Shell, preparation method thereof and electronic equipment

Abstract

The invention provides a shell, a preparation method thereof and electronic equipment. The shell provided by the embodiment of the invention comprises fiber cloth; the graphene coating is coated on the periphery of a part of the fiber cloth; the surface of the fiber cloth and the surface of the graphene coating are wrapped with the resin layer. The shell provided by the embodiment of the invention has relatively high rigidity and heat conductivity coefficient, and does not affect the transmission of electromagnetic wave signals.

Description

Technical Field

[0001] This application relates to the field of electronics, and particularly to a housing, a preparation method thereof, and an electronic device. Background Art

[0002] The back cover materials of electronic devices (such as mobile phones, tablets, etc.) mainly include plastics, metals, glasses, and ceramics, etc. Conventional plastic back covers have low costs, are light and easy to process, but have poor texture and low mechanical strength, and are prone to deformation. Metal back covers have good texture, are strong and durable, but have high costs and heavy weights, and metal back covers are prone to affecting signal transmission. Glass back covers are beautiful, have high hardness, and support wireless charging, but are fragile, prone to fingerprint smudging, and have poor heat conduction performance. Ceramic back covers combine the advantages of metals and glasses, but have problems such as high costs, large weights, and being fragile. In summary, the existing back covers of electronic devices are difficult to have high heat conductivity, high strength, and not affect signal transmission and other performances at the same time. Summary of the Invention

[0003] An embodiment of this application provides a housing, which has high stiffness and thermal conductivity, and does not affect the transmission of electromagnetic wave signals.

[0004] An embodiment of the first aspect of this application provides a housing, which includes:

[0005] Fiber cloth;

[0006] A graphene coating, which is wrapped around the outer periphery of part of the fiber cloth; and

[0007] A resin layer, which is wrapped around the surfaces of the fiber cloth and the graphene coating.

[0008] An embodiment of the second aspect of this application provides a preparation method of a housing, and the preparation method includes:

[0009] Provide fiber cloth;

[0010] Deposit a graphene coating on part of the regions of the fiber cloth to obtain a graphene-coated fiber cloth; and

[0011] Immerse the graphene-coated fiber cloth in a resin glue solution, and cure the resin glue solution to form a resin layer to obtain the housing.

[0012] An embodiment of the third aspect of this application provides an electronic device, which includes:

[0013] A display screen;

[0014] The housing according to the embodiment of this application, the housing is disposed opposite to the display screen; and

[0015] A processor located between the housing and the display screen, electrically connected to the display screen for controlling the display screen to display.

[0016] The housing of the embodiment of the present application includes a fiber cloth, a graphene coating, and a resin layer. The graphene coating wraps around the outer periphery of part of the fiber cloth; the resin layer wraps around the surfaces of the fiber cloth and the graphene coating. Compared with a fiber resin housing where the fiber cloth is impregnated with resin, it not only has a higher thermal conductivity and better heat dissipation effect. When applied to an electronic device, it can better dissipate heat from heat-generating components such as the motherboard and battery of the electronic device, extending the service life of the electronic device. In addition, compared with the fiber resin housing, the housing of the present application has higher stiffness and mechanical strength, is not easily deformed, and can better protect the electronic device. Moreover, the graphene coating is only located in part of the area of the housing. Through design, when the housing is applied to an electronic device, the graphene coating can avoid the antenna setting of the electronic device, so as not to affect the transmission of antenna signals, enabling the antenna signals to be normally received and transmitted without affecting the signal strength. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic structural diagram of the housing of an embodiment of the present application.

[0019] Figure 2 It is along Figure 1 in the A-A direction of the housing of an embodiment of the present application, which is a schematic cross-sectional structural diagram.

[0020] Figure 3 It is along Figure 1 in the A-A direction of the housing of another embodiment of the present application, which is a schematic cross-sectional structural diagram.

[0021] Figure 4 It is a schematic flow diagram of the preparation method of the housing of an embodiment of the present application.

[0022] Figure 5 It is a schematic structural diagram of the preparation process of the housing of an embodiment of the present application.

[0023] Figure 6 It is a schematic flow diagram of the preparation method of the graphene fiber cloth of an embodiment of the present application.

[0024] Figure 7It is a schematic flow chart of forming a housing with a mengene fiber cloth according to an embodiment of the present application.

[0025] Figure 8 It is a schematic structural diagram of an electronic device according to an embodiment of the present application.

[0026] Figure 9 It is a partial exploded structural diagram of an electronic device according to an embodiment of the present application.

[0027] Figure 10 It is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0028] Explanation of reference numerals:

[0029] 100 - housing, 10a - mengene fiber cloth, 10 - fiber cloth, 11 - first part, 12 - second part, 12’ - mask layer, 20 - graphene coating, 30 - resin layer, 40 - first area, 50 - second area, 101 - light - transmitting part, 300 - electronic device, 310 - display screen, 320 - middle frame, 330 - processor, 350 - memory, 370 - camera module. Detailed implementation manners

[0030] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0031] The terms "first", "second", etc. in the specification, claims and the above - mentioned drawings of the present application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non - exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0032] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

[0033] It should be noted that, for the convenience of description, in the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, in different embodiments, the detailed description of the same components is omitted.

[0034] The back cover materials of electronic devices (such as mobile phones, tablets, etc.) mainly include plastics, metals, glasses, and ceramics, etc. Conventional plastic back covers have low costs, are lightweight and easy to process, but have poor texture and low mechanical strength, and are prone to deformation. Metal back covers have good texture, are firm and durable, but have high costs and heavy weights, and metal back covers are prone to affecting signal transmission. Glass back covers are beautiful, have high hardness, support wireless charging, but are fragile, prone to fingerprint smudging, and have poor heat conduction performance. Ceramic back covers combine the advantages of metals and glasses, but have problems such as high costs, large weights, and being fragile. In summary, the existing back covers of electronic devices are difficult to have high heat conductivity, high strength, and do not affect signal transmission and other performances at the same time.

