Massive needling transfer device based on mechanical reciprocating structure

Through the mechanical reciprocating structure, the problem of low transfer efficiency and high cost of Mini LED display screen is solved, and efficient, low-cost, and damage-free chip transfer is achieved, improving the transfer yield and reducing environmental pollution.

CN120435140APending Publication Date: 2025-08-05BEIJING HAIJU ELECTRONIC TECHNOLOGY CO LTD

Patent Information

Application Number
CN202410312337.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-03-19
Publication Date
2025-08-05

AI Technical Summary

Technical Problem

The existing Mini LED display massive transfer technology has problems such as low transfer efficiency, high cost, low yield and environmental pollution, and the existing transfer methods cannot meet production needs.

Method used

A large-scale needle-punching transfer device based on mechanical reciprocating structure is adopted, and a rotating motor drives vertical needle-punching of the mechanical structure, which is evenly arranged on the blue film, is used to pierce the chip flexible needle-punching to the target solder joint, avoiding complex movements, mechanical structure restrictions, laser pollution and motor resonance, and achieving flexible contact and efficient transfer.

Benefits of technology

It realizes efficient, low-cost and damage-free transfer of Mini LED chips, improves transfer yield, simplifies the transfer process, and reduces the risk of pollution to the environment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a needling mass transfer device based on a mechanical reciprocating structure, and relates to the technical field of mass transfer, the needling mass transfer device comprises a marble base, and a mechanical needling system, a blue film moving system and a PCB moving system which are arranged on the marble base, the mechanical needling system is arranged on a portal frame, and the portal frame is fixed at the top of the marble base; the PCB moving system is fixed to the center of the marble base, and the blue film moving system is arranged above the PCB moving system in a crossing mode and located below the mechanical needling system. According to the needling mass transfer device based on the mechanical reciprocating structure, the mechanical structure is used for driving the mechanical structure to conduct vertical needling through the rotating motor, and chips evenly distributed on a blue film are flexibly needled to a target welding spot; and non-direct motor driving, flexible contact and theoretically no transfer speed upper limit Mini LED chip mass transfer can be realized.
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Description

Technical Field

[0001] The present invention relates to the technical field of mass transfer, and particularly to a needle-piercing mass transfer device based on a mechanical reciprocating structure. Background Art

[0002] The advent of the information age means that more information and resources will be disseminated through display screens. The display technology has achieved high-definition display from cathode ray tubes (CRTs) to liquid crystal displays (LCDs). However, the defects of display afterimages and the inability to self-emit light have restricted the development of LCDs. Since organic light-emitting diodes (OLEDs) have achieved self-emitting display and have an extremely fast response speed, but the lifespan of OLED displays is not long, and the phenomenon of "burn-in" is likely to occur, and the screen will flicker at a low frequency, which harms people's eyes. As a new generation of display technology, MiniLED uses arrayed inorganic self-emitting micron-level LED chips, reducing response time, power consumption, etc., and improving color gamut, dynamic zoning degree, contrast, etc., thus solving the above problems.

[0003] The production process of Mini LED display panels is long and complex, mainly including chip preparation, chip transfer, defect detection and repair, etc. Among them, mass transfer technology refers to picking up or peeling off nearly hundreds of millions of Mini LED grains from the source substrate through a high-precision transfer device and transferring them to the target substrate through a high-speed and precise positioning mechanism. To produce an ordinary 4K screen, the number of micron-level LED chips to be transferred will reach millions or even tens of millions. Transferring 10,000 chips at a time requires at least hundreds of repetitions. The number of transferred chips is huge, and the accuracy requirement is extremely high. As a result, mass transfer has become the key link restricting production capacity in the back-end packaging process of Mini LED and is the main factor restricting the mass production of LED display screens at present. Currently, there are many transfer methods internationally, and most of them remain at the laboratory stage. The transfer methods used in the industry for production are mainly divided into two types: mechanical swing arm type and needle-piercing type. Due to its own structure, the production capacity of the mechanical swing arm type is restricted and cannot be significantly improved. The needle-piercing transfer optimizes the transfer stroke and transfer structure, uses a needle to pierce the chip to drive the transfer, has low requirements for the film material, and does not require complex actions. It is the best alternative to the mechanical swing arm type and is also the most promising transfer method currently used in production.

