Cryogenic pumps for fusion devices and fusion devices

Abstract

This invention discloses a cryogenic pump for a fusion device and a fusion device. The cryogenic pump, relating to the field of fusion devices, includes: a cryogenic pump body defining an adsorption space, and a first medium inlet communicating with the adsorption space; a valve assembly disposed on the cryogenic pump body for opening or closing the first medium inlet; and at least one adsorption component, at least a portion of which is disposed within the adsorption space for adsorbing gas within the adsorption space, and which is detachably disposed on the cryogenic pump body. Therefore, by detachably disposing of the adsorption component on the cryogenic pump body, the adsorption component can be replaced individually, which helps reduce the maintenance cost of the cryogenic pump, thereby reducing the production cost of fusion energy and improving economic efficiency. Furthermore, when replacing a single adsorption component, the entire adsorption process can be continuously replaced.

Description

Technical Field

[0001] This invention relates to the field of fusion devices, and more particularly to a cryogenic pump for a fusion device and a fusion device having the cryogenic pump. Background Technology

[0002] Among related technologies, fusion devices are among the most complex scientific and engineering systems ever built by humankind, comprising dozens of subsystems such as vacuum systems and cryogenic systems. The vacuum system of a fusion device provides an insulating environment for cryogenic superconductivity in the fusion reactor, a clean environment for high-temperature plasma fusion reactions, and ensures efficient fuel recycling, thus forming the foundation for the continuous operation of the fusion reaction.

[0003] The vacuum system includes a cryogenic pump, a type of cryogenic condensation adsorption pump. Cryogenic pumps are used in fusion devices primarily to remove impurity gases during plasma operation. The cryogenic pump includes an adsorption assembly, which is a consumable component. After prolonged use, the adsorption performance of the adsorption assembly deteriorates, and there is a risk of adsorption failure. The adsorption assembly cannot be replaced individually; the entire cryogenic pump must be replaced, increasing the production cost of fusion energy and reducing its economic viability. Furthermore, replacing the cryogenic pump requires shutting down the reactor. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a cryogenic pump that allows for the individual replacement of the adsorption component, thereby reducing the maintenance cost of the cryogenic pump, and allowing for the replacement of the adsorption component without stopping the stack.

[0005] The present invention further proposes a fusion device.

[0006] A cryogenic pump for a fusion device according to an embodiment of the present invention includes:

[0007] The cryogenic pump body defines an adsorption space and has a first medium inlet that communicates with the adsorption space.

[0008] Valve assembly, located on the body of the cryogenic pump, is used to open or close the first medium inlet;

[0009] At least one adsorption component, at least a portion of which is disposed within an adsorption space, the adsorption component being used to adsorb gas within the adsorption space, and the adsorption component being detachably disposed within the cryogenic pump body.

[0010] According to an embodiment of the present invention, the cryogenic pump for a fusion device is detachably mounted on the cryogenic pump body via an adsorption component, which allows for individual replacement of the adsorption component. This reduces the maintenance cost of the cryogenic pump, thereby reducing the production cost of fusion energy and improving economic efficiency. Furthermore, when replacing a particular adsorption component, the adsorption component can be replaced without stopping the stack.

[0011] In some examples of the present invention, the cryogenic pump body includes: a housing defining an adsorption space, the housing having a first medium inlet, and the housing also having a mounting hole communicating with the adsorption space, through which the adsorption assembly is inserted into or removed from the adsorption space.

[0012] In some examples of the present invention, the adsorption components and mounting holes are provided in a one-to-one correspondence.

[0013] In some examples of the present invention, the outer shell has a first end wall and a second end wall, the first end wall and the second end wall are opposite to and spaced apart, the adsorption space is located between the first end wall and the second end wall, the first end wall is formed with a first medium inlet, and the second end wall is formed with a mounting hole.

[0014] In some examples of the present invention, there are multiple adsorption components, which are arranged sequentially along the circumference of the second end wall.

[0015] In some examples of the present invention, the adsorption assembly includes: an adsorption structure, a cooling medium circuit pipe and a cooling medium inflow pipe. The adsorption structure is disposed in the adsorption space and forms a cooling medium flow channel. The cooling medium flow channel passes through the adsorption structure along the axial direction of the cooling medium circuit pipe. The adsorption structure is fixed to the cooling medium circuit pipe. The cooling medium flow channel connects the cooling medium circuit pipe and the cooling medium inflow pipe.

[0016] In some examples of the present invention, the adsorption structure includes multiple adsorption plates arranged around the cooling medium circuit pipe along the circumference of the cooling medium circuit pipe, and each adsorption plate forms a cooling medium flow channel.

[0017] In some examples of the present invention, the adsorption assembly further includes: a connecting pipe, the adsorption structure and the cooling medium inflow pipe are arranged axially along the cooling medium circuit pipe, the adsorption structure is located between the connecting pipe and the cooling medium inflow pipe, the connecting pipe connects the cooling medium circuit pipe and the cooling medium flow channel, and the cooling medium flow channel connects the connecting pipe and the cooling medium inflow pipe.

[0018] In some examples of the present invention, the adsorption plate has an arc-shaped structure.

[0019] In some examples of the present invention, the adsorption assembly further includes: a mounting part, the mounting part and the adsorption structure are arranged along the axial direction of the cooling medium circuit pipe, the cooling medium circuit pipe and the cooling medium inflow pipe are both fixed to the mounting part, and the mounting part is detachably disposed on the cryogenic pump body.

[0020] In some examples of the present invention, the cooling medium inflow pipe includes: a first pipe body and a second pipe body connected together, the first pipe body passing through the mounting portion along the axial direction of the cooling medium circuit pipe, the second pipe body being located on the side of the mounting portion away from the adsorption structure, the first pipe body connecting the second pipe body and the cooling medium flow channel, and the second pipe body forming a second medium inlet.

