Halogen-free low-splashing agent for solder wire, manufacturing method of halogen-free low-splashing agent and solder wire

Abstract

The invention discloses a halogen-free low-splashing solder wire agent, a manufacturing method thereof and a solder wire, and the halogen-free low-splashing solder wire agent comprises the following raw materials in percentage by weight: 88%-95% of polymerized rosin, 4%-13% of an active agent and 0.2%-1.6% of a film-forming agent, wherein the active agent comprises a main active agent and an auxiliary active agent, based on the total weight of the raw materials of the agent, the main active agent is formed by compounding 2%-5% of dimethylolpropionic acid and 2%-5% of maleic anhydride, and the auxiliary active agent comprises 0.1%-0.6% of triton X-100; the film-forming agent comprises at least one of polyethylene glycol dimethacrylate and sodium carboxymethyl cellulose. The preparation method of the agent is simple, reasonable and easy to operate, and the obtained agent can effectively inhibit splashing, has excellent wettability and welding reliability, and well meets market requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of solder wires, in particular to a halogen-free low-spatter solder wire agent, a preparation method thereof, and the solder wire. Background Art

[0002] Welding is a critical step in the manufacturing of electronic devices. With the continuous advancement of electronic welding technologies, such as the increasing use of high-frequency and laser welding processes, traditional solder wire is prone to spatter during the welding process. This spatter includes spatter from the solder flux (specifically, rosin-core flux) and fine solder particles. Spatter during welding not only seriously affects weld quality but can also cause harm to operators. Therefore, there is an urgent need for a solder flux that reduces spatter during welding.

[0003] In view of this, the present invention is proposed. Summary of the Invention

[0004] In order to overcome the above-mentioned defects, the present invention provides a halogen-free low-spatter solder wire agent, a preparation method thereof, and solder wire. The preparation method of the agent is simple, reasonable, and easy to operate, and the obtained agent can effectively inhibit the generation of spatter and has excellent wetting performance and welding reliability, which well meets market demand.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a halogen-free low-spatter solder wire agent, which has the following raw material formula, calculated by weight percentage: 88% to 95% polymerized rosin, 4% to 13% active agent, and 0.2% to 1.6% film-forming agent; wherein the active agent includes a main active agent and an auxiliary active agent, and based on the total weight of the raw materials of the agent, the main active agent is composed of 2% to 5% dimethylolpropionic acid and 2% to 5% maleic anhydride, and the auxiliary active agent includes 0.1% to 0.6% Triton X-100; The film-forming agent includes at least one of polyethylene glycol dimethacrylate and sodium carboxymethyl cellulose.

[0006] As a further improvement of the present invention, the polymerized rosin is polymerized rosin-140 having a softening point of 135° C. to 145° C.

[0007] As a further improvement of the present invention, based on the total weight of the raw materials of the medicament, the auxiliary active agent also includes 0.5% to 1.5% of polyoxypropylene glycerol ether.

[0008] As a further improvement of the present invention, based on the total weight of the raw materials of the agent, the film-forming agent is composed of 0.2% to 0.5% polyethylene glycol dimethacrylate and 0.1% to 1% sodium carboxymethyl cellulose; and the molecular weight of the polyethylene glycol dimethacrylate is 600.

[0009] The present invention also provides a method for preparing a halogen-free, low-spatter solder wire agent, comprising the following steps: S1: After heating the formulated amount of polymerized rosin until it is completely melted, adding the formulated amount of auxiliary active agent and polyethylene glycol dimethacrylate thereto, and stirring and mixing thoroughly to obtain a first mixture; S2: cooling the obtained first mixture while stirring, and after the obtained first mixture is cooled to 120° C. to 130° C., adding the main active agent and sodium carboxymethyl cellulose in the formulated amount thereto, and stirring and mixing again to obtain the halogen-free low-spatter solder wire agent.

[0010] As a further improvement of the present invention, in the above S1, after the first mixture is obtained, the first mixture needs to be stirred continuously, and the stirring speed is controlled at 50-60 rpm.

[0011] As a further improvement of the present invention, in the above S2, the stirring speed is also controlled at 50-60 rpm.

[0012] The present invention also provides a solder wire, comprising a solder alloy and the agent for the halogen-free, low-spatter solder wire as described in the present invention, wherein the agent is coated on the surface of the solder alloy through a coating process or a dipping process to obtain the solder wire; alternatively, the agent and the solder alloy are extruded together through an extrusion molding process to form the solder wire into an integral structure.

[0013] The beneficial effects of the present invention are as follows: ① Through technological innovation, the present invention produces a medicament and solder wire that can effectively suppress spatter generation and has excellent wetting properties and welding reliability, effectively meeting market demand. ② The preparation method of the medicament for halogen-free, low-spatter solder wire provided by the present invention is simple, reasonable, and easy to operate, and the relevant raw materials are readily available, inexpensive, and more environmentally friendly. DETAILED DESCRIPTION

[0014] The present invention will be further described in detail below with reference to specific examples, but the present invention is not limited to these examples.