[0004] In the existing technology:

[0005] The die bonder described in the authorized patent 202111674090.9 uses a turret mechanism to drive the suction nozzle to pick up the chips lifted by the piercing mechanism, and the swing arm places the chips at the specified position to achieve transfer. It adopts the traditional mechanical swing arm transfer method, which has a low price and wide application. It is the current mainstream transfer method. However, the movement in the transfer process is complex, and the transfer efficiency is limited by the mechanical structure, and it can no longer meet the current production requirements.

[0006] A laser projection proximity massive transfer device described in the patent application 202210520859.X makes use of the advantages of high frequency and high precision of laser. Under the action of ultraviolet or infrared laser, the sacrificial layer is ablated to generate gas, and the sacrificial layer generates bubbles to achieve transfer. However, it is difficult to achieve uniform distribution of the sacrificial layer material, and the decomposed bubbles are relatively divergent, resulting in easy posture change and position deviation of the chips, reducing the chip transfer yield. In addition, the sacrificial layer material cannot be reused and toxic and harmful substances will be generated during the decomposition process, polluting the working environment.

[0007] A laser debonding acupuncture pneumatic chip massive transfer mechanism described in the authorized patent 202311212308.8 uses laser to debond the UV blue film, and the method of acupuncture plus blowing generates bubbles to drive the chip to peel off. This scheme utilizes the characteristics of the UV blue film, uses laser to change the properties of the film material, then adjusts the depth by acupuncture, and the air nozzle blows air to form bubbles to drive the chip to peel off. It can achieve autonomous adjustment of the blue film viscosity, improving the chip transfer yield. And the laser changes the film tension, which can make the film material generate bubbles with good shape. However, the problem of substrate warping still exists, and the bubble height cannot accurately match the substrate spacing, resulting in a low transfer yield. In addition, this scheme uses a laser, which greatly increases the cost. The laser reaction point is relatively close to the PCB substrate, and the laser is likely to be reflected onto the PCB substrate during the transfer process, which will damage the solder mask layer on the PCB substrate, causing the copper layer to be exposed, affecting the life of the PCB substrate. The laser will also damage the symbols and words sprayed on the surface of the PCB substrate, affecting recognition and aesthetics. The high cost of the laser results in a high transfer cost.

[0008] A method, device and transfer head structure for massive transfer of LED chips described in the patent application 202311212790.5 uses two-stage acupuncture transfer. A pressure sensor is provided at the front end of the acupuncture head to check whether the transfer is successful through the value of the pressure sensor, which has the advantage of real-time monitoring of the transfer situation. Under the condition of motor-driven acupuncture, the frequency is affected by motor performance, rail accuracy, device self-weight and resonance, and it is difficult to improve. And it requires the use of high-precision motors, drivers and controllers, resulting in high prices and difficulties in early development; the contact force value of the chip is small, and it is difficult to accurately measure using traditional sensors. If high-precision sensors are used, it will inevitably lead to an increase in transfer costs. In addition, the acupuncture head is in rigid contact with the chip, which causes great damage to the light-emitting surface of the chip, resulting in a short product life and poor transfer effect. Summary of the Invention

[0009] The object of the present invention is to provide a needle-punching massive transfer device based on a mechanical reciprocating structure, which uses a mechanical structure to drive the mechanical structure to vertically punch needles through a rotating motor, and flexibly punch the chips evenly arranged on the blue film to the target solder joints, so as to achieve massive transfer of Mini LED chips with non-direct motor drive, flexible contact, and theoretically no upper limit on the transfer speed.

[0010] To achieve the above object, the present invention provides a needle-punching massive transfer device based on a mechanical reciprocating structure, including a marble base and a mechanical needle-punching system, a blue film moving system, and a PCB moving system arranged on the marble base. The mechanical needle-punching system is arranged on a gantry, the gantry is fixed on the top of the marble base, the PCB moving system is fixed in the center of the marble base, the blue film moving system straddles above the PCB moving system, and the blue film moving system is located below the mechanical needle-punching system.

