Acceleration test method for MEMS pressure sensor

Abstract

The invention discloses an acceleration test method for an MEMS pressure sensor, which comprises the following steps of: acquiring an MEMS pressure sensor sample which comprises a deformable membrane structure; a stress application structure is arranged on the membrane structure, and the stress application structure is a built-in electrode or an external electrode plate; applying voltage to the stress application structure, and enabling the membrane structure to deform through electrostatic force, which is equivalent to environment pressure input; installing the MEMS pressure sensor in a multi-environmental stress test device, and synchronously loading at least one environmental stress of temperature, humidity, vibration or impact; and monitoring the performance parameter change of the MEMS pressure sensor, and evaluating the reliability of the MEMS pressure sensor. By designing the stress application structure, the electrostatic force generated by loading the direct-current voltage simulates the pressure film structure to realize the input of the environmental pressure, additional equipment is not needed, and the test method is convenient and easy to implement.

Description

Technical Field

[0001] The present invention belongs to the technical field of micro-electromechanical systems (MEMS), and in particular relates to an accelerated testing method for a MEMS pressure sensor. Background Art

[0002] MEMS pressure sensors are manufactured using MEMS processing technology and are capable of measuring the pressure of liquids, gases, and other environments. Due to their use of MEMS technology, their size is significantly smaller than traditional pressure sensors. Furthermore, MEMS pressure sensors offer low power consumption, low cost, and ease of integration. These characteristics have led to their widespread application in a wide range of fields, including automotive electronics, industrial control, aerospace, and defense.

[0003] Reliability is an important assessment indicator for product engineering. During the development and application of MEMS pressure sensors, reliability tests are required to verify and improve their reliability. Therefore, conducting reliability test research on MEMS pressure sensors is of great significance for improving their reliability, reducing failure rates, and realizing engineering applications.

[0004] Reliability testing is generally accelerated by increasing environmental stress. Traditional accelerated reliability testing for microelectronic products includes tests such as temperature, humidity, vibration, and shock. Products can be subjected to single accelerated tests or multiple environmental stress accelerated tests, such as temperature, humidity, and vibration accelerated tests. MEMS pressure sensors are different from traditional microelectronic products. As a sensor, its sensitive input physical quantity is pressure, which can also affect product reliability. This is especially true for MEMS pressure sensors with a large range. Environmental pressure can cause the MEMS membrane structure to deform, and under the influence of multiple environmental stresses such as temperature and vibration, the MEMS membrane structure may be damaged.

[0005] For the reliability acceleration test of MEMS pressure sensors, a specific gas or liquid pressure is usually generated by a pressure control module to apply pressure environmental stress to the MEMS pressure sensor. This will have the following three problems: (1) It is difficult to generate a high-frequency alternating pressure by using a pressure control module, which is generally less than 10Hz. If a pressure fatigue acceleration test is to be conducted on a MEMS pressure sensor, the test time will be very long and the test cost will be high. (2) MEMS pressure sensors are often exposed to multiple environmental stresses such as pressure, temperature, and vibration during use. If the actual use environment is to be considered, the reliability acceleration test of MEMS pressure sensors requires input of physical quantities such as pressure, temperature, humidity, and vibration. In other words, it is necessary to use equipment such as a pressure control module, a temperature and humidity chamber, and a vibration table (shock table). It is difficult to integrate these devices. There is no corresponding equipment on the market. The current reliability acceleration test of MEMS pressure sensors still draws on traditional microelectronic products and does not consider the environmental physical quantity of pressure. (3) For large-range MEMS pressure sensors, the environmental pressure they face can be as high as 200 MPa. If a 200 MPa pressure test is carried out, there will be major safety issues.

