Nano-silver pre-sintering chip mounter

Abstract

The invention relates to the field of chip mounters, and discloses a nano-silver pre-sintering chip mounter which comprises a rack, a base material conveying device, a chip mounting head device, a heating sintering chip mounting platform, a crystal ring feeding device and a TRAY disc feeding device, the chip mounting head device is erected on the rack, the base material conveying device is arranged on the lower side of the chip mounting head device, the heating sintering chip mounting platform is arranged on the lower side of the chip mounting head device, and the TRAY disc feeding device is arranged on the lower side of the chip mounting head device. The heating platform is arranged in front of the base material conveying device; the wafer ring feeding device is arranged on the right side of the front end of the machine frame, the TRAY disc feeding device is arranged on the left side of the front end of the machine frame, components can be accurately mounted on a circuit board or other carriers, the mounting requirements of most of products in the market are met, the structure is more compact, the mounting efficiency is higher, and the mounting precision is higher.

Description

Technical Field

[0001] The invention relates to the field of chip mounters, in particular to a nano silver pre-sintering chip mounter. Background Art

[0002] The placement machine is a kind of automation equipment widely used in the electronics manufacturing industry, and it plays an important role in various industries.

[0003] With the continuous development of various industrial technologies, placement machines also need to be improved according to the strict requirements of industrial manufacturing processes to meet the needs of industrial manufacturing for efficient and precise placement, so that placement machines can achieve higher accuracy, faster speed and wider adaptability. Summary of the invention

[0004] The purpose of the present invention is to solve the problems in the prior art and to provide a high-precision nano silver pre-sintering chip mounter, which has a compact structure, high mounting accuracy and is compatible with a variety of mounting processes.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a nano silver pre-sintering chip placement machine, including a frame, a substrate transport device, a placement head device, a heating sintering chip placement platform, a crystal ring loading device and a TRAY tray loading device, the placement head device is mounted on the frame, the substrate transport device is arranged at the lower side of the placement head device, and the heating platform is arranged in front of the substrate transport device; the crystal ring loading device is arranged at the right side of the front end of the frame, and the TRAY tray loading device is arranged at the left side of the front end of the frame.

[0006] As a further solution of the present invention, the placement head device includes: a placement head moving platform and a placement head mechanism, the placement head mechanism includes a substrate, a second positioning mechanism, a high-temperature placement head assembly and a placement head assembly, the second positioning mechanism is arranged at the center of the lower end of the substrate, the high-temperature placement head assembly is fixed above the second positioning mechanism through a bracket, and the placement head assembly is fixed on both sides of the second positioning mechanism; the placement head moving platform includes an XY-axis moving platform, the Y-axis moving platform is relatively arranged and erected on the left and right sides of the frame, and the X-axis moving platform is horizontally erected on the Y-axis moving platform; the placement head mechanism is fixed to the X-axis moving platform through a sliding assembly on the substrate of the placement head mechanism.

[0007] As a further solution of the present invention, the high-temperature mounting head assembly includes a pressing drive assembly, a rotating drive assembly, a high-temperature mounting head and a heat dissipation assembly. The pressing drive assembly drives and connects the high-temperature mounting head. The rotating drive assembly is arranged on the top of the high-temperature mounting head. The rotating drive assembly drives the high-temperature mounting head to rotate. The heat dissipation assembly is arranged outside the high-temperature mounting head. The heat dissipation assembly is used to dissipate heat from the high-temperature mounting head.

[0008] As a further solution of the present invention, the placement head assembly includes a linear-rotary motor assembly and a vacuum placement head; the linear-rotary motor device includes a shell, a linear module, a rotary motor, a lifting seat and an output shaft, the linear module is arranged on one side of the inner cavity of the shell, and the linear module is driven and connected to the lifting seat; the rotary motor and the output shaft are connected and formed and then installed on the lifting seat; the output shaft extends out of the shell and is connected to the vacuum placement head.

[0009] As a further solution of the present invention, the heating and sintering patch platform includes a heating platform and a heat dissipation mechanism, and the heat dissipation mechanism is arranged on both sides of the heating platform.

[0010] As a further solution of the present invention, the substrate transport device includes a base plate transport mechanism and a nanosilver film transport mechanism, and the base plate transport mechanism and the nanosilver film transport mechanism are arranged side by side.