[0021] In some examples of the present invention, there are multiple cooling medium channels, which are arranged around the cooling medium circuit pipe along the circumference of the cooling medium circuit pipe. There are multiple first pipe bodies, which are arranged around the cooling medium circuit pipe along the circumference of the cooling medium circuit pipe. The multiple first pipe bodies and the multiple cooling medium channels are connected in a one-to-one correspondence.

[0022] In some examples of the present invention, the cryogenic pump body includes: a cold screen, which is a ring structure, disposed in the adsorption space, and sleeved on the adsorption component and spaced apart from the adsorption component.

[0023] In some examples of the present invention, the cryogenic pump body further includes: a radiation baffle, which is disposed in the adsorption space, and a cold shield is fitted over the radiation baffle.

[0024] In some examples of the present invention, the adsorption component is located between the radiation baffle and the cold screen.

[0025] In some examples of the present invention, the cryogenic pump body further includes: a heat exchange pipeline, at least a portion of which is disposed within the adsorption space, the heat exchange pipeline being in contact with both the cold screen and the radiant baffle, and the heat exchange pipeline being in heat exchange cooperation with both the cold screen and the radiant baffle.

[0026] The fusion device according to an embodiment of the present invention includes the cryogenic pump for the fusion device described above.

[0027] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0029] Figure 1 This is a schematic diagram of a cryogenic pump according to an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of a cryogenic pump according to an embodiment of the present invention from another angle;

[0031] Figure 3 This is a cross-sectional view of a cryogenic pump according to an embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of an adsorption component according to an embodiment of the present invention;

[0033] Figure 5 yes Figure 4 Enlarged view of point A in the middle;

[0034] Figure 6 This is a schematic diagram of the adsorption assembly according to an embodiment of the present invention from another angle;

[0035] Figure 7 This is a schematic diagram of the cryogenic pump body according to an embodiment of the present invention;

[0036] Figure 8 This is a schematic diagram of the cryogenic pump body from another angle according to an embodiment of the present invention;

[0037] Figure 9 This is a cross-sectional view of the cryogenic pump body according to an embodiment of the present invention;

[0038] Figure 10 This is a cross-sectional view of a cryogenic pump according to an embodiment of the present invention.

[0039] Figure label:

[0040] Cryogenic pump 100;

[0041] 10. Cryogenic pump body; 11. Adsorption space; 12. First medium inlet;

[0042] 13 housing; 131 mounting hole; 132 first end wall; 133 second end wall; 134 connecting wall;

[0043] Cooling screen 14; Radiation baffle 15;

[0044] Heat exchange pipe 16; First pipe 161; Second pipe 162; Pipe inlet 164; Pipe outlet 165; First heat exchange pipe 166; Second heat exchange pipe 167; Third heat exchange pipe 168;

[0045] Valve assembly 20; Valve 21; Drive structure 22;

[0046] Adsorption component 30;

[0047] Adsorption structure 31; Adsorption plate 311;

[0048] Cooling medium circuit pipe 32;

[0049] Cooling medium inlet pipe 33; first pipe body 331; second pipe body 332; second medium inlet 333;

[0050] Connecting pipe 34; mounting part 35. Detailed Implementation

[0051] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0052] The following is for reference. Figures 1-9 The present invention describes a cryogenic pump 100 for a fusion device. The cryogenic pump 100 is a cryogenic condensation and adsorption pump. The cryogenic pump 100 is mainly used in fusion devices to remove some impurity gases during plasma operation. The main working principle of the cryogenic pump 100 is to achieve a high-speed exhaust effect on the working gas by relying on the characteristics of cryogenic condensation and adsorption (activated carbon).

[0053] like Figures 1-4 As shown, a cryogenic pump 100 for a fusion device according to an embodiment of the present invention includes: a cryogenic pump body 10 defining an adsorption space 11, the cryogenic pump body 10 having a first medium inlet 12 communicating with the adsorption space 11; a valve assembly 20 disposed on the cryogenic pump body 10 and used to open or close the first medium inlet 12; and at least one adsorption component 30, at least a portion of which is disposed within the adsorption space 11, the adsorption component 30 being used to adsorb gas within the adsorption space 11, and the adsorption component 30 being detachably disposed on the cryogenic pump body 10.

[0054] The cryogenic pump 100 includes a cryogenic pump body 10, a valve assembly 20, and at least one adsorption assembly 30. This application uses multiple adsorption assemblies 30 as an example for illustration. The cryogenic pump body 10 defines an adsorption space 11. The cryogenic pump body 10 has a first medium inlet 12, which communicates with the adsorption space 11. Working gas flows into the adsorption space 11 through the first medium inlet 12. The cryogenic pump body 10 may also have an outlet, which communicates with the adsorption space 11. Gas in the adsorption space 11 can flow out through the outlet. The outlet can be selectively opened or closed. When it is necessary to discharge gas from the adsorption space 11, the outlet is opened, thereby discharging the gas from the adsorption space 11. When it is not necessary to discharge gas from the adsorption space 11, the outlet is closed. It should be noted that the opening or closing method of the outlet can be reasonably selected and set according to actual conditions, and is not specifically limited here, as long as it can achieve the opening or closing of the outlet.

