Etching device for optical modulator chip processing

Abstract

The invention discloses an etching device for optical modulator chip processing, and belongs to the field of chip processing, the etching device comprises an etching machine body, the top of the inner surface of the etching machine body is fixedly provided with a conveyor, the left side of the conveyor is provided with a containing bin, and the inner surface of the containing bin is slidably connected with a rotating disc; a driving part used for driving the rotating disc to rotate is assembled below the rotating disc, a pushing part used for pushing out chips is assembled above the rotating disc, a drainage part used for discharging waste water is assembled below the containing bin, and a water inlet assembly used for washing and drying the chips is assembled on the outer surface of the conveyor. The driving part is arranged to drive the rotating disc to rotate in the containing bin so as to convey the chips in sequence, hot water of the water inlet assembly is cooled through the cooling assembly and then sprayed to the chips in the rotating disc so that the chips can be washed, and the cleaned chips are dried through heat generated by the hot water of the water inlet assembly; the cleaning and drying effects are convenient.

Description

Technical Field

[0001] The present application relates to the field of chip processing, and in particular, to an etching device for processing optical modulator chips. Background Art

[0002] Etchers can be categorized as chemical and electrolytic. Chemical etching uses chemical solutions to achieve the desired etching effect through chemical reactions, while chemical etching involves removing materials through chemical reactions or physical impact. Etching existing optical modulator chips requires soaking them in deionized water for five to ten minutes to dissolve contaminants and organic matter. After soaking, the surface must be cleaned using a cleaning device to remove any residual contaminants. After cleaning, the chip surface must be dried and manually loaded.

[0003] The patent document with announcement number CN118486616B discloses an etching device for processing optical modulator chips. The invention discloses an etching device for processing optical modulator chips, which relates to the technical field of etching devices, including an etcher, a fixed frame fixedly installed on the surface of the etcher, and a drain pipe fixedly connected to the bottom of the fixed frame, and the drain pipe extends through the bottom of the etcher at one end away from the fixed frame.

[0004] The above application document dries the cleaned chips by setting up a drying mechanism. However, the drying mechanism requires an external power supply to function, and the hot air blown out by the drying mechanism may heat the chips, thereby affecting the function of the chips, making it inconvenient to dry the chips in a safer and energy-saving manner. Summary of the Invention

[0005] In view of the deficiencies in the prior art, the present invention provides an etching device for processing an optical modulator chip, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned objectives, the present application provides an etching device for processing optical modulator chips, comprising an etcher body, a conveyor fixedly installed on the top of the inner surface of the etcher body, a receiving bin provided on the left side of the conveyor, a turntable slidably connected to the inner surface of the receiving bin, a driving member for driving the turntable to rotate is installed below the turntable, a pushing member for pushing out the chip is installed above the turntable, a drainage member for discharging waste water is installed below the receiving bin, a water inlet component for rinsing and drying the chip is installed on the outer surface of the conveyor, a cooling component for cooling water is installed on the outer surface of the water inlet component, a wiping component for wiping moisture from the surface of the chip is installed on the front of the cooling component, and a rotating component for evenly rinsing the chip is installed on the outer surface of the water inlet component.

[0007] Preferably, the driving member includes a first support rod, the first support rod is fixedly connected to the bottom of the accommodating bin, the outer surface of the first support rod is fixedly connected to a carrying plate, a motor is fixedly installed above the carrying plate, the output end of the motor is fixedly connected to a rotating shaft through a coupling, the rotating shaft passes through the bottom of the accommodating bin and is rotatably connected, and the rotating shaft passes through the bottom of the turntable and is fixedly connected.

[0008] Preferably, the pushing member includes an electric push rod, which is fixedly connected to the top of the turntable, and the output end of the electric push rod is fixedly connected to a push plate.

[0009] Preferably, the drainage component includes a water storage ring, which is fixedly connected to the bottom of the accommodating bin, and a drainage pipe is fixedly connected to the bottom of the water storage ring.

