Aluminum wire bonding and pressing device

Abstract

The invention belongs to the technical field of aluminum wire bonding, and particularly relates to an aluminum wire bonding and pressing device which comprises a bonding machine body, the bonding machine body comprises a feeding mechanism and a paying-off welding mechanism, the feeding mechanism and the paying-off welding mechanism are communicated through a conveying mechanism, and the conveying mechanism comprises a mounting table communicated with the feeding mechanism. An up-and-down abutting piece is installed at the position, matched with the paying-off welding mechanism, in the mounting table, a first conveying assembly and a second conveying assembly are symmetrically installed on the mounting table through the up-and-down abutting piece, the first conveying assembly comprises a pushing piece and a conveying piece, and L-shaped protection tables are fixedly installed at the upper end of the mounting table in a front-and-back symmetry mode; according to the invention, in the process of abutting and limiting the chips through the up-and-down movement of the up-and-down abutting piece, the transportation piece transports the subsequent chips to make the subsequent chips abut against the previous chips, and then when the up-and-down abutting piece moves upwards to be lifted, the pushing piece accurately pushes the chips which abut against each other towards the direction welding mechanism to make the chips be aligned with the up-and-down abutting piece.

Description

Technical Field

[0001] The present invention belongs to the technical field of aluminum wire bonding, and in particular relates to an aluminum wire bonding and pressing device. Background Art

[0002] The working principle of the aluminum wire welding machine is that the ultrasonic wave from the ultrasonic generator generates high-frequency vibration through the transducer and is transmitted to the splitter through the transducer. When the splitter contacts the lead and the workpiece, under the action of pressure and vibration, the metal surfaces to be welded rub against each other, the oxide film is destroyed, and plastic deformation occurs, causing the two pure metal surfaces to come into close contact, achieving atomic distance bonding, and ultimately forming a strong mechanical connection.

[0003] When existing semiconductor chips are bonded with aluminum wires, intermittent feeding cannot be achieved when transporting the semiconductor chips, and continuous pauses are required. At the same time, semiconductor chips are continuously transported into the body, resulting in uneven distances between chips. As a result, the welding head cannot be accurately aligned when entering the bonding step, so this needs to be improved. Summary of the Invention

[0004] The purpose of the present invention is to provide an aluminum wire bonding and pressing device to solve the problems existing in the background technology.

[0005] In order to achieve the above technical objectives, the technical solutions adopted by the present invention are as follows:

[0006] An aluminum wire bonding and pressing device includes a bonding machine body, the bonding machine body including a feeding mechanism and a wire-paying welding mechanism, the feeding mechanism and the wire-paying welding mechanism being connected via a transport mechanism, the transport mechanism including a mounting platform connected to the feeding mechanism, upper and lower abutment members being installed at positions inside the mounting platform that match the wire-paying welding mechanism, the mounting platform symmetrically having a first transport assembly and a second transport assembly installed around the upper and lower abutment members, the first transport assembly including a pusher and a transport member, and an L-shaped protective platform being fixedly installed symmetrically at the front and rear ends of the upper end of the mounting platform;

[0007] The upper and lower abutting members abut against the mounting platform through up and down movement, and the upper and lower abutting members are connected to the pushing member and the transport member in an up and down transmission manner.

[0008] The upper and lower abutment members include a first telescopic cylinder installed inside the bonding machine body, the output end of the first telescopic cylinder is fixedly connected to an H-shaped frame, the upper end of the H-shaped frame is fixedly installed with a circular frame, and the lower end of the circular frame is fixedly installed with an abutment plate that abuts against the mounting platform.

[0009] The first transport component includes a sliding sleeve fixedly mounted on the H-shaped frame, the sliding sleeve is connected to the pushing member and the transport member for left and right sliding, the pushing member and the transport member are connected to a fixed plate for upward and downward sliding together, and a second telescopic cylinder is installed inside the bonding machine body and is transmission-connected to the fixed plate.

[0010] The pushing member includes a T-shaped block connected to the fixed plate for vertical sliding connection, the T-shaped block is fixedly connected to a connecting rod connected to the sliding sleeve for horizontal sliding connection, the connecting rod is fixedly connected to an upwardly extending rectangular frame, an electric telescopic rod is installed inside the rectangular frame, and an L-shaped abutting rod matching the mounting platform is fixedly installed at the output end of the electric telescopic rod.

