Vehicle-mounted domain controller structure

Abstract

The vehicle-mounted domain controller structure comprises a metal frame, a heat dissipation module, a top cover assembly and a bottom cover, a first installation cavity and a second installation cavity are integrally formed in the metal frame, and the two installation cavities are physically isolated through a continuous metal partition plate; a high-speed signal board is fixedly mounted in the first mounting cavity, and a main control board is fixedly mounted in the second mounting cavity; and the plate surface of the continuous metal partition plate is respectively parallel to the mounting plane of the high-speed signal plate and the mounting plane of the main control plate. According to the vehicle-mounted domain controller structure provided by the invention, through rigid physical separation and continuous electromagnetic shielding, effective isolation of a high-speed signal circuit and a high-power main control circuit in a physical space and an electromagnetic environment is fundamentally realized, and an inter-board coupling noise path is thoroughly blocked; and the signal integrity, the electromagnetic compatibility, the thermal management efficiency and the long-term reliability of the whole system are obviously improved.

Description

Technical Field

[0001] The present invention relates to the field of automotive electronics technology, and in particular to a vehicle-mounted domain controller hardware architecture design that is resistant to electromagnetic interference and is suitable for high-performance vehicle-mounted computing scenarios such as intelligent driving and smart cockpits. Background Art

[0002] Electromagnetic compatibility (EMC) has become a key challenge in the field of automotive electronics, particularly in the design of in-vehicle domain controllers (DCs) for computing-intensive applications such as intelligent driving and smart cockpits. Current mainstream designs typically utilize a monolithic integrated architecture, integrating circuit boards responsible for high-speed signal processing (such as multi-channel sensor data acquisition, high-definition video transmission, and high-speed network communication) with the main control board (such as the SoC, GPU, or MCU) performing core computing and power management within the same enclosed cavity. This isolation is primarily achieved through physical spacing and limited local shielding.

[0003] However, this single-cavity integration solution faces several technical challenges in practice: Limited electromagnetic interference suppression: Sensitive analog / digital signals on high-speed signal boards are susceptible to strong electromagnetic noise generated by the main control board. This interference is primarily transmitted through close-range capacitive coupling (electric field coupling) and inductive coupling (magnetic field coupling). Within the compact space of a single cavity, it is often difficult to completely eliminate this inter-board crosstalk solely through physical spacing and conventional PCB layout optimization, which can lead to decreased signal integrity (SI), increased communication bit error rate (BER), and connection stability issues. Furthermore, the single-shell design has limitations in its ability to protect against external electromagnetic interference (EMS / RFI) and suppress internal radiated interference (EMI) in complex in-vehicle electromagnetic environments (such as engine ignition, motor drive, high-power DC-DC conversion, and external RF sources), increasing the difficulty, development cycle, and cost of meeting stringent automotive EMC standards.

[0004] Increased thermal management complexity: The large amount of heat generated by the main control board (especially the high-power processor chip) may indirectly affect temperature-sensitive components (such as crystal oscillators, precision ADCs, and RF front-ends) on adjacent high-speed signal boards through air convection or structural heat conduction within the shared cavity. This thermal interference may cause component parameter drift (such as frequency and gain), performance fluctuations, and long-term reliability risks.

[0005] Structural design and manufacturing complexity: To mitigate the aforementioned electromagnetic interference and thermal issues, designs often require the introduction of additional local shielding enclosures, complex grounding strategies, or numerous filtering components. This not only increases system design complexity and material costs, but can also introduce additional parasitic effects and create manufacturing and assembly challenges.

[0006] Therefore, in order to effectively address the above challenges and improve the signal integrity, electromagnetic compatibility, thermal management efficiency and long-term reliability of the vehicle domain controller, an innovative hardware architecture design solution is urgently needed that can achieve more effective isolation between high-speed signal circuits and high-power main control circuits in terms of physical space and electromagnetic environment. Summary of the Invention

[0007] In view of this, the present invention provides an on-vehicle domain controller structure, which fundamentally achieves effective isolation of high-speed signal circuits and high-power main control circuits in physical space and electromagnetic environment through rigid physical separation and continuous electromagnetic shielding, completely blocks the inter-board coupling noise path, and significantly improves the signal integrity, electromagnetic compatibility, thermal management efficiency and long-term reliability of the overall system.

[0008] The purpose of the present invention is achieved through the following technical solutions: A vehicle-mounted domain controller structure includes a metal frame, a top cover assembly, and a bottom cover. The metal frame is integrally formed with a first mounting cavity and a second mounting cavity, and the two mounting cavities are physically separated by a continuous metal partition. The first mounting cavity is fixedly mounted with a first printed circuit board, and the second mounting cavity is fixedly mounted with a second printed circuit board. The plate surface of the continuous metal partition is parallel to the mounting plane of the first printed circuit board and the mounting plane of the second printed circuit board, respectively.

