Device and method for machining blade film hole through femtosecond laser

Abstract

The invention relates to the technical field of laser micropore processing, and discloses a device for processing a blade film hole by femtosecond laser, which sequentially comprises an infrared femtosecond laser for emitting laser, a blade hole forming device for guiding light and processing laser beams and a blade fixing device for fixing a blade to be processed along a beam transmission path, the blade hole forming device comprises a laser incidence port, a compact scanning galvanometer system for adjusting a laser scanning path, a rotating assembly capable of rotating around an optical axis and used for adjusting the emitting angle of a laser beam, a focusing system for adjusting laser focusing, a light guide assembly for adjusting light beam incidence and a light guide reflection assembly. The lower end of the scanning galvanometer system is connected with the upper end of the rotating assembly, the upper end of the focusing system is connected with the lower end of the rotating assembly, the lower end of the focusing system is connected with the upper end of the light guide assembly, and the lower end of the light guide assembly is connected with the light guide reflection assembly. And the infrared femtosecond laser, the compact scanning galvanometer system and the focusing system are all controlled by the control system. According to the system, blade film hole machining in a complex track can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser micro-hole processing, and more particularly, to a device and method for processing air film holes on blades using femtosecond lasers. Background Art

[0002] Modern advanced aero-engines generally adopt small-hole air film cooled turbine blades to increase the turbine inlet temperature, thereby improving the thrust-to-weight ratio of the engine. The performance of an aero-engine depends to a large extent on the shape and quality of the air film cooling holes on the blades. Due to the obvious cooling effect on the engine, the air film cooling holes have always received extensive attention in the aviation equipment industry. However, due to the high processing difficulty of the air film holes, it has always been a difficult problem that needs to be solved in the aviation equipment manufacturing industry.

[0003] Electrical discharge drilling is a relatively mature method for processing air film holes and is widely used in the processing of air film holes at home and abroad. Rapid electrical discharge drilling can process deep holes with good roundness and straightness and has a high processing speed, and is not limited by the hardness and toughness of the material. However, it is difficult to process the ceramic coating of the blade with poor conductivity.

[0004] Electro-hydraulic beam drilling can obtain good processing quality. However, due to problems such as difficult hole shape control and electrolyte corrosion in electro-hydraulic beam drilling, it has not yet become the mainstream technology for air film hole processing technology.

[0005] Laser processing for drilling is to heat, melt and even erode the material in the spot irradiation area through extremely high energy density, and has the advantages of non-contact processing, good processing quality, high precision, high processing efficiency, high material utilization rate, high economic efficiency, good universality, small heat affected area, etc. At present, according to the laser pulse width, lasers are divided into long pulse lasers (pulse width greater than 10 - 7 s), short pulses (pulse width between 10 -7 and 10 -11 s) and ultra-short pulse lasers (pulse width between 10 -11 and 10 -15 s). Millisecond or nanosecond laser drilling has obvious thermal effects, and there are inevitably recast layers and even micro-cracks in the material during the rapid cooling process. By using a femtosecond laser and a galvanometer scanner, as involved in the invention patent with the authorized publication number of CN105458530B, ultra-short pulse laser processing can achieve minimal recast layer and minimal micro-crack processing due to its extremely small thermal effect. However, in this solution, due to the poor coordination between the galvanometer scanning and the workpiece movement, the processing efficiency of complex trajectories is low, and there is also an interference area, making it difficult to meet the high-quality processing requirements of the air film cooling holes of aero-engine blades. Summary of the Invention

[0006] The technical problem to be solved by the present invention is that the existing femtosecond laser processing of blade film holes has low processing efficiency for complex trajectories and there are interference regions. To overcome the above defects of the prior art, the present invention provides a novel device and method for femtosecond laser processing of blade film holes.

[0007] The present invention provides a device for femtosecond laser processing of blade film holes, which sequentially includes an infrared femtosecond laser for emitting laser along the beam transmission path, a blade interference region hole-making device for guiding and processing the laser beam, and a blade fixing device for fixing the blade to be processed. The blade interference region hole-making device includes a laser incident port, a compact scanning galvanometer system for adjusting the laser scanning path, a rotating component that can rotate around the optical axis and is used for adjusting the laser beam exit angle, a focusing system for adjusting laser focusing, and a light guiding component and a light guiding reflection component for adjusting the beam incidence; the lower end of the compact scanning galvanometer system is connected to the upper end of the rotating component, the upper end of the focusing system is connected to the lower end of the rotating component, the lower end of the focusing system is connected to the upper end of the light guiding component, and the lower end of the light guiding component is connected to the light guiding reflection component; the infrared femtosecond laser, the compact scanning galvanometer system, and the focusing system are all controlled by a control system.

