Wafer protection adhesive tape, two-component glue and application of two-component glue

Abstract

The invention provides a wafer protection adhesive tape, two-component glue and application thereof, the wafer protection adhesive tape comprises a base material layer and a composite glue layer, the composite glue layer comprises a first glue layer and a surface glue layer, and the first glue layer is compounded with the base material layer; the raw materials for preparing the surface adhesive layer comprise a component A, a component B and a photoinitiator, the mass ratio of the component B in the surface adhesive layer is 5-50wt%, the component A is an acrylate adhesive, the raw materials for preparing the component B comprise a hydroxyl monomer, an isocyanate monomer and an acrylic acid hydroxyl ester compound, and the photoinitiator is a photoinitiator. The acrylic acid hydroxyl ester compound is prepared from at least one of pentaerythritol triacrylate, dipentaerythritol pentaacrylate and trimethylolpropane diacrylate. The wafer protection adhesive tape is used for packaging and protecting the surface of a wafer, so that the reject ratio of wafer preparation can be reduced, and the probability of adhesive residue on the surface of the wafer or damage of the wafer is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of adhesives, and in particular relates to a wafer protection tape, a two-component glue and applications thereof. Background Art

[0002] In recent years, with the rapid development of the optoelectronics and microelectronics industries, various industries, including aerospace, aviation, machinery, light industry, and chemical engineering, have also been moving towards integration and miniaturization. The requirements for integrated circuits (ICs) are becoming increasingly higher in integration density and functionality, which in turn requires higher packaging density and smaller size. Wafer dicing is an essential step in the semiconductor chip manufacturing process. It is a post-processing step after slicing, separating the entire wafer into individual chips according to chip size. As a critical process in integrated circuit chip manufacturing, the quality of wafer dicing directly affects chip performance.

[0003] Since wafers are brittle and fragile during processing, broken edges and corners will affect the strength of the chip, and the surface smoothness will be easily damaged during the cutting process, which will cause pollution to subsequent processes. In order to avoid the above problems, a layer of protective tape needs to be set during the wafer cutting process to play a certain protective role and avoid subsequent troubles.

[0004] After wafer processing is complete, the protective tape is peeled off the wafer surface. UV light is generally used to reduce the adhesive strength of the protective tape, making it easier to peel. Generally speaking, the surface energy of the protective tape's base layer is lower than that of the wafer. Therefore, after UV light exposure, not only does the peeling force between the adhesive layer and the wafer surface decrease, but the interaction between the adhesive layer and the base layer is also weakened. During the tape peeling process, insufficient adhesion between the adhesive layer and the base layer can easily lead to residual adhesive on the wafer surface.

[0005] In addition, the protective tape made of the traditional one-component adhesive system faces contradictory demands that are difficult to reconcile. In actual application scenarios, the protective tape is required to have sufficient initial adhesion strength so that it can be firmly adhered to the wafer surface in the early stage of wafer cutting to prevent displacement or falling off; it is also required to have controllable peeling performance so that it can be smoothly peeled off from the wafer after cutting is completed without leaving any glue or damaging the wafer surface. However, the protective tape made of the traditional one-component adhesive system often cannot meet the performance requirements of both aspects at the same time. At the same time, the system generally has the problem of small molecule migration, which can easily cause interface failure, further weakening the bonding effect between the tape and the wafer, and reducing the reliability and stability of the protective tape during the wafer cutting process.

[0006] In summary, the wafer cutting protection tape in the existing technology has many shortcomings in performance and application. It is necessary to develop a new type of wafer cutting protection tape technology with better performance to meet the ever-evolving needs of the semiconductor manufacturing industry. Summary of the Invention

[0007] The purpose of the present invention is to provide a wafer protection tape, a two-component glue and their application. The wafer protection tape is used to encapsulate and protect the wafer surface, which can reduce the wafer preparation defect rate and reduce the probability of residual glue on the wafer surface or causing wafer damage.

[0008] According to a first aspect of the present invention, a wafer protection tape is provided, comprising a substrate layer and a composite adhesive layer, the composite adhesive layer comprising a first adhesive layer and a surface adhesive layer, the first adhesive layer being composited with the substrate layer; raw materials for preparing the surface adhesive layer comprising component A, component B and a photoinitiator, and the mass proportion of component B in the surface adhesive layer is not higher than 50wt%, component A is an acrylate adhesive, and raw materials for preparing component B comprise a hydroxyl monomer, an isocyanate monomer and an acrylic acid hydroxy ester compound, and the acrylic acid hydroxy ester compound comprises at least one of pentaerythritol triacrylate, dipentaerythritol pentaacrylate and trimethylolpropane diacrylate.

[0009] This solution sets up a multi-layer structure and uses component A of the acrylate system and component B of the polyurethane system to prepare the surface adhesive layer for bonding wafers. Based on the structural composition of components A and B, the above-mentioned hydroxy acrylate compound is introduced into component B. In this way, the high initial adhesion of the surface adhesive layer and the viscosity-reducing performance after UV irradiation are balanced, and the migration of small molecular monomers in the adhesive layer can be inhibited, thereby reducing debonding, residual adhesive, etc., thereby reducing the defective rate in the wafer preparation process.