[0035] Figure 1 FIG. 4 is a schematic structural view of a housing 100 according to an embodiment of the present application. Figure 2 FIG. 5 is a schematic cross-sectional structural view of the housing 100 along the Figure 1 A-A direction in FIG. 4 according to an embodiment of the present application. Figure 3 FIG. 6 is a schematic cross-sectional structural view of the housing 100 along the Figure 1 A-A direction in FIG. 4 according to another embodiment of the present application.

[0036] Please refer to Figures 1 to 3 , the embodiment of the present application provides a housing 100, which includes a fiber cloth 10, a graphene coating 20, and a resin layer 30. The graphene coating 20 wraps around the outer periphery of part of the fiber cloth 10; the resin layer 30 wraps around the surfaces of the fiber cloth 10 and the graphene coating 20.

[0037] The housing 100 of the present application can be applied to portable electronic devices such as mobile phones, tablet computers, laptop computers, desktop computers, smart bracelets, smart watches, e-readers, game consoles, etc. The housing 100 of the embodiment of the present application can be a 2D structure, a 2.5D structure, a 3D structure, etc. The housing 100 of the present application can be a middle frame, a back cover (battery cover), a decorative part, etc. of an electronic device. In the following embodiments of the present application, the housing 100 is taken as an example of the back cover of a mobile phone for detailed description.

[0038] It can be understood that the graphene coating 20 is disposed on the outer periphery of part of the fiber cloth 10. It can also be understood that the graphene coating 20 is deposited on the surface of part of the fiber cloth 10.

[0039] It should be noted that the graphene coating 20 can be located on one surface of the fiber cloth 10, or can be located on two opposite surfaces of the fiber cloth 10.

[0040] It should be noted that the resin layer 30 wraps around the entire outer periphery of the fiber cloth 10 and the graphene coating 20. In other words, the fiber cloth 10 and the graphene coating 20 are disposed inside the resin layer 30.

[0041] Understandably, the housing 100 includes a fiber resin board, and the fiber resin board includes a fiber cloth 10, a graphene coating 20, and a resin layer 30. The graphene coating 20 wraps around the outer periphery of a part of the fiber cloth 10; the resin layer 30 wraps around the surfaces of the fiber cloth 10 and the graphene coating 20.

[0042] Optionally, the housing 100 includes one or more layers of fiber resin boards. When the housing 100 includes multiple layers of fiber resin boards, the multiple layers of fiber resin boards are stacked and connected in sequence. Understandably, the multiple layers of fiber resin boards are connected through the adhesive property of their own resin layers 30, without the need to use an additional binder.

[0043] The term "multiple layers" means greater than or equal to two layers.

[0044] Optionally, the thickness of each layer of fiber resin board ranges from 0.08 mm to 0.16 mm. Specifically, the thickness of the fiber resin board can be, but is not limited to, 0.08 mm, 0.09 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, etc.

[0045] The housing 100 of the embodiment of the present application includes a fiber cloth 10, a graphene coating 20, and a resin layer 30. The graphene coating 20 wraps around the outer periphery of a part of the fiber cloth 10; the resin layer 30 wraps around the surfaces of the fiber cloth 10 and the graphene coating 20. Compared with the fiber resin housing 100 formed by impregnating the fiber cloth 10 with resin, it not only has a higher thermal conductivity and better heat dissipation effect, but when applied to an electronic device, it can better dissipate heat from heat-generating components such as the main board and battery of the electronic device, and extend the service life of the electronic device. In addition, compared with the fiber resin housing 100, the housing 100 of the present application has higher stiffness and mechanical strength, is not easily deformed, and can better protect the electronic device. In addition, the graphene coating 20 is only located in a part of the housing 100. Through design, when the housing 100 is applied to an electronic device, the graphene coating 20 can avoid the antenna setting of the electronic device, so as not to affect the transmission of the antenna signal, enabling the antenna signal to be normally received and transmitted without affecting the signal strength.

[0046] Optionally, the fiber cloth 10 is formed by weaving or knitting fiber threads. In other words, the fiber cloth 10 includes multiple fiber threads that intersect vertically and horizontally. For example, fiber threads woven in a criss-cross pattern along the warp and weft directions.

[0047] Optionally, the diameter of the fiber thread can be, but is not limited to, 5 μm to 10 μm. Specifically, the diameter of the fiber thread can be, but is not limited to, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc. If the diameter of the fiber thread is too small, the difficulty of preparing the fiber thread increases, and the mechanical strength will decrease; if the diameter of the fiber thread is too large, the wear resistance and mechanical strength of the fiber thread will also decrease. In addition, this will make the single-layer fiber cloth 10 relatively thick, which is not convenient for the laminated design of the housing 100.

[0048] In the embodiments of the present application, when it comes to the numerical range from a to b, if not specifically specified, it means that the numerical value can be any numerical value between a and b, including the endpoint numerical value a and the endpoint numerical value b.

[0049] Optionally, the fiber cloth 10 can be, but is not limited to, at least one of glass fiber, Kevlar fiber, aramid fiber, poly(p-phenylene benzobisoxazole) fiber (abbreviated as PBO fiber), ultra-high molecular weight polyethylene fiber (abbreviated as UPE fiber), ceramic fiber, etc.

[0050] Glass fiber filament is an inorganic non-metallic material with excellent performance. Usually, glass balls or waste glass are used as raw materials, and through processes such as high-temperature melting, wire drawing, winding, and weaving, various products are finally made. And the glass fiber woven cloth is a cloth made of glass fiber filaments through a specific weaving process. Among them, winding is to wind the drawn glass fiber filaments, that is, to gather multiple fiber filaments together to form a yarn, and to carry out necessary finishing and inspection to ensure the quality and uniformity of the yarn. So if the raw filament is too thick, the yarn after winding will be relatively thick, and the single-layer prepreg cannot be made thin, which is not convenient for the laminated design.

