Refrigerating system and refrigerating box

Abstract

The embodiment of the invention provides a refrigeration system and a refrigeration box, and relates to the technical field of refrigeration. The refrigeration system comprises a semiconductor refrigeration subsystem, a first water tank, an atomizer and a first air duct; the first water tank is connected with the atomizer and used for supplying water to the atomizer; a hot end fan of the semiconductor refrigeration subsystem is arranged in the first air duct, one end of the first air duct is provided with an opening part used for being communicated with the external environment, an atomizing nozzle of the atomizer is arranged in the first air duct, and the atomizing nozzle is arranged between the opening part of the first air duct and the hot end fan. Therefore, by additionally arranging the first water tank and the atomizer, the humidity of air is gradually increased, the temperature of the air is greatly reduced and gradually approaches the wet bulb temperature, and then the air enters the hot end fan under the guidance of the first air duct to cool a hot end radiator of the semiconductor refrigeration subsystem, so that the temperature of the hot end of a semiconductor refrigeration sheet can be greatly reduced; the energy efficiency and the refrigerating capacity of the system are improved.

Description

Technical Field

[0001] The present application relates to the field of refrigeration technology, and in particular to a refrigeration system and a refrigeration box. Background Art

[0002] Existing refrigerators and insulated boxes use a semiconductor refrigeration subsystem, which includes semiconductor cooling chips, a hot-end fan, a cold-end fan, a hot-end radiator, and a cold-end radiator. The hot and cold ends dissipate heat from the box to the atmosphere through forced convection. The box's temperature is maintained low by balancing the cooling capacity of the semiconductor cooling chips with the heat exchange between the inside and outside of the box.

[0003] However, the temperature difference between the hot and cold ends of the semiconductor refrigeration plate is large, and the energy efficiency is low. Especially when the ambient temperature is high, the temperature difference between the hot and cold ends is further increased, and the cooling capacity of the semiconductor refrigeration plate drops sharply, which is not enough to balance the heat exchange inside and outside the box, resulting in the box failing to keep warm. Summary of the Invention

[0004] In view of this, an embodiment of the present application provides a refrigeration system and a refrigerator, aiming to improve energy efficiency and keep the refrigerator at a low temperature.

[0005] In a first aspect, an embodiment of the present application provides a refrigeration system, comprising: a semiconductor refrigeration subsystem, a first water tank, an atomizer, and a first air duct;

[0006] The first water tank is connected to the atomizer and is used to supply water to the atomizer;

[0007] The hot end fan of the semiconductor refrigeration subsystem is arranged in the first air duct, and an opening for communicating with the external environment is provided at one end of the first air duct. The atomizing nozzle of the atomizer is arranged in the first air duct, and the atomizing nozzle is arranged between the opening of the first air duct and the hot end fan.

[0008] Optionally, a pre-cooling heat exchanger is also included;

[0009] The first fluid conduit of the pre-cooling heat exchanger is arranged corresponding to the hot end radiator of the semiconductor refrigeration subsystem;

[0010] The second fluid conduit of the pre-cooling heat exchanger is arranged corresponding to the hot end fan in the first air duct.

[0011] Optionally, the pre-cooling heat exchanger is arranged on a side of the atomizing nozzle close to the opening end.

[0012] Optionally, it also includes an auxiliary cooling module and a second water tank.

[0013] The first end of the auxiliary cooling module is connected to the second water tank, and the second end of the auxiliary cooling module is connected to the first heat dissipation module. The auxiliary cooling module is used to circulate water in the second water tank to the first heat dissipation module, so that the first heat dissipation module dissipates heat for the refrigerated box.

[0014] Optionally, the first heat dissipation module is a hot end radiator of the semiconductor refrigeration subsystem.

[0015] Optionally, the surface of the hot end heat sink is sintered, or the surface coating is a porous medium.

[0016] Optionally, the auxiliary cooling module includes a first water pipe, a first water pump and a first thermostat, the first water pump is connected to the first water pipe, and a control end of the first water pump is connected to a signal output end of the first thermostat;

[0017] The first water pump is used to circulate the water in the second water tank to the first radiator through the first water pipe;

[0018] The first thermostat is used to collect the water temperature of the second water tank and control the first water pump to turn on when the water temperature is lower than a first preset value, and control the first water pump to turn off when the water temperature is not lower than the first preset value.