[0009] This dual-chamber physical separation structure establishes a first mounting cavity and a second mounting cavity within a metal frame, using a continuous metal partition for physical isolation. This allows the first and second printed circuit boards to be strictly separated into two independent spaces, effectively eliminating signal crosstalk between the boards. The first printed circuit board can be a high-speed signal board, and the second printed circuit board can be a main control board. Due to capacitive and inductive coupling paths between the boards, when two electronic devices are too close together, electric or magnetic fields can interfere through the air or dielectric medium. This physical separation directly blocks these coupling paths, preventing high-frequency signals from interfering with each other during transmission and safeguarding signal integrity. In a vehicle environment, electromagnetic interference (EMI) sources are diverse and complex. For example, noise from the engine, sensors, or external radio equipment can intrude into the system. This design provides a continuous shielding layer through the metal isolation barrier, significantly improving the system's electromagnetic compatibility and reducing data transmission errors. Furthermore, the parallel placement of the partition surface and the mounting plane ensures that the partition maximizes coverage of the circuit board's working area, eliminating electromagnetic leakage vulnerabilities caused by angular deviation and enhancing isolation. This is particularly useful for in-vehicle controllers processing high-speed signals. It prevents high-power signals from the second printed circuit board from affecting sensitive first printed circuit board circuits, thereby improving overall system reliability and stability and extending component life. Furthermore, the unibody structure reduces assembly complexity, minimizes contact points, improves mechanical strength, and maintains isolation effectiveness in vibration environments.

[0010] Preferably, a first shielding boss extending toward the bottom of the first printed circuit board is provided at the bottom of the first installation cavity, and the first shielding boss is electrically connected to the continuous metal partition to form an equipotential shielding body.

[0011] The first shielding boss extends from the bottom of the first mounting cavity to the underside of the first printed circuit board and is electrically connected to the continuous metal partition, forming a continuous equipotential shield. This significantly enhances electromagnetic protection for the first printed circuit board. In high-speed electronic systems, the bottom of the circuit board is often a critical area for signal leakage. The boss design, which covers the bottom surface, effectively fills the geometric blind spot of traditional isolation plates and prevents low-frequency interference from intruding through edges or gaps. The electrical connection integrates the boss with the partition, eliminating the risk of electromagnetic radiation caused by potential differences and ensuring that the entire shield is at the same potential level, thereby suppressing electromagnetic coupling caused by capacitance or inductance. This structure is particularly important for automotive applications, as the in-vehicle environment is prone to strong electromagnetic interference sources. The boss shields the space below the signal board, preventing external noise from coupling into the signal lines through the chassis or cables, thereby improving signal transmission accuracy. The equipotential design also reduces electromagnetic energy reflection, prevents resonant interference caused by standing waves, and ensures the purity of high-speed signals. In assembly, the extended boss simplifies the construction of the shielding system, reduces the need for additional electromagnetic padding, and reduces material costs. It also provides mechanical support and enhances circuit board stability. This significantly improves the controller's anti-interference capability, ensures the reliability of high-speed data communication, and avoids bit errors or system failures.

[0012] Preferably, it also includes a thermally conductive substrate, which is arranged in the second installation cavity, and the continuous metal partition extends a second shielding boss toward the top of the second printed circuit board, and a thermally conductive interface material layer is provided between the second shielding boss and the thermally conductive substrate.

[0013] This design integrates electromagnetic shielding and heat dissipation by placing a thermally conductive substrate within the second mounting cavity and utilizing a second shielding boss extending from a continuous metal partition, combined with a thermal interface material layer. The second shielding boss extends from the top of the partition toward the second printed circuit board area, forming a physical barrier that effectively covers the space above the second printed circuit board's circuitry, blocking any interference caused by high-frequency signal radiation propagating upward. Furthermore, a thermal interface material layer is placed between the boss and the thermally conductive substrate, creating an efficient heat conduction path. Heat generated by the second printed circuit board is transferred through the interface material to the thermally conductive substrate, dissipating and dissipating it out of the system. In high-temperature vehicle environments, the second printed circuit board, as the core processor, accumulates significant heat. This structure prevents heat accumulation from causing component performance degradation or failure, maintaining a stable operating temperature. The thermal interface material layer ensures a zero-gap between the metal boss and the substrate, reducing thermal resistance and enhancing heat transfer efficiency. The shielding boss itself, as a metal body with high thermal conductivity, further enhances heat dissipation. This dual design simplifies system layout, eliminates the need for separate heat dissipation components, reduces costs, and maintains overall shielding continuity. For example, while a vehicle is in motion, vibrations can cause a conventional heat sink to loosen, but this integrated structure ensures uninterrupted shielding and heat dissipation, improving reliability and durability. This is particularly true for the high-power second PCB, as it prevents increased electromagnetic interference caused by thermal management defects, ensuring long-term, trouble-free operation of the control unit.

[0014] Preferably, the continuous metal partition is provided with a through-type electrical channel, an interconnection device for connecting the two circuit boards is arranged in the channel, and the inner wall of the channel is plated with a conductive layer.

[0015] This structure achieves electromagnetic shielding and isolation between circuit boards by creating a through-hole electrical channel through a continuous metal partition, placing interconnect components within the channel, and coating the channel's inner wall with a conductive layer. The through-hole channel allows signal lines or power interconnects to pass through the partition, avoiding physical separation that disrupts connectivity. The interconnect components are mounted directly within the channel, ensuring signal transmission continuity. The conductive layer on the channel's inner wall integrates with the metal partition, creating a closed, shielded environment that prevents high-frequency electromagnetic waves from leaking or intruding through the channel's pores, effectively blocking signal crosstalk. In vehicle controllers, interconnect points are often high-risk areas for electromagnetic interference. The conductive coating ensures that the entire channel wall acts as a metal shield, eliminating potential differences caused by potential insulation points and suppressing capacitive coupling. This design is crucial for multi-board systems, enabling the connection of a second printed circuit board to the first while maintaining a complete isolation barrier, preventing mutual interference that could impact system performance. The coating also enhances the mechanical strength of the channel wall, reducing fatigue and poor contact caused by vibration. Technically, the through-hole channel simplifies layout, eliminating the need for additional wiring troughs and saving space, while the controllable mounting orientation of the interconnect components improves maintainability. This significantly improves data integrity, especially in high-frequency communications. It can reduce conducted radiation and induced noise, ensure high-speed and reliable transmission of in-vehicle networks, and extend the life of interconnected components.

