A manufacturing apparatus chip in situ collection device and method

Abstract

The application discloses a kind of manufacturing equipment chip in-situ collection device and method, including additive-subtractive composite repair cabin, chip collection module and electrical control system;Additive-subtractive composite repair cabin includes sealed cabin and is arranged in sealed cabin blow chip module, cabin door opening and closing module and additive-subtractive repair module;Sealed cabin is equipped with eight corners, and each corner is provided with chip removal hole;Chip collection module includes chip collection mechanism and corner cover opening and closing mechanism, chip collection mechanism includes multiple chip collection boxes communicated by hose;In the position corresponding to each chip removal hole, there is a corner cover opening and closing mechanism for controlling chip removal hole opening and closing;Each chip removal hole and corresponding corner cover opening and closing mechanism are covered with a chip collection box outside;Electrical control system is installed on the top cover of sealed cabin, respectively with chip collection module, blow chip module, cabin door opening and closing module and additive-subtractive repair module connection.The application can be in any posture and position in-situ repair, and the generated chip is in-situ collected.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of additive and subtractive composite manufacturing, in particular to a manufacturing equipment chip in-situ collection device and method. BACKGROUND

[0002] Additive and subtractive composite repair technology is a derivative of additive and subtractive manufacturing technology, and is a new technology that combines 3D printing technology and traditional numerical control machining technology. The technology relies on additive process to realize material accumulation forming, and relies on subtractive machining to improve surface quality and remove internal defects. The two have a strong complementary relationship. Through the combination of the two processes, high-efficiency and high-quality in-situ repair of parts can be achieved in a manner of subtractive machining first, additive manufacturing first, additive and subtractive machining alternately, etc. It can be widely used in aerospace, automobile parts, ships, molds, military equipment and other fields, and can improve production efficiency, reduce production cost, extend the service life of equipment, and has broad development prospects.

[0003] At present, the additive and subtractive in-situ repair technology is still in its infancy. The equipment composition of additive and subtractive repair is mainly in the form of machine tool and robot. Both of these two forms cannot automatically recycle the chips, and need to be cleaned regularly by manual work. The residue of the chips will also affect the quality of the additive process, increase the possibility of defects, and affect the quality of machining and repair.

[0004] A deepwater pipeline composite milling additive and subtractive in-situ repair equipment is disclosed in Chinese patent document with authorization announcement No. CN211102164U, but it can only repair the pipeline by additive and subtractive method and cannot effectively collect the chips. Chinese patent document with publication No. CN114619256A discloses a powder and cutting chip separation and collection device and method for additive and subtractive composite machining system, which can separate the cutting chips and machining powder scattered on the machining platform, but it is only suitable for planer machine tool and does not have applicability for uncertain space posture in in-situ repair.

[0005] Therefore, there is an urgent need for an additive and subtractive equipment with chip collection function, which can be widely used in variable posture additive and subtractive composite repair scenes such as underwater, land and aerospace. SUMMARY

[0006] The present application provides a manufacturing equipment chip in-situ collection device and method, which can in-situ repair large structures in underwater, on land or in space in any posture and position, and collect the generated chips in-situ, realize the isolation control of the repair environment, and avoid the pollution of the equipment to the environment.

[0007] A manufacturing equipment chip in-situ collection device, comprising an additive and subtractive composite repair cabin, a chip collection module and an electrical control system.

[0008] The additive and subtractive material composite repair cabin comprises a sealed cabin and a plurality of chip blowing modules, a cabin door opening and closing module and an additive and subtractive material repair module arranged in the sealed cabin; the sealed cabin is provided with eight corners, and each corner is provided with an inclined surface with a chip discharge hole;

[0009] The chip collection module comprises a chip collection mechanism and a corner cover opening and closing mechanism, the chip collection mechanism comprises a plurality of chip collection boxes which are connected to each other by hoses; wherein the outer surface of the sealed cabin is provided with a corner cover opening and closing mechanism for controlling the opening and closing of the chip discharge hole at the position corresponding to each chip discharge hole; each chip discharge hole and the corresponding corner cover opening and closing mechanism are covered with a chip collection box outside, and the chip collection box is sealed and fixed with the sealed cabin;

[0010] The electrical control system is installed on the top cover of the sealed cabin and is connected with the chip collection module, the chip blowing module, the cabin door opening and closing module and the additive and subtractive material repair module respectively.