[0019] Optionally, the first heat dissipation module includes a water-cooled radiator, a semiconductor refrigeration plate, a cold end radiator and a cold end fan;

[0020] The water-cooled radiator is arranged outside the refrigerator, and a semiconductor refrigeration plate 1 is arranged on a side of the water-cooled radiator close to the refrigerator, and a side of the semiconductor refrigeration plate 1 away from the water-cooled radiator is connected to a first end of the cold end radiator, and a second end of the cold end radiator is connected to the cold end fan; the cold end radiator 1 and the cold end fan 1 are both inside the refrigerator;

[0021] The auxiliary cooling module is used to control the cooling water pump of the second water tank to the water-cooled radiator to cool the water-cooled radiator.

[0022] Optionally, a second thermostat is also included, which is used to control the first heat dissipation module and the auxiliary cooling module to start and turn off the semiconductor refrigeration subsystem when it is detected that the temperature of the second water tank is lower than a second preset value; when it is detected that the temperature of the second water tank is not lower than the second preset value, the first heat dissipation module and the auxiliary cooling module are controlled to turn off and turn on the semiconductor refrigeration subsystem.

[0023] In a second aspect, the present application also provides a refrigerated box that adopts a refrigeration system described in any one of the above.

[0024] The present application provides a refrigeration system and a refrigerator, which include a semiconductor refrigeration subsystem, a first water tank, an atomizer, and a first air duct. The first water tank is connected to the atomizer and is used to supply water to the atomizer. The hot end fan of the semiconductor refrigeration subsystem is disposed in the first air duct, one end of the first air duct is provided with an opening for communicating with the external environment, and the atomizing nozzle of the atomizer is disposed in the first air duct, between the opening of the first air duct and the hot end fan. In this way, by adding the first water tank and the atomizer, the ambient temperature on the hot end fan side of the semiconductor refrigeration subsystem can be humidified by atomized water vapor. As the humidity of the air gradually increases, the temperature of the air decreases significantly, gradually approaching the wet bulb temperature, and then enters the hot end fan under the guidance of the first air duct to cool the hot end radiator of the semiconductor refrigeration subsystem, which can greatly reduce the temperature of the hot end of the semiconductor refrigeration plate and improve the energy efficiency and cooling capacity of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in this embodiment or the prior art, the following briefly introduces the drawings required for use in the embodiment or the prior art description. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic structural diagram of a semiconductor refrigeration subsystem provided in an embodiment of the present application;

[0027] Figure 2 A schematic structural diagram of a refrigeration system provided in an embodiment of the present application;

[0028] Figure 3 A schematic structural diagram of another refrigeration system provided in an embodiment of the present application;

[0029] Figure 4 A schematic structural diagram of another refrigeration system provided in an embodiment of the present application;

[0030] Figure 5 A schematic structural diagram of another refrigeration system provided in an embodiment of the present application.

[0031] Description of the accompanying figures:

[0032] 1-first water tank; 2-atomizer; 3-pre-cooling heat exchanger; 4-second water tank; 5-first heat dissipation module; 51-cold end fan 1; 52-cold end radiator 1; 53-semiconductor refrigeration plate 1; 54-water-cooled radiator; 6-semiconductor refrigeration subsystem. DETAILED DESCRIPTION

[0033] See also Figure 1 The schematic diagram of the structure of a semiconductor refrigeration subsystem is shown in FIG. Figure 1 The refrigerator shown uses a semiconductor refrigeration subsystem, which includes semiconductor cooling elements, a hot-end fan, a cold-end fan, a hot-end radiator, and a cold-end radiator. The hot and cold ends dissipate heat from the box to the atmosphere through forced convection. The temperature inside the box is maintained low by balancing the cooling capacity of the semiconductor cooling elements with the heat exchange between the inside and outside of the box. However, the temperature difference between the hot and cold ends of the semiconductor cooling elements is large, resulting in low energy efficiency. Especially at high ambient temperatures, the temperature difference between the hot and cold ends increases further, causing the semiconductor cooling element's cooling capacity to drop sharply, insufficient to balance the heat exchange between the inside and outside of the box, resulting in a failure to maintain heat preservation.