[0011] Preferably, the mechanical needle-punching system includes a needle-punching fixing plate, a rotating motor, a transfer wheel assembly, a guiding tooling, a transfer spring, and a flexible needle-punching component. The needle-punching fixing plate is fixed at the center of the upper surface of the gantry, the rotating motor is fixed at the center of the upper surface of the needle-punching fixing plate, the motor output shaft of the rotating motor passes downward through the needle-punching fixing plate and is linked with the transfer wheel assembly. The transfer wheel assembly is arranged below the needle-punching fixing plate and is sleeved and connected with the lower surface of the needle-punching fixing plate through a bearing. The guiding tooling is arranged below the needle-punching fixing plate, the flexible needle-punching component is arranged between the guiding tooling and the transfer wheel assembly, and the transfer spring is sleeved outside the flexible needle-punching component.

[0012] Preferably, the guiding tooling includes a left lifting rod, a right lifting rod, a circular hanging plate, and a linear bearing. The tops of the left lifting rod and the right lifting rod are connected to the needle-punching fixing plate through adjusting screws, the bottoms of the left lifting rod and the right lifting rod are connected to the circular hanging plate, and a linear bearing is arranged below the circular hanging plate.

[0013] Preferably, the transfer wheel assembly includes a transfer wheel base and a plurality of driving blocks arranged below the transfer wheel base. The center of the upper surface of the transfer wheel base is connected to the motor output shaft. The driving blocks are arranged around the center of the transfer wheel base, and the surface shape of the driving blocks conforms to the following formula:

[0014] Z = -X * sin(X) (0 ≥ X ≤ π).

[0015] Preferably, the flexible needle assembly includes a vertical transfer rod, a horizontal transfer rod, a driving contact head, and a flexible needle. One end of the horizontal transfer rod is vertically fixed to the top end of the vertical transfer rod. The driving contact head is disposed above the other end of the horizontal transfer rod and contacts the driving block. The vertical transfer rod passes downward through the circular suspension plate and the linear bearing. The flexible needle is disposed at the bottom end of the vertical transfer rod. A transfer spring is sleeved around the vertical transfer rod. The transfer spring is located between the horizontal transfer rod and the circular suspension plate. Both ends of the transfer spring are fixedly connected to the horizontal transfer rod and the circular suspension plate respectively.

[0016] Preferably, the transfer spring is made of one or more of carbon spring steel wire, music wire, oil-quenched and tempered carbon steel wire, oil-quenched and tempered silicon manganese steel wire, and valve oil-quenched and tempered chromium silicon steel wire.

[0017] Preferably, the driving contact head is made of one or more of high-rigidity and anti-friction aluminum-lithium alloy, titanium-aluminum alloy, magnesium alloy, beryllium alloy, and titanium alloy.

[0018] Preferably, the diameter of the flexible needle is 50μm - 100μm, and the flexible needle is made of one or more of polyimide material, polydimethylsiloxane, and polyethylene terephthalate.

[0019] Preferably, the blue film moving system includes a left motor stator, a right motor stator, a front lead screw motor, a rear lead screw motor, and a blue film moving seat. The left motor stator and the right motor stator are respectively fixed on both sides of the marble base and below the gantry. A left motor rotor is provided on the left motor stator. A lead screw fixing plate is provided above the left motor rotor. The front lead screw motor and the rear lead screw motor are disposed outside the lead screw fixing plate. The output lead screws of the front lead screw motor and the rear lead screw motor pass through the lead screw fixing plate and extend in the direction of the right motor stator. A right motor rotor is provided above the right motor stator. A bearing fixing plate is provided above the right motor rotor. Two lead screw bearings are provided above the bearing fixing plate. The end of the output lead screw is rotatably connected to the lead screw bearing. Screw connection seats are respectively provided at the four corners of the top surface of the blue film moving seat. The output lead screw passes through the middle of the screw connection seat and is threadedly connected to the screw connection seat. A blue film is provided in the center of the blue film moving seat. Mini LED chips are provided on the lower surface of the blue film.