[0011] Further, the corner cover opening and closing mechanism comprises a closing rudder fixed on the outer surface of the sealed cabin and a rotating shaft driven by the closing rudder, and the rotating shaft is fixed with a corner cover; in the process of rotating the corner cover driven by the rotating shaft, the corner cover cooperates with the inclined surface with the chip discharge hole to control the opening and closing of the chip discharge hole.

[0012] Further, the connection between the adjacent two surfaces in the sealed cabin is provided with a chip guide groove for guiding the chip into the chip collection box.

[0013] Further, the chip blowing module is arranged on the cabin wall of the sealed cabin and comprises a high-pressure nozzle, a rudder support, a pitch rudder, a cloud platform turntable and a yaw rudder;

[0014] The high-pressure nozzle is fixed outside the rudder support through a nozzle adapter plate; the pitch rudder is fixed inside the rudder support and is rotationally connected with the cloud platform turntable; the yaw rudder is fixed on the cloud platform turntable and is rotationally connected with a base fixed on the cabin wall.

[0015] Further, the cabin door opening and closing module comprises an electric cylinder and a sealed cabin door.

[0016] The bottom plate of the sealed cabin is provided with a through opening matched with the sealed cabin door, and the sealed cabin door is hingedly connected with the bottom plate of the sealed cabin through a hinge; the two ends of the electric cylinder are connected with the cabin wall of the sealed cabin and the inner side of the sealed cabin door through mounting supports respectively; the opening and closing of the sealed cabin door around the hinge is driven by controlling the shortening and lengthening of the electric cylinder.

[0017] Further, the additive and subtractive material repair module comprises a three-axis Cartesian motion platform composed of an X1 axis, an X2 axis, a Y axis and a Z axis.

[0018] The Z-axis is fixed with a slurry additive extruder, a subtractive module and a chip blowing module; the chip blowing module has an end facing the electric spindle tool head of the subtractive module, and is used for spraying high-pressure gas during subtracting.

[0019] Further, a plurality of chip collecting boxes connected with each other by hoses are connected with electromagnetic valves in the electrical control system, and the electromagnetic valves are opened when it is necessary to collect chips.

[0020] Further, a gyroscope is arranged in the electrical control system, and the posture of the sealed cabin is detected by the gyroscope during the collection of chips.

[0021] A chip in-situ collection method using the in-situ chip collection device of the manufacturing equipment, comprising:

[0022] The mechanical arm carries the additive and subtractive composite repair cabin to approach and compress in the direction perpendicular to the surface to be repaired, the cabin door opening and closing module controls the opening of the sealed cabin door, and the additive and subtractive repair module performs additive and subtractive repair work;

[0023] When chips appear during the additive and subtractive repair process, the blowing chip module and the chip blowing module in the additive and subtractive repair module work together to increase the pressure in the sealed cabin, enhance the convection of air in the cabin, form a cyclone, and guide the chips into the chip guide groove in the sealed cabin;

[0024] After the pressure in the sealed cabin reaches a preset pressure, the gyroscope in the electrical control system detects the posture of the current sealed cabin, confirms the lowest corner point position according to the different postures, controls the opening of the corner cover opening and closing mechanism at the position, and guides the chips in the cabin to be discharged by using the pressure difference between the sealed cabin and the chip collecting box;

[0025] For part of the large-mass residual chips, the direction of the high-pressure nozzle of the blowing chip module is turned to the lowest corner point of the sealed cabin, high-pressure gas is sprayed along the direction of the chip guide groove again, the chips are completely blown into the chip collecting box, and the chip in-situ collection method of blowing-chip-guiding-chip-collecting is realized.

[0026] Compared with the prior art, the present application has the following beneficial effects:

[0027] The present application can adjust the chip collection position according to different spatial postures of the machining cabin, use the technical route of blowing-chip-guiding-chip-collecting to efficiently collect the generated chips, avoid the influence of the residual chips on the additive repair process, and avoid the pollution of the environment outside the cabin.

[0028] The present application can be used in various complex working conditions, including closed additive and subtractive in-situ repair under water and in space environment, can efficiently and widely collect chips in any posture, and can realize the full-process automation of additive and subtractive repair, is convenient and fast to use, and improves the work efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 This is a schematic diagram of the overall structure of an in-situ chip collection device for manufacturing equipment according to the present invention.

[0030] Figure 2 It is a schematic diagram of the chip collection mechanism in the present invention.

[0031] Figure 3 Schematic diagram of the corner cover opening and closing mechanism of the present invention.