[0034] Based on the above problems, the present application provides a refrigeration system and a refrigerated box, which include a semiconductor refrigeration subsystem, a first water tank, an atomizer, and a first air duct; the first water tank is connected to the atomizer and is used to supply water to the atomizer; the hot end fan of the semiconductor refrigeration subsystem is arranged in the first air duct, one end of the first air duct is provided with an opening for communicating with the external environment, and the atomizing nozzle of the atomizer is arranged in the first air duct, and the atomizing nozzle is arranged between the opening of the first air duct and the hot end fan. In this way, by adding the first water tank and the atomizer, the ambient temperature on the hot end fan side of the semiconductor refrigeration subsystem can be humidified by the atomized water vapor. As the humidity of the air gradually increases, the temperature of the air decreases significantly, gradually approaching the wet bulb temperature, and then enters the hot end fan under the guidance of the first air duct to cool the hot end radiator of the semiconductor refrigeration subsystem, which can greatly reduce the temperature of the hot end of the semiconductor refrigeration plate and improve the energy efficiency and cooling capacity of the system.

[0035] Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0036] See also Figure 2 , Figure 2 A schematic structural diagram of a refrigeration system provided in an embodiment of the present application, comprising: a semiconductor refrigeration subsystem 6, a first water tank 1, an atomizer 2 and a first air duct;

[0037] The first water tank is connected to the atomizer and is used to supply water to the atomizer.

[0038] The hot end fan of the semiconductor refrigeration subsystem is arranged in the first air duct, and an opening for communicating with the external environment is provided at one end of the first air duct. The atomizing nozzle of the atomizer is arranged in the first air duct, and the atomizing nozzle is arranged between the opening of the first air duct and the hot end fan.

[0039] like Figure 1 As shown, the semiconductor refrigeration subsystem 6 includes a semiconductor refrigeration chip. A cold end radiator and a cold end fan are sequentially provided on the side of the semiconductor refrigeration chip close to the refrigerator. The cold end radiator and the cold end fan are disposed inside the refrigerator. A hot end radiator and a hot end fan are sequentially provided on the side of the semiconductor refrigeration chip away from the cold end fan. The hot end radiator and the hot end fan are disposed outside the refrigerator. The semiconductor refrigeration chip is used to dissipate heat inside the refrigerator to the outside of the refrigerator through the semiconductor refrigeration chip, thereby cooling the refrigerator. The semiconductor refrigeration chip can be disposed outside or inside the refrigerator.

[0040] The first water tank 1 supplies water to the atomizer 2 so that the atomizing nozzle of the atomizer 2 can atomize the water in the first water tank 1 and release the atomized water vapor into the first air duct to humidify the air in the first air duct, and the hot-end fan is arranged at the end of the first air duct away from the opening end. As the humidity in the first air duct gradually increases, the humidity of the air around the hot-end fan also increases, which greatly reduces the temperature of the air and gradually approaches the wet-bulb temperature, cooling the hot-end radiator of the semiconductor refrigeration subsystem 6, which can greatly reduce the temperature of the hot end of the semiconductor refrigeration plate, improve the energy efficiency and cooling capacity of the system, and its cooling coefficient COP can reach above 1.

[0041] In one possible implementation, see Figure 3 The schematic diagram of another refrigeration system shown in FIG. 1 further includes a pre-cooling heat exchanger 3. The input end of the first fluid conduit of the pre-cooling heat exchanger 3 corresponds to the hot-end radiator of the semiconductor refrigeration subsystem (the input end of the first fluid conduit receives gas released from the hot-end radiator, and the output end of the first fluid conduit exhausts air to the external environment). The second fluid conduit of the pre-cooling heat exchanger corresponds to the hot-end fan within the first air duct (the input end of the second fluid conduit is used to receive gas from the environment, and the output end of the second fluid conduit corresponds to the hot-end fan).

[0042] Since the temperature of the gas output by the hot-end radiator is lower than the ambient temperature, the gas with a certain amount of cooling output by the hot-end radiator can be further transported into the first fluid pipe of the pre-cooling heat exchanger, thereby cooling the air of ambient temperature transported to the hot-end fan in the second fluid pipe through the pre-cooling heat exchanger.

