Inter-frequency combiner and multi-system access platform

Abstract

This application relates to the field of communication technology, and in particular to a frequency combiner and a multi-system access platform. The frequency combiner includes a dielectric component, an input component, an output component, and an intermediate metal layer. The dielectric component includes a first substrate and a second substrate disposed opposite to each other. The input component includes a first transmission element and a second transmission element, both disposed on the side of the first substrate facing away from the second substrate. The output component is disposed on the side of the second substrate facing away from the first substrate. The intermediate metal layer is disposed between the first substrate and the second substrate, and has a first coupling groove and a second coupling groove. The first coupling groove corresponds to a portion of the first transmission element, and a portion of the first transmission element is coupled to the output component via the first coupling groove. The frequency combiner and multi-system access platform provided by this application reduce the size of the frequency combiner and facilitate system integration.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a frequency combiner and a multi-system access platform. Background Technology

[0002] The Points of Interface (POI) is one of the central pieces of equipment in large-scale network coverage projects. It combines system signals from multiple services and introduces the combined signals into the antenna distribution system, thereby maximizing resource utilization and reducing costs. The frequency combiner is a key component within the POI, used to combine signals from different frequency bands.

[0003] In related technologies, a frequency combiner includes a metal cavity and a coupling structure. The interior of the metal cavity is divided into multiple independent resonant cavities by a partition. Each resonant cavity corresponds to an input port, and signals of different frequency bands enter their respective resonant cavities from different input ports. An output port is located at the end of the metal cavity furthest from the input port. A probe is embedded in each resonant cavity, and signals within each resonant cavity are coupled to the output port through the probe.

[0004] However, the size of the resonant cavity needs to match the operating wavelength. The wavelength in the low-frequency band is relatively long, and the resonant cavity needs to be large enough to support electromagnetic resonance, which results in the large size of the frequency combiner and makes it inconvenient to install. Summary of the Invention

[0005] This application provides a frequency combiner and a multi-system access platform, which reduces the size of the frequency combiner and facilitates system integration.

[0006] In a first aspect, the frequency combiner provided in this application includes: a dielectric component, an input component, an output component, and an intermediate metal layer, wherein the dielectric component includes a first substrate and a second substrate disposed opposite to each other.

[0007] The input component includes a first transmission element and a second transmission element, both of which are disposed on the side of the first substrate facing away from the second substrate. The first transmission element and the second transmission element are used to receive signals of different frequency bands respectively.

[0008] The output component is disposed on the side of the second substrate opposite to the first substrate.

[0009] An intermediate metal layer is disposed between the first substrate and the second substrate. The intermediate metal layer has a first coupling groove and a second coupling groove. The first coupling groove is disposed corresponding to a portion of the first transmission components, and the portion of the first transmission components is coupled to the output component through the first coupling groove. The second coupling groove is disposed corresponding to a portion of the second transmission components, and the portion of the second transmission components is coupled to the output component through the second coupling groove.

[0010] In one possible implementation, the frequency combiner provided in this application includes a first transmission element comprising a first transmission line and a first single-mode resonator, wherein the first transmission line and the first single-mode resonator are spaced apart, and a first coupling slot is correspondingly arranged with a portion of the first single-mode resonator.

[0011] The second transmission element includes a second transmission line and a second single-mode resonator, with the second transmission line and the second single-mode resonator spaced apart, and a second coupling slot corresponding to a portion of the second single-mode resonator.

[0012] In one possible implementation, the cross-frequency combiner provided in this application has a first single-mode resonator with a length shorter than the second single-mode resonator.

[0013] In one possible implementation, the second single-mode resonator of the frequency combiner provided in this application is linear or polygonal.

[0014] In one possible implementation, the cross-frequency combiner provided in this application has a first transmission line with a length shorter than the second transmission line.

[0015] In one possible implementation, the frequency combiner provided in this application has at least a portion of the first single-mode resonator parallel to the first transmission line.

[0016] At least part of the second single-mode resonator is parallel to the second transmission line.

[0017] In one possible implementation, the frequency combiner provided in this application further includes a first feeder connected to a first transmission line.

[0018] The second transmission element also includes a second feeder line, which is connected to the second transmission line. The first feeder line and the second feeder line are used to access signals of different frequency bands, respectively.