[0016] Preferably, a heat dissipation fin array is provided on the outer wall of the metal frame, and the extension direction of the heat dissipation fin array is consistent with the air outlet direction of the heat dissipation module.

[0017] The cooling fin array on the metal frame's outer wall aligns with the airflow direction of the heat dissipation module, optimizing the airflow path and significantly improving heat dissipation efficiency. The fin array, a passive cooling component, absorbs system heat through heat exchange between the fins and the air. Aligning the fins with the airflow direction reduces airflow resistance, prevents turbulence or backflow, and ensures smooth cooling airflow across the fin surface, maximizing heat dissipation area. Under high vehicle operating conditions, the controller experiences high internal heat loads. This alignment promotes continuous heat removal via natural convection or fan-driven forced airflow, preventing the formation of localized hotspots. The integrated structure of the fin array and metal frame not only simplifies manufacturing but also enhances heat transfer. The entire frame acts as a thermal conductor, rapidly transferring heat from internal heat sources to the fin area for dissipation. This aligned design reduces heat dissipation blind spots, improves thermal uniformity, and lowers component operating temperatures, preventing performance degradation or malfunctions caused by overheating. In space-constrained in-vehicle environments, it optimizes airflow, allowing the heat dissipation module to operate efficiently without adding additional components, reducing costs and improving reliability. This is particularly true for high-power domain controllers, ensuring that the cooling system works in conjunction with the electromagnetic shielding to extend the life of the electronic components while maintaining low noise levels.

[0018] Preferably, a plurality of independently shielded antenna accommodating grooves are provided at the end of the metal frame, and each accommodating groove is separated by a metal partition wall.

[0019] This structure features multiple independently shielded antenna slots at the ends of the metal frame, separated by metal partitions to provide antenna isolation and protection. Multiple slots provide space for different antenna components, and the metal partitions physically separate each slot into independent units, preventing crosstalk or coupling between antenna signals. In an in-vehicle domain controller, antennas such as GPS, Wi-Fi, or cellular modules operate in different frequency bands, which can easily cause intermodulation interference when placed in close proximity. The metal walls of the independent shielding slots create a Faraday cage effect, blocking RF leakage paths and ensuring signal purity. This design prevents cross-interference within the antenna array and improves the compatibility of multi-band systems, such as preventing high-frequency signals from contaminating low-frequency receivers. The metal partitions are integrated into the frame, enhancing mechanical stability, reducing vibration, and ensuring the antennas are securely positioned. Electromagnetically, each slot forms a self-contained shield, preventing external interference from intruding into the internal circuitry and preventing antenna radiation from interfering with sensitive controller areas. This optimizes wireless communication quality and reduces packet loss and bit errors. This is particularly true in high-density automotive electronics, supporting diverse antenna requirements without sacrificing isolation performance, thereby improving overall system reliability.

[0020] Preferably, the top cover assembly includes a metal shielding cover, and the side wall of the metal shielding cover forms an annular overlapping structure with the first shielding boss.

[0021] The top cover assembly utilizes a metal shielding hood whose sidewalls form an annular overlap structure with the first shielding boss of the first mounting cavity, creating a continuous electromagnetic shielding seal. The annular overlap design perfectly connects the top cover to the bottom boss, eliminating electromagnetic leakage caused by gaps and forming a 360-degree shielding environment, preventing radio frequency interference from invading the first printed circuit board area through the top or sides. In vehicle applications, road vibration or temperature changes can easily damage component joints, but the annular overlap provides mechanical redundancy, maintaining stable contact and ensuring long-term shielding effectiveness. The metal shielding hood incorporates the top cover area into the shielding system and works in conjunction with the continuous partition to cover the entire cavity and prevent signal radiation from the top. This is especially critical for high-speed signal protection, as it can suppress interference from external electromagnetic sources such as radar or mobile devices, ensuring distortion-free data transmission. The overlap structure simplifies assembly, reduces the need for seals, improves reliability, and ensures stable operation of the vehicle control unit in harsh environments.

[0022] Preferably, the top cover assembly is provided with a guide structure, and the guide structure comprises an inclined guide surface, and the guide surface forms an acute angle with the gap between the heat dissipation fin array.

[0023] The top cover assembly is equipped with a guide structure, whose inclined guide surface forms an acute angle with the gap between the heat dissipation fin array, effectively guiding the cooling airflow into the heat dissipation channel. The inclined guide surface is designed according to the direction of the airflow. The acute angle reduces the inlet resistance, accelerates the flow of air into the fin gap, avoids vortexes or stagnant areas, and maximizes the use of the fin heat dissipation surface area. In the vehicle cooling system, the fan or driving wind often has an irregular flow field. The guide surface ensures a smooth transition of airflow through angle optimization and improves heat exchange efficiency. This prevents local overheating, balances the system temperature distribution, and avoids damage to electronic components due to uneven heat dissipation. The acute angle design enhances wind pressure concentration, promotes forced convection, and optimizes cooling performance in a limited space. The guide structure does not consume additional power, reducing costs. At the same time, it matches the heat dissipation module to ensure that the controller maintains low temperature operation under high load and improves durability.

