Capacitor module with optimized air-cooled heat dissipation structure

Abstract

The invention relates to a capacitor module for optimizing an air-cooled heat dissipation structure, the capacitor module comprises a plurality of capacitor banks, each capacitor bank is composed of a plurality of capacitor monomers, the positive and negative electrodes of the capacitor monomers are electrically connected through a connecting sheet group, and the connecting sheet group comprises a plurality of first connecting sheets and second connecting sheets. The parallel connection and the series connection between the capacitor monomers are realized by adopting the first connecting sheet with a claw-shaped structure; the air cooling module is composed of a plurality of cooling fans, a temperature sensor and a speed regulation control system, the air speed of the cooling fans is regulated through the intelligent frequency conversion technology, regulation is conducted according to real-time data fed back by the temperature sensor, and therefore precise cooling control is achieved; the capacitor module is internally provided with a main air channel and an auxiliary air channel, the size and layout design of the air channels optimizes an airflow path, and the heat exchange area between air and the surface of the capacitor monomer is increased; the design can effectively reduce the heat dissipation efficiency, reduce the system energy consumption, prolong the service life of the capacitor module, and is suitable for the fields of energy storage systems, power equipment and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of electric energy storage modules, and particularly to a capacitor module with an optimized air-cooled heat dissipation structure. Background Art

[0002] In electronic devices and power electronic systems, capacitor modules, as important energy storage and power conditioning components, have a significant impact on the stability and efficiency of the entire system. However, during high-frequency charging and discharging processes, capacitor modules generate a large amount of heat, especially at the pole columns of capacitor cells. Due to their special positions and relatively small contact areas with the outside world, heat is often difficult to dissipate quickly, resulting in local overheating. This heat accumulation not only affects the operating stability of the capacitor module but also accelerates the aging of capacitor cells, reducing the overall reliability and service life of the device.

[0003] Currently, traditional energy storage battery packs mainly adopt two thermal management technologies: liquid cooling and air cooling. The liquid cooling technology circulates coolant through pipes or cooling plates to remove the heat inside the battery pack. The liquid cooling system has high thermal management efficiency and can keep the operating temperature of the battery within a reasonable range under high-power and high-heat-density conditions. However, the liquid cooling system requires additional equipment such as coolant, circulation pumps, pipelines, and radiators. The system structure is complex, and the installation and maintenance costs are relatively high. In addition, there may be a risk of coolant leakage, further increasing the uncertainty of system operation.

[0004] The air cooling technology guides air flow through fans to remove the heat on the surface of the battery pack, which is simpler and easier to maintain compared to the liquid cooling technology. However, in the traditional air-cooled heat dissipation structure, capacitor modules usually use flat connecting pieces to connect capacitor cells in series and parallel. However, this structure has deficiencies in current conduction and heat dissipation. The flat connecting piece covers the top surface of the capacitor cell, with a small heat-receiving area and a small gap between the connecting piece and the bracket. Heat cannot be quickly conducted to the outside through the connecting piece on the pole column, and the heat dissipation efficiency of the pole column is poor. In addition, the traditional air-cooled design usually relies on relay switches to control the air volume. This control method is relatively simple and cannot dynamically adjust the rotational speed and air volume of the fan according to the temperature change inside the battery pack. With the fluctuation of the battery pack load, the heat dissipation demand may change. However, the traditional air-cooled system cannot respond to these changes in real time, resulting in unstable heat dissipation efficiency and affecting the service life and safety of the battery.

[0005] Therefore, there is an urgent need for an improved capacitor module with an optimized air-cooled heat dissipation structure to improve the heat dissipation efficiency of its pole column, reduce costs, and facilitate assembly. Summary of the Invention

[0006] The purpose of the present invention is to provide a capacitor module with an optimized air-cooled heat dissipation structure, which uses a claw-shaped first connecting piece to achieve better heat dissipation. The purpose of the present invention is achieved by the following technical solutions:

[0007] The present invention provides a capacitor module with an optimized air-cooled heat dissipation structure, which includes:

[0008] A plurality of capacitor groups, each capacitor group includes a plurality of capacitor monomers, the housing of the capacitor monomer is connected to its positive electrode, and the negative electrode post of the capacitor monomer extends out from the center of the top surface of the housing;

[0009] A bracket assembly, and the capacitor groups are arranged in the bracket assembly;

