Induction coil structure adjusting assembly and plasma processing equipment

Abstract

The invention relates to the technical field of plasma processing equipment, and provides an induction coil structure adjusting assembly and plasma processing equipment. The assembly includes an induction coil construction device, a magnetic sensor array, and a drive mechanism. The device comprises a first coil segment group and a second coil segment group, the first coil segment group and the second coil segment group are constructed into two groups of coil segments which are formed by a plurality of annular coil pieces which are concentrically arranged and are symmetrically separated in at least one direction in a one-to-one manner; each connector is arranged to be capable of moving to the connecting part between the electrically-connected segment groups, so that the electrically-connected coil segments form an induction coil; the magnetic sensor array is matched to detect the magnetic field intensity distribution of the target area of the induction coil, the drive mechanism is used to adjust the segment connected with the connector, the induction coils of different sizes and structures are flexibly constructed to adapt to different processes, the efficiency is improved, and the magnetic field intensity distribution of the target area is adjusted according to requirements.

Description

Technical Field

[0001] The present disclosure relates to the technical field of plasma processing equipment, and particularly to an induction coil structure adjustment component and a plasma processing equipment. Background Art

[0002] Semiconductor processing equipment such as inductively coupled plasma (ICP) or capacitively coupled plasma (CCP) usually adopts the method of connecting an induction coil wound in a spiral plane to a radio frequency source to generate a high-concentration plasma for etching a wafer to be processed.

[0003] However, for different wafer sizes or different processes (such as Si, SiO2, SiC, etc.), induction coils with different sizes or structures need to be adapted to achieve better process effects. For this reason, it is usually necessary to replace the coil. Therefore, it is very difficult for a machine tool of a device to quickly switch between different processes due to reasons such as replacing the induction coil and re-adjusting the impedance of the machine tool after replacing the induction coil, resulting in low switching efficiency. In addition, during the device research and development stage, it is necessary to continuously try and error to find a suitable induction coil that can achieve better process effects. However, the current operation method of replacing the induction coil will slow down the research and development progress of semiconductor processing equipment and result in low efficiency. Summary of the Invention

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present disclosure is to provide an induction coil structure adjustment component and a plasma processing equipment, so as to solve the efficiency problem caused by the need to replace the induction coil according to different processes in the related art.

[0005] According to a first aspect of the present disclosure, there is provided an induction coil construction device for constructing an induction coil in a plasma processing device; the induction coil construction device comprises: at least a first coil segment group and a second coil segment group; wherein the first coil segment group and the second coil segment group are constructed as two pairs of coil segments formed by a plurality of concentrically arranged annular coil members symmetrically separated in at least one direction; each of the coil segments forms at least a connection portion at both ends; and at least one connector; each of the connectors is configured to be movable to electrically connect a connection portion of the first coil segment group and a connection portion of the second coil segment group, respectively, so that each electrically connected connection portion is electrically connected. The coil segments constitute an induction coil; a magnetic sensor array is arranged on a side of the induction coil structure device that is away from the reaction chamber in the plasma processing equipment, and is mirror-symmetrical on both sides of the induction coil structure device relative to a target area in the reaction chamber that is affected by the magnetic field of the induction coil; the magnetic sensor array includes: a plurality of magnetic sensors, evenly distributed in a radial plane parallel to the induction coil, for detecting and obtaining the magnetic field intensity distribution of the target area in the radial direction in a mirror-symmetrical manner; a driving mechanism for controlling the operation of disconnecting / connecting the coil segments connected to the connector to the induction coil, and changing the structural distribution density of the induction coil to correspondingly adjust the magnetic field intensity distribution.

[0006] In an embodiment of the first aspect, the operation of disconnecting / connecting the coil segment connected to the connector to the induction coil, and changing the structural distribution density of the induction coil to correspondingly adjust the magnetic field strength distribution, includes: avoiding or connecting the radial coil segment to the induction coil by operating the connector to adjust the magnetic field strength distribution at the corresponding radial position of the induction coil.

[0007] In an embodiment of the first aspect, operating the coil segment connected to the connector to disconnect or connect to the induction coil, and changing the structural distribution density of the induction coil to correspondingly adjust the magnetic field intensity distribution, includes: operating the connector to select to avoid or connect the coil segments in the target coil segment group, and changing the structural distribution density of the target coil segment group to adjust the magnetic field intensity distribution relationship of the sub-region to be measured affected by the target coil segment group relative to other regions.

[0008] In an embodiment of the first aspect, the coil segments in the first coil segment group and the second coil segment group that are not connected to the induction coil are reserved for use.

[0009] In an embodiment of the first aspect, the coil segments form the connection portion at at least one end.

[0010] In an embodiment of the first aspect, the coil segments form at least one connection between two ends.

[0011] In an embodiment of the first aspect, the connecting portions on each coil segment in each coil segment group are arranged along one or more radial straight lines.

[0012] In an embodiment of the first aspect, the connection manner between the connecting portions on the coil segments in the first coil segment group and the second coil segment group includes one of the following: 1) A paired connection is formed between the connecting portion of at least one coil segment and the connecting portion at the proximal end on its paired coil segment through at least one connector; 2) An adjacent variable diameter connection is formed between a connecting portion of at least one coil segment and a connecting portion at the proximal end on a radially adjacent coil segment in the coil segment group where its paired coil segment is located through at least one connector; 3) An alternating variable diameter connection is formed between a connecting portion of at least one coil segment and a connecting portion at the proximal end on a radially spaced coil segment in the coil segment group where its paired coil segment is located through at least one connector; 4) An intra-group adjacent connection is formed between the adjacent connecting portions at the proximal ends on two adjacent coil segments belonging to the same coil segment group through a connector; 5) An intra-group alternating connection is formed between the alternating connecting portions on two adjacent coil segments belonging to the same coil segment group through a connector.

[0013] In an embodiment of the first aspect, the induction coil is constructed in at least one of the following ways: 1) One end connecting portions of at least some of the radially adjacent / alternating coil segments in the first coil segment group and the second coil segment group form paired connections, and the other end connecting portions form adjacent variable diameter connections / alternating variable diameter connections to construct the induction coil; 2) One end connecting portions of at least some of the coil segments in the first coil segment group and the second coil segment group form adjacent variable diameter connections / alternating variable diameter connections, and the other end connecting portions form adjacent variable diameter connections / alternating variable diameter connections to construct the induction coil; 3) Adjacent variable diameter connections of the two end connecting portions are alternately and sequentially performed between at least some of the coil segments in the first coil segment group and the second coil segment group to constitute two complementary sub-coils along the circumference to form an induction coil; 4) The coil segments in different radial regions of the first coil segment group and the second coil segment group are respectively conductively connected to form at least two sub-coils arranged inside and outside in the radial direction to form an induction coil.

[0014] In an embodiment of the first aspect, the coil segments not connected to the radio frequency source are reserved for future use or removed; and / or, the coil segments in the first coil segment group and the second coil segment group are semi-circular arcs.

[0015] In an embodiment of the first aspect, the connecting portion includes a first connecting hole formed in the coil segment; the connector includes: a second connecting hole corresponding to the formation position of the first connecting hole, and a conductive member for combining and electrically contacting each pair of the first connecting hole and the second connecting hole at corresponding positions; and / or, the coil segment further includes at least one fixing hole for fixing to an attachment.

[0016] In an embodiment of the first aspect, the induction coil constructed by the induction coil constructing device is connected to an adjustable impedance unit to reduce the impedance change caused by the change of the constructed induction coil through the impedance adjustment of the adjustable impedance unit.

[0017] In an embodiment of the first aspect, the induction coil constructing device includes: a driving mechanism connected to and driving the connector to switch the connected connecting portion; a control device communicatively connected to the driving mechanism for controlling the driving mechanism to drive the connector to switch and connect to a target connecting portion in response to a trigger signal.

[0018] A second aspect of the present disclosure provides a plasma processing device, which is characterized by including: a reaction chamber; an induction coil structure adjustment component as described in any one of the first aspect.