[0020] Preferably, the PCB moving system includes a lower motor stator, a lower sliding table, an upper motor stator, and a PCB vacuum base. The lower motor stator is fixedly provided in the center of the marble base. The lower motor stator is arranged parallel to the left motor stator and the right motor stator. A lower motor rotor is provided on the lower motor stator. Lower left guide rails and lower right guide rails are respectively arranged symmetrically and in parallel on both sides of the lower motor stator. The center of the bottom surface of the lower sliding table is fixedly connected to the lower motor rotor. Both sides of the bottom surface of the lower sliding table are slidably connected to the lower left guide rail and the lower right guide rail respectively;

[0021] The upper motor stator is fixed at the center of the top surface of the lower sliding table. The upper motor stator is perpendicular to the lower motor stator. An upper motor mover is provided on the upper motor stator. On both sides of the upper motor stator, a front upper guide rail and a rear upper guide rail are symmetrically arranged in parallel. The center of the bottom surface of the PCB vacuum base is fixedly connected to the upper motor mover. On both sides of the bottom surface of the PCB vacuum base, it is slidably connected to the front upper guide rail and the rear upper guide rail respectively. The PCB substrate is placed on the upper surface of the PCB vacuum base.

[0022] Therefore, the present invention adopts a mechanical reciprocating structure-based needle-punching massive transfer device with the above structure. Compared with the traditional swing-arm type transfer, it avoids the defects of complex transfer process actions and transfer efficiency being limited by the mechanical structure; compared with the laser irradiation sacrificial layer bubbling method, it avoids the defects of chip loss during the top suction process and fatigue caused by repeated use of the mechanical transfer spring; compared with the pneumatic needle-punching method, it avoids the defects of easy chip offset and generation of harmful gases during the transfer process; compared with the laser debonding needle-punching pneumatic transfer, it eliminates the defects of mismatched spacing between bubbles and the substrate, high cost, and easy damage to the PCB substrate; compared with the two-stage needle-punching method, it eliminates the defects of performance being limited by the motor, easy resonance of the motor, and easy damage to the chip structure on the light-emitting side by direct needle-punching. It has the advantages of simple transfer process, short transfer stroke, high efficiency, high yield, no damage to the chip structure, reusable, low transfer cost, and harmless transfer process, and can achieve massive transfer of flexible contact Mini LED chips.

[0023] Next, through the drawings and embodiments, the technical solutions of the present invention will be further described in detail. Description of the Drawings

[0024] Figure 1 It is a schematic structural diagram of an embodiment of a mechanical reciprocating structure-based needle-punching massive transfer device of the present invention;

[0025] Figure 2 It is a schematic structural diagram of the mechanical needle-punching system of an embodiment of the present invention;

[0026] Figure 3 It is a schematic cross-sectional structural diagram of the mechanical needle-punching system of an embodiment of the present invention;

[0027] Figure 4 It is a schematic structural diagram of the transfer wheel assembly of an embodiment of the present invention;

[0028] Figure 5 It is a schematic structural diagram of the guiding tooling of an embodiment of the present invention;

[0029] Figure 6 It is a schematic structural diagram of the flexible needle-punching assembly of an embodiment of the present invention;

[0030] Figure 7 It is a schematic structural diagram of the blue film moving system of an embodiment of the present invention;

[0031] Figure 8 Schematic diagram of the PCB moving system structure according to an embodiment of the present invention;

[0032] Figure 9 Curved surface function diagram of the lower surface of the driving block according to an embodiment of the present invention.

[0033] Reference numerals

[0034] 1. Marble base; 2. Gantry; 3. Needle-piercing fixing plate; 4. Rotating motor; 5. Transfer wheel assembly; 501. Motor output shaft; 502. Transfer wheel base; 503. Driving block; 6. Guiding tooling; 601. Linear bearing; 602. Circular hanging plate; 603. Left lifting rod; 604. Right lifting rod; 7. Transfer spring; 8. Flexible needle-piercing assembly; 801. Driving contact head; 802. Horizontal transfer rod; 803. Vertical transfer rod; 804. Flexible needle head; 9A. Left motor stator; 9B. Right motor stator; 10A. Left motor rotor; 10B. Right motor rotor; 11. Screw fixing plate; 12A. Front screw motor; 12B. Rear screw motor; 13. Blue film moving seat; 14. Lower motor stator; 15A. Lower left guide rail; 15B. Lower right guide rail; 16. Lower sliding table; 17. Upper motor stator; 18A. Upper front guide rail; 18B. Upper rear guide rail; 19. PCB vacuum base; 20. Bearing fixing plate; 21. Screw bearing; 22. Output screw; 23. Screw connection seat. Detailed implementation manners

[0035] The technical solutions of the present invention will be further described below with reference to the drawings and embodiments.

