A film-covered resistor and a processing method thereof

Abstract

The application relates to the field of high-precision resistor devices, in particular to a film-coated resistor and a processing method thereof. The film-coated resistor comprises a ceramic substrate, the left and right ends of the ceramic substrate are integrally formed with cylindrical parts, a nickel-chromium alloy film is deposited on the ceramic substrate, a sleeve is sleeved on each cylindrical part, and a metal sheet is arranged on each sleeve. The processing method comprises the following steps: S1, ultrasonic cleaning of the ceramic substrate with deionized water to remove oil stains, dust and impurities on the surface, and then drying for standby; S2, placing the nickel-chromium alloy into a storage pot, and fixing the ceramic substrate on four clamping rods in an evaporation box; S3, covering a cover plate on the evaporation box, and performing air extraction on the inside of the evaporation box to form a low-pressure state; and S4, driving a resistance heating ring to heat the nickel-chromium alloy in the storage pot, so that the nickel-chromium alloy evaporates and diffuses in a gaseous form.

Description

Technical Field

[0001] The present invention relates to the field of high-precision resistor devices, and more particularly to a film-coated resistor and a processing method thereof. Background Art

[0002] Resistors, as extremely critical basic components in electronic devices, are widely used in various electronic products and play an important role in regulating current and distributing voltage. Among them, film resistors have been widely used in many electronic fields due to their good stability, high precision and strong resistance to environmental interference. The film resistors in the existing technology achieve the conductive function through metal sheets on both sides. However, in actual use, due to various complex working environments and the impact of current and voltage fluctuations, the metal sheets used for conductivity on the film resistors are very easy to be damaged. Once the metal sheet is damaged, the existing film resistor structure design makes the replacement of the metal sheet extremely inconvenient. Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a film-coated resistor and a processing method thereof, which has the beneficial effect of facilitating replacement of a metal sheet on the film-coated resistor used for conducting electricity after being damaged.

[0004] A film resistor includes a ceramic substrate. The left and right ends of the ceramic substrate are integrally formed with cylindrical parts. A nickel-chromium alloy film is deposited on the ceramic substrate. Each cylindrical part is covered with a sleeve, and each sleeve is provided with a metal sheet.

[0005] The left and right ends of the ceramic substrate are both provided with sockets, the upper and lower ends of each sleeve are both provided with convex pieces, the convex pieces are inserted into the corresponding sockets, and the outer side of the ceramic substrate is covered with a plastic sleeve.

[0006] A method for processing a film resistor comprises the following steps:

[0007] S1: Ultrasonic cleaning of the ceramic substrate with deionized water to remove oil, dust and impurities on the surface, and then drying for later use;

[0008] S2: Place the nickel-chromium alloy into the storage pot and fix the ceramic substrate on the four clamping rods in the evaporation box;

[0009] S3: Place the cover on the evaporator box to evacuate the air inside the evaporator box to a low pressure state;

[0010] S4: driving the electromagnetic heating coil to heat the nickel-chromium alloy in the storage pot, causing the nickel-chromium alloy to evaporate and diffuse in gaseous form. Due to the high and low pressure conditions in the evaporation box, the gaseous nickel-chromium alloy flies toward the ceramic substrate, deposits, condenses, and gradually forms a continuous thin film.

[0011] S5: Take the ceramic substrate out of the evaporation box and install two metal sheets on both sides of the ceramic substrate respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0013] Figure 1 A schematic diagram of the structure of a film resistor and its processing device Figure 1 ;

[0014] Figure 2 A schematic diagram of the structure of a film resistor and its processing device Figure 2 ;

[0015] Figure 3 A schematic diagram of the structure of a film resistor and its processing device Figure 3 ;

[0016] Figure 4 Schematic diagram of the evaporator structure Figure 1 ;

[0017] Figure 5 Schematic diagram of the evaporator structure Figure 2 ;

[0018] Figure 6 Schematic diagram of the structure of the hole cover Figure 1 ;

[0019] Figure 7 Schematic diagram of the structure of the hole cover Figure 2 ;

[0020] Figure 8 It is a structural diagram of the portal frame;

[0021] Figure 9 Schematic diagram of the cover structure Figure 1 ;

[0022] Figure 10 Schematic diagram of the cover structure Figure 2 ;

[0023] Figure 11 A schematic diagram of the structure of a film resistor Figure 1 ;

[0024] Figure 12 A schematic diagram of the structure of a film resistor Figure 2 ;

[0025] Figure 13 It is a partial structural diagram of a film resistor;