[0019] As described above, the present disclosure relates to the technical field of plasma processing equipment, and provides an induction coil structure adjustment component and a plasma processing device. The component includes an induction coil constructing device, a magnetic sensor array, and a driving mechanism. The device includes a first coil segment group and a second coil segment group; the first coil segment group and the second coil segment group are configured as two groups of coil segments that are symmetrically separated in at least one direction by a plurality of concentrically arranged annular coil members in pairs; each connector is arranged to be movable to electrically connect to the connecting portion between the segment groups respectively, so that the electrically connected coil segments form an induction coil; cooperating with the magnetic sensor array to detect the magnetic field intensity distribution in the target area of the induction coil, and adjusting the segments connected by the connector through the driving mechanism to flexibly construct induction coils of different sizes and structures to adapt to different processes to improve efficiency and adjust the magnetic field intensity distribution in the target area according to requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic structural diagram of a plasma processing device in an embodiment of the present disclosure is shown.

[0021] Figure 2 A schematic structural diagram of an induction coil constructing device in an embodiment of the present disclosure is shown.

[0022] Figure 3 A schematic structural diagram of a connection manner formed between connecting portions through a connector in an embodiment of the present disclosure is shown.

[0023] Figure 4 Schematic diagram showing another connection method formed between connection parts through a connector in an embodiment of the present disclosure.

[0024] Figure 5 Schematic diagram showing yet another connection method formed between connection parts through a connector in an embodiment of the present disclosure.

[0025] Figure 6 Schematic diagram showing the connection structure of an induction coil construction device constructing an induction coil in an embodiment of the present disclosure.

[0026] Figure 7 Schematic diagram showing the connection structure of an induction coil construction device constructing an induction coil in another embodiment of the present disclosure.

[0027] Figure 8 Schematic diagram showing the connection structure of an induction coil construction device constructing an induction coil in another embodiment of the present disclosure.

[0028] Figure 9 Schematic diagram showing the connection structure of an induction coil construction device constructing induction coil 131 in still another embodiment of the present disclosure.

[0029] Figure 10 Schematic diagram showing the physical structure of a first coil assembly and a second coil assembly in an induction coil construction device in an embodiment of the present disclosure.

[0030] Figure 11 Show Figure 10 Schematic diagram of the induction coil constructed by the induction coil construction device in the embodiment.

[0031] Figure 12 Schematic diagram showing the structure of a first connector in an embodiment of the present disclosure.

[0032] Figure 13 Schematic diagram showing the structure of a second connector in an embodiment of the present disclosure.

[0033] Figure 14 Schematic diagram showing the induction coil constructed by the induction coil construction device in another embodiment of the present disclosure.

[0034] Figure 15 Simplified schematic diagram of the induction coil constructed by the induction coil construction device in another embodiment of the present disclosure.

[0035] Figure 16 Schematic diagram showing that the induction coil construction device in an embodiment of the present disclosure is applied to a plasma processing device and a magnetic sensor array is correspondingly arranged.

[0036] Figure 17A plan view showing the arrangement position relationship between the induction coil structure device and the magnetic sensor array in an embodiment of the present disclosure.

[0037] Figure 18 A schematic diagram showing that in an embodiment of the present disclosure, the induction coil structure is changed by the induction coil structure device to adjust the magnetic field intensity distribution in the target area.

[0038] Figure 19 A schematic diagram of the structure before change showing that in another embodiment of the present disclosure, the induction coil structure is changed by the induction coil structure device to adjust the magnetic field intensity distribution in the target area.

[0039] Figure 20 A schematic diagram of the structure after change showing that in another embodiment of the present disclosure, the induction coil structure is changed by the induction coil structure device to adjust the magnetic field intensity distribution in the target area.

[0040] Figure 21 A schematic diagram of the structure of a computer device in an embodiment of the present disclosure. Detailed implementation manners

[0041] The following uses specific specific examples to illustrate the implementation manners of the present disclosure. Those skilled in the art can easily understand other advantages and effects of the present disclosure from the information disclosed in the present disclosure. The present disclosure can also be implemented or applied in different specific implementation manners. Various details in the present disclosure can also be modified or changed according to different viewpoints and application scenarios without departing from the spirit of the present disclosure. It should be noted that, without conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0042] The following takes the drawings as a reference and details the embodiments of the present disclosure so that those skilled in the technical field to which the present disclosure belongs can easily implement it. The present disclosure can be embodied in many different forms and is not limited to the embodiments described herein.

[0043] In the description of the present disclosure, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics represented by the combination of the embodiment or example are included in at least one embodiment or example of the present disclosure. Moreover, the specific features, structures, materials, or characteristics represented can be combined in a suitable manner in any one or a group of embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples represented in the present disclosure and the features of different embodiments or examples.

[0044] Furthermore, the terms "first" and "second" are used for illustrative purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the representation of the present disclosure, the meaning of "a group" is two or more, unless otherwise specifically defined.

[0045] To clearly illustrate the present disclosure, devices irrelevant to the description are omitted, and the same or similar components throughout the specification are given the same reference numerals.

[0046] Throughout the specification, when it is said that a device is "connected" to another device, this includes not only the case of "direct connection" but also the case of "indirect connection" with other elements interposed therebetween. In addition, when it is said that a certain device "includes" a certain component, unless there is a particularly contrary record, it does not exclude other components but means that other components may also be included.

[0047] Although in some examples the terms first, second, etc. are used herein to denote various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first interface and the second interface, etc. are indicated. Furthermore, as used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms unless the context indicates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the stated features, steps, operations, elements, modules, items, kinds, and / or groups, but do not preclude the presence, occurrence or addition of one or a group of other features, steps, operations, elements, modules, items, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or meaning any one or any combination. Thus, "A, B or C" or "A, B and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A, B and C". An exception to this definition only occurs when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way.

[0048] The technical terms used herein are only used to refer to specific embodiments and are not intended to limit the present disclosure. The singular form used herein also includes the plural form as long as the statement does not clearly indicate the contrary meaning. The meaning of "including" used in the specification is to embody specific characteristics, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and / or components.

[0049] Although not defined differently, all terms used herein, including technical and scientific terms, have the same meanings as those generally understood by those skilled in the art to which this disclosure belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with relevant technical literature and the current message. Unless otherwise defined, they should not be overly interpreted as ideal or highly formalized meanings.

[0050] In related technologies, ICP or CCP equipment uses an induction coil connected to an RF source to generate plasma. However, to achieve optimal process results across different processes, the induction coil often needs to be replaced and re-debugged within the equipment, making it difficult to quickly switch between processes and inefficient. Furthermore, during the equipment development phase, continuous trial and error is required to explore optimal process results, and repeated induction coil replacement may be necessary, resulting in slow development progress and low R&D efficiency.

[0051] In view of this, an embodiment of the present disclosure provides an induction coil construction device that can be flexibly constructed to switch coils of different structures to try different processes, which can effectively solve the low efficiency problem of replacing induction coils in related technologies.

[0052] like Figure 1 , which is a schematic diagram showing an application scenario of the induction coil construction device described in one embodiment of the present disclosure.

[0053] exist Figure 1 , the structure of the plasma processing equipment 100 is shown. As an example, Figure 1 The plasma process equipment 100 is exemplified as an ICP equipment, but in other embodiments it may also be a CCP equipment or an equipment having both CCP and ICP functions, and the illustration is not limiting.

[0054] The plasma processing apparatus 100 includes a reaction chamber 110, within which is disposed a carrier 120 for placing a wafer. The top surface of the carrier 120 forms the placement surface for the wafer 400. For example, the carrier 120 may include an electrostatic chuck (ESC) or a heater. A process gas may flow into the reaction chamber 110.

[0055] The plasma process equipment 100 includes an induction coil 131, which can be connected to a radio frequency source and grounded to form a loop. The induction coil 131 generates a high-frequency electromagnetic field acting on the process gas by applying a radio frequency voltage from the radio frequency source, thereby forming a plasma to process (e.g., etch) the surface of a wafer through the plasma. In some examples, the induction coil 131 is connected to the radio frequency source 300 through a radio frequency matcher 200, and the radio frequency matcher 200 is used for impedance matching between the radio frequency source 300 and the induction coil 131 to provide maximum power transfer and system efficiency.

[0056] The induction coil 131 can be constructed by the induction coil construction device 130 in the embodiments of the present disclosure, and different-sized and differently-connected induction coils 131 can be flexibly overlapped and constructed. That is, through the induction coil construction device 130, multiple coil modes (i.e., different sizes, connection forms, etc.) can be switched to complete the compatibility with multiple processes, improving the flexibility of the production line and the efficiency of equipment R & D. In some embodiments, the time node for performing coil mode switching can be selected, for example, during equipment maintenance, during the process flow, or between two processes. The switching time is short and does not need to additionally occupy the normal working time of the equipment.

