Optical module and forming method thereof

Abstract

The invention provides an optical module and a forming method of the optical module. The optical module comprises a housing which is internally provided with an accommodating cavity; the circuit board is positioned in the accommodating cavity; the chip assembly is located in the containing cavity and coupled with the circuit board, the chip assembly comprises multiple sets of optical chip assemblies and multiple sets of electric chip assemblies, each set of optical chip assembly comprises at least one optical receiving chip and at least one optical transmitting chip, and each set of electric chip assembly comprises at least one driving chip and at least one limiting amplifier. Based on the technical scheme, the manufacturing cost of the optical module can be effectively reduced, the number of channels of the optical receiving chip, the optical transmitting chip, the driving chip and the limiting amplifier can be respectively set, and the use is more flexible.

Description

Technical Field

[0001] The present application relates to the field of optoelectronic communication technology, and in particular to an optical module and a method for forming the optical module. Background Art

[0002] Optical modules are common devices in the field of optoelectronic communications. They include optoelectronic chip assemblies that convert optical and electrical signals. First, the optical module is electrically connected to a first device. The module receives an optical signal from a second device, converts the optical signal into an electrical signal using the optoelectronic chip assembly, amplifies the electrical signal, and then outputs it to the first device, achieving the conversion from optical to electrical. Second, the optical module receives an electrical signal from the first device, converts it into an optical signal using the optoelectronic chip assembly, and then transmits it to the second device. In the prior art, optoelectronic chip assemblies are typically integrated chips, which are relatively expensive, leading to higher costs for optical modules. Summary of the Invention

[0003] The present application proposes an optical module and a method for forming the optical module to solve the technical problem of high cost of optical modules in the prior art.

[0004] In a first aspect, an embodiment of the present application provides an optical module, comprising:

[0005] a housing, wherein the housing has a receiving cavity;

[0006] A circuit board is located in the accommodating cavity;

[0007] A chip assembly is located within the accommodating cavity and coupled to the circuit board, the chip assembly comprising multiple groups of optical chip assemblies and multiple groups of electrical chip assemblies, each group of the optical chip assemblies comprising at least one optical receiving chip and at least one optical transmitting chip, and each group of the electrical chip assemblies comprising at least one driver chip and at least one limiting amplifier. In some embodiments, the chip assembly comprises multiple groups of optical chip assemblies and multiple groups of electrical chip assemblies.

[0008] In some embodiments, the optical receiving chip is a 4-channel optical receiving chip or a 6-channel optical receiving chip; the optical transmitting chip is a 4-channel optical transmitting chip or a 6-channel optical transmitting chip.

[0009] In some embodiments, the driver chip is a 4-channel driver chip or a 6-channel driver chip; and the limiting amplifier is a 4-channel limiting amplifier or a 6-channel limiting amplifier.

[0010] In some embodiments, the number of the optical chip assemblies in each group of the chip assemblies ranges from two to three groups; and the number of the electrical chip assemblies in each group of the chip assemblies ranges from two to three groups.

[0011] In some embodiments, the number of the optical chip assemblies is three groups, and the number of the electrical chip assemblies is three groups;

[0012] The circuit board includes a first area and a second area;

[0013] The three groups of optical chip assemblies include a first group and a second group, the first group includes three 4-channel optical receiving chips, and the second group includes three 4-channel optical transmitting chips;

[0014] The three groups of electrical chip components include a third group and a fourth group, wherein the third group includes three 4-channel limiting amplifiers and the fourth group includes three 4-channel driver chips;

[0015] The first group and the third group are fixed and electrically connected to the first region, and the second group and the fourth group are fixed and electrically connected to the second region.

[0016] In some embodiments, the optical module further includes: a heat sink assembly located between the chip assembly and the circuit board.

[0017] In some embodiments, the heat sink assembly includes a plurality of heat sinks, each of the heat sinks is connected to the chip assembly, and the heat sinks and the chip assembly are stacked in a direction perpendicular to the surface of the circuit board.

[0018] In some embodiments, the heat sink is made of aluminum nitride.

[0019] In some embodiments, the optical module further includes: a heat-conducting bump, wherein the heat-conducting bump is located in the accommodating cavity and connected between the heat sink and the housing.