[0011] The transport member includes a rack fixedly mounted on a connecting rod, two transmission columns are rotatably mounted inside the mounting platform, and the two transmission columns are jointly connected to a transmission belt matching the mounting platform, one of the transmission columns passes through the mounting platform and is fixedly connected to a first sprocket, a second sprocket is rotatably mounted inside the bonding machine body, a chain is installed between the first sprocket and the second sprocket, and the second sprocket is fixedly mounted with a driving gear meshing with the rack.

[0012] The second conveying assembly includes a driving motor installed inside the bonding machine body, two driving shafts are rotatably installed inside the mounting platform, and the two driving shafts are commonly connected to a second transmission belt.

[0013] The present invention can use the upper and lower abutment parts to move up and down to limit the abutment of the chips, and the transport part will transport the subsequent chip to abut against the previous chip. Then, when the upper and lower abutment parts move upward and are lifted, the pushing part will accurately push the chips abutting each other toward the welding mechanism to align them with the upper and lower abutment parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention is further illustrated by means of the following non-limiting examples.

[0015] Figure 1 This is a schematic structural diagram of an aluminum wire bonding and pressing device according to the present invention;

[0016] Figure 2 This is a partial structural diagram of an aluminum wire bonding and pressing device according to the present invention;

[0017] Figure 3 This is a schematic diagram of a first structure of a partial cross-section of an aluminum wire bonding and pressing device according to the present invention;

[0018] Figure 4 This is a second structural schematic diagram of a partial cross-section of an aluminum wire bonding and pressing device according to the present invention.

[0019] The main component symbols are described as follows:

[0020] Bonding machine body 1, feeding mechanism 11, wire-paying welding mechanism 12, mounting platform 13, upper and lower abutment members 14, L-shaped protective platform 15, first telescopic cylinder 20, H-shaped frame 21, circular frame 22, abutment plate 23, sliding sleeve 24, fixed plate 25, second telescopic cylinder 26, T-shaped block 27, connecting rod 28, rectangular frame 29, L-shaped abutment rod 30, rack 31, transmission column 32, transmission belt 33, first sprocket 34, second sprocket 35, chain 36, drive gear 37, electric telescopic rod 38, drive motor 40, drive drawer 41, second transmission belt 42. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below with reference to the accompanying drawings and embodiments.

[0022] Example 1: Figure 1-4 As shown, an aluminum wire bonding and pressing device of the present invention includes a bonding machine body 1, which includes a feeding mechanism 11 and a wire-paying welding mechanism 12. The feeding mechanism 11 and the wire-paying welding mechanism 12 are connected by a transport mechanism. The transport mechanism includes a mounting platform 13 connected to the feeding mechanism. Upper and lower abutment members 14 are installed at positions inside the mounting platform 13 that match the wire-paying welding mechanism 12. The mounting platform 13 is symmetrically equipped with a first transport component and a second transport component on the upper and lower abutment members 14. The first transport component includes a pusher and a transport member. An L-shaped protective platform 15 is fixedly installed symmetrically on the upper end of the mounting platform 13.

[0023] The upper and lower abutting members 14 abut against the mounting platform 13 by moving up and down, and the upper and lower abutting members 14 are connected to the pushing member and the transport member in an up and down transmission manner.

[0024] When in use, the chip box is aligned with the first transport assembly through the loading mechanism 11, so that the loading mechanism transfers the chip to the upper end of the transport member at the upper end of the mounting table 13 for transportation. In the initial state, the upper and lower abutting members 14 are flush with the mounting table 13 to block the chip, so that the transport member at this time is connected to the transport member when the upper and lower abutting members 14 abut against the mounting table 13, so that the transport member drives the chip to move toward the wire-laying welding mechanism 12 until it abuts against the upper and lower abutting members 14, and then drives the upper and lower abutting members 14 to move upward, and the transport member cannot move. At this time, the pushing member is connected, so that the pushing member drives the chip to move to the inside of the upper and lower abutting members 14. At this time, the upper and lower abutting members 14 are driven to move downward, so that the chip can be fixed, and the wire-laying welding mechanism 12 is started to process the chip;

[0025] During the process of waiting for processing to be completed, new chips are transported from the loading mechanism into the mounting table 13. At this time, the subsequent chips are transported to the upper and lower abutment members 14 by the transport members, so that all the chips will abut against each other, making it convenient for the pushing members to accurately push the abutting chips to the lower ends of the upper and lower abutment members 14, making it convenient for the wire-laying welding mechanism 12 to process.