[0011] As a further solution of the present invention, the substrate transport assembly includes a bottom plate, which is used to be fixed on the frame; a first substrate transport assembly is provided on the bottom plate; a connecting rod is fixed to the first substrate transport assembly; a fixing seat is provided at one end of the connecting rod away from the first substrate transport assembly; the fixing seat is used to be fixed to the frame; a slidable second substrate transport assembly is sleeved on the connecting rod; the second substrate transport assembly slides relative to the first substrate transport mechanism to adjust the width of the transport mechanism; the second substrate transport assembly is provided with a locking mechanism, which fixes the second substrate transport assembly to the connecting rod to prevent the second substrate transport assembly from sliding.

[0012] As a further solution of the present invention, the TRAY tray loading device includes a TRAY tray transport platform, a TRAY tray loading and unloading rack, and a TRAY tray first lifting assembly; the TRAY tray transport platform includes a TRAY tray handling platform and a TRAY tray transport mechanism, and the TRAY tray handling platform is divided into a loading area and an unloading area; the TRAY tray loading and unloading rack is divided into a loading rack and an unloading rack, and the TRAY tray loading and unloading rack is erected at the front end of the TRAY tray transport platform; the TRAY tray first lifting assembly is erected at the end of the TRAY tray transport platform; the TRAY tray handling platform travels back and forth between the loading and unloading rack and the TRAY tray first lifting mechanism under the traction of the TRAY tray transport mechanism; the TRAY tray transport platform is provided with a TRAY tray second lifting assembly and a TRAY tray third lifting assembly corresponding to the TRAY tray loading and unloading rack, and the TRAY tray second lifting assembly and the TRAY tray third lifting assembly are respectively arranged under the loading rack and the unloading rack.

[0013] As a further solution of the present invention, the crystal ring loading device includes an automatic disc changing mechanism, a gripping mechanism and a crystal ring lifting basket loading mechanism; the automatic disc changing mechanism and the basket loading mechanism fix the frame; the automatic disc changing mechanism includes a crystal ring fixing disc and a crystal ring lifting assembly, and the crystal ring lifting assembly is arranged at the bottom of the crystal ring lifting assembly; the crystal ring fixing disc is used to fix the crystal ring, and the crystal ring lifting assembly is used to replace an empty crystal ring disc; the gripping mechanism includes an air claw and an air claw driving mechanism for driving the air claw to move and grip between the crystal ring lifting basket loading mechanism and the automatic disc changing mechanism, and the air claw driving mechanism is fixed to the Y-axis moving platform; the crystal ring lifting basket loading mechanism includes a basket base and a basket lifting assembly, and the basket lifting assembly is arranged at the bottom of the basket base; the basket base is used to place a basket equipped with a crystal ring disc, and the basket lifting assembly is used to lift the basket equipped with a crystal ring disc.

[0014] As a further solution of the present invention, it also includes a first positioning mechanism and a pressure measuring mechanism, and the first positioning mechanism and the pressure measuring mechanism are arranged on the heating and sintering patch platform.

[0015] The present invention provides a nano silver pre-sintering chip mounter, which has the following beneficial effects:

[0016] 1. The nano silver pre-sintering chip mounter of the present invention comprises high and low temperature mounting heads, which cooperate with each other to realize high temperature pre-sintering mounting of chips, or only use low temperature mounting heads to insert chips. It is equipped with nano silver film transport mechanism and glue dispensing mechanism, and can complete various mounting process requirements such as nano silver sintering mounting process.

[0017] 2. The pressing drive component of the nano silver pre-sintering placement machine of the present invention drives the high temperature placement head, which can effectively reduce the impact force on the chip during the high temperature placement head placement, effectively protect the chip, and reduce the damage of the components.

[0018] 3. The nano silver pre-sintering placement machine of the present invention sets the Y-axis moving platform relatively and erects it on the left and right sides of the frame, and the X-axis moving platform is horizontally erected on the Y-axis moving platform. The relative setting of the Y-axis moving platform and the relative flat setting effectively reduce the length of the X-axis, making the overall size of the equipment smaller. At the same time, the relative setting of the Y-axis moving platform generates relative magnetic force, which can offset the magnetic force and improve the placement accuracy.