[0020] In some embodiments, the material of the thermally conductive bump includes silver.

[0021] In some embodiments, the shell includes a matching top cover and a base, and the accommodating cavity is located between the top cover and the base.

[0022] In some embodiments, the thermal conductive bumps include a plurality of first bumps and a plurality of second bumps, the first bumps are respectively connected to both sides of each heat sink, and the first bumps are connected between the heat sink and the base, the second bumps are respectively connected to both sides of each heat sink, and the second bumps are connected between the heat sink and the top cover.

[0023] In some embodiments, a surface of the top cover close to the chip assembly has a heat-conducting boss; the second bump is connected between the heat sink and the heat-conducting boss.

[0024] In some embodiments, the optical module further includes: a connector; the base has a receiving groove penetrating the base, the connector is located in the receiving groove, and the connector is coupled to the circuit board.

[0025] In some embodiments, the optical module further includes: an optical fiber array coupled to the optical chip assembly.

[0026] In some embodiments, the optical module further includes: an adhesive layer located between the circuit board and the heat sink assembly; the material of the adhesive layer includes silver.

[0027] In a second aspect, embodiments of the present application provide a method for forming an optical module as described in any of the above embodiments, comprising:

[0028] forming a circuit board;

[0029] coupling the chip assembly to the circuit board;

[0030] The circuit board and the chip assembly are placed in the accommodating cavity of the shell.

[0031] The technical solution of this application can achieve the following beneficial effects:

[0032] The optical module proposed in the embodiment of the present application uses a separate optical receiving chip, optical transmitting chip, driver chip and limiting amplifier, which can effectively reduce the manufacturing cost of the optical module compared to the integrated optical chip (including the integrated optical receiving chip and optical transmitting chip) and the integrated electrical chip (including the integrated driver chip and limiting amplifier) ​​in the prior art; and the number of channels of the optical receiving chip and the optical transmitting chip in the integrated optical chip is equal, and the number of channels of the driver chip and the limiting amplifier in the integrated electrical chip is equal. The embodiment of the present application can set the number of channels of the optical receiving chip, optical transmitting chip, driver chip and limiting amplifier separately, which is more flexible to use.

[0033] Furthermore, a heat sink assembly and a thermally conductive bump are arranged in the accommodating cavity of the optical module, the chip assembly is connected to the heat sink assembly, the heat sink assembly is connected to the thermally conductive bump, and the thermally conductive bump is connected to the shell. The heat sink assembly and the thermally conductive bump have good thermal conductivity. The heat generated by the chip assembly can be dissipated through the heat sink assembly, the thermally conductive bump, and the shell in sequence, effectively reducing the operating temperature of the optical module, making the optical module work more stably, and avoiding the problems of reduced sensitivity and degradation of optical eye diagram parameters of the optical module at high temperatures. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0035] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0036] Figure 1 An exploded diagram of an optical module provided in an embodiment of the present application;

[0037] Figure 2 A schematic diagram of a partial structure of an optical module provided in an embodiment of the present application;

[0038] Figure 3 A schematic diagram of the structure of an optical module provided in an embodiment of the present application;

[0039] Figure 4 A schematic diagram of the structure of an optical module provided in an embodiment of the present application;

[0040] Figure 5 A schematic diagram of a partial structure of an optical module provided in an embodiment of the present application;

[0041] Figure 6 A schematic structural diagram of a top cover provided in an embodiment of the present application;

[0042] Figure 7 A schematic structural diagram of a connector and a base in a connected state provided in an embodiment of the present application;

[0043] Figure 8 A schematic structural diagram of a connector and a base in a separated state provided in an embodiment of the present application;

[0044] Figure 9 A schematic flow chart of a method for forming an optical module provided in an embodiment of the present application.

[0045] Reference numerals:

[0046] 1-shell; 11-accommodating cavity; 12-top cover; 121-thermal conductive boss; 13-base; 131-accommodating groove; 2-circuit board; 21-first area; 22-second area; 3-chip assembly; 31-optical chip assembly; 311-first group; 312-second group; 32-electrical chip assembly; 321-third group; 322-fourth group; 4-heat sink assembly; 40-heat sink; 41-first gasket; 42-second gasket; 43-connection area; 5-thermal conductive bump; 61-first area; 62-second area; 7-connector; 8-optical fiber array; Z-direction perpendicular to the surface of the circuit board. DETAILED DESCRIPTION

[0047] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative work are within the scope of protection of this application.