[0026] The present invention can use the upper and lower abutment parts to move up and down to limit the abutment of the chips, and the transport part will transport the subsequent chip to abut against the previous chip. Then, when the upper and lower abutment parts move upward and are lifted, the pushing part will accurately push the chips abutting each other toward the welding mechanism to align them with the upper and lower abutment parts.

[0027] Example 2: Further improvement is made on the basis of Example 1, and the upper and lower abutment members 14 include a first telescopic cylinder 20 installed inside the bonding machine body 1, and the output end of the first telescopic cylinder 20 is fixedly connected to an H-shaped frame 21, and the upper end of the H-shaped frame 21 is fixedly installed with a circular frame 22, and the lower end of the circular frame 22 is fixedly installed with an abutment plate 23 that abuts against the mounting table 13.

[0028] When it is necessary to drive the abutting plate 23 to move up and down, the first telescopic cylinder 20 drives the H-shaped frame 21 to move up and down, thereby driving the circular frame 22 and the abutting plate 23 to move up and down.

[0029] The first transport assembly includes a sliding sleeve 24 fixedly mounted on the H-shaped frame 21. The sliding sleeve 24 is connected to the pushing member and the transport member for left and right sliding movement. The pushing member and the transport member are connected to a fixed plate 25 for upward and downward sliding movement. A second telescopic cylinder 26 is installed inside the bonding machine body 1 for transmission connection with the fixed plate 25.

[0030] The pushing member includes a T-shaped block 27 that is slidably connected to the fixed plate 25 up and down, the T-shaped block 27 is fixedly connected to a connecting rod 28 that is slidably connected to the sliding sleeve 24 left and right, the connecting rod 28 is fixedly connected to an upwardly extending rectangular frame 29, an electric telescopic rod 38 is installed inside the rectangular frame 29, and an L-shaped abutment rod 30 that matches the mounting platform 13 is fixedly installed at the output end of the electric telescopic rod 38.

[0031] The transport part includes a rack 31 fixedly mounted on the connecting rod 28, and two transmission columns 32 are rotatably mounted inside the mounting platform 13. The two transmission columns 32 are jointly connected to a transmission belt 33 that matches the mounting platform 13. One of the transmission columns 32 passes through the mounting platform 13 and is fixedly connected to a first sprocket 34. A second sprocket 35 is rotatably mounted inside the bonding machine body 1, and a chain 36 is installed between the first sprocket 34 and the second sprocket 35. The second sprocket 35 is fixedly mounted with a driving gear 37 that meshes with the rack 31.

[0032] When the H-shaped frame 21 moves up and down, it drives the sliding sleeve 24 to move together, and then drives the pushing member and the transport member to drive the T-shaped block 27 to move up and down inside the fixed plate 25. When the H-shaped frame 21 moves upward, the abutment plate 23 moves away from the chip, the transport member cannot move, and the rack 31 moves away from the driving gear 37. Then, the second telescopic cylinder 26 drives the fixed plate 25 to extend or shorten. When the fixed plate 25 moves, it pushes the pushing member and the transport member to slide left and right, that is, it drives the connecting rod 28 and the rack 31 to move.

[0033] When the abutment plate 23 is away from the chip, the rack 31 is away from the driving gear 37, thereby making the L-shaped abutment rod 30 away from the chip. For further optimization, a sensor can be installed at the lower end of the L-shaped abutment rod 30 to identify the hollow position of the chip. In this way, when the fixing plate 25 and the connecting rod 28 are driven to move by the second telescopic cylinder 26, the electric telescopic rod 38 and the L-shaped abutment rod 30 will be driven to move. Then, the output end of the electric telescopic rod 38 is controlled to control the L-shaped abutment rod 30 to move downward and insert into the hollow of the chip, and then the second telescopic cylinder 26 pushes the L-shaped abutment rod 30 to drive the chip to move into the inside of the rectangular frame 22. In this way, the second telescopic cylinder 26 accurately controls the movement distance of the L-shaped abutment rod 30, thereby facilitating the processing of the wire-laying welding mechanism 12