[0010] A connection piece group, which is electrically connected to the top of the capacitor group. The connection piece group includes a plurality of first connection pieces and at least two second connection pieces located at the lead-out ends. One first connection piece is provided in each capacitor group, and adjacent capacitor groups are connected through the first connection pieces; the first connection piece connects at least two capacitor monomers in one capacitor group in parallel, and connects the at least two parallel capacitor monomers in series with at least two other capacitor monomers; at least two second connection pieces are respectively connected to the positive electrodes of the capacitor monomers in the first capacitor group and the negative electrodes of the capacitor monomers in the parallel combination in the last capacitor group;

[0011] An air-cooled module, which includes at least one cooling fan and at least one temperature sensor;

[0012] The first connection piece is a claw-shaped structure with a height difference, including at least two positive electrode connection parts, at least two negative electrode connection parts and a bridge waist part. The positive electrode connection parts and the negative electrode connection parts are respectively arranged on both sides of the bridge waist part; the negative electrode connection part of the first connection piece is connected to the negative electrode post of one capacitor monomer, and the positive electrode connection part is connected to the top surface of the housing of the adjacent next capacitor monomer.

[0013] Preferably, the capacitor module with the optimized air-cooled heat dissipation structure includes 10 capacitor groups, and the capacitor groups are arranged in a 2×5 horizontal and vertical distribution structure; the connection piece group includes 4 second connection pieces, and the connection piece group further includes a third connection piece. The two second connection pieces are located at the relative ends of the lead-out end, and the two second connection pieces located at the relative ends are electrically connected through the third connection piece.

[0014] Further, each capacitor group includes 8 capacitor monomers, and the first connection piece includes 4 positive electrode connection parts and 4 negative electrode connection parts, forming a capacitor group structure in which 4 capacitor monomers are connected in parallel and are connected in series with another 4 capacitors.

[0015] Further, the air-cooled module includes three cooling fans and three temperature sensors. The cooling fans are evenly distributed horizontally at the relative ends, and the rotation speed of the cooling fans includes at least 3 gears for adjustment.

[0016] Further, the capacitor module with the optimized air-cooled heat dissipation structure further includes a flexible circuit board group, which is located above the connection piece group. The flexible circuit board group includes a plurality of longitudinally installed FPC boards, and a plurality of collecting pieces are arranged on the FPC boards. The collecting pieces are connected to the first connection piece and / or the second connection piece, and the temperature sensor is arranged on the sampling piece.

[0017] Further, the cooling fan includes an axial flow fan using intelligent variable frequency technology. Three temperature sensors on the FPC board sample the real-time temperature data inside the module, and feedback it to the terminal CMS for judgment and processing. Then, the fan speed is controlled by PWM technology. According to the sampled data of different temperature rises inside the capacitor module, the high, medium, and low speed gears of the axial flow fan are preset.

[0018] Preferably, the bracket assembly includes a lower bracket group and an upper bracket group. The lower bracket group includes a plurality of lower brackets arranged side by side, and adjacent lower brackets are connected by a plug-in structure. The upper bracket group includes a plurality of upper brackets arranged side by side. The lower bracket and the corresponding upper bracket are fixedly connected by fasteners. A plurality of lower columns are provided on the lower bracket, and corresponding upper columns are arranged on the upper bracket. The lower columns and the upper columns are correspondingly inserted and fixedly connected by fasteners. One of the lower columns or the upper columns is provided with a slot or a socket, and the other is provided with a plug joint, and the plug joint is inserted and matched with the slot or the socket.

[0019] Further, the flexible circuit board group further includes a bridge bracket, which is located between the connection piece group and the FPC board.

[0020] Preferably, the positive connection part is an arc-shaped concave structure, and the concave structure surrounds the negative pole column.

[0021] Preferably, the bridge waist is fixed to the bracket assembly, and the bridge waist, the negative connection part and the positive connection part are sequentially arranged from high to low in the first connection piece.