[0019] In one possible implementation, the frequency combiner provided in this application includes a dual-mode resonator and a third transmission line as its output components. The third transmission line is spaced apart from the dual-mode resonator and is coupled to the dual-mode resonator.

[0020] In one possible implementation, the frequency combiner provided in this application includes a dual-mode resonator comprising a first resonant section and a second resonant section connected to the first resonant section.

[0021] The first resonant part is arranged correspondingly to the first coupling slot, and part of the first transmission element is coupled to the first resonant part through the first coupling slot.

[0022] The second resonant part is arranged correspondingly to the second coupling groove, and part of the second transmission element is coupled to the second resonant part through the second coupling groove.

[0023] Secondly, this application also provides a multi-system access platform, including: a bridge, at least two radiating terminals and at least two frequency combiners as provided in the first aspect above, wherein the output components of the frequency combiners have third feeders, and each third feeder is connected to the input terminal of the bridge.

[0024] It has at least two radiating terminals, each of which is connected to the output terminal of the bridge.

[0025] This application provides a frequency combiner and a multi-system access platform. The frequency combiner comprises a dielectric component, an input component, an output component, and an intermediate metal layer. The dielectric component includes a first substrate and a second substrate disposed opposite to each other. The input component includes a first transmission element and a second transmission element, both disposed on the side of the first substrate facing away from the second substrate. The first and second transmission elements are used to receive signals of different frequency bands respectively. The output component is disposed on the side of the second substrate facing away from the first substrate.

[0026] An intermediate metal layer is disposed between the first substrate and the second substrate. The intermediate metal layer has a first coupling groove and a second coupling groove. The first coupling groove is correspondingly disposed with a portion of the first transmission components, and the portion of the first transmission components is coupled to the output component through the first coupling groove. The second coupling groove is correspondingly disposed with a portion of the second transmission components, and the portion of the second transmission components is coupled to the output component through the second coupling groove. In this way, the structure is compact, the size of the frequency combiner is reduced, and it is easy to integrate with the system. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of the frequency combiner provided in the embodiments of this application;

[0029] Figure 2 for Figure 1 A structural diagram from another angle;

[0030] Figure 3 for Figure 1 Another structural diagram from a different angle;

[0031] Figure 4 for Figure 1 A schematic diagram of the exploded structure;

[0032] Figure 5 The S-parameter curve of the frequency combiner provided in the embodiments of this application;

[0033] Figure 6 This is a schematic diagram of the structure of the multi-system access platform provided in an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 10- Frequency combiner;

[0036] 100 - Dielectric assembly; 110 - First substrate; 120 - Second substrate;

[0037] 200 - Input component;

[0038] 210 - First transmission element; 211 - First transmission line; 212 - First single-mode resonator; 213 - First feeder;

[0039] 220 - Second transmission element; 221 - Second transmission line; 222 - Second single-mode resonator; 223 - Second feeder;

[0040] 300 - Output Component;

[0041] 310 - Dual-mode resonator; 311 - First resonant section; 312 - Second resonant section;

[0042] 320 - Third transmission line;

[0043] 330 - Third feeder;

[0044] 400 - Intermediate metal layer; 410 - First coupling groove; 420 - Second coupling groove;

[0045] 20 - Signal source;

[0046] 30-bridge;

[0047] 40 - Radiation end.

[0048] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0049] First, those skilled in the art should understand that these embodiments are merely for explaining the technical principles of this application and are not intended to limit the scope of protection of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.

[0050] Secondly, it should be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] Furthermore, it should be noted that in the description of this application, the terms "upper," "lower," "front," "back," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0052] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0053] As shown in the background section, in related technologies, the frequency combiner includes a metal cavity and a coupling structure. The interior of the metal cavity is divided into multiple independent resonant cavities by a partition. Each resonant cavity corresponds to an input port, and signals of different frequency bands enter their respective resonant cavities from different input ports. An output port is located at the end of the metal cavity furthest from the input port. A probe is embedded in each resonant cavity, and the signals in each resonant cavity are coupled to the output port through the probe.

[0054] However, the size of the resonant cavity needs to match the operating wavelength. The wavelength in the low-frequency band is relatively long, and the resonant cavity needs to be large enough to support electromagnetic resonance, which results in the large size of the frequency combiner and makes it inconvenient to install.