[0055] A valve assembly 20 is disposed on the cryogenic pump body 10. The valve assembly 20 is used to open or close the first medium inlet 12. The valve assembly 20 may include a valve 21 and a drive structure 22. The valve 21 and the drive structure 22 are connected, and the valve 21 and the first medium inlet 12 are correspondingly arranged. The drive structure 22 is used to drive the valve 21 to move relative to the cryogenic pump body 10, thereby opening or closing the first medium inlet 12. As an example, the drive structure 22 is a drive cylinder with a telescopic shaft. The telescopic shaft is fixedly connected to the valve 21. The valve 21 is driven to open or close the first medium inlet 12 by extending or retracting the telescopic shaft along the axial direction of the first medium inlet 12. As another example, the drive structure 22 includes a drive screw, a drive nut, and a drive motor. The drive nut is sleeved on the drive screw and fixedly connected to the motor shaft of the drive motor. The drive screw and the valve 21 are fixedly connected. The operation of the drive motor drives the drive nut to rotate. The rotation of the drive nut drives the drive screw to move along the axial direction of the first medium inlet 12. During the movement of the drive screw, the valve 21 is driven to open or close the first medium inlet 12. As another example, valve 21 is rotatably mounted on the cryogenic pump body 10. The drive structure 22 is a drive cylinder with a telescopic shaft. The telescopic shaft and valve 21 are fixedly connected. The telescopic shaft extends and retracts along the axial direction of the first medium inlet 12 to drive valve 21 to rotate, thereby opening or closing the first medium inlet 12. It should be noted that the drive structure 22 can be communicatively connected to a controller, which controls the drive structure 22 to open or close valve 21. During the regeneration phase of the cryogenic pump 100, the controller controls the drive structure 22 to close valve 21. During the pumping phase of the cryogenic pump 100, the controller controls the drive structure 22 to adjust the opening degree of valve 21 to achieve pumping speed regulation.

[0056] The adsorption component 30 is used to adsorb the gas in the adsorption space 11. For example, the adsorption component 30 is used to adsorb helium generated by the reaction and unreacted fuel gas at low temperature. At least a portion of the structure of the adsorption component 30 is disposed in the adsorption space 11. That is, a part of the structure of the adsorption component 30 is disposed in the adsorption space 11, or the entire structure of the adsorption component 30 is disposed in the adsorption space 11. This application uses the example of a portion of the structure of the adsorption component 30 being disposed in the adsorption space 11 for illustration. The adsorption component 30 disposed in the adsorption space 11 can adsorb the fuel gas generated by the reaction.

[0057] The adsorption component 30 is detachably mounted on the cryogenic pump body 10. The adsorption component 30 can be detachably mounted on the cryogenic pump body 10 via bolts or snap-fit ​​connections. Because the adsorption component 30 is detachably mounted on the cryogenic pump body 10, when it needs to be replaced, only the adsorption component 30 can be replaced, without replacing the entire cryogenic pump 100. This helps reduce the maintenance cost of the cryogenic pump 100, thereby reducing the production cost of fusion energy and improving economic efficiency. Furthermore, when a specific adsorption component 30 needs to be replaced, the valve assembly 20 closes the first medium inlet 12, allowing for replacement of the adsorption component 30 without stopping the reactor, achieving the effect of replacing the adsorption component 30 without stopping the reactor, which helps improve the operating efficiency of the fusion device.

[0058] Therefore, since the adsorption component 30 is detachably installed on the cryogenic pump body 10, the adsorption component 30 can be replaced individually, which helps to reduce the maintenance cost of the cryogenic pump 100, thereby helping to reduce the production cost of fusion energy and thus improving economic efficiency. Furthermore, when a certain adsorption component 30 is replaced, the valve assembly 20 closes the first medium inlet 12, achieving the effect of replacing the adsorption component 30 without stopping the stack.

[0059] In some embodiments of the present invention, such as Figure 1 and Figure 7 As shown, the cryogenic pump body 10 includes: a housing 13, which defines an adsorption space 11, a first medium inlet 12 formed in the housing 13, and a mounting hole 131 communicating with the adsorption space 11. The adsorption assembly 30 is inserted into or removed from the adsorption space 11 through the mounting hole 131.

[0060] The cryogenic pump body 10 includes a housing 13, which can be made of metal, for example, stainless steel. The housing 13 serves as the outermost structural support of the cryogenic pump 100. The housing 13 defines an adsorption space 11, meaning the adsorption space 11 is defined by the housing 13. The housing 13 has a first medium inlet 12 and a mounting hole 131 communicating with the adsorption space 11. When the adsorption assembly 30 needs to be installed on the cryogenic pump body 10, the adsorption assembly 30 is inserted into the adsorption space 11 through the mounting hole 131. After the adsorption assembly 30 is inserted into place, it is fixed to the housing 13. When the adsorption assembly 30 needs to be removed from the cryogenic pump body 10, it is removed from the housing 13, and the adsorption assembly 30 is pulled out of the adsorption space 11 through the mounting hole 131, allowing for replacement of the adsorption assembly 30. Therefore, by providing mounting holes 131 on the outer casing 13, it is convenient to insert the adsorption component 30 into the adsorption space 11, thereby achieving the effect of placing at least a portion of the adsorption component 30 in the adsorption space 11, which facilitates the assembly and disassembly of the adsorption component 30 and the cryogenic pump body 10.

[0061] In some embodiments of the present invention, such as Figure 1 and Figure 7 As shown, the adsorption component 30 and the mounting hole 131 are set in a one-to-one correspondence.

[0062] One mounting hole 131 is used to assemble one adsorption component 30. The adsorption components 30 and the mounting holes 131 are set in a one-to-one correspondence. With multiple adsorption components 30 assembled in one mounting hole 131, it is easier to insert the adsorption component 30 into the adsorption space 11 and to pull the adsorption component 30 out of the adsorption space 11. It is also easier to disassemble and assemble the adsorption component 30 and the cryogenic pump body 10, thereby facilitating the replacement of the adsorption component 30.

