3MCU (Microprogrammed Control Unit) case with module carrying air duct plugging

Abstract

The invention discloses a 3MCU (Microprogrammed Control Unit) case with pluggable modules and air ducts. Six surfaces of the case are formed by a rear side plate assembly, a front panel assembly, a left air duct assembly, a right air duct assembly, an upper cover plate assembly and a lower cover plate assembly; the front fan cover assembly is installed on the outer side of the front panel assembly, the front fan cover assembly and the front panel assembly are jointly closed to form a fan cavity, the fan assembly is installed in the closed cavity, a through hole is formed in the front fan cover assembly and serves as an air outlet hole, and grooves are formed in the two sides of the front panel assembly. The rear frame assembly is installed on the inner side of the rear side plate assembly, and grooves are formed in the two sides of the rear frame assembly. The inner sides of the left air duct plate assembly and the right air duct plate assembly are used for installing modules, the outer sides are provided with front-back through air ducts, the outer sides of the air ducts are sealed through a left cover plate and a right cover plate respectively, air inlets of the air ducts are communicated with the grooves in the two sides of the rear frame assembly, and air outlets of the air ducts are communicated with the grooves in the two sides of the front panel assembly. According to the invention, an air duct plugging structure which a traditional MCU case does not have is realized in a crowded space.

Description

Technical Field

[0001] The present invention relates to the technical field of avionics equipment, the field of airborne equipment structure design and the field of air cooling and heat dissipation of electronic equipment, and in particular to a 3MCU chassis with module and air duct plug-in suitable for high-power consumption equipment of an airborne integrated mission system. Background Art

[0002] The aircraft's integrated mission processing system includes functions such as data processing, network management, video management, data loading and storage, mission planning, data fusion, and integrated vision. It provides the pilot with a comprehensive display of aircraft and external environment information, navigation information, electromechanical information, situation information, system status, and warning information. It realizes the integrated control of airborne equipment and display screen scheduling in a centralized control manner, and provides the pilot with real-time data fusion, mission planning, and integrated vision information to reduce the burden on the pilot. Therefore, higher resource requirements are put forward for the software and hardware resources of each sub-device of the system, and higher resource requirements often mean higher heat dissipation requirements. Only by controlling the hardware of each sub-device of the system within the appropriate temperature range can the reliability and service life of the electronic equipment be guaranteed to the greatest extent.

[0003] In the prior art, the ARINC 600 standard defines the dimensions, fixing methods, and electrical connector definitions of avionics equipment chassis and mounting frames. In traditional 3MCU chassis, a plug-in structure with a heat-conducting plate and a shrink strip built into the module is often used, or a swing-wire structure that directly attaches to the side wall for heat dissipation. The former is conducive to module disassembly, replacement, and maintenance, but has limited heat dissipation capacity and is not suitable for high-power products; the latter is conducive to module heat dissipation, but has low hardware cross-linking reliability, and is more complicated to disassemble and repair, and is not suitable for high-performance products. Summary of the invention

[0004] The purpose of the invention is to provide a 3MCU chassis with module and air duct plug-in, which takes into account the heat dissipation performance and disassembly and maintenance of high-performance and high-power products, and realizes the new air duct plug-in structure design, air cooling and heat dissipation design, electronic disk and debugging cover design that are not available in traditional MCU chassis in a crowded space. It not only ensures the easy maintainability of module plug-in installation, but also minimizes the thermal resistance on the heat transfer path of the heat dissipation device, and meets the heat dissipation demand of at least 70W on a single side. It is a brand-new 3MCU chassis structure type and has great application prospects in the new generation of airborne integrated mission systems.