[0010] On the one hand, the above three hydroxy acrylate compounds all belong to a three-dimensional macromolecular structure. Through the cross-linking reaction of hydroxy acrylate compounds, hydroxy monomers and isocyanate monomers, a component B with a three-dimensional network macromolecular structure is formed. Not only does it allow small molecule monomers (such as hydroxy monomers, hydroxy acrylate compounds) to participate in the cross-linking reaction, reducing the residual small molecule monomers, but it also utilizes the three-dimensional macromolecular structure formed by the hydroxy acrylate compounds to further enhance the interlayer linking force and cross-linking density, thereby further improving the cross-linking density of the surface adhesive layer on the basis of the original cross-linking density of the adhesive layer. This high-density cross-linked network can effectively hinder the movement of small molecules, extend the movement path of small molecules, increase the tortuosity of the movement path of small molecules, further reduce the residue and migration of small molecule monomers, and reduce the possibility of residual glue. On the other hand, the surface adhesive layer exhibits a unique dual-response characteristic. During the wafer cutting and expansion operations, the interface between the wafer protection tape and the wafer is firmly bonded, effectively suppressing displacement and falling off during wafer processing. When the wafer needs to be peeled, irradiating the wafer protection tape with a light source causes components A and B to rapidly polymerize, transforming the molecular structure of the surface adhesive layer and reducing the contact points between the surface adhesive layer and the wafer. The synergistic UV viscosity-reducing properties of components A and B facilitate wafer peeling and reduce residual adhesive on the wafer surface. Furthermore, the introduction of the aforementioned hydroxy acrylate compound enhances the compatibility between components A and B, making the resulting adhesive, when mixed in varying ratios, uniform in texture and easy to apply, resulting in a surface adhesive with stable performance and a smooth surface.

[0011] In particular, the wafer protection tape provided by this solution can be used in the field of wafer processing or chip manufacturing. Due to the small thickness of the wafer, the wafer is brittle and easy to break during the wafer cutting and wafer expansion operations. The use of the above-mentioned wafer protection tape to encapsulate and protect the wafer surface can not only effectively avoid damage to the wafer during the processing process, but also reduce the residual glue remaining on the wafer surface, thereby reducing the wafer preparation defect rate.

[0012] Preferably, in component B, based on the total mass of the hydroxyl monomer, isocyanate monomer, and hydroxy acrylate compound, the mass proportion of hydroxy acrylate compound is 12 to 29 wt%. By regulating the amount of hydroxy acrylate compound added as a three-dimensional macromolecule, it is possible to balance the cost of raw materials, the initial tackiness of the surface adhesive layer, the UV viscosity reduction, and the hindrance to the migration of small molecules. If the amount of hydroxy acrylate compound used is too much, the amount of hydroxyl monomer used will decrease, the proportion of long molecular chain components will decrease, the system will be more viscous and difficult to apply, and the viscosity reduction performance of the tape will decrease after UV irradiation; if the amount of hydroxy acrylate compound used is too little, the bonding performance of the components will decrease, the viscosity reduction effect after UV treatment will be insufficient, and the tape will not be easy to completely peel off from the wafer surface.

[0013] Preferably, in component B, the ratio of hydroxyl monomer, isocyanate monomer and acrylic hydroxy ester compound satisfies the following conditions: - ):N(NCO - )=0.85~0.95:1~1.05,wherein, N(OH - ) represents the amount of hydroxyl groups in acrylic glue, N(NCO - ) represents the amount of isocyanate-containing substances in isocyanate curing agents. By optimizing the ratios of hydroxyl monomers, isocyanate monomers, and acrylic hydroxy ester compounds, and regulating the ratio of hydroxyl groups, the main groups in the cross-linking reaction, to isocyanate groups, this can, on the one hand, reduce side reactions and improve the adhesion properties of the wafer protection tape. It can also reduce the free diffusion of small-molecule monomers in the surface adhesive layer, improve the long-term adhesion of the secondary curing tape, and increase the interfacial peeling force between the surface adhesive layer and the wafer. On the other hand, it can enhance the interlayer structural strength of the composite adhesive layer to reduce the increase in wafer defective rate due to adhesive debonding and residual adhesive.

[0014] Preferably, the isocyanate monomer includes at least one of hexamethylene diisocyanate (HDI), polymethylene polyphenyl polyisocyanate (PAPI), toluene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), isophorone diisocyanate (IPDI), and dicyclohexylmethane diisocyanate (HMDI).

[0015] Preferably, the hydroxy monomer includes at least one of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, trimethylolpropane diacrylate, polyethylene glycol, polypropylene glycol, ethylene oxide-propylene oxide copolymer, polyester diol, polycaprolactone diol, p-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, and hydroquinone.

[0016] Preferably, the hydroxy monomer includes at least three of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, trimethylolpropane diacrylate, polyethylene glycol, polypropylene glycol, ethylene oxide-propylene oxide copolymer, polyester diol, polycaprolactone diol, p-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, and hydroquinone.

[0017] Preferably, the hydroxyl monomer includes a first hydroxyl monomer, a second hydroxyl monomer, and a third hydroxyl monomer.

[0018] Preferably, the first hydroxyl monomer includes polyethylene glycol, polypropylene glycol, ethylene oxide-propylene oxide copolymer, polyester diol, polycaprolactone diol.

[0019] Preferably, the second hydroxy monomer includes at least one of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, and trimethylolpropane diacrylate.

[0020] Preferably, the third hydroxy monomer includes at least one of p-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, and hydroquinone.