[0010] Preferably, the water inlet assembly includes a hot water inlet pipe, which is fixedly connected to the left side of the conveyor, a spiral tube fixedly connected to the front end of the hot water inlet pipe, which is fixedly connected to the outer surface of the conveyor, a cooling pipe fixedly connected to the rear end of the spiral tube, a hose fixedly connected below the cooling pipe, a rotating tube fixedly connected to the lower end of the hose, a main nozzle fixedly connected to the lower end of the rotating tube, and a second support rod fixedly connected between the cooling pipe and the containing bin.

[0011] Preferably, the cooling component includes a water trough, which is fixedly connected to the outer surface of the cooling pipe, and a third support rod is fixedly connected below the water trough.

[0012] Preferably, the wiping assembly includes a sliding frame, the outer surface of the sliding frame is slidably connected to a sliding seat, a spring is elastically connected between the sliding seat and the water sink, a telescopic rod is fixedly connected to the bottom of the sliding seat, a sponge brush is fixedly connected to the bottom of the telescopic rod, a limiting plate is fixedly connected to the bottom of the water sink, a sliding groove is provided on the front of the limiting plate, the inner surface of the sliding groove is slidably connected to the sliding rod, the sliding rod is fixedly connected to the top of the sponge brush, a pressure seat is provided under the sponge brush, the pressure seat is fixedly connected to the front of the limiting plate, and the front of the limiting plate is fixedly connected to a water retaining plate.

[0013] Preferably, the wiping assembly also includes a first hydraulic warehouse, the front and rear surfaces of the first hydraulic warehouse are fixedly connected to the fourth support rod, the fourth support rod is fixedly connected to the top of the accommodating warehouse, the inner surface of the first hydraulic warehouse is slidably connected to the first hydraulic rod, the left end of the first hydraulic rod is fixedly connected to the sliding ball, the left side of the sliding ball is slidably connected to the rotating seat, the rotating seat is fixedly connected to the upper end of the rotating shaft, the outer surface of the rotating seat is fixedly connected to the top block, the second hydraulic warehouse is fixedly connected to the bottom of the water tank, the second hydraulic warehouse and the first hydraulic warehouse are connected by pipelines, the inner surface of the second hydraulic warehouse is slidably connected to the second hydraulic rod, and the second hydraulic rod is fixedly connected to the right side of the sliding seat.

[0014] Preferably, the rotating assembly includes a first support frame, the first support frame is fixedly connected to the outer surface of the accommodating chamber, the rear end of the first support frame is fixedly connected to a shaft sleeve, the shaft sleeve is rotatably connected to the outer surface of the rotating tube, a second support frame is fixedly connected above the first support frame, the rear end of the second support frame is fixedly connected to a support ring, and a torsion spring is elastically connected between the support ring and the rotating tube.

[0015] Preferably, the rotating assembly further comprises a gear, the gear is fixedly connected to the outer surface of the rotating tube, the outer surface of the rotating tube is fixedly connected to an auxiliary nozzle, a gear ring is provided behind the gear, and a connecting strip is fixedly connected between the gear ring and the rotating seat.

[0016] The benefits of this application are: , This application sets a driving part to drive the turntable to rotate in the receiving chamber to transport the chips in sequence, cools the hot water of the water inlet component through the cooling component and sprays it on the chips in the turntable for rinsing, and dries the cleaned chips through the heat generated by the hot water of the water inlet component, which facilitates cleaning and drying.

[0017] , In this application, the rotation of the turntable in the receiving chamber can drive the wiping component to move on the conveyor. The wiping component can absorb the residual moisture on the chip and squeeze out the moisture absorbed by itself during movement, which facilitates the enhancement of the drying effect.