[0005] The object of the present invention is achieved through the following technical solutions:

[0006] A 3MCU chassis with module and air duct pluggable, comprising a chassis structure component and a fan component;

[0007] The chassis structure components include a rear side plate component, a front panel component, a left air duct plate component, a right air duct plate component, an upper cover plate component, a lower cover plate component, a left cover plate, a right cover plate, a rear frame component, a middle frame component, and a front fan cover component;

[0008] The rear side plate component, the front panel component, the left air duct component, the right air duct component, the upper cover plate component, and the lower cover plate component form the six faces of the chassis;

[0009] The front fan cover component is installed on the outside of the front panel component and jointly forms a fan cavity with the front panel component. A fan component is installed in this enclosed cavity. The front fan cover component is provided with through holes as air outlet holes, and both sides of the front panel component are provided with grooves as air inlets;

[0010] The rear frame component is installed on the inside of the rear side plate component. Both sides of the rear frame component are provided with grooves as air inlets. The rear frame component and the front panel component together provide the sliding grooves and fixing hole positions required during the insertion and extraction of the module-carrying air duct plate;

[0011] The inner sides of the left air duct plate component and the right air duct plate component are used to install modules. The outer sides of the left air duct plate component and the right air duct plate component have air ducts that penetrate from front to back. The air ducts are respectively enclosed by the left cover plate and the right cover plate on the outside. The air inlets of the air ducts communicate with the grooves on both sides of the rear frame component, and the air outlets of the air ducts communicate with the grooves on both sides of the front panel component;

[0012] The middle frame component connects the front panel parts and the rear frame parts inside the chassis.

[0013] Preferably, heat-conducting bosses are provided at the positions corresponding to the heat dissipation devices on the modules on the inner sides of the air duct plate component and the right air duct plate component, and heat-conducting pads are pasted on the heat-conducting bosses.

[0014] Preferably, the chassis structure components further include a debugging port door cover component and an electronic disk door cover component, and the debugging port door cover component and the electronic disk door cover component are installed on the front panel component.

[0015] Preferably, a cross beam component is added above the middle frame component.

[0016] Preferably, the fan component includes a fan connector and two fans. The two fans are installed side by side on the front panel component and respectively correspond to the left and right air ducts of the chassis.

[0017] Preferably, a signal interface board component is further provided inside the chassis structure components, and the signal interface board component is used to connect the modules and the fan component.

[0018] Preferably, the signal interface board component includes a motherboard component, a filter, an S6 connector, an electronic disk signal interface module component, a debugging port signal interface module component, and two optical cable components;

[0019] The motherboard assembly is fixedly installed on the front panel assembly, middle frame assembly, and rear frame assembly through screws. The motherboard assembly is equipped with a VPX connector socket, a power connector, a fan connector socket, and an RPB5F22Q connector;

[0020] One end of the electronic disk signal interface module assembly is fixedly installed on the middle frame assembly through screws, and the other end is docked on the motherboard assembly through a connector and fixed with screws; One end of the debug port signal interface module assembly is fixedly installed on the front panel part through screws, and the other end is docked on the motherboard assembly through a connector and fixed with screws.

[0021] The fan is connected to the fan connector socket of the motherboard assembly through a fan connector plug, and the fan is fixed on the front panel assembly and the fan cover assembly with screws;

[0022] The MT port ends of the two optical cable assemblies are fixed on the RPB5F22Q connector of the motherboard assembly, the E8T ends are installed and fixed on the S6 connector, and the longer MT flat fiber passes under the motherboard assembly and is fixed on the motherboard assembly with various small brackets and tie-downs. Description of the Drawings

[0023] Figure 1 is an isometric view of a 3MCU chassis with module-carrying air ducts for plugging and unplugging shown in the present invention;

[0024] Figure 2 is a schematic structural diagram of a 3MCU chassis with module-carrying air ducts for plugging and unplugging shown in the present invention;

[0025] Figure 3 is a schematic structural diagram of the signal interface board assembly and the 3U standard module in the present invention.

[0026] Figure 4 is a schematic diagram of the principle of air-cooled heat dissipation in the present invention.