[0055] Based on this, the present application provides a frequency combiner and a multi-system access platform. The frequency combiner comprises a dielectric component, an input component, an output component, and an intermediate metal layer. The dielectric component includes a first substrate and a second substrate disposed opposite to each other. The input component includes a first transmission element and a second transmission element, both disposed on the side of the first substrate opposite to the second substrate. The first and second transmission elements are used to access signals of different frequency bands respectively. The output component is disposed on the side of the second substrate opposite to the first substrate.

[0056] An intermediate metal layer is disposed between the first substrate and the second substrate. The intermediate metal layer has a first coupling groove and a second coupling groove. The first coupling groove is correspondingly disposed with a portion of the first transmission components, and the portion of the first transmission components is coupled to the output component through the first coupling groove. The second coupling groove is correspondingly disposed with a portion of the second transmission components, and the portion of the second transmission components is coupled to the output component through the second coupling groove. In this way, the structure is compact, the size of the frequency combiner is reduced, and it is easy to integrate with the system.

[0057] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0058] Reference Figures 1 to 4 As shown, the frequency combiner 10 provided in this application includes: a dielectric component 100, an input component 200, an output component 300, and an intermediate metal layer 400. The dielectric component 100 includes a first substrate 110 and a second substrate 120 disposed opposite to each other.

[0059] The input component 200 includes a first transmission element 210 and a second transmission element 220. Both the first transmission element 210 and the second transmission element 220 are disposed on the side of the first substrate 110 facing away from the second substrate 120. The first transmission element 210 and the second transmission element 220 are used to receive signals of different frequency bands respectively.

[0060] The output component 300 is disposed on the side of the second substrate 120 that is opposite to the first substrate 110.

[0061] An intermediate metal layer 400 is disposed between the first substrate 110 and the second substrate 120. The intermediate metal layer 400 has a first coupling groove 410 and a second coupling groove 420. The first coupling groove 410 is correspondingly disposed with a portion of the first transmission element 210, and the portion of the first transmission element 210 is coupled to the output component 300 through the first coupling groove 410. The second coupling groove 420 is correspondingly disposed with a portion of the second transmission element 220, and the portion of the second transmission element 220 is coupled to the output component 300 through the second coupling groove 420.

[0062] Understandably, the first transmission element 210 and the second transmission element 220 are both disposed on the side of the first substrate 110 facing away from the second substrate 120, the output component 300 is disposed on the side of the second substrate 120 facing away from the first substrate 110, and the intermediate metal layer 400 is disposed between the first substrate 110 and the second substrate 120. That is, the first substrate 110 is located between the first transmission element 210 (and the second transmission element 220) and the intermediate metal layer 400, and the second substrate 120 is located between the intermediate metal layer 400 and the output component 300.

[0063] The first transmission element 210, the second transmission element 220, the intermediate metal layer 400, and the output component 300 are all metal conductors. The first substrate 110 and the second substrate 120 are dielectric substrates. The dielectric substrate is a support structure based on insulating material and possessing specific dielectric properties. The dielectric substrate is disposed between the metal conductors and can serve as a carrier for the metal conductors. At the same time, it affects the propagation characteristics of electromagnetic waves through its dielectric properties (such as dielectric constant and loss tangent).

[0064] Thus, the frequency combiner 10 provided in this application embodiment has a compact structure, reduces the size of the frequency combiner 10, and facilitates system integration.

[0065] The first transmission element 210 and the second transmission element 220 are used to access signals of different frequency bands respectively. In a specific implementation, the first transmission element 210 accesses the first signal and the second transmission element 220 accesses the second signal. The frequency band of the first signal can be higher than the frequency band of the second signal, or the frequency band of the first signal can be lower than the frequency band of the second signal. This application uses the example of the frequency band of the first signal being higher than the frequency band of the second signal to describe the frequency combiner 10.

[0066] The first transmission element 210 is connected to the first signal. The first coupling slot 410 is correspondingly set with a portion of the first transmission element 210. The portion of the first transmission element 210 is coupled to the output component 300 through the first coupling slot 410, so that the first transmission element 210 transmits the first signal to the output component 300.

[0067] The second transmission element 220 is connected to the second signal. The second coupling slot 420 is correspondingly set with a portion of the second transmission element 220. The portion of the second transmission element 220 is coupled to the output component 300 through the second coupling slot 420, so that the second transmission element 220 transmits the second signal to the output component 300.