[0048] In the description of this application, it should be noted that, unless otherwise specified or limited, the term "and / or" herein is merely a description of an association relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. Furthermore, the character " / " herein, unless otherwise specified, generally indicates that the associated objects are in an "or" relationship.

[0049] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0050] Optical modules are common devices in the optoelectronic communications field. They include optoelectronic chip assemblies that convert optical and electrical signals. In existing technologies, optoelectronic chip assemblies are typically integrated chips, which are relatively expensive, leading to higher costs for optical modules.

[0051] In response to the technical problem of high cost of optical modules in the prior art, the embodiments of the present application provide an optical module and a method for forming an optical module to overcome the above problem.

[0052] An optical module and a method for forming the optical module provided in the present application are introduced below with reference to the accompanying drawings.

[0053] See Figure 1 As shown, an embodiment of the present application provides an optical module, comprising: a housing 1, a circuit board 2, and a chip assembly 3. The housing 1 has a housing cavity 11; the circuit board 2 is located within the housing cavity 11; the chip assembly 3 is located within the housing cavity 11 and coupled to the circuit board 2. The chip assembly 3 includes multiple groups of optical chip assemblies 31 (not shown) and multiple groups of electrical chip assemblies 32 (not shown). Each group of optical chip assemblies 31 includes at least one optical receiving chip and at least one optical transmitting chip, and each group of electrical chip assemblies 32 includes at least one driver chip and at least one limiting amplifier.

[0054] Specifically, the optical receiver chip (PD) receives optical signals from the fiber array 8, converts them into electrical signals, and then amplifies them through a limiting amplifier (TIA) to output electrical signals at the corresponding bit rate. The driver chip (LDD) receives electrical signals from the connector 7 and drives the optical transmitter chip (VCSEL) to emit optical signals at the corresponding bit rate. After coupling into the fiber array 8, the optical signals are transmitted to external optical fibers, through which they can be transmitted to other optical modules (or other devices).

[0055] Specifically, the circuit board 2 includes an optical power automatic control circuit to keep the output optical signal power stable.

[0056] In some embodiments, the number of optical chip assemblies 31 in each chip assembly group 3 ranges from two to three; the number of electrical chip assemblies 32 in each chip assembly group 3 ranges from two to three.

[0057] In some embodiments, the optical receiver chip is a 4-channel optical receiver chip or a 6-channel optical receiver chip; and the optical transmitter chip is a 4-channel optical transmitter chip or a 6-channel optical transmitter chip. For example, the optical chip assemblies 31 are arranged in three groups, each group including a 4-channel optical receiver chip and a 4-channel optical transmitter chip. For another example, the optical chip assemblies 31 are arranged in two groups, each group including a 6-channel optical receiver chip and a 6-channel optical transmitter chip.

[0058] In some embodiments, the driver chip is a 4-channel driver chip or a 6-channel driver chip; and the limiting amplifier is a 4-channel limiting amplifier or a 6-channel limiting amplifier. For example, the number of electronic chip assemblies 32 is two, and each group of electronic chip assemblies 32 includes a 6-channel driver chip and a 6-channel limiting amplifier. For another example, the number of electronic chip assemblies 32 is three, and each group of electronic chip assemblies 32 includes a 4-channel driver chip and a 4-channel limiting amplifier.

[0059] In some embodiments, see Figure 2 As shown, the number of optical chip assemblies 31 is three groups, and the number of electrical chip assemblies 32 is three groups; the circuit board 2 includes a first area 21 and a second area 22; the three groups of optical chip assemblies 31 include a first group 311 and a second group 312, the first group 311 includes three 4-channel optical receiving chips, and the second group 312 includes three 4-channel optical transmitting chips; the three groups of electrical chip assemblies 32 include a third group 321 and a fourth group 322, the third group 321 includes three 4-channel limiting amplifiers, and the fourth group 322 includes three 4-channel driver chips; the first group 311 and the third group 321 are fixed and electrically connected to the first area 21, and the second group 312 and the fourth group 322 are fixed and electrically connected to the second area 22.