[0018] , This application sets the movement of the wiping component to drive the main and auxiliary nozzles in the water inlet component to rotate continuously. The continuous rotation of the main and auxiliary nozzles can evenly rinse the chips in the turntable, which facilitates enhancing the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings that constitute part of this application are used to provide a further understanding of this application and make other features, objects and advantages of this application more apparent. The illustrative embodiment drawings of this application and their descriptions are used to explain this application and do not constitute an improper limitation of this application. In the drawings: Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a top view of the overall structure of the present invention; Figure 3 It is a schematic structural diagram of the first part of the present invention; Figure 4 It is a schematic structural diagram of the second part of the present invention; Figure 5 It is a right bottom view of the second structure of the present invention; Figure 6 It is a schematic structural diagram of the third part of the present invention; Figure 7 The present invention Figure 3 A schematic diagram of the structure at center A; Figure 8 The present invention Figure 5 A magnified schematic diagram of the structure at point B in the middle.

[0020] In the above figure, 1, etching machine body; 2, conveyor; 3, storage bin; 4, turntable; 5, driving member; 501, first support rod; 502, carrying plate; 503, motor; 504, rotating shaft; 6, pushing member; 601, electric push rod; 602, push plate; 7, drainage member; 701, water storage ring; 702, drainage pipe; 8, water inlet assembly; 801, hot water inlet pipe; 802, spiral pipe; 803, cooling pipe; 804, hose; 805, rotating pipe; 806, main nozzle; 807, second support rod; 9, wiping assembly; 901, sliding frame; 902, sliding seat; 903, spring; 904, telescopic rod; 905, Sponge brush; 906, limit plate; 907, sliding groove; 908, sliding rod; 909, pressure seat; 910, water retaining plate; 911, first hydraulic compartment; 912, fourth support rod; 913, first hydraulic rod; 914, sliding ball; 915, rotating seat; 916, top block; 917, second hydraulic compartment; 918, second hydraulic rod; 10, rotating assembly; 101, first support frame; 102, second support frame; 103, support ring; 104, torsion spring; 105, bushing; 106, gear; 107, auxiliary nozzle; 108, gear ring; 109, connecting strip; 11, cooling assembly; 111, water tank; 112, third support rod. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0022] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate to describe the embodiments of the present application here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0023] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0024] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0025] Furthermore, the terms "installed," "disposed," "provided with," "connected," "connected," and "socketed" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0026] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] Example 1, see Figures 1-8, this embodiment provides an etching device for processing an optical modulator chip, including an etcher body 1, which is used to etch the chip, which is a prior art. A conveyor 2 is fixedly installed on the top of the inner surface of the etcher body 1, and a transmission belt and a transmission roller are provided in the conveyor 2 to transport the chip to the etcher body 1, which is a prior art. An H-shaped support is provided at the lower left end of the conveyor 2, and a accommodating bin 3 is provided on the left side of the conveyor 2. A leakage hole is provided at the bottom of the inner surface of the accommodating bin 3, and openings are provided on the left and right sides of the accommodating bin 3 for chips to enter and exit. A turntable 4 is slidably connected to the inner surface of the accommodating bin 3, and six notches are provided around the turntable 4 for accommodating chips. A driving member 5 for driving the turntable 4 to rotate is assembled under the turntable 4, and the driving member 5 includes a first The first support rod 501 is fixedly connected to the bottom of the storage bin 3, and the outer surface of the first support rod 501 is fixedly connected to the carrier disk 502. A motor 503 is fixedly installed above the carrier disk 502, and the output end of the motor 503 faces upward. The output end of the motor 503 is fixedly connected to the rotating shaft 504 through a coupling. The rotating shaft 504 passes through the bottom of the storage bin 3 and is rotatably connected. The rotating shaft 504 passes through and is fixedly connected to the bottom of the turntable 4. A pusher 6 for pushing out the chip is equipped above the turntable 4. The pusher 6 includes an electric push rod 601, which is fixedly connected to the top of the turntable 4. The output end of the electric push rod 601 is fixedly connected to the push plate 602. The electric push rod 601 and the push plate 60 2 is six in number, the push plate 602 is arranged in the gap around the turntable 4, and a drainage piece 7 for discharging waste water is installed under the accommodating bin 3. The drainage piece 7 includes a water storage ring 701, which is hollow. The water storage ring 701 is connected to the inner surface of the accommodating bin 3 through the leakage hole in the accommodating bin 3. The water storage ring 701 is fixedly connected to the bottom of the accommodating bin 3. A drain pipe 702 is fixedly connected to the bottom of the water storage ring 701. A valve is provided at the lower end of the drain pipe 702. The outer surface of the conveyor 2 is equipped with a water inlet component 8 for washing and drying chips. The water inlet component 8 includes a hot water inlet pipe 801. The hot water inlet pipe 801 is provided with a pipe interface for connecting to a hot water source. The hot water inlet pipe 801 is fixedly connected to the left side of the conveyor 2. The hot water inlet pipe 80 1 The front end is fixedly connected to a spiral tube 802, which is fixedly connected to the outer surface of the conveyor 2 and the outer shell of the conveyor 2. The rear end of the spiral tube 802 is fixedly connected to a cooling tube 803. A hose 804 is fixedly connected below the cooling tube 803. The lower end of the hose 804 is fixedly connected to a rotating tube 805. The lower end of the rotating tube 805 is fixedly connected to a main nozzle 806. There are two hoses 804, rotating tubes 805 and main nozzles 806. A second support rod 807 is fixedly connected between the cooling tube 803 and the accommodating bin 3. There are two second support rods 807. The outer surface of the water inlet assembly 8 is equipped with a cooling assembly 11 for cooling water. The cooling assembly 11 includes a water tank 111. Cooling water is provided in the water tank 111.The water tank 111 is fixedly connected to the outer surface of the cooling tube 803. A third support rod 112 is fixedly connected below the water tank 111. There are four third support rods 112. The front of the cooling assembly 11 is equipped with a wiping assembly 9 for wiping moisture from the chip surface. The outer surface of the water inlet assembly 8 is equipped with a rotating assembly 10 for evenly rinsing the chips.