[0036] Embodiment

[0037] As Figure 1 shown, a needle-piercing massive transfer device based on a mechanical reciprocating structure includes a marble base 1 and a mechanical needle-piercing system, a blue film moving system, and a PCB moving system provided on the marble base 1. The mechanical needle-piercing system is provided on the gantry 2, the gantry 2 is fixed on the top of the marble base 1, the PCB moving system is fixed in the center of the marble base 1, the blue film moving system straddles above the PCB moving system, and the blue film moving system is located below the mechanical needle-piercing system.

[0038] As Figure 2 and Figure 3As shown in the figure, the mechanical needle punching system includes a needle punching fixing plate 3, a rotating motor 4, a transfer wheel assembly 5, a guiding tooling 6, a transfer spring 7, and a flexible needle punching assembly 8. The needle punching fixing plate 3 is fixed at the center of the upper surface of the gantry 2, and the center of the needle punching fixing plate 3 is slightly offset forward from the gantry 2. The rotating motor 4 is fixed at the center of the upper surface of the needle punching fixing plate 3. The motor output shaft 501 of the rotating motor 4 passes downward through the needle punching fixing plate 3 and is linked with the transfer wheel assembly 5. The transfer wheel assembly 5 is arranged below the needle punching fixing plate 3 and is sleeved and connected with the lower surface of the needle punching fixing plate 3 through a bearing. When the rotating motor 4 is started, the motor output shaft 501 drives the transfer wheel assembly 5 to rotate.

[0039] As Figure 4 shown in the figure, the transfer wheel assembly 5 includes a transfer wheel base 502 and a number of driving blocks 503 arranged below the transfer wheel base 502. The center of the upper surface of the transfer wheel base 502 is connected to the motor output shaft 501 by a welding process. The driving blocks 503 are arranged around the center of the transfer wheel base 502. As Figure 9 shown in the figure, the surface shape of the driving block 503 conforms to the following formula:

[0040] Z = -X * sin(X) (0 ≥ X ≤ π).

[0041] The shape function of the driving block 503 can be reasonably designed according to different working conditions.

[0042] As Figure 5 shown in the figure, the guiding tooling 6 is arranged below the needle punching fixing plate 3. The guiding tooling 6 includes a left lifting rod 603, a right lifting rod 604, a circular hanging plate 602, and a linear bearing 601. The tops of the left lifting rod 603 and the right lifting rod 604 are connected to the needle punching fixing plate 3 by adjusting screws. The bottoms of the left lifting rod 603 and the right lifting rod 604 are connected to the circular hanging plate 602. A linear bearing 601 is arranged below the circular hanging plate 602. The linear bearing 601 has steel balls inside. By using grease to form an oil film on the surfaces of the steel balls and the rolling surface of the linear bearing 601, low friction resistance and high-precision movement can be achieved.

[0043] As Figure 6As shown, the flexible needle assembly 8 is disposed between the guiding tooling 6 and the transfer wheel assembly 5, and the transfer spring 7 is sleeved outside the flexible needle assembly 8. The flexible needle assembly 8 includes a vertical transfer rod 803, a horizontal transfer rod 802, a driving contact head 801, and a flexible needle head 804. One end of the horizontal transfer rod 802 is perpendicularly fixed to the top end of the vertical transfer rod 803. The driving contact head 801 is disposed above the other end of the horizontal transfer rod 802. The driving contact head 801 is bonded to the horizontal transfer rod 802, the horizontal transfer rod 802 is bonded to the vertical transfer rod 803, and the vertical transfer rod 803 is bonded to the flexible needle head 804 with epoxy resin glue. The driving contact head 801 contacts the driving block 503. The material of the driving contact head 801 is one or more of high-rigidity and anti-friction aluminum-lithium alloy, titanium-aluminum alloy, magnesium alloy, beryllium alloy, and titanium alloy to reduce the wear of the driving contact head 801.