[0024] Preferably, the bottom cover is locked to the second printed circuit board and the support portion of the second mounting cavity at the same time, and the second printed circuit board is clamped between the bottom cover and the second shielding boss.

[0025] The bottom cover simultaneously locks the second printed circuit board to the support portion of the second mounting cavity, and clamps the second printed circuit board between the bottom cover and the second shielding boss, providing multiple fixations and heat conduction. This clamping design ensures that the second printed circuit board is mechanically firmly positioned, and the bottom cover, support portion, and boss are formed into a rigid whole by fasteners to prevent loosening or displacement caused by vehicle vibration. The clamping between the metal bosses establishes a direct thermal path, and heat is transferred from the second printed circuit board through the bosses to the frame or heat dissipation system, reducing interfacial thermal resistance. In terms of electromagnetics, the clamping structure seals the second printed circuit board area, assisting the shielding function and eliminating noise caused by loose contact. Fastener locking enhances disassembly and facilitates maintenance, while providing uniform pressure distribution and avoiding thermal strain. This is critical for protecting the high-power second printed circuit board and can improve overall system reliability and heat dissipation efficiency.

[0026] Preferably, the plugging direction of the interconnection device is perpendicular to the surface of the continuous metal partition.

[0027] The interconnect's mating direction is perpendicular to the continuous metal partition surface, ensuring connection reliability and maintaining shielding effectiveness. Vertical insertion reduces insertion and removal forces, prevents misalignment that could cause poor contact or wear, and ensures stable signal transmission. Furthermore, the perpendicular orientation of the board plane positions the interconnection point perpendicular to the shielding surface, maximizing the use of the conductive path shield layer and preventing signal leakage. In vibrating environments, the vertical orientation reduces the risk of force displacement and improves system durability. This optimizes the interconnection process, simplifies installation, and ensures uninterrupted electrical continuity.

[0028] The beneficial effects of the present invention compared to the prior art are: Excellent electromagnetic interference blocking capability: The continuous metal partition forms a highly effective Faraday cage effect, significantly blocking electromagnetic interference between the two mounting cavities. Tests have shown that in typical high-frequency communication bands (such as Wi-Fi bands), this structure can achieve electromagnetic shielding effectiveness far exceeding the industry average, significantly suppressing crosstalk between circuit boards. (The comparative data section can be moved to the specific implementation method or examples for further explanation.) Superior vibration reliability: The integrated metal frame significantly enhances the rigidity and integrity of the overall structure. Under stringent random vibration conditions (e.g., covering common frequency and acceleration ranges), this structure effectively raises the system's natural resonant frequency and significantly reduces vibration-induced stress on critical components (such as solder joints), thereby improving reliability in long-term vibration environments.

[0029] Efficient thermal management optimization: By directing heat from the main control board's heat source (such as the SoC chip) to remote cooling fins via heat pipes inside the partition, this structure effectively isolates the heat source between the critical heating area and the adjacent high-speed signal board, minimizing the negative impact of high temperature on the performance and life of sensitive components on the high-speed signal board.

[0030] Significant cost-effectiveness in mass production: The die-casting process radically reduces the number of parts and assembly steps, significantly streamlining the production process and reducing manufacturing costs. Furthermore, the excellent electromagnetic isolation performance significantly improves the product's electromagnetic compatibility (EMC) test pass rate, reducing rework and testing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 This is an exploded view of the vehicle-mounted domain controller structure according to an embodiment of the present invention.

[0033] Figure 2 This is a structural diagram of a metal frame according to an embodiment of the present invention.

[0034] Figure 3 This is a structural diagram of the metal frame from another perspective according to an embodiment of the present invention.

[0035] Figure 4 FIG. 1 is a schematic diagram of the positions of multiple antennas according to an embodiment of the present invention.

[0036] Figure 5FIG. 1 is a schematic diagram showing the positions of multiple antennas from another perspective according to an embodiment of the present invention.

[0037] Figure 6 FIG. 1 is a schematic diagram showing the position of a cooling fan according to an embodiment of the present invention.

[0038] Figure 7 This is a top view of the vehicle-mounted domain controller structure according to an embodiment of the present invention.

[0039] Figure 8 for Figure 7 Cross-sectional view of the AA region.

[0040] Figure 9 This is a structural diagram of a top cover assembly according to an embodiment of the present invention.

[0041] Figure 10 This is a structural diagram of the top cover assembly from another perspective of an embodiment of the present invention.

[0042] Explanation of reference numerals: metal frame 100, heat dissipation fin array 110, first shielding boss 120, thermally conductive substrate 130, continuous metal partition 140, second shielding boss 150, antenna accommodating groove 161, antenna accommodating groove 162, antenna accommodating groove 163, antenna 171, antenna 172, antenna 173, cooling fan 200, top cover assembly 300, metal shielding cover 310, first printed circuit board 400, thermal interface material layer 500, second printed circuit board 600, bottom cover 700. DETAILED DESCRIPTION

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0044] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0045] It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further defined and explained in the subsequent figures. In the description of the embodiments of the present application, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship in which the product of the application is usually placed when in use, or is the orientation or position relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0046] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0047] The technical solution in this application will be described below with reference to the accompanying drawings.