[0051] Optionally, the material of the resin layer 30 can be, but is not limited to, at least one of epoxy resin, phenolic resin, polyester resin, etc. When the material of the resin layer 30 is epoxy resin, the epoxy resin has good adhesion performance, chemical resistance, physical and mechanical and electrical insulation performance, which can make the housing 100 have better mechanical strength, so that only a thinner housing 100 is needed to ensure good mechanical performance, which is beneficial to the light and thin of the housing 100.

[0052] Optionally, in the fiber resin board, the mass fraction range of the resin layer 30 is 70% to 79.7%. Specifically, in the fiber resin board, the mass fraction of the resin layer 30 can be, but is not limited to, 70%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79.7%, etc. If the mass fraction of the resin layer 30 is too low, the bonding force between adjacent fiber resin boards will be reduced, and after the housing 100 is used for a period of time, delamination is likely to occur; if the mass fraction of the resin layer 30 is too high, the content of the fiber cloth 10 and the graphene coating 20 will be too low, reducing the mechanical strength and thermal conductivity of the fiber resin board.

[0053] Optionally, in the fiber resin board, the mass fraction of the fiber cloth 10 ranges from 20% to 30%. Specifically, in the fiber resin board, the mass fraction of the fiber cloth 10 can be, but is not limited to, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, etc. If the mass fraction of the fiber cloth 10 is too low, the mechanical strength of the fiber resin board will be reduced; if the mass fraction of the fiber cloth 10 is too high, the bonding force between adjacent fiber resin boards will be reduced, making the housing 100 prone to delamination after a period of use.

[0054] Optionally, in the fiber resin board, the mass fraction of the graphene coating 20 ranges from 0.3% to 6%. Specifically, in the fiber resin board, the mass fraction of the graphene coating 20 can be, but is not limited to, 0.3%, 0.5%, 0.8%, 1%, 2%, 3%, 4%, 5%, 6%, etc. If the mass fraction of the graphene coating 20 is too low, the improvement of the stiffness and thermal conductivity of the housing 100 is limited; if the mass fraction of the graphene coating 20 is too high, the cost of the housing 100 will be greatly increased. In addition, the bonding force between the fiber cloth 10 and the resin layer 30 is reduced, thereby reducing the mechanical properties of the housing 100.

[0055] Furthermore, in the fiber resin board, the mass fraction of the graphene coating 20 ranges from 0.3% to 3%. This can make the housing 100 have higher stiffness and thermal conductivity. In addition, the fiber cloth 10 and the resin layer 30 also have better bonding force.

[0056] Please refer to again Figures 1 to 3 , in some embodiments, the housing 100 includes a connected first region 40 and a second region 50. The second region 50 is disposed around the outer periphery of the first region 40. The graphene coating 20 covers the part of the fiber cloth 10 located in the first region 40, and the graphene coating 20 avoids the part of the fiber cloth 10 located in the second region 50.

[0057] It can be understood that the graphene coating 20 is only provided in the middle region of the housing 100, and the graphene coating 20 is not provided in the outer peripheral region of the housing 100. That is, the graphene coating 20 is provided avoiding the outer peripheral region of the housing 100.

[0058] When the housing 100 serves as the rear cover of an electronic device, the antenna of the electronic device is usually made on the middle frame, and signals are transmitted from the side of the middle frame. In this embodiment, by making the graphene coating 20 cover the portion of the fiber cloth 10 located in the first region 40, and the graphene coating 20 avoids the portion of the fiber cloth 10 located in the second region 50. This can better avoid the graphene layer affecting the transceiver of the antenna signal, and at the same time can make the overall housing 100 have a high stiffness and thermal conductivity.

[0059] In other embodiments, the housing 100 includes a connected first region 40 and a second region 50. The graphene coating 20 covers the portion of the fiber cloth 10 located in the first region 40, and the graphene coating 20 avoids the portion of the fiber cloth 10 located in the second region 50. In this embodiment, the second region 50 can be located on one side of the first region 40; it can also be embedded in the first region 40, that is, the first region 40 is arranged around the outer periphery of the second region 50; in addition, there can be multiple second regions 50, and one of the multiple second regions 50 is arranged around the outer periphery of the first region 40, and the other parts of the multiple second regions 50 are embedded in the first region 40.

[0060] Please refer to again Figure 3 , in some embodiments, the line width w of the second region 50 ranges from 4 mm ≤ w ≤ 12 mm.

[0061] Specifically, the line width w of the second region 50 can be, but is not limited to, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, etc.

[0062] In this embodiment, if the line width w of the second region 50 is too narrow, the area covered by the graphene coating 20 is too large. When the housing 100 is applied to an electronic device, it is likely to affect the transceiver of antenna signals such as electromagnetic waves of the electronic device. In addition, the bonding force between the graphene coating 20 and the resin is weaker than the bonding force between the fiber cloth 10 and the resin. This will also reduce the bonding force between the layers inside the fiber resin board, making the fiber resin board prone to delamination; if the line width w of the second region 50 is too wide, the area covered by the graphene coating 20 is too small, and the improvement of the stiffness and thermal conductivity of the housing 100 is limited.

[0063] In some embodiments, the thickness h of the graphene coating 20 ranges from 0.2 μm ≤ h ≤ 10 μm.

[0064] Specifically, the thickness h of the graphene coating 20 can be, but is not limited to, 0.2 μm, 0.5 μm, 0.8 μm, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc.

[0065] In this embodiment, if the thickness h of the graphene coating 20 is too thin, the improvement of the stiffness and thermal conductivity of the housing 100 is limited; if the thickness h of the graphene coating 20 is too thick, the coating time of the graphene coating 20 and the amount of graphene used are increased, greatly increasing the cost of the housing 100. In addition, the bonding force between the fiber cloth 10 and the resin layer 30 will be reduced, thereby reducing the mechanical properties of the housing 100.