[0019] 4. The substrate transport mechanism of the nano silver pre-sintering placement machine of the present invention can adjust the width to meet the placement requirements of most size products in the existing market. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the nano silver pre-sintering chip mounter of the present invention;

[0021] Figure 2It is a schematic diagram of the structure of the placement head device of the present invention;

[0022] Figure 3 It is a schematic diagram of the structure of the placement head mechanism of the present invention;

[0023] Figure 4 It is a schematic diagram of the structure of the placement head mechanism of the present invention;

[0024] Figure 5 It is a schematic diagram of the structure of the linear rotary motor assembly of the present invention;

[0025] Figure 6 It is a schematic diagram of the heating and sintering patch platform of the present invention;

[0026] Figure 7 It is a schematic structural diagram of the substrate transport device of the present invention;

[0027] Figure 8 is a top view of the substrate transport device of the present invention;

[0028] Fig. 9 This is a schematic diagram of the structure of the TRAY loading and unloading device of the present invention;

[0029] Fig.10 This is a schematic diagram of the structure of the wafer ring feeding device of the present invention;

[0030] Reference numerals:

[0031] Frame 1, substrate transport device 2, substrate transport mechanism 21, bottom plate 210, substrate first transport component 211, substrate second transport component 212, connecting rod 213, fixed seat 214, locking mechanism 215, nano silver film transport mechanism 22, mounting head device 3, mounting head moving platform 31, X-axis moving platform 311, Y-axis moving platform 312 mounting head mechanism 32, substrate 321, second positioning mechanism 322, high temperature mounting head component 323, pressing drive component 3231, rotating drive component 3232, high temperature mounting head 3233, heat dissipation component 3234, mounting head component 324, linear rotary motor component 3241, housing 32411, linear module 32412, rotating motor 32413, lifting seat 32414, output shaft 32415, vacuum mounting head 3242, adding Thermal sintering patch platform 4, heating platform 41, heat dissipation mechanism 42, crystal ring loading device 5, automatic disc changing mechanism 51, crystal ring fixing disc 511, crystal ring lifting assembly 512, grabbing mechanism 52, air claw 521, air claw driving mechanism 522, crystal ring basket loading mechanism 53, basket base 531, lifting assembly 532 of lifting basket, TRAY tray loading device 6, TRAY tray transport platform 61, TRAY tray handling platform 611, loading area 6111, unloading area 6112, TRAY tray conveyor 612, TRAY tray loading and unloading rack 62, loading rack 621, unloading rack 622, TRAY tray first lifting assembly 63, TRAY tray second lifting assembly 64, TRAY tray second lifting assembly 65, first positioning mechanism 7, pressure measuring mechanism 8, waste box 9, dispensing mechanism 10. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0033] like Figure 1-10 As shown in the figure, this embodiment discloses a nanosilver pre-sintering chip mounter, a nanosilver pre-sintering chip mounter, including a frame 1, a substrate transport device 2, a mounting head device 3, a heating and sintering chip mounting platform 4, a crystal ring loading device 5 and a TRAY tray loading device 6, wherein the mounting head device 3 is mounted on the frame 1, the substrate transport device 2 is arranged at the lower side of the mounting head device 3, and the heating platform 4 is arranged in front of the substrate transport device 2; the crystal ring loading device 5 is arranged at the right side of the front end of the frame 1, and the TRAY tray loading device 6 is arranged at the left side of the front end of the frame 1.

[0034] Specifically, in this embodiment, the mounting head device 3 includes: a mounting head moving platform 31 and a mounting head mechanism 32, the mounting head mechanism 32 includes a substrate 321, a second positioning mechanism 322, a high-temperature mounting head assembly 323 and a mounting head assembly 324, the second positioning mechanism 322 is arranged at the center of the lower end of the substrate 321, the high-temperature mounting head assembly 323 is fixed above the second positioning mechanism 322 by a bracket, and the mounting head assembly 324 is fixed on both sides of the second positioning mechanism 322; the first positioning mechanism 322 is used to photograph the position of the substrate, and combined with the first positioning mechanism 7 to achieve rapid positioning and position correction, thereby improving the efficiency and accuracy of bonding; the mounting head moving platform 31 includes an XY axis moving platform, The Y-axis movable platform 312 is relatively arranged and erected on the left and right sides of the frame 1, and the X-axis movable platform 311 is horizontally arranged on the Y-axis movable platform 312; the mounting head mechanism 32 is fixed to the X-axis movable platform 311 through the sliding component on the base plate 321 of the mounting head mechanism 32; the Y-axis movable platform 312 is relatively arranged and erected on the left and right sides of the frame 1, and the X-axis movable platform 311 is horizontally arranged on the Y-axis movable platform 312. The relative arrangement of the Y-axis movable platform 312 effectively reduces the length of the X-axis movable platform 311 and makes the overall size of the equipment smaller. At the same time, the relative arrangement of the Y-axis movable platform 312 generates relative magnetic force, and the relative arrangement can offset the magnetic force and improve the mounting accuracy.