[0028] When the above device is used, the chip is first placed from the left opening of the accommodating chamber 3 so that it enters the notch on the turntable 4, and then the motor 503 is started to drive the rotating shaft 504 to rotate counterclockwise, so that the notch on the turntable 4 drives the chip to move to the right in sequence, and the chip will pass through the two main nozzles 806. At this time, the hot water inlet pipe 801 is connected to the hot water source. The hot water will enter the spiral tube 802 through the hot water inlet pipe 801, and the spiral tube 802 will generate heat. The hot water will enter the cooling pipe 803 from the spiral tube 802 and be cooled by the water in the water tank 111. Then, it will pass through the hose 804 and the rotating tube 805 from the main nozzle. The nozzle 806 sprays out, thereby cleaning the chip in the turntable 4. The chip will be cleaned twice and then moved to the opening on the right side of the accommodating chamber 3. At this time, the electric push rod 601 is started to push the push plate 602. The push plate 602 will push the chip out of the gap on the turntable 4. At this time, the chip will fall onto the conveyor 2 and be transported to the right. It will be arranged in sequence as the turntable 4 transports the chip. The chip on the conveyor 2 will move in the spiral tube 802 during transportation. At this time, the heat of the spiral tube 802 will dry the chip until the chip moves to the etcher body 1. At this time, the chip is etched by the etcher body 1.