[0066] In some embodiments, the thermal conductivity α of the housing 100 ranges from 130 W / mK ≤ α ≤ 180 W / mK.

[0067] Specifically, the thermal conductivity α of the housing 100 can be, but is not limited to, 130 W / mK, 135 W / mK, 140 W / mK, 145 W / mK, 150 W / mK, 155 W / mK, 160 W / mK, 165 W / mK, 170 W / mK, 175 W / mK, 180 W / mK, etc.

[0068] In this embodiment, if the thermal conductivity of the housing 100 is too small, it is not conducive to the heat dissipation of the housing 100; if the thermal conductivity of the housing 100 is too large, a relatively thick graphene coating 20 needs to be deposited, increasing the cost of the housing 100. When the thermal conductivity of the housing 100 is from 130 W / mK to 180 W / mK, the housing 100 can have a good heat dissipation effect while having a relatively low manufacturing cost.

[0069] In some embodiments, the stiffness of the housing with a thickness of 0.27 mm ranges from 5500 N / m to 7000 N / m.

[0070] Specifically, the stiffness of the housing with a thickness of 0.27 mm can be, but is not limited to, 5500 N / m, 5600 N / m, 5800 N / m, 6000 N / m, 6200 N / m, 6400 N / m, 6600 N / m, 6800 N / m, 7000 N / m, etc.

[0071] In this embodiment, if the stiffness of the housing 100 is too small, the proportion of the graphene coating 20 in the housing 100 is relatively small, which is not conducive to improving the heat dissipation effect of the housing 100; if the stiffness of the housing 100 is too large, the proportion of the graphene coating 20 in the housing 100 is relatively large, which not only increases the cost of the housing 100, but also reduces the bonding force between the fiber resin plates.

[0072] In some embodiments, the graphene coating 20 is deposited on a part of the surface of the fiber cloth 10 by a deposition method.

[0073] Optionally, the deposition method includes at least one of chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemcial deposition, etc. In this embodiment, the deposition method is used to deposit a graphene coating 20 on a partial surface of the fiber cloth 10, which can better enhance the bonding force between the graphene coating 20 and the fiber cloth 10, and better avoid delamination of the obtained housing 100 after a period of use.

[0074] Optionally, the thickness of the housing 100 ranges from 0.25 mm to 1 mm; specifically, the thickness of the housing 100 can be, but is not limited to, 0.25 mm, 0.27 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, etc. When the housing 100 is too thin, the mechanical strength of the housing 100 is reduced, and it cannot play a good role in support and protection, and the mechanical strength cannot well meet the requirements of the electronic device housing 100. When the housing 100 is too thick, the weight of the electronic device is increased, affecting the feel of the electronic device and resulting in a poor user experience.

[0075] The housing 100 of the embodiment of the present application can be prepared by the method described in the following embodiments of the present application. In addition, it can also be prepared by other methods. The preparation method of the embodiment of the present application is only one or more preparation methods of the housing 100 of the present application, and should not be construed as a limitation on the housing 100 provided by the embodiment of the present application.

[0076] Figure 4 is a schematic flow chart of a method for preparing the housing 100 according to an embodiment of the present application. Figure 5 is a schematic structural diagram of the preparation process of the housing 100 according to an embodiment of the present application.

[0077] Please refer to Figure 4 and Figure 5 , the embodiment of the present application also provides a method for preparing a housing 100, and the preparation method includes:

[0078] S201, providing a fiber cloth 10;

[0079] Optionally, the fiber cloth 10 can be, but is not limited to, at least one of glass fiber, Kevlar fiber, aramid fiber, poly(p-phenylene benzobisoxazole) fiber (abbreviation: PBO fiber), ultra-high molecular weight polyethylene fiber (abbreviation: UPE fiber), ceramic fiber, etc. In the embodiment of the present application, the fiber cloth 10 is taken as a glass fiber cloth 10 and the resin layer 30 is taken as an epoxy resin layer 30 for illustration, and should not be construed as a limitation on the fiber cloth 10 and the resin layer 30 of the embodiment of the present application.

[0080] S202, depositing a graphene coating 20 on a partial area of the fiber cloth 10 to obtain a graphene-coated fiber cloth 10a; and

[0081] Optionally, when the fiber cloth 10 is a glass fiber cloth 10, the mengene fiber cloth 10a is a mengene glass fiber cloth.

[0082] Understandably, please refer again to Figure 2 , the mengene fiber cloth 10a includes the fiber cloth 10 and the graphene coating 20, and the graphene coating 20 is deposited on the two opposite surfaces of the mengene fiber cloth 10a.

[0083] In a specific embodiment, the content of silicon dioxide in the glass fiber cloth 10 is 99.83%, and the burning loss is 0.16%. The warp tensile breaking strength of the mengene glass fiber cloth 10 is 177 N / 25 mm, the weft tensile breaking strength is 150 N / 25 mm, the surface resistance is 10 Ω / sq; the electrothermal radiation conversion efficiency > 90%, and the normal total emissivity is 0.88.

[0084] S203, immerse the mengene fiber cloth 10a in the resin glue solution, and cure the resin glue solution to form a resin layer 30, obtaining the housing 100.

[0085] For the detailed description of other aspects of the fiber cloth 10, the graphene coating 20 and the resin layer 30, please refer to the description of the corresponding parts of the above embodiments, which will not be repeated here.