[0032] Figure 4 for Figure 3 A partial enlarged view of area A in the middle.

[0033] Figure 5 The present invention is a partial cross-sectional view of an in-situ chip collection device for manufacturing equipment.

[0034] Figure 6 It is a structural schematic diagram of the chip blowing module in the present invention.

[0035] Figure 7 It is a schematic diagram of the hatch opening and closing module in the present invention.

[0036] Figure 8 Schematic diagram of the additive and subtractive material repair module in the present invention.

[0037] Figure 9 It is a schematic diagram of the arrangement of the chip blowing module in the present invention.

[0038] Figure 10 It is a cross-sectional schematic diagram of the chip guide groove in the present invention. DETAILED DESCRIPTION

[0039] The present invention will be described in further detail below with reference to the accompanying drawings and examples. It should be noted that the following examples are intended to facilitate understanding of the present invention and do not have any limiting effect on the present invention.

[0040] like Figure 1 As shown, a chip in-situ collection device for manufacturing equipment includes a chip collection module 1, an additive and subtractive composite repair cabin 2 and an electrical control system 3.

[0041] like Figure 2 and Figure 3 As shown, the chip collection module 1 includes a chip collection mechanism 10 and a corner cover opening and closing mechanism 11 .

[0042] The chip collection mechanism 10 includes a chip box 101, a hose 102, and a sealing ring 103. The hose 102 is connected through a quick interface installed on the chip box 101, connecting the eight chip boxes 101 to the solenoid valves in the electrical control system 3. The chip box 101 is fixedly connected to the additive and subtractive composite repair cabin 2, and the air tightness of the connection is ensured by the sealing ring 103.

[0043] As shown in Figure 4 The corner cover opening and closing mechanism 11 is installed at eight corner points of the additive and subtractive composite repair cabin 2, including a closing rudder 111, a rudder support 112, a rotating shaft support 113, a rotating shaft 114, a corner cover 115, a synchronous belt 116, and a synchronous pulley 117.

[0044] When receiving the instruction of the electrical control system 3, the closing rudder 111 rotates by a fixed angle, drives the corner cover 115 to rotate around the rotating shaft 114 through the synchronous belt 116 and the synchronous pulley 117, seals the reserved chip removal hole of the additive and subtractive composite repair cabin 2, and sets flexible rubber at the contact position of the corner cover 115 and the cabin body to ensure air tightness. Each chip removal hole and the corresponding corner cover opening and closing mechanism 11 are covered with a chip collection box 101.

[0045] As shown in Figure 5 The additive and subtractive composite repair cabin 2 includes a sealed cabin 23 and a chip blowing module 20, a cabin door opening and closing module 21, and an additive and subtractive repair module 22 arranged in the sealed cabin 23. The sealed cabin 23 includes a top cover 231, a cabin wall 232, and a bottom plate 233.

[0046] The connection between two adjacent surfaces in the sealed cabin 23 is provided with a chip guide groove, as shown in Figure 10 The connection between two adjacent cabin walls 232 is provided with a circular arc-shaped chip guide groove. Similarly, the connections between the top cover 231 and the cabin wall 232 and between the cabin wall 232 and the bottom plate 233 are also provided with chip guide grooves. The cuttings fall into the chip guide groove and are guided into the chip collection box 101, improving the collection efficiency of the cuttings.

[0047] As shown in Figure 6 The chip blowing module 20 includes a high-pressure nozzle 201, a nozzle adapter plate 202, a rudder support 203, a pitch rudder 204, a cloud platform 205, a yaw rudder 206, and a base 207. The high-pressure nozzle 201 is fixed outside the rudder support 203 through the nozzle adapter plate 202; the pitch rudder 204 is fixed inside the rudder support 203 and rotationally connected with the cloud platform 205; the yaw rudder 206 is fixed on the cloud platform 205 and rotationally connected with the base 207 fixed on the cabin wall 232.

[0048] The high-pressure nozzle 201 is connected with an external high-pressure gas source through a gas pipe inside the cabin body and is controlled by an electromagnetic valve; the chip blowing module 20 has two degrees of freedom and can realize yaw and pitch movements of the nozzle, so as to adjust the jet direction in the cabin.