[0043] Optionally, the pre-cooling heat exchanger 3 is arranged on the side of the atomizing nozzle close to the opening end.

[0044] The atomizing nozzle is arranged between the pre-cooling heat exchanger 3 and the hot end fan. The gas output from the pre-cooling heat exchanger 3 to the hot end fan is atomized by the atomizing nozzle, further reducing the temperature of the air around the hot end fan.

[0045] By adding a pre-cooling heat exchanger 3 to the refrigeration system, the pre-cooling heat exchanger 3 uses the gas with a certain amount of cooling output from the hot-end radiator to be transported into the first fluid pipe of the pre-cooling heat exchanger. Thus, the air at ambient temperature in the second fluid pipe of the pre-cooling heat exchanger, which is transported to the hot-end fan, is cooled through the first fluid pipe of the pre-cooling heat exchanger. Furthermore, when the atomizing nozzle is positioned between the pre-cooling heat exchanger 3 and the hot-end fan, the gas output from the pre-cooling heat exchanger 3, which is below ambient temperature, is guided through the first air duct to prevent it from spreading to the surroundings. The gas is then humidified by the water vapor atomized by the atomizer 2, allowing the air temperature to be lower than the wet-bulb temperature. The air then reaches the hot-end fan, which uses the pre-cooled air to cool the hot-end radiator, further reducing the temperature of the hot end of the semiconductor refrigeration plate, improving the system's energy efficiency and cooling capacity, and achieving a COP of over 1.

[0046] Based on the above possible implementation methods, the above refrigeration system may further include an auxiliary cooling module and a second water tank 4, the first end of the auxiliary cooling module is connected to the second water tank 4, and the second end of the auxiliary cooling module is connected to the first heat dissipation module 5. The auxiliary cooling module is used to circulate the water in the second water tank 4 to the first heat dissipation module 5, so that the first heat dissipation module 5 dissipates heat for the refrigerated box. There may be multiple implementation methods for its specific implementation, which are described in detail below.

[0047] The first water tank 1 and the second water tank 4 can be two water tanks respectively or the same water tank. The first water tank 1 is used to supply water to the atomizer and can be arranged in the refrigerator or outside the refrigerator.

[0048] In one possible implementation, see Figure 4 A structural schematic diagram of another refrigeration system is shown.

[0049] The first heat dissipation module 5 is a hot end heat sink of the semiconductor refrigeration subsystem 6 .

[0050] The auxiliary cooling module includes a first water pipe, a first water pump and a first thermostat, the first water pump is connected to the first water pipe, and the control end of the first water pump is connected to the signal output end of the first thermostat; the first water pump is used to circulate the water in the second water tank to the first radiator through the first water pipe; the first thermostat is used to collect the water temperature of the second water tank, and when the water temperature is lower than a first preset value, control the first water pump to turn on, and when the water temperature is not lower than the first preset value, control the first water pump to turn off.

[0051] The second water tank 4 is used to provide cooling water for the first heat dissipation module.

[0052] Optionally, the surface of the hot end heat sink is sintered or coated with a porous medium to achieve better heat dissipation.

[0053] In this possible implementation, the second water tank 4 can be set in the refrigerator to store cold water. When the temperature of the water in the second water tank 4 is lower than the first preset value, the cold water in the second water tank 4 is pumped to the hot end radiator, and the heat dissipated by the hot end of the semiconductor refrigeration subsystem 6 is removed by evaporative cooling. Specifically, the second water tank 4 is set in the refrigerator. When the temperature of the refrigerator body is low, the temperature of the second water tank 4 can be kept low, and part of the cold energy can be stored in the cold water in the second water tank 4. When the water temperature of the second water tank 4 is lower than the first preset value, the cold water in the cold storage water tank can be pumped to the surface of the hot end radiator of the semiconductor refrigeration subsystem 6, and the heat of the radiator can be removed by evaporation of the cold water. Since the water temperature is close to the temperature in the refrigerator, the hot end temperature of the semiconductor refrigeration plate can be made close to the cold end temperature, thereby maximizing the energy efficiency and cooling capacity of the refrigeration plate. The highest coefficient of cooling (COP) can reach above 1.5.