[0048] Example 1: This embodiment provides a vehicle-mounted domain controller structure, including a metal frame 100, a heat dissipation module, a top cover assembly 300, a bottom cover 700 and fasteners. The metal frame 100 is integrally formed with a first mounting cavity and a second mounting cavity, and the two mounting cavities are physically isolated by a continuous metal partition 50; the first mounting cavity is fixedly installed with a high-speed signal board 400, and the second mounting cavity is fixedly installed with a main control board 600; the board surface of the continuous metal partition 50 is parallel to the mounting plane of the high-speed signal board 400 and the mounting plane of the main control board 600, respectively.

[0049] The dual-cavity physical separation structure achieves physical isolation by setting a first mounting cavity and a second mounting cavity in the metal frame 100 and using a continuous metal partition 50, so that the high-speed signal board 400 and the main control board 600 are strictly separated in two independent spaces, thereby effectively eliminating the signal crosstalk problem between the circuit boards. Due to the presence of capacitive coupling and inductive coupling paths between the circuit boards, when two electronic devices are too close, the electric field or magnetic field will interfere through the air or medium. This physical isolation method directly blocks these coupling paths, preventing high-frequency signals from interfering with each other during transmission and ensuring signal integrity. In a vehicle-mounted environment, electromagnetic interference sources are diverse and complex. For example, noise from the engine, sensors or external radio equipment may invade the system. This design provides a continuous shielding layer through a metal isolation barrier, significantly improving the electromagnetic compatibility of the system and reducing the data transmission error rate. At the same time, the parallel arrangement of the partition surface and the mounting plane ensures that the partition maximizes the coverage of the working area of ​​the circuit board, eliminates electromagnetic leakage weaknesses caused by angle deviation, and enhances the isolation effect. This is particularly useful for in-vehicle controllers that process high-speed signals. It prevents high-power signals from the main control board 600 from affecting sensitive circuits on the high-speed signal board 400, thereby improving overall system reliability and stability and extending component life. Furthermore, the unibody structure reduces assembly complexity, minimizes contact points, improves mechanical strength, and maintains isolation effectiveness in vibration environments.

[0050] In this embodiment, the heat dissipation module includes a heat dissipation fan 200. The bottom of the first installation cavity is provided with a first shielding boss 26 extending toward the bottom of the high-speed signal board 400. The first shielding boss 26 is electrically connected to the continuous metal partition 50 to form an equipotential shielding body.

[0051] The first shielding boss 26 extends from the bottom of the first mounting cavity to below the high-speed signal board 400 and is electrically connected to the continuous metal partition 50, forming a continuous equipotential shield. This significantly enhances electromagnetic protection for the high-speed signal board 400. In high-speed electronic systems, the bottom of the circuit board is often a critical area for signal leakage. The boss design, which covers the bottom surface, effectively fills the geometric blind spot of traditional isolation boards and prevents low-frequency interference from intruding through edges or gaps. The electrical connection integrates the boss with the partition, eliminating the risk of electromagnetic radiation caused by potential differences and ensuring that the entire shield is at the same potential level, thereby suppressing electromagnetic coupling caused by capacitance or inductance. This structure is particularly important for automotive applications, as the in-vehicle environment is prone to strong electromagnetic interference sources. The boss shields the space below the signal board, preventing external noise from coupling into the signal lines through the chassis or cables, thereby improving signal transmission accuracy. The equipotential design also reduces electromagnetic energy reflection, prevents resonant interference caused by standing waves, and ensures the purity of high-speed signals. In assembly, the extended boss simplifies the construction of the shielding system, reduces the need for additional electromagnetic padding, and reduces material costs, while providing mechanical support and enhancing circuit board stability. This significantly improves the controller's anti-interference capability, ensures the reliability of high-speed data communication, and avoids bit errors or system failures.

[0052] In this embodiment, a thermally conductive substrate 130 is further included, which is arranged in the second installation cavity. The continuous metal partition 50 extends a second shielding boss 51 toward the top of the main control board 600, and a thermally conductive interface material layer 500 is provided between the second shielding boss 51 and the thermally conductive substrate 40.

[0053] This design integrates electromagnetic shielding and heat dissipation by placing a thermally conductive substrate 40 within the second mounting cavity and utilizing a second shielding protrusion 51 extending from a continuous metal partition 50, combined with a thermal interface material layer 500. The second shielding protrusion 51 extends from the top of the partition toward the main control board 600, forming a physical barrier that effectively covers the space above the main control board 600's circuitry, blocking any interference caused by upward propagation of high-frequency signals. Furthermore, the thermal interface material layer 500 fills the space between the protrusion and the thermally conductive substrate 40, creating an efficient heat conduction path. Heat generated by the main control board 600 is transferred through the interface material to the thermally conductive substrate 40, dissipating and discharging it from the system. In high-temperature vehicle environments, the main control board 600, as a core processor, accumulates significant heat. This structure prevents heat accumulation from causing component performance degradation or failure, maintaining a stable operating temperature. The thermal interface material layer 500 ensures a zero-gap between the metal protrusion and the substrate, reducing thermal resistance and enhancing heat transfer efficiency. The shielding protrusion itself, as a metal body with high thermal conductivity, further promotes heat dissipation. This dual design simplifies system layout, eliminates the need for separate heat sink components, reduces costs, and maintains overall shielding continuity. For example, while a vehicle is in motion, vibrations can cause traditional heat sinks to loosen, but this integrated structure ensures uninterrupted shielding and heat dissipation, improving reliability and durability. This is particularly useful for the high-power main control board 600, as it prevents increased electromagnetic interference caused by thermal management defects and ensures long-term, trouble-free operation of the control unit.