[0029] Example 2, see Figure 3-Figure 8, the wiping assembly 9 includes a sliding frame 901, the shape of the sliding frame 901 is triangular, the outer surface of the sliding frame 901 is slidably connected to a sliding seat 902, the shape of the sliding seat 902 is T-shaped, and a spring 903 is elastically connected between the sliding seat 902 and the water tank 111. A telescopic rod 904 is fixedly connected to the bottom of the sliding seat 902. There are two telescopic rods 904. A sponge brush 905 is fixedly connected to the bottom of the telescopic rod 904. The sponge brush 905 includes a plastic brush seat and a sponge block brush body. A limiting plate 906 is fixedly connected to the bottom of the water tank 111. A reinforcing rib is provided between the limiting plate 906 and the water tank 111. The limiting plate 906 A sliding groove 907 is provided on the front, and the sliding groove 907 is in the shape of a hook. A sliding rod 908 is slidably connected to the inner surface of the sliding groove 907, and the sliding rod 908 is in an L-shaped shape. The sliding rod 908 is fixedly connected to the top of the sponge brush 905. The sliding rod 908 is specifically connected to the plastic brush seat in the sponge brush 905. A pressure seat 909 is provided below the sponge brush 905. The left side of the pressure seat 909 is provided with an inclined surface, and the top is provided with a slightly sunken structure for squeezing out the moisture in the sponge brush 905. The pressure seat 909 is fixedly connected to the front of the limiting plate 906. The front of the limiting plate 906 is fixedly connected to a water retaining plate 910, and the water retaining plate 910 is in an arc shape. Used to block the water sliding down from the left side of the pressure seat 909, the wiping assembly 9 also includes a first hydraulic tank 911, liquid is set in the first hydraulic tank 911, the front and rear surfaces of the first hydraulic tank 911 are fixedly connected to the fourth support rod 912, the number of the fourth support rod 912 is two, the shape of the fourth support rod 912 is L-shaped, the fourth support rod 912 is fixedly connected to the top of the accommodating tank 3, the inner surface of the first hydraulic tank 911 is slidably connected to the first hydraulic rod 913, the first hydraulic rod 913 and the first hydraulic tank 911 are slidably connected by a piston, the left end of the first hydraulic rod 913 is fixedly connected to a sliding ball 914, and the sliding ball 914 slides on the left side It is connected to a rotating seat 915, which is fixedly connected to the upper end of the rotating shaft 504. A top block 916 is fixedly connected to the outer surface of the rotating seat 915. There are six top blocks 916. A second hydraulic tank 917 is fixedly connected below the water tank 111. The second hydraulic tank 917 is connected to the first hydraulic tank 911 by a pipeline. The second hydraulic tank 917 and the first hydraulic tank 911 are connected and communicated through a pipeline. A second hydraulic rod 918 is slidably connected to the inner surface of the second hydraulic tank 917. The second hydraulic rod 918 is slidably connected to the second hydraulic tank 917 by a piston. The second hydraulic rod 918 is fixedly connected to the right side of the sliding seat 902.

[0030] When the above device is in use, when the chip is pushed out from the notch on the turntable 4 onto the conveyor 2, the chip will be in front of the sponge brush 905. At this time, the turntable 4 will continue to convey the chip through the counterclockwise rotation of the rotating shaft 504, and the counterclockwise rotation of the rotating shaft 504 will drive the rotating seat 915 to rotate counterclockwise. The counterclockwise rotation of the rotating seat 915 will drive the top block 916 to push against the sliding ball 914. At this time, the sliding ball 914 will drive the first hydraulic rod 913 to retract into the first hydraulic chamber 911, and the first hydraulic rod 913 will retract into the first hydraulic chamber 911. A hydraulic rod 913 pushes the liquid in the first hydraulic chamber 911 to be injected into the second hydraulic chamber 917 through the pipeline, and then pushes the second hydraulic rod 918 to extend from the second hydraulic chamber 917. At this time, the second hydraulic chamber 917 moves toward the chips on the conveyor 2. The second hydraulic rod 918 pushes the sliding seat 902 to slide forward on the sliding frame 901, stretching the spring 903. The sliding frame 901 drives the telescopic rod 904 to move the sponge brush 905 toward the front. At this time, the sponge brush 905 is The sliding rod 908 will slide in the sliding groove 907 on the limit plate 906 and be guided by the sliding groove 907, so that the sponge brush 905 moves a distance to the front and then drops down, thereby falling on the chips on the conveyor 2 to absorb the moisture. At this time, as the rotating seat 915 continues to rotate counterclockwise, it will drive the top block 916 to leave the sliding ball 914. At this time, the spring 903 will elastically recover and pull the sliding seat 902 to slide back on the sliding frame 901. The sliding seat 902 will drive the second hydraulic rod 9 18 is retracted into the second hydraulic chamber 917, so that the first hydraulic rod 913 is extended from the first hydraulic chamber 911 until the sliding ball 914 contacts the rotating seat 915. The sliding seat 902 slides and resets on the sliding rack 901, which drives the sponge brush 905 to move away from the upper chip to prevent interference with the transportation of the next chip. The sponge brush 905 will move toward the pressure seat 909. At this time, the pressure seat 909 will squeeze the sponge brush 905 to squeeze out the water therein, so that the sponge brush 905 can absorb the water of the next chip.