[0060] The first group 311 and the third group 321 form the optical module's receiving module. The receiving module has 12 channels, called receiving channels, and is used to receive optical signals and convert them into electrical signals. The second group 312 and the fourth group 322 form the optical module's transmitting module. The transmitting module has 12 channels, called transmitting channels, and is used to receive electrical signals and convert them into optical signals.

[0061] In the prior art, the cost of using a 12-channel optical chip assembly (a 12-channel optical chip assembly includes a 12-channel optical receiver chip and a 12-channel optical transmitter chip) and a 12-channel electrical chip assembly (a 12-channel electrical chip assembly includes a 12-channel driver chip and a 12-channel limiting amplifier) ​​is relatively high. The embodiment of the present application splits a 12-channel optical chip assembly into three 4-channel optical receiver chips and three 4-channel optical transmitter chips, and splits a 12-channel electrical chip assembly into three 4-channel driver chips and three 4-channel limiting amplifiers. This can reduce costs while keeping the total number of channels unchanged. The cost of the optical chip assembly 31 becomes 33% of the cost before the split, and the cost of the electrical chip assembly 32 becomes 10% of the cost before the split. Furthermore, using the split optical receiver chip, optical transmitter chip, driver chip, and limiting amplifier allows for more flexible control of the number of channels per chip.

[0062] In some embodiments, see Figure 1As shown, the optical module further includes a heat sink assembly 4 located between the chip assembly 3 and the circuit board 2 .

[0063] Specifically, the heat sink assembly 4 includes a plurality of heat sinks 40, each heat sink 40 being connected to the chip assembly 3. The heat sinks 40 and the chip assembly 3 are stacked in a direction Z perpendicular to the surface of the circuit board 2. The heat sinks 40 are parallel to the circuit board 2, and the chip assembly 3 is parallel to the circuit board 2.

[0064] In some embodiments, the heat sink 40 is made of at least one of aluminum nitride and beryllium oxide. Aluminum nitride has a thermal conductivity of 170 to 230 W / (m·K), while beryllium oxide has a thermal conductivity of 220 to 250 W / (m·K). Beryllium oxide has better thermal conductivity than aluminum nitride, but aluminum nitride is less expensive than beryllium oxide. Therefore, aluminum nitride heat sinks 40 are more suitable for optical modules.

[0065] In some embodiments, see Figure 3 As shown, the optical module further includes a heat-conducting bump 5 , which is located in the accommodating cavity 11 and connected between the heat sink 40 and the housing 1 .

[0066] In some embodiments, the material of the thermally conductive bump 5 includes silver. The thermally conductive bump 5 can be formed by cooling the liquid silver paste.

[0067] In some embodiments, see Figure 1 、 Figure 4 As shown, the housing 1 includes a top cover 12 and a base 13 that match each other, and the accommodating cavity 11 is located between the top cover 12 and the base 13. The top cover 12 and the base 13 are connected by fasteners (such as screws).

[0068] In some embodiments, the thermal conductive bumps 5 include multiple first bumps and multiple second bumps, the first bumps are respectively connected to both sides of each heat sink 40, and the first bumps are connected between the heat sink 40 and the base 13, and the second bumps are respectively connected to both sides of each heat sink 40, and the second bumps are connected between the heat sink 40 and the top cover 12.

[0069] For details, see Figure 5 As shown, the heat sink 40 has first regions 61 on both sides. A first bump (not shown) is connected to the first region 61 at one end and to the base 13 (not shown) at the other end. The heat sink 40 also has second regions 62 on both sides. A second bump (not shown) is connected to the second region 62 at one end and to the top cover 12 (not shown) at the other end. The heat sink 40 has a protruding connection area 43, and the chip assembly 3 is connected to the connection area 43.