[0057] Optionally, the induction coil 131 can be grounded through an adjustable impedance unit 140. Since the induction coil construction device 130 can construct different induction coils 131, their impedances may be different. Therefore, the impedance adjustment of the adjustable impedance unit 140 is used to reduce the impedance change caused by the change of the constructed induction coil 131 to maintain impedance matching, thereby achieving maximum power transfer and system efficiency. If the induction coil 131 includes multiple independent sub-coils, each sub-coil can be grounded through a path of the adjustable impedance unit 140. In some embodiments, the adjustable impedance unit 140 can be implemented as an adjustable capacitor. Among them, a switch can also be provided in the loop where the induction coil 131 is located to turn on and off the power supply of one or more sub-coils.

[0058] The structure of the induction coil construction device 130 is exemplarily described below through embodiments.

[0059] As Figure 2 shown, a schematic structural diagram of an induction coil construction device in an embodiment of the present disclosure is shown.

[0060] The induction coil construction device 130 includes a first coil segment group 130a and a second coil segment group 130b. The first coil segment group 130a and the second coil segment group 130b are constructed as two pairs of coil segments 1310 that are symmetrically separated in at least one direction by a plurality of concentrically arranged annular coil members. Only two coil segments 1310 are marked in the figure, and the others not marked are all coil segments 1310. As an example,Figure 2 The coil segment group on the left side in the middle can be the first coil segment group 130a, Figure 2 and the coil segment group on the right side in the middle can be the second coil segment group 130b. As an example, in Figure 2 the coil segment 1310 is exemplarily shown as semi-circular arc-shaped. That is, the first coil segment group 130a and the second coil segment group 130b respectively include a group of semi-circular arc-shaped coil segments 1310 that are complementary to each other in circumference. Each two coil segments 1310 that are paired one by one are spaced apart, and the two ends of the coil segment 1310 are respectively corresponding to each other in position. For example, between the two coil segments 1310 with the smallest radius length in the figure (defined as the first coil segment 1310a and the second coil segment 1310b in the subsequent figure), the A end and the C end are corresponding in position, and the B end and the D end are corresponding in position.

[0061] At least one connection part for external conductive connection is formed on each of the coil segments 1310. Each of the coil segments 1310 can form the connection part at at least one end, for example, connection parts are formed at the A, B, C, and D ends. Thus, Figures 2 to 8 in the drawings, for the sake of simplified expression, the ends of the coil segment 1310 are used to represent the connection part alternatively, and the connection part is omitted from being marked. In some embodiments, the connection part can be implemented as a concave part (such as a hole, a groove, etc.) or a convex part (such as a convex column, a convex point, etc.), and the structure of the connection part is not limited.

[0062] In some examples, at least one connection part can also be formed between the two ends of the coil segment 1310 to enrich the wiring method and construct more combinations of the induction coil 131. For example, reference can be made to Figure 2 the first coil segment 1310a with A and B ends shown in the figure. In addition to the connection parts that can be provided at the A and B ends, a connection part can also be provided at the G position between A and B.

[0063] The induction coil construction device 130 further includes at least one connector 1320. The connector 1320 is arranged to be movable to electrically connect a connection part of a coil segment 1310 in the first coil segment group 130a and a connection part of a coil segment 1310 in the second coil segment group 130b respectively, so that the coil segments 1310 where the electrically connected connection parts are located form the induction coil 131. For the sake of simplified structure to illustrate the principle, in the figure, the connector 1320 is represented by a single line, but this does not limit its structure.

[0064] The connector 1320 can be selected for making a conductive connection between any two connection portions of the first coil segment group 130a and the second coil segment group 130b. Of course, in order to reduce the unnecessary space occupied by the conductive connection between two relatively distant connection portions, it is possible to select the conductive connection of the connector 1320 between two relatively close connection portions on the first coil segment group 130a and the second coil segment group. For example, making a conductive connection between the A end and the C end or the D end can form a conductive connection between the first coil segment 1310a and the second coil segment 1310b where they are located. However, making a conductive connection between the A end and the relatively close C end instead of the D end can effectively reduce the size and occupied space of the used connector 1320, so that a larger number of connectors 1320 can be arranged to flexibly construct more modes of the induction coil 131.

[0065] In some embodiments, the connection manner of the connector 1320 between the connection portions on the coil segments 1310 in the first coil segment group 130a and the second coil segment group 130b may include one or more of the following combinations.

[0066] In some embodiments, Figure 2 the conductive connection between the connection portions of two paired coil segments 1310 in the first coil segment group 130a and the second coil segment group 130b in

[0067] such as Figure 3 shown, showing a schematic structural diagram of a connection manner formed by a connector between connection portions in an embodiment of the present disclosure.

[0068] As an example, Figure 3 in

[0069] a paired connection is taken as an example for the connection between the connection portions of the A end and the C end. Alternatively, it can also be, for example, a paired connection between the connection portions of the B end and the D end. Figure 2 In some embodiments,

[0070] such as Figure 4 shown, showing a schematic structural diagram of another connection manner formed by a connector between connection portions in an embodiment of the present disclosure.

[0071] As an example, Figure 4The coil segments where the A end and the B end are located in [it] are defined as the first coil segment 1310a, and the coil segments where the C end and the D end are located are defined as the second coil segment 1310b paired with the first coil segment 1310a. Then, in the same coil segment, the third coil segment 1310c adjacent to the second coil segment 1310b on the radially outer side has an E end and an F end. The E end is close to the A end, the F end is close to the B end, and the connection part between the E end and the A end forms an electrical connection, that is, the so-called "adjacent variable diameter connection".

[0072] Figure 2 Between a connection part of a coil segment 1310 in [it] and a connection part at the proximal end on a coil segment 1310 that is radially interspersed (the interval can be more than one coil segment 1310) in the coil segment group where its paired coil segment 1310 is located, an electrical connection is formed through at least one connector 1320, which can be called an "interspersed variable diameter connection".

[0073] Such as Figure 5 shown, it is a schematic structural diagram showing another connection method between connection parts through a connector in an embodiment of the present disclosure.

[0074] As an example, Figure 5 The coil segments where the A end and the B end are located in [it] are defined as the first coil segment 1310a, and the coil segments where the C end and the D end are located are defined as the second coil segment 1310b paired with the first coil segment 1310a. The third coil segment 1310c adjacent to the second coil segment 1310b on the radially outer side in the same coil segment group has an E end and an F end. The seventh coil segment 1310g adjacent to the third coil segment 1310c on the radially outer side has N and O ends. The N end is close to the A end, and the connection part between the N end and the A end forms an electrical connection, that is, the so-called "interspersed variable diameter connection".

[0075] It can be understood that although in the Figure 5 embodiment, the shown interspersed variable diameter connection method is to be spaced by 1 coil segment 1310, however, in other embodiments, it can also be spaced by multiple coil segments 1310. For example, the connection part of the A end and the connection part of the proximal end P end on the eighth coil segment 1310h (see Figure 6 ) that is spaced by 2 coil segments 1310 are electrically connected through the connector 1320, so it is not limited to the Figure 5 embodiment.

[0076] In addition, since each of the coil segments 1310 may include a plurality of connection portions, such as connection portions at both ends and connection portions in the middle, the connection method of each connection portion on each coil segment 1310 can be selected from the above "paired connection", "adjacent diameter-changing connection", and "alternate diameter-changing connection", and the number of coil segments 1310 to be connected can also be set according to requirements. Thus, induction coils 131 of various structures are constructed through combinations of different connection portions and connection methods.

[0077] In some embodiments, connections may also be formed between the connection portions of the coil segments 1310 belonging to the same coil segment group.

[0078] As an example, an intra-group adjacent connection is formed between the proximal adjacent connection portions on two adjacent coil segments 1310 belonging to the same coil segment group through a connector. For example, in Figure 5 , between connection portions E and C are proximal adjacent connection portions, and an intra-group adjacent connection can be formed when needed.

[0079] As an example, an intra-group alternate connection is formed between the alternate connection portions on two adjacent coil segments 1310 belonging to the same coil segment group through a connector. For example, in Figure 5 , between connection portions N and C can form an intra-group alternate connection when needed.

[0080] In some embodiments, a single induction coil 131 can be constructed by connecting a plurality of coil segments 1310 in series.

[0081] In some embodiments, one end connection portions of at least some of the coil segments 1310 of the first coil segment group 130a and the second coil segment group 130b form adjacent diameter-changing connections / alternate diameter-changing connections, and the other end connection portions form adjacent diameter-changing connections / alternate diameter-changing connections to construct the induction coil 131.