[0026] Figure 14 A schematic diagram of the structure of a film resistor and its processing device Figure 4 ;

[0027] Figure 15 A schematic diagram of the structure of a film resistor and its processing device Figure 5 ;

[0028] In the figure: evaporation box 101; fan plate 102; inclined rod 103; rotating rod 104; rotating shaft 105; supporting leg 106; storage pot 107; cross 108; electromagnetic heating coil 109; telescopic rod 110; track 111; slider 112;

[0029] Hole cover 201; steam outlet 202;

[0030] Gantry 301; motor frame 302; side shaft 303; motor 304; square column 305; bolt seat 306; hand screw bolt 307; clamping rod 308;

[0031] Cover plate 401; exhaust pipe 402; air inlet cover 403; air inlet pipe 404; one-way valve 405; sealing gasket 406;

[0032] Ceramic substrate 501 ; cylindrical portion 502 ; metal sheet 503 ; sleeve 504 ; protruding piece 505 ; insertion hole 506 ; plastic sleeve 507 . DETAILED DESCRIPTION

[0033] In order to clearly show the connection relationship of the internal parts of the evaporation box 101, Figure 1-5 The front half of the evaporation box 101 is not shown in the figure, and only the rear half of the evaporation box 101 is shown. The unshown parts do not affect the disclosure of the technical solution of the present invention. By the above method, the disclosure requirements of the patent can be met, and the clarity of the drawings can be improved by reasonable omission, avoiding the obstruction of the interior of the evaporation box 101. The complete structure of the evaporation box 101 is shown in the figure. Figure 14-15 Shown in.

[0034] The evaporation box 101, the storage pot 107, the hole cover 201 and the cover plate 401 are all made of carbide ceramic hafnium carbide, which has a melting point of 3890° C. and is one of the materials with the highest melting point under normal pressure.

[0035] like Figure 11-13 As shown;

[0036] Since the film resistor includes a ceramic substrate 501, cylindrical portions 502 are integrally formed at both left and right ends of the ceramic substrate 501, a nickel-chromium alloy film is deposited on the ceramic substrate 501, each cylindrical portion 502 is sleeved with a sleeve 504, and each sleeve 504 is provided with a metal sheet 503. The sleeve 504 is made of metal and can be opened and sleeved on the cylindrical portion 502, and then the sleeve 504 is pressed to press the sleeve 504 on the cylindrical portion 502, so that the sleeve 504 fits tightly with the nickel-chromium alloy film on the ceramic substrate 501, making it easy to replace the metal sheet 503 on the sleeve 504. The two metal sheets 503 are used to connect to the circuit board. Current flows from one metal sheet 503 to the nickel-chromium alloy film on the ceramic substrate 501, and the nickel-chromium alloy film has resistance, and then flows electrically to the other metal sheet 503 to complete the work of the resistor.

[0037] like Figure 11-13 As shown;

[0038] Since the ceramic substrate 501 is provided with sockets 506 on both the left and right ends, and each sleeve 504 is provided with tabs 505 on the upper and lower ends, which are inserted into the corresponding sockets 506, the ceramic substrate 501 is covered with a plastic sleeve 507. When the sleeve 504 is pressed against the cylindrical portion 502 and the sleeve 504 and the nickel-chromium alloy film on the ceramic substrate 501 are tightly attached, the two tabs 505 on the sleeve 504 are inserted into the corresponding sockets 506. The tabs 505 prevent the sleeve 504 from moving forward or backward relative to the cylindrical portion 502, thereby preventing the sleeve 504 from separating from the cylindrical portion 502. The ceramic substrate 501 is covered with a plastic sleeve 507, which protects the nickel-chromium alloy film and prevents damage to the nickel-chromium alloy film.

[0039] like Figure 4-5 As shown;

