Dust-removing and anti-static equipment for circuit board surface mounting

Abstract

The invention, which relates to the printed circuit field, discloses a dedusting antistatic device for circuit board surface mounting, comprising a box body, a negative pressure chamber installed in the box body, conveying mechanisms arranged at two ends of the negative pressure chamber and used for conveying a circuit board, and an antistatic roller rotatably connected to one side of the negative pressure chamber and used for contacting the surface of the circuit board. The two sides of the bottom of the negative pressure bin are both slidably connected with sealing plates, the sealing plates are fixedly connected with inclined push plates, elastic reset mechanisms are arranged between the sealing plates and the inner wall of the negative pressure bin, the two ends of the fixed bin are both slidably connected with telescopic bins, and the top surfaces of the telescopic bins and the fixed bin are both in contact with the bottom surface of the circuit board. And dust filtering plates are arranged at the bottoms at intervals. Dust and other sundries on the surface of the circuit board and in the through holes of the circuit board are cleaned through negative pressure in the negative pressure bin, effective cleaning of the circuit board is achieved, and meanwhile the static electricity removing roller makes contact with the surface of the cleaned circuit board, so that a better static electricity removing effect is achieved.

Description

Technical Field

[0001] The present invention relates to the field of printed circuits, and specifically to a dust removal and anti-static device for circuit board chip mounting. Background Art

[0002] Surface mount technology for electronic circuits, also known as surface mounting or surface mount technology, is a circuit assembly technology in which surface mount components without pins or short leads are mounted on the surface of a printed circuit board or other substrates and soldered and assembled by methods such as reflow soldering or dip soldering.

[0003] The existing circuit board chip mounting process includes solder paste printing, component mounting, reflow soldering, optical inspection, repair, and board splitting in sequence. Before the solder paste printing process, it is necessary to keep the circuit board surface clean, clean foreign matters such as fine board chips, dust, fibers, hairs, skin debris, and tiny metal particles on the circuit board surface, and eliminate soldering defects such as false soldering, void soldering, warping, and skewing in advance, so as to improve product quality.

[0004] Chinese Patent with the related publication number CN221017502U discloses a PCB drum dust removal and static elimination device for SMT lines, including a touch screen, a rubber roller cleaning bin, a brush support bin, a terminal block, a PLC, a relay, and an ion wind bar. The touch screen is set on the surface of the device; the brush support bin is set inside the middle of the device, and an anti-static brush drum is set inside the brush support bin; the rubber roller cleaning bin is set inside the upper part of the elimination device, and a sticky dust paper roll and a transmission guide rail are set inside the rubber roller cleaning bin. The transmission guide rail is set on the top of the anti-static brush drum; a front dust removal rubber roller and a rear dust removal rubber roller are respectively set at the inlet end and the outlet end of the transmission guide rail; the sticky dust paper roll is set above the front dust removal rubber roller and the rear dust removal rubber roller and is tangent to the two; the relay, the PLC, and the terminal block are set inside the bottom of the device; the ion wind bar is installed above the outlet of the transmission guide rail.

[0005] In view of the above related technologies, the punching process of the circuit board in the prior art is generally completed before solder paste printing. The diameters of the holes on the circuit board for inserting components or playing a conduction role are different, and there may also be a small amount of dust or other impurities in some holes. The method of adhering impurities in the prior art is difficult to effectively clean the holes in the circuit board, and a small amount of impurities existing in the holes of the circuit board are likely to cause soldering defects in the subsequent component mounting process, ultimately affecting the chip mounting quality of the circuit board. In summary, the existing dust removal and anti-static devices for circuit board chip mounting are difficult to effectively clean the holes in the circuit board. Summary of the Invention

[0006] Based on this, the object of the present invention is to provide a dust removal and anti-static device for circuit board patching, so as to solve the technical problem that the existing dust removal and anti-static device for circuit board patching is difficult to effectively clean the inside of the holes of the circuit board.