[0008] Compared with the prior art, the present invention has the following advantages: The infrared femtosecond laser emits high-energy laser, and then the compact scanning galvanometer system can design the scanning path of the light beam. These scanning paths are preset on the control system in advance. The control system controls the deflection of the scanning galvanometer according to the preset path, so as to realize the setting and change of the path. Since the light beam path is not necessarily linear, and the focusing system is usually fixed under the control of the control system, the light beam reflected by the scanning galvanometer must be incident on the focusing system after the outgoing angle is adjusted by the rotating assembly. In addition, since the light guiding assembly and the light guiding reflection assembly are also fixed, and the angle adjustment of the scanning galvanometer is limited, in order for the focusing system to focus the light beam with a complex path and then vertically enter the blade to be processed through the light guiding assembly and the light guiding reflection assembly, the rotating assembly needs to cooperate to adjust the output angle of the laser beam, so as to complete the processing of the film cooling holes with complex paths on the blade. Through the above series of optical path adjustments and the final perpendicular incidence of the light beam on the blade to be processed, the interference problem caused by the traditional inclined incidence of the light beam can be avoided. The device combines modular innovation (galvanometer, rotating assembly, focusing, light guiding) with dynamic control technology (real-time control of the control system). The obtained device has a compact structure and complete functions. The scanning galvanometer system is used to cooperate in the optical path design, and then after the integration of focusing and light guiding, the system solves the problem of space limitation in blade hole making. Because the laser path design is controllable, complex trajectory processing can be realized with high efficiency. Due to the limitations of the traditional laser beam processing of blades, such as the yaw angle and too long focal length, the local energy density is uneven (such as focus shift), which affects the processing quality (such as surface roughness and melt depth consistency). The adjacent blade spacing is small, and improper planning of the traditional galvanometer scanning path may cause interference between the laser beam and the processed area or fixture. The compact integrated light guiding optical path design of this application enables the light beam to be embedded in the narrow blade gap, avoiding the formation of interference areas.

[0009] In a possible implementation manner, the compact scanning galvanometer system includes an X-axis scanning galvanometer composed of a first reflecting lens and a first galvanometer motor, and a Y-axis scanning galvanometer composed of a second reflecting lens and a second galvanometer motor. The rotor shaft of the first galvanometer motor is connected to the first reflecting lens, and the rotor shaft of the second galvanometer motor is connected to the second emitting lens. The rotation control of the first galvanometer motor and the second galvanometer motor is controlled by the control system.

[0010] In a possible implementation manner, the rotating assembly sequentially includes a sleeve adapter, a rotating cage plate, and an adapter fixing module from top to bottom. The upper end of the sleeve adapter is connected to the lower end of the compact scanning galvanometer system. One end of the rotating cage plate is connected to the lower end of the sleeve adapter, and the other end is connected to the upper end of the adapter fixing module. The lower end of the adapter fixing module is connected to the upper end of the focusing system.

[0011] In a possible implementation manner, the focusing system includes a focusing lens and a telescopic sleeve. The focusing lens is fixed on a sliding mounting seat inside the telescopic sleeve, and the upper end of the telescopic sleeve is connected to the lower end of the adapter fixing module.

[0012] In a possible implementation manner, the light guiding component is in the shape of a hollow funnel, including an inverted conical opening and a first hollow tube connected to the lower end of the opening. The opening of the light guiding component is connected to the lower end of the telescopic sleeve, and the lower end of the first hollow tube of the light guiding component is connected to the upper end of the light guiding and reflecting component.

[0013] In a possible implementation manner, the light guiding and reflecting component is a second hollow tube in the shape of a hollow column. An opening is provided on the tube wall of the second hollow tube, and the opening is communicated with the hollow inner hole of the second hollow tube. A third reflecting lens is provided at the bottom of the opening.

[0014] In a possible implementation manner, the cylindrical lower end hollow tube of the funnel-shaped light guiding component and the second hollow tube of the light guiding and reflecting component in the shape of a hollow column are coaxially arranged and have the same inner and outer diameters. The ratio L / D of the sum of the length of the first hollow tube and the length of the second hollow tube to the diameter of the first hollow tube or the second hollow tube is ≥ 10:1.