[0082] As Figure 6 shown, it is a schematic diagram of the connection structure of the induction coil constructed by the induction coil construction device in an embodiment of the present disclosure.

[0083] In Figure 6In it, it is defined that in the same coil segment group, the fourth coil segment 1310d, the fifth coil segment 1310e, and the sixth coil segment 1310f are arranged radially and successively outward with respect to the first coil segment 1310a. The two ends of the fourth coil segment 1310d are the H end and the I end, the two ends of the fifth coil segment 1310e are the J end and the K end, and the two ends of the sixth coil segment 1310f are the L end and the M end. It is defined that in the same coil segment group, the second coil segment 1310b, the third coil segment 1310c, the seventh coil segment 1310g, and the eighth coil segment 1310h are arranged radially and successively outward. The two ends of the third coil segment 1310c are respectively the E end and the F end, the two ends of the seventh coil segment 1310g are the N end and the O end, and the two ends of the eighth coil segment 1310h are the P end and the Q end.

[0084] In Figure 6 it, the H end of the fourth coil segment 1310d can be adjacently and variably connected to the N end of the seventh coil segment 1310g through the connector 1320, and through the O end of the seventh coil segment 1310g, it is adjacently and variably connected to the M end of the sixth coil segment 1310f through the connector 1320, forming a single induction coil 131 between the I and L ends. The induction coil 131 is composed of the fourth coil segment 1310d, the seventh coil segment 1310g, and the sixth coil segment 1310f. The connection part between the I end of the fourth coil segment 1310d and the L end of the sixth coil segment 1310f serves as the connection end for the external conductive connection of the induction coil 131, and POWER IN1 and POWER OUT1 are respectively led out, and one end can be connected to the radio frequency source and the other end can be connected to the ground.

[0085] Alternatively, the O end of the seventh coil segment 1310g can also be connected to the S end at the proximal end of the ninth coil segment 1310i adjacent to the outside in the radial direction of the sixth coil segment 1310f through the connector 1320 with an alternating diameter change to form a single induction coil 131 between the I end and the R end.

[0086] [[ID=1">In some embodiments, one - end connection parts of at least some of the radially adjacent / alternating coil segments 1310 in the first coil segment group 130a and the second coil segment group 130b form paired connections, and the other - end connection parts form adjacent variable - diameter connections / alternating variable - diameter connections to construct the induction coil 131.

[0087] As Figure 7 shown, it is a schematic diagram of the connection structure for constructing an induction coil by an induction coil construction device in another embodiment of the present disclosure.

[0088] In Figure 7Among them, it is defined that in the same coil segment group, the fourth coil segment 1310d, the fifth coil segment 1310e, and the sixth coil segment 1310f are arranged radially outward in sequence from the first coil segment 1310a. The two ends of the fourth coil segment 1310d are the H end and the I end, the two ends of the fifth coil segment 1310e are the J end and the K end, and the two ends of the sixth coil segment 1310f are the L end and the M end. It is defined that in the same coil segment group, the third coil segment 1310c, the seventh coil segment 1310g, and the eighth coil segment 1310h are arranged radially outward in sequence from the second coil segment 1310b. The two ends of the third coil segment 1310c are the E end and the F end respectively, the two ends of the seventh coil segment 1310g are the N end and the O end, and the two ends of the eighth coil segment 1310h are the P end and the Q end.

[0089] In ​ Among them, the H end can be adjacently and variably connected to the N end of the seventh coil segment 1310g through the connector 1320, and is pair - connected to the K end through the O end and the connector 1320, and then is adjacently and variably connected to the P end of the eighth segment through the J end and the connector 1320 to form a single induction coil 131 between the I and Q ends. The induction coil 131 is composed of the fourth coil segment 1310d, the seventh coil segment 1310g, and the eighth coil segment 1310h. The connection part between the I end of the fourth coil segment 1310d and the Q end of the eighth segment serves as the connection end for the external conductive connection of the induction coil 131, and POWER IN1 and POWER OUT1 are respectively led out.

[0090] Or, it is defined that the radially adjacent outer side of the eighth coil segment 1310h is the tenth coil segment 1310j (see ​ ), and the J end of the fifth coil segment 1310e can also be alternately and variably connected to the T end which is the J proximal end on the tenth coil segment 1310j through the connector 1320 to form a single induction coil 131 between the I end and the U end.

[0091] According to ​ , ​ the embodiments, it can be understood that in other embodiments, the combination of the connection methods of each connection part can be changed, and it is not limited to the above - mentioned embodiments.

[0092] In addition to constructing a single induction coil 131, the induction coil construction device 130 can also be used to construct multiple induction coils 131 each containing multiple sub - coils. The following is an example.

[0093] In some embodiments, at least some of the coil segments 1310 between the first coil segment group 130a and the second coil segment group 130b can be alternately and sequentially adjacently and variably connected at both ends to form two complementary sub - coils along the circumference to form an induction coil 131.

[0094] As shown ​ in the figure, it shows a schematic connection structure diagram of the induction coil construction device constructing an induction coil in another embodiment of the present disclosure.

[0095] In ​ , it is defined that in the same coil segment group, the first coil segment 1310a has the fourth coil segment 1310d, the fifth coil segment 1310e, the sixth coil segment 1310f, and the ninth coil segment 1310i arranged radially outward in sequence. The two ends of the fourth coil segment 1310d are the H end and the I end, the two ends of the fifth coil segment 1310e are the J end and the K end, the two ends of the sixth coil segment 1310f are the L end and the M end, and the two ends of the ninth coil segment 1310i are the R end and the S end. It is defined that in the same coil segment group, the second coil segment 1310b has the third coil segment 1310c, the seventh coil segment 1310g, and the eighth coil segment 1310h arranged radially outward in sequence. The two ends of the third coil segment 1310c are the E end and the F end respectively, the two ends of the seventh coil segment 1310g are the N end and the O end, and the two ends of the eighth coil segment 1310h are the P end and the Q end.

[0096] In ​ , the F end of the third coil segment 1310c can be adjacently and variably connected to the K end of the fifth coil segment 1310e through the connector 1320, and through the J end, it is adjacently and variably connected to the P end through the connector 1320, forming a sub-coil between the E end and the Q end, which is composed of the third coil segment 1310c, the fifth coil segment 1310e, and the eighth coil segment 1310h. Among them, the connection part between the E end of the third coil segment 1310c and the Q end of the eighth coil segment 1310h serves as the connection end of the sub-coil for external conductive connection, and POWER IN1 and POWER OUT1 are respectively led out.

[0097] Moreover, the H end of the fourth coil segment 1310d can be adjacently and variably connected to the N end of the seventh coil segment 1310g through the connector 1320, and through the O end, it is adjacently and variably connected to the M end through the connector 1320, forming another sub-coil between the I end and the L end, which is composed of the fourth coil segment 1310d, the seventh coil segment 1310g, and the sixth coil segment 1310f. Among them, the connection part between the I end of the fourth coil segment 1310d and the L end of the sixth coil segment 1310f serves as the connection end of the induction coil 131 for external conductive connection, and POWER IN2 and POWER OUT2 are respectively led out.

[0098] Two sub-coils form the induction coil 131. Among them, it can be seen that the third coil segment 1310c, the fifth coil segment 1310e, and the eighth coil segment 1310h in one sub-coil are paired one by one with the fourth coil segment 1310d, the seventh coil segment 1310g, and the sixth coil segment 1310f in the other sub-coil respectively, that is, they are respectively complementary in circumference, so that the induction coil 131 including two independent sub-coils can still present a circular planar coil structure, which is compact in structure and effectively saves space. In some embodiments, each sub-coil can be connected in parallel to a radio frequency source or independently connected to different radio frequency sources to be used for zonal regulation of the plasma in the reaction chamber 110.

[0099] In some embodiments, the coil segments 1310 in different radial regions of the first coil segment group 130a and the second coil segment group 130b are respectively conductively connected to form at least two sub-coils arranged inside and outside in the radial direction to form the induction coil 131.

[0100] As ​ shown, a schematic connection structure diagram of the induction coil construction device for constructing the induction coil 131 in another embodiment of the present disclosure is shown.