[0086] In the preparation method of the housing 100 according to the embodiment of the present application, first deposit the graphene coating 20 on the fiber cloth 10, then immerse the mengene fiber cloth 10a in the resin glue solution, and cure it to form. The obtained housing 100 includes the fiber cloth 10, the graphene coating 20 and the resin layer 30. The graphene coating 20 is wrapped around the outer periphery of part of the fiber cloth 10; the resin layer 30 is wrapped on the surfaces of the fiber cloth 10 and the graphene coating 20. Compared with the fiber resin housing 100 made of the fiber cloth 10 infiltrated with resin, it not only has a higher thermal conductivity and better heat dissipation effect, but when applied to an electronic device, it can better dissipate heat from the heat-generating components such as the main board and battery of the electronic device, and extend the service life of the electronic device. In addition, compared with the fiber resin housing 100, the housing 100 of the present application has higher stiffness and mechanical strength, is not prone to deformation, and can better protect the electronic device. In addition, the graphene coating 20 is only located in part of the area of the housing 100. Through design, when the housing 100 is applied to an electronic device, the graphene coating 20 can avoid the antenna setting of the electronic device, so as not to affect the transmission of the antenna signal, so that the antenna signal can be normally received and transmitted, and the signal strength will not be affected. Moreover, the graphene coating 20 is formed by a deposition method, so that the graphene coating 20 and the fiber cloth 10 have better bonding force, and it can better prevent the housing 100 from delaminating after being used for a period of time.

[0087] Figure 6 It is a schematic flow chart of a method for preparing the graphene fiber cloth 10a according to an embodiment of the present application.

[0088] Please refer to Figure 5 and Figure 6 , in some embodiments, the fiber cloth 10 includes a connected first part 11 and a second part 12, and the second part 12 is disposed around the outer periphery of the first part 11; in S202, depositing a graphene coating 20 on a partial area of the fiber cloth 10 to obtain the graphene fiber cloth 10a includes:

[0089] S2021, disposing a mask layer 12' on the second part 12 of the fiber cloth 10; and

[0090] Optionally, before disposing the mask layer 12', the fiber cloth 10 (such as a glass fiber cloth 10, abbreviated as a glass cloth) is cut into a specific length and width as required, cleaned and dried for standby.

[0091] Optionally, a photoresist solution is coated on two opposite surfaces of the fiber cloth 10 to form a photoresist layer, and through processes such as exposure, development, and hard baking in sequence, a mask layer 12' is formed on the second part 12. In other embodiments, the fiber cloth 10 is placed in a jig, and the jig is used to block the peripheral areas of the front and back surfaces of the fiber cloth 10 (that is, to block the front and back surfaces of the second part 12 of the fiber cloth 10), so that the periphery of the fiber cloth 10 will not be coated when graphene coating is performed.

[0092] It can be understood that the orthographic projection of the mask layer 12' on the surface of the second part 12 falls within the range of the second part 12; it can also be understood that the mask layer 12' completely covers the entire second part 12.

[0093] In other embodiments, the mask layer 12' can also be an invar alloy mask plate or a quartz glass mask plate, etc.

[0094] It can be understood that the first part 11 of the fiber cloth 10 corresponds to the first region 40 of the housing 100, and the second part 12 of the fiber cloth 10 corresponds to the second region 50 of the housing 100.

[0095] S2022, in an inert atmosphere, at a temperature of 850 °C to 950 °C, introducing a carbon-containing gas and hydrogen to deposit a graphene coating 20 on the first part 11 of the fiber cloth 10 to obtain the graphene fiber cloth 10a, wherein the flow ratio of the carbon-containing gas to the hydrogen is 3:1 to 8:1.

[0096] Optionally, place the fiber cloth 10 with the mask layer 12' in a chemical vapor deposition device, evacuate the air to reduce the pressure to below 0.5 Pa; heat the chemical vapor deposition device to 850°C to 950°C, and sequentially introduce a carbon source gas and hydrogen to deposit the graphene coating 20. After the deposition is completed, cool down the device, remove the sample, and remove the mask layer 12' to obtain the graphene fiber cloth 10a.

[0097] In a specific embodiment, the deposition of the graphene coating 20 includes: (1) Turn on the power supply, gas supply, and tail gas absorption device; the total switches of CH4, H2, and Ar, the first pressure reducing valve, and the second pressure reducing valve; (2) Turn on the PECVD power switch, the instrument switch, and start the vacuum detection unit switch. Detect the vacuum degree of the instrument and keep it below 0.5 Pa. Test its pressure holding effect. After the vacuum system test, cut a 10-cm long piece of the fiber cloth 10 and place it on the quartz boat and then place it in the heating zone of the quartz tube. Close the flange furnace cavity door; (3) Evacuate the air: Open the baffle valve, close the tail gas connection device switch, and click the start button of the vacuum system device until the pressure in the quartz tube drops below 0.5 Pa; (4) Heat: Click the operation button of the heating control unit until the temperature rises to the target temperature; (5) Constant temperature annealing: Open the H2 inlet switch and the mixed gas inlet switch, click the automatic gas inlet setting button, open the plasma switch, adjust the power to the target power, click the ON button of the plasma. After 30 minutes, the H2 flow will automatically close; (6) Growth: Open the CH4 inlet switch, click the automatic gas inlet setting button. After 15 minutes, the H2 flow will automatically close. Adjust the plasma power to the target power. After the growth is completed, adjust the plasma power to 0 W, close the plasma switch, and click the OFF button; (7) Cool down: Open the Ar inlet switch, click the automatic gas inlet setting button, close the H2 and CH4 inlet switches. After 50 minutes, the Ar flow will automatically close; and (8) Cooling and sampling: When the furnace body temperature drops to 50°C, close the vacuum detection unit, close the Ar inlet and the mixed gas inlet switches, open the flange, and take out the sample.

[0098] It can be understood that in this embodiment, the chemical deposition method (CVD) is used to grow the graphene coating 20 on the fiber cloth 10.

[0099] Optionally, the inert atmosphere can be, but is not limited to, nitrogen, argon (Ar), etc.

[0100] Optionally, the carbon-containing gas can be, but is not limited to, at least one of methane, ethylene, acetylene, etc.

[0101] In this embodiment, by reacting a carbon-containing gas with hydrogen under the protection of an inert atmosphere at a high temperature, the carbon-containing gas decomposes, thereby depositing a graphene coating 20 on the fiber cloth 10. The method of this embodiment can accurately control the growth position and growth amount of the graphene coating 20. In addition, the formed graphene coating 20 has higher quality, thus having higher stiffness and better thermal conductivity.