[0040] A storage pot 107 is located below the evaporation box 101, protruding from the bottom surface. A cross 108 is fixed to the underside of the storage pot 107, onto which an electromagnetic heating coil 109 is attached. The electromagnetic heating coil 109 fits over the outside of the storage pot 107. Support legs 106 are fixed to the four corners of the lower side of the evaporation box 101. When manufacturing the resistor, the ceramic substrate 501 is placed inside the evaporation box 101, and then the nickel-chromium alloy is placed in the storage pot 107. The cross 108 supports the electromagnetic heating coil 109. When the electromagnetic heating coil 109 is energized, it heats the nickel-chromium alloy in the storage pot 107, causing the nickel-chromium alloy to diffuse in a gaseous form. The gaseous nickel-chromium alloy then flies toward the ceramic substrate 501, deposits, condenses, and gradually forms a continuous thin film. The four legs 106 support the evaporation box 101, keeping it suspended in the air. Electromagnetic heating coil 109 utilizes the principle of electromagnetic induction, passing an alternating current through a coil to generate an alternating magnetic field. When the nickel-chromium alloy is exposed to this alternating magnetic field, the alternating magnetic field generates eddy currents within the alloy, which in turn generate heat, raising the alloy's temperature. As the eddy currents continue to generate heat, the temperature of the nickel-chromium alloy continues to rise. When the temperature reaches 2600°C-2700°C, the nickel-chromium alloy reaches its boiling point, causing it to begin vaporizing.

[0041] like Figure 4-7 As shown;

[0042] Because the storage pot 107 is covered with a hole cover 201, which is evenly distributed with multiple steam outlet holes 202 and has a protrusion on its underside, the hole cover 201 is inserted into the upper part of the storage pot 107 via the protrusion. The hole cover 201 on the storage pot 107 plays a vital role in the processing of film-coated resistors. The multiple steam outlet holes 202 evenly distributed on the hole cover 201 are a key structure for regulating the amount and direction of nickel-chromium alloy vapor escape. When the electromagnetic heating coil 109 heats the nickel-chromium alloy in the storage pot 107, the nickel-chromium alloy gradually vaporizes into a gaseous state due to the heat. At this time, the steam outlet holes 202 on the hole cover 201 can effectively control the release of steam. On the one hand, the multiple steam outlet holes 202 disperse the escape path of the steam, preventing the steam from being concentrated and gushing out in large quantities at a certain place, so that the steam can be diffused more evenly to various spaces in the evaporation box 101, ensuring that the gaseous nickel-chromium alloy can fly to the ceramic substrate 501 more evenly and deposit and condense, which is conducive to forming a nickel-chromium alloy film with better quality and more uniform thickness on the ceramic substrate 501.

[0043] On the other hand, the protrusion on the underside of the hole cover 201 inserts into the upper portion of the storage pot 107, achieving a tight connection between the hole cover 201 and the storage pot 107. This connection method not only prevents large amounts of steam from leaking from the connection between the storage pot 107 and the hole cover 201, ensuring that the steam can be discharged in an orderly manner mainly through the steam outlet 202, but also enhances the stability of the entire structure. During the continuous heating of the electromagnetic heating coil 109 and the generation of steam, the hole cover 201 can firmly cover the storage pot 107, ensuring the smooth evaporation of the nickel-chromium alloy and the subsequent deposition process.

[0044] like Figure 9-10 As shown;

[0045] The upper side of the evaporation box 101 is covered with a cover plate 401, and a protrusion is provided on the lower side of the cover plate 401. The cover plate 401 is inserted into the upper side of the evaporation box 101 through the protrusion. A sealing gasket 406 is bonded to the edge of the cover plate 401. An exhaust pipe 402 is provided on the cover plate 401, and a one-way valve 405 is provided on the exhaust pipe 402. The one-way valve 405 can only release air.

[0046] The protrusion provided on the lower side of the cover plate 401 is inserted into the upper side of the evaporation box 101, thereby achieving a stable connection between the cover plate 401 and the evaporation box 101.

[0047] The sealing gasket 406 bonded to the edge of the cover 401 is a key element in maintaining a stable environment within the evaporator 101. When the nickel-chromium alloy vaporizes into a gaseous state due to heat within the storage pot 107 and diffuses within the evaporator 101, the sealing gasket 406 effectively prevents vapor leakage from the connection between the cover 401 and the evaporator 101. This maintains a relatively stable vapor concentration and pressure environment within the evaporator 101, ensuring that the gaseous nickel-chromium alloy can evenly deposit and condense onto the ceramic substrate 501 under ideal conditions, thereby contributing to the formation of a high-quality nickel-chromium alloy film. The sealing gasket 406 is made of tungsten alloy, which has an extremely high melting point of 3410°C and exhibits excellent stability at high temperatures.