[0015] In a possible implementation manner, an air vent interface is provided on the opening of the light guiding component.

[0016] In a possible implementation manner, a magnetic attraction convex groove is provided at the upper end of the second hollow tube of the hollow column light guiding and reflecting component, and a magnetic attraction concave groove is provided at the lower end of the first hollow tube of the funnel-shaped light guiding component. The magnetic attraction concave groove is adapted to the magnetic attraction convex groove.

[0017] The present invention also provides a method for processing blade air film holes by femtosecond laser, which is carried out in the device described in any one of the above. The method includes the following steps: The control system controls the infrared femtosecond laser to emit laser. The laser enters the compact scanning galvanometer system from the laser incident port and is set to emit a first light beam. After passing through the rotating component, the reflected first light beam enters the focusing system and is adjusted into a focused light beam. The focused light beam enters the light guiding and reflecting component through the light guiding component, forms a second reflected light beam, and is accurately positioned on the blade to be processed fixed by the blade fixing device, so as to process the air film holes.

[0018] The beneficial effects of the present invention are as follows: 1. The device for processing blade air film holes designed by the present invention solves the problems of spatial interference generated in processing blade air film holes in the prior art and how to perform multi-degree-of-freedom hole making on complex curved surface blades.

[0019] 2. The cold processing technology of the infrared femtosecond laser solves the problems of recast layer, microcracks, and removal of ceramic coatings.

[0020] 3. An integrated ventilation interface is provided on the open end of the hollow funnel-shaped light guide component, with a built-in ventilation channel, which combines with an external gas source to achieve active chip removal and cooling in the processing area.

[0021] 4. The processed blade film holes have small diameters, a large number, and high quality. Description of the Drawings

[0022] Figure 1 It is a schematic diagram of the overall structure of a device for processing blade film holes with femtosecond laser according to the present invention; Figure 2 It is the front view of the blade hole-making device; Figure 3 It is the internal optical path transmission diagram of the blade hole-making device; Figure 4 It is the composition diagram of the scanning galvanometer system; Figure 5 It is Figure 2 The enlarged view at I of Figure 6 It is the front view of the telescopic sleeve; Figure 7 It is Figure 6 The A-A sectional view of Figure 8 It is Figure 2 The enlarged view at II of Figure 9 It is Figure 2 The enlarged view at III of

[0023] Explanation of the Reference Numerals in the Drawings: 100, infrared femtosecond laser; 200, beam transmission path; 201, laser output beam; 202, first reflected beam; 203, focused beam; 204, second reflected beam; 300, blade hole-making device; 301, laser inlet; 302, compact scanning galvanometer system; 303, focusing system; 304, first sealing port; 305, X-axis scanning galvanometer system; 306, Y-axis scanning galvanometer system; 307, second sealing port; 308, focusing mirror; 309, light guide reflection component; 310, first reflecting lens; 311, first galvanometer motor; 312, sleeve adapter; 313, rotating cage plate; 314, adapter fixing module; 315, ventilation interface; 316, light guide component; 317, magnetic attraction groove; 318, magnetic attraction convex groove; 319, third reflecting lens; 320, setscrew fixing hole; 321, second reflecting lens; 322, second galvanometer motor; 323, telescopic sleeve; 324, fixing frame; 325, rotating component; 326, fastening screw; 327, external thread adapter; 328, sliding mounting seat; 329, internal thread adapter; 330, snap ring; 400, blade to be processed; 500, blade fixing device. Detailed Embodiment

[0024] To make the above objects, features, and advantages of the present invention more apparent and understandable, the following provides a detailed description of specific embodiments of the present invention. It should be noted that the following embodiments are only used to illustrate the implementation methods and typical parameters of the present invention, and are not used to limit the parameter range described in the present invention. Any reasonable variations derived therefrom are still within the protection scope of the claims of the present invention.

[0025] In the description of the present invention, it should be noted that the orientation or positional relationships indicated by the terms "left", "right", "inner", "outer", "front", "back", "head", "tail", etc. are based on the orientation or positional relationships shown in the drawings, or the orientation or positional relationships in which the product of the present invention is usually placed during use. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0026] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0027] In the embodiments of the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over", and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath", and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0028] The following further elaborates on the present application in conjunction with the drawings and specific embodiments.