[0006] Therefore, in the actual use of MEMS pressure sensors, especially large-range MEMS pressure sensors, large environmental pressure, temperature changes, and vibrations are common application environments, which can easily cause reliability problems such as membrane structure damage, performance degradation and drift. However, the current reliability accelerated test cannot simultaneously include these stresses for reliability accelerated test. Therefore, in order to improve the reliability of MEMS pressure sensors in actual use environments, it is very necessary to develop new reliability test methods to conduct accelerated tests on them in order to evaluate and improve the reliability of MEMS pressure sensors. Summary of the Invention

[0007] The main purpose of the present invention is to overcome the shortcomings and deficiencies of the existing technology and provide an accelerated test method for MEMS pressure sensors. The deformation of the membrane structure is achieved by loading a voltage, and the equivalent environmental stress is applied to the membrane structure to cause deformation. No pressure input device such as a pressure control module is required. Therefore, the use of this accelerated test method can be fully compatible with conventional reliability accelerated test methods, and the loading of the environmental pressure stress can more realistically reflect the application environmental stress, providing a more comprehensive accelerated test method for the reliability of MEMS pressure sensors.

[0008] In order to achieve the above object, the present invention adopts the following technical solutions:

[0009] The present invention provides a MEMS pressure sensor accelerated test method, comprising the following steps:

[0010] S1. Obtain a MEMS pressure sensor sample, wherein the sample includes a deformable membrane structure;

[0011] S2. Arranging a force-adding structure on the membrane structure, wherein the force-adding structure is a built-in electrode or an external electrode plate;

[0012] S3, applying voltage to the force-applying structure to deform the membrane structure through electrostatic force, which is equivalent to ambient pressure input;

[0013] S4, installing the MEMS pressure sensor in a multi-environmental stress test device, and simultaneously applying at least one environmental stress of temperature, humidity, vibration or shock;

[0014] S5. Monitor changes in performance parameters of the MEMS pressure sensor and evaluate its reliability.

[0015] As a preferred technical solution, the force-applying structure is a built-in electrode, and the built-in electrode and the membrane structure are integrated into the same sensitive structure. By loading a DC voltage signal on the force-applying structure, there is a potential difference between the force-applying structure and the membrane structure. The potential difference will generate an electrostatic force on the membrane structure, and the membrane structure will be deformed under the action of the electrostatic force.

[0016] As a preferred technical solution, in step S2, the force-applying structure is an external electrode plate, which is arranged parallel to the membrane structure and simulates dynamic pressure input through alternating voltage.

[0017] As a preferred technical solution, in step S2, the distance between the force-applying structure and the membrane structure is at the nanometer level.

[0018] As a preferred technical solution, step S2 also includes the following steps:

[0019] When the force-adding structure is not working, the sensitivity parameters of the MEMS pressure sensor are calibrated and tested to obtain the first output voltage of the MEMS pressure sensor corresponding to the set pressure, and the pressure required to be loaded is set according to the first output voltage.

[0020] As a preferred technical solution, when the force-applying structure is in operation, a voltage is applied to the force-applying structure through a voltage source, and the DC voltage is adjusted so that the second output voltage of the MEMS pressure sensor is equal to the first output voltage, thereby completing the input of the simulated loading set pressure to the MEMS pressure sensor.

[0021] As a preferred technical solution, in step S3, the voltage loading method includes:

[0022] DC voltage, used to simulate static high voltage environment;

[0023] Alternating voltage used to simulate pressure pulses or pressure cycles with a frequency range of 1 Hz to 1000 Hz.

[0024] As a preferred technical solution, in step S4, the multi-environmental stress test equipment is a three-integrated test box that simultaneously loads temperature, humidity and vibration stress.

[0025] As a preferred technical solution, in step S3, the voltage amplitude is adjusted to be equivalent to the ambient pressure input of different ranges.

[0026] As a preferred technical solution, step S5 is specifically as follows:

[0027] Collect and observe the output of the MEMS pressure sensor to evaluate the reliability of the MEMS pressure sensor, such as whether membrane damage or performance drift occurs during multi-environmental stress acceleration testing.