[0044] The vertical transfer rod 803 passes downward through the circular hanging plate 602 and the linear bearing 601. The flexible needle head 804 is disposed at the bottom end of the vertical transfer rod 803. The flexible needle head 804 has certain flexibility and stretchability, with a diameter of 50μm - 100μm. The material of the flexible needle head 804 is one or more of polyimide material, polydimethylsiloxane, and polyethylene terephthalate. Since the flexible needle head 804 makes direct contact with the blue film, it cannot have too high hardness to avoid damaging the blue film.

[0045] The transfer spring 7 is sleeved around the vertical transfer rod 803. The transfer spring 7 is located between the horizontal transfer rod 802 and the circular hanging plate 602. Both ends of the transfer spring 7 are fixedly connected to the horizontal transfer rod 802 and the circular hanging plate 602 respectively. The material of the transfer spring 7 is one or more of carbon spring steel wire, piano wire, oil-quenched and tempered carbon steel wire, oil-quenched and tempered silicon-manganese steel wire, and valve oil-quenched and tempered chromium-silicon steel wire. The transfer spring 7 is disposed outside the flexible needle assembly 8. When the transfer wheel assembly 5 rotates, due to its convex surface shape, the driving block 503 applies pressure to the flexible needle assembly 8 through the driving contact head 801. At the same time, affected by the elastic force of the transfer spring 7, the horizontal transfer rod 802 has an upward movement tendency, so the driving contact head 801 always closely adheres to the lower surface of the driving block 503. As the transfer wheel assembly 5 rotates, the driving block 503 rotates periodically, and the driving contact head 801 also rises and falls periodically with the driving block 503, causing the flexible needle head 804 to perform reciprocating motion in the vertical direction.

[0046] As Figure 7 shown, the blue film moving system includes a left motor stator 9A, a right motor stator 9B, a front lead screw motor 12A, a rear lead screw motor, and a blue film moving seat 13. The left motor stator 9A and the right motor stator 9B are respectively fixed on both sides of the marble base 1 and are located below the gantry 2.

[0047] A left motor stator 9A is provided with a left motor rotor 10A. Above the left motor rotor 10A, there is a lead screw fixing plate 11. A front lead screw motor 12A and a rear lead screw motor 12B are arranged outside the lead screw fixing plate 11. The output lead screws of the front lead screw motor 12A and the rear lead screw motor 12B pass through the lead screw fixing plate 11 and extend towards the right motor stator 9B. Above the right motor stator 9B, there is a right motor rotor 10B. Above the right motor rotor 10B, there is a bearing fixing plate 20. Above the bearing fixing plate 20, there are two lead screw bearings 21. The end of the output lead screw 22 is rotatably connected to the lead screw bearing 21. The lead screw fixing plate 11 and the bearing fixing plate 20 are respectively driven by the left motor and the right motor, driving the lead screw fixing plate 11 and the front lead screw motor 12A, rear lead screw motor 12B, output lead screw 22 above it to move along the left motor stator 9A and the right motor stator 9B. At the four corners of the top surface of the blue film moving seat 13, there are respectively lead screw connection seats 23. The output lead screw 22 passes through the middle of the lead screw connection seat 23 and is threadedly connected to the lead screw connection seat 23. In the center of the blue film moving seat 13, there is a blue film, and Mini LED chips are arranged on the lower surface of the blue film. When the front lead screw motor 12A and the rear lead screw motor 12B are started, the two output lead screws 22 rotate synchronously, driving the blue film moving seat 13 to move along the output lead screw 22 through the lead screw connection seats 23.

[0048] As Figure 8 shown, the PCB moving system includes a lower motor stator 14, a lower slide table 16, an upper motor stator 17, and a PCB vacuum base 19. The lower motor stator 14 is fixedly arranged in the center of the marble base 1. The lower motor stator 14 is arranged parallel to the left motor stator 9A and the right motor stator 9B. The lower motor stator 14 is provided with a lower motor rotor. On both sides of the lower motor stator 14, there are respectively symmetrically arranged lower left guide rails 15A and lower right guide rails 15B in parallel. The center of the bottom surface of the lower slide table 16 is fixedly connected to the lower motor rotor. The two sides of the bottom surface of the lower slide table 16 are respectively slidably connected to the lower left guide rail 15A and the lower right guide rail 15B. The lower slide table 16 slides along the lower left guide rail 15A and the lower right guide rail 15B under the drive of the lower motor.