[0068] Thus, by setting the first transmission element 210, the second transmission element 220, the first coupling slot 410 and the second coupling slot 420, the transmission of signals of different frequency bands to the output component 300 can be controlled respectively, thereby realizing the merging of signals of different frequency bands.

[0069] For example, the first coupling groove 410 and the second coupling groove 420 can be rectangular coupling grooves or coupling grooves of other shapes. The embodiments of this application do not impose too many restrictions on the shape of the first coupling groove 410 and the second coupling groove 420.

[0070] In some embodiments, refer to Figure 1 and Figure 4 As shown, the first transmission element 210 includes a first transmission line 211 and a first single-mode resonator 212. The first transmission line 211 and the first single-mode resonator 212 are spaced apart, and the first coupling slot 410 is correspondingly arranged with a portion of the first single-mode resonator 212.

[0071] The second transmission element 220 includes a second transmission line 221 and a second single-mode resonator 222. The second transmission line 221 and the second single-mode resonator 222 are spaced apart, and the second coupling slot 420 is correspondingly arranged with a portion of the second single-mode resonator 222.

[0072] It should be noted that the first transmission line 211 and the first single-mode resonator 212 are spaced apart, and non-contact energy transfer is achieved through the interaction between the edge field of the first transmission line 211 and the equivalent dipole or current loop of the first single-mode resonator 212. Similarly, the second transmission line 221 and the second single-mode resonator 222 are spaced apart, and non-contact energy transfer is achieved through the interaction between the edge field of the second transmission line 221 and the equivalent dipole or current loop of the second single-mode resonator 222.

[0073] For example, the first transmission line 211 and the second transmission line 221 can both be microstrip lines or other transmission lines. This application embodiment does not impose too many restrictions on this.

[0074] Specifically, the first transmission line 211 is spaced apart from the first single-mode resonator 212, and the first coupling slot 410 is correspondingly arranged with a portion of the first single-mode resonator 212. The first transmission line 211 is used to receive the first signal, and the first transmission line 211 couples the first signal to the first single-mode resonator 212. The first single-mode resonator 212 transmits the first signal to the output component 300 through the first coupling slot 410.

[0075] The second transmission line 221 is spaced apart from the second single-mode resonator 222, and the second coupling slot 420 is correspondingly arranged with a portion of the second single-mode resonator 222. The second transmission line 221 is used to receive the second signal. The second transmission line 221 couples the second signal to the second single-mode resonator 222, and the second single-mode resonator 222 transmits the second signal to the output component 300 through the second coupling slot 420.

[0076] Thus, by setting up the first transmission line 211, the first single-mode resonator 212, the second transmission line 221, and the second single-mode resonator 222, signals of different frequency bands can be transmitted to the output component 300 respectively, thereby realizing the merging of signals of different frequency bands and ensuring the independent controllability of signals of each frequency band.

[0077] In some embodiments, refer to Figure 1 As shown, the length of the first single-mode resonator 212 is less than the length of the second single-mode resonator 222.

[0078] It should be noted that, because higher frequencies correspond to shorter wavelengths, the electromagnetic wave travels a shorter distance within one cycle. Therefore, the physical length of a single-mode resonator must also be shortened to maintain the same resonant mode.

[0079] In a practical implementation, the frequency of the first signal is higher than the frequency of the second signal, and the wavelength of the first signal is shorter than the wavelength of the second signal. Therefore, the length of the first single-mode resonator 212 is shorter than the length of the second single-mode resonator 222, so that the lengths of the first single-mode resonator 212 and the second single-mode resonator 222 are matched with the wavelengths of the first signal and the second signal, respectively, thereby allowing the first single-mode resonator 212 and the second single-mode resonator 222 to transmit signals of different frequency bands.

[0080] In some embodiments, refer to Figure 1 As shown, the second single-mode resonator 222 is linear or polygonal.

[0081] It should be noted that the straight-line second single-mode resonator 222 is easy to design and manufacture. The zigzag-shaped second single-mode resonator 222 can increase its length through a folded-back structure, enabling it to achieve low-frequency resonance (longer equivalent wavelength) within a limited space, thereby saving space and reducing the size of the frequency combiner 10. Exemplarily, the shape of the second single-mode resonator 222 can be U-shaped, S-shaped, or other shapes; this embodiment does not impose excessive limitations on this.