[0027] Label Description: 1 - 3MCU chassis, 2 - Fan connector socket, 3 - Debug port signal interface module assembly, 4 - Electronic disk signal interface module assembly, 5 - Motherboard assembly, 6 - Filter, 7 - S6 connector, 8 - Optical cable assembly, 9 - Right cover plate, 10 - Right air duct plate assembly, 11 - Rear side plate assembly, 12 - Rear frame assembly, 13 - Middle frame assembly, 14 - Cross beam assembly, 15 - Upper cover plate assembly, 16 - Left air duct plate assembly, 17 - Left cover plate, 18 - Front fan cover assembly, 19 - Fan assembly, 20 - Front panel assembly, 21 - Electronic disk door cover assembly, 22 - Debug port door cover assembly, 23 - 3U standard power module, 24 - 3U standard function module, 25 - Heat dissipation device, 26 - Thermal pad, 27 - 6U standard function module. Detailed Implementation Manner

[0028] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0029] Refer to Figure 1 As shown, a 3MCU chassis 1 with module-carrying air duct pluggable is shown in this embodiment. It is a 3MCU air-cooled chassis based on the ARINC 600 standard. Refer to Figure 2 As shown, it includes a chassis structure component, a signal interface board component, and a fan component 19.

[0030] The chassis structure component includes a rear side plate component 11, a front panel component 20, a left air duct plate component 16, a right air duct plate component 10, an upper cover plate component 15, a lower cover plate component, a left cover plate 17, a right cover plate 9, a rear frame component 12, a front fan cover component 18, a middle frame component 13, a cross beam component 14, an electronic disk door cover component 21, and a debugging port door cover component 22, etc.

[0031] The rear side plate component 11, the front panel component 20, the left air duct component 16, the right air duct component 10, the upper cover plate component 15, and the lower cover plate component constitute the six faces of the chassis, forming a closed chassis shell, which mainly serves to enclose various circuit board components inside, and has basic functions such as installation support, electromagnetic shielding, grounding protection, salt spray, mildew, and mold prevention.

[0032] The front fan cover component 18 is installed on the outside of the front panel component 20, and together with the front panel component 20, it forms a closed fan cavity. The fan component 19 is installed in this closed cavity. The front fan cover component 18 is provided with through holes as air outlet holes, and the two sides of the front panel component 20 are provided with grooves as air inlet holes.

[0033] The rear frame component 12 is installed on the inside of the rear side plate component 11. The two sides of the rear frame component 12 are provided with grooves as air inlet holes. The rear frame component 12 and the front panel component together provide the required chutes and fixing hole positions during the plugging and unplugging process of the module-carrying air duct board.

[0034] The outer sides of the left air duct plate component 16 and the right air duct plate component 10 have air ducts that penetrate from front to back. The outer sides of the air ducts are respectively closed by the left cover plate 17 and the right cover plate 9. The air inlet of the air duct is communicated with the grooves on both sides of the rear frame component 12, and the air outlet of the air duct is communicated with the grooves on both sides of the front panel component 20. The inner sides of the left air duct plate component 16 and the right air duct plate component 10 are used to install modules. Heat conducting bosses are provided at the positions corresponding to the heat dissipation devices on the modules on the inner sides of the air duct plate components 16 and the right air duct plate component 10, and the heat conducting pads 26 are pasted on the heat conducting bosses.

[0035] Please refer to Figure 4As shown in the figure, the air-cooling heat dissipation principle of the present invention is as follows: The fan assembly 19 operates in an air-extracting mode. Air enters from the grooves on both sides of the rear frame assembly 12. When passing through the air duct between the left (right) air duct assembly and the left (right) cover plate, convective heat transfer occurs through the heat dissipation fins in the air duct, taking away the heat of the heat dissipation device 25 on the module, flowing into the fan assembly from the grooves on both sides of the front panel assembly 20, and finally flowing out through the ventilation holes of the front fan cover assembly 18. The heat on the heat dissipation fins is conducted from the top of the module device through the contact interface to the thermal conductive pad 26, then from the thermal conductive pad 26 through the contact interface to the thermal conductive boss on the left (right) air duct assembly, and finally from the thermal conductive boss structure to the heat dissipation fins through solid heat conduction.

[0036] The debugging port door cover assembly and the electronic disk door cover assembly are installed on the front panel assembly.

[0037] The middle frame assembly 13 connects the front panel parts and the rear frame parts inside the chassis, playing a role in strengthening the structural strength. Since the middle frame assembly is in the lower part of the whole, a cross beam assembly can also be added above the middle frame assembly to further strengthen the overall structural strength.