[0101] In ​ it is defined that in the same coil segment group, the first coil segment 1310a has the fourth coil segment 1310d, the fifth coil segment 1310e, the sixth coil segment 1310f, the ninth coil segment 1310i, and the eleventh coil segment 1310k arranged radially outward in sequence. The two ends of the fourth coil segment 1310d are the H end and the I end, the two ends of the fifth coil segment 1310e are the J end and the K end, the two ends of the sixth coil segment 1310f are the L end and the M end, the two ends of the ninth coil segment 1310i are the R end and the S end, and the two ends of the eleventh coil segment 1310k are the V end and the W end. It is defined that in the same coil segment group, the second coil segment 1310b has the third coil segment 1310c, the seventh coil segment 1310g, the eighth coil segment 1310h, the tenth coil segment 1310j, and the twelfth coil segment 1310l arranged radially outward in sequence. The two ends of the third coil segment 1310c are the E end and the F end respectively, the two ends of the seventh coil segment 1310g are the N end and the O end, the two ends of the eighth coil segment 1310h are the P end and the Q end, the two ends of the tenth coil segment 1310j are the T end and the U end, and the two ends of the twelfth coil segment 1310l are the X end and the Y end respectively.

[0102] In ​Among them, the A end of the first coil segment 1310a can be connected in pairs to the C end of the second coil segment 1310b through the connector 1320, and through the B end, it is adjacently connected with a reduced diameter to the F end through the connector 1320, and through the E end, it is connected in pairs to the H end, forming an inner sub-coil between the D end and the I end, which is composed of the first coil segment 1310a, the second coil segment 1310b, the third coil segment 1310c and the fourth coil segment 1310d. Among them, the connection part of the D end of the second coil segment 1310b and the I end of the fourth coil segment 1310d serves as the connection end for the inner sub-coil to conduct electricity externally, and POWER IN1 and POWEROUT1 are respectively led out.

[0103] In ​ Among them, the S end of the ninth coil segment 1310i can be connected in pairs to the U end of the tenth coil segment 1310j through the connector 1320, and through the T end, it is adjacently connected with a reduced diameter to the V end of the eleventh coil segment 1310k through the connector 1320, and through the W end, it is connected in pairs to the Y end of the twelfth coil segment 1310l through the connector 1320, forming an outer sub-coil located outside the inner sub-coil between the R end and the X end, which is composed of the ninth coil segment 1310i, the tenth coil segment 1310j, the eleventh coil segment 1310k and the twelfth coil segment 1310l. Among them, the connection part of the R end of the ninth coil segment 1310i and the X end of the twelfth coil segment 1310 serves as the connection end for the induction coil to conduct electricity externally, and POWER IN2 and POWER OUT2 are respectively led out.

[0104] Through the two inner and outer sub-coils, the etching speed of the plasma in the inner and outer regions in the radial direction of the wafer during wafer etching can be adjusted. When the two sub-coils are connected in series, the etching speed of the inner and outer regions in the radial direction of the wafer can be adjusted synchronously. When the two sub-coils are connected in parallel or independently connected to the radio frequency source, the etching speed of the inner and outer regions in the radial direction of the wafer can be adjusted separately.

[0105] In some embodiments, the induction coil 131 with two inner and outer sub-coils can switch the coil form in the state where the plasma does not annihilate. For example, the induction coil 131 is connected in the initial state as ​ and is applied to ​An exemplary plasma processing device. Process gas is introduced into the reaction chamber 110, and the induction coil 131 is connected to start the radio frequency. The process gas in the reaction chamber 110 is initiated. First, the inner sub-coil maintains the state of being connected to the radio frequency source to initiate the corresponding inner ring plasma, and the outer sub-coil disconnects from the radio frequency source. Then, the outer sub-coil is switched to the target structure and the corresponding adjustable capacitor is adjusted to impedance matching and then powered on, and the outer ring plasma starts to initiate. Thus, the coil structure switching of the induction coil 131 in the continuous plasma excitation state can be completed. It should be particularly noted that the dual-zone coil structure of the above-mentioned inner and outer two sub-coils is only an example. It can be understood that more inner and outer sub-coils can be constructed, such as 3, 4, 5, etc., not limited to 2 sub-coils.

[0106] In an alternative embodiment, ​ and ​ exemplarily shows that the coil segments (which can also be sub-coils) that are not used to connect to the radio frequency source as the induction coil 131 are shown as dotted lines and used as spare parts. It can be understood that the said spare parts can be left for future use or removed. After removal, only the solid-line parts in the figure are retained. The spare parts that were not used as the induction coil in the previous ​ embodiment can also be left for future use or removed.

[0107] It should be noted that for the convenience of explaining the connection method of the induction coil construction device 130, ​ the structure of the induction coil construction device 130 and the constructed induction coil 131 shown is only a simplified structure. The following exemplarily shows the possible physical structures of the induction coil construction device 130.

[0108] As ​ shown, it shows a schematic diagram of the physical structures of the first coil assembly and the second coil assembly in the induction coil construction device in an embodiment of the present disclosure.

[0109] In ​ , it shows that the coil segment 1310 can be implemented as a rigid metal member. Each of the coil segments 1310 can be semi-circular arc-shaped. Connection parts 1311 can be provided at both ends of each of the coil segments 1310. As an example, the connection part 1311 is implemented as the first connection hole on the metal member. The first connection hole can be a through hole or a concave hole.

[0110] Optionally, a set of connection portions 1311 on each coil segment 1310 in each coil assembly may be arranged along a radial straight line, and two radial straight lines along which the two sets of connection portions 1311 of the first coil assembly and the second coil assembly are arranged may be parallel to each other, that is, the distance between each pair of connection portions 1311 corresponding to the positions of each pair of coil segments 1310 is the same. Thus, for multiple connections corresponding to each of the connection methods of "paired connection", "adjacent variable-diameter connection", and "alternate variable-diameter connection", the same connector ( ​ not shown in ​ , so the label is omitted) can be used to complete the connection, reducing the requirements for the connector. For example, a relatively shortest connector is used for "paired connection", a slightly longer connector is used for "adjacent variable-diameter connection", and a connector with a longer length than the previous two connection methods is used for "alternate variable-diameter connection". The specific length may vary according to the number of spaced coil segments 1310.

[0111] ​ Show ​ Schematic diagram of the structure of the induction coil constructed by the induction coil construction device in the embodiment.

[0112] In ​ ​ , it is exemplarily shown that the connection portions 1311 at one end of multiple paired coil segments 1310 in the first coil assembly and the second coil assembly are paired-connected by the first connector 1320a, and the connection portions 1311 at the other end are adjacent variable-diameter connected by the second connector 1320b (or at least one may be alternate variable-diameter connected).

[0113] The first connector 1320a and the second connector 1320b are at least different in length. The first connector 1320a and the second connector 1320b are made of a conductive material, such as a metal material.

[0114] Reference can be made to ​ and ​ shown, which respectively show the schematic diagrams of the structures of the first connector 1320a and the second connector 1320b.

[0115] In ​Among them, the first connector 1320a may include a second connection hole 1321 and a conductive member (not shown). The second connection hole 1321 is used to correspond to the position of the first connection hole, and the conductive member can be combined and conductively contacted with each pair of the corresponding first connection holes and the second connection hole 1321. Second connection holes 1321 are respectively arranged at both ends of the first connector 1320a for corresponding to the first connection holes of the two coil segments 1310 to be connected respectively and for forming a conductive connection, so as to realize the paired connection of the two coil segments 1310. As an example, the middle of the first connector 1320a may further have a support portion 1322 for fittingly embedding into the gaps at the ends of the two coil segments 1310 to be conductively connected, so that the overall structure of the first connector 1320a is similar to a T shape. Through the support portion 1322, after the paired connection is formed, the position of the first connector 1320a between the two coil segments 1310 can be made more stable, and shaking can be avoided, so as to improve the stability of the established conductive connection.

[0116] In an alternative embodiment, the first connection hole and / or the second connection hole 1321 may be a threaded hole, and the conductive member may be a bolt made of metal, which is threadedly connected to the threaded hole to realize positioning conductive contact by using the threaded connection. Alternatively, the first connection hole and / or the second connection hole 1321 may not be provided with threads, and it is only necessary to contact the conductive member, which is not limited herein.

[0117] In an alternative embodiment, reference may be made to ​ and ​ As shown, the coil segment 1310 further includes at least one fixing hole 1312 for fixing to an attachment. In the illustrated embodiment, each coil segment 1310 may have a plurality of fixing holes 1312, and the number of fixing holes 1312 can be selected and set according to the length of the fixed coil segment 1310 and / or the required stability level. For example, fixing holes 1312 are respectively arranged at both ends and the central position of the coil segment 1310. In some embodiments, the fixing hole 1312 may be a threaded hole for fixing by threadedly connecting a bolt. In some embodiments, the attachment includes but is not limited to a coil bracket, a carrier plate, etc.