[0021] The first hydroxyl monomer acts as a chain extender, extending the polymer backbone and improving the elastic modulus and toughness of component B. The second hydroxyl monomer acts as a chain extender and viscosity enhancer, enhancing the adhesion of the surface adhesive layer while also improving the compatibility between components A and B. The third hydroxyl monomer regulates the reaction progress by consuming some isocyanate groups, limiting excessive cross-linking and thus controlling the molecular weight distribution. By employing these three hydroxyl monomers in a coordinated design, the molecular structure of component B can be precisely controlled, balancing the controllability of the reaction process with the overall performance of the final product.

[0022] Preferably, the raw materials for preparing component B include 25 to 35 parts of hydroxyl monomer, 25 to 35 parts of isocyanate monomer, and 10 to 20 parts of hydroxyl acrylate compound.

[0023] Preferably, the raw materials for preparing component B further include a metal catalyst.

[0024] Preferably, the metal catalyst includes at least one of dibutyltin dilaurate and stannous octoate.

[0025] Preferably, the raw materials used to prepare the B component also include a solvent.

[0026] Preferably, the solvent includes at least one of toluene, acetone, and ethyl acetate.

[0027] Preferably, the raw materials used to prepare component A include a functional monomer and a solvent, wherein the functional monomer includes at least one of hydroxyethyl methacrylate, glycidyl methacrylate, and acrylic acid, and the functional monomer accounts for 2 to 10 wt % of the raw materials used to prepare component A. Specifically, based on the raw materials for preparing component A including the solvent, the weight percentage of the functional monomer is 2 to 10 wt %. For example, the weight percentage of the functional monomer is 2 wt %, 3 wt %, 4 wt %, 5 wt %, 6 wt %, 7 wt %, 8 wt %, 9 wt %, or 10 wt %.

[0028] Preferably, the raw materials for preparing component A include soft monomers, hard monomers and functional monomers, and the mass ratio is soft monomer: hard monomer: functional monomer = 20-40: 5-15: 1-10.

[0029] Preferably, the soft monomer includes at least one of isooctyl acrylate, butyl acrylate, isononyl acrylate, and ethyl acrylate.

[0030] Preferably, the hard monomer includes at least one of methyl methacrylate, isobornyl methacrylate, methyl acrylate, vinyl acetate, styrene, and acrylonitrile.

[0031] Preferably, the functional monomers include hydroxyethyl methacrylate, glycidyl methacrylate and acrylic acid.

[0032] Preferably, the raw materials for preparing component A also include an initiator, and the initiator includes at least one of azobisisobutyronitrile, azobisisoheptanenitrile, dibenzoyl peroxide, dodecyl peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, and dicumyl peroxide.

[0033] Preferably, the raw materials for preparing component A further include a solvent, and the solvent includes at least one of toluene, acetone, and ethyl acetate.

[0034] Preferably, in the raw materials used to prepare the surface adhesive layer, the mass ratio of component A to component B is 6-8:2-4.

[0035] Preferably, the photoinitiator comprises diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide (TPO).

[0036] Preferably, the raw materials used to prepare the surface adhesive layer also include processing aids.

[0037] Preferably, the raw materials used to prepare the first adhesive layer include component A. The inclusion of component A in the first adhesive layer can, on the one hand, improve the bonding performance between the first adhesive layer and the substrate layer, and on the other hand, improve the compatibility between the first adhesive layer and the surface adhesive layer, so that the adhesive used to prepare the surface adhesive layer spreads well on the surface of the first adhesive layer, which helps to reduce structural weaknesses of the wafer protection tape, improve the structural integrity of the wafer protection tape after UV irradiation, and reduce adhesive residue on the wafer surface caused by peeling of the substrate layer and the first adhesive layer.

[0038] Preferably, the raw materials for preparing the first adhesive layer include component A and component B.

[0039] Traditional adhesives typically require custom formulations due to varying surface energy levels for different substrates, leading to long R&D cycles and high production costs. However, by designing the first adhesive layer composed of components A and B, while simultaneously improving the spreading of the adhesive used to prepare the first adhesive layer on the substrate surface and the adhesion of the first adhesive layer, the synergistic effect of components A and B can be utilized to cover a wide range of substrate types.

[0040] Through the dynamic ratio control mechanism, the goal of simplifying the process and improving production flexibility is achieved. In the actual production process, when faced with different types of substrate layers, strong adhesion to different substrate layers can be achieved simply by adjusting the ratio of component A and component B, rather than relying on changing the type of raw materials to customize the adhesive layer formula for the type of substrate. Technical personnel in the industry can achieve uniform spreading on the surface of the substrate layer and good adhesion to multiple types of substrates through simple regulation of the ratio between component A and component B. It has a wide range of applications and high feasibility for mass production. This control method gives the production line extremely high flexibility. Technical personnel do not need to re-verify the raw material system. They only need to adjust the mixing ratio of component A and component B in real time according to the type of substrate to quickly adapt to the new substrate, greatly shortening the process development cycle.

[0041] Preferably, in the raw materials used to prepare the first adhesive layer, the mass proportion of component B is 5 to 50 wt%.

[0042] Preferably, among the raw materials used to prepare the first adhesive layer, component A is an acrylic adhesive, and the raw materials used to prepare component B include hydroxyl monomers, isocyanate monomers and acrylic acid hydroxy ester compounds, and the acrylic acid hydroxy ester compounds include at least one of pentaerythritol triacrylate, dipentaerythritol pentaacrylate, and trimethylolpropane diacrylate.