[0054] In this embodiment, a through-type electrical channel is defined in the continuous metal partition 50 . An interconnection device for connecting two circuit boards is disposed in the channel, and the inner wall of the channel is plated with a conductive layer.

[0055] This structure achieves electromagnetic shielding and isolation between circuit boards by creating a through-hole electrical channel through a continuous metal partition 50, placing interconnect components within the channel, and coating the inner wall of the channel with a conductive layer. The through-hole channel allows signal lines or power supply interconnects to pass through the partition, avoiding physical separation that disrupts connectivity requirements. The interconnect components are mounted directly within the channel, ensuring signal transmission continuity. The conductive layer on the inner wall of the channel integrates with the metal partition 50, creating a closed shielding environment that prevents high-frequency electromagnetic waves from leaking or intruding through the channel pores, effectively blocking signal crosstalk paths. In vehicle controllers, interconnect points are often high-risk areas for electromagnetic interference. The conductive coating ensures that the entire channel wall acts as a metal shield, eliminating potential differences caused by potential isolation points and suppressing capacitive coupling effects. This design is crucial for multi-board systems, connecting the main control board 600 and the high-speed signal board 400 while maintaining a complete isolation barrier, preventing mutual interference that could impact system performance. The coating also enhances the mechanical strength of the channel wall, reducing fatigue or poor contact of interconnect components caused by vibration. In terms of technology, through-channels simplify layout, eliminating the need for additional wiring troughs and saving space, while the controllable installation direction of interconnect components improves maintainability. This significantly enhances data integrity, especially in high-frequency communications, by reducing conducted, radiated, and induced noise, ensuring high-speed and reliable transmission of in-vehicle networks and extending the life of interconnect components.

[0056] In this embodiment, a heat dissipation fin array 11 is provided on the outer wall of the metal frame 100 , and the extending direction of the heat dissipation fin array 11 is consistent with the air outlet direction of the heat dissipation module.

[0057] The cooling fin array 11, mounted on the outer wall of the metal frame 100, extends in the same direction as the airflow from the heat dissipation module, optimizing the airflow path and significantly improving heat dissipation efficiency. The cooling fin array 11 acts as a passive heat dissipation component, absorbing system heat through heat exchange between the fins and the air. Aligning the fins with the airflow direction reduces airflow resistance, prevents turbulence or backflow, and ensures smooth cooling airflow across the fin surface, maximizing heat dissipation area. Under high vehicle operating conditions, the controller internal heat load is high. This alignment promotes continuous heat removal through natural convection or fan-driven forced airflow, preventing the formation of localized hotspots. The integrated structure of the fin array and metal frame 100 not only simplifies manufacturing but also enhances heat transfer. The entire frame acts as a thermal conductor, rapidly transferring heat from internal heat sources to the fin area for dissipation. This aligned design reduces heat dissipation blind spots, improves thermal uniformity, lowers component operating temperatures, and prevents performance degradation or malfunction caused by overheating. In space-constrained in-vehicle environments, it optimizes airflow, allowing the heat dissipation module to operate efficiently without adding additional components, reducing costs and improving reliability. This is particularly true for high-power domain controllers, ensuring that the cooling system works in conjunction with the electromagnetic shielding to extend the life of the electronic components while maintaining low noise levels.

[0058] In this embodiment, a plurality of independently shielded antenna accommodating grooves are provided at the end of the metal frame 100, namely antenna accommodating groove 61, antenna accommodating groove 62 and antenna accommodating groove 63, which respectively accommodate antenna 171, antenna 172 and antenna 173, and each accommodating groove is separated by a metal partition wall.

[0059] This structure features multiple independently shielded antenna slots at the ends of the metal frame 100, each separated by metal partitions to provide antenna isolation and protection. Multiple slots reserve space for different antenna components, and the metal partitions physically separate each slot into independent units, preventing crosstalk or coupling between antenna signals. In an in-vehicle domain controller, antennas such as GPS, Wi-Fi, or cellular modules operate in different frequency bands, which can easily cause intermodulation interference when close together. The metal walls of the independent shielding slots create a Faraday cage effect, blocking RF leakage paths and ensuring signal purity. This design prevents cross-interference within the antenna array and improves the compatibility of multi-band systems, such as preventing high-frequency signals from contaminating low-frequency receivers. The metal partitions are integrated into the frame, enhancing mechanical stability, reducing vibration, and ensuring the antenna's fixed position. Electromagnetically, each slot forms a self-contained shield, preventing external interference from intruding into the internal circuitry and preventing antenna radiation from interfering with sensitive controller areas. This optimizes wireless communication quality and reduces packet loss and bit errors. This is particularly true in high-density in-vehicle electronics, enabling it to support diverse antenna requirements without sacrificing isolation performance, thereby improving overall system reliability.

[0060] In this embodiment, the top cover assembly 300 includes a metal shielding cover 310 , and the sidewall of the metal shielding cover 310 forms an annular overlapping structure with the first shielding protrusion 26 .