[0070] In some embodiments, see Figure 6As shown, the top cover 12 has a thermally conductive boss 121 on the side of the surface near the chip assembly 3 (not shown); second bumps (not shown) are connected between the heat sink 40 (not shown) and the thermally conductive boss 121. The provision of the thermally conductive boss 121 enhances heat conduction efficiency. Specifically, there are four thermally conductive bosses 121 and four second bumps, with the thermally conductive bosses 121 and second bumps connected in a one-to-one correspondence. The heat sink 40 is connected via four second bumps and four thermally conductive bosses 121.

[0071] Based on the above embodiment, the chip assembly 3 is connected to the heat sink 40, the heat sink 40 is connected to the thermal bump 5, and the thermal bump 5 is connected to the housing 1. The heat sink 40 and the thermal bump 5 have good thermal conductivity. The heat generated by the chip assembly 3 can be dissipated through the heat sink 40, the thermal bump 5, and the housing 1 in sequence, effectively reducing the operating temperature of the optical module, making the optical module work more stably, and avoiding the problem of reduced sensitivity and degradation of optical eye diagram parameters of the optical module at high temperatures.

[0072] In some embodiments, see Figure 1 and Figure 2 As shown, multiple heat sinks 40 include at least one first gasket 41 and at least one second gasket 42, the first gasket 41 is respectively connected to the first group 311 and the third group 321, and the second gasket 42 is respectively connected to the second group 312 and the fourth group 322; the first group 311, the third group 321, and the first gasket 41 are located in the first area 21 of the circuit board 2, and the second group 312, the fourth group 322, and the second gasket 42 are located in the second area 22 of the circuit board 2.

[0073] Specifically, the first gasket 41 and the second gasket 42 have a rectangular structure.

[0074] Specifically, the first gasket 41 is made of aluminum nitride, the number of first gaskets 41 is one, the upper surface of the first gasket 41 is connected to the first group 311 and the third group 321, and the lower surface is connected to the circuit board 2. The second gasket 42 is made of aluminum nitride, the number of second gaskets 42 is one, the upper surface of the second gasket 42 is connected to the second group 312 and the fourth group 322, and the lower surface is connected to the circuit board 2.

[0075] Specifically, the first gasket 41 is further connected to the plurality of heat-conducting bumps 5 , and the second gasket 42 is further connected to the plurality of heat-conducting bumps 5 .

[0076] Based on the above embodiment, the first gasket 41 and the plurality of thermally conductive bumps 5 are configured for the first group 311 and the third group 321 , and the second gasket 42 and the plurality of thermally conductive bumps 5 are configured for the second group 312 and the fourth group 322 , thereby increasing the heat transfer path and achieving efficient heat dissipation.

[0077] In some embodiments, the length of the second bump perpendicular to the surface of the circuit board 2 ranges from 0.1 mm to 0.3 mm.

[0078] In some embodiments, see Figure 7 and Figure 8 As shown, Figure 7 The optical module structure diagram shows that the connector 7 is located in the receiving groove 131. Figure 8 This diagram shows the structure of an optical module with connector 7 positioned outside of slot 131. The optical module also includes connector 7. Base 13 has slot 131 extending through it, with connector 7 positioned within slot 131. Connector 7 is coupled to circuit board 2. Connector 7 specifically comprises a 200-pin LGA connector (LGA stands for Land Grid Array packaging technology). Connector 7 is used to transmit electrical signals.

[0079] In some embodiments, see Figure 1 As shown, the optical module further includes an optical fiber array 8, which is coupled to the optical chip assembly 31 (not shown) in the chip assembly 3. A portion of the optical fiber array 8 may pass through the housing 1 and be connected to an external optical fiber.

[0080] In some embodiments, the material of the shell 1 includes copper (red copper), whose thermal conductivity ranges from 350W / (m·K) to 390W / (m·K), and the copper material grade is T2Y, where T2 represents a material containing 99.90% copper, and Y represents the process, specifically referring to that the material is cold worked to reach a specific state.

[0081] In some embodiments, the optical module further includes an adhesive layer located between the circuit board 2 and the heat sink assembly 4 ; the adhesive layer is made of silver. The liquid silver paste can be cooled to form the adhesive layer, which is used to connect the circuit board 2 and the heat sink assembly 4 .