[0022] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above technical solutions adopted in the embodiments of this specification at least include:

[0023] First, the first connecting piece in this application adopts a claw-shaped design with a height difference structure, enabling cold air to pass through the gap with height difference, increasing the heat dissipation area, and allowing the heat of the terminal post to be quickly conducted to the outside through the gap between the claw-shaped connecting piece and the bracket assembly. Through the reasonable layout of the positive connecting part, negative connecting part, and bridging waist of the claw-shaped connecting piece, not only the series and parallel connections between the capacitor monomers are ensured, but also the electrical conductivity and heat dissipation path are further optimized, significantly improving the overall heat dissipation efficiency and current conduction ability of the module. Since the gap between the capacitor bodies is the auxiliary air duct of the present invention, the bridging waist of the first connecting piece cooperates with this auxiliary air duct to form a better flow space, enabling cold air to fully contact the bridging waist and the outer surface of the capacitor body, achieving good cooling of the terminal post while cooling the capacitor body.

[0024] Second, this application precisely positions the capacitor monomers through a plastic bracket, reasonably controls the gap between the capacitor monomers, and makes the air duct size uniform. The optimized air duct design increases the heat exchange area between the circulating air and the surface of the capacitor monomers, ensuring that the cooling air can flow smoothly inside the module, thereby effectively improving the heat dissipation efficiency. At the same time, the bracket structure provides stable support for the capacitor monomers, enhancing the vibration resistance performance and overall structural reliability of the module.

[0025] Third, the air-cooled module of this application adopts intelligent variable frequency technology, which real-time collects the temperature data inside the module through the set temperature sensor and feeds the data back to the terminal CMS for judgment and processing. Using PWM control technology to dynamically adjust the fan speed, providing high, medium, and low three-speed outputs according to different temperature rise situations, ensuring the balance of heat dissipation performance and energy efficiency ratio. Compared with the traditional air-cooled system with a fixed rotation speed, this design avoids unnecessary energy consumption, extends the service life of the fan, and further improves the heat dissipation efficiency.

[0026] Fourth, this application optimizes the gaps between capacitor groups, between the capacitor group and the box body, and between capacitor monomers, fully considering the balance of the cell arrangement and air duct distribution, making the air flow more evenly cover all capacitor monomers, and avoiding the problem of insufficient local heat dissipation. Through optimizing heat dissipation and intelligent regulation, the temperature gradient during the operation of the capacitor module is effectively reduced, the service life of the capacitor monomers is extended, and the overall reliability and stability of the system are improved.

[0027] Fifth, the capacitor module of this application adopts a same-end lead-out design, arranging the positive and negative lead-out ends of the module on the same side, simplifying the connection structure of the module, reducing the complexity of external wiring. This design facilitates the installation and maintenance of the module, improves the modular assembly efficiency, and at the same time reduces the cost and process complexity of system integration. Description of the Drawings

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0029] Figure 1 Structural schematic diagram of a capacitor module with an optimized air-cooled heat dissipation structure according to the first embodiment of the present invention;

[0030] Figure 2 Structural schematic diagram of a capacitor bank according to the first embodiment of the present invention;

[0031] Figure 3 Top view of a capacitor bank according to the first embodiment of the present invention;

[0032] Figure 4 Structural schematic diagram of a first connection piece according to the first embodiment of the present invention;

[0033] Figure 5 Side view of a first connection piece according to the first embodiment of the present invention;

[0034] Figure 6 Top view of a capacitor module with an optimized air-cooled heat dissipation structure according to the second embodiment of the present invention;

[0035] Figure 7 Cross-sectional schematic diagram of the air duct of a capacitor module according to the second embodiment of the present invention;

[0036] Figure 8 Top view of a capacitor module with an optimized air-cooled heat dissipation structure according to the third embodiment of the present invention.

[0037] Explanation of reference numerals

[0038] 1. Capacitor bank; 11. Capacitor cell; 12. Negative terminal; 2. First connection piece; 21. Negative connection part; 22. Positive connection part; 23. Bridge waist part; 3. Bracket assembly; 31. Upper bracket group; 311. Plug connector; 312. Socket; 32. Lower bracket group; 4. Cooling fan; 5. FPC board; 51. Sampling piece; 52. Bridge bracket; 6. Lead-out end; 7. Second connection piece; 8. Third connection piece. Detailed implementation manners

[0039] The following will describe the embodiments of the present invention in detail with reference to the drawings.

[0040] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The present invention can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0041] It should be noted that the following describes various aspects of the embodiments within the scope of the appended claims. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is illustrative only. Based on the present invention, those skilled in the art should understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects described herein can be used to implement the device and / or practice the method. In addition, this device and / or this method can be implemented using other structures and / or functions in addition to one or more of the aspects described herein.