[0048] The exhaust pipe 402 on the cover plate 401 works closely with the one-way valve 405 to form a crucial low-pressure exhaust system. Before processing the film resistors, a low-pressure environment must be created within the evaporation box 101 to allow the nickel-chromium alloy to evaporate and deposit on the ceramic substrate 501 under ideal conditions. This is where the crucial role of the one-way valve 405 becomes apparent. When an external exhaust device is operating the evaporation box 101 through the exhaust pipe 402, the one-way valve 405 is open, allowing air inside the evaporation box 101 to escape smoothly. Because the one-way valve 405 only allows one-way air flow, it automatically closes after the exhaust is complete, preventing outside air from re-entering the evaporation box 101. This feature ensures a stable low-pressure environment within the evaporation box 101, creating favorable conditions for the evaporation of the nickel-chromium alloy and its subsequent uniform deposition and condensation on the ceramic substrate 501, greatly improving the processing quality of the film resistors.

[0049] like Figure 9-10 As shown;

[0050] Since the cover plate 401 is provided with an air inlet pipe 404, and the upper portion of the air inlet pipe 404 is threadedly connected to the air inlet cap 403, when the evaporator 101 is at low pressure, to restore it to normal pressure, the operator simply unscrews the air inlet cap 403. This allows outside air to flow smoothly into the evaporator 101 through the air inlet pipe 404.

[0051] like Figure 8 As shown;

[0052] Since a gantry 301 is fixed on the inner wall of the evaporation box 101, the left and right ends of the gantry 301 are rotatably connected to the side shafts 303 through the bearing seats, the opposite ends of the two side shafts 303 are fixed with square columns 305, one end of the square column 305 is fixed with a clamping rod 308, and the other end of the square column 305 is slidably connected to another clamping rod 308, and the end of the square column 305 is fixed with a bolt seat 306, and the bolt seat 306 is threadedly connected with a hand screw bolt 307, which presses on the movable On the outside of the clamping rods 308, the ceramic substrate 501 can be inserted between the four clamping rods 308. The two thumb screws 307 are then rotated separately to press against two of the clamping rods 308, causing the left and right clamping rods 308 to clamp the ends of the ceramic substrate 501. The ceramic substrate 501 can then be rotated on the gantry 301 about the axis of the side shafts 303 via the two side shafts 303. Rotating the ceramic substrate 501 during the evaporation and deposition of the nickel-chromium alloy offers significant advantages. This allows all surfaces of the ceramic substrate 501 to be evenly exposed to the gaseous nickel-chromium alloy, preventing excessive or insufficient deposition in certain areas. This ensures a more uniform and higher-quality nickel-chromium alloy film formed on the ceramic substrate 501. This ensures secure clamping and flexible rotation of the ceramic substrate 501, providing a strong guarantee for the high-quality processing of film-coated resistors.

[0053] like Figure 4-5 and 8;

[0054] Since the two side shafts 303 pass through the two sides of the evaporator box 101 respectively, a sealing ring is provided at the connection between the side shaft 303 and the evaporator box 101, and a motor frame 302 is fixed to one side of the evaporator box 101. The motor 304 is fixed on the motor frame 302, and the output shaft of the motor 304 is connected to one of the side shafts 303 through a coupling.

[0055] Two side shafts 303 extend from either side of the evaporator box 101, and sealing rings are installed at the connection between the side shafts 303 and the evaporator box 101. These sealing rings are made of tungsten alloy, which has an extremely high melting point of 3410°C and exhibits excellent stability at high temperatures. During the processing of film resistors, a specific atmospheric pressure environment must be maintained within the evaporator box 101, possibly the low pressure state mentioned above after the vacuum is pumped down, to facilitate the uniform deposition of the nickel-chromium alloy vapor on the ceramic substrate 501. The presence of the sealing rings effectively prevents outside air from entering the evaporator box 101 and disrupting the internal pressure balance. They also prevent the nickel-chromium alloy vapor from leaking out of the evaporator box 101, thereby ensuring the stability and safety of the processing.

[0056] A motor frame 302 is fixed to one side of the evaporator 101, and the motor frame 302 provides a stable support for the motor 304. The motor 304 is fixed to the motor frame 302, and its output shaft is connected to one of the side shafts 303 through a coupling. When the motor 304 is started, the output shaft of the motor begins to rotate, and the power is transmitted to the side shaft 303 connected to it through the coupling. Since the ceramic substrate 501 is fixed between the two side shafts 303 by the clamping rod 308, the rotation of the side shaft 303 will drive the ceramic substrate 501 to rotate about the axis of the side shaft 303. This allows each surface of the ceramic substrate 501 to fully and evenly contact the nickel-chromium alloy vapor, avoiding the problem of uneven film deposition caused by the ceramic substrate 501 being stationary. This ensures that the nickel-chromium alloy film formed on the ceramic substrate 501 is uniform in thickness and stable in quality, thereby improving the performance and quality of the film resistor.