[0082] See Figure 9 As shown, the embodiment of the present application provides a method for forming an optical module as described in any embodiment, including:

[0083] S101: forming a circuit board;

[0084] S102: coupling the chip assembly to the circuit board;

[0085] S103: placing the circuit board and chip assembly in the receiving cavity of the housing.

[0086] The method for forming the optical module will be described below with reference to the accompanying drawings.

[0087] Please refer to Figure 1 and Figure 9 , execute step S101 to form a circuit board 2.

[0088] Circuit board 2 includes a substrate, conductive circuits, and pads. The substrate is the supporting structure of circuit board 2 and is made of insulating material. The pads are located on the substrate surface, and the conductive circuits are located on or within the substrate. The conductive circuits are electrically connected to the pads, which are in turn electrically connected to the chip assembly 3.

[0089] Please refer to Figure 1 、 Figure 2 and Figure 9 , execute step S102 to couple the chip assembly 3 to the circuit board 2.

[0090] In some embodiments, the chip assembly 3 includes multiple groups of optical chip assemblies 31 and multiple groups of electrical chip assemblies 32, each group of optical chip assemblies 31 includes at least one optical receiving chip and at least one optical transmitting chip, and each group of electrical chip assemblies 32 includes at least one driver chip and at least one limiting amplifier.

[0091] Please refer to Figure 1 and Figure 9 , execute step S103, placing the circuit board and chip assembly in the accommodating cavity of the shell.

[0092] Specifically, the housing 1 includes a top cover 12 and a base 13 that match each other, and the accommodating cavity 11 is located between the top cover 12 and the base 13 .

[0093] In some embodiments, after forming the circuit board 2, the method also includes: fixing a heat sink assembly 4 on the surface of the circuit board 2; fixing a chip assembly 3 on the surface of the heat sink assembly 4, and coupling the chip assembly 3 to the circuit board 2; forming a thermal bump 5 on the surface of the heat sink assembly 4; placing the circuit board 2, the heat sink assembly 4, the chip assembly 3 and the thermal bump 5 in the accommodating cavity 11 of the shell 1, and the thermal bump 5 is connected between the heat sink assembly 4 and the shell 1.

[0094] Specifically, the heat sink group (4) includes a plurality of heat sinks 40, each heat sink 40 is connected to the chip assembly 3, and the heat sink 40 and the chip assembly 3 are stacked in a direction Z perpendicular to the surface of the circuit board 2.

[0095] Specifically, the thermal conductive bumps 5 include multiple first bumps and multiple second bumps, the first bumps are respectively connected to both sides of each heat sink 40, and the first bumps are connected between the heat sink 40 and the base 13, the second bumps are respectively connected to both sides of each heat sink 40, and the second bumps are connected between the heat sink 40 and the top cover 12.

[0096] In some embodiments, after the chip assembly 3 is fixed on the surface of the heat sink assembly 4 , the method further includes: coupling the optical fiber array 8 to the optical chip assembly 31 in the chip assembly 3 .

[0097] In some embodiments, after placing the circuit board 2, heat sink assembly 4, chip assembly 3 and thermally conductive bump 5 in the accommodating cavity 11 of the shell 1, the method further includes: placing the connector 7 in the accommodating groove 131 of the shell 1 and coupling the connector 7 to the circuit board 2.

[0098] It should be noted that the above method may also include other implementation methods according to the description of the optical module embodiment. The specific implementation methods can refer to the description of the relevant optical module embodiment, and will not be described in detail here.

[0099] The optical module embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units. They may be located in a single location or distributed across multiple network elements. Some or all of these modules may be selected to achieve the objectives of this embodiment as needed. Persons of ordinary skill in the art will be able to understand and implement these embodiments without inventive effort.

[0100] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, or of course, by hardware. Based on this understanding, the essence of the above technical solution or the part that contributes to the existing technology can be embodied in the form of a software product. The computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or certain parts of the embodiments.

[0101] In summary, although the present application has been disclosed as above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Ordinary technicians in this field can make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims.