[0042] In the prior art, in order to achieve the heat dissipation effect of the supercapacitor bank 1, liquid cooling and air cooling are mostly used. Liquid cooling has a relatively high cost and high maintenance difficulty compared with air cooling; while the heat dissipation efficiency of air cooling is relatively lower than that of liquid cooling; under this premise, how to use an air-cooled heat dissipation structure with good heat dissipation effect and reduced cost has become an urgent problem in the industry; based on this, the embodiments of this specification propose a solution for an air-cooled heat dissipation structure, and this solution uses a claw-shaped first connecting piece 2 to increase the heat dissipation area to enhance the heat dissipation effect.

[0043] Embodiment 1:

[0044] Refer to Figure 1 - Figure 5, this embodiment provides a capacitor module with an optimized air-cooled heat dissipation structure, which includes: several capacitor groups 1, each capacitor group 1 includes at least 4 capacitor monomers 11, the housing of the capacitor monomer 11 is connected to its positive electrode, the negative electrode post 12 of the capacitor monomer 11 extends from the center of the top surface of the housing, and the negative electrode posts 12 of several capacitor monomers 11 face the same side; a bracket assembly 3, the capacitor group 1 is arranged in the bracket assembly 3; a connecting piece group, the connecting piece group is electrically connected to the top of the capacitor group 1, and several capacitor groups 1 are arranged in series through several connecting pieces in sequence; the connecting piece group includes several first connecting pieces 2 and at least two second connecting pieces 7 at the lead-out end 6, one first connecting piece 2 is provided in each capacitor group 1, adjacent capacitor groups 1 are connected by the first connecting piece 2, adjacent capacitor monomers 11 are led out from the same end at the top, welded at the same end, and serially fixed at the same end. Compared with the prior art's lead-out method at both the top and bottom ends, the processing procedure is simplified, the processing timeliness and efficiency are improved, the processing consistency is also improved, the assembly cost is effectively reduced, and it is also more convenient in terms of product maintainability; the connecting piece group is integrally stamped by a sheet metal forming process, and 1-series or 3-series aluminum is selected; the first connecting piece 2 connects at least two capacitor monomers 11 in one capacitor group 1 in parallel, and connects the at least two capacitor monomers 11 connected in parallel to at least two other capacitor monomers 11 in series; at least two second connecting pieces 7 are respectively connected to the positive electrode of the capacitor monomer 11 in the first capacitor group 1 and the negative electrode of the capacitor monomers 11 connected in parallel in the last capacitor group 1; an air-cooled module, the air-cooled module includes at least one cooling fan 4 and at least one temperature sensor; the first connecting piece 2 is a claw-shaped structure with a height difference, including at least two positive electrode connecting parts 22, at least two negative electrode connecting parts 21 and a bridge waist part 23, the positive electrode connecting part 22 and the negative electrode connecting part 21 are respectively arranged on both sides of the bridge waist part 23; the negative electrode connecting part 21 of the first connecting piece 2 is connected to the negative electrode post 12 of a capacitor monomer 11, and the positive electrode connecting part 22 is connected to the top surface of the housing of the adjacent next capacitor monomer 11.

[0045] In this solution, the 8 capacitor bodies in a single capacitor group are connected in a series-parallel manner by using a claw-shaped conductive aluminum row through laser welding for fixation, realizing the basic composition of 4 capacitor bodies 11 connected in parallel and 4 other capacitor bodies 11 connected in series, and then fixed by upper / lower plastic brackets; this connection method can not only effectively pass current but also play a certain role in heat conduction and dissipation.

[0046] In a preferred embodiment, the bracket assembly 3 includes a lower bracket group 32 and an upper bracket group 31. The lower bracket group 32 includes a plurality of lower brackets arranged side by side, and adjacent lower brackets are connected by a plugging structure. The upper bracket group 31 includes a plurality of upper brackets arranged side by side. The lower brackets and the corresponding upper brackets are fixedly connected by fasteners. A plurality of lower struts are provided on the lower brackets, and corresponding upper struts are provided on the upper brackets. The lower struts and the upper struts are correspondingly plugged and fixed by fasteners. A slot 312 or a socket is formed on one of the lower struts or the upper struts, and a plug 311 is provided on the other, and the plug 311 is in plugging fit with the slot 312 or the socket.