[0038] In this embodiment, the fan assembly 19 includes a fan connector plug and a fan. Considering the limitations of the electronic disk door cover assembly 21, a debugging port door cover assembly 22, and the overall appearance of the machine, two 40×40 standard fans are selected in this embodiment, which can be just installed side by side on the front panel assembly, corresponding to the left and right air ducts of the chassis respectively.

[0039] Please refer to Figure 3 As shown in the figure, in this embodiment, the signal interface board assembly is used to connect the module and the fan assembly, including a motherboard assembly 5, a filter 6, an S6 connector 7, an electronic disk signal interface module assembly 4, a debugging port signal interface module assembly 3, and two optical cable assemblies 8.

[0040] The motherboard assembly 5 is fixedly installed on the front panel assembly, the middle frame assembly, and the rear frame assembly by screws. In this embodiment, the left side of the motherboard assembly 5 has a VPX connector socket for a 6U standard function module 27, the right side of the motherboard assembly 5 has a VPX connector for a 3U standard function module 24 and a power connector for a 3U standard power module 23, and also includes a fan connector socket, an RPB5F22Q connector, etc.

[0041] One end of the electronic disk signal interface module assembly 4 is fixedly installed on the middle frame assembly 13 by screws, and the other end is docked on the motherboard assembly 5 through a connector and fixed with screws. One end of the debugging port signal interface module assembly is fixedly installed on the front panel part by screws, and the other end is docked on the motherboard assembly 5 through a connector and fixed with screws.

[0042] The wire harnesses of two 40×40 fans share a single fan connector plug, which is connected to the fan connector socket 2 on the motherboard assembly 5. The fans are fixed to the front panel assembly 20 and the fan cover assembly using screws.

[0043] The MT ends of the two fiber optic cable assemblies are fixed to the RPB5F22Q connector on the motherboard assembly 5, and the E8T ends are installed and fixed to the S6 connector 7. The longer MT flat fiber passes under the motherboard assembly 5 and is fixed to the motherboard assembly 5 using various small brackets and tie-downs.

[0044] In this embodiment, through the signal interface board assembly, two 3U modules and one 6U module can be connected, the electronic disk and the debugging port can be connected, the S6 connector can be connected, and the filter can be connected. All the hardware parts are connected together, and an interface for fan power supply is provided to connect the fan, enabling the necessary functions to be achieved in a small-size space.

[0045] Please refer to Figure 2 and Figure 4 As shown, before installing the 6U standard function module 27, first remove the upper cover assembly 15, and remove the fastener screws between the left air duct board assembly 16 and the front panel assembly 20, the rear frame assembly 12, and the lower cover assembly respectively, then the left air duct board assembly 16 can be removed. Secondly, after pasting the thermal pad 26 on the heat-conducting boss inside the left air duct board assembly 16, fasten the 6U standard function module 27 to the inside of the left air duct board assembly 16 using screws. Finally, insert the 6U standard function module 27 and the left air duct board assembly 16 together into the chassis. When the VPX connector of the 6U standard function module 27 is bent and docked, use screws to fasten the left air duct board to the front panel assembly 20, the rear frame assembly 12, and the lower cover assembly respectively.

[0046] When installing the 3U standard function module 24 and the 3U standard power module 23 on the right air duct assembly, it is the same as installing the 6U standard function module 27. After all the modules are installed, install the upper cover assembly 15 and fix it firmly with screws.

[0047] In addition, there is a hole in the middle of the rear side panel assembly for opening the interface of the S6 connector. The interface of this S6 connector is used to connect the cable plug on the installation machine. Through this connector and the cable, this device can interact with other on-board devices or control systems for information.

[0048] It can be understood that for those of ordinary skill in the art, equivalent substitutions or changes can be made according to the technical solutions and inventive concepts of the present invention, and all such changes or substitutions should fall within the protection scope of the appended claims of the present invention.