[0029] See Figures 1 to 7As shown in the figure, the present application designs a device for processing film cooling holes on blades by femtosecond laser. The core of the device is a hole-making device for the blade interference area. This hole-making device can be used in conjunction with an infrared femtosecond laser 100. The device includes a laser inlet 301, a compact scanning galvanometer system 302, a rotating assembly 325, a focusing system 303, a ventilation interface 315, and a mounting position for the third mirror 319. It uses a light guide component 316 with a high aspect ratio (L / D≥10:1) and a light guide and reflection component 309. Through the in-entry optical path transmission technology, precise introduction of the laser beam and hole-making processing in the geometric interference area of the blade are realized.

[0030] Specifically, as Figure 1 shown in the figure, the present application designs a device for processing film cooling holes on blades by femtosecond laser. The device includes an infrared femtosecond laser 100 that emits laser along the beam transmission path 200, a blade hole-making device 300 that guides and processes the laser beam, and a blade fixing device 500 that fixes the blade 400 to be processed. After the laser beam 201 emitted by the laser is adjusted in path by the compact scanning galvanometer system 302, it is output to the blade 400 to be processed through the blade hole-making device 300, and the film cooling holes on the blade are processed. The parameters of the laser are a wavelength of 1030 nm, a maximum single-pulse energy of 2 mJ, an adjustable frequency range of 50 kHz - 1 MHz, and a spot size of 3±1 mm. The blade fixing device 500 includes a flexible tooling fixture and a four-axis displacement table. The flexible tooling fixture is fixed on the four-axis displacement table. The clamping of the bottom of the blade can be realized through the flexible tooling fixture, and then the fixture is fixed on the four-axis displacement table to achieve all-round and dead-angle-free processing of the blade sample. The entire device is controlled by a computer control system that is Bluetooth-connected to the device.

[0031] Referring to Figure 2 and Figure 3 it can be seen that the blade hole-making device 300 includes a laser inlet 301, a compact scanning galvanometer system 302 that adjusts the laser scanning path, and a focusing system 303 that adjusts the laser focus; the compact scanning galvanometer system 302 is connected to the upper end of the focusing system 303 through a rotating assembly. The lower end of the focusing system 303 is connected to a light guide component 316 that processes the laser beam, and the lower end of the light guide component 316 is connected to a light guide and reflection component 309 that adjusts the beam exit angle; the infrared femtosecond laser 100, the compact scanning galvanometer system 302, and the focusing system 303 are controlled by a control system. The compact scanning galvanometer system 302 can achieve high speed and multiple processing paths. The focusing system 303 includes a focusing lens 308 and a telescopic sleeve 323. The focusing lens 308 is fixed on a sliding mounting seat inside the telescopic sleeve 323, and the upper end of the telescopic sleeve 323 is fixed to the lower end of the adapter fixing module 314. The focusing system 303 adjusts the external adjustment ring of the telescopic sleeve 323 ( Figure 2The position of the internal focusing lens 308 is changed by the black circular part) to achieve the change of the focal position. The focusing range is ±10 mm, which can meet the requirements of different material thicknesses, different interference zone sizes, and processing depths. The focusing lens 308 focuses the light beam; the telescopic sleeve 323 enables the adjustable focusing position. The focusing lens 308 is fixed on the sliding mounting seat inside the telescopic sleeve 323 by two snap rings. By adjusting the external adjustment ring of the telescopic sleeve 323 ( Figure 2 the black part in) linearly moves the focusing lens 308 to change the focal position.

