PCB (Printed Circuit Board) element pressing equipment for integrated circuit carrier
By adopting the feeding structure and guide slope in the PCB board pressing equipment, combined with the design of the clamp and electric telescopic rod, the problem of offset when putting in the PCB board is solved, achieving a more efficient pressing process and better product quality.
CN120129160AActive Publication Date: 2025-06-10PI SEMICON (NANTONG) CO LTD
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Patent Information
- Application Number
- CN202510608113.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-13
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2045-05-13
AI Technical Summary
Technical Problem
When placed in the PCB board, existing PCB board pressing devices are prone to insufficient sliding distance due to friction, resulting in PCB board offset, which will affect the compression efficiency and product quality.
Method used
A PCB board component pressing device for integrated circuit carrier is designed. The PCB board is accurately placed into the press box using the feeding structure and guide slope, and the precise clamping and movement of the PCB board is achieved through the clamp and the electric telescopic rod.
Benefits of technology
It realizes more accurate placement and clamping of PCB boards, avoids damage caused by offset pressing, and improves pressing efficiency and product quality.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention belongs to the technical field of integrated circuits, and particularly relates to PCB element pressing equipment for an integrated circuit carrier, which comprises a working table, a pressing assembly is mounted at the top end of the working table, a pressing table is mounted at one end of the pressing assembly, a pressing box is arranged below the pressing table, and the bottom end of the pressing box is fixedly connected with the top end of the working table. Feeding structures are arranged on the two sides of the pressing box, the feeding structures can convey PCBs to the position above the pressing box and discharge the PCBs, and a guide slope is formed in the inner side of the top end of the pressing box and used for guiding the PCBs when the PCBs are fed into the pressing box; the PCB in the containing groove can be clamped through the clamping plate, the moving plate is pushed through the electric telescopic rod to drive the PCB to move to the position above the pressing box, the PCB is discharged, the guide slope face guides the discharged PCB, in this way, the PCB can be more accurately put into the pressing box, and the influence caused by offset pressing is avoided.
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