[0049] The orientation arrangement of the chip blowing module 20 is as shown in Figure 9As shown, during the chip recovery process, the eight chip blowing modules 20 first spray high-pressure gas in a counterclockwise direction to increase the pressure in the cabin and enhance the air convection in the cabin. They work simultaneously with the chip lifting modules to form a cyclone to carry the chips away from the repair surface. On the one hand, reducing the residual chips on the surface helps to improve the quality of additive repair. At the same time, this method can also increase the chip collection rate and avoid chips remaining when the chips leave the surface of the processing cabin, causing pollution to the environment outside the cabin.

[0050] like Figure 7 As shown, the hatch opening and closing module 21 includes a mounting bracket 211, an electric cylinder 212, a sealed hatch 213, and a hinge 214. The bottom plate 233 of the sealed hatch 23 has a through opening that matches the sealed hatch 213, which is hingedly connected to the bottom plate 233 via the hinge 214. The two ends of the electric cylinder 212 are connected to the cabin wall 232 of the sealed hatch 23 and the inner side of the sealed hatch 213, respectively, via the mounting bracket 211. The sealed hatch 213 is driven to open and close around the hinge 214 by controlling the contraction and extension of the electric cylinder 212.

[0051] When the sealed cabin 23 contacts the surface to be processed, the electric cylinder 212 drives the sealed cabin door 213 to open around the hinge 214, so that the internal additive and subtractive material repair module 22 can reach the target processing position and perform the repair operation.

[0052] like Figure 8 As shown, the additive and subtractive repair module 22 includes a three-axis Cartesian motion platform consisting of an X1 axis 221, an X2 axis 222, a Y axis 224, a Z axis 225, an XY adapter plate 223, and a YZ adapter plate 226. The slurry additive extruder is fixed to the slider nut of the Z axis via an adapter plate, on which are mounted a displacement cylinder 227, a cylinder connecting plate 228, an extrusion module 229, an extrusion head 2210, a syringe chuck 2211, a semicircular pressure head 2212, a guide flange 2213, and a syringe 2214. The displacement cylinder 227 can move the syringe 2214 up and down, allowing it to be lowered during additive operations and raised during subtractive operations to avoid interference. The upper end of the push rod of syringe 2214 is clamped within extruder head 2210. The filler barrel of syringe 2214 is clamped and held in place by syringe chuck 2211 and semicircular pressure head 2212, which are connected by screws to restrict the syringe's six degrees of freedom. Several screw holes are arranged on guide flange 2213, allowing for fine-tuning of the syringe 2214's tip's orientation by tightening set screws. This also limits the syringe's deformation direction when extrusion pressure is high, improving the quality of the additive.

[0053] The additive and subtractive repair module 22 further comprises a subtractive module, which is composed of a main shaft tool holder 2215 and an electric spindle 2216. The main shaft tool holder 2215 is fixed by screws and a Z-axis 225, and the electric spindle 2216 is installed in the tool hole of the main shaft tool holder 2215 and locked by three screws to ensure high rigidity during subtractive machining. The chip ejecting module 2217 is connected with the air cylinder connecting plate 228, and the end thereof faces the position of the tool head of the electric spindle 2216. High-pressure gas is sprayed during subtractive machining to cool the tool and also to lift the chips and blow them away from the machining surface to participate in the process of chip recycling.

[0054] The electrical control system 3 comprises a gyroscope, solenoid valves, motor drivers, electric spindle drivers and a lower computer. Each sensor and driving element is connected with the lower computer through an electric circuit to receive the control signals sent by the lower computer. The gyroscope can sense the current attitude of the cabin body. The solenoid valves are used to control the on-off of the air circuit, the motor drivers drive the movement of the module, and the electric spindle drivers are used to adjust the speed of the spindle. The upper part of the electrical box is provided with a comprehensive wiring port, which can be connected with external high and low pressure gas sources, power sources and the upper computer.

[0055] A chip in-situ collection method using the chip in-situ collection device of the manufacturing equipment mentioned in the above embodiment, comprising:

[0056] Step 1: When the damage of the structure surface is detected, the additive and subtractive repair cabin 2 reaches the area to be repaired by the mechanical arm clamping, and the sealing cabin 23 is attached to the damaged structure in an inclined attitude. When the machining cabin is completely attached, the sealing cabin door 213 is opened by the electric cylinder 212 to maintain the isolation of the cabin environment from the outside environment.

[0057] Step 2: The additive and subtractive repair module 22 starts to work, and first, the surface to be repaired is pretreated to remove foreign matters possibly existing on the damaged surface and regularize the defects, which is beneficial to improve the interface bonding strength. At this time, the milling operation of the electric spindle 2216 will generate chips, which will scatter on the bottom plate 233 and the milled surface, and part of them will be deposited in the lowest position and the chip guide groove in the inclined cabin due to gravity.