[0057] like Figure 4-5 As shown;

[0058] Since fan plates 102 are provided on the front and back sides of the evaporator box 101, a rotating shaft 105 is fixed to the lower part of each fan plate 102, and both ends of each rotating shaft 105 are rotationally connected to the two sides of the evaporator box 101 with a clearance fit. A sealing ring is provided at the rotating connection between the rotating shaft 105 and the evaporator box 101, and a rotating rod 104 is fixed to the left end of the two rotating shafts 105. A track 111 is fixed to the left side of the evaporator box 101, and a slider 112 driven to slide by a telescopic rod 110 is slidably connected to the track 111. Two oblique rods 103 are hinged on the slider 112, and the other ends of the two oblique rods 103 are hinged on the two rotating rods 104 respectively.

[0059] In the processing device for the film resistor, the fan plate 102 inside the evaporation box 101 and its driving structure play a key role in optimizing the distribution of nickel-chromium alloy vapor in the box.

[0060] The fan plates 102, located on the front and rear sides of the evaporator 101, are the core components for achieving uniform steam distribution. The fan plates 102 are pivotally connected to the sides of the evaporator 101 via a fixed lower shaft 105. A clearance fit allows the fan plates 102 to rotate flexibly driven by the shaft 105. A sealing ring is also installed at the pivoting connection between the shaft 105 and the evaporator 101. This tungsten alloy sealing ring, with an extremely high melting point of 3410°C and excellent stability at high temperatures, serves a similar purpose to the sealing ring on the side shaft 303: to prevent the atmospheric pressure inside the evaporator 101 from being disrupted, ensuring process stability and preventing steam leakage or air ingress.

[0061] A rotating rod 104 is fixed to the left end of each of the two rotating shafts 105. These rotating rods 104 cooperate with the diagonal rod 103 hinged on the slider 112 to form a transmission mechanism. A track 111 fixed to the left side of the evaporator 101 provides a sliding path for the slider 112, while the telescopic rod 110 is the power source that drives the slider 112 along the track 111.

[0062] When the telescopic rod 110 extends and retracts, it drives the slider 112 to slide on the track 111. The sliding movement of the slider 112 is transmitted to the rotating rod 104 via the inclined rod 103. Because the inclined rod 103, the rotating rod 104, and the slider 112 are all hingedly connected, the linear motion of the slider 112 is converted into the rotation of the rotating rod 104, which in turn drives the rotation of the rotating shaft 105, ultimately causing the fan plate 102 to rotate.

[0063] During the nickel-chromium alloy evaporation process, the rotation of the fan plate 102 is crucial. It accelerates the flow of nickel-chromium alloy vapor within the evaporation chamber 101, breaking up any localized vapor accumulation and distributing the vapor more evenly throughout the evaporation chamber 101. This ensures that all areas of the ceramic substrate 501 are more evenly exposed to the nickel-chromium alloy vapor, helping to form a more uniform, high-quality nickel-chromium alloy film on the ceramic substrate 501 and improving the production quality of film-coated resistors.

[0064] A method for processing a film resistor comprises the following steps:

[0065] S1: ultrasonically clean the ceramic substrate 501 with deionized water to remove oil, dust and impurities on the surface, and then dry it for later use;

[0066] S2: Place the nickel-chromium alloy into the storage pot 107 and fix the ceramic substrate 501 on the four clamping rods 308 in the evaporation box 101;

[0067] S3: Cover the cover plate 401 on the evaporation box 101 to evacuate the interior of the evaporation box 101 to a low pressure state;

[0068] S4: The electromagnetic heating coil 109 is driven to heat the nickel-chromium alloy in the storage pot 107, causing the nickel-chromium alloy to evaporate and diffuse in gaseous form. Due to the high and low pressure conditions in the evaporation box 101, the gaseous nickel-chromium alloy flies toward the ceramic substrate 501, where it is deposited and condensed, gradually forming a continuous thin film.

[0069] S5: Take the ceramic substrate 501 out of the evaporation box 101 and install two metal sheets 503 on both sides of the ceramic substrate 501 respectively.