[0028] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0029] (1) The present invention discloses a multi-environment coupling accelerated reliability test method for MEMS pressure sensors, which innovatively breaks through the technical limitations of traditional single stress loading. This method constructs a multi-dimensional environmental stress reproduction system by integrating the collaborative loading mechanism of multiple physical fields such as pressure, temperature and humidity, mechanical vibration and impact, and effectively solves the technical difficulties of multi-stress synchronous simulation in existing reliability tests. Compared with traditional solutions, this method can accurately reproduce the composite environmental loads under the actual working conditions of the device, significantly improve the environmental fidelity of the accelerated test, thereby quickly inducing potential failure modes and providing a key experimental platform for the reliability evaluation and optimization of MEMS pressure sensors. The innovatively designed electrostatic drive forcing module adopts the voltage-electrostatic force conversion principle and realizes dynamic stress loading of the pressure-sensitive membrane structure through DC excitation. While eliminating the dependence on external pressure sources, it constructs an electro-mechanical coupled closed-loop test environment. This integrated design scheme not only greatly simplifies the complexity of the test device, but also realizes the precise control of test parameters, significantly improving the engineering applicability of the accelerated test.

[0030] (2) The core technological breakthrough of the present invention lies in the innovative design of an embedded / external electrostatic loading unit, which realizes the environmental stress equivalent loading of the pressure-sensitive membrane structure through the voltage-electrostatic force conversion mechanism. Specifically, the force module establishes a precisely controllable electrostatic force field in the pressure-sensitive area by applying programmable DC voltage excitation, breaking through the technical limitations of the traditional mechanical loading mode. This electric-mechanical coupling loading mechanism can not only simulate steady-state high voltage (corresponding to constant voltage DC excitation), dynamic pressure pulses (corresponding to square wave voltage sequences) and cyclic pressure loads (corresponding to alternating voltage waveforms), but also realize the precise reproduction of complex pressure spectra through digital control of voltage amplitude / frequency. This innovative solution eliminates the complexity of traditional hydraulic / pneumatic loading systems while realizing full-domain programmable control of test stress parameters, and constructs an electrically controlled standard loading platform for multi-dimensional reliability verification of MEMS pressure sensors.

[0031] (3) The present invention adopts this method to load environmental stress in the multi-environmental stress accelerated test of the MEMS pressure sensor. Existing reliability equipment, such as a three-in-one test chamber, can be used to simultaneously load multiple stresses such as pressure, temperature, humidity, and vibration, simulating the actual application environment and testing the reliability of the MEMS pressure sensor more comprehensively and accurately. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0033] Figure 1 This is a schematic diagram of the sensitive structure of the MEMS resistive pressure sensor in this embodiment;

[0034] Figure 2 A flowchart of a MEMS pressure sensor accelerated test method provided in this embodiment;

[0035] Figure 3 This is a schematic diagram of a force-adding structure built into a sensitive structure in this embodiment;

[0036] Figure 4 This is a schematic diagram of an external force-adding structure on a sensitive structure in this embodiment. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0038] References to "embodiments" in this application mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0039] The present invention uses traditional reliability testing equipment to complete the reliability test of the MEMS pressure sensor, and several major existing reliability testing equipment and their uses.

[0040] The pressure sensor performance detection system can output accurate pressure of different sizes (the pressure is a constant value) through the pressure control module. This pressure can be used as the input of the MEMS pressure sensor, which can be used to calibrate the sensitivity and range of the MEMS pressure sensor.

[0041] The pressure test analysis system is a commonly used test device for conducting accelerated reliability tests on pressure sensors. It utilizes a pressure control module to input ambient pressure (this pressure can be static or dynamic, with dynamic pressure generally less than 10Hz) into the MEMS pressure sensor. The device also integrates a temperature chamber to apply temperature stress to the product. Therefore, the pressure test analysis system can simultaneously apply pressure and temperature stress to the MEMS pressure sensor, allowing for accelerated reliability testing of the MEMS pressure sensor under ambient pressure and temperature stress.

[0042] HALT / HASS test chambers can apply temperature and vibration stress to products. They are often used for product aging tests and reliability testing under high and low temperature + strong vibration conditions. They cannot apply environmental stress.

[0043] As can be seen from the above devices, some devices can apply multiple stresses to MEMS pressure sensors to perform accelerated tests on them. However, there is currently no device that simultaneously integrates pressure + temperature + humidity + vibration / shock. This is mainly because the devices used for pressure input are relatively special and difficult to be compatible with devices that load environmental stresses such as vibration and humidity. It is difficult to achieve a test environment that takes into account environmental pressure, vibration, and humidity.