[0035] Specifically, in this embodiment, the high-temperature mounting head assembly 323 includes a pressing drive assembly 3231, a rotating drive assembly 3232, a high-temperature mounting head 3233 and a heat dissipation assembly 3234; the pressing drive assembly 3231 drives and connects the high-temperature mounting head 3233; the rotating drive assembly 3232 is disposed on the top of the high-temperature mounting head 3233; the rotating drive assembly 3232 drives the high-temperature mounting head 3233 to rotate; the heat dissipation assembly 3234 is disposed outside the high-temperature mounting head 3233; the heat dissipation assembly 3234 is used for dissipating heat from the high-temperature mounting head 3233; the pressing drive assembly 3231 includes a driving motor and a guide rail; the high-temperature mounting head is mounted on the guide rail of the pressing drive assembly; and the driving motor drives the high-temperature mounting head to be pressed downward.

[0036] In this embodiment, the placement head assembly 324 includes a linear rotary motor assembly 3241 and a vacuum placement head 3242; the linear rotary motor device 3241 includes a housing 32411, a linear module 32412, a rotary motor 32413, a lifting seat 32414 and an output shaft 32415, the linear module guide rail platform 324121 is arranged on one side of the inner cavity of the housing 1, and the slider 324122 of the linear drive assembly is driven and connected to the lifting seat 32414; the rotary drive assembly 32413 and the output shaft assembly 32415 2415 is connected and formed and then installed on the lifting seat 32414; the output shaft 324151 of the output shaft assembly 32415 extends out of the shell 1 through the bottom through hole of the shell, and the output shaft extends out of the shell and is connected to the vacuum head 3242; the linear-rotary motor assembly 3241 arranges the linear module 32412, the rotary motor 32413, the lifting seat 32414 and the output shaft 32415 in the inner cavity of the shell 32411 to realize an integrated linear-rotary motor device, thereby further reducing the volume of the linear-rotary motor.

[0037] Preferably, in this embodiment, the linear rotary motor assembly 3241 is also provided with a lifting seat guide rail 324141, and the lifting seat guide rail 324141 is fixedly connected to the lifting seat 32414, and the lifting seat guide rail 324141 is arranged on the side of the inner cavity of the shell 32411 opposite to the linear module 32412, and the lifting seat guide rail 324141 is arranged opposite to the linear module 32412, and the lifting seat 32414 is clamped in the shell 32411 for up and down movement, thereby ensuring the movement accuracy and stability of the lifting seat 32414.

[0038] In this embodiment, the linear rotary motor assembly is further provided with a spring suspension mechanism 32417, one end of the spring suspension mechanism 32417 is fixedly suspended on the housing 32411, and the other end is fixedly suspended on the slider 324122 of the linear module. The spring suspension mechanism 32417 is additionally provided to balance gravity to reduce the peak value of the motor output force. When the power is off, the slider 324122 of the linear drive assembly is suspended in the middle position of the full stroke due to the force of the spring suspension mechanism 32417.

[0039] Typically, in this embodiment, the mounting head device 3 includes: a glue dispensing component 10, the glue dispensing component 10 is arranged on one side of the high-temperature mounting head component 323, and the glue dispensing component 10 is used for dispensing glue on components during the mounting process.

[0040] Preferably, in this embodiment, the mounting head device 3 further comprises a vacuum generator, and the vacuum generator provides a vacuum state for the mounting head device.

[0041] Advantageously, in this embodiment, the placement head device 3 has a variety of bonding head components, including high-temperature and low-temperature bonding head components, which can meet the manufacturing processes of various products. The high-temperature and low-temperature bonding heads can be used together or alone, and more complex manufacturing processes can be completed.