Claims

1. An optical module, characterized in that: include: A housing (1), wherein the housing (1) has a receiving cavity (11); A circuit board (2) is located in the accommodating cavity (11); A chip assembly (3) is located in the accommodating cavity (11) and coupled to the circuit board (2), wherein the chip assembly (3) includes multiple groups of optical chip assemblies (31) and multiple groups of electrical chip assemblies (32), each group of the optical chip assemblies (31) includes at least one light receiving chip and at least one light transmitting chip, and each group of the electrical chip assemblies (32) includes at least one driver chip and at least one limiting amplifier.

2. The optical module according to claim 1, wherein The optical receiving chip is a 4-channel optical receiving chip or a 6-channel optical receiving chip; the optical transmitting chip is a 4-channel optical transmitting chip or a 6-channel optical transmitting chip.

3. The optical module according to claim 1, wherein: The driver chip is a 4-channel driver chip or a 6-channel driver chip; the limiting amplifier is a 4-channel limiting amplifier or a 6-channel limiting amplifier.

4. The optical module according to claim 1, wherein: The number of the optical chip components (31) in each group of the chip components (3) ranges from two to three groups; the number of the electrical chip components (32) in each group of the chip components (3) ranges from two to three groups.

5. The optical module according to claim 4, wherein: The number of the optical chip components (31) is three groups, and the number of the electrical chip components (32) is three groups; The circuit board (2) comprises a first area (21) and a second area (22); The three groups of optical chip assemblies (31) include a first group (311) and a second group (312), wherein the first group (311) includes three 4-channel optical receiving chips, and the second group (312) includes three 4-channel optical transmitting chips; The three groups of electrical chip components (32) include a third group (321) and a fourth group (322), wherein the third group (321) includes three 4-channel limiting amplifiers, and the fourth group (322) includes three 4-channel driver chips; The first group (311) and the third group (321) are fixed and electrically connected to the first area (21), and the second group (312) and the fourth group (322) are fixed and electrically connected to the second area (22).

6. The optical module according to claim 1, wherein: Also includes: A heat sink assembly (4) is located between the chip assembly (3) and the circuit board (2).

7. The optical module according to claim 6, wherein: The heat sink assembly (4) comprises a plurality of heat sinks (40), each heat sink (40) is connected to the chip assembly (3), and the heat sinks (40) and the chip assembly (3) are stacked in a direction (Z) perpendicular to the surface of the circuit board (2).

8. The optical module according to claim 7, wherein: The material of the heat sink (40) includes aluminum nitride.

9. The optical module according to claim 7, wherein: Also includes: A heat-conducting protrusion (5), the heat-conducting protrusion (5) is located in the accommodating cavity (11), and the heat-conducting protrusion (5) is connected between the heat sink (40) and the housing (1).

10. The optical module according to claim 9, wherein: The material of the heat-conducting bump (5) includes silver.

11. The optical module according to claim 9, wherein: The housing (1) comprises a top cover (12) and a base (13) that match each other, and the accommodating cavity (11) is located between the top cover (12) and the base (13).

12. The optical module according to claim 11, wherein: The heat-conducting protrusions (5) include a plurality of first protrusions and a plurality of second protrusions, wherein the first protrusions are respectively connected to both sides of each heat sink (40), and the first protrusions are connected between the heat sink (40) and the base (13), and the second protrusions are respectively connected to both sides of each heat sink (40), and the second protrusions are connected between the heat sink (40) and the top cover (12).

13. The optical module according to claim 12, wherein: The surface of the top cover (12) close to the chip assembly (3) has a heat-conducting boss (121); the second boss is connected between the heat sink (40) and the heat-conducting boss (121).

14. The optical module according to claim 11, wherein: Also includes: Connector (7); the base (13) has a receiving groove (131) that passes through the base (13); the connector (7) is located in the receiving groove (131); and the connector (7) is coupled to the circuit board (2).

15. The optical module according to claim 1, wherein: Also includes: An optical fiber array (8) is coupled to the optical chip assembly (31).

16. The optical module according to claim 6, wherein: Also includes: An adhesive layer is located between the circuit board (2) and the heat sink assembly (4); the material of the adhesive layer includes silver.

17. A method for forming an optical module according to any one of claims 1 to 16, characterized in that: include: forming a circuit board; coupling the chip assembly to the circuit board; The circuit board and the chip assembly are placed in the accommodating cavity of the shell.

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