Claims

1. A 3MCU chassis with pluggable module-carrying air ducts, comprising a chassis structure assembly and a fan assembly, characterized in that: The chassis structure assembly includes a rear side plate assembly, a front panel assembly, a left air duct plate assembly, a right air duct plate assembly, an upper cover plate assembly, a lower cover plate assembly, a left cover plate, a right cover plate, a rear frame assembly, a middle frame assembly and a front fan cover assembly; The rear side plate assembly, the front panel assembly, the left air duct assembly, the right air duct assembly, the upper cover plate assembly and the lower cover plate assembly form the six faces of the chassis; The front fan cover assembly is installed on the outside of the front panel assembly and jointly encloses with the front panel assembly to form a fan cavity. A fan assembly is installed in the enclosed cavity. The front fan cover assembly is provided with through holes as air outlets, and grooves are provided on both sides of the front panel assembly as air inlets; The rear frame assembly is installed on the inner side of the rear side plate assembly. Grooves are provided on both sides of the rear frame assembly as air inlets. The rear frame assembly and the front panel assembly together provide the chutes and fixing hole positions required during the plugging and unplugging of the module-carrying air duct plates; The inner sides of the left air duct plate assembly and the right air duct plate assembly are used to install modules. The outer sides of the left air duct plate assembly and the right air duct plate assembly have air ducts that penetrate through the front and rear. The air ducts are respectively closed by the left cover plate and the right cover plate on the outside. The air inlets of the air ducts communicate with the grooves on both sides of the rear frame assembly, and the air outlets of the air ducts communicate with the grooves on both sides of the front panel assembly; The middle frame assembly connects the front panel parts and the rear frame parts inside the chassis.

2. The 3MCU chassis with pluggable module and air duct according to claim 1, characterized in that: Thermal conductive bosses are provided at the positions corresponding to the heat dissipation devices on the modules on the inner sides of the air duct plate assembly and the right air duct plate assembly, and thermal conductive pads are pasted on the thermal conductive bosses.

3. The 3MCU chassis with module-carrying air ducts for plugging and unplugging according to claim 1, wherein: The chassis structure assembly also includes a debugging port door cover assembly and an electronic disk door cover assembly, and the debugging port door cover assembly and the electronic disk door cover assembly are installed on the front panel assembly.

4. A 3MCU chassis with a module-carrying air duct for plugging and unplugging, characterized in that A cross beam assembly is added above the middle frame assembly.

5. A 3MCU chassis with module-carrying air ducts for plugging and unplugging, characterized in that The fan assembly includes a fan connector and two fans. The two fans are installed side by side on the front panel assembly, corresponding to the left and right air ducts of the chassis respectively.

6. The 3MCU chassis with pluggable module and air duct according to claim 1, characterized in that It also includes a signal interface board assembly located inside the chassis structure assembly, and the signal interface board assembly is used to connect the module and the fan assembly.

7. A 3MCU chassis with module-carrying air ducts for plugging and unplugging, characterized in that The signal interface board assembly includes a motherboard assembly, a filter, an S6 connector, an electronic disk signal interface module assembly, a debugging port signal interface module assembly, and two optical cable assemblies; The motherboard assembly is fixedly installed on the front panel assembly, the middle frame assembly and the rear frame assembly by screws. The motherboard assembly is provided with a VPX connector socket, a power connector, a fan connector socket and an RPB5F22Q connector; One end of the electronic disk signal interface module assembly is fixedly installed on the middle frame assembly by screws, and the other end is docked on the motherboard assembly through a connector and fixed with screws; one end of the debugging port signal interface module assembly is fixedly installed on the front panel parts by screws, and the other end is docked on the motherboard assembly through a connector and fixed with screws; The fan is connected to the fan connector socket of the motherboard assembly through a fan connector plug, and the fan is fixed on the front panel assembly and the fan cover assembly with screws; The MT port ends of the two optical cable assemblies are fixed on the RPB5F22Q connector of the motherboard assembly, and the E8T ends are installed and fixed on the S6 connector. The longer MT flat fiber passes under the motherboard assembly and is fixed on the motherboard assembly with various small brackets and tie-downs.

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