[0063] In some embodiments of the present invention, such as Figure 1 , Figures 7-9 As shown, the outer shell 13 has a first end wall 132 and a second end wall 133. The first end wall 132 and the second end wall 133 are opposite to each other and spaced apart. The adsorption space 11 is located between the first end wall 132 and the second end wall 133. The first end wall 132 has a first medium inlet 12, and the second end wall 133 has a mounting hole 131.

[0064] The outer shell 13 has a first end wall 132 and a second end wall 133, which are arranged opposite to each other and spaced apart. The first end wall 132 and the second end wall 133 can be plate-shaped structures or parallel to each other. The outer shell 13 may also have a connecting wall 134, which can be annular and connected between the first end wall 132 and the second end wall 133. Thus, the connecting wall 134, the first end wall 132, and the second end wall 133 together define an adsorption space 11, which is located between the first end wall 132 and the second end wall 133. The first end wall 132 forms a first medium inlet 12, and the second end wall 133 forms a mounting hole 131, which allows the adsorption component 30 to be disassembled and assembled on the side of the cryogenic pump body 10 away from the first medium inlet 12. When disassembling and assembling the adsorption component 30, the gas will not be affected from entering the adsorption space 11 from the first medium inlet 12, which is beneficial to achieving the effect of replacing the adsorption component 30 without stopping the fusion reactor.

[0065] In some embodiments of the present invention, such as Figure 1 and Figure 7 As shown, there are multiple adsorption components 30, which are arranged sequentially along the circumference of the second end wall 133.

[0066] The adsorption components 30 can be configured in quantities of two, three, four, five, eight, twelve, etc., and the number of adsorption components 30 can be reasonably selected according to actual usage. Multiple adsorption components 30 are arranged sequentially and spaced apart along the circumference of the second end wall 133. These multiple adsorption components 30 can be located on the same circumference. For example, each adsorption component 30 has a central axis extending axially along the mounting hole 131, and multiple central axes of the multiple adsorption components 30 are located on the same circumference. The multiple adsorption components 30 can be arranged sequentially and evenly along the circumference of the second end wall 133. By arranging multiple adsorption components 30 sequentially along the circumference of the second end wall 133, the pumping speed of the cryogenic pump 100 can be increased without interfering with other components within the cryogenic pump 100.

[0067] In some embodiments of the present invention, such as Figure 1 , Figures 3-6 As shown, the adsorption assembly 30 includes: an adsorption structure 31, a cooling medium circuit pipe 32, and a cooling medium inflow pipe 33. The adsorption structure 31 is disposed in the adsorption space 11 and forms a cooling medium flow channel. The cooling medium flow channel passes through the adsorption structure 31 along the axial direction of the cooling medium circuit pipe 32. The adsorption structure 31 is fixed to the cooling medium circuit pipe 32. The cooling medium flow channel connects the cooling medium circuit pipe 32 and the cooling medium inflow pipe 33.

[0068] The adsorption assembly 30 may include an adsorption structure 31, a cooling medium circuit pipe 32, and a cooling medium inflow pipe 33. The adsorption structure 31 is used to adsorb helium generated in the reaction and unreacted fuel gas at low temperatures. The adsorption structure 31 is disposed within the adsorption space 11 and can be made of a metallic material, such as stainless steel or iron. Activated carbon may be present on the adsorption structure 31. The adsorption structure 31 has at least one cooling medium flow channel. This application describes an example where the adsorption structure 31 has multiple cooling medium flow channels. The cooling medium flow channels penetrate the adsorption structure 31 along the axial direction of the cooling medium circuit pipe 32. Figure 4 As shown, the axial direction of the cooling medium circuit pipe 32 refers to... Figure 4 The X direction in the diagram. The cooling medium flow channel is for the coolant to flow through, and the coolant can be a liquid coolant or a gaseous coolant. For example, the coolant can be liquid helium, specifically 4K liquid helium.

[0069] The cooling medium circuit pipe 32 can be made of metal, such as stainless steel or iron. The adsorption structure 31 is fixed to the cooling medium circuit pipe 32. The adsorption structure 31 can be welded to the cooling medium circuit pipe 32, fixed to the cooling medium circuit pipe 32 with bolts, or clamped to the cooling medium circuit pipe 32. By fixing the adsorption structure 31 to the cooling medium circuit pipe 32, the cooling medium circuit pipe 32 can support the adsorption structure 31, reducing the risk of swaying and improving the positional stability of the adsorption structure 31.

[0070] The cooling medium flow channel connects the cooling medium circuit pipe 32 and the cooling medium inlet pipe 33. For example, one end of the cooling medium flow channel is connected to the cooling medium circuit pipe 32, and the other end is connected to the cooling medium inlet pipe 33. The coolant flows into the cooling medium inlet pipe 33 through the cooling medium flow channel, then into the cooling medium flow channel, and finally into the cooling medium circuit pipe 32. The coolant in the cooling medium circuit pipe 32 flows out of the adsorption assembly 30. When the coolant flows through the cooling medium flow channel, it can exchange heat with the adsorption structure 31, cooling the adsorption structure 31 and lowering its temperature to a suitable level, thereby helping to maintain the adsorption effect of the adsorption structure 31 on the gas.

[0071] In some embodiments of the present invention, such as Figures 4-6As shown, the adsorption structure 31 includes multiple adsorption plates 311, which are arranged around the cooling medium circuit pipe 32 along the circumference of the cooling medium circuit pipe 32. Each adsorption plate 311 forms a cooling medium flow channel.