[0015] This application discloses a halogen-free, low-spatter solder agent, a method for producing the same, and solder wire. The method for producing the solder agent is simple, rational, and easy to operate. The resulting agent effectively suppresses spatter and exhibits excellent wetting and welding reliability, effectively meeting market demand. This achievement is primarily due to the optimization and innovation of the raw material formula for the solder agent. The details are as follows: 1. Preparation of the halogen-free low-spatter solder wire described in this application:

[0016] Example 1:

[0017] This embodiment 1 provides a method for preparing a halogen-free, low-spatter solder wire agent, which mainly includes the following steps: S1: 88 kg of polymerized rosin-140 was placed in an electromagnetic heating boiler and heated to 145°C until completely melted. Then, 0.4 kg of Triton X-100, 1 kg of polyoxypropylene glycerol ether, and 0.5 kg of polyethylene glycol dimethacrylate (molecular weight 600) were added sequentially while stirring. The mixture was thoroughly stirred to obtain a first mixture. After the first mixture was obtained, the mixture was continuously stirred. In particular, the stirring speed in each stage of S1 was controlled to be 50-60 rpm.

[0018] S2: Cooling the obtained first mixture while stirring. It is understandable that the stirring speed is also controlled at 50-60 rpm. After the obtained first mixture is cooled to 120°C-130°C (preferably 125°C), 5 kg of dihydroxymethylpropionic acid, 5 kg of maleic anhydride and 0.1 kg of sodium carboxymethyl cellulose are added thereto in sequence, and the mixture is thoroughly stirred and mixed again to obtain the halogen-free low-spatter solder wire agent.

[0019] Supplementary Notes: ① The molecular weight of the polyethylene glycol dimethacrylate is 600. It is understood that the polyethylene glycol dimethacrylate has 4 to 6 ethylene glycol units. This type of product is a medium molecular weight product and appears as a viscous liquid. ② The soldering agent prepared in this application can also be called a flux.

[0020] Example 2:

[0021] This embodiment 2 also provides a method for preparing a medicament for halogen-free low-spatter solder wire. Compared with embodiment 1, this embodiment 2 is different in that the medicament raw material formula used in this embodiment 2 is different from that in embodiment 1.

[0022] Specifically, the raw material formula of the agent used in Example 2 is: 90 kg of polymerized rosin-140, 0.4 kg of Triton X-100, 0.8 kg of polyoxypropylene glycerol ether, 0.4 kg of polyethylene glycol dimethacrylate (molecular weight 600), 4 kg of dihydroxymethylpropionic acid, 4 kg of maleic anhydride, and 0.4 kg of sodium carboxymethyl cellulose.

[0023] Note: In addition to the above differences, the specific processing methods and processing parameters used in each step of this embodiment 2, such as heating temperature, stirring speed, etc., are the same as those in embodiment 1, so they are not repeated here.

[0024] Example 3:

[0025] This embodiment 3 also provides a method for preparing a medicament for halogen-free low-spatter solder wire. Compared with embodiment 1, this embodiment 3 is different in that the medicament raw material formula used in this embodiment 3 is different from that in embodiment 1.

[0026] Specifically, the raw material formula of the agent used in this Example 3 is: 91 kg of polymerized rosin-140, 0.6 kg of Triton X-100, 1.2 kg of polyoxypropylene glycerol ether, 0.4 kg of polyethylene glycol dimethacrylate (molecular weight 600), 3 kg of dihydroxymethylpropionic acid, 3 kg of maleic anhydride, and 0.8 kg of sodium carboxymethyl cellulose.

[0027] Note: In addition to the above differences, the specific processing methods and processing parameters used in each step of this embodiment 3, such as heating temperature, stirring speed, etc., are the same as those in embodiment 1, so they are not repeated here.

[0028] Embodiment 4:

[0029] This embodiment 4 also provides a method for preparing a medicament for halogen-free low-spatter solder wire. Compared with embodiment 1, this embodiment 4 is different in that the medicament raw material formula used in this embodiment 4 is different from that in embodiment 1.

[0030] Specifically, the raw material formula of the agent used in Example 4 is: 95 kg of polymerized rosin-140, 0.2 kg of Triton X-100, 0.5 kg of polyoxypropylene glycerol ether, 0.2 kg of polyethylene glycol dimethacrylate (molecular weight 600), 2 kg of dihydroxymethylpropionic acid, 2 kg of maleic anhydride, and 0.1 kg of sodium carboxymethyl cellulose.