[0043] Preferably, in the raw materials used to prepare the first adhesive layer, the ratio of the hydroxyl monomer, isocyanate monomer and acrylic hydroxy ester compound in component B satisfies the following conditions: N(OH-):N(NCO-)=0.85-0.95:1-1.05, wherein N(OH-) represents the amount of hydroxyl substances in the acrylic ester glue, and N(NCO-) represents the amount of isocyanate substances in the isocyanate curing agent.

[0044] Preferably, in the raw materials for preparing the first adhesive layer, based on the total weight of the hydroxyl monomer, isocyanate monomer and hydroxy acrylate compound in component B, the weight proportion of the hydroxy acrylate compound is 12-29 wt %.

[0045] Preferably, among the raw materials used to prepare the first adhesive layer, the isocyanate monomer includes at least one of hexamethylene diisocyanate (HDI), polymethylene polyphenyl polyisocyanate (PAPI), toluene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), isophorone diisocyanate (IPDI), and dicyclohexylmethane diisocyanate (HMDI).

[0046] Preferably, among the raw materials used to prepare the first adhesive layer, the hydroxyl monomer includes at least one of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, trimethylolpropane diacrylate, polyethylene glycol, polypropylene glycol, ethylene oxide-propylene oxide copolymer, polyester diol, polycaprolactone diol, p-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, and hydroquinone.

[0047] Preferably, among the raw materials used to prepare the first adhesive layer, the hydroxyl monomer includes at least three of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, trimethylolpropane diacrylate, polyethylene glycol, polypropylene glycol, ethylene oxide-propylene oxide copolymer, polyester diol, polycaprolactone diol, p-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, and hydroquinone.

[0048] Preferably, in the raw materials used to prepare the first adhesive layer, the hydroxyl monomer includes a first hydroxyl monomer, a second hydroxyl monomer, and a third hydroxyl monomer.

[0049] Preferably, among the raw materials used to prepare the first adhesive layer, the first hydroxyl monomer includes polyethylene glycol, polypropylene glycol, ethylene oxide-propylene oxide copolymer, polyester diol, and polycaprolactone diol.

[0050] Preferably, in the raw materials used to prepare the first adhesive layer, the second hydroxy monomer includes at least one of hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, and trimethylolpropane diacrylate.

[0051] Preferably, in the raw materials used to prepare the first adhesive layer, the third hydroxy monomer includes at least one of p-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, and hydroquinone.

[0052] Preferably, among the raw materials used to prepare the first adhesive layer, the raw materials used to prepare component B include 25 to 35 parts of hydroxyl monomer, 25 to 35 parts of isocyanate monomer, and 10 to 20 parts of hydroxyl acrylate compound.

[0053] Preferably, among the raw materials for preparing the first adhesive layer, the raw materials for preparing component B also include a metal catalyst.

[0054] Preferably, in the raw materials used to prepare the first adhesive layer, the metal catalyst includes at least one of dibutyltin dilaurate and stannous octoate.

[0055] Preferably, among the raw materials for preparing the first subbing layer, the raw materials for preparing component B also include a solvent.

[0056] Preferably, in the raw materials used to prepare the first adhesive layer, the solvent includes at least one of toluene, acetone, and ethyl acetate.

[0057] Preferably, among the raw materials for preparing the first adhesive layer, the raw materials for preparing component A include soft monomers, hard monomers and functional monomers, and the functional monomers account for 2-10 wt % of the raw materials for preparing component A.

[0058] Preferably, in the raw materials used to prepare the first adhesive layer, the weight ratio of soft monomer: hard monomer: functional monomer is 20-40: 5-15: 1-10.

[0059] Preferably, in the raw materials used to prepare the first adhesive layer, the soft monomer includes at least one of isooctyl acrylate, butyl acrylate, isononyl acrylate, and ethyl acrylate.

[0060] Preferably, in the raw materials used to prepare the first adhesive layer, the hard monomer includes at least one of methyl methacrylate, isobornyl methacrylate, methyl acrylate, vinyl acetate, styrene, and acrylonitrile.

[0061] Preferably, in the raw materials used to prepare the first adhesive layer, the functional monomer includes at least one of hydroxyethyl methacrylate, glycidyl methacrylate, and acrylic acid.

[0062] Preferably, in the raw materials used to prepare the first adhesive layer, the functional monomers include hydroxyethyl methacrylate, glycidyl methacrylate and acrylic acid.

[0063] Preferably, among the raw materials used to prepare the first adhesive layer, the raw materials used to prepare component A also include an initiator, and the initiator includes at least one of azobisisobutyronitrile, azobisisoheptanenitrile, dibenzoyl peroxide, dodecyl peroxide, isopropylbenzene hydroperoxide, tert-butyl hydroperoxide, and diisopropylbenzene peroxide.

[0064] Preferably, among the raw materials for preparing the first adhesive layer, the raw materials for preparing component A further include a solvent, and the solvent includes at least one of toluene, acetone, and ethyl acetate.

[0065] Preferably, the raw materials used to prepare the first adhesive layer also include a processing aid.

[0066] Preferably, the substrate layer includes at least one of polyvinyl chloride (PVC), polyolefin (PO), polyethylene terephthalate (PET), and thermoplastic polyurethane (TPU).

[0067] Preferably, the polyolefin (PO) includes at least one of polypropylene (PP) and polyethylene (PE).