[0082] In some embodiments, the first single-mode resonator 212 can be linear or other shapes, and the embodiments of this application do not impose too many restrictions on this.

[0083] In some embodiments, refer to Figure 1 As shown, the length of the first transmission line 211 is less than the length of the second transmission line 221.

[0084] It should be noted that the first transmission line 211 and the second transmission line 221 can be microstrip lines. The length of the microstrip line is a specific multiple of the wavelength of the signal (such as a quarter wavelength or half wavelength) to achieve specific electrical characteristics, such as impedance matching and resonance.

[0085] Because higher frequencies correspond to shorter wavelengths, electromagnetic waves can complete a full cycle over shorter distances, thus the physical length of microstrip lines is correspondingly shorter.

[0086] In a practical implementation, the frequency of the first signal is higher than the frequency of the second signal, and the wavelength of the first signal is shorter than the wavelength of the second signal. Therefore, the length of the first transmission line 211 is shorter than the length of the second transmission line 221, so that the lengths of the first transmission line 211 and the second transmission line 221 are matched with the wavelengths of the first signal and the second signal, respectively, so that the first transmission line 211 and the second transmission line 221 transmit signals of different frequency bands.

[0087] In some embodiments, refer to Figure 1 As shown, at least part of the first single-mode resonator 212 is parallel to the first transmission line 211.

[0088] At least part of the second single-mode resonator 222 is parallel to the second transmission line 221.

[0089] Thus, the parallel arrangement allows the electromagnetic field of the first single-mode resonator 212 to fully overlap with the electromagnetic field of the first transmission line 211, and the electromagnetic field of the second single-mode resonator 222 to fully overlap with the electromagnetic field of the second transmission line 221. This enables the first signal to be transmitted from the first transmission line 211 to the first single-mode resonator 212, and the second signal to be transmitted from the second transmission line 221 to the second single-mode resonator 222, thereby effectively transferring signal energy between the two.

[0090] Parallel configuration can also optimize coupling efficiency, minimizing the transmission loss of the first signal between the first single-mode resonator 212 and the first transmission line 211, and minimizing the transmission loss of the second signal between the second single-mode resonator 222 and the second transmission line 221.

[0091] In some embodiments, refer to Figure 1 As shown, the first transmission element 210 also includes a first feeder 213, which is connected to the first transmission line 211.

[0092] The second transmission element 220 also includes a second feeder 223, which is connected to the second transmission line 221. The first feeder 213 and the second feeder 223 are used to access signals of different frequency bands, respectively.

[0093] Specifically, the first feeder 213 is connected to the first transmission line 211. The first feeder 213 is used to receive the first signal, thereby introducing the first signal into the frequency combiner 10 and transmitting the first signal to the first transmission line 211.

[0094] The second feeder 223 is connected to the second transmission line 221. The second feeder 223 is used to receive the second signal, thereby introducing the second signal into the frequency combiner 10 and transmitting the second signal to the second transmission line 221.

[0095] It should be noted that both the first feed line 213 and the second feed line 223 can be 50-ohm microstrip line feed lines. 50 ohms is the standard characteristic impedance of an RF system. Using 50-ohm microstrip line feed lines can minimize signal reflection, achieve impedance matching, and ensure maximum power transmission.

[0096] In some embodiments, refer to Figure 3 and Figure 4 As shown, the output component 300 includes a dual-mode resonator 310 and a third transmission line 320. The third transmission line 320 is spaced apart from the dual-mode resonator 310 and is coupled to the dual-mode resonator 310.

[0097] It should be noted that the dual-mode resonator 310 and the third transmission line 320 are spaced apart, and non-contact energy transfer is achieved through the interaction between the edge field of the third transmission line 320 and the equivalent dipole or current loop of the dual-mode resonator 310.

[0098] For example, the third transmission line 320 can be a microstrip line or other transmission lines, and the embodiments of this application do not impose too many restrictions on it.

[0099] Specifically, the third transmission line 320 and the dual-mode resonator 310 are spaced apart. The first single-mode resonator 212 transmits the first signal to the dual-mode resonator 310 via the first coupling slot 410, and the dual-mode resonator 310 transmits the first signal to the third transmission line 320. The second single-mode resonator 222 transmits the second signal to the dual-mode resonator 310 via the second coupling slot 420, and the dual-mode resonator 310 transmits the second signal to the third transmission line 320. In this way, the third transmission line 320 and the dual-mode resonator 310 achieve signal merging.