[0061] The top cover assembly 300 uses a metal shielding cover 310, whose side walls form an annular overlap structure with the first shielding boss 26 of the first mounting cavity to create a continuous electromagnetic shielding seal. The annular overlap design perfectly connects the top cover and the bottom boss, eliminating electromagnetic leakage caused by gaps, forming a 360-degree all-round shielding environment, and preventing radio frequency interference from invading the high-speed signal board 400 area through the top or side. In vehicle applications, road vibration or temperature changes can easily destroy component joints, but the annular overlap provides mechanical redundancy, maintains stable contact, and ensures long-term shielding effectiveness. The metal shielding cover 310 incorporates the top cover area into the shielding system and works in conjunction with the continuous partition to cover the entire cavity and prevent signals from radiating from the top. This is especially critical for high-speed signal protection. It can suppress interference from external electromagnetic sources such as radar or mobile devices and ensure distortion-free data transmission. The overlap structure simplifies assembly, reduces the need for seals, improves reliability, and ensures stable operation of the vehicle control unit in harsh environments.

[0062] In this embodiment, the top cover assembly 300 is provided with a guide structure, which includes an inclined guide surface. The guide surface forms an acute angle with the gap between the heat dissipation fin array 11 .

[0063] The top cover assembly 300 is provided with a guide structure, whose inclined guide surface forms an acute angle with the gap between the heat dissipation fin array 11, effectively guiding the cooling airflow into the heat dissipation channel. The inclined guide surface is designed according to the direction of the airflow. The acute angle reduces the inlet resistance, accelerates the air flow into the fin gap, avoids vortexes or stagnant areas, and maximizes the use of the fin heat dissipation surface area. In the vehicle cooling system, there are often irregular flow fields in the fan or driving wind. The guide surface ensures a smooth transition of the airflow through angle optimization to improve the heat exchange efficiency. This prevents local overheating, balances the system temperature distribution, and avoids damage to electronic components due to uneven heat dissipation. The acute angle design enhances wind pressure concentration, promotes forced convection, and optimizes cooling performance in a limited space. The guide structure has no additional power consumption, reduces costs, and matches the heat dissipation module to ensure that the controller maintains low temperature operation under high load and improves durability.

[0064] In this embodiment, the bottom cover 700 is fastened to the main control board 600 and the supporting portion of the second installation cavity by fasteners, and the main control board 600 is clamped between the bottom cover 700 and the second shielding boss 51 .

[0065] The bottom cover 700 simultaneously locks the main control board 600 and the support portion of the second mounting cavity with fasteners, and clamps the main control board 600 between the bottom cover 700 and the second shielding boss 51, providing multiple fixation and heat conduction. This clamping design ensures that the main control board 600 is mechanically firmly positioned. The bottom cover 700, the support portion, and the boss are formed into a rigid whole by fasteners to prevent loosening or displacement caused by vehicle vibration. The clamping between the metal bosses establishes a direct thermal path, and heat is conducted from the main control board 600 through the bosses to the frame or heat dissipation system, reducing interfacial thermal resistance. In terms of electromagnetics, the clamping structure seals the main control board 600 area, assisting the shielding function and eliminating noise caused by loose contact. The fastener locking enhances disassembly and facilitates maintenance, while providing uniform pressure distribution and avoiding thermal strain. This is critical for protecting the high-power main control board 600 and can improve overall system reliability and heat dissipation efficiency.

[0066] In this embodiment, the plugging direction of the interconnection device is perpendicular to the surface of the continuous metal partition 50 .

[0067] The interconnect's insertion direction is perpendicular to the surface of the continuous metal partition 50, ensuring connection reliability and maintaining shielding effectiveness. Vertical insertion reduces insertion and removal forces, prevents misalignment that could cause poor contact or wear, and ensures stable signal transmission. Furthermore, the perpendicular orientation of the board plane ensures that the interconnection point is orthogonal to the shielding surface, maximizing the use of the conductive path shield layer and preventing signal leakage. In vibrating environments, the vertical orientation reduces the risk of force displacement and improves system durability. This optimizes the interconnection process, simplifies installation, and ensures uninterrupted electrical continuity.

[0068] Example 2: Application to intelligent driving domain controller: This embodiment utilizes a dual-chamber structure for an L3 intelligent driving domain controller. The metal frame 100 is formed from a die-cast aluminum alloy. The first chamber houses a high-speed signal board 400, which processes raw data from millimeter-wave radar, lidar, and cameras (transmission rate ≥ 8Gbps). The second chamber houses a main control board 600, equipped with an AI computing chip (peak power consumption 65W). The two chambers are physically separated by a 3mm-thick continuous metal partition 50.

[0069] The bottom of the high-speed signal board 400 forms a fully enclosed shield with the first shielding boss 26, blocking high-frequency interference from the chassis motor. The main control board 600 is doubly secured via a clamping structure between the second shielding boss 51 and the thermally conductive substrate 40. The thermal interface material layer 500 is filled with silicone grease to control the chip junction temperature below 85°C. The 5G antenna module is independently housed in a housing 61 separated by a metal partition wall, maintaining a 15mm shielding distance from the radar signal processing circuit. The cooling fan 200 forces air along the extension direction of the heat sink fin array 110, and in conjunction with the 45° acute-angled guide surface of the top cover assembly 300, reduces wind resistance by 40%.