[0068] Preferably, when the substrate layer is polyvinyl chloride (PVC), the mass ratio of component A to component B in the raw materials used to prepare the first adhesive layer is 8-10:1-2.

[0069] Preferably, when the substrate layer is polyethylene (PE), the mass ratio of component A to component B in the raw materials used to prepare the first adhesive layer is 7-8:2-3.

[0070] Preferably, when the substrate layer is polypropylene (PP), the mass ratio of component A to component B in the raw materials used to prepare the first adhesive layer is 7-8:2-3.

[0071] Preferably, when the substrate layer is polyethylene terephthalate (PET), the mass ratio of component A to component B in the raw materials used to prepare the first adhesive layer is 6-8:2-4.

[0072] Preferably, when the substrate layer is thermoplastic polyurethane (TPU), the mass ratio of component A to component B in the raw materials used to prepare the first adhesive layer is 6-7:3-4.

[0073] Preferably, in the wafer protection tape, the first adhesive layer is compounded with the surface adhesive layer.

[0074] Preferably, the viscosity of component A is 500 to 1000 mPa·s.

[0075] Preferably, the viscosity of component B is 2500 to 4000 mPa·s.

[0076] Preferably, the solid content of component A is 39.0-41.0%.

[0077] Preferably, the solid content of component B is 72.0-75.0%.

[0078] Preferably, the peeling force of the adhesive layer formed solely by component A on the steel plate is 8 to 15 N / 25 mm.

[0079] Preferably, the peeling force of the adhesive layer formed solely by component B on the steel plate is 10 to 20 N / 25 mm.

[0080] Preferably, the wafer protection tape further includes a release layer, which is composited with the surface adhesive layer.

[0081] According to another aspect of the present invention, a method for preparing the above-mentioned wafer protection tape is provided, comprising the following operations: using the component A and the component B to prepare the wafer protection tape.

[0082] Preferably, the method for preparing the wafer protection tape comprises the following operations: preparing a semi-finished tape product containing the first adhesive layer, and compounding the surface adhesive layer with the first adhesive layer.

[0083] Preferably, the method for preparing the wafer protection tape includes preparing a semi-finished tape containing the first adhesive layer, coating a raw material for preparing the surface adhesive layer on the surface of the semi-finished tape, and curing the resultant.

[0084] Preferably, the method for preparing the wafer protection tape includes preparing a semi-finished tape containing the first adhesive layer, coating the raw material for preparing the surface adhesive layer on the surface of the release layer, curing, and compounding the surface adhesive layer with the first adhesive layer.

[0085] Preferably, the process of preparing the semi-finished adhesive tape containing the first adhesive layer includes coating a raw material for preparing the first adhesive layer on the surface of the base material layer and curing the raw material.

[0086] Preferably, the method for preparing the wafer protection tape includes the following operations: mixing component A with component B to obtain a first adhesive material for forming a first adhesive layer.

[0087] Preferably, the method for preparing the wafer protection tape comprises the following operations: mixing component A, component B and a photoinitiator to obtain a surface adhesive for forming a surface adhesive layer.

[0088] Preferably, the preparation method of component A includes the following operations: mixing the soft monomer, the hard monomer, the functional monomer and part of the solvent to obtain a mixed liquid; mixing the mixed liquid with a solvent containing an initiator and keeping it at a temperature of 70 to 90° C. for 0.5 to 1.5 hours, and then adding the remaining initiator to the reaction system until the solid content is 39.0 to 41.0%.

[0089] Preferably, when preparing component A, heat preservation is carried out in an inert gas environment.

[0090] Preferably, the preparation method of component B includes the following operations: S1. mixing the first hydroxyl monomer, the second hydroxyl monomer, the isocyanate monomer and the solvent to obtain a reaction base liquid B; S2. then mixing the reaction base liquid B with a metal catalyst and an acrylic hydroxy ester compound; S3. then adding the third hydroxyl monomer to the reaction system and keeping it warm at a temperature of 60 to 90°C until the solid content is 72.0 to 75.0%.

[0091] Preferably, in S2 for preparing component B, a metal catalyst is first added to the reaction system and kept warm at 60-90°C for 0.2-0.7 hours, and then a hydroxy acrylate compound is added to the reaction system and kept warm at 60-90°C for 1-2 hours.

[0092] Preferably, in S3 of preparing component B, the heat preservation time is 3 to 5 hours.

[0093] According to another aspect of the present invention, a two-component glue is provided, comprising component A and component B. Component A is an acrylate adhesive, and the raw materials used to prepare component B include a hydroxyl monomer, an isocyanate monomer, and an acrylate hydroxy ester compound. The acrylate hydroxy ester compound includes at least one of pentaerythritol triacrylate, dipentaerythritol pentaacrylate, and trimethylolpropane diacrylate. This two-component glue can achieve good adhesion to different substrate layers. Through dynamic ratio control, technicians can adjust the ratio of component A to component B to achieve tight adhesion to different substrate layers. The process is simple, production is flexible, and it can be quickly adapted to different substrate types, shortening the process development cycle.

[0094] Preferably, the two-component glue also includes a photoinitiator. When the two-component glue also includes a photoinitiator, the adhesive layer formed by the two-component glue has good initial tack before being exposed to UV light. After being exposed to UV light, the adhesive layer formed by the two-component glue has reduced tack, thereby facilitating the separation of the adhesive layer from the adhered object. In addition, the migration of small molecules in the adhesive layer can be inhibited, thereby reducing the occurrence of debonding, adhesive residue, and contamination of the protected surface.