[0031] Example 3, see Figure 3-Figure 7The rotating assembly 10 includes a first support frame 101, which is E-shaped. The first support frame 101 is fixedly connected to the outer surface of the accommodating chamber 3. The rear end of the first support frame 101 is fixedly connected to a sleeve 105, which is rotatably connected to the outer surface of the rotating tube 805. A bearing is provided between the sleeve 105 and the rotating tube 805. A second support frame 102 is fixedly connected to the top of the first support frame 101. The second support frame 102 is L-shaped. The rear end of the second support frame 102 is fixedly connected to a support ring 103. A torsion spring 104 is elastically connected between the ring 103 and the rotating tube 805. The rotating assembly 10 also includes a gear 106, which is fixedly connected to the outer surface of the rotating tube 805. A secondary nozzle 107 is fixedly connected to the outer surface of the rotating tube 805. Three secondary nozzles 107 are arranged on each rotating tube 805. A gear ring 108 is arranged behind the gear 106. The teeth on the gear ring 108 are arranged in sections, with a total of six sections. A connecting strip 109 is fixedly connected between the gear ring 108 and the rotating seat 915. The number of connecting strips 109 is six.

[0032] When the above-mentioned device is in use, when the rotating shaft 504 rotates counterclockwise, it will also drive the connecting bar 109 to rotate the gear ring 108 counterclockwise. The counterclockwise rotation of the gear ring 108 will drive the gear 106 to rotate. The rotation of the gear 106 will drive the rotating tube 805 to rotate the main nozzle 806. The rotation of the rotating tube 805 will also drive the auxiliary nozzle 107 to rotate, thereby facilitating uniform flushing. At this time, as the rotating tube 805 rotates, the torsion spring 104 will also be tightened. When the notch on the turntable 4 rotates one grid, the teeth on the gear ring 108 leave the gear 106, and the torsion spring 104 will reset and drive the rotating tube 805 to rotate, causing the main nozzle 806 and the auxiliary nozzle 107 to rotate, thereby continuing uniform flushing.

[0033] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. An etching device for processing an optical modulator chip, comprising an etcher body, a conveyor fixedly mounted on the top of the inner surface of the etcher body, a storage bin provided on the left side of the conveyor, a turntable slidably connected to the inner surface of the storage bin, characterized in that: A driving member for driving the turntable to rotate is installed under the turntable, a pushing member for pushing out the chip is installed above the turntable, a drainage member for discharging waste water is installed under the accommodating bin, a water inlet component for washing and drying the chips is installed on the outer surface of the conveyor, a cooling component for cooling water is installed on the outer surface of the water inlet component, a wiping component for wiping moisture from the surface of the chip is installed on the front of the cooling component, and a rotating component for evenly washing the chips is installed on the outer surface of the water inlet component.

2. The etching device for processing an optical modulator chip according to claim 1, characterized in that: The driving member includes a first support rod, which is fixedly connected to the bottom of the accommodating bin, a carrying plate fixedly connected to the outer surface of the first support rod, a motor fixedly installed above the carrying plate, and an output end of the motor fixedly connected to a rotating shaft through a coupling, the rotating shaft passes through the bottom of the accommodating bin and is rotatably connected, and the rotating shaft passes through the bottom of the turntable and is fixedly connected.