[0102] Specifically, the temperature at which the graphene coating 20 is deposited can be, but is not limited to, 850 °C, 860 °C, 870 °C, 880 °C, 890 °C, 900 °C, 910 °C, 920 °C, 930 °C, 940 °C, 950 °C, etc. If the temperature at which the graphene coating 20 is deposited is too low, the growth of graphene may be incomplete, forming a discontinuous film, thereby reducing the stiffness and thermal conductivity of the prepared housing 100; in addition, the growth rate of the graphene coating 20 is slow, the growth time is prolonged, the production efficiency of the housing 100 is reduced, and the production cost of the housing 100 is increased; if the temperature at which the graphene coating 20 is deposited is too high, during the growth process of graphene, the growth rates and directions in different regions may be inconsistent, resulting in the formation of grain boundaries, which will weaken the mechanical properties of graphene and is not conducive to improving the mechanical strength of the housing 100.

[0103] Optionally, the flow rate ratio of the carbon-containing gas to the hydrogen can be, but is not limited to, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, etc. If the flow rate ratio of the carbon-containing gas to the hydrogen is too low, there is too little carbon-containing gas and too much hydrogen. If there is too little carbon-containing gas, the growth efficiency of graphene will be reduced and the cost of depositing the graphene coating 20 will increase. If there is too much hydrogen, the reaction will be too violent, increasing the cost of preparing the graphene coating 20. If the flow rate ratio of the carbon-containing gas to the hydrogen is too high, there is too much carbon-containing gas and too little hydrogen. If there is too much carbon-containing gas, the quality of the formed graphene coating 20 will be reduced. If the hydrogen content is too little, the stability of graphene will be reduced.

[0104] Optionally, the gas flow rate range of the carbon-containing gas is 50 sccm to 100 sccm. Specifically, the gas flow rate of the carbon-containing gas can be, but is not limited to, 50 sccm, 60 sccm, 70 sccm, 80 sccm, 90 sccm, 100 sccm, etc. If the gas flow rate of the carbon-containing gas is too small, the growth efficiency of graphene will be reduced and the cost of depositing the graphene coating 20 will increase; if the gas flow rate of the carbon-containing gas is too large, the quality of the formed graphene coating 20 will be reduced.

[0105] Optionally, the gas flow rate of hydrogen ranges from 12 sccm to 30 sccm. Specifically, the gas flow rate of hydrogen can be, but is not limited to, 12 sccm, 15 sccm, 18 sccm, 20 sccm, 23 sccm, 25 sccm, 28 sccm, 30 sccm, etc. If the hydrogen content is too low, the stability of graphene is reduced; if the hydrogen is too much, the reaction will be too intense, increasing the cost of preparing the graphene coating 20.

[0106] Optionally, the deposition time of the graphene coating 20 ranges from 40 minutes (min) to 100 minutes. Specifically, the deposition time of the graphene coating 20 can be, but is not limited to, 40 min, 50 min, 60 min, 70 min, 80 min, 90 min, 100 min, etc. If the deposition time of the graphene coating 20 is too short, the thickness of the prepared graphene coating 20 is too thin, and the improvement of the stiffness and thermal conductivity of the housing 100 is limited; if the deposition time of the graphene coating 20 is too long, the cost of the housing 100 is increased.

[0107] Figure 7 It is a schematic flow chart of forming the housing 100 with the mengene fiber cloth 10a according to an embodiment of the present application.

[0108] Please refer to Figure 5 and Figure 7 , optionally, in S203, the step of dipping the mengene fiber cloth 10a into the resin adhesive solution and curing the resin adhesive solution to form a resin layer 30 to obtain the housing 100 includes:

[0109] S2031, dipping the mengene fiber cloth 10a into the resin adhesive solution;

[0110] Optionally, the resin adhesive solution can be, but is not limited to, an epoxy resin adhesive solution, such as bisphenol A epoxy resin adhesive solution, that is, bisphenol A epoxy resin monomer adhesive solution.

[0111] It should be noted that when the prepared mengene fiber cloth 10a is a roll material, when preparing the prepreg, continuous pre-impregnation can be carried out on a roll-to-roll device. The mengene fiber cloth 10a is immersed in an epoxy resin glue tank, and then semi-cured at a low temperature.

[0112] S2032, semi-curing the mengene fiber cloth 10a impregnated with the resin adhesive solution to obtain a prepreg; and

[0113] Optionally, the mengene fiber cloth 10a is taken out of the resin adhesive solution and semi-cured at a temperature of 60 °C to 80 °C so that the resin monomers in the resin adhesive solution form semi-cured resin to obtain a prepreg.

[0114] Specifically, the semi-curing temperature can be, but is not limited to, 60°C, 65°C, 70°C, 75°C, 80°C, etc. If the semi-curing temperature is too low, the viscosity of the resin glue solution is too high, the fluidity decreases, and it cannot penetrate well into the fiber cloth 10, resulting in a decrease in the bonding force between the fiber cloth 10 and the resin, and the mechanical strength of the produced housing 100 is reduced. If the semi-curing temperature is too high, the curing degree of the resin is too high at this time. When the subsequent multi-layer semi-cured boards are cured, the adhesion between adjacent semi-cured boards is reduced, making the produced housing 100 prone to delamination.

[0115] S2033, stack the multi-layer semi-cured boards and cure them to obtain the housing 100.

[0116] Optionally, according to the design, stack the multi-layer semi-cured boards together and perform hot pressing and curing at a temperature of 100°C to 130°C to obtain the housing 100. It can be understood that several semi-cured boards are stacked and formed under high pressure according to the thickness and strength requirements to obtain a housing 100 with a specific thickness (such as a glass fiber board for a mobile phone back cover).