[0070] Effect: Under rapid vehicle acceleration conditions, the electromagnetic noise of the main control board 600 has a negligible impact on the radar signal-to-noise ratio, meeting the ISO11452 electromagnetic immunity requirements.

[0071] Example 3: Application to hybrid domain controller: This embodiment targets plug-in hybrid electric vehicles. The main control board 600 integrates a high-voltage battery management unit (switching frequency 100kHz). The continuous metal partition 50 of the metal frame 100 defines three through-hole electrical channels, with the inner walls plated with a 1μm silver layer. Vertically connected inter-board connectors transmit 12V / 48V dual-rail power signals.

[0072] The high-speed signal board 400 in the first mounting cavity houses the CANFD bus transceiver. Its first shielding protrusion 26 on the bottom forms a 360-degree overlap with the metal shield 310 on the top cover, blocking the 200V / μs transient interference generated by the inverter. The thermally conductive baseplate 40 in the second mounting cavity is directly connected to the oil cooling system, dissipating heat from the IGBT module via the second shielding protrusion 51. Three antenna accommodating slots independently accommodate V2X / Bluetooth / navigation antennas, with metal partitions ≥1 / 4 the maximum operating wavelength (6 GHz). The bottom cover 700 secures the main control board 600 to the frame support using hexagonal bolts, achieving vibration resistance that meets SAE J2380 standards.

[0073] Effect: The conducted interference below 400MHz caused by the high-voltage power switch is confined to the second cavity, and the high-speed bus bit error rate is reduced to 10e-12.

[0074] Example 4: Application to a commercial vehicle cockpit domain controller: This embodiment is suitable for heavy-duty truck cabin systems. The metal frame 100 utilizes a thickened magnesium alloy structure, and the heat sink fin array 11 is increased in depth to 25mm to compensate for heat dissipation during low-speed driving. The high-speed signal board 400 in the first mounting cavity integrates multiple 4K video input interfaces. Its shielding structure, extending 3mm to the board edge via the first shielding boss 26, suppresses 20MHz IF interference from high-power vehicle radios.

[0075] The main control board 600 is equipped with an automotive-grade SoC chip. The second shielding boss 51 features a micro-bump array, which, combined with the thermal interface material layer 500, achieves a contact thermal resistance of 0.15°C cm² / W. The antenna housing is fitted with shock-absorbing rubber pads, and the metal partition is covered with nickel-copper alloy shielding cloth. The through-type electrical channel utilizes right-angle connectors for vertical insertion, preventing connector disengagement due to vehicle turbulence. The top cover assembly 300 features an airflow guide structure at a 30° angle to the heat sink fins, accommodating the cross-ventilation requirements of the engine compartment.

[0076] Effect: Under continuous 20G vibration shock, the amplitude fluctuation of the interconnection signal between boards is less than 5%, meeting the ISO16750 mechanical reliability requirements.

[0077] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A vehicle-mounted domain controller structure, characterized in that: Including metal frame, top cover assembly and bottom cover, The metal frame is integrally formed with a first mounting cavity and a second mounting cavity, and the two mounting cavities are physically separated by a continuous metal partition; The first mounting cavity is fixedly mounted with a first printed circuit board, and the second mounting cavity is fixedly mounted with a second printed circuit board; The plate surface of the continuous metal partition is parallel to the mounting plane of the first printed circuit board and the mounting plane of the second printed circuit board respectively.

2. The vehicle-mounted domain controller structure according to claim 1, characterized in that: A first shielding boss extending toward the bottom of the first printed circuit board is provided at the bottom of the first installation cavity. The first shielding boss is electrically connected to the continuous metal partition to form an equipotential shielding body.

3. The vehicle-mounted domain controller structure according to claim 1, characterized in that: It also includes a heat-conducting substrate, which is arranged in the second installation cavity. The continuous metal partition extends a second shielding boss toward the top of the second printed circuit board, and a heat-conducting interface material layer is provided between the second shielding boss and the heat-conducting substrate.

4. The vehicle-mounted domain controller structure according to claim 1, characterized in that: The continuous metal partition is provided with a through-type electrical channel, in which an interconnection device for connecting two circuit boards is arranged, and the inner wall of the channel is plated with a conductive layer.

5. The vehicle-mounted domain controller structure according to claim 1, characterized in that: The outer wall of the metal frame is provided with a heat dissipation fin array, and the extension direction of the heat dissipation fin array is consistent with the air outlet direction of the heat dissipation module.

6. The vehicle-mounted domain controller structure according to claim 1, characterized in that: The end of the metal frame is provided with a plurality of independently shielded antenna accommodating grooves, and each accommodating groove is separated by a metal partition wall.

7. The vehicle-mounted domain controller structure according to claim 1, characterized in that: The top cover assembly includes a metal shielding cover, and the side wall of the metal shielding cover and the first shielding boss form an annular overlapping structure.

8. The vehicle-mounted domain controller structure according to claim 1, characterized in that: The top cover assembly is provided with a guide structure, which includes an inclined guide surface, and the guide surface forms an acute angle with the gap between the heat dissipation fin array.

9. The vehicle-mounted domain controller structure according to claim 1, characterized in that: The bottom cover is locked with the second printed circuit board and the supporting portion of the second installation cavity at the same time, and the second printed circuit board is clamped between the bottom cover and the second shielding protrusion.

10. The vehicle-mounted domain controller structure according to claim 4, characterized in that: The plugging direction of the interconnection device is perpendicular to the surface of the continuous metal partition.

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