[0118] In ​Among them, the second connector 1320b also includes a second connection hole 1321 and a conductive member (not shown). The second connection hole 1321 is used to correspond to the position of the first connection hole, and the conductive member can be combined and conductively contacted with each pair of the first connection holes and the second connection hole 1321 corresponding in position. Both ends of the first connector 1320a are respectively provided with second connection holes 1321 for corresponding to the first connection holes of the two coil segments 1310 to be connected respectively and for forming a conductive connection, so as to realize the paired connection of the two coil segments 1310. Optionally, the middle part of the first connector 1320a may further have a support portion 1322 for fittingly embedding into the gaps at the ends of the two coil segments 1310 to be conductively connected, so that the first connector 1320a as a whole presents a structure similar to a T shape. Through the support portion 1322, after the paired connection is formed, the position of the first connector 1320a between the two side coil segments 1310 can be made more stable, and shaking can be avoided, so as to improve the stability of the established conductive connection. Compared with the first connector 1320a, the middle part of the second connector 1320b between the two ends has a tapered portion 1323 with a reduced thickness relative to the two ends, so that when performing "adjacent variable diameter connection" or "alternate variable diameter connection" obliquely, an avoidance gap can be formed between the two second connectors 1320b (refer to ​ ), which is convenient for taking and placing the second connector 1320b from the avoidance gap. The support portion of the second connector 1320b can be filled into the gap between the coil segments 1310 where the two connection portions 1311 of the "adjacent variable diameter connection" or "alternate variable diameter connection" are located, so that the position of the second connector 1320b is more stable.

[0119] It can be understood that the support portions 1322 of the first connector 1320a and the second connector 1320b are not necessary and can also be omitted in other embodiments, and are not limited by the illustration.

[0120] ​ and ​ In the induction coil structure device 130 in the embodiment, there are gaps between the radially arranged coil segments 1310. However, the coil segments 1310 can also be filled into these gaps, that is, there may be no gaps between the coil segments 1310 in the radial direction.

[0121] In addition, it should be noted that although in the above embodiments, the connectors 1320 (such as the first connector 1320a and the second connector 1320b) can be stacked on the coil segments 1310, and are respectively aligned with two first connection holes through a pair of second connection holes 1321 and conduct electricity through a conductive member to achieve electrical connection, in other embodiments, other bonding structures can also be adopted between the connector 1320 and the coil segment 1310 to complete electrical contact. For example, the connecting portion 1311 is implemented as a groove (not shown) provided on the side surface of the end of the coil segment 1310, and both ends of the groove (i.e., the upper and lower ends) are through. The connecting portion 1311 may include a fitting portion (not shown) for fitting into the grooves of the two to-be-electrically-connected members, so as to achieve electrical connection. To be suitable for obliquely adjacent variable-diameter connections and phase-interval variable-diameter connections, the fitting portion can be arranged at both ends of the connector 1320 in a hinged manner.

[0122] As ​ shown, a schematic structural diagram of an induction coil of an induction coil structure device in another embodiment of the present disclosure is shown.

[0123] In ​ , it is shown that the gap between the radially adjacent coil segments 1310 is small or there is no gap, and the radially adjacent coil segments 1310 can be insulated from each other through the insulating layer on the surface. Thus, the induction coil structure device 130 can include more coil segments 1310, so that the size and structure types of the induction coil 131 formed by electrical connection are more, that is, the adjustable range of the size of the formed induction coil 131 is more refined. In this embodiment, the paired coil segments 1310 that are radially spaced in the two coil segment assemblies are selected for electrical connection. The connecting portions 1311 at one end are connected in pairs through the first connector 1320a, and the connecting portions 1311 at the other end are connected by adjacent variable-diameter connection (or at least one can be connected by phase-interval variable-diameter connection) through the second connector 1320b.

[0124] After the coil segments 1310 of the unconnected and unconnected spare parts are removed, it can be presented as the structure of the induction coil 131 as shown in ​ . If the coil segments 1310 of the spare parts are electrically connected to the already electrically connected coil segments 1310 through the first connector 1320a or the second connector 1320b, the formed induction coil 131 will change on the basis of the induction coil 131 shown in ​ . It can be seen that the more dense layout of the coil segments 1310 in ​ can improve the diversity of the formed induction coil 131, and can be used to adapt to more abundant process requirements to increase the possibility of achieving better process effects in the test.

[0125] It can be understood that in​ , ​ , ​ Among ​ , ​ , and ​ , due to the large number of coil segments and connectors, for simplicity of representation, the labels of some coil segments and connectors are omitted, which should be understandable to those skilled in the art.

[0126] In some embodiments, the movement of the connector 1320 (see ​ ) can be automatically controlled to enable automatic switching of the coil modes of the induction coil. As further shown in ​ , the induction coil construction device 130 may further include a drive control system for the connector 1320 (see ​ ), which can be manipulated to drive the connector 1320 to move to complete the electrical connection of the required coil segment 1310.

[0127] In ​ , it is shown that the drive control system may include a drive mechanism 150 and a control device 160.

[0128] The drive mechanism 150 is connected to and drives the connection part 1311 to which the connector 1320 makes an electrical connection. In some embodiments, the drive mechanism 150 may be implemented as including, but not limited to, a robotic arm or other moving mechanism. The drive mechanism 150 may include one or more controllable power sources, such as a motor or a cylinder, etc.

[0129] The control device 160 is communicatively connected to the driving mechanism 150 and is configured to control the driving mechanism 150 to drive the connector 1320 to switch and connect to the target connection part 1311 in response to a trigger signal. In some embodiments, the control device 160 may be connected to an environment detection device for detecting the environment and generating detection data, such as a vision device (e.g., a depth camera), a radar (e.g., ultrasonic, laser, etc.), so as to determine the positions of the driving mechanism 150, the driven connector 1320, and the target connection part 1311 in the detection data, thereby planning a path for the driving mechanism 150 to drive the connector 1320 to the target connection part 1311 and implementing control accordingly. For example, the control device 160 acquires a color depth image captured by a depth camera, identifies the first spatial position of the target connection part 1311 in the image, and acquires the second spatial position of the connector 1320 (e.g., identified from the color depth image or estimated based on the previous position of the driving mechanism 150 and existing inertial navigation data). According to the first spatial position, the second spatial position, and the movement mode of the driving mechanism 150, a movement path of the driving mechanism 150 that can make the connector 1320 move from the second spatial position to a position corresponding to the target connection part 1311 beside the first spatial position (such as overlapping as in the previous embodiment, with the first connection hole corresponding to the second connection hole 1321) is planned, and the driving mechanism 150 is made to move along the movement path.

[0130] In some embodiments, the user can control the connector 1320 to switch the connected connection part in real time through the driving control system, so as to switch the required coil mode in real time. Alternatively, the driving control system can be preset with one or more coil modes, so as to automatically switch the corresponding coil mode based on an instruction or a trigger condition.

[0131] It should be noted that the number of coil groups of the first coil segment group and the second coil segment group shown in the above embodiments is only an example, and can be changed in other embodiments.

[0132] For example, as ​ shown, a simplified structural schematic diagram of an induction coil constructed by the induction coil structure device 130 in another embodiment of the present disclosure is shown.

[0133] In this embodiment, 4 coil segment groups X1, X2, X3, and X4 forming a ring are shown, and the coil segments 1310 in each coil segment group present a 1 / 4 arc shape. The adjacent connection parts between the coil segments 1310 can all be connected through the connector 1320, and the connection methods are as listed in the previous embodiments: paired connection, adjacent diameter-changing connection, or alternating diameter-changing connection, etc.

[0134] In some embodiments, the coil segment 1310 in the induction coil construction device 130 that is not connected to the induction coil can be retained for use when changing the structure of the induction coil.