[0100] In some embodiments, refer to Figure 3 and Figure 4 As shown, the dual-mode resonator 310 includes a first resonant section 311 and a second resonant section 312 connected to the first resonant section 311.

[0101] The first resonant part 311 is correspondingly arranged with the first coupling groove 410, and part of the first transmission element 210 is coupled to the first resonant part 311 through the first coupling groove 410.

[0102] The second resonant part 312 is correspondingly arranged with the second coupling groove 420, and part of the second transmission element 220 is coupled to the second resonant part 312 through the second coupling groove 420.

[0103] It should be noted that the first resonant part 311 can be an open-circuit stub, and the second resonant part 312 can be a microstrip line.

[0104] Specifically, the first resonant section 311 is correspondingly arranged with the first coupling slot 410, the first transmission line 211 couples the first signal to the first single-mode resonator 212, and the first single-mode resonator 212 transmits the first signal to the first resonant section 311 via the first coupling slot 410.

[0105] The second resonant section 312 is correspondingly arranged with the second coupling slot 420. The second transmission line 221 couples the second signal to the second single-mode resonator 222, and the second single-mode resonator 222 transmits the second signal to the second resonant section 312 via the second coupling slot 420.

[0106] Thus, by setting the first resonant part 311 and the second resonant part 312, the dual-mode resonator 310 can achieve the superposition and synthesis of different frequencies, as well as the isolation between the first signal and the second signal, and finally complete the efficient combining of multi-frequency signals.

[0107] It should also be noted that, referring to Figure 5 As shown, S11 is the reflection coefficient of the first port, S21 is the transmission coefficient from the first port to the second port, and S31 is the transmission coefficient from the first port to the third port. The frequency range of the first channel is 2.726 GHz to 3.063 GHz (bandwidth 310 MHz), and the frequency range of the second channel is 4.357 GHz to 4.785 GHz (bandwidth 428 MHz). The insertion losses of the two channels are 0.42 dB and 0.61 dB, respectively, and the signal isolation of both is better than 24 dB.

[0108] Therefore, the frequency combiner 10 provided in this application embodiment has lower insertion loss and a compact size, which improves the flexibility and system integration of the frequency combiner 10.

[0109] This application also provides a multi-system access platform, as described above. Figure 4 and Figure 6 As shown, it includes: a bridge 30, at least two radiating terminals 40 and at least two frequency combiners 10, the output component 300 of the frequency combiner 10 having a third feeder 330, each of the third feeders 330 being connected to the input terminal of the bridge 30.

[0110] At least two radiating terminals 40, each of which is connected to the output terminal of the bridge 30.

[0111] Understandably, as a key component of the multi-system access platform, the frequency combiner 10 can connect to different signal sources 20 to combine signals from different frequency bands. Furthermore, the frequency combiner 10 provided in this embodiment has a compact structure, facilitating system integration.

[0112] Specifically, the third feeder 330 is connected to the third transmission line 320. Since the first single-mode resonator 212 transmits the first signal to the dual-mode resonator 310 through the first coupling slot 410, and the dual-mode resonator 310 transmits the first signal to the third transmission line 320, the third transmission line 320 transmits the signal to the third feeder 330.

[0113] It should be noted that the third feeder 330 can be a 50-ohm microstrip line feeder. 50 ohms is the standard characteristic impedance of an RF system. Using a 50-ohm microstrip line feeder can minimize signal reflection, achieve impedance matching, and ensure maximum power transmission.

[0114] Those skilled in the art will understand that the frequency combiner 10 and multi-system access platform provided in this application include a medium component 100, an input component 200, an output component 300, and an intermediate metal layer 400. The medium component 100 includes a first substrate 110 and a second substrate 120 disposed opposite to each other. The input component 200 includes a first transmission element 210 and a second transmission element 220, both disposed on the side of the first substrate 110 facing away from the second substrate 120, and used to respectively receive signals of different frequency bands. The output component 300 is disposed on the side of the second substrate 120 facing away from the first substrate 110.