[0034] When the chip is located at the lower end of the circular frame 22, it drives the H-shaped clamp 21 to move downward, thereby engaging the rack 31 with the drive gear 37. At this time, the electric telescopic rod 38 is retracted upward, and then the second telescopic cylinder 26 is continuously driven to move in the same direction. The drive gear 37 can be driven to rotate toward the circular frame 22 through the rack 31, thereby driving the first sprocket 34 and the second sprocket 35 to be transported to the circular frame 22 through the chain 36. The chip newly transferred to the mounting table 13 with a gap is then transferred to the circular frame 22 through the conveyor belt 33, so that they abut each other, making it convenient for the L-shaped abutting rod 30 to accurately push the chip into the interior of the circular frame 22.

[0035] The second conveying assembly includes a driving motor 40 installed inside the bonding machine body 1 . Two driving shafts 41 are rotatably installed inside the mounting platform 13 . The two driving shafts 41 are jointly connected to a second conveyor belt 42 .

[0036] The driving motor 40 is in driving connection with one of the driving shafts 41 , so that the driving shaft 41 drives the second conveyor belt 42 to transport the chips.

[0037] A stabilizing plate is installed inside the mounting platform 13 in the interior of the conveyor belt 33 and the second conveyor belt 42. The stabilizing plate provides a supporting force when the elastic telescopic rod 38 drives the L-shaped abutting rod 30 to abut.

[0038] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. An aluminum wire bonding and pressing device, comprising a bonding machine body, wherein the bonding machine body comprises a feeding mechanism and a wire-discharging and welding mechanism, wherein the feeding mechanism and the wire-discharging and welding mechanism are connected via a transport mechanism, and wherein: The transport mechanism includes a mounting platform connected to the feeding mechanism, upper and lower abutment members are installed at positions inside the mounting platform that match the wire-laying welding mechanism, the mounting platform is symmetrically mounted with a first transport component and a second transport component on the upper and lower abutment members, the first transport component includes a pushing member and a transport member, and an L-shaped protective platform is fixedly mounted symmetrically on the upper end of the mounting platform; The upper and lower abutting members abut against the mounting platform through up and down movement, and the upper and lower abutting members are connected to the pushing member and the transport member in an up and down transmission manner.

2. The aluminum wire bonding and pressing device according to claim 1, wherein: The upper and lower abutment members include a first telescopic cylinder installed inside the bonding machine body, the output end of the first telescopic cylinder is fixedly connected to an H-shaped frame, the upper end of the H-shaped frame is fixedly installed with a circular frame, and the lower end of the circular frame is fixedly installed with an abutment plate that abuts against the mounting platform.

3. The aluminum wire bonding and pressing device according to claim 2, wherein: The first transport component includes a sliding sleeve fixedly mounted on the H-shaped frame, the sliding sleeve is connected to the pushing member and the transport member for left and right sliding, the pushing member and the transport member are connected to a fixed plate for upward and downward sliding together, and a second telescopic cylinder is installed inside the bonding machine body and is transmission-connected to the fixed plate.

4. The aluminum wire bonding and pressing device according to claim 3, characterized in that: The pushing member includes a T-shaped block connected to the fixed plate for vertical sliding connection, the T-shaped block is fixedly connected to a connecting rod connected to the sliding sleeve for horizontal sliding connection, the connecting rod is fixedly connected to an upwardly extending rectangular frame, an electric telescopic rod is installed inside the rectangular frame, and an L-shaped abutting rod matching the mounting platform is fixedly installed at the output end of the electric telescopic rod.

5. The aluminum wire bonding and pressing device according to claim 4, characterized in that: The transport member includes a rack fixedly mounted on a connecting rod, two transmission columns are rotatably mounted inside the mounting platform, and the two transmission columns are jointly connected to a transmission belt matching the mounting platform, one of the transmission columns passes through the mounting platform and is fixedly connected to a first sprocket, a second sprocket is rotatably mounted inside the bonding machine body, a chain is installed between the first sprocket and the second sprocket, and the second sprocket is fixedly mounted with a driving gear meshing with the rack.

6. The aluminum wire bonding and pressing device according to claim 1, wherein: The second conveying assembly includes a driving motor installed inside the bonding machine body, two driving shafts are rotatably installed inside the mounting platform, and the two driving shafts are commonly connected to a second transmission belt.

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