[0007] To achieve the above object, the present invention provides the following technical solution: A dust removal and anti-static device for circuit board patching, including a box body, a negative pressure chamber is installed inside the box body, and conveying mechanisms for conveying circuit boards are arranged at both ends of the negative pressure chamber. One side of the negative pressure chamber is rotatably connected with an anti-static roller for contacting the surface of the circuit board. It also includes a negative pressure chamber. Sealing plates are slidably connected to both sides of the bottom of the negative pressure chamber. The sealing plates are fixedly connected with inclined push plates. After the circuit board contacts the push plates, the sealing plates can slide towards both sides of the negative pressure chamber. The distance between the two sliding sealing plates is the same as the width of the circuit board. An elastic reset mechanism is arranged between the sealing plates and the inner wall of the negative pressure chamber. It also includes a fixed chamber. Telescopic chambers are slidably connected to both ends of the fixed chamber. The ends of the telescopic chambers are slidably connected to the sealing plates in the vertical direction. The top surfaces of the telescopic chambers and the fixed chamber are both in contact with the bottom surface of the circuit board, and dust filter plates are arranged at intervals at the bottom.

[0008] By adopting the above technical solution, the negative pressure in the negative pressure chamber is used to clean the dust and other sundries on the surface of the circuit board and in the through holes of the circuit board, so as to achieve effective cleaning of the circuit board. At the same time, the anti-static roller is used to contact the surface of the circuit board after cleaning to achieve a better static electricity removal effect.

[0009] The present invention is further arranged as follows: Guide columns are fixedly connected to the bottom end of the negative pressure chamber along the width direction. The mutually close ends of the two sealing plates are slidably connected to the guide columns. Springs are arranged between the ends of the sealing plates and the inner wall of the negative pressure chamber. Guide rods are fixedly connected to the top surfaces of the sealing plates. The guide rods respectively pass through both sides of the negative pressure chamber and are slidably connected to the side walls of the negative pressure chamber. The top surfaces of the sealing plates are in close contact with the bottom surface of the negative pressure chamber.

[0010] Preferably, the guide rods and the guide columns together play a role in guiding the sealing plates, so that both ends of the sealing plates covering the air inlet position of the negative pressure chamber have support structures to ensure the airtight effect of the sealing plates.

[0011] The present invention is further arranged as follows: Driving rollers parallel to the sliding direction of the sealing plates are rotatably arranged at both ends of the negative pressure chamber inside the box body. The rotating shafts of the driving rollers are connected with driving components. A lifting table is arranged below the driving rollers inside the box body. A compression spring is arranged inside the lifting table, and a driven roller is slidably connected in the vertical direction. The driven roller is parallel to and in contact with the driving roller. The bottom surface of the driving roller is lower than the bottom surface of the negative pressure chamber. The bottom end of the negative pressure chamber is not in contact with the surface of the circuit board.

[0012] Preferably, the circuit board is conveyed by utilizing the friction force between the driving roller and the driven roller.

[0013] The present invention is further configured such that both sides of the negative pressure chamber are rotatably connected to a rotating rod, an anti-static roller is rotatably connected between the ends of the rotating rod, and both sides of the negative pressure chamber are fixedly connected to limit blocks for limiting the rotation of the rotating rod. When the rotating rod contacts the limit block, the bottom end of the anti-static roller is lower than the top surface of the circuit board.

[0014] Preferably, the anti-static roller connected to the rotating rod contacts the surface of the circuit board to remove static electricity that may be carried on the surface of the circuit board.

[0015] The present invention is further configured such that the position of the closing plate near the telescopic bin is provided with an upward-pointing lifting rod, and the position of the push plate near the negative pressure bin is rotatably connected to a pressure switch. When the spacing of the closing plates is the same as the width of the circuit board, the pressure switch is pressed down. The pressure switch is used to control the raising of the lifting rod, and a reset torsion spring is provided in the rotating shaft.

[0016] Preferably, the lifting rod raises the telescopic bin and the fixed bin so that the top surfaces of the telescopic bin and the fixed bin contact the bottom surface of the circuit board, thereby preventing the airflow passing through the through holes of the circuit board from bringing external dust and impurities into the through holes of the circuit board.