[0072] The adsorption structure 31 may include multiple adsorption plates 311. The number of adsorption plates 311 can be two, three, four, etc., and the number of adsorption plates 311 can be reasonably selected according to the actual situation. Multiple adsorption plates 311 are fixedly installed on the cooling medium circuit pipe 32. The multiple adsorption plates 311 are arranged around the cooling medium circuit pipe 32 circumferentially. For example, the multiple adsorption plates 311 are evenly arranged around the cooling medium circuit pipe 32 circumferentially. This arrangement facilitates the fixing of multiple adsorption plates 311 to the cooling medium circuit pipe 32, thereby facilitating the manufacturing of the adsorption assembly 30 and improving the production efficiency of the adsorption assembly 30. Each adsorption plate 311 has at least one cooling medium flow channel, and the cooling medium flow channel of each adsorption plate 311 connects the cooling medium circuit pipe 32 and the cooling medium inlet pipe 33. This arrangement allows coolant to flow through each adsorption plate 311, which helps reduce the loss of cooling capacity and also ensures uniform cooling of the adsorption structure 31.

[0073] In some embodiments of the present invention, such as Figures 4-6 As shown, the adsorption assembly 30 further includes a connecting pipe 34. The connecting pipe 34, the adsorption structure 31, and the cooling medium inflow pipe 33 are arranged along the axial direction of the cooling medium circuit pipe 32. The adsorption structure 31 is located between the connecting pipe 34 and the cooling medium inflow pipe 33. The connecting pipe 34 connects the cooling medium circuit pipe 32 and the cooling medium flow channel. The cooling medium flow channel connects the connecting pipe 34 and the cooling medium inflow pipe 33.

[0074] The adsorption assembly 30 further includes a connecting pipe 34 along the axial direction of the cooling medium circuit pipe 32. At least a portion of the adsorption structure 31 is located between the connecting pipe 34 and the cooling medium inflow pipe 33. One end of the connecting pipe 34 is connected to the cooling medium circuit pipe 32, and the other end is connected to the cooling medium flow channel. This allows the connecting pipe 34 to connect the cooling medium circuit pipe 32 and the cooling medium flow channel, achieving indirect connection between the cooling medium flow channel and the cooling medium circuit pipe 32 via the connecting pipe 34. The cooling medium flow channel connects the connecting pipe 34 and the cooling medium inflow pipe 33, allowing coolant flowing into the cooling medium inflow pipe 33 to flow into the connecting pipe 34.

[0075] In some embodiments of the present invention, such as Figures 4-6 As shown, the adsorption plate 311 has an arc-shaped structure.

[0076] For example, the adsorption plate 311 can protrude towards the cooling medium circuit pipe 32. The adsorption plate 311 can be an arc-shaped structure. By setting the adsorption plate 311 to an arc shape, it is beneficial to increase the outer surface area of ​​the adsorption plate 311. More activated carbon can be placed on the outer surface of the adsorption plate 311, increasing the area of ​​activated carbon placement, which can allow the adsorption structure 31 to adsorb more gas, thereby improving the pumping speed of the cryogenic pump 100. Furthermore, by arranging the arc-shaped adsorption plate 311 around the cooling medium circuit pipe 32 circumferentially, the influence of the angle of installation of the adsorption assembly 30 can be reduced, reducing the risk of interference between the adsorption assembly 30 and other components inside the cryogenic pump 100 during the assembly and disassembly of the adsorption assembly 30, and facilitating the assembly and disassembly of the adsorption assembly 30.

[0077] In some embodiments of the present invention, such as Figure 1 , Figures 4-6 As shown, the adsorption assembly 30 also includes a mounting part 35. The mounting part 35 and the adsorption structure 31 are arranged along the axial direction of the cooling medium circuit pipe 32. The cooling medium circuit pipe 32 and the cooling medium inflow pipe 33 are both fixed to the mounting part 35. The mounting part 35 is detachably provided on the cryogenic pump body 10.

[0078] The adsorption assembly 30 may further include a mounting portion 35, which may be a flange or a flat plate. The mounting portion 35 and the adsorption structure 31 are arranged axially along the cooling medium circuit pipe 32, and may be spaced apart. Both the cooling medium circuit pipe 32 and the cooling medium inflow pipe 33 may pass through the mounting portion 35 and be fixed to the mounting portion 35. The cooling medium circuit pipe 32 and the cooling medium inflow pipe 33 may be welded to the mounting portion 35, or they may be snap-fitted to the mounting portion 35. The mounting portion 35 provides support for the cooling medium circuit pipe 32 and the cooling medium inflow pipe 33. The mounting portion 35 is detachably mounted on the cryogenic pump body 10. For example, the mounting portion 35 may be bolted to the outer casing 13 of the cryogenic pump body 10, or it may be snap-fitted to the outer casing 13 of the cryogenic pump body 10. When the adsorption component 30 is inserted into the adsorption space 11 through the mounting hole 131 and is in place, the mounting part 35 can be located outside the outer shell 13. The mounting part 35 can contact the outer surface of the outer shell 13. The mounting part 35 is detachably connected to the outer shell 13, which facilitates the disassembly and assembly of the adsorption component 30 and makes it easy to replace the adsorption component 30.

[0079] In some embodiments of the present invention, such as Figure 5 and Figure 6As shown, the cooling medium inflow pipe 33 includes: a first pipe body 331 and a second pipe body 332 connected together. The first pipe body 331 passes through the mounting part 35 along the axial direction of the cooling medium circuit pipe 32. The second pipe body 332 is located on the side of the mounting part 35 away from the adsorption structure 31. The first pipe body 331 connects the second pipe body 332 and the cooling medium flow channel. The second pipe body 332 forms a second medium inlet 333.