[0042] In this embodiment, the heating sintering chip platform 4 includes a heating platform 41 and a heat dissipation mechanism 42, and the heat dissipation mechanism 42 is arranged on both sides of the heating platform 41; the heating platform 41 is used to provide heat energy during chip sintering and mounting, and the heat dissipation mechanism 42 is used to dissipate heat from the heating platform 42.

[0043] In this embodiment, it also includes a first positioning mechanism 7 and a pressure measuring mechanism 8, and the first positioning mechanism 7 and the pressure measuring mechanism 8 are arranged on the heating and sintering patch platform 4; arranging the first positioning mechanism 7 and the pressure measuring mechanism 7 on the heating and sintering patch platform 4 can make the overall layout of the equipment more compact, and it is convenient to install more functional components; the first positioning mechanism 7 is used to take a picture of the first position of the component after absorption, and cooperates with the visual system of the bonding head device 3 to achieve rapid positioning and position correction, thereby improving the efficiency and accuracy of bonding; the pressure measuring mechanism 8 is used to test the output pressure of the mounting head device 3, and ensure the pressure stability of the mounting process through pressure testing, thereby effectively protecting various components.

[0044] Preferably, in this embodiment, the heating and sintering patch platform 4 is also provided with a waste box for storing waste components 9 .

[0045] Specifically, in this embodiment, the substrate transport device 2 includes a substrate transport mechanism 21 and a nanosilver film transport mechanism 22, and the substrate transport mechanism 21 and the nanosilver film transport mechanism 22 are arranged side by side; the substrate transport mechanism 21 is used to transport substrate components, and the nanosilver film transport mechanism 22 is used to transport nanosilver films, and the nanosilver transport component of the nanosilver film transport mechanism 22 is composed of a driving motor and a conveyor belt; the bonding head device 3 adsorbs chips or electronic components and transfers the chips or electronic components to the nanosilver film transport mechanism 22 to adhere the nanosilver film and then transfers them to the heating and sintering chip platform 4 for sintering and mounting.

[0046] In the present embodiment, the substrate transport assembly 21 comprises a bottom plate 210, the bottom plate 210 is used to be fixed on the frame 1, a first substrate transport assembly 211 is provided on the bottom plate 210, a connecting rod 213 is fixed to the first substrate transport assembly 211, a fixing seat 214 is provided at one end of the connecting rod 213 away from the first substrate transport assembly 211, the fixing seat 214 is used to be fixed on the frame 1, a slidable second substrate transport assembly 212 is sleeved on the connecting rod 213, and the second substrate transport assembly 212 is relative to the substrate. The first transport mechanism 211 of the substrate slides to adjust the width of the transport mechanism; the second transport component 212 of the substrate is provided with a locking mechanism 215, and the locking mechanism 215 fixes the second transport component 212 of the substrate to the connecting rod 213 to prevent the second transport component 212 of the substrate from sliding; the first transport component 211 of the substrate and the second transport component 212 of the substrate both transport the substrate through a driving motor and a conveyor belt, and are preferably arranged in three sections; the substrate transport mechanism 21 can adjust the width, which can meet the mounting requirements of most sizes of products in the existing market.

[0047] In the present embodiment, the tray loading device 6 comprises a tray transport platform 61, a tray loading and unloading rack 62, and a tray first lifting assembly 63; the tray transport platform 61 comprises a tray handling platform 611 and a tray transport mechanism 612, the tray handling platform 611 is divided into a loading area 6111 and a unloading area 6112; the tray loading and unloading rack 62 is divided into a loading rack 621 and an unloading rack 622, the tray loading and unloading rack 62 is set up at the front end of the tray transport platform 61; the tray The first lifting assembly 63 is set up at the end of the TRAY tray transport platform 61; the TRAY tray handling platform 611 moves back and forth between the TRAY tray loading and unloading rack 62 and the TRAY tray first lifting mechanism 63 under the traction of the TRAY tray transport mechanism 612; the TRAY tray transport platform 61 is provided with a TRAY tray second lifting assembly 64 and a TRAY tray third lifting assembly 65 corresponding to the TRAY tray loading and unloading rack 62, and the TRAY tray second lifting assembly 64 and the TRAY tray third lifting assembly 65 are respectively arranged under the loading rack 621 and the unloading rack 622;