[0047] In a preferred embodiment, referring again to Figure 2 and Figure 3 , the capacitor module with an optimized air-cooled heat dissipation structure further includes a flexible printed circuit board group. The flexible printed circuit board group is located above the connecting piece group. The flexible printed circuit board group includes a plurality of FPC boards 5 installed longitudinally. A plurality of sampling chips are provided on the FPC boards 5. The sampling chips are connected to the first connecting piece 2 and / or the second connecting piece 7. The temperature sensor is arranged on the sampling chip 51. The capacitor unit 11 uses the FPC board 5 as a sampling circuit. The FPC board 5 collects the electric control signals of the capacitor unit 11 through the sampling chips and the connecting pieces, realizing the wire-free of the module, simplifying the structure, reducing the weight, having better heat dissipation and weldability. When designing, there is no need to reserve space for accommodating wires, which is more conducive to integrated design, reducing the space volume of the module and the installation space requirements for the module. Moreover, the connection positions of the sampling chips and the connecting pieces can be adjusted arbitrarily according to requirements, making rational use of the space of each part. The position arrangement of the sampling chips is more flexible and has no limitations, and the module can be minimized to the greatest extent, reducing the space volume of the module. The sampling chips and the connecting pieces are fixed by welding, improving the contact reliability and sampling accuracy, reducing the risk of poor contact caused by missed insertion, loose plugging, loosening, etc., and ensuring the reliability of sampling signal transmission. The flexible printed circuit board group further includes a bridge support 52. The bridge support 52 is located between the connecting piece group and the FPC board 5. The positive connection part 22 is an arc-shaped concave structure, and the concave structure surrounds the negative pole column 12. The negative connection part 21 is in a round head shape and is connected to the negative pole columns 12 of adjacent capacitor units 11. The bridge waist 23 is fixed to the bracket assembly 3. In the first connecting piece 2, the bridge waist 23, the negative connection part 21 and the positive connection part 22 are arranged in sequence from high to low.

[0048] In this solution, the claw-shaped first heat sink 2 mainly has two advantages: 1. The heat dissipation area is relatively large. Since the negative connection part is an arc-shaped concave structure, the upper surface has a large contact area with the cold air and can dissipate heat quickly; 2. Referring again to Figure 3 and Figure 5, there is a large gap between the bridge waist 23 of the first heat sink 2 and the bracket assembly 3, allowing cold air to pass through the lower surface of the bridge waist. This not only improves the air flow circulation but also enhances heat conduction and dissipation, further optimizing the heat dissipation effect and helping to maintain the temperature stability of the capacitor module during efficient operation.

[0049] Embodiment 2:

[0050] Refer to Figure 6 and Figure 7 , compared with Embodiment 1, the air-cooled module in this embodiment includes three cooling fans 4 and three temperature sensors. The cooling fans 4 are evenly distributed horizontally at the relative tail end, and the rotational speed of the cooling fans 4 includes at least 3-level adjustment to quickly and evenly discharge heat to the outside of the module; the cooling fans 4 are axial fans using intelligent variable frequency technology. Three temperature sensors on the FPC board 5 sample the real-time temperature data inside the module, which is fed back to the terminal CMS for judgment and processing, and then the rotational speed of the fan is controlled through PWM technology. According to the sampled data of different temperature rises inside the capacitor module, the rotational speeds of the high, medium, and low gears of the axial fan are preset; the three-speed rotational speed of the cooling fan 4 is controllable, and the rotational speed of the cooling fan 4 can be adjusted in real time according to the sampled data of the temperature sensor to quickly and effectively dissipate heat from the capacitor body 11. The cooling fan 4 has built-in stall protection, overcurrent / overvoltage protection and other related safety regulations, and has a long service life and is easy to maintain; it avoids uneven heat dissipation and large temperature differences between individual capacitor bodies 11 due to the position difference of the cooling fans 4.

[0051] In this solution, the procurement cost of a single fan is within 10 yuan, and the procurement cost of the entire air-cooled system can be controlled within 40 yuan; while the procurement cost of the water-cooled coil + aluminum heat sink + sealed water pipe joint is estimated to be about 450 yuan, and the mold cost is not included; therefore, this solution greatly reduces the heat dissipation cost of the capacitor module, and the installation structure design of the air-cooled solution's cooling fan 4 is simple, easy to disassemble, does not occupy too much internal space of the capacitor module, to achieve a higher energy efficiency ratio, and has strong maintainability in the later stage.