[0032] See Figure 3 and Figure 4 It can be seen that the compact scanning galvanometer system 302 includes a fixed frame 324, an X-axis scanning galvanometer composed of a reflecting mirror 310 and a galvanometer motor 311 installed at the first seal port 304, and a Y-axis scanning galvanometer composed of a reflecting mirror 321 and a galvanometer motor 322 installed at the second seal port 307. The X-axis scanning galvanometer and the Y-axis scanning galvanometer are both fixed on the fixed frame 324, that is, fixed on the first seal port 304 and the second seal port 307 of the fixed frame 324 respectively. The settings of the first seal port 304 and the second seal port 307 are to ensure the sealing of the entire compact scanning galvanometer system 302 and guarantee the transmission of the light beam. The rotor shaft of the galvanometer motor 311 is rigidly connected to the reflecting mirror 310, and the rotor shaft of the galvanometer motor 322 is rigidly connected to the emitting mirror 321. The angle control of the reflecting mirror 310 and the reflecting mirror 321 is controlled by the control system, and the rotation power control of the galvanometer motor 311 and the galvanometer motor 322 is controlled by the control system. The rotor shaft of the high-speed and high-precision galvanometer motor is directly rigidly connected to the reflecting mirror, without a reduction gear or belt drive, ensuring zero backlash and high-frequency response. The scanning speed of the high-speed and high-precision galvanometer motor can be adjusted from 0 to 12000 mm / s, the line spacing is adjustable within the range of 0.1 - 10 mm, and the minimum processing size can be set to 0.1 mm, which can meet the processing requirements of air film holes. The cooperation of the two galvanometer systems can realize the planning of various complex path trajectories, such as spiral lines, circles, squares, etc. By controlling the rotation of the motor to drive the reflecting mirror 310 and the reflecting mirror 321, the position of the incident light beam is changed, so that the light beam reaches the specified position on the XY coordinate plane. The control system is connected via Bluetooth to a tablet computer, and the maximum connection distance exceeds 10 m, which is safer and more portable.

[0033] See Figure 5It can be seen that the rotation assembly 325 successively includes a sleeve adapter 312, a rotation cage plate 313, and an adapter fixing module 314 that are detachably connected from top to bottom. The sleeve adapter 312 is connected to the lower end of the fixing frame 324. One end of the rotation cage plate 313 is fixed to the lower end of the sleeve adapter 312, and the other end is fixed to the upper end of the adapter fixing module 314. The lower end of the adapter fixing module 314 is connected to the upper end of the focusing system 303. One end of the sleeve adapter 312 has internal threads and the other end has external threads. The end with external threads is used to connect to the upper compact scanning galvanometer system 302, and the end with internal threads is rotationally and fixedly connected to the rotation cage plate 313. By fixing the sleeve adapter 312 to the compact scanning galvanometer system 302, the rotation cage plate 313 can rotate the assembly around the optical axis. It includes two cage plates, an upper fixed cage plate (upper half) and a lower cage plate (lower half) that allows the connected components to rotate. When the incident light beam is fixed, the laser beam output direction can be flexibly adjusted.

[0034] See Figure 6 and Figure 7 It can be seen that the focusing system 303 includes a focusing lens 308 and a telescopic sleeve 323. The focusing lens 308 is fixed on a sliding mounting seat 328 inside the telescopic sleeve 323 and then fixed in position by a snap ring 330. The upper end of the telescopic sleeve 323 is an external thread adapter 327 for screwing and fixing to the lower end of the adapter fixing module 314. Standard M5 mounting holes are reserved on the adapter fixing module 314, and fastening screws are also provided on the outside of the telescopic sleeve 323 to lock the mounting holes, enabling the fixed installation of the device while connecting the upper and lower components. The function of the adapter fixing module 314 is to fix the entire blade hole-making device to other external devices (such as a breadboard). The lower end of the telescopic sleeve 323 is an internal thread adapter 329 for screwing onto the lower light guide assembly 316.

[0035] See Figure 8It can be seen that the light guide component 316 is in the shape of a hollow funnel. The opening of the funnel-shaped light guide component 316 is fixed to the lower end of the telescopic sleeve 323. A magnetic attraction groove 317 is provided at the bottom of the hollow tube 1 at the cylindrical lower end of the funnel-shaped light guide component 316. An air vent interface 315 is provided on the opening of the hollow funnel-shaped light guide component 316. The funnel-shaped light guide component 316 is designed for two purposes. First, it is to use the hollow tube 1 at the cylindrical lower end to more smoothly connect to the light guide and reflection component 309 with a high length-diameter ratio below. Second, it is to use the upper opening to be more conducive to accelerating the air flow when transmitting inert gas. The hollow tube 1 at the cylindrical lower end of the light guide component 316 is used to connect to the hollow tube 2 with a hollow cylindrical shape of the light guide and reflection component 309 and provides a larger length-diameter ratio. An opening is provided on the tube wall of the hollow tube 2, and the opening communicates with the hollow inner hole of the hollow tube 2. A reflection lens 3 is provided at the bottom of the opening. The hollow tube 1 at the cylindrical lower end of the funnel-shaped light guide component 316 and the hollow tube 2 with a hollow cylindrical shape of the light guide and reflection component 309 are concentric and coaxial and have the same inner and outer diameters. The ratio of the sum of the length of the hollow tube 1 and the length of the hollow tube 2 to the diameter of the hollow tube 1 or the hollow tube 2, that is, the length-diameter ratio L / D≥10:1. The advantage of such a large length-diameter ratio is that it can better extend into a deeper interference area for blade film hole processing. The light guide component 316 has a high length-diameter ratio. The inside of this part is hollow and has the advantage of being lightweight. By introducing inert gas into the air vent interface 315 on the opening of the light guide component 316, it can prevent lens contamination or thermal damage, and can isolate oxygen, avoid oxidation of the material surface during high-temperature processing, and can also stabilize the light path, reduce the interference of air turbulence on laser transmission, and achieve the functions of dust removal and temperature reduction. The high length-diameter ratio light guide component 316 is used to achieve an in-entry light path transmission. This component can enter the interference area of the processed sample for processing. 317 is a magnetic attraction groove, which is magnetic and can adsorb and embed the light guide component 309, and the suction force is about 20N.