[0044] The present invention is based on the inherent characteristics of MEMS pressure sensors to achieve equivalent loading of ambient pressure. In order to more clearly understand the technology of the present invention, it is necessary to introduce the sensitive structural characteristics and working principles of MEMS pressure sensors.

[0045] Pressure sensors can measure the pressure of liquid or gas environments. MEMS pressure sensors generally consist of two parts. One part is sensitive to the external environmental pressure, causing changes in other physical quantities, such as resistance. This part is called the sensitive structure. The other part is the detection circuit, which detects the changed physical quantity. Since the innovative part of this invention is in the sensitive structure, the sensitive structure in the MEMS pressure sensor is mainly explained. Figure 1 This is a schematic diagram of the sensitive structure of a MEMS resistive pressure sensor, which, from bottom to top, includes the substrate, single crystal silicon, doped silicon, silicon dioxide, and sensitive resistor.

[0046] It is understandable that the sensitive structure of a MEMS resistive pressure sensor is mainly composed of a membrane structure and a piezoresistor. When there is pressure in the external environment, the thin membrane structure will deform under the action of the external pressure. The deformation of the membrane structure will generate tensile and compressive stress on the piezoresistor, which in turn causes the resistance of the piezoresistor to change. The magnitude of the environmental pressure can be measured by detecting the magnitude of the change in the piezoresistor through the detection circuit.

[0047] Traditionally, ambient pressure input is applied to MEMS pressure sensors via pressure generated by pressure control equipment. This invention, based on the sensitive structure of MEMS pressure sensors, applies electrostatic force to the membrane structure, thereby equivalently inputting external ambient pressure based on the membrane's deformation. This method avoids the use of ambient pressure input equipment such as pressure control equipment, while achieving a high equivalent ambient pressure input. Therefore, this method can be applied to existing multi-environmental stress acceleration tests, enabling MEMS pressure sensors to perform multi-environmental stress acceleration tests that take into account ambient pressure input, such as pressure, temperature, humidity, and vibration multi-environmental stress acceleration tests.

[0048] like Figure 2 As shown, this embodiment provides a MEMS pressure sensor accelerated test method, including the following steps:

[0049] S1. Obtain a MEMS pressure sensor sample, wherein the sample includes a deformable membrane structure;

[0050] S2. Arranging a force-applying structure on the membrane structure, wherein the force-applying structure is a built-in electrode or an external electrode plate; and installing a MEMS pressure sensor sample designed with the force-applying structure on a conventional reliability test device;

[0051] It is understandable that the MEMS pressure sensor is a precision measuring instrument. Therefore, when setting the force-applying structure, the distance between the force-applying structure and the membrane structure is set to the nanometer level, thereby achieving a simulated loading set pressure for the MEMS pressure sensor.

[0052] S3. Connect the MEMS pressure sensor cable and power on the pressure sensor to enable normal operation. Apply voltage to the force-applying structure, and deform the membrane structure through electrostatic force, which is equivalent to the ambient pressure input. In this way, the MEMS pressure sensor is simulated to be loaded with the ambient pressure input.

[0053] S4, installing the MEMS pressure sensor in a multi-environmental stress test device, and simultaneously applying at least one environmental stress of temperature, humidity, vibration or shock;

[0054] S5. Monitor the performance parameter changes of the MEMS pressure sensor and evaluate its reliability; specifically, collect and observe the output of the MEMS pressure sensor to see whether it can work normally or calculate the corresponding performance indicator changes.

[0055] Furthermore, the present invention has two methods for implementing electrostatic force on the membrane structure: (1) providing a force-adding structure on the sensitive structure; (2) providing an external force-adding structure. The following two specific embodiments will introduce these two methods respectively:

[0056] (1) Method of building a force-adding structure into the sensitive structure: This method requires the design of a MEMS pressure sensor sensitive structure. Figure 3 The present invention provides a schematic diagram of a MEMS pressure sensor sensitive structure provided with a force-applying structure to implement ambient pressure input to the MEMS pressure sensor. Compared to conventional MEMS pressure sensor sensitive structures, the sensitive structure in the method of this embodiment has a force-applying structure added to simulate the input of external ambient pressure and achieve equivalent deformation of the membrane structure. A DC voltage signal is applied to the force-applying structure and the membrane structure, creating a potential difference between the force-applying structure and the membrane structure. This potential difference generates an electrostatic force on the membrane structure, causing the membrane structure to deform under the action of the electrostatic force. Thus, by applying a voltage to the MEMS pressure sensor sensitive structure to generate an electrostatic force on the membrane structure, equivalent input of ambient pressure to the MEMS pressure sensor is achieved.