[0080] The cooling medium inflow pipe 33 may include a first pipe body 331 and a second pipe body 332, which are connected. The first pipe body 331 and the second pipe body 332 may be integrally formed. The first pipe body 331 passes through the mounting part 35 along the axial direction of the cooling medium circuit pipe 32. Along the axial direction of the cooling medium circuit pipe 32, the second pipe body 332 is located on the side of the mounting part 35 away from the adsorption structure 31. The two ends of the first pipe body 331 are connected to the second pipe body 332 and the cooling medium flow channel, respectively, thereby achieving the effect of connecting the first pipe body 331 to the second pipe body 332 and the cooling medium flow channel. The second pipe body 332 has a second medium inlet 333, through which coolant can flow into the cooling medium inflow pipe 33, thus achieving the effect of coolant flowing into the cooling medium inflow pipe 33. It should be noted that when the adsorption component 30 is inserted into the adsorption space 11 through the mounting hole 131 and is in place, the second tube 332 is located outside the outer shell 13, which facilitates the connection between the second medium inlet 333 and the device storing coolant, thereby making the structure of the cooling medium inflow pipe 33 reasonable.

[0081] In some embodiments of the present invention, such as Figures 4-6 As shown, there are multiple cooling medium channels, which are arranged around the cooling medium circuit pipe 32 along the circumference of the cooling medium circuit pipe 32. There are multiple first pipe bodies 331, which are arranged around the cooling medium circuit pipe 32 along the circumference of the cooling medium circuit pipe 32. The multiple first pipe bodies 331 and the multiple cooling medium channels are connected in a one-to-one correspondence.

[0082] The second tube 332 can be an annular structure, with multiple first tubes 331 arranged sequentially along the circumference of the second tube 332, and all of the first tubes 331 are connected to the second tube 332. The number of cooling medium channels is the same as the number of first tubes 331. The multiple first tubes 331 and multiple cooling medium channels are arranged one-to-one along the axial direction of the cooling medium circuit pipe 32, and the first tubes 331 are connected to the corresponding cooling medium channels. This arrangement allows the coolant in the second tube 332 to be diverted into multiple flow paths into the corresponding cooling medium channels, which is beneficial for the coolant in the second tube 332 to be evenly distributed into multiple cooling medium channels, thereby improving the cooling uniformity of the adsorption structure 31.

[0083] In some embodiments of the present invention, such as Figure 3 and Figure 9 As shown, the cryogenic pump body 10 includes: a cold screen 14, which is a ring structure. The cold screen 14 is disposed in the adsorption space 11 and is sleeved on the adsorption component 30 and spaced apart from the adsorption component 30.

[0084] The cryogenic pump body 10 may further include a cold screen 14, which is an annular structure and is disposed within the adsorption space 11. The cold screen 14 defines an assembly space, and the assembly space and the mounting hole 131 are arranged opposite each other along the axial direction of the cooling medium circuit pipe 32. When the adsorption component 30 is inserted into the adsorption space 11 through the mounting hole 131, at least a portion of the structure of the adsorption component 30 can extend into the assembly space, thereby allowing the cold screen 14 to be fitted onto the adsorption component 30. The axial direction of the cold screen 14 can be parallel to the axial direction of the cooling medium circuit pipe 32. When the adsorption component 30 is inserted into the adsorption space 11, the risk of interference between the adsorption component 30 and the cold screen 14 is reduced.

[0085] The cold shield 14 can be made of metallic materials, such as oxygen-free copper or iron. The outer surface of the cold shield 14 can be plated with bright nickel, and the inner surface can be blackened. This design allows the cold shield 14 to absorb most of the radiant heat, achieving a heat shielding effect. The cold shield 14 can condense water vapor within the adsorption space 11, causing it to form liquid water, thereby separating the water vapor from the gas.

[0086] In some embodiments of the present invention, such as Figure 3 and Figure 9 As shown, the cryogenic pump body 10 also includes: a radiation baffle 15, which is disposed in the adsorption space 11, and a cold shield 14 is sleeved on the radiation baffle 15.

[0087] The cryogenic pump body 10 may further include a radiation baffle 15, which is disposed within the adsorption space 11. The radiation baffle 15 may be disposed within the assembly space so that the cold shield 14 is fitted onto the radiation baffle 15. The radiation baffle 15 may be made of a metallic material, and the cold shield 14 may be made of oxygen-free copper, iron, or other materials. The outer surface of the radiation baffle 15 may be plated with bright nickel to provide thermal shielding. Furthermore, after the gas flows into the adsorption space 11 through the first medium inlet 12, the radiation baffle 15 can pre-cool the gas in the adsorption space 11 and further condense the water vapor in the adsorption space 11, causing the water vapor to form liquid water, thereby facilitating the separation of water vapor from the gas.

[0088] In some embodiments of the present invention, such as Figure 3 and Figure 9As shown, there are multiple radiation baffles 15, which are arranged sequentially at intervals along the axial direction of the cooling medium circuit pipe 32. After the gas flows into the adsorption space 11 through the first medium inlet 12, the multiple radiation baffles 15 can simultaneously pre-cool the gas in the adsorption space 11 and further condense the water vapor in the adsorption space 11, which is more conducive to the formation of liquid water from the water vapor, and thus more conducive to the separation of water vapor from the gas.

[0089] In some embodiments of the present invention, such as Figure 3 and Figure 9 As shown, the adsorption component 30 is located between the radiation baffle 15 and the cold screen 14.

[0090] In this configuration, after the adsorption component 30 is inserted into the adsorption space 11 through the mounting hole 131, the adsorption component 30 is located between the radiation baffle 15 and the cold screen 14. Multiple adsorption components 30 are arranged around the radiation baffle 15 along the circumference of the radiation baffle 15. This arrangement makes the overall structure of the adsorption component 30, the radiation baffle 15 and the cold screen 14 compact, which is conducive to the miniaturization of the cryogenic pump 100 and thus helps to reduce the volume of the cryogenic pump 100.