[0036] See Figure 9 It can be seen that the light guide and reflection component 309 is in the shape of a hollow cylinder. An opening is made from the middle of the hollow cylinder to the side, and a reflection lens 319 is fixed at the bottom surface of the side opening, and the fixed angle is 45°. A magnetic attraction convex groove 318 is provided at the upper end of the hollow cylinder light guide and reflection component 309. The magnetic attraction groove 317 matches the magnetic attraction convex groove 318. The magnetic attraction groove 317 and the magnetic attraction convex groove 318 form a complementary structure, which can realize the embedding and adsorption of the two, and ensure the stable fixation of the light guide and reflection component 309. When the reflection lens 319 is installed, it is fixed by the bottom set screw against the set screw fixing hole 320 to ensure the 90° accurate turning of the laser light path.

[0037] Through modular innovation, the device combines the technologies of galvanometers, focusing, light guiding, and dynamic control through rotation and intervention, systematically solving the problems of spatial limitations, thermal damage control, and deep hole accuracy in hole making in the interference area of blades, and having significant competitive advantages in the processing of high-value components in the aerospace field. Enhanced spatial adaptability: Compact design enables it to be embedded in narrow blade gaps to avoid mechanical interference. Integrated ventilation interface: Built-in ventilation channels, combined with an external air source, achieve active chip removal and cooling in the processing area.

[0038] The present invention also provides a method for processing film cooling holes on a blade with a femtosecond laser, which is carried out in the above-mentioned device, and includes the following steps: The control system controls the infrared femtosecond laser 100 to emit laser light. The laser light enters the compact scanning galvanometer system 302 from the laser entrance 301. After the beam path is set, the exit angle is adjusted by the rotating assembly 325, then the focal length is adjusted by the focusing system 303, and then it is focused on the light guiding reflection assembly 309 through the light guiding assembly 316. After reflection, it is accurately positioned on the blade 400 to be processed fixed by the blade fixing device 500 to process film cooling holes. The specific beam change is that the laser light enters the compact scanning galvanometer system 302 from the laser entrance 301 and is set as the first reflected beam 202. The first reflected beam 202 passes through the rotating assembly 325 and then is adjusted into the focused beam 203 by the focusing system 303. Then it is focused on the light guiding reflection assembly 309 through the light guiding assembly 316 to form the second reflected beam 204, which is accurately positioned on the blade 400 to be processed fixed by the blade fixing device 500 to process film cooling holes.

[0039] In the description of the present application, the descriptions referring to terms such as "one embodiment", "some embodiments", "in this embodiment", "specific examples", or "some examples" mean that the specific features, mechanisms, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, mechanisms, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0040] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A device for processing film cooling holes on a blade by femtosecond laser, which sequentially includes an infrared femtosecond laser (100) for emitting laser along a beam transmission path (200), a blade hole-making device (300) for guiding and processing the laser beam, and a blade fixing device (500) for fixing the blade to be processed (400), characterized in that, The blade hole-making device (300) includes a laser incident port (301), a compact scanning galvanometer system (302) for adjusting the laser scanning path, a rotating assembly (325) that can rotate around the optical axis and is used to adjust the laser beam emission angle, a focusing system (303) for adjusting laser focusing, a light guiding assembly (316) for adjusting the beam incidence, and a light guiding and reflecting assembly (309); the lower end of the compact scanning galvanometer system (302) is connected to the upper end of the rotating assembly, the upper end of the focusing system (303) is connected to the lower end of the rotating assembly, the lower end of the focusing system (303) is connected to the upper end of the light guiding assembly (316), and the lower end of the light guiding assembly (316) is connected to the light guiding and reflecting assembly (309); the infrared femtosecond laser (100), the compact scanning galvanometer system (302), and the focusing system (303) are all controlled by the control system.