[0057] A specific example of using the test method of the present invention (a method of providing a force-applying structure on a sensitive structure) to conduct a multi-environment stress accelerated test on a MEMS pressure sensor is as follows:

[0058] (1.1) First, a force-applying structure is designed on the sensitive structure of the MEMS pressure sensor to obtain a MEMS pressure sensor sample that can apply force to the membrane structure;

[0059] (1.2) When the force-adding structure is not working, perform calibration tests on the MEMS pressure sensor for parameters such as sensitivity, such as the MEMS pressure sensor output U1 corresponding to a pressure of 1 MPa;

[0060] (1.3) Install and fix the MEMS pressure sensor on reliability equipment (such as HALT / HASS test chamber, temperature and humidity chamber, or vibration table, etc.);

[0061] (1.4) Connect the MEMS pressure sensor cable and power on the pressure sensor to ensure normal operation;

[0062] (1.5) Set the required pressure, such as 1 MPa. Apply voltage to the force structure through the voltage source and adjust the DC voltage so that the output of the pressure sensor is U2 = U1. This simulates a 1 MPa pressure input to the MEMS pressure sensor.

[0063] (1.6) Set environmental stress parameters such as temperature high and low temperature curves, vibration spectrum, and humidity, start reliability equipment (such as HALT / HASS test chamber or temperature and humidity chamber or vibration table, etc.), and apply corresponding environmental stress (such as temperature, humidity, vibration, etc.) to the MEMS pressure sensor;

[0064] (1.7) Collect and observe the output of the MEMS pressure sensor to evaluate whether the MEMS pressure sensor has any reliability issues such as membrane damage and performance drift during the multi-environment stress acceleration test.

[0065] (2) External force-adding structure method: This method does not require the design of an additional MEMS pressure sensor sensitive structure. An electrode plate is designed and manufactured and placed above the MEMS pressure sensor sample, close to the MEMS pressure sensor membrane structure. The electrode plate is parallel to the membrane structure to form a force-adding structure. Figure 4 This is a schematic diagram of the present invention realizing ambient pressure input to the MEMS pressure sensor through an external force-applying structure. In this method, the force-applying structure is arranged parallel to the top of the membrane structure through a bracket, thereby simulating the pressurization process.

[0066] Another specific example of using the test method of the present invention (the method of external force-applying structure) to conduct an accelerated test on a MEMS pressure sensor is as follows:

[0067] (2.1) Prepare the MEMS pressure sensor sample to be tested and install it on the vibration table;

[0068] (2.2) Design and fabricate an electrode plate, and install it above the MEMS pressure sensor sample, close to the MEMS pressure sensor membrane structure, with the electrode plate parallel to the membrane structure to form a force-applying structure;

[0069] (2.3) Connect the MEMS pressure sensor cable and power on the pressure sensor to ensure normal operation;

[0070] (2.4) Apply an alternating voltage to the force structure to simulate a cyclically changing external environment. In addition, the frequency of the alternating voltage applied to the force structure can be changed (e.g., 1000 Hz) to greatly accelerate the test, depending on the requirements of the accelerated test.

[0071] (2.5) Set up the vibration spectrum, start the vibration table, and apply vibration stress to the MEMS pressure sensor;

[0072] (2.6) Collect and observe the output of the MEMS pressure sensor to evaluate whether the MEMS pressure sensor has any reliability issues such as membrane damage and performance drift during the accelerated test under the vibration stress + alternating pressure environment.