[0054] In another possible implementation, see Figure 5 A structural schematic diagram of another refrigeration system is shown.

[0055] The first heat dissipation module 5 may include a water-cooled radiator 54, a semiconductor refrigeration plate 53, a cold-end radiator 52 and a cold-end fan 51; the water-cooled radiator 54 is arranged on the outside of the cold storage box, and a semiconductor refrigeration plate 53 is arranged on the side of the water-cooled radiator 54 close to the cold storage box, and the side of the semiconductor refrigeration plate 53 away from the water-cooled radiator 54 is connected to the first end of the cold-end radiator, and the second end of the cold-end radiator is connected to the cold-end fan; the cold-end radiator 52 and the cold-end fan 51 are both inside the cold storage box.

[0056] The semiconductor refrigeration plate 53 can be arranged inside the refrigerator or outside the refrigerator.

[0057] The auxiliary cooling module is used to control the cooling water pump of the second water tank to the water-cooled radiator to cool the water-cooled radiator.

[0058] The auxiliary cooling module may include a second water pipe and a second water pump, wherein the second water pipe is used to connect the water circulation between the second water tank 4 and the water-cooled radiator 54, and the second water pump is used to pump the cooling water in the second water tank into the water-cooled radiator.

[0059] Furthermore, the system also includes a second thermostat, which is used to control the first heat dissipation module 5 and the auxiliary cooling module to start and turn off the semiconductor refrigeration subsystem 6 when it is detected that the temperature of the second water tank 4 is lower than a second preset value; when it is detected that the temperature of the second water tank 4 is not lower than the second preset value, control the first heat dissipation module 5 and the auxiliary cooling module to turn off and turn on the semiconductor refrigeration subsystem 6.

[0060] In this possible implementation, a first heat dissipation module 5 is provided in parallel with the semiconductor refrigeration subsystem 6. The structure of the first heat dissipation module 5 inside the cold storage box can be the same as the structure of the semiconductor refrigeration subsystem 6 inside the cold storage box, while the structure of the first heat dissipation module 5 outside the cold storage box includes a water-cooled radiator 54. The water-cooled radiator 54 is connected to the second water tank 4 via a water pipe, and the power for water circulation can be provided by a water pump, etc. The specific working process can be: when the semiconductor refrigeration subsystem 6 is working for air cooling, the temperature inside the cold storage box is relatively low, and the second water tank 4 can be provided inside the cold storage box so that the temperature of the second water tank 4 is also maintained at a relatively low temperature, and part of the cold energy is stored in the cold water. When the water temperature of the second water tank 4 is lower than a second preset value, the air cooling work of the semiconductor refrigeration subsystem 6 is stopped, and the first heat dissipation module 5 is started for water cooling. Since the water temperature of the second water tank 4 is close to the temperature inside the cold storage box, the hot end temperature of the semiconductor refrigeration plate 1 53 can be made close to the cold end temperature, thereby maximizing the energy efficiency and cooling capacity of the refrigeration plate.

[0061] When the temperature in the second water tank 4 gradually rises with the running time, when the water temperature in the second water tank 4 is not lower than the second preset value, the first heat dissipation module 5 stops working and the semiconductor refrigeration subsystem 6 starts working. While cooling, the semiconductor refrigeration subsystem 6 continues to store cold in the second water tank 4, and the refrigeration coefficient COP can reach up to 2 or more.

[0062] The above embodiment reduces the hot end temperature by atomization of the atomizer 2, heat exchange and refrigeration of the pre-cooling heat exchanger 3, and cold storage of the second water tank 4, thereby significantly reducing the temperature of the hot end of the semiconductor refrigeration plate, reducing the temperature difference between the cold end and the hot end, and improving the energy efficiency and cooling capacity of the refrigeration system.

[0063] In addition, an embodiment of the present application also provides a refrigerator, which adopts a refrigeration system described in any one of the above.

[0064] The "first" and "second" in the names such as "first" and "second" (if any) mentioned in the embodiments of this application are only used as name identifiers and do not represent the first or second in order.