[0017] The present invention is further configured such that fixed brushes are provided at both ends of the fixed bin facing the bottom surface of the telescopic bin, and a connecting frame is fixedly connected to the bottom surface of the telescopic bin near the sealing plate, and the connecting frame extends to the other end of the telescopic bin and is connected to a movable brush facing the bottom surface of the fixed bin.

[0018] Preferably, the fixed brush and the movable brush clean the dust filter plate when the telescopic bin is extended or retracted.

[0019] The present invention is further configured such that a sliding groove is fixedly connected to the bottom surface of the fixed bin, and both ends of the movable brush are slidably connected in the sliding groove.

[0020] Preferably, the sliding groove guides the movable brush to prevent the movable brush from being out of contact with the bottom surface of the fixed bin due to the deflection and deformation of the connecting frame.

[0021] The present invention is further configured such that the negative pressure bin is tilted, and a bin cover is connected to the bottom surface of the tilted portion, and collecting strips for collecting dust and debris are connected to the inner wall of the bin cover at intervals along the height direction.

[0022] Preferably, the collecting strips in the compartment cover can effectively collect some of the heavier dust and debris to prevent them from falling back onto the circuit board.

[0023] In summary, the present invention mainly has the following beneficial effects: The present invention adjusts the air inlet of the negative pressure chamber to the same width as the circuit board by sliding the sealing plate, and provides an air intake filter structure that can fit with the circuit board on the bottom surface of the circuit board. The negative pressure in the negative pressure chamber is used to clean the dust and other debris on the surface of the circuit board and in the through-holes of the circuit board, thereby achieving effective cleaning of the circuit board. At the same time, the anti-static roller is used to contact the cleaned surface of the circuit board to achieve a better static electricity removal effect.

[0024] The present invention uses an obliquely arranged push plate to contact the edge of the circuit board, and uses the moving circuit board to push the push plate and the closing plate to slide, thereby achieving the adaptation of the negative pressure chamber air inlet of different widths according to the width of the circuit board, avoiding the reduction of the air flow speed at the circuit board through-hole due to the large-area air inlet at both ends of the negative pressure chamber, and while adapting to the width of the circuit board, the air flow speed passing through the circuit board through-hole is increased as much as possible, so as to better remove dust and impurities that may exist in the circuit board through-hole, and achieve more thorough cleaning of the circuit board; The present invention connects the telescopic bin with the sealing plate, so that the telescopic bin is slidably connected to the fixed bin. When the sealing plate slides to adjust its position, the telescopic bin is driven to extend and retract, so that the sum of the lengths of the telescopic bin and the fixed bin is equal to the width of the air inlet of the negative pressure bin. The top surfaces of the telescopic bin and the fixed bin are in contact with the bottom surface of the circuit board, which has a certain filtering effect on the intake air flow of the negative pressure bin, effectively preventing external dust or other debris from being affected by the intake air flow and being stuck in the through-holes of the circuit board when passing through the through-holes of the circuit board, thereby further improving the cleaning effect of the circuit board. The present invention provides fixed brushes at the bottom of both ends of the fixed bin and connects a movable brush to the bottom end of the telescopic bin. During each extension and retraction of the telescopic bin, the fixed brushes can clean the dust filter plate on the bottom of the telescopic bin, while the movable brush simultaneously cleans the dust filter plate on the bottom of the fixed bin, effectively avoiding the problem of dust filter plate being clogged by dust and ensuring the flow rate of the airflow of the negative pressure bin through the through-holes of the circuit board. The present invention provides an inclined negative pressure bin structure, with a bin cover detachably connected to the bottom surface of the inclined part of the negative pressure bin, and collection strips for accommodating some large dust or debris are arranged at intervals along the height direction of the bin cover, so as to prevent such dust or debris from colliding with the inner wall of the negative pressure airflow channel under the influence of the negative pressure airflow and falling back onto the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A perspective view of the present invention; Figure 2 This is a three-dimensional diagram of the internal structure of the box body in the state of cleaning the circuit board of the present invention; Figure 3 For the present invention Figure 2 A magnified view of middle A; Figure 4Stereogram of the internal structure of the box body in the state where the circuit board of the present invention has not been cleaned; Figure 5 of the present invention Figure 4 Enlarged view of B in; Figure 6 Side view of the internal structure of the box body in the state where the circuit board of the present invention has been cleaned; Figure 7 Stereogram of the internal structure of the negative pressure chamber of the present invention; Figure 8 of the present invention Figure 7 Enlarged view of C in; Figure 9 Stereogram of the sealing plate, pushing plate and telescopic chamber of the present invention; Figure 10 of the present invention Figure 9 Enlarged view of D in; Figure 11 Stereogram of the telescopic chamber and the fixed chamber of the present invention; Figure 12 Stereogram of the lid of the present invention; Figure 13 of the present invention Figure 12 Enlarged view of E in.