[0049] The upper motor stator 17 is fixed in the center of the top surface of the lower slide table 16. The upper motor stator 17 is perpendicular to the lower motor stator 14. The upper motor stator 17 is provided with an upper motor rotor. On both sides of the upper motor stator 17, there are respectively symmetrically arranged upper front guide rails 18A and upper rear guide rails 18B in parallel. The center of the bottom surface of the PCB vacuum base 19 is fixedly connected to the upper motor rotor. The two sides of the bottom surface of the PCB vacuum base 19 are respectively slidably connected to the upper front guide rail 18A and the upper rear guide rail 18B. The PCB vacuum base 19 slides along the upper front guide rail 18A and the upper rear guide rail 18B under the drive of the upper motor. The PCB substrate is placed on the upper surface of the PCB vacuum base 19. The coordinated actions of the upper motor and the lower motor enable the PCB substrate to have two degrees of freedom.

[0050] The working process of this device is as follows:

[0051] The first stage: The PCB moving system uses the lower motor stator 14 to drive the lower sliding table 16 to move and position along the directions of the lower left guide rail 15A and the lower right guide rail 15B, and uses the upper motor stator 17 to drive the PCB vacuum base 19 to move and position along the directions of the upper front guide rail 18A and the upper rear guide rail 18B, driving the PCB to move to the designated station.

[0052] The second stage: The blue film moving system uses the left motor stator 9A and the left motor mover 10A, as well as the right motor stator 9B and the right motor mover 10B to move and position along their own directions, and uses the front lead screw motor 12A and the rear lead screw motor 12B to move and position along their own directions, driving the blue film moving seat 13 to move to the designated station.

[0053] The third stage: The rotating motor 4 drives the transfer wheel assembly 5 to rotate, driving the flexible needle assembly to perform precise reciprocating motion in the vertical direction under the combined action of the transfer wheel assembly 5 and the transfer spring 7, stabbing the Mini LED chips on the blue film onto the PCB to achieve transfer.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that they can still modify or equivalently replace the technical solutions of the present invention, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A mechanical reciprocating acupuncture mass transfer device, characterized by: It includes a marble base and a mechanical needling system, a blue film moving system and a PCB moving system arranged on the marble base. The mechanical needling system is arranged on a gantry, and the gantry is fixed on the top of the marble base. The PCB moving system is fixed in the center of the marble base. The blue film moving system is arranged across the PCB moving system, and the blue film moving system is located below the mechanical needling system.

2. The mechanical reciprocating acupuncture mass transfer device according to claim 1, characterized in that: The mechanical acupuncture system includes acupuncture fixed plate, a rotating motor, a transfer wheel assembly, a guide tooling, a transfer spring, and a flexible acupuncture assembly. The acupuncture fixed plate is fixed at the center of the upper surface of the gantry, and the rotating motor is fixed at the center of the upper surface of the acupuncture fixed plate. The motor output shaft of the rotating motor passes downward through the acupuncture fixed plate and is linked to the transfer wheel assembly. The transfer wheel assembly is arranged below the acupuncture fixed plate and is connected to the lower surface of the acupuncture fixed plate through a bearing. The guide tooling is arranged below the acupuncture fixed plate, the flexible acupuncture assembly is arranged between the guide tooling and the transfer wheel assembly, and the transfer spring is arranged on the outside of the flexible acupuncture assembly.

3. The mechanical reciprocating acupuncture mass transfer device according to claim 2, characterized in that: The guide tooling includes a left lifting rod, a right lifting rod, a circular hanging plate, and a linear bearing. The tops of the left lifting rod and the right lifting rod are connected to the acupuncture fixing plate through adjusting screws, and the bottoms of the left lifting rod and the right lifting rod are connected to the circular hanging plate. A linear bearing is provided under the circular hanging plate.

4. The mechanical reciprocating acupuncture mass transfer device according to claim 3, characterized in that: The transfer wheel assembly includes a transfer wheel base and a plurality of drive blocks disposed below the transfer wheel base. The center of the upper surface of the transfer wheel base is connected to the motor output shaft. The drive blocks are disposed around the center of the transfer wheel base. The surface shape of the drive blocks conforms to the following formula: Z=-X*sin(X)(0≥X≤π).