[0091] In some embodiments of the present invention, such as Figures 7-9 As shown, the cryogenic pump body 10 also includes a heat exchange pipeline 16, at least a portion of which is disposed within the adsorption space 11. The heat exchange pipeline 16 is in contact with both the cold screen 14 and the radiation baffle 15, and the heat exchange pipeline 16 is in heat exchange cooperation with both the cold screen 14 and the radiation baffle 15.

[0092] The cryogenic pump body 10 may further include a heat exchange pipeline 16, with a portion of the heat exchange pipeline 16 disposed within the adsorption space 11, or the entire structure of the heat exchange pipeline 16 being disposed within the adsorption space 11. This application uses the example of a portion of the heat exchange pipeline 16 being disposed within the adsorption space 11 for illustration. The heat exchange pipeline 16 is in contact with both the cold screen 14 and the radiant baffle 15, and the heat exchange pipeline 16 engages with both the cold screen 14 and the radiant baffle 15 for heat exchange. The heat exchange pipeline 16 is used to transport a cooling medium, which can be a liquid cooling medium or a gaseous cooling medium. For example, the cooling medium can be helium, specifically 80K helium. When the cooling medium flows within the heat exchange pipeline 16, it can exchange heat with the cold screen 14 and the radiant baffle 15, cooling the cold screen 14 and the radiant baffle 15 and lowering their temperatures to a suitable level.

[0093] Furthermore, the heat exchange pipe 16 is fixedly connected to the cold screen 14 and the radiant baffle 15. The heat exchange pipe 16 can be welded to the cold screen 14 and the radiant baffle 15, or it can be fixedly connected to the cold screen 14 and the radiant baffle 15 by bolts. By fixing the heat exchange pipe 16 to the cold screen 14 and the radiant baffle 15, the heat exchange pipe 16 can reliably contact the cold screen 14 and the radiant baffle 15, which is beneficial to maintaining the heat exchange effect between the heat exchange pipe 16 and the cold screen 14 and the radiant baffle 15.

[0094] In some embodiments of the present invention, such as Figure 10 As shown, the heat exchange pipeline 16 includes a first pipeline 161, a second pipeline 162, and a heat exchange tube section. Both the first pipeline 161 and the second pipeline 162 are located outside the outer shell 13. Both the first pipeline 161 and the second pipeline 162 can be annular structures. The first pipeline 161 has a pipeline inlet 164, and the second pipeline 162 has a pipeline outlet 165. The heat exchange tube section is located inside the adsorption space 11. The heat exchange tube section is in contact with both the cold screen 14 and the radiation baffle 15. The heat exchange tube section is connected to the first pipeline 161 and the second pipeline 162. The cooling medium flows into the first pipe 161 from the pipe inlet 164, and then flows into the heat exchange tube section along the first pipe 161. When the cooling medium flows in the heat exchange tube section, it can exchange heat with the cold screen 14 and the radiant baffle 15 through the heat exchange tube section, thereby achieving a cooling effect on the cold screen 14 and the radiant baffle 15. The cooling medium in the heat exchange tube section flows into the second pipe 162 and then flows out of the heat exchange tube 16 through the pipe outlet 165.

[0095] In some embodiments of the present invention, such as Figure 10 As shown, the heat exchange tube section includes: a first heat exchange tube 166, a second heat exchange tube 167, and a third heat exchange tube 168. The first heat exchange tube 166 and the second heat exchange tube 167 are connected. The first heat exchange tube 166 connects the second heat exchange tube 167 and the first pipeline 161. The second heat exchange tube 167 connects the first heat exchange tube 166 and the second pipeline 162. Both the first heat exchange tube 166 and the second heat exchange tube 167 extend axially along the cooling medium circuit pipe 32. Both the first heat exchange tube 166 and the second heat exchange tube 167 are in heat exchange cooperation with the radiation baffle 15. The third heat exchange tube 168 is connected to the first pipeline 161. Exemplarily, the third heat exchange tube 168 is connected to the first pipeline 161 through at least one of the first heat exchange tube 166 and the second heat exchange tube 167. The third heat exchange tube 168 is also connected to the second pipeline 162. The third heat exchange tube 168 is in heat exchange cooperation with the cold shield 14.

[0096] In some embodiments of the present invention, the cryogenic pump body 10 may further include: an insulating support block (not shown in the figure), the insulating support block is located between the cold screen 14 and the outer shell 13, the insulating support block can support the cold screen 14, when the cryogenic pump 100 is installed in the horizontal direction, the insulating support block reliably supports the cold screen 14, reducing the risk of leakage of the heat exchange pipeline 16 due to deformation caused by gravity.

[0097] Specifically, the first medium inlet 12 is connected to the fusion reactor divertor window, and the cryogenic pump 100 is placed entirely in an external container (in a vacuum environment), which is connected to the cold valve box. During the cooling phase of the cryogenic pump 100, 80K cryogenic helium gas enters the cryogenic pump 100 from the cold valve box through a detachable pipeline via pipeline inlet 164, flows through the heat exchange tube section to cool the cold screen 14 and the radiation baffle 15, and finally flows out from pipeline outlet 165. After a period of time, 4K cryogenic liquid helium enters the cryogenic pump 100 from the second medium inlet 333, flows through the cooling medium inflow pipe 33 to cool the adsorption plate 311, and finally flows out from the cooling medium return pipe 32. When the predetermined temperature is reached, the valve 21 of the cryogenic pump 100 is opened to pump gas. When the pumping performance of the cryogenic pump 100 decreases and maintenance is required, the valve 21 of the cryogenic pump 100 is closed to regenerate the cryogenic pump 100. After returning to room temperature, the bolts on the mounting part 35 are removed remotely, and one or more adsorption components 30 are removed and replaced. To maintain the normal pumping speed of the cryogenic pump 100, individual adsorption components 30 can be replaced periodically. Therefore, the cost of replacing the cryogenic pump 100 every time its pumping speed decreases is reduced to the cost of replacing a single adsorption component 30, greatly improving economic efficiency.