[0031] Note: In addition to the above differences, the specific processing methods and processing parameters used in each step of this embodiment 4, such as heating temperature, stirring speed, etc., are the same as those in embodiment 1, so they are not repeated here.

[0032] 2. Making the solder wire described in this application:

[0033] Example 5:

[0034] This embodiment 5 provides a solder wire, and the manufacturing method thereof is as follows: Step 1): Provide a solder alloy and the solder wire agent prepared in Example 1 above, wherein the weight ratio of the solder alloy to the agent is 98:2.

[0035] Note: Regarding the solder alloy, this application does not impose any restrictions on its specific composition, which can be determined according to product requirements. For example, it can be used but not limited to tin-lead alloy, lead-free alloy, or medium and low temperature alloy, among which the tin-lead alloy can be further preferably used as 63Sn37Pb, 60Sn40Pb, or 62Sn36Pb2.0Ag, etc., the lead-free alloy can be further preferably used as 99.2Sn0.3Ag0.5Cu, 99Sn0.3Ag0.7Cu, 98.5Sn1.0Ag0.5Cu, or 96.5Sn3.0Ag0.5Cu, etc., and the medium and low temperature alloy can be further preferably used as 42Sn58Bi, 64.7Sn35Bi0.3Ag, or 64Sn35Bi1.0Ag, etc.

[0036] Specifically, this embodiment 5 is described by taking the solder alloy 99Sn0.3Ag0.7Cu as an example.

[0037] Step 2): First, the solder alloy and the reagent are put into an extruder for extrusion molding to obtain a solder wire semi-finished product with an integrated structure; then the obtained solder wire semi-finished product is subjected to wire drawing to obtain a solder wire A with a wire diameter of 1 mm.

[0038] Example 6:

[0039] This embodiment 6 also provides a solder wire, and compared with embodiment 5, this embodiment 6 is different in that the agent used in this embodiment 6 is prepared from the above-mentioned embodiment 2.

[0040] Note: Aside from the aforementioned differences, the solder wire manufacturing process in Example 6, including the weight ratio between the solder alloy and the reagent, the extrusion molding process, and the wire drawing process, is identical to that in Example 5 and is therefore not further described here. It is understood that Example 6 provides a solder wire B also having a wire diameter of 1 mm.

[0041] Example 7:

[0042] This embodiment 7 also provides a solder wire, and compared with embodiment 5, this embodiment 7 is different in that the agent used in this embodiment 7 is prepared from the above-mentioned embodiment 3.

[0043] Note: Aside from the aforementioned differences, the solder wire manufacturing process in Example 7, including the weight ratio between the solder alloy and the reagent, the extrusion molding process, and the wire drawing process, is identical to that in Example 5 and is therefore not further described here. It is understood that Example 7 provides a solder wire C also having a wire diameter of 1 mm.

[0044] Example 8:

[0045] This embodiment 8 also provides a solder wire, and compared with embodiment 5, this embodiment 8 is different in that the agent used in this embodiment 8 is prepared from the above-mentioned embodiment 4.

[0046] Note: Aside from the aforementioned differences, the solder wire manufacturing process in Example 8, including the weight ratio between the solder alloy and the reagent, the extrusion molding process, and the wire drawing process, is identical to that in Example 5 and is therefore not further described here. It is understood that Example 8 provides a solder wire D also having a wire diameter of 1 mm.

[0047] 3. Conducting performance tests on the solder wire produced in this application; The solder wires prepared in Examples 5 to 8 of the present application and conventional solder wire (99Sn0.3Ag0.7Cu with a wire diameter of 1 mm and a rosin content of 2%) were used for laser welding, high-power constant-temperature soldering iron welding, and automatic soldering machine welding. In any welding process, the weldments corresponding to the five types of solder wires (such as a T2 copper plate with an area of ​​40 mm × 40 mm) and the welding parameters were the same.

[0048] After completing the above welding operation, a 10x magnifying glass was used to count the amount of rosin and solder ball spatter around the solder joints. The test results are shown in Table 1 below.

[0049] Table 1 Performance test results of the solder wires obtained in Examples 5 to 8 of the present application and conventional solder wires As can be seen from Table 1, conventional solder wire is prone to spattering during welding, including no fewer than 13 rosin spatters and more than two solder balls. However, the solder wire produced in the present application exhibits very low spattering during welding, primarily consisting of no more than six rosin spatters, and no solder balls. Therefore, the solder wire produced in the present application exhibits far superior spatter suppression performance than conventional solder wire.