[0052] In a preferred embodiment, a first air duct 41, a second air duct 42, and a third air duct 43 are provided in the capacitor module with an optimized air-cooled heat dissipation structure. The first air duct 41 and the third air duct 43 are located between the overall capacitor bank 1 and the box body, and the second air duct 42 is located between laterally adjacent capacitor banks 1. Preferably, the gap between capacitor bodies is controlled by the bracket assembly 3 to be d1, the dimensions of the first air duct 41, the second air duct 42, and the third air duct 43 are d2, and the height of the box body is preferably h1; the height of the capacitor cell 11 is preferably h2. Further, d1 is 4 mm, d2 is 10 mm, h1 is 110 mm, and h2 is 95 mm. The cooperation between the capacitor body gap (d1 = 4 mm) and the air duct width (d2 = 10 mm) makes the air flow rate moderate and the air circulation smooth, avoiding high air resistance and air stagnation, and improving the heat dissipation efficiency. There is sufficient space between the box body height (h1 = 110 mm) and the capacitor cell 11 height (h2 = 95 mm) to accommodate structures such as the first connection piece 2 and the FPC board 5, saving space in the vertical direction while ensuring the heat dissipation performance.

[0053] In this solution, three main air ducts (the first air duct 41, the second air duct 42, and the third air duct 43) and multiple auxiliary air ducts are provided inside the capacitor module. The design and arrangement of the multiple auxiliary air ducts increase the heat exchange area between the air and the surface of the battery cells, effectively improving the heat dissipation effect. The cross-sectional dimensions of the three main air ducts are: 10×115 mm, and the cross-sectional dimensions of the remaining auxiliary air ducts are: 4×95 mm. By reasonably arranging the dimensions of the auxiliary air ducts through the bracket assembly 3, it is ensured that the air flow exchanges heat with the surface of the capacitor cell 11 to the greatest extent, thereby greatly improving the heat dissipation efficiency. Compared with the traditional air-cooled system, the added auxiliary air ducts and the reasonable configuration of the main air ducts can effectively reduce the local overheating phenomenon caused by uneven air ducts or insufficient heat dissipation, improving the working stability and service life of the capacitor module. At the same time, the auxiliary air ducts and the lower surface of the bridge waist 23 form a heat dissipation space, enabling the cold air to flow fully in this heat dissipation space, further improving the heat dissipation efficiency.

[0054] Example 3:

[0055] Refer to Figure 8, compared with Embodiment 1 and Embodiment 2, the capacitor module with an optimized air-cooling structure in this embodiment includes 10 capacitor groups 1. The capacitor groups 1 are arranged in a 2×5 horizontal and vertical distribution structure, ensuring that each capacitor cell 11 can be fully covered by the cooling air flow, avoiding local overheating, and improving the heat dissipation uniformity and efficiency. The connecting piece group includes 4 second connecting pieces 7. The connecting piece group further includes a third connecting piece 8. The two second connecting pieces 7 are located at the opposite ends of the lead-out end 6. The two second connecting pieces 7 located at the opposite ends are electrically connected through the third connecting piece 8. The third connecting piece 8 is connected to the two second connecting pieces 7 by bolts or welding, simplifying the external wiring, reducing the resistance of the connection path, and improving the overall electrical stability of the module. The capacitor group 1 includes 8 capacitor cells 11. The first connecting piece 2 includes 4 positive connection parts 22 and 4 negative connection parts 21, forming a capacitor group 1 structure in which 4 capacitor cells 11 are connected in parallel and then connected in series with the other 4 capacitor cells.

[0056] In this specification, for the same and similar parts among the various embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the embodiments described later, the description is relatively simple, and reference can be made to the corresponding parts of the foregoing embodiments for the relevant content.