[0048] The tray loading and unloading device 6 stacks the trays loaded with materials on the loading rack 621. When the second lifting assembly 64 rises to receive the materials, it puts down the trays loaded with materials one by one to the second lifting assembly 64. The second lifting assembly 64 descends to place the trays with materials on the loading area 6111 of the tray handling platform 611. The tray transport mechanism 612 pulls the tray handling platform 611 to the first lifting mechanism 63. After the materials on the tray are emptied, the first lifting mechanism 63 lifts the empty tray, and the tray handling platform 611 is lifted. The unloading area 6112 of the TRAY tray 11 retreats to the first lifting mechanism 63, the first lifting mechanism 63 descends, and the empty TRAY tray is placed on the unloading area 6112 of the TRAY tray transporting platform 611, and then the TRAY tray transporting mechanism 612 pulls the TRAY tray transporting platform 611 back to the bottom of the TRAY tray loading and unloading machine frame 62, the third lifting assembly 65 lifts the empty TRAY tray and stores it in the unloading machine 622, and at the same time, the second lifting assembly 64 repeats the loading process to realize the loading and unloading of the TRAY tray at the same time, and the TRAY tray loading and unloading device effectively improves the loading and unloading efficiency.

[0049] In the present embodiment, the crystal ring feeding device 5 comprises an automatic disc changing mechanism 51, a gripping mechanism 52 and a crystal ring lifting basket feeding mechanism 53; the automatic disc changing mechanism 51 and the lifting basket feeding mechanism 53 fix the frame; the automatic disc changing mechanism 51 comprises a crystal ring fixing plate 511 and a crystal ring lifting assembly 512, and the crystal ring lifting assembly 512 is arranged at the bottom of the crystal ring lifting assembly 512; the crystal ring fixing plate 511 is used to fix the crystal ring, and the crystal ring lifting assembly 512 is used to replace an empty crystal ring plate; the gripping mechanism 52 includes ... The air claw 522 and the air claw driving mechanism 521 that drives the air claw to move and grasp between the crystal ring basket loading mechanism and the automatic disk changing mechanism, the air claw driving mechanism 521 is fixed to the Y-axis moving platform 312; the crystal ring basket loading mechanism 53 includes a basket base 531 and a basket lifting assembly 532, and the basket lifting assembly 532 is arranged at the bottom of the basket base 531; the basket base 531 is used to place the basket equipped with the crystal ring disk, and the basket lifting assembly 532 is used to lift the basket equipped with the crystal ring disk to facilitate the replacement of the crystal ring disk.

[0050] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A nano silver pre-sintering chip mounter, Features: It includes a frame, a substrate transport device, a mounting head device, a heating and sintering chip mounting platform, a crystal ring loading device and a TRAY tray loading device, wherein the mounting head device is mounted on the frame, the substrate transport device is arranged at the lower side of the mounting head device, and the heating platform is arranged in front of the substrate transport device; The crystal ring loading device is arranged on the right side of the front end of the frame, and the TRAY tray loading device is arranged on the left side of the front end of the frame.

2. The nano silver pre-sintering chip mounter according to claim 1, Features: The placement head device includes: a placement head moving platform and a placement head mechanism, the placement head mechanism includes a substrate, a second positioning mechanism, a high-temperature placement head assembly and a placement head assembly, the second positioning mechanism is arranged at the center of the lower end of the substrate, the high-temperature placement head assembly is fixed above the second positioning mechanism through a bracket, and the placement head assembly is fixed on both sides of the second positioning mechanism; the placement head moving platform includes an XY axis moving platform, the Y axis moving platform is relatively arranged and erected on the left and right sides of the frame, and the X axis moving platform is horizontally erected on the Y axis moving platform; the placement head mechanism is fixed to the X axis moving platform through a sliding assembly on the substrate of the placement head mechanism.

3. The nano silver pre-sintering chip mounter according to claim 2, Features: The high-temperature mounting head assembly includes a pressing drive assembly, a rotating drive assembly, a high-temperature mounting head and a heat dissipation assembly. The pressing drive assembly drives and connects the high-temperature mounting head. The rotating drive assembly is arranged on the top of the high-temperature mounting head, and the rotating drive assembly drives the high-temperature mounting head to rotate. The heat dissipation assembly is arranged outside the high-temperature mounting head, and the heat dissipation assembly is used for dissipating heat from the high-temperature mounting head.