[0115] An intermediate metal layer 400 is disposed between the first substrate 110 and the second substrate 120. The intermediate metal layer 400 has a first coupling groove 410 and a second coupling groove 420. The first coupling groove 410 is correspondingly disposed with a portion of the first transmission element 210, and the portion of the first transmission element 210 is coupled to the output component 300 through the first coupling groove 410. The second coupling groove 420 is correspondingly disposed with a portion of the second transmission element 220, and the portion of the second transmission element 220 is coupled to the output component 300 through the second coupling groove 420. In this way, the structure is compact, the size of the frequency combiner 10 is reduced, and it is easy to integrate the frequency combiner 10 with the system.

[0116] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0117] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0118] The technical solutions of this application have been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of this application is obviously not limited to these specific embodiments. Without departing from the principles of this application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of this application.

Claims

1. A frequency combiner, characterized in that, include: The dielectric assembly (100) includes a first substrate (110) and a second substrate (120) disposed opposite to each other. The input component (200) includes a first transmission element (210) and a second transmission element (220). The first transmission element (210) and the second transmission element (220) are both disposed on the side of the first substrate (110) facing away from the second substrate (120). The first transmission element (210) and the second transmission element (220) are used to receive signals of different frequency bands respectively. An output component (300) is disposed on the side of the second substrate (120) facing away from the first substrate (110); An intermediate metal layer (400) is disposed between the first substrate (110) and the second substrate (120). The intermediate metal layer (400) has a first coupling groove (410) and a second coupling groove (420). The first coupling groove (410) is correspondingly disposed with a portion of the first transmission element (210), and the portion of the first transmission element (210) is coupled to the output component (300) through the first coupling groove (410). The second coupling groove (420) is correspondingly disposed with a portion of the second transmission element (220), and the portion of the second transmission element (220) is coupled to the output component (300) through the second coupling groove (420). The first transmission element (210) includes a first transmission line (211) and a first single-mode resonator (212). The first transmission line (211) and the first single-mode resonator (212) are spaced apart. The first coupling slot (410) is correspondingly arranged with a portion of the first single-mode resonator (212). The second transmission element (220) includes a second transmission line (221) and a second single-mode resonator (222), the second transmission line (221) and the second single-mode resonator (222) are spaced apart, and the second coupling slot (420) is correspondingly arranged with a portion of the second single-mode resonator (222).

2. The frequency combiner according to claim 1, characterized in that, The length of the first single-mode resonator (212) is less than the length of the second single-mode resonator (222).

3. The frequency combiner according to claim 2, characterized in that, The second single-mode resonator (222) is linear or polygonal.

4. The frequency combiner according to claim 1, characterized in that, The length of the first transmission line (211) is less than the length of the second transmission line (221).

5. The frequency combiner according to any one of claims 1 to 4, characterized in that, At least a portion of the first single-mode resonator (212) is parallel to the first transmission line (211); At least a portion of the second single-mode resonator (222) is parallel to the second transmission line (221).

6. The frequency combiner according to any one of claims 1 to 4, characterized in that, The first transmission element (210) further includes a first feeder (213), which is connected to the first transmission line (211). The second transmission element (220) further includes a second feeder (223), which is connected to the second transmission line (221). The first feeder (213) and the second feeder (223) are respectively used to access the signals of different frequency bands.

7. The frequency combiner according to any one of claims 1 to 4, characterized in that, The output component (300) includes a dual-mode resonator (310) and a third transmission line (320), the third transmission line (320) being spaced apart from the dual-mode resonator (310) and coupled to the dual-mode resonator (310).

8. The frequency combiner according to claim 7, characterized in that, The dual-mode resonator (310) includes a first resonant section (311) and a second resonant section (312) connected to the first resonant section (311). The first resonant part (311) is correspondingly arranged with the first coupling groove (410), and a portion of the first transmission element (210) is coupled to the first resonant part (311) through the first coupling groove (410); The second resonant part (312) is correspondingly arranged with the second coupling groove (420), and a portion of the second transmission element (220) is coupled to the second resonant part (312) through the second coupling groove (420).

9. A multi-system access platform, characterized in that, include: Bridge (30); At least two frequency combiners (10) as described in any one of claims 1 to 8, wherein the output component (300) of the frequency combiner (10) has a third feeder (330), each of the third feeders (330) being connected to the input of the bridge (30); At least two radiating terminals (40) are connected to the output terminal of the bridge (30).

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