[0057] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A capacitor module with an optimized air-cooling heat dissipation structure, characterized in that: include: A plurality of capacitor groups, wherein the shell of each capacitor unit is connected to the positive electrode thereof, and the negative electrode column of each capacitor unit extends from the center of the top surface of the shell; A bracket assembly, wherein the capacitor bank is arranged in the bracket assembly; A connecting piece group, the connecting piece group is electrically connected to the top of the capacitor group, the connecting piece group includes a plurality of first connecting pieces and at least two second connecting pieces located at the lead-out end, the first connecting piece is a claw-shaped structure with a height difference, including at least two positive electrode connecting parts, at least two negative electrode connecting parts and a bridge waist, the positive electrode connecting part and the negative electrode connecting part are respectively arranged on both sides of the bridge waist; the negative electrode connecting part of the first connecting piece is connected to the negative electrode column of a capacitor monomer, and the positive electrode connecting part is connected to the top surface of the shell of the next adjacent capacitor monomer; The air cooling module comprises at least one cooling fan and at least one temperature sensor.

2. The capacitor module with optimized air-cooling heat dissipation structure according to claim 1, characterized in that: A first connecting plate is provided in each capacitor group, and adjacent capacitor groups are connected through the first connecting plate; the first connecting plate connects at least two capacitor monomers in a capacitor group in parallel, and connects the at least two parallel capacitor monomers in series with at least two other capacitor monomers; at least two second connecting plates are respectively connected to the positive electrode of the capacitor monomer in the first capacitor group and the negative electrode of the capacitor monomer in parallel combination in the last capacitor group.

3. The capacitor module with optimized air-cooling heat dissipation structure according to claim 2, characterized in that: It includes multiple capacitor groups, and the capacitor groups are of a horizontal and vertical distribution structure; the connecting plate group includes multiple second connecting plates, and the connecting plate group also includes a third connecting plate, two of the second connecting plates are located at opposite tail ends of the lead-out end, and the two second connecting plates located at the opposite tail ends are electrically connected through the third connecting plate.

4. The capacitor module with optimized air-cooling heat dissipation structure according to claim 2 or 3, characterized in that: The air cooling module includes three cooling fans and three temperature sensors. The cooling fans are evenly distributed laterally at the opposite rear ends. The rotation speed of the cooling fans includes at least 3 levels of adjustment.

5. The capacitor module with optimized air-cooling heat dissipation structure according to claim 4, characterized in that: It also includes a flexible circuit board group, which is located above the connecting plate group. The flexible circuit board group includes a plurality of FPC boards installed longitudinally. A plurality of collection plates are arranged on the FPC board. The collection plates are connected to the first connecting plate and / or the second connecting plate. The temperature sensor is arranged on the sampling plate.

6. The capacitor module with optimized air-cooling heat dissipation structure according to claim 5, characterized in that: The cooling fan includes an axial flow fan using intelligent frequency conversion technology. The real-time temperature data inside the module is sampled through three temperature sensors on the FPC board, and the data is fed back to the terminal CMS for judgment and processing. The fan speed is then controlled through PWM technology. According to the different temperature rise sampling data inside the capacitor module, the axial flow fan is preset to three speed gears: high, medium and low.

7. The capacitor module with optimized air-cooling heat dissipation structure according to claim 1, characterized in that: The bracket assembly includes a lower bracket group and an upper bracket group. The lower bracket group includes a plurality of lower brackets arranged side by side, and adjacent lower brackets are connected by a plug-in structure. The upper bracket group includes a plurality of upper brackets arranged side by side, and the lower brackets are fixedly connected to the corresponding upper brackets by fasteners. A plurality of lower pillars are provided on the lower bracket, and upper pillars are correspondingly provided on the upper bracket. The lower pillars are correspondingly plugged into the upper pillars and fixed by fasteners. A slot or a socket is provided on one of the lower pillars or the upper pillars, and a plug connector is provided on the other, and the plug connector is plugged into and matched with the slot or the socket.

8. The capacitor module with optimized air-cooling heat dissipation structure according to claim 5, characterized in that: The flexible circuit board group also includes a bridge bracket, and the bridge bracket is located between the connecting sheet group and the FPC board.

9. The capacitor module with optimized air-cooling heat dissipation structure according to claim 1, characterized in that: The positive electrode connecting portion is an arc-shaped concave structure, and the concave structure surrounds the negative electrode column.

10. The capacitor module with optimized air-cooling heat dissipation structure according to claim 1, characterized in that: The bridge waist portion is fixed to the bracket assembly, and the bridge waist portion, the negative electrode connecting portion and the positive electrode connecting portion are sequentially arranged in the first connecting piece from high to low.

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