[0026] Explanation of reference numerals: 1. Box body; 101. Through port; 2. Negative pressure chamber; 201. Limit block; 202. Negative pressure interface; 3. Lid; 301. Collection strip; 4. Sealing plate; 5. Pushing plate; 501. Vertical sliding groove; 6. Fixed chamber; 7. Telescopic chamber; 701. Vertical sliding block; 8. Guide post; 9. Spring; 10. Guide rod; 11. Rotating rod; 12. Static elimination roller; 13. Fixed brush; 14. Connecting frame; 15. Moving brush; 16. Sliding groove; 17. Dust filter plate; 18. Pressure switch; 19. Jacking rod; 20. Driving roller; 21. Lifting platform; 22. Driven roller; 23. Circuit board body. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as limiting the present invention.

[0028] Next, the embodiments of the present invention will be described according to the overall structure of the present invention. Embodiment 1

[0029] A dust removal and anti-static device for circuit board patching, please refer to Figure 1-13, including a box body 1. Specifically, the box body 1 can be installed between the screen printer and the board loading machine on the circuit board chip mounting production line. The circuit board sent out by the board loading machine is sent into the screen printer for subsequent processing after dust removal and static elimination in the box body 1. A negative pressure chamber 2 is installed in the box body 1, and conveying mechanisms for conveying the circuit board are arranged at both ends of the negative pressure chamber 2. A negative pressure interface 202 extending out of the box body 1 is arranged at the top end of the negative pressure chamber 2, and the negative pressure interface 202 is used to connect a negative pressure dust collection pipeline. An electrostatic elimination roller 12 for contacting the surface of the circuit board is rotatably connected to one side of the negative pressure chamber 2; It further includes a negative pressure chamber 2. Sealing plates 4 are slidably connected to both sides of the bottom of the negative pressure chamber 2. The top surface of the sealing plate 4 contacts the bottom surface of the negative pressure chamber 2. The sealing plate 4 is further closely attached to the bottom surface of the negative pressure chamber 2 under the negative pressure state in the negative pressure chamber 2. The sealing plate 4 is fixedly connected with an inclined push plate 5. After the circuit board contacts the push plate 5, the sealing plate 4 can slide towards both sides of the negative pressure chamber 2 to adapt to circuit boards of different widths. The distance between the two sliding sealing plates 4 is the same as the width of the circuit board. An elastic reset mechanism is arranged between the sealing plate 4 and the inner wall of the negative pressure chamber 2. Under the elastic force of the elastic reset structure, the sealing plate 4 is closely attached to the side surface of the circuit board; It further includes a fixed chamber 6. Telescopic chambers 7 are slidably connected to both ends of the fixed chamber 6. The telescopic chamber 7 is slidably connected to the fixed chamber 6 along its own length direction. When the telescopic chamber 7 moves up and down, the fixed chamber 6 will also move up and down synchronously. The end of the telescopic chamber 7 is slidably connected to the sealing plate 4 in the vertical direction. The top surfaces of the telescopic chamber 7 and the fixed chamber 6 both contact the bottom surface of the circuit board, and filter dust plates 17 are arranged at intervals at the bottom to prevent external dust and sundries from entering the through holes of the circuit board due to the influence of air flow.