[0065] Through the description of the above embodiments, it can be known that those skilled in the art can clearly understand that all or part of the steps in the above embodiment methods can be implemented by means of software plus a general hardware platform. Based on this understanding, the technical solution of the present application can be embodied in the form of a software product, which can be stored in a storage medium such as a read-only memory (ROM) / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network communication device such as a router) to execute the methods described in each embodiment of the present application or certain parts of the embodiments.

[0066] Each embodiment in this specification is described in a progressive manner. The same or similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple. For the relevant parts, refer to the partial description of the method embodiment. Some or all of the modules can be selected according to actual needs to achieve the purpose of the embodiment. Those of ordinary skill in the art can understand and implement it without paying any creative work.

[0067] The above description is merely an exemplary embodiment of the present application and is not intended to limit the scope of protection of the present application.

Claims

1. A refrigeration system, characterized in that: include: Semiconductor refrigeration subsystem, first water tank, atomizer and first air duct; The first water tank is connected to the atomizer and is used to supply water to the atomizer; The hot end fan of the semiconductor refrigeration subsystem is arranged in the first air duct, and an opening for communicating with the external environment is provided at one end of the first air duct. The atomizing nozzle of the atomizer is arranged in the first air duct, and the atomizing nozzle is arranged between the opening of the first air duct and the hot end fan.

2. The system according to claim 1, wherein: Also includes a pre-cooling heat exchanger; The first fluid conduit of the pre-cooling heat exchanger is arranged corresponding to the hot end radiator of the semiconductor refrigeration subsystem; The second fluid conduit of the pre-cooling heat exchanger is arranged corresponding to the hot end fan in the first air duct.

3. The system according to claim 2, characterized in that The pre-cooling heat exchanger is arranged on a side of the atomizing nozzle close to the opening end.

4. The system according to any one of claims 1 to 3, characterized in that: It also includes an auxiliary cooling module and a second water tank, The first end of the auxiliary cooling module is connected to the second water tank, and the second end of the auxiliary cooling module is connected to the first heat dissipation module. The auxiliary cooling module is used to circulate water in the second water tank to the first heat dissipation module, so that the first heat dissipation module dissipates heat for the refrigerated box.

5. The system according to claim 4, characterized in that The first heat dissipation module is a hot end heat sink of the semiconductor refrigeration subsystem.

6. The system according to claim 5, characterized in that The surface of the hot end radiator is sintered, or the surface coating is a porous medium.

7. The system according to claim 5, characterized in that The auxiliary cooling module includes a first water pipe, a first water pump and a first thermostat, wherein the first water pump is connected to the first water pipe, and a control end of the first water pump is connected to a signal output end of the first thermostat; The first water pump is used to circulate the water in the second water tank to the first radiator through the first water pipe; The first thermostat is used to collect the water temperature of the second water tank and control the first water pump to turn on when the water temperature is lower than a first preset value, and control the first water pump to turn off when the water temperature is not lower than the first preset value.

8. The system according to claim 4, wherein: The first heat dissipation module includes a water-cooled radiator, a semiconductor refrigeration plate, a cold end radiator and a cold end fan; The water-cooled radiator is arranged outside the refrigerator, and a semiconductor refrigeration plate 1 is arranged on a side of the water-cooled radiator close to the refrigerator, and a side of the semiconductor refrigeration plate 1 away from the water-cooled radiator is connected to a first end of the cold end radiator, and a second end of the cold end radiator is connected to the cold end fan; the cold end radiator 1 and the cold end fan 1 are both inside the refrigerator; The auxiliary cooling module is used to control the cooling water pump of the second water tank to the water-cooled radiator to cool the water-cooled radiator.

9. The system according to claim 8, characterized in that It also includes a second thermostat, which is used to control the first heat dissipation module and the auxiliary cooling module to start and turn off the semiconductor refrigeration subsystem when it detects that the temperature of the second water tank is lower than a second preset value; when it detects that the temperature of the second water tank is not lower than the second preset value, it controls the first heat dissipation module and the auxiliary cooling module to turn off and turn on the semiconductor refrigeration subsystem.

10. A refrigerator, characterized in that: A refrigeration system according to any one of claims 1 to 9 is used.

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