4. The nano silver pre-sintering chip mounter according to claim 2, Features: The placement head assembly includes a linear rotary motor assembly and a vacuum placement head; the linear rotary motor device includes a shell, a linear module, a rotary motor, a lifting seat and an output shaft, the linear module is arranged on one side of the inner cavity of the shell, and the linear module is driven and connected to the lifting seat; the rotary motor and the output shaft are connected and formed and then installed on the lifting seat; the output shaft extends out of the shell and is connected to the vacuum placement head.

5. The nano silver pre-sintering chip mounter according to any one of claims 1 to 3, Features: The heating and sintering patch platform comprises a heating platform and a heat dissipation mechanism, and the heat dissipation mechanism is arranged on both sides of the heating platform.

6. The nano silver pre-sintering chip mounter according to claim 1, Features: The substrate transport device comprises a base plate transport mechanism and a nano-silver film transport mechanism, and the base plate transport mechanism and the nano-silver film transport mechanism are arranged side by side.

7. The nano silver pre-sintering chip mounter according to claim 6, Features: The substrate transport assembly includes a bottom plate, which is used to be fixed on the frame, a first substrate transport assembly is provided on the bottom plate, a connecting rod is fixed to the first substrate transport assembly, a fixing seat is provided at one end of the connecting rod away from the first substrate transport assembly, the fixing seat is used to be fixed on the frame, a slidable second substrate transport assembly is sleeved on the connecting rod, and the second substrate transport assembly slides relative to the first substrate transport mechanism to adjust the width of the transport mechanism; the second substrate transport assembly is provided with a locking mechanism, which fixes the second substrate transport assembly to the connecting rod to prevent the second substrate transport assembly from sliding.

8. The nano silver pre-sintering chip mounter according to claim 1, Features: The TRAY tray loading device includes a TRAY tray transport platform, a TRAY tray loading and unloading rack, and a TRAY tray first lifting assembly; the TRAY tray transport platform includes a TRAY tray handling platform and a TRAY tray transport mechanism, and the TRAY tray handling platform is divided into a loading area and an unloading area; the loading and unloading racks are divided into a loading rack and an unloading rack, and the loading and unloading racks are erected at the front end of the TRAY tray transport platform; the TRAY tray first lifting assembly is erected at the end of the TRAY tray transport platform; the TRAY tray handling platform moves back and forth between the loading and unloading racks and the TRAY tray first lifting mechanism under the traction of the TRAY tray transport mechanism; the TRAY tray transport platform is provided with a TRAY tray second lifting assembly and a TRAY tray third lifting assembly corresponding to the loading and unloading racks, and the TRAY tray second lifting assembly and the TRAY tray third lifting assembly are respectively arranged under the loading rack and the unloading rack.

9. The nano silver pre-sintering chip mounter according to claim 2, Features: The crystal ring loading device comprises an automatic disc changing mechanism, a gripping mechanism and a crystal ring lifting basket loading mechanism; the automatic disc changing mechanism and the basket loading mechanism fix the frame; the automatic disc changing mechanism comprises a crystal ring fixing disc and a crystal ring lifting assembly, and the crystal ring lifting assembly is arranged at the bottom of the crystal ring lifting assembly; the crystal ring fixing disc is used to fix the crystal ring, and the crystal ring lifting assembly is used to replace an empty crystal ring disc; the gripping mechanism comprises an air claw and an air claw driving mechanism for driving the air claw to move and grip between the crystal ring lifting basket loading mechanism and the automatic disc changing mechanism, and the air claw driving mechanism is fixed to the Y-axis moving platform; the crystal ring lifting basket loading mechanism comprises a basket base and a basket lifting assembly, and the basket lifting assembly is arranged at the bottom of the basket base; the basket base is used to place a basket equipped with a crystal ring disc, and the basket lifting assembly is used to lift the basket equipped with a crystal ring disc.

10. The nano silver pre-sintering chip mounter according to claim 5, Features: It also includes a first positioning mechanism and a pressure measuring mechanism, wherein the first positioning mechanism and the pressure measuring mechanism are arranged on the heating and sintering patch platform.

Images