Claims

1. A film resistor comprising a ceramic substrate (501), characterized in that: The left and right ends of the ceramic substrate (501) are integrally formed with cylindrical portions (502), a nickel-chromium alloy film is deposited on the ceramic substrate (501), each cylindrical portion (502) is covered with a sleeve (504), the sleeve is made of metal, and the sleeve is tightly fitted with the nickel-chromium alloy film on the ceramic substrate, the left and right ends of the ceramic substrate (501) are provided with sockets (506), the upper and lower ends of each sleeve (504) are provided with convex pieces (505), the convex pieces (505) are inserted into the corresponding sockets (506), and the outer side of the ceramic substrate (501) is covered with a plastic sleeve (507).

2. A film resistor processing device, the processing device being used for processing the film resistor according to claim 1, comprising an evaporation box (101), characterized in that: A storage pot (107) is provided at the lower portion of the evaporation box (101), the storage pot (107) protruding from the bottom surface of the evaporation box (101), a cross (108) is fixed to the lower side of the storage pot (107), an electromagnetic heating coil (109) is fixed to the cross (108), and the electromagnetic heating coil (109) is sleeved on the outer side of the storage pot (107), and legs (106) are fixed at the four corners of the lower side of the evaporation box (101); The storage pot (107) is covered with a hole cover (201), and a plurality of steam outlet holes (202) are evenly distributed on the hole cover (201). A protrusion is provided on the lower side of the hole cover (201), and the hole cover (201) is inserted into the upper part of the storage pot (107) through the protrusion; The upper side of the evaporation box (101) is covered with a cover plate (401), the lower side of the cover plate (401) is provided with a protrusion, the cover plate (401) is inserted into the upper side of the evaporation box (101) through the protrusion, a sealing gasket (406) is bonded to the edge of the cover plate (401), an exhaust pipe (402) is provided on the cover plate (401), and a one-way valve (405) is provided on the exhaust pipe (402), and the one-way valve (405) can only discharge air; An air intake pipe (404) is provided on the cover plate (401), and an air intake cover (403) is connected to the upper portion of the air intake pipe (404) via a thread. A portal frame (301) is fixed on the inner wall of the evaporation box (101), and the left and right ends of the portal frame (301) are rotatably connected to side shafts (303) through bearing seats. Square columns (305) are fixed to the opposite ends of the two side shafts (303), one end of the square column (305) is fixed to a clamping rod (308), and the other end of the square column (305) is slidably connected to another clamping rod (308). A bolt seat (306) is fixed to the end of the square column (305), and a hand-screw bolt (307) is threadedly connected to the bolt seat (306), and the hand-screw bolt (307) is pressed on the outside of the movable clamping rod (308); The two side shafts (303) respectively pass through the two sides of the evaporation box (101); a sealing ring is provided at the connection between the side shafts (303) and the evaporation box (101); a motor frame (302) is fixed to one side of the evaporation box (101); a motor (304) is fixed to the motor frame (302); and an output shaft of the motor (304) is connected to one of the side shafts (303) via a coupling.

3. The film resistor processing device according to claim 2, characterized in that: The evaporation box (101) is provided with fan plates (102) on both the front and rear sides. A rotating shaft (105) is fixed to the lower part of each fan plate (102). Both ends of each rotating shaft (105) are rotationally connected to the two sides of the evaporation box (101) with clearance fit. A sealing ring is provided at the rotation connection between the rotating shaft (105) and the evaporation box (101). A rotating rod (104) is fixed to the left end of each rotating shaft (105). A track (111) is fixed to the left side of the evaporation box (101). A slider (112) driven to slide by a telescopic rod (110) is slidably connected to the track (111). Two oblique rods (103) are hinged to the slider (112). The other ends of the two oblique rods (103) are respectively hinged to the two rotating rods (104).

4. A method for processing a film resistor, the method being used to prepare the film resistor according to claim 1, characterized in that: The following steps are involved: S1: ultrasonically clean the ceramic substrate (501) with deionized water to remove oil, dust and impurities on the surface, and then dry it for later use; S2: Place the nickel-chromium alloy into the storage pot (107), and fix the ceramic substrate (501) on the four clamping rods (308) in the evaporation box (101); S3: Covering the cover plate (401) on the evaporation box (101) to evacuate the interior of the evaporation box (101) to a low pressure state; S4: driving the electromagnetic heating coil (109) to heat the nickel-chromium alloy in the storage pot (107), causing the nickel-chromium alloy to evaporate and diffuse in a gaseous form. Since the evaporation box (101) is in a high-low pressure state, the gaseous nickel-chromium alloy flies toward the ceramic substrate (501) to deposit and condense, and gradually forms a continuous thin film; S5: Take the ceramic substrate (501) out of the evaporation box (101), and install two metal sheets (503) on both sides of the ceramic substrate (501).

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