[0117] Specifically, the curing temperature can be, but is not limited to, 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, etc. If the curing temperature is too low, the resin is not completely cured, reducing the mechanical strength of the housing 100; if the curing temperature is too high, the curing degree of the resin is too high, reducing the toughness of the resin and the impact resistance of the housing 100, and it is prone to brittle fracture.

[0118] It can be understood that after the semi-cured board is cured, a fiber resin board is formed.

[0119] The following further describes the housing 100 of the embodiment of the present application through specific examples.

[0120] Example 1

[0121] The housing 100 of the example is prepared through the following steps:

[0122] (1) Provide the glass fiber cloth 10;

[0123] (2) Form a mask layer 12' with a width of 6 mm on the outer periphery of the glass fiber cloth 10;

[0124] (3) Place it in a chemical vapor deposition device. In an argon atmosphere, at a vacuum degree of 0.5 Pa and a temperature of 900°C, introduce methane and hydrogen to perform chemical vapor deposition to deposit graphene coatings 20 on the two surfaces of the fiber cloth 10 facing away from each other. Among them, the gas flow rate of methane is 80 sccm, the gas flow rate of hydrogen is 20 sccm, and the mask layer 12' is removed to obtain the graphene fiber cloth 10a;

[0125] (4) Immerse the graphene fiber cloth 10a into the epoxy resin glue solution, take it out and semi-cure it at 75 °C to obtain a semi-cured board;

[0126] (5) Stack three layers of semi-cured boards and perform hot pressing and curing at 120 °C to obtain the housing 100.

[0127] After measurement, the thickness of the obtained housing 100 is 0.27 mm, the mass fraction of epoxy resin in the housing 100 is 73%, the mass fraction of the glass fiber cloth 10 is 25%, and the mass fraction of the graphene coating 20 is 2%.

[0128] Comparative Example 1

[0129] The housing 100 of this comparative example is prepared through the following steps:

[0130] (1) Provide the glass fiber cloth 10 and the epoxy resin glue solution;

[0131] (2) Immerse the glass fiber cloth 10 into the epoxy resin glue solution, take it out and semi-cure it at 75 °C to obtain a semi-cured board;

[0132] (3) Stack three layers of semi-cured boards and perform hot pressing and curing at 120 °C to obtain the housing 100.

[0133] After measurement, the thickness of the obtained housing 100 is 0.27 mm, the mass fraction of epoxy resin in the housing 100 is 75%, and the mass fraction of the glass fiber cloth 10 is 25%.

[0134] Comparative Example 2

[0135] The housing 100 of this comparative example is prepared through the following steps:

[0136] (1) Provide the glass fiber cloth 10, the epoxy resin glue solution and graphene flakes;

[0137] (2) Disperse the graphene flakes in the epoxy resin glue solution, immerse the glass fiber cloth 10 into the epoxy resin glue solution mixed with graphene flakes, take it out and semi-cure it at 75 °C to obtain a semi-cured board;

[0138] (3) Stack three layers of semi-cured boards and perform hot pressing and curing at 120 °C to obtain the housing 100.

[0139] After measurement, the thickness of the obtained housing 100 is 0.27 mm, the mass fraction of epoxy resin in the housing 100 is 73%, the mass fraction of the glass fiber cloth 10 is 25%, and the mass fraction of the graphene flakes is 2%.

[0140] Perform performance tests on the housings 100 of each example and comparative example, and the test results are shown in Table 1 below.

[0141] (1) Stiffness test: Measured using an automatic load tester.

[0142] (2) Thermal conductivity α test: ASTM D5470.

[0143] Table 1 Performance parameters of the housing 100 of each example and comparative example

[0144] Example Stiffness Thermal conductivity α Example 1 6500 N / m 140 W / (m·K) Comparative Example 1 5000 N / m 0.2 W / (m·K) Comparative Example 2 5000 N / m 1.244 W / (m·K)

[0145] From the test results of Example 1 and Comparative Example 1, it can be seen that compared with the glass fiber housing 100 without graphene (i.e., the housing 100 of Comparative Example 1), the housing 100 of Example 1 of the present application, which is obtained by plating a graphene coating 20 on the surface of the glass fiber cloth 10 and then immersing it in epoxy resin and curing and semi-curing, has higher stiffness and thermal conductivity. Thus, when the housing 100 is applied to an electronic device, it can better protect the electronic device, and the housing 100 can be made thinner while meeting the mechanical properties, making the electronic device more lightweight and thinner. Moreover, when the housing 100 of the present application is applied to an electronic device, it can better dissipate heat from heat-generating components such as the main board and battery of the electronic device, thereby better extending the service life of the electronic device.

[0146] From the test results of Comparative Example 1 and Comparative Example 2, it can be seen that compared with the glass fiber housing 100 without graphene in Comparative Example 1, in Comparative Example 2, graphene flakes are mixed into the epoxy resin, which can improve the thermal conductivity of the housing 100. However, mixing graphene flakes into the epoxy resin has limited improvement in the thermal conductivity of the housing 100 and limited improvement in the heat dissipation effect of the housing 100.

[0147] From the test results of Example 1 and Comparative Example 2, it can be seen that compared with the scheme of directly dispersing the same mass content of graphene flakes in the resin (i.e., Comparative Example 2), in Example 1 of the present application, a graphene coating 20 is first plated on the surface of the glass fiber cloth 10, impregnated with epoxy resin, and cured to form the housing 100. This can make the housing 100 have higher thermal conductivity. When applied to an electronic device, it can better dissipate heat from heat-generating components such as the main board and battery of the electronic device, thereby better extending the service life of the electronic device. In addition, the housing 100 of this example also has higher stiffness.

[0148] Figure 8 It is a schematic structural diagram of an electronic device 300 according to an embodiment of the present application. Figure 9 It is a partial exploded structural diagram of an electronic device 300 according to an embodiment of the present application. Figure 10 It is a circuit block diagram of an electronic device 300 according to an embodiment of the present application.