5. The mechanical reciprocating acupuncture mass transfer device according to claim 4, characterized in that: The flexible acupuncture assembly includes a vertical transmission rod, a transverse transmission rod, a driving contact head, and a flexible needle. One end of the transverse transmission rod is vertically fixed to the top of the vertical transmission rod. The driving contact head is arranged above the other end of the transverse transmission rod. The driving contact head is in contact with the driving block. The vertical transmission rod passes downward through the circular hanging plate and the linear bearing. The flexible needle is arranged at the bottom end of the vertical transmission rod. The transfer spring is sleeved on the outer periphery of the vertical transmission rod. The transfer spring is located between the transverse transmission rod and the circular hanging plate. The two ends of the transfer spring are fixedly connected to the transverse transmission rod and the circular hanging plate respectively.

6. The mechanical reciprocating acupuncture mass transfer device according to claim 2, characterized in that: The material of the transfer spring is one or more of carbon spring steel wire, music steel wire, oil quenched and tempered carbon steel wire, oil quenched and tempered silicon manganese steel wire, and oil quenched and tempered chrome silicon steel wire for valves.

7. The mechanical reciprocating acupuncture mass transfer device according to claim 5, characterized in that: The driving contact head is made of one or more of high-rigidity, anti-friction aluminum-lithium alloy, titanium-aluminum alloy, magnesium alloy, beryllium alloy and titanium alloy.

8. The mechanical reciprocating acupuncture mass transfer device according to claim 5, characterized in that: The diameter of the flexible needle is 50 μm-100 μm, and the material of the flexible needle is one or more of polyimide, polydimethylsiloxane, and polyethylene terephthalate.

9. The mechanical reciprocating acupuncture mass transfer device according to claim 1, characterized in that: The blue film moving system includes a left motor stator, a right motor stator, a front lead screw motor, a rear lead screw motor, and a blue film moving seat. The left motor stator and the right motor stator are respectively fixed on both sides of the marble base and are located under the gantry. The left motor stator is provided with a left motor mover, and a lead screw fixing plate is provided above the left motor mover. The front lead screw motor and the rear lead screw motor are provided on the outside of the lead screw fixing plate. The output lead screws of the front lead screw motor and the rear lead screw motor pass through the lead screw fixing plate and extend toward the right motor stator. The right motor mover is provided above the right motor stator, and a bearing fixing plate is provided above the right motor mover. Two lead screw bearings are provided above the bearing fixing plate. The end of the output lead screw is rotatably connected to the lead screw bearing. Screw connecting seats are respectively provided at the four corners of the top surface of the blue film moving seat. The output lead screw passes through the middle of the lead screw connecting seat and is threadedly connected to the lead screw connecting seat. A blue film is provided in the center of the blue film moving seat, and a Mini LED chip is provided on the lower surface of the blue film.

10. The mechanical reciprocating acupuncture mass transfer device according to claim 9, characterized in that: The PCB moving system includes a lower motor stator, a lower slide, an upper motor stator, and a PCB vacuum base. The lower motor stator is fixedly arranged in the center of the marble base and is arranged parallel to the left motor stator and the right motor stator. A lower motor mover is arranged on the lower motor stator. A lower left guide rail and a lower right guide rail are respectively and symmetrically arranged on both sides of the lower motor stator. The center of the bottom surface of the lower slide is fixedly connected to the lower motor mover, and the two sides of the bottom surface of the lower slide are respectively slidably connected to the lower left guide rail and the lower right guide rail. The upper motor stator is fixed at the center of the top surface of the lower slide, the upper motor stator is perpendicular to the lower motor stator, an upper motor mover is provided on the upper motor stator, and upper front guide rails and upper rear guide rails are respectively and symmetrically provided on both sides of the upper motor stator. The center of the bottom surface of the PCB vacuum base is fixedly connected to the upper motor mover, and both sides of the bottom surface of the PCB vacuum base are respectively slidably connected to the upper front guide rail and the upper rear guide rail. The PCB substrate is placed on the upper surface of the PCB vacuum base.

Citation Information

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  • Die bonder

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