[0135] The above provides the structure of the induction coil whose structure can be dynamically changed using the induction coil. In a plasma processing device, the plasma is obtained by ionizing the gas in the reaction chamber under the action of the magnetic field of the induction coil. The magnetic field intensity distribution of the induction coil can be determined by the distribution density of its structure. For example, the magnetic field intensity in the area corresponding to the dense position of the line segments of the induction coil may be greater, and then the plasma density in this area may be greater. In the area with a greater plasma density, the processing rate of the corresponding area on the wafer being processed may be higher, such as a higher etching rate, etc. Thus, by switching the connection object of the connector 1320 in the induction coil construction device 130, the structure of the induction coil can be changed to adjust the distribution density of the induction coil structure, thereby adjusting the magnetic field intensity of the plasma corresponding to the target area. In order to obtain the magnetic field intensity distribution information of the induction coil in the target area, a magnetic field monitoring device for monitoring the magnetic field intensity distribution information can be correspondingly arranged. Furthermore, the structure of the induction coil is correspondingly changed according to the magnetic field monitoring device.

[0136] It should be particularly noted that the relative position between the magnetic sensor 171 and the coil segment 1310 does not necessarily need to be vertically corresponding. The relationship between the magnetic field intensities detected by adjacent magnetic sensors 171 can be used to determine the magnetic field intensity in the area between them. Therefore, the position setting of the magnetic sensor 171 is relatively free and can be vertically corresponding to the coil segment 1310 or vertically corresponding to the gap between the coil segments 1310.

[0137] As ​ shown, a schematic structural diagram of the induction coil structure adjustment component in an embodiment of the present disclosure is shown.

[0138] In ​ it is shown that the induction coil structure adjustment component includes: the induction coil construction device 130 described in any of the previous embodiments, the magnetic sensor array 170, the driving mechanism 150, and the control device 160. ​Simplified side views of the inductive coil structure device 130 and the magnetic sensor array 170 are shown. On one side of the inductive coil structure device 130 is the reaction chamber of the plasma processing equipment, and on the other side of the inductive coil structure device 130 is arranged the magnetic sensor array 170, which includes a plurality of magnetic sensors 171. The magnetic sensor array 170 can be symmetrically arranged with respect to the target area Q1 in the induction chamber. The target area is affected by the magnetic field of the inductive coil. The magnetic sensor array 170 is symmetrically located on both sides of the inductive coil structure device 130 relative to the target area Q1. Since the magnetic field intensity distributions on the opposite sides of the inductive coil are mirror-symmetrically the same, the magnetic field intensity distribution detected by the magnetic sensor array 170 is the same as the magnetic field intensity distribution of the target area. Thus, it is possible to conveniently detect the magnetic field intensity distribution of the target area in the reaction chamber outside the reaction chamber.

[0139] For another example ​ As shown, a plan view showing the layout position relationship between the inductive coil structure device 130 and the magnetic sensor array 170 in an embodiment of the present disclosure.

[0140] In ​ As can be seen, the plurality of magnetic sensors 171 in the magnetic sensor array 170 can be evenly distributed in a radial plane parallel to the inductive coil. For example, in the cross-shaped arrangement shown in the figure, the magnetic sensors 171 can be located between the coil segments 1310, or in other examples, they can also be vertically corresponding to the coil segments 1310. It can be understood that each magnetic sensor 171 in the magnetic sensor array 170 can be used to detect the magnetic field intensity at the location where it is located, and thus the magnetic field intensity of the mirror-symmetric point of the target area Q1 can be obtained. Then, through the entire magnetic sensor array 170, the magnetic field intensity distribution of the target area Q1 in the radial direction can be detected in a mirror-symmetric manner.

[0141] The drive mechanism 150 can be controlled by the control device 160 to operate the coil segments 1310 connected by the connector 1320 to disconnect / connect to the inductive coil, changing the structural distribution density of the inductive coil to correspondingly adjust the magnetic field intensity distribution.

[0142] In some embodiments, the magnetic field intensity distribution at corresponding positions in the radial direction of the inductive coil can be adjusted by operating the connector 1320 to avoid or connect the coil segments 1310 in the radial direction to the inductive coil.

[0143] For example ​ As shown, a schematic diagram showing the adjustment of the magnetic field intensity distribution of the target area by changing the structure of the inductive coil through the inductive coil structure device 130 in an embodiment of the present disclosure.

[0144] In​ In this case, inner and outer sub-coils are formed, and two sub-coils are expressed in the connection order of the connection part. The inner sub-coil structure is expressed as D-C-A-B-F-E-H-I, and the outer sub-coil structure is expressed as R-S-U-T-V-W-Y-X. Assuming the magnetic field distribution feedback by the magnetic induction coil array, it is found that the magnetic field intensity in the radially outer peripheral region corresponding to the inner sub-coil (i.e., the connection part) in the radial direction is lower than the magnetic field intensity in the radially inner region corresponding to the outer sub-coil. If it is necessary to adjust the magnetic field intensity in the influence regions of the inner and outer sub-coils to be close, in one example, the number of turns of the inner sub-coil connected can be increased by adding connectors 1320 to connect connection parts I and O, N and J, and the structure is changed to D-C-A-B-F-E-H-I-O-N-J-K, so as to increase the distribution density of the inner sub-coil connected and enhance the magnetic field intensity in the inner region correspondingly. Or, in another example, the connection of V to T can be changed to the connection of V to X, and the connection of S-U can be eliminated, and the outer sub-coil structure is changed to V-W-Y-X to reduce the number of turns of the outer sub-coil and reduce the magnetic field intensity in the outer region affected by the outer sub-coil.

[0145] Among them, the coil segment 1310 represented by the dashed line in the figure is the coil segment 1310 that was not originally connected to the induction coil but was reserved for later use, and can be utilized in this embodiment to increase the distribution density of the local induction coil.

[0146] In some embodiments, the coil segment 1310 in the target coil segment group can also be selected to be avoided or connected by operating the connector 1320, and the structural distribution density of the target coil segment group can be changed to adjust the magnetic field intensity distribution relationship of the sub-region to be measured corresponding to the influence of the target coil segment group relative to other regions.

[0147] Such as ​ and ​ shown, it shows a schematic diagram of changing the structure of the induction coil by the induction coil construction device 130 to adjust the magnetic field intensity distribution in another embodiment of the present disclosure. ​ It shows the structure of the induction coil before the change, ​ It shows the structure of the induction coil after the change.

[0148] In ​ it shows that the induction coil includes 4 groups of coil segments X1, X2, X3, X4 arranged annularly and uniformly, and the original coil structure is:

[0149] Z5-B-D-Z7-Z8-C-A-Z6-Z3-I-F-Z9-Z10-E-H-Z4-Z1K-O-Z11-Z12-N-J-Z2.

[0150] If it is necessary to adjust the magnetic field strength of the magnetic field influence area corresponding to the X1 coil segment group, for example, to weaken its magnetic field strength. Further optionally, if it is necessary to more precisely weaken the magnetic field strength of the influence area corresponding to the coil segment 1310 of H-Z4, the changed coil structure is as follows ​ shown. By using connection methods such as paired connection, phase-interleaved variable-diameter connection (C-J), and adjacent connection within the group (E-N), the coil structure is changed to:

[0151] Z3-I-F-Z9-Z10-E-N-Z12-Z11-O-K-Z1-Z2-J-C-Z8-Z7-D-B-Z5-Z6-A.

[0152] It can be seen that ​ the coil segment 1310 of H-Z4 in

[0153] is disconnected from the induction coil, weakening the magnetic field strength of the corresponding area. ​ As shown in

[0154] The control device 160 can be implemented based on the computer device 500.

[0155] The computer device 500 includes a bus 501, a processor 502, and a memory 503. The processor 502 and the memory 503 can communicate through the bus 501. The memory 503 can store computer programs or instructions. The processor 502 realizes the functions of the control device in the previous embodiments by running the computer programs or instructions in the memory 503.

[0156] The bus 501 can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the sake of convenience of representation, although only a thick line is used in the figure, it does not mean that there is only one bus or one type of bus.

[0157] In some embodiments, the processor 502 can be implemented as a Central Processing Unit (CPU), a Microcontroller Unit (MCU), a System On Chip, or a Field Programmable Gate Array (FPGA), etc. The memory 503 can include volatile memory for temporarily storing data when running programs, such as Random Access Memory (RAM).

[0158] The memory 503 may also include non-volatile memory for data storage, such as Read-Only Memory (ROM), flash memory, Hard Disk Drive (HDD), or Solid-State Disk (SSD).

[0159] In some embodiments, the computer device 500 may further include a communicator 504. The communicator 504 is used for external communication. In a specific example, the communicator 504 may include one or a group of wired and / or wireless communication circuit modules. For example, the communicator 504 may include one or more of a wired network card, a USB module, a serial interface module, etc. The wireless communication protocols followed by the wireless communication module include, for example, one or more of Nearfield communication (NFC) technology, Infrared (IR) technology, Global System for Mobile communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code division multiple access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Bluetooth (BT), Global Navigation Satellite System (GNSS), etc.