[0095] According to another aspect of the present invention, there is provided application of the wafer protection tape or the two-component glue in the field of wafer processing or chip manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0096] Figure 1 This is a schematic diagram of a wafer protection tape, where the corresponding numbers are: 1. base material layer; 2. first adhesive layer; 3. surface adhesive layer; 4. release layer. DETAILED DESCRIPTION

[0097] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention and the drawings in the embodiments. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0098] Example 1

[0099] Experimental Group 1

[0100] This experimental group provides a wafer protection tape, comprising a base layer 1, a first adhesive layer 2, a surface adhesive layer 3, and a release layer 4 arranged in sequence, wherein the first adhesive layer 2 and the surface adhesive layer 3 form a composite adhesive layer. The base layer 1 comprises polyolefin PP.

[0101] The raw materials used to prepare the first adhesive layer 2 include, by weight, 20 parts of component A, 2 parts of component B, 0.02 parts of a photoinitiator, and a processing aid. The raw materials used to prepare the surface adhesive layer 3 include, by weight, 70 parts of component A, 30 parts of component B, 0.2 parts of a photoinitiator, and a processing aid. The raw materials used to prepare component A are shown in Table 1, and the raw materials used to prepare component B are shown in Table 2.

[0102] Table 1. Composition of raw materials used to prepare component A

[0103]

[0104] Note: Under the test condition of 25°C, the viscosity of component A was tested using a rotational viscosity tester, and the viscosity of component A was measured to be 848.8 mPa·s.

[0105] The preparation method of component A includes the following operations:

[0106] The soft monomer, hard monomer, functional monomer and part of the solvent (1 / 3 of the total amount of solvent added) are mixed to obtain a mixed solution, and part of the initiator (3 / 4 of the total amount of initiator added) and part of the solvent (1 / 2 of the total amount of solvent added) are mixed to form a reaction base liquid A;

[0107] In a nitrogen environment, the reaction base liquid A was heated to 80±2°C, the mixed liquid was added to the reaction base liquid A in portions, and the mixture was kept at 80±2°C for 1 hour. Then, the remaining solvent and the remaining initiator were added to the reaction system, and the mixture was kept at 80±2°C for 2 hours. The mixture was cooled to obtain component A with a solid content of 39.5±0.5%.

[0108] Table 2. Composition of raw materials used to prepare component B

[0109]

[0110] Note: Under the test condition of 25°C, the viscosity of component B was tested using a rotational viscosity tester, and the viscosity of component B was measured to be 3348.4 mPa·s.

[0111] The preparation method of component B includes the following operations:

[0112] S1. The first hydroxyl monomer, the second hydroxyl monomer and the solvent are mixed to obtain a reaction base liquid B, and the reaction base liquid B is mixed with an isocyanate monomer;

[0113] S2. First, add a metal catalyst to the reaction system obtained after mixing, and keep it warm at 80±10°C for 0.5 hours. Then, add a hydroxy acrylate compound to the reaction system, and keep it warm at 80±10°C for 1.5 hours.

[0114] S3. Then, a third hydroxyl monomer is added to the reaction system, and the mixture is kept at a temperature of 70 to 90° C. for 3.5 hours to obtain a component B having a solid content of 74.0 ± 0.5%.

[0115] The method for preparing the wafer protection tape includes the following operations:

[0116] Preparation: Mixing component A and component B to obtain a first adhesive for forming the first adhesive layer 2; mixing component A, component B and a photoinitiator to obtain a surface adhesive for forming the surface adhesive layer 3;

[0117] Coating: The first adhesive is coated on the surface of the substrate layer 1 and dried to form a first adhesive layer 2. Then, the surface adhesive is coated on the surface of the release layer 4 and dried to form a surface adhesive layer 3. The first adhesive layer 2 and the surface adhesive layer 3 are then compounded and rolled up to obtain a wafer protection tape.

[0118] In this example, different wafer protection tapes were prepared using the raw materials of the surface adhesive layer 3 as variables. The product numbers and specific variables are shown in Table 3. Aside from the variables shown in Table 3, the raw material ratios, structures, and preparation methods of the wafer protection tapes prepared in this experimental group were strictly consistent with those of Experimental Group 1.

[0119] Table 3. Specific information of each product number and corresponding variables in Example 1

[0120]

[0121] Note: For Experimental Groups 2 and 3, only the amount of functional monomers added was adjusted. The mass ratio of hydroxyethyl methacrylate, glycidyl methacrylate, and acrylic acid in the functional monomers remained strictly consistent with that in Experimental Group 1. In Table 3, the mass ratio of hydroxyl acrylate compounds is based on the total mass of hydroxyl monomers, isocyanate monomers, and hydroxyl acrylate compounds: mass ratio of hydroxyl acrylate compounds = hydroxyl acrylate compounds / (total mass of hydroxyl monomers, isocyanate monomers, and hydroxyl acrylate compounds) × 100%. "Component A:Component B" in Table 3 refers to the mass ratio of Component A to Component B in the raw materials used to prepare surface adhesive layer 3.

[0122] Control group 4

[0123] This control group prepared an adhesive tape using the same method as that provided in Experimental Group 1. The difference between this control group and Experimental Group 1 is that during the tape preparation process, the surface adhesive was applied to the surface of substrate layer 1, resulting in the adhesive tape consisting of substrate layer 1, surface adhesive layer 3, and release layer 4, arranged in that order. The remaining raw material ratios and preparation methods were strictly consistent with those of Experimental Group 1.