[0030] In the above embodiment, specifically, please refer to again Figure 7-8 , a guiding column 8 is fixedly connected to the bottom end inside the negative pressure chamber 2 along the width direction. The mutually approaching ends of the two sealing plates 4 are slidably connected to the guiding column 8. A spring 9 is arranged between the end of the sealing plate 4 and the inner wall of the negative pressure chamber 2. During the process that the push plate 5 is pushed by the circuit board and the sealing plates 4 move away from each other, the spring 9 is in a further compressed state, and elastic potential energy is accumulated in the spring 9 in this state.

[0031] Furthermore, guiding rods 10 are fixedly connected to the top surfaces of the sealing plates 4. The guiding rods 10 respectively pass through both sides of the negative pressure chamber 2 and are relatively slidably connected to the side walls of the negative pressure chamber 2. The top surface of the sealing plate 4 is in close contact with the bottom surface of the negative pressure chamber 2. The guiding rods 10 and the guiding column 8 together play a role in guiding the sealing plate 4, so that both ends of the sealing plate 4 blocking the air inlet position of the negative pressure chamber 2 have a support structure to ensure the airtight effect of the sealing plate 4.

[0032] In the above embodiment, specifically, please refer to again Figure 1-3 and Figure 6, inside the box body 1, driving rollers 20 parallel to the sliding direction of the sealing plate 4 are rotatably arranged at both ends of the negative pressure chamber 2. The rotating shaft of the driving roller 20 is connected with a driving component. Specifically, the driving component is a driving motor, which is specifically installed on the outer wall of the box body 1, and the output shaft of the driving motor is coaxial with the driving roller 20.

[0033] Further, a lifting platform 21 is arranged below the driving roller 20 inside the box body 1. A compression spring is arranged inside the lifting platform 21, and a driven roller 22 is slidably connected along the vertical direction. Specifically, the lifting platform 21 includes a fixed part fixedly connected to the box body 1 and a sliding part slidably connected inside the fixed part along the vertical direction. A compression spring in a compressed state all the time is arranged between the sliding part and the inner wall of the fixed part. The driven roller 22 is rotatably connected between the sliding parts of the two lifting platforms 21. The driven roller 22 is parallel to and in contact with the driving roller 20. When the circuit board touches the driving roller 20 and the driven roller 22, the driven roller 22 will be pressed down, so that the driven roller 22 and the driving roller 20 are respectively in close contact with the bottom surface and the top surface of the circuit board.

[0034] Specifically, the bottom surface of the driving roller 20 is lower than the bottom surface of the negative pressure chamber 2, and the bottom end of the negative pressure chamber 2 does not contact the surface of the circuit board, so as to avoid the negative pressure chamber 2 rubbing against the surface of the circuit board. The friction between the driving roller 20 and the driven roller 22 is used to realize the conveying of the circuit board. In this embodiment, the lengths of the driving roller 20 and the driven roller 22 are equal to the width of the negative pressure chamber 2, and a total of two groups are arranged at both ends of the negative pressure chamber 2 respectively. In other unpublished embodiments, in order to further improve the conveying effect of the circuit board and avoid the circuit board from being bent and deformed, multiple conveying structures composed of the driving roller 20 and the driven roller 22 can be arranged, and the lengths can also be different from the width of the negative pressure chamber 2. Embodiment Two

[0035] A dust removal and anti-static device for circuit board soldering, please refer to Figure 1-13 , on the basis of the first embodiment, the difference from the first embodiment is that rotating rods 11 are rotatably connected to both sides of the negative pressure chamber 2, and an anti-static roller 12 is rotatably connected between the ends of the rotating rods 11. Specifically, the surface of the anti-static roller 12 can conduct electricity, and a conductive slip ring is arranged at the connection with the rotating rod 11. The anti-static roller 12 is grounded through a grounding wire, so that the static electricity on the surface of the circuit board body 23 can be guided to the ground by the anti-static roller 12, thereby eliminating the static electricity that the circuit board body 23 may carry.