[0160] In the embodiments of the present disclosure, a computer-readable storage medium may also be provided, storing a computer program or instruction, and when the computer program or instruction is run, the functions of the control device in the previous embodiments are implemented.

[0161] That is, the method steps in the above embodiments are implemented as software or computer code that can be stored in a recording medium (such as a CD ROM, RAM, floppy disk, hard disk, or magneto-optical disk), or as computer code that is originally stored in a remote recording medium or a non-transitory machine-readable medium and is to be downloaded via a network and stored in a local recording medium. Thus, the method represented herein can be stored as such software processing on a recording medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware (such as an ASIC or FPGA).

[0162] An embodiment of the present disclosure may also provide a computer program product, one or more computer programs or instructions, which when run, wholly or partially execute the functions of the control device in the embodiments of the present disclosure. The computer program product includes one or more computer programs or instructions.

[0163] The computer program or instructions can be stored in a readable storage medium, or transmitted from one readable storage medium to another. For example, the computer program or instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center in a wired or wireless manner. The readable storage medium can be any accessible available medium or a data storage device such as a server or data center integrating one or more available media. The available medium can be a magnetic medium, such as a floppy disk, hard disk, or magnetic tape; it can also be an optical medium, such as a digital video disc; or it can be a semiconductor medium, such as a solid-state drive. The computer-readable storage medium can be a volatile or non-volatile storage medium, or can include both volatile and non-volatile types of storage media.

[0164] In summary, the present disclosure relates to the technical field of plasma processing equipment, and provides an induction coil construction device including a first coil segment group and a second coil segment group; the first coil segment group and the second coil segment group are configured as two sets of coil segments in pairs that are symmetrically separated in at least one direction by a plurality of concentrically arranged annular coil members; each of the coil segments forms at least connection portions at both ends; at least one connector; each of the connectors is arranged to be movable to electrically connect a connection portion of the first coil segment group and a connection portion of the second coil segment group respectively, so that the coil segments where the electrically connected connection portions are located form an induction coil. Through the induction coil construction device, by moving the connector to switch the electrically connected connection portions, different-sized and -structured induction coils can be flexibly constructed to adapt to different processes to achieve good effects, avoiding the low efficiency problem of disassembling and replacing the induction coil, and improving the equipment R & D efficiency.

[0165] The above embodiments are merely illustrative of the principles and effects of the present disclosure and are not intended to limit the present disclosure. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present disclosure. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present disclosure should still be covered by the protection scope of the present disclosure.

Claims

1. An induction coil structure adjustment component, characterized in that, include; An induction coil construction device for constructing an induction coil in a plasma processing apparatus comprises: at least a first coil segment group and a second coil segment group; wherein the first coil segment group and the second coil segment group are constructed as two pairs of coil segments formed by a plurality of concentrically arranged annular coil members symmetrically separated in at least one direction; each coil segment has at least connecting portions at both ends; and at least one connector; each connector is configured to be movable to electrically connect to a connecting portion of the first coil segment group and a connecting portion of the second coil segment group, respectively, so that the coil segments where the electrically connected connecting portions are located constitute the induction coil. A magnetic sensor array is arranged on a side of the induction coil structure facing away from a reaction chamber in the plasma processing equipment, and is mirror-symmetrically disposed on both sides of the induction coil structure relative to a target area in the reaction chamber affected by the magnetic field of the induction coil. The magnetic sensor array includes: a plurality of magnetic sensors uniformly distributed in a radial plane parallel to the induction coil, and configured to detect and obtain a radial magnetic field intensity distribution of the target area in a mirror-symmetrical manner; The driving mechanism is used for controlling the coil connected to the connector to be disconnected from / connected to the induction coil in sections, and changing the structural distribution density of the induction coil to correspondingly adjust the magnetic field intensity distribution.

2. The induction coil structure adjusting component according to claim 1, characterized in that The operation of disconnecting / connecting the coil segment connected to the connector to the induction coil changes the structural distribution density of the induction coil to correspondingly adjust the magnetic field intensity distribution, including: avoiding or connecting the radial coil segment to the induction coil by operating the connector to adjust the magnetic field intensity distribution at the corresponding radial position of the induction coil.

3. The induction coil structure adjusting component according to claim 1, characterized in that, The coil segment connected to the connector is operated to disconnect or connect to the induction coil, and the structural distribution density of the induction coil is changed to correspondingly adjust the magnetic field intensity distribution, including: by operating the connector to select to avoid or connect the coil segment in the target coil segment group, changing the structural distribution density of the target coil segment group to adjust the magnetic field intensity distribution relationship of the sub-area to be measured affected by the target coil segment group relative to other areas.

4. The induction coil structure adjusting component according to claim 1, characterized in that The coil segments in the first coil segment group and the second coil segment group that are not connected to the induction coil are reserved.

5. The induction coil structure adjustment component according to claim 1, characterized in that The coil segments form the connection portion at at least one end.

6. The inductive coil structure adjusting component according to claim 1, characterized in that, The coil segments form at least one connection between two ends.

7. The induction coil structure adjusting assembly according to claim 1, wherein The connecting portions of the coil segments in each coil segment group are arranged along one or more radial straight lines.

8. The inductive coil structure adjusting component according to claim 1, wherein, The connection between the connecting portions of the coil segments in the first coil segment group and the second coil segment group includes one of the following: 1) The connection portion of at least one coil segment is connected to the connection portion of the proximal end of its paired coil segment via at least one connector; 2) a connecting portion of at least one coil segment and a connecting portion on a proximal end of a radially adjacent coil segment in the coil segment group to which the paired coil segment belongs are connected to form an adjacent reduced diameter connection via at least one connector; 3) An interphase variable diameter connection is formed between a connection part of at least one coil segment and a connection part at the proximal end on a coil segment radially spaced in the coil segment group where its paired coil segment is located through at least one connector; 4) An intra-group adjacent connection is formed between adjacent connection parts at the proximal ends on two adjacent coil segments belonging to the same coil segment group through a connector; 5) An intra-group interphase connection is formed between interphase connection parts on two adjacent coil segments belonging to the same coil segment group through a connector.

9. The induction coil structure adjusting component according to claim 8, wherein, The construction method of the induction coil includes at least one of the following: 1) One end connection parts of at least some of the radially adjacent / interphase coil segments in the first coil segment group and the second coil segment group form paired connections, and the other end connection parts form adjacent variable diameter connections / interphase variable diameter connections to construct the induction coil; 2) One end connection parts of at least some of the coil segments in the first coil segment group and the second coil segment group form adjacent variable diameter connections / interphase variable diameter connections, and the other end connection parts form adjacent variable diameter connections / interphase variable diameter connections to construct the induction coil; 3) Adjacent variable diameter connections of the connection parts at both ends are alternately carried out between at least some of the coil segments in the first coil segment group and the second coil segment group in sequence to constitute two complementary sub-coils along the circumference to form an induction coil; 4) The coil segments in different radial regions of the first coil segment group and the second coil segment group are respectively conductively connected to form at least two sub-coils arranged inside and outside in the radial direction to form an induction coil.

10. The inductive coil structure adjusting component according to claim 1, wherein The coil segments not connected to the radio frequency source are left for standby or removed; and / or, the coil segments in the first coil segment group and the second coil segment group are semi-circular arcs; and / or, the connection part includes a first connection hole formed in the coil segment; the connector includes: a second connection hole corresponding to the formation position of the first connection hole, and a conductive member for combining and conductively contacting each pair of the first connection hole and the second connection hole at the corresponding position; and / or, the coil segment further includes at least one fixing hole for fixing to an attachment; and / or, the induction coil constructed by the induction coil construction device is connected to an adjustable impedance unit to reduce the impedance change caused by the change of the constructed induction coil through the impedance adjustment of the adjustable impedance unit; and / or, the induction coil construction device includes: a driving mechanism for connecting and driving the connector to switch the connection part to be conductively connected; a control device communicatively connected to the driving mechanism for controlling the driving mechanism to drive the connector to switch and connect to the target connection part in response to a trigger signal.

11. A plasma processing device, characterized in that, Comprising: A reaction chamber; an induction coil structure adjustment assembly as described in any one of claims 1 to 10.

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