[0050] The reason why the solder wire obtained in this application can achieve the above advantages is that this application has optimized and innovated the raw material formula of the solder wire agent, which is specifically manifested in the following aspects: ① When preparing the agent, this application selected polymerized rosin-140 with a high softening point. It decomposes and produces active substances during the welding process, which can effectively remove oxides on the surface of the metal weldment, thereby promoting good contact between the solder and the metal weldment surface, improving the welding quality, and reducing the surface tension of the solder, improving the fluidity, and thus significantly reducing spatter. ② When preparing the agent, this application selected dimethylolpropionic acid and maleic anhydride to form the main active agent in a controlled formula ratio. It is understandable that this application, by compounding two active agents with weak low-temperature activity and strong high-temperature activity, can ensure that the solder wire has the reaction ability to continuously and uninterruptedly remove oxides on the surface of the metal weldment during the welding process, thereby helping to improve the welding quality and reduce the spattering caused by the presence of oxides. ③ When preparing the agent, the present application selects Triton X-100 and polyoxypropylene glycerol ether to form an auxiliary active agent in a controlled formula ratio. Both active agents have good surface activity, which can effectively reduce the interfacial tension between the solder and the surface of the metal weldment, promote the wetting and spreading of the solder, thereby helping to improve the welding quality and effectively reduce spatter. ④ When preparing the agent, the present application selects polyethylene glycol dimethacrylate and sodium carboxymethyl cellulose to form a film-forming agent in a controlled formula ratio. Among them, polyethylene glycol dimethacrylate has good film-forming properties and stability during the welding process, and can form a stable protective film during the welding process, thereby effectively suppressing the spattering of solder or rosin; sodium carboxymethyl cellulose has a certain viscosity and can form a protective film during the welding process, further preventing solder spatter.

[0051] In summary, through technological innovation, this application has produced an agent and solder wire that can effectively suppress the generation of spatter and has excellent wetting properties and welding reliability, which well meets market demand.

[0052] In the above description, many specific details are set forth in order to fully understand the present invention. However, the above description is only a preferred embodiment of the present invention. The present invention can be implemented in many other ways different from those described herein, so the present invention is not limited to the specific implementation disclosed above. At the same time, any person skilled in the art can make many possible changes and modifications to the technical solution of the present invention using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment of equivalent changes. Any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A halogen-free, low-spatter solder wire agent, characterized by: Calculated by weight percentage, the raw material formula is as follows: polymerized rosin 88% to 95%, active agent 4% to 13% and film-forming agent 0.2% to 1.6%; Wherein, the active agent includes a main active agent and an auxiliary active agent, and based on the total weight of the raw materials of the pharmaceutical agent, the main active agent is composed of 2% to 5% dimethylolpropionic acid and 2% to 5% maleic anhydride, and the auxiliary active agent includes 0.1% to 0.6% of Triton X-100; The film-forming agent includes at least one of polyethylene glycol dimethacrylate and sodium carboxymethyl cellulose.

2. The halogen-free low-spatter solder wire agent according to claim 1, characterized in that: The polymerized rosin is polymerized rosin-140 with a softening point of 135° C. to 145° C.

3. The halogen-free low-spatter solder wire agent according to claim 1, characterized in that: Based on the total weight of the raw materials of the medicament, the auxiliary active agent also includes 0.5% to 1.5% of polyoxypropylene glycerol ether.

4. The halogen-free low-spatter solder wire agent according to claim 1, characterized in that: Based on the total weight of the raw materials of the drug, the film-forming agent is composed of 0.2% to 0.5% of polyethylene glycol dimethacrylate and 0.1% to 1% of sodium carboxymethyl cellulose; and the molecular weight of the polyethylene glycol dimethacrylate is 600.

5. A method for preparing a halogen-free, low-spatter solder wire agent according to any one of claims 1 to 4, characterized in that: The production steps include: S1: After heating the formulated amount of polymerized rosin until it is completely melted, adding the formulated amount of auxiliary active agent and polyethylene glycol dimethacrylate thereto, and stirring and mixing thoroughly to obtain a first mixture; S2: cooling the obtained first mixture while stirring, and after the obtained first mixture is cooled to 120° C. to 130° C., adding the main active agent and sodium carboxymethyl cellulose in the formulated amount thereto, and stirring and mixing again to obtain the halogen-free low-spatter solder wire agent.

6. The method for producing the halogen-free low-spatter solder wire agent according to claim 5, characterized in that: In the above S1, after the first mixture is obtained, the first mixture needs to be stirred continuously, and the stirring speed is controlled at 50-60 rpm.

7. The method for preparing the halogen-free low-spatter solder wire agent according to claim 5, characterized in that: In the above S2, the stirring speed is also controlled at 50-60 rpm.

8. A solder wire, characterized in that: The solder wire is prepared by coating the solder alloy with the halogen-free low-spatter solder agent according to any one of claims 1 to 4, or by coating the solder alloy with the agent on the surface of the solder alloy by a coating process or a dipping process. Alternatively, the agent and the solder alloy are extruded together to form the solder wire into an integral structure through an extrusion molding process.

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