2. The device for processing blade air film holes by femtosecond laser according to claim 1, wherein The compact scanning galvanometer system (302) includes an X-axis scanning galvanometer composed of a first reflecting lens (310) and a first galvanometer motor (311), and a Y-axis scanning galvanometer composed of a second reflecting lens (321) and a second galvanometer motor (322). The rotor shaft of the first galvanometer motor (311) is connected to the first reflecting lens (310), and the rotor shaft of the second galvanometer motor (322) is connected to the second emitting lens (321). The rotation control of the first galvanometer motor (311) and the second galvanometer motor (322) is controlled by the control system.

3. The device for machining a blade air film hole by femtosecond laser according to claim 1, characterized in that, The rotating assembly (325) successively includes a sleeve adapter (312), a rotating cage plate (313), and an adapter fixing module (314) from top to bottom. The upper end of the sleeve adapter (312) is connected to the lower end of the compact scanning galvanometer system (302). One end of the rotating cage plate (313) is connected to the lower end of the sleeve adapter (312), and the other end is connected to the upper end of the adapter fixing module (314). The lower end of the adapter fixing module (314) is connected to the upper end of the focusing system (303).

4. The device for processing film cooling holes on a blade by femtosecond laser according to claim 1, characterized in that, The focusing system includes a focusing lens (308) and a telescopic sleeve (323). The focusing lens (308) is connected to a sliding mounting seat (328) inside the telescopic sleeve (323). The upper end of the telescopic sleeve (323) is connected to the lower end of the rotating assembly (325).

5. The device for processing film cooling holes on a blade by femtosecond laser according to claim 1, wherein, The light guiding assembly (316) is in the shape of a hollow funnel, including an inverted conical opening and a first hollow tube connected to the lower end of the opening. The opening of the light guiding assembly (316) is connected to the lower end of the telescopic sleeve (323), and the lower end of the first hollow tube of the light guiding assembly (316) is connected to the upper end of the light guiding and reflecting assembly (309).

6. The device for processing the film cooling holes of the blade by femtosecond laser according to claim 5, wherein, The light guiding and reflecting assembly (309) is a second hollow tube in the shape of a hollow column. An opening is provided on the tube wall of the second hollow tube, and the opening is communicated with the hollow inner hole of the second hollow tube. A third reflecting lens (319) is provided at the bottom of the opening.

7. The device for processing the film cooling holes of the blade by femtosecond laser according to claim 6, characterized in that, The cylindrical lower-end hollow tube one of the light guide component (316) and the hollow tube two of the hollow-column shape of the light guide and reflection component (309) are coaxially arranged and have the same inner and outer diameters, and the ratio L / D of the sum of the length of the hollow tube one and the length of the hollow tube two to the diameter of the hollow tube one or the hollow tube two is ≥10:

1.

8. The device for processing the air film holes of the blade by femtosecond laser according to claim 5, characterized in that, An air vent interface (315) is provided on the open end of the light guide component (316).

9. The device for processing the film cooling holes of the blade by femtosecond laser according to claim 7, characterized in that, A magnetic attraction convex groove (318) is provided at the upper end of the hollow tube two of the hollow-column light guide and reflection component (309), and a magnetic attraction concave groove (317) is provided at the lower end of the hollow tube one of the funnel-shaped light guide component (316), and the magnetic attraction concave groove (317) is adapted to the magnetic attraction convex groove (318).

10. A method for processing blade film cooling holes by femtosecond laser, characterized in that, It is carried out in the device according to any one of claims 1-9, and includes the following steps: the control system controls the infrared femtosecond laser (100) to emit laser light, the laser light enters the compact scanning galvanometer system (302) from the laser incident port (301) and is set to reflect beam one (202), the reflected beam one (202) enters the focusing system (303) through the rotating component and is adjusted into a focused beam (203), the focused beam (203) enters the light guide and reflection component (309) through the light guide component (316), and a reflected beam two (204) is formed and accurately positioned on the to-be-processed blade (400) fixed by the blade fixing device (500), so as to process the film cooling holes.

Images