[0058] Step 3: The chip ejecting module 2217 is opened throughout the milling process, and high-pressure gas is continuously supplied to the tool head to cool the tool and blow part of the chips away from the original position. After the milling pretreatment is completed, the tool stops rotating, and the Cartesian motion platform drives the chip ejecting module 2217 to continue moving in the Z-Zag path at a high speed and in a pulse ventilation mode to completely sweep the damaged surface to ensure that there is no residual milling chip on the surface. At the same time, the chip blowing module 20 is opened, and the eight high-pressure nozzles 201 are driven by the pitch rudder 204 and the yaw rudder 206 to face the counterclockwise direction, the solenoid valve is opened, and the air supply is started. During the air supply process, an anticlockwise cyclone is formed in the inside of the sealing cabin 23 to drive the chips in the cabin to flow, and the pressure in the cabin is increased to form a certain pressure difference with the chip collecting module 1.

[0059] Step 4: The gyroscope located in the electrical control system 3 starts to detect the current attitude of the cabin, according to the different attitude, the lowest corner position is confirmed, the corner cover 115 at this position is opened, the pressure difference of the two cavities is used to guide the chip removal in the cabin, part of the chips may remain in the cabin due to the large mass, at this time the electromagnetic valve of the chip removal module 2217 and the chip blowing module 20 is closed, the chip blowing module 20 is driven by the elevator 204 and the rudder 206 to turn the nozzle direction to the lowest corner, and high pressure gas is injected along the chip removal groove direction again to blow the chips out of the cabin.

[0060] Step 5: If there are still fine chips remaining in the sealed cabin 23 at this time, steps 3-4 can be repeated.

[0061] Step 6: The displacement cylinder 227 extends the slurry extruder under the action of gas pressure, additive repair is carried out on the surface after pretreatment using slurry direct writing printing technology, and some machining allowance is left, the material used is a two-component polymer repair agent which has been filled into the syringe 2214 by pre-proportioning.

[0062] Step 7: After the polymer repair agent is completely cured, the additive and subtractive repair module 22 works again to perform the final surface treatment on the repaired surface, and the machining allowance reserved is finished by the subtractive module to improve the surface quality and repair accuracy.

[0063] Step 8: Chips are generated again in the cabin at this time, and steps 3-5 are repeated.

[0064] Step 9: Repair is completed, the sealed cabin door 213 is closed, at this time the repaired surface should have no chip residues, realizing in-situ chip collection and cleaning repair of additive and subtractive repair.

[0065] Step 10: The chips in the chip collection box 101 are manually cleaned after the cabin completes the work.

[0066] The above embodiments have described the technical solutions and beneficial effects of the present application in detail, it should be understood that the above description is only a specific embodiment of the present application, and is not used to limit the present application, any modification, supplement and equivalent replacement made within the principle range of the present application should be included in the protection scope of the present application.

Claims

1. A chip in-situ collection device for manufacturing equipment, characterized in that: It comprises an additive and subtractive composite repair chamber (2), a chip collection module (1) and an electrical control system (3); The additive and subtractive composite repair cabin (2) comprises a sealed cabin (23), a plurality of chip blowing modules (20), a cabin door opening and closing module (21), and an additive and subtractive repair module (22) arranged in the sealed cabin (23); the sealed cabin (23) is provided with eight corners, each corner being provided with an oblique cut surface having a chip removal hole; The chip collection module (1) comprises a chip collection mechanism (10) and a corner cover opening and closing mechanism (11), wherein the chip collection mechanism (10) comprises a plurality of chip collection boxes (101) interconnected by a hose (102); wherein the outer surface of the sealed cabin (23) is provided with a corner cover opening and closing mechanism (11) for controlling the opening and closing of the chip discharge hole at a position corresponding to each chip discharge hole; each chip discharge hole and the corresponding corner cover opening and closing mechanism (11) are covered with a chip collection box (101) on the outside, and the chip collection box (101) is sealed and fixed to the sealed cabin (23); The corner cover opening and closing mechanism (11) includes a closing steering gear (111) fixed to the outer surface of the sealed cabin (23) and a rotating shaft (114) driven by the closing steering gear (111), and a corner cover (115) is fixed to the rotating shaft (114); when the rotating shaft (114) drives the corner cover (115) to rotate, the corner cover (115) cooperates with the beveled surface with the chip removal hole to control the opening and closing of the chip removal hole; The electrical control system (3) is installed on the top cover (231) of the sealed cabin (23) and is respectively connected to the chip collection module (1), the chip blowing module (20), the cabin door opening and closing module (21) and the additive and subtractive material repair module (22).