[0098] The fusion device according to an embodiment of the present invention includes the cryogenic pump 100 for the fusion device described in the above embodiment. Since the adsorption component 30 is detachably disposed on the cryogenic pump body 10, the adsorption component 30 can be replaced individually, which helps reduce the maintenance cost of the cryogenic pump 100, thereby reducing the production cost of fusion energy and improving the economic efficiency of the fusion device. Furthermore, the ability to replace the adsorption component 30 without stopping the reactor helps maintain the operating efficiency of the fusion device.

[0099] The other components and operation of the cryogenic pump 100 and the fusion device according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0100] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0101] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A cryogenic pump for a fusion device, characterized in that, include: A cryogenic pump body, the cryogenic pump body defining an adsorption space, and the cryogenic pump body forming a first medium inlet communicating with the adsorption space; A valve assembly is disposed on the cryogenic pump body and is used to open or close the first medium inlet; At least one adsorption component, at least a portion of which is disposed within the adsorption space, the adsorption component being used to adsorb gas within the adsorption space, and the adsorption component being detachably disposed within the cryogenic pump body; The adsorption assembly includes: an adsorption structure, a cooling medium circuit pipe, and a cooling medium inflow pipe. The adsorption structure is disposed within the adsorption space and forms a cooling medium flow channel. The cooling medium flow channel passes through the adsorption structure along the axial direction of the cooling medium circuit pipe. The adsorption structure is fixed to the cooling medium circuit pipe. The cooling medium flow channel connects the cooling medium circuit pipe and the cooling medium inflow pipe. The adsorption structure includes multiple adsorption plates, which are arranged around the cooling medium circuit pipe along the circumference of the cooling medium circuit pipe, and each adsorption plate forms a cooling medium flow channel.

2. The cryogenic pump for a fusion device according to claim 1, characterized in that, The cryogenic pump body includes: a housing, the housing defining the adsorption space, the housing having a first medium inlet, and the housing also having a mounting hole communicating with the adsorption space, through which the adsorption assembly is inserted into or removed from the adsorption space.

3. The cryogenic pump for a fusion device according to claim 2, characterized in that, The adsorption components and the mounting holes are configured in a one-to-one correspondence.

4. The cryogenic pump for a fusion device according to claim 2, characterized in that, The outer shell has a first end wall and a second end wall, the first end wall and the second end wall are opposite to each other and spaced apart, the adsorption space is located between the first end wall and the second end wall, the first end wall forms the first medium inlet, and the second end wall forms the mounting hole.

5. The cryogenic pump for a fusion device according to claim 4, characterized in that, The adsorption components are multiple, and the multiple adsorption components are arranged sequentially along the circumference of the second end wall.

6. The cryogenic pump for a fusion device according to claim 1, characterized in that, The adsorption assembly further includes a connecting pipe, wherein the connecting pipe, the adsorption structure, and the cooling medium inflow pipe are arranged along the axial direction of the cooling medium circuit pipe, the adsorption structure is located between the connecting pipe and the cooling medium inflow pipe, the connecting pipe connects the cooling medium circuit pipe and the cooling medium flow channel, and the cooling medium flow channel connects the connecting pipe and the cooling medium inflow pipe.

7. The cryogenic pump for a fusion device according to claim 1, characterized in that, The adsorption plate has an arc-shaped structure.

8. The cryogenic pump for a fusion device according to claim 1, characterized in that, The adsorption assembly further includes a mounting part, wherein the mounting part and the adsorption structure are arranged along the axial direction of the cooling medium circuit pipe, the cooling medium circuit pipe and the cooling medium inflow pipe are both fixed to the mounting part, and the mounting part is detachably disposed on the cryogenic pump body.

9. The cryogenic pump for a fusion device according to claim 8, characterized in that, The cooling medium inflow pipe includes: a first pipe body and a second pipe body connected together. The first pipe body passes through the mounting part along the axial direction of the cooling medium circuit pipe. The second pipe body is located on the side of the mounting part away from the adsorption structure. The first pipe body connects the second pipe body and the cooling medium flow channel. The second pipe body forms a second medium inlet.

10. The cryogenic pump for a fusion device according to claim 9, characterized in that, The cooling medium flow channels are multiple, and the multiple cooling medium flow channels are arranged around the cooling medium circuit pipe along the circumference of the cooling medium circuit pipe. The first pipe body is multiple, and the multiple first pipe bodies are arranged around the cooling medium circuit pipe along the circumference of the cooling medium circuit pipe. The multiple first pipe bodies and the multiple cooling medium flow channels are connected in a one-to-one correspondence.

11. The cryogenic pump for a fusion device according to any one of claims 1-5, characterized in that, The cryogenic pump body includes a cold screen, which is a ring structure and is located within the adsorption space. The cold screen is fitted over the adsorption component and spaced apart from the adsorption component.

12. The cryogenic pump for a fusion device according to claim 11, characterized in that, The cryogenic pump body also includes: a radiation baffle, which is disposed within the adsorption space, and a cold shield is fitted over the radiation baffle.

13. The cryogenic pump for a fusion device according to claim 12, characterized in that, The adsorption component is located between the radiation baffle and the cold screen.

14. The cryogenic pump for a fusion device according to claim 12, characterized in that, The cryogenic pump body further includes a heat exchange pipeline, at least a portion of which is located within the adsorption space. The heat exchange pipeline is in contact with both the cold screen and the radiation baffle, and the heat exchange pipeline is in heat exchange cooperation with both the cold screen and the radiation baffle.

15. A fusion device, characterized in that, Includes a cryogenic pump for a fusion device according to any one of claims 1-14.

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