[0036] Further, two sides of the negative pressure chamber 2 are fixedly connected with limiting blocks 201 that restrict the rotation of the rotating rod 11. When the rotating rod 11 contacts the limiting block 201, the bottom end of the static eliminator roller 12 is lower than the top surface of the circuit board. After the circuit board contacts the static eliminator roller 12, the static eliminator roller 12 will be lifted up, and the rotating rod 11 rotates to disengage from the contact with the limiting block 201. The static eliminator roller 12 fully contacts the surface of the cleaned circuit board body 23 under its own gravity, effectively avoiding the phenomenon of poor contact between the static eliminator roller 12 and the circuit board body. The surface of the circuit board contacted by the static eliminator roller 12 connected to the rotating rod 11 can conduct the static electricity that the circuit board surface may carry. Embodiment III

[0037] A dust removal and anti-static device for circuit board soldering, please refer to Figure 1-13 On the basis of the second embodiment, the difference from the second embodiment is that a jacking rod 19 facing upward is arranged at a position of the sealing plate 4 close to the telescopic chamber 7. The jacking rod 19 is a pneumatic telescopic rod, and an electric telescopic rod or a hydraulic rod can also be used in other undisclosed embodiments. A pressure switch 18 is rotatably connected at a position of the push plate 5 close to the negative pressure chamber 2. A vertical chute 501 is arranged on the sealing plate 4 in the direction towards the telescopic chamber 7. A vertical slider 701 is fixedly connected to the telescopic chamber 7 in the direction towards the sealing plate 4. The vertical slider 701 is slidably connected in the vertical chute 501 in the vertical direction.

[0038] Specifically, please refer to Figure 1-3 and Figure 9-10 When the distance between the sealing plates 4 is the same as the width of the circuit board, the pressure switch 18 is pressed down. The pressure switch 18 is used to control the lifting of the jacking rod 19, and a reset torsion spring is arranged in the rotating shaft. When the circuit board leaves the area between the sealing plates 4, the sealing plates 4 move towards each other and reset under the elastic potential energy accumulated by the spring 9. At the same time, the pressure switch 18 returns to the open state under the action of the reset torsion spring, causing the jacking rod 19 to retract, and the heights of the fixed chamber 6 and the telescopic chamber 7 decrease. When the next circuit board body 23 arrives, the pressure switch 18 is pressed down, and the jacking rod 19 will extend again to adapt to circuit board bodies 23 of different thicknesses.

[0039] Further, when the jacking rod 19 extends, it can lift the telescopic chamber 7 and the fixed chamber 6, so that the top surfaces of the telescopic chamber 7 and the fixed chamber 6 contact the bottom surface of the circuit board, avoiding the outside air flow passing through the through holes of the circuit board from bringing external dust and impurities into the through holes of the circuit board. Embodiment IV

[0040] A dust removal and anti-static device for circuit board soldering, please refer to Figure 1-13, based on the third embodiment, the difference from the third embodiment is that fixed brushes 13 are arranged at both ends of the fixed bin 6 facing the bottom surface of the telescopic bin 7. The fixed brushes 13 are used to clean the dust filter plate 17 on the bottom surface of the telescopic bin 7. A connecting frame 14 is fixedly connected to the bottom surface of the telescopic bin 7 near the sealing plate 4. The connecting frame 14 extends to the other end of the telescopic bin 7 and is connected to a moving brush 15 facing the bottom surface of the fixed bin 6. The moving brush 15 is used to clean the dust filter plate 17 on the bottom surface of the fixed bin 6. The fixed brushes 13 and the moving brush 15 play a role in cleaning the dust filter plate 17 when the telescopic bin 7 expands and contracts, ensuring the ventilation efficiency of the dust filter plate 17, and increasing the air flow velocity through the through holes of the circuit board as much as possible on the premise that the negative pressure in the negative pressure bin 2 is inconvenient, so as to achieve a better cleaning effect on the through holes of the circuit board.