3. The etching device for processing an optical modulator chip according to claim 1, characterized in that: The pushing member includes an electric push rod, which is fixedly connected to the top of the turntable, and an output end of the electric push rod is fixedly connected to a push plate.

4. The etching device for processing an optical modulator chip according to claim 1, characterized in that: The drainage component includes a water storage ring, which is fixedly connected to the bottom of the accommodating bin, and a drainage pipe is fixedly connected to the bottom of the water storage ring.

5. The etching device for processing an optical modulator chip according to claim 1, characterized in that: The water inlet assembly includes a hot water inlet pipe, which is fixedly connected to the left side of the conveyor, a spiral pipe fixedly connected to the front end of the hot water inlet pipe, the spiral pipe fixedly connected to the outer surface of the conveyor, a cooling pipe fixedly connected to the rear end of the spiral pipe, a hose fixedly connected below the cooling pipe, a rotating pipe fixedly connected to the lower end of the hose, a main nozzle fixedly connected to the lower end of the rotating pipe, and a second support rod fixedly connected between the cooling pipe and the containing bin.

6. The etching device for processing an optical modulator chip according to claim 5, characterized in that: The cooling component includes a water tank, which is fixedly connected to the outer surface of the cooling pipe, and a third support rod is fixedly connected below the water tank.

7. The etching device for processing an optical modulator chip according to claim 6, characterized in that: The wiping assembly includes a sliding frame, the outer surface of the sliding frame is slidably connected to a sliding seat, a spring is elastically connected between the sliding seat and the water tank, a telescopic rod is fixedly connected to the bottom of the sliding seat, a sponge brush is fixedly connected to the bottom of the telescopic rod, a limiting plate is fixedly connected to the bottom of the water tank, a sliding groove is provided on the front of the limiting plate, the sliding rod is slidably connected to the inner surface of the sliding groove, the sliding rod is fixedly connected to the top of the sponge brush, a pressure seat is provided below the sponge brush, the pressure seat is fixedly connected to the front of the limiting plate, and the front of the limiting plate is fixedly connected to a water retaining plate.

8. The etching device for processing an optical modulator chip according to claim 7, characterized in that: The wiping assembly also includes a first hydraulic warehouse, the front and rear surfaces of the first hydraulic warehouse are fixedly connected to the fourth support rod, the fourth support rod is fixedly connected to the top of the accommodating warehouse, the inner surface of the first hydraulic warehouse is slidably connected to the first hydraulic rod, the left end of the first hydraulic rod is fixedly connected to the sliding ball, the left side of the sliding ball is slidably connected to the rotating seat, the rotating seat is fixedly connected to the upper end of the rotating shaft, the outer surface of the rotating seat is fixedly connected to the top block, the second hydraulic warehouse is fixedly connected to the bottom of the water tank, the second hydraulic warehouse and the first hydraulic warehouse are connected by pipelines, the inner surface of the second hydraulic warehouse is slidably connected to the second hydraulic rod, and the second hydraulic rod is fixedly connected to the right side of the sliding seat.

9. The etching device for processing an optical modulator chip according to claim 5, characterized in that: The rotating assembly includes a first support frame, the first support frame is fixedly connected to the outer surface of the accommodating chamber, the rear end of the first support frame is fixedly connected to a shaft sleeve, the shaft sleeve is rotatably connected to the outer surface of the rotating tube, a second support frame is fixedly connected above the first support frame, the rear end of the second support frame is fixedly connected to a support ring, and a torsion spring is elastically connected between the support ring and the rotating tube.

10. The etching device for processing an optical modulator chip according to claim 9, characterized in that: The rotating assembly also includes a gear, which is fixedly connected to the outer surface of the rotating tube. The outer surface of the rotating tube is fixedly connected to the auxiliary nozzle. A gear ring is provided behind the gear, and a connecting strip is fixedly connected between the gear ring and the rotating seat.

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