[0124] Test Example 1

[0125] Test subjects: The adhesive tapes prepared in Example 1 and Control Group 4 were used as test subjects.

[0126] Test items and test methods:

[0127] (1) Peel strength before UV irradiation: Referring to the test method in GB / T 2792-2014 Test method for peel strength of adhesive tapes, the test object was cut into a size of 240 mm * 150 mm, and the release layer 4 of the test object was peeled off. The surface adhesive layer 3 was attached to the steel plate and rolled back and forth three times with a 1 kg rubber roller. The test object was placed in an environment of 23 ± 1 ° C and 50 ± 5% RH for 20 minutes. Then, the test object was peeled off from the steel plate at a peeling speed of 300 mm / min and a peeling angle of 180°. The peeling force of the test object before UV irradiation was recorded.

[0128] (2) Peel strength after UV irradiation: Referring to the test method in GB / T 2792-2014 Test method for peel strength of adhesive tape, the test object was cut into a size of 24 mm * 150 mm, and the release layer 4 of the test object was peeled off. The surface adhesive layer 3 was attached to the steel plate and rolled back and forth three times with a 1 kg rubber roller. After being placed in an environment of 23 ± 1 ° C and 50 ± 5% RH for 20 minutes, a metal halide lamp with a main wavelength of 365 nm was used and the curing condition was 250 mJ / cm 2 The test object was then peeled off from the steel plate at a peeling speed of 300 mm / min and a peeling angle of 180°, and the peeling force of the test object after UV irradiation was recorded.

[0129] (3) Wafer defect rate: The release layer 4 of the test object was peeled off and the surface adhesive layer 3 was attached to the wafer surface. The wafer was cut and expanded, and then the wafer was heated at 250mJ / cm 2 UV light irradiation was performed and the wafer samples were left for 30 minutes to prepare. 10,000 wafer samples were prepared in this manner. Wafer samples with cracks, scratches, breakage, or residual adhesive on the surface were considered defective. Wafer defect rate = (number of defective wafers / number of wafer samples) × 100%.

[0130] Test results: The test results are shown in Table 4.

[0131] Table 4. Test results of the subjects

[0132]

[0133] Note: The “-” in the wafer defect rate in Table 4 means “the tape and wafer cannot be peeled off, there is a large amount of residual adhesive on the wafer surface, or the wafer is severely damaged.”

[0134] Result analysis:

[0135] Comparing the test results of experimental groups 1 to 11 with those of control groups 1 to 3 in Table 4, it can be found that compared with the tapes provided by control groups 1 to 3, the wafer protection tapes provided by experimental groups 1 to 11 can more effectively reduce the wafer preparation defect rate.

[0136] Comparing the wafer protection tapes of experimental groups 1, 4-5, and control group 1 revealed lower wafer defect rates in experimental groups 1 and 4-5 than in control group 1. This is due to the inclusion of pentaerythritol triacrylate, dipentaerythritol pentaacrylate, and trimethylolpropane diacrylate, respectively, in the surface adhesive layer 3 of experimental groups 1 and 4-5. The introduction of these three-dimensional, macromolecular hydroxy acrylate compounds creates a high-density, three-dimensional cross-linked network, further increasing the cross-linking density of the surface adhesive layer 3. This balances high initial tack and UV-resistant adhesion, resulting in a lower wafer defect rate. In contrast, the post-UV peel force of control group 1 reached 2.13 N / 25 mm, and the wafer defect rate was as high as 4.52%, further demonstrating the key role of the three-dimensional structure of the hydroxy acrylate compounds in inhibiting small molecule migration and improving interfacial peeling performance.

[0137] Comparing the tapes from experimental groups 1-11 with those from controls 2 and 3 revealed that the wafer protection tapes from experimental groups 1-11 exhibited superior overall performance compared to the tape from control group 2, whose surface adhesive layer 3 was prepared solely from component A, and the tape from control group 3, whose surface adhesive layer 3 was prepared solely from component B. In actual testing, the tape from control group 2 showed no significant viscosity reduction after UV irradiation, as evidenced by a post-UV peel force of 7.80 N / 25 mm. This made it difficult to peel the tape from the wafer surface, and it even damaged the wafer. Therefore, it was recorded as "-" in the wafer defect rate test results. After UV exposure, the peel force of the tape in Control Group 3 dropped to 1.25N / 25mm. However, a large amount of adhesive residue remained on the wafer surface after the tape was peeled off. This is because the surface adhesive composed solely of Component B cures quickly and has poor spreadability, resulting in structural weaknesses or gaps between Surface Adhesive Layer 3 and the first adhesive layer, and between Surface Adhesive Layer 3 and the wafer. During the peeling process, these structural weaknesses caused uneven force applied to the adhesive layers, resulting in a large amount of adhesive residue on the wafer surface. This demonstrates that the synergistic effect of Components A and B can not only effectively prevent damage to the wafer, but also reduce residual adhesive on the wafer surface, thereby lowering the wafer production defect rate.