[0041] In the above embodiment, specifically, please refer to Figure 4-5 and Figure 9-11 , a sliding groove 16 is fixedly connected to the bottom surface of the fixed bin 6. Both ends of the moving brush 15 are slidably connected in the sliding groove 16. There is no mutual interference between the connecting frame 14 and the sliding groove 16. The sliding groove 16 plays a guiding role for the moving brush 15, avoiding the moving brush 15 from detaching from the contact with the bottom surface of the fixed bin 6 due to the flexural deformation of the connecting frame 14. Embodiment Five

[0042] A dust removal and anti-static device for circuit board soldering, please refer to Figure 1-13 , based on the fourth embodiment, the difference from the fourth embodiment is that the negative pressure bin 2 is inclined, and a bin cover 3 is connected to the bottom surface of the inclined part. The inner wall of the bin cover 3 is connected with dust collection strips 301 for collecting dust and sundries at intervals in the height direction.

[0043] Specifically, when the pressure in the negative pressure bin 2 changes, some heavier dust and sundries may fall due to reasons such as colliding with the inner wall of the negative pressure bin 2 or the reduction of air flow velocity. The dust collection strips 301 in the bin cover 3 can effectively collect some heavier dust and sundries, preventing them from falling back onto the circuit board, thereby further improving the cleaning effect of the circuit board. After a period of dust removal and anti-static work on the circuit board, the bin cover 3 can be disassembled for cleaning. At the same time, after the bin cover 3 is disassembled, the internal structure of the negative pressure bin 2 is exposed, which is also convenient for repairing or cleaning the inside of the negative pressure bin 2.

[0044] When the present invention is working specifically: the circuit board is inserted into the box body 1 from the through port 101 of the box body 1. Under the conveyance of the conveying mechanism, the circuit board pushes the push plate 5 to slide towards both sides of the sealing plate 4, and finally makes the width of the air inlet at the bottom of the negative pressure chamber 2 the same as the width of the circuit board. During this process, both sides of the circuit board will press down the pressure switch 18 to raise the jacking rod 19. The fixed chamber 6 and the telescopic chamber 7 are pressed against the bottom surface of the circuit board under the action of the jacking rod 19. The airflow generated by the negative pressure in the negative pressure chamber 2 makes the dust and debris on the surface of the circuit board and in the through holes of the circuit board move upward. The dust filter plates 17 on the bottom surfaces of the telescopic chamber 7 and the fixed chamber 6 effectively filter the dust and debris carried by the airflow passing through the through holes of the circuit board, preventing the dust and debris in the external air from entering the through holes, and at the same time effectively cleaning the surface and through holes of the circuit board. The surface of the cleaned circuit board contacts the static elimination roller 12, and the static electricity that may be carried on the surface of the circuit board is guided and eliminated by the static elimination roller 12, completing the dust removal and static elimination work before the solder paste printing of the circuit board.

[0045] Although the embodiments of the present invention have been shown and described, the specific embodiments are only explanations of the present invention and not limitations thereof. The specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can make modifications, substitutions and variations without creative contributions to the embodiments as needed, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A dust removal and anti-static device for circuit board soldering, characterized in that, include: A box body (1), wherein a negative pressure chamber (2) is installed in the box body (1), and conveying mechanisms for conveying circuit boards are provided at both ends of the negative pressure chamber (2), and a static-eliminating roller (12) for contacting the surface of the circuit board is rotatably connected to one side of the negative pressure chamber (2); A negative pressure bin (2), wherein both sides of the bottom of the negative pressure bin (2) are slidably connected to a sealing plate (4), the sealing plate (4) is fixedly connected to an inclined push plate (5), and the sealing plate (4) can slide toward both sides of the negative pressure bin (2) after the circuit board contacts the push plate (5), and the spacing between the two sealing plates (4) after sliding is the same as the width of the circuit board, and an elastic reset mechanism is provided between the sealing plate (4) and the inner wall of the negative pressure bin (2); A fixed bin (6), both ends of the fixed bin (6) are slidably connected to a telescopic bin (7), the end of the telescopic bin (7) is slidably connected to the sealing plate (4) along the vertical direction, the top surfaces of the telescopic bin (7) and the fixed bin (6) are in contact with the bottom surface of the circuit board, and dust filter plates (17) are spaced apart at the bottom.