[0073] The present invention discloses an accelerated reliability test method for MEMS pressure sensors based on composite environmental stress, which effectively solves the technical bottleneck of the existing accelerated test technology that temperature, humidity, mechanical vibration / shock and pressure input are difficult to achieve multi-stress composite loading. This method can achieve high-fidelity simulation of the environmental stress of the product's actual working conditions by constructing a multi-dimensional stress collaborative loading system, thereby effectively revealing potential reliability defects during the accelerated test process, and providing a key verification means for improving the service reliability of MEMS pressure sensors. The core technological breakthrough is reflected in the innovatively designed electrostatic drive forcing module, which is based on an electrostatic force loading mechanism excited by DC voltage. It can accurately simulate the complex stress state of the pressure-sensitive membrane structure, and realize in-situ loading of the environmental pressure through electric-mechanical coupling, avoiding the traditional solution's dependence on external pressure sources, and significantly improving the integration and operability of the test system.

[0074] It should be noted that, for the sake of convenience, the aforementioned method embodiments are all expressed as a series of action combinations, but those skilled in the art should know that the present invention is not limited to the described order of actions, because according to the present invention, certain steps can be performed in other orders or simultaneously.

[0075] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be considered as equivalent replacement methods and are included in the scope of protection of the present invention.

Claims

1. A MEMS pressure sensor accelerated test method, characterized in that: The steps include: S1. Obtain a MEMS pressure sensor sample, wherein the sample includes a deformable membrane structure; S2. Arranging a force-adding structure on the membrane structure, wherein the force-adding structure is a built-in electrode or an external electrode plate; S3, applying voltage to the force-applying structure to deform the membrane structure through electrostatic force, which is equivalent to ambient pressure input; S4, installing the MEMS pressure sensor in a multi-environmental stress test device, and simultaneously applying at least one environmental stress of temperature, humidity, vibration or shock; S5. Monitor changes in performance parameters of the MEMS pressure sensor and evaluate its reliability.

2. A MEMS pressure sensor accelerated test method according to claim 1, characterized in that: In step S2, the force-applying structure is a built-in electrode, and the built-in electrode and the membrane structure are integrated into the same sensitive structure. By loading a DC voltage signal on the force-applying structure, there is a potential difference between the force-applying structure and the membrane structure. The potential difference will generate an electrostatic force on the membrane structure, and the membrane structure will be deformed under the action of the electrostatic force.

3. The MEMS pressure sensor accelerated test method according to claim 1, characterized in that: In step S2, the force-applying structure is an external electrode plate, which is arranged parallel to the membrane structure and simulates dynamic pressure input through alternating voltage.

4. The MEMS pressure sensor accelerated test method according to claim 1, characterized in that: In step S2, the distance between the force-applying structure and the membrane structure is at the nanometer level.

5. The MEMS pressure sensor accelerated test method according to claim 1, characterized in that: Step S2 also includes the following steps: When the force-adding structure is not working, the sensitivity parameters of the MEMS pressure sensor are calibrated and tested to obtain the first output voltage of the MEMS pressure sensor corresponding to the set pressure, and the pressure required to be loaded is set according to the first output voltage.

6. The MEMS pressure sensor accelerated test method according to claim 5, characterized in that: When the force-adding structure is in operation, a voltage is applied to the force-adding structure through a voltage source, and the DC voltage is adjusted so that the second output voltage of the MEMS pressure sensor is equal to the first output voltage, thereby completing the input of the simulated loading set pressure to the MEMS pressure sensor.

7. A MEMS pressure sensor accelerated test method according to any one of claims 1 to 6, characterized in that: In step S3, the voltage loading method includes: DC voltage, used to simulate static high voltage environment; Alternating voltage used to simulate pressure pulses or pressure cycles with a frequency range of 1 Hz to 1000 Hz.

8. The MEMS pressure sensor accelerated test method according to claim 1, characterized in that: In step S4, the multi-environmental stress test equipment is a three-integrated test box that simultaneously loads temperature, humidity and vibration stress.

9. The MEMS pressure sensor accelerated test method according to claim 1, characterized in that: In step S3, the voltage amplitude is adjusted to be equivalent to the ambient pressure input of different ranges.

10. The MEMS pressure sensor accelerated test method according to claim 1, characterized in that: Step S5 is specifically as follows: Collect and observe the output of the MEMS pressure sensor to evaluate the reliability of the MEMS pressure sensor, such as whether membrane damage or performance drift occurs during multi-environmental stress acceleration testing.

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