[0138] By comparing the tapes of experimental group 1 and control group 4, it can be found that the peeling force of experimental group 1 and control group 4 after being exposed to UV light is smaller, but the wafer defective rate of experimental group 1 is lower than that of control group 4. This is because after the tape of control group 4 is exposed to UV light, the peeling force between the surface adhesive layer 3 and the wafer surface is reduced, and the peeling force between the surface adhesive layer 3 and the base material layer 1 is also reduced. Therefore, in the process of peeling the tape, the surface adhesive layer 3 and the base material layer 1 are prone to partial separation, resulting in residual adhesive on the wafer surface.

[0139] Example 2

[0140] 1. Prepare wafer protection tape

[0141] In this example, different wafer protection tapes were prepared using the raw material composition and preparation method described in Experimental Group 1, with the raw materials of the first adhesive layer 2 used as variables. The product numbers and corresponding variables are shown in Table 5. Aside from the variables listed in Table 5, the raw material ratios and preparation methods used in the wafer protection tapes prepared in this experiment remained strictly consistent with those in Experimental Group 1.

[0142] 2. The wafer protection tapes were tested using the wafer defect rate test method in Test Example 1. The test results are shown in Table 5. For ease of comparison, Table 5 also includes relevant information and performance indicators of the wafer protection tapes in Experimental Group 1.

[0143] Table 5. Raw material composition and test performance indicators of the wafer protection tape in this embodiment

[0144]

[0145] Result analysis:

[0146] In this test example, the test subjects were grouped according to the type of substrate layer 1. For comparison, Experimental Group 1, Experimental Group 12A, and Experimental Group 12B were grouped together; Experimental Group 13A and Experimental Group 13B were grouped together; Experimental Group 14A, Experimental Group 14B, Experimental Group 14C, and Experimental Group 14D were grouped together; Experimental Group 15A and Experimental Group 15B were grouped together; and Experimental Group 16A and Experimental Group 16B were grouped together. Based on the data shown in Table 5, within the same group, by adjusting the ratio of Component A to Component B, uniform spreading on the surface of the substrate layer 1 and good adhesion to multiple substrate types can be achieved. Based on the test objects of the above groups, it can be shown that in response to the surface energy differences of different substrate layers 1 (such as PVC, PE, PP, PET, and TPU), the ratio of component A to component B in the first adhesive layer 2 can be dynamically adjusted to optimize the bonding performance between the adhesive layer and the substrate. This can cover a variety of substrate types, simplify process development, and improve production adaptability.

[0147] Among them, in experimental group 12A, the first adhesive layer 2 is composed of a single component A, which can also achieve a low wafer defect rate. In other words, for some types of substrate layers 1, the use of a first adhesive layer 2 composed of component A can also achieve a good adhesion effect with the substrate layer 1, and even after exposure to UV light, it can also reduce residual adhesive on the wafer surface.

[0148] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A wafer protection tape, characterized in that: The invention comprises a base material layer and a composite adhesive layer, wherein the composite adhesive layer comprises a first adhesive layer and a surface adhesive layer, wherein the first adhesive layer is composited with the base material layer; the raw materials for preparing the surface adhesive layer comprise component A, component B and a photoinitiator, and the mass proportion of the component B in the surface adhesive layer is 5 to 50 wt%. The component A is an acrylic adhesive, and the raw materials used to prepare the component B include a hydroxyl monomer, an isocyanate monomer and an acrylic hydroxy ester compound, wherein the acrylic hydroxy ester compound includes at least one of pentaerythritol triacrylate, dipentaerythritol pentaacrylate and trimethylolpropane diacrylate.

2. The wafer protection tape according to claim 1, wherein: In the component B, based on the total weight of the hydroxyl monomer, the isocyanate monomer and the hydroxy acrylate compound, the weight of the hydroxy acrylate compound accounts for 12 to 29 wt %.

3. The wafer protection tape according to claim 1, wherein: The raw materials for preparing the A component include functional monomers and solvents. The functional monomers include at least one of hydroxyethyl methacrylate, glycidyl methacrylate, and acrylic acid. The functional monomers account for 2 to 10 wt % of the raw materials for preparing the A component.

4. The wafer protection tape according to claim 3, wherein: The raw materials for preparing the A component include a soft monomer, a hard monomer and the functional monomer. Calculated by mass ratio, the soft monomer: the hard monomer: the functional monomer = 20-40: 5-15: 1-10.

5. The wafer protection tape according to any one of claims 1 to 4, wherein: The raw materials for preparing the first adhesive layer include the A component.

6. The wafer protection tape according to claim 5, wherein: The substrate layer includes at least one of polyvinyl chloride, polyolefin, polyethylene terephthalate, and thermoplastic polyurethane.

7. A method for preparing the wafer protection tape according to any one of claims 1 to 6, characterized in that: The method comprises the following operations: using the component A and the component B to prepare the wafer protection tape.

8. The method for preparing the wafer protection tape according to claim 7, characterized in that: The method comprises the following operations: preparing a semi-finished adhesive tape product containing the first adhesive layer, and compounding the surface adhesive layer with the first adhesive layer.

9. A two-component glue, characterized in that: The invention comprises component A and component B, wherein component A is an acrylic adhesive, and the raw materials for preparing component B include a hydroxyl monomer, an isocyanate monomer and an acrylic hydroxy ester compound, wherein the acrylic hydroxy ester compound includes at least one of pentaerythritol triacrylate, dipentaerythritol pentaacrylate and trimethylolpropane diacrylate.

10. Use of the wafer protection tape according to any one of claims 1 to 7 or the two-component glue according to claim 9 in the field of wafer processing or chip manufacturing.

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