2. The dust removal and antistatic device for circuit board patch according to claim 1, characterized in that: The bottom end of the negative pressure bin (2) is fixedly connected to a guide column (8) along the width direction, and the ends of the two sealing plates (4) close to each other are slidably connected to the guide column (8), and a spring (9) is provided between the end of the sealing plate (4) and the inner wall of the negative pressure bin (2). The top surface of the sealing plate (4) is fixedly connected to a guide rod (10), and the guide rod (10) passes through both sides of the negative pressure bin (2) and is relatively slidably connected to the side wall of the negative pressure bin (2). The top surface of the sealing plate (4) is in close contact with the bottom surface of the negative pressure bin (2).

3. The dust removal and anti-static device for circuit board soldering pads according to claim 1, characterized in that: Drive rollers (20) are rotatably provided at both ends of the negative pressure bin (2) in the box body (1) and are parallel to the sliding direction of the sealing plate (4). The rotating shaft of the drive roller (20) is connected to a drive assembly. A lifting platform (21) is provided below the drive roller (20) in the box body (1). A compression spring is provided in the lifting platform (21) and a driven roller (22) is slidably connected in the vertical direction. The driven roller (22) and the drive roller (20) are parallel to and in contact with each other. The bottom surface of the drive roller (20) is lower than the bottom surface of the negative pressure bin (2), and the bottom end of the negative pressure bin (2) does not contact the surface of the circuit board.

4. The dust removal and anti-static device for circuit board patching according to claim 3, characterized in that: Both sides of the negative pressure chamber (2) are rotatably connected to a rotating rod (11), and an anti-static roller (12) is rotatably connected between the ends of the rotating rod (11). Both sides of the negative pressure chamber (2) are fixedly connected to limit blocks (201) for limiting the rotation of the rotating rod (11), and when the rotating rod (11) contacts the limit blocks (201), the bottom end of the anti-static roller (12) is lower than the top surface of the circuit board.

5. The dust removal and antistatic device for circuit board patch according to claim 1, characterized in that: The sealing plate (4) is provided with an upward-facing lifting rod (19) at a position close to the telescopic bin (7), and the push plate (5) is rotatably connected to a pressure switch (18) at a position close to the negative pressure bin (2). When the spacing between the sealing plates (4) is the same as the width of the circuit board, the pressure switch (18) is pressed down. The pressure switch (18) is used to control the lifting rod (19) to rise, and a reset torsion spring is provided in the rotating shaft.

6. The dust removal and anti-static device for circuit board patching according to claim 1, wherein: Both ends of the fixed bin (6) are provided with fixed brushes (13) facing the bottom surface of the telescopic bin (7). A connecting frame (14) is fixedly connected to the bottom surface of the telescopic bin (7) near the sealing plate (4). The connecting frame (14) extends to the other end of the telescopic bin (7) and is connected with a moving brush (15) facing the bottom surface of the fixed bin (6).

7. The dust removal and antistatic device for circuit board patch according to claim 6, characterized in that: A sliding groove (16) is fixedly connected to the bottom surface of the fixed bin (6). Both ends of the moving brush (15) are slidably connected in the sliding groove (16).

8. The dust removal and anti-static device for circuit board patching according to claim 1, wherein: The negative pressure bin (2) is inclined, and a bin cover (3) is connected to the bottom surface of the inclined part. Collection strips (301) for collecting dust and sundries are connected to the inner wall of the bin cover (3) at intervals in the height direction.

Images