2. The in-situ chip collection device for manufacturing equipment according to claim 1, characterized in that: A chip guide groove is provided at the connection between two adjacent surfaces in the sealed cabin (23) for guiding chips into the chip collecting box (101).

3. The in-situ chip collection device for manufacturing equipment according to claim 1, characterized in that: The chip blowing module (20) is arranged on the bulkhead (232) of the sealed cabin (23), and comprises a high-pressure nozzle (201), a steering gear bracket (203), a pitch steering gear (204), a pan / tilt turntable (205), and a yaw steering gear (206); The high-pressure nozzle (201) is fixed to the outside of the servo bracket (203) via a nozzle adapter plate (202); the pitch servo (204) is fixed to the inside of the servo bracket (203) and is rotatably connected to the pan / tilt turntable (205); the yaw servo (206) is fixed to the pan / tilt turntable (205) and is rotatably connected to a base (207) fixed to the bulkhead (232).

4. The in-situ chip collection device for manufacturing equipment according to claim 1, characterized in that: The hatch opening and closing module (21) comprises an electric cylinder (212) and a sealed hatch (213); The bottom plate (233) of the sealed cabin (23) is provided with a through opening matching the sealed cabin door (213), and the sealed cabin door (213) is hinged to the bottom plate (233) of the sealed cabin (23) via a hinge (214); the two ends of the electric cylinder (212) are respectively connected to the bulkhead (232) of the sealed cabin (23) and the inner side surface of the sealed cabin door (213) via a mounting bracket (211); and the sealed cabin door (213) is driven to open and close around the hinge (214) by controlling the shortening and extension of the electric cylinder (212).

5. The in-situ chip collection device for manufacturing equipment according to claim 1, characterized in that: The additive and subtractive material repair module (22) includes a three-axis Cartesian motion platform consisting of an X1 axis (221), an X2 axis (222), a Y axis (224), and a Z axis (225); A slurry additive extruder, a subtractive module, and a chip raising module (2217) are fixed on the Z-axis (225); the end of the chip raising module (2217) faces the cutter head of the electric spindle (2216) of the subtractive module, and is used to spray high-pressure gas during subtractive operation.

6. The in-situ chip collection device for manufacturing equipment according to claim 1, characterized in that: A plurality of chip collecting boxes (101) interconnected by a hose (102) are connected to a solenoid valve in an electrical control system (3), and the solenoid valve is opened when chips need to be collected.

7. The in-situ chip collection device for manufacturing equipment according to claim 1, characterized in that: The electrical control system (3) is provided with a gyroscope, and during the chip collection process, the posture of the sealed cabin (23) is detected by the gyroscope.

8. A method for collecting chips in situ, characterized in that: The in-situ chip collection device for manufacturing equipment according to any one of claims 1 to 7 comprises: The robotic arm carries the additive and subtractive composite repair cabin (2) and approaches and presses the surface to be repaired in a direction perpendicular to the surface to be repaired, the cabin door opening and closing module (21) controls the sealed cabin door to open, and the additive and subtractive repair module (22) performs the additive and subtractive repair work; When chips appear during the additive and subtractive material repair process, the chip blowing module (20) and the chip raising module (2217) in the additive and subtractive material repair module (22) work together to increase the pressure in the sealed cabin (23), enhance the air convection in the cabin, form a cyclone, and guide the chips into the chip guide groove in the sealed cabin (23); After the preset pressure is reached in the sealed cabin (23), the gyroscope in the electrical control system (3) detects the current posture of the sealed cabin (23), confirms the position of the lowest corner point according to the different postures, controls the corner cover opening and closing mechanism (11) at the position to open the corner cover (115), and uses the pressure difference between the sealed cabin (23) and the chip collection box (101) to guide the chips in the cabin to be discharged; For some large-mass residual chips, the high-pressure nozzle (201) of the chip blowing module (20) is turned toward the lowest corner point of the sealed cabin (23), and high-pressure gas is sprayed again along the direction of the chip guide groove to completely blow the chips into the chip collection box (101), thereby realizing the chip raising-chip blowing-chip guiding-chip collecting method in situ.

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