[0149] Please refer toFigures 8 to 10 In addition, an embodiment of the present application further provides an electronic device 300, which includes: a display screen 310, the housing 100 described in the embodiment of the present application, and a processor 330. The housing 100 is disposed opposite to the display screen 310; the processor 330 is located between the housing 100 and the display screen 310, and the processor 330 is electrically connected to the display screen 310 for controlling the display screen 310 to display.

[0150] The electronic device 300 in the embodiment of the present application may be, but is not limited to, portable electronic devices 300 such as mobile phones, tablet computers, laptop computers, desktop computers, smart bracelets, smart watches, e-readers, game consoles, etc.

[0151] For a detailed description of the housing 100, please refer to the corresponding part of the above embodiment and will not be repeated here.

[0152] Optionally, the display screen 310 may be, but is not limited to, one or more of a liquid crystal display screen, a light-emitting diode display screen (LED display screen), a micro light-emitting diode display screen (Micro LED display screen), a sub-millimeter light-emitting diode display screen (Mini LED display screen), an organic light-emitting diode display screen (OLED display screen), etc.

[0153] Optionally, the processor 330 includes one or more general-purpose processors. Among them, the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The processor 330 is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory, and it can enable the computing device to provide a wide variety of services.

[0154] Optionally, the electronic device 300 of the present application further includes a memory 350. The memory 350 is electrically connected to the processor 330 for storing program codes required for the operation of the processor 330, program codes required for controlling the display screen 310, display contents of the display screen 310, etc.

[0155] Optionally, the memory 350 may include volatile memory, such as random access memory (RAM); the memory 350 may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). The memory 350 may also include a combination of the above types of memory.

[0156] In some embodiments, the electronic device 300 of the embodiments of the present application further includes a middle frame 320 and a camera module 370. The middle frame 320 is disposed between the display screen 310 and the housing 100, and the side surface of the middle frame 320 is exposed between the housing 100 and the display screen 310. The middle frame 320 and the housing 100 enclose a receiving space (not shown in the figure), and the receiving space is used to receive the processor 330, the memory 350, and the camera module 370. The camera module 370 is electrically connected to the processor 330 and is configured to perform shooting under the control of the processor 330.

[0157] Optionally, the housing 100 has a light-transmitting portion 101, and the camera module 370 can shoot through the light-transmitting portion 101 on the housing 100. That is, the camera module 370 in this embodiment is a rear camera module 370. It can be understood that in other embodiments, the light-transmitting portion 101 may be disposed on the display screen 310, that is, the camera module 370 is a front camera module 370. In the schematic diagram of this embodiment, the light-transmitting portion 101 is shown as an opening for illustration. In other embodiments, the light-transmitting portion 101 may not be an opening but a light-transmitting material, such as plastic, glass, etc.

[0158] It can be understood that the electronic device 300 described in this embodiment is only one form of the electronic device 300 to which the housing 100 is applied, and should not be construed as a limitation on the electronic device 300 provided by the present application, nor should it be construed as a limitation on the housing 100 provided by each embodiment of the present application.

[0159] References to "embodiments" or "implementation manners" in this application mean that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of this application. The phrase appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described in this application may be combined with other embodiments. In addition, it should also be understood that the features, structures, or characteristics described in each embodiment of this application can be arbitrarily combined with each other without contradiction to form another embodiment that does not depart from the spirit and scope of the technical solution of this application.

[0160] Finally, it should be noted that the above implementation manners are only used to illustrate the technical solutions of this application and not to limit them. Although the technical solutions of this application have been described in detail with reference to the above preferred implementation manners, those of ordinary skill in the art should understand that modifications or equivalent replacements can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A housing, characterized in that, Comprising: Fiber cloth; A graphene coating, the graphene coating being wrapped around the outer periphery of a part of the fiber cloth; And A resin layer, the resin layer being wrapped around the surfaces of the fiber cloth and the graphene coating.

2. The housing according to claim 1, characterized in that, The housing includes a connected first region and a second region, the second region being disposed around the outer periphery of the first region, the graphene coating covering the part of the fiber cloth located in the first region, and the graphene coating avoiding the part of the fiber cloth located in the second region.

3. The housing according to claim 2, characterized in that, The line width w of the second region ranges from 4 mm ≤ w ≤ 12 mm.

4. The housing according to claim 1, characterized in that, The thickness h of the graphene coating ranges from 0.2 μm ≤ h ≤ 10 μm.

5. The housing according to claim 1, characterized in that The thermal conductivity α of the housing ranges from 130 W / mK ≤ α ≤ 180 W / mK.

6. The housing according to claim 1, characterized in that, The stiffness of the housing with a thickness of 0.27 mm ranges from 5500 N / m to 7000 N / m.

7. The housing according to any one of claims 1 to 6, characterized in that, The graphene coating is deposited on a part of the surface of the fiber cloth by a deposition method.

8. A method for preparing a housing, characterized in that, The preparation method includes: Providing a fiber cloth; Depositing a graphene coating on a part of the region of the fiber cloth to obtain a graphene-coated fiber cloth; and Immersing the graphene-coated fiber cloth in a resin glue solution and curing the resin glue solution to form a resin layer to obtain the housing.

9. The manufacturing method of the housing according to claim 8, characterized in that, The fiber cloth includes a connected first part and a second part, the second part being disposed around the outer periphery of the first part; the depositing a graphene coating on a part of the region of the fiber cloth to obtain a graphene-coated fiber cloth includes: Providing a mask layer on the second part of the fiber cloth; and In an inert atmosphere, at a temperature of 850 °C to 950 °C, introducing a carbon-containing gas and hydrogen to deposit a graphene coating on the first part of a part of the fiber cloth, wherein the flow rate ratio of the carbon-containing gas to the hydrogen is 3:1 to 8:

1.

10. An electronic device, characterized in that, Comprising: A display screen; The housing according to any one of claims 1-7, the housing being disposed opposite to the display screen; And A processor, the processor being located between the housing and the display screen, the processor being electrically connected to the display screen for controlling the display screen to display.

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