Electronic integrated chip manufacturing equipment and manufacturing method thereof

Abstract

The invention discloses electronic integrated chip manufacturing equipment and a preparation method thereof in the technical field of electronic integrated chips, and the equipment comprises a box body and a partition plate, the partition plate is arranged in the box body, a plurality of strip-shaped holes are embedded in the surface of the partition plate, a sliding rail is arranged on one side of the partition plate, a wafer is arranged in the sliding rail, and a heating wire is arranged on one side of the partition plate. The two partition plates are arranged on the two sides of the box body respectively, a temperature sensor is arranged on one side of each partition plate, an alarm is arranged on the top of the box body, the alarm is electrically connected with the temperature sensors, and an oxygen generator is arranged on the top of the box body. The partition plates, the strip-shaped holes, the sliding rails, the wafers, the heating wires, the temperature sensors, the alarm and the oxygen generator are arranged, and the heating wires are arranged on the two sides of the box body; therefore, the wafer is uniformly heated during heating, the product quality can be effectively improved, the oxygen generator can convey oxygen into the box body during heating, the oxidation speed of the wafer is increased, silicon dioxide is rapidly generated on the surface of the wafer, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic integrated chips, and in particular relates to electronic integrated chip manufacturing equipment and a manufacturing method thereof. Background Art

[0002] An integrated chip is a chip manufactured by first integrating transistors into specialized cores, which are then integrated into a single chip using semiconductor technology based on application requirements. A core, also known as a "chiplet," is a prefabricated, functionally specific wafer that can be combined and integrated. Its functions can include general-purpose processors, memory, graphics processors, encryption engines, network interfaces, and more. Electronic integrated chips are made from wafers, which are processed in high-temperature furnaces. This process forms a layer of silicon dioxide on the surface of the wafer, allowing for further processing.

[0003] Existing high-temperature furnaces for electronic integrated chip production still have some defects. Most of the heating sources are located at the top or bottom of the furnace body, resulting in uneven heating of the wafer, which may cause incomplete oxidation of the wafer. In addition, the wafer needs to come into contact with oxygen during the heating process so that silicon dioxide can form on its surface. The existing oxygen supply is insufficient, which reduces production efficiency. For this reason, we propose an electronic integrated chip production equipment and its preparation method. Summary of the Invention

[0004] The object of the present invention is to provide an electronic integrated chip manufacturing device and a manufacturing method thereof, so as to solve the problems of uneven heating and low production efficiency raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an electronic integrated chip manufacturing device and a preparation method thereof, comprising a box body and a partition, a partition is provided inside the box body, the partition and the box body are fixedly connected, a strip hole is embedded in the surface of the partition, and there are multiple strip holes, a slide rail is provided on one side of the partition, a wafer is provided inside the slide rail, and there are multiple groups of slide rails and wafers, a heating wire is provided on one side of the partition, and there are two groups of partitions and heating wires, which are respectively located on both sides of the box body, a temperature sensor is provided on one side of the partition, and the temperature sensor and the partition are fixed by screws, an alarm is provided on the top of the box body, and the alarm and the temperature sensor are electrically connected, and an oxygen generator is provided on the top of the box body.

[0006] Preferably, a humidifier bottle is provided on one side of the oxygen concentrator, the humidifier bottle and the oxygen concentrator are detachably connected, and a connecting pipe is provided on the top of the humidifier bottle.

[0007] Preferably, a transport tube is provided on the top of the humidification bottle, a branch tube is provided on one side of the transport tube, the branch tube and the box body are interconnected, and a plurality of branch tubes are provided.

[0008] Preferably, a shell is provided on one side of the box body, the shell and the box body are fixed by screws, and a motor is provided on one side of the shell.

[0009] Preferably, fan blades are provided inside the shell, and a protective net is provided on the inner wall of the box body, and the protective net and the box body are detachably connected.

[0010] Preferably, a controller is provided on one side of the box, the controller and the box are fixed by screws, and a timer is provided on one side of the controller.

[0011] Preferably, a sealing door is provided on one side of the box body, and the sealing door and the box body are rotatably connected via a hinge.

[0012] Preferably, an observation window is embedded in the surface of the sealed door, and the observation window is made of a transparent material.

[0013] Preferably, the bottom of the box is provided with universal wheels, and four universal wheels are provided and respectively located at the four corners of the bottom of the box.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. Through the provided partitions, strip holes, slide rails, wafers, heating wires, temperature sensors, alarms and oxygen generators, since the heating wires are arranged on both sides of the box, the wafers are heated evenly during heating, which can effectively improve the quality of the product. During heating, the oxygen generator can transport oxygen to the inside of the box, accelerate the oxidation rate of the wafers, and quickly generate silicon dioxide on their surface, thereby improving production efficiency. The temperature sensor can detect the temperature inside the box, so as to better control its temperature. When it is detected that the temperature is not at the preset value, the alarm will start to sound, reminding the staff to check the cause in time, making it safer to use.

[0016] 2. The cooling of the wafer can be accelerated by the provided fan blades and motor. When the wafer is oxidized, open the sealed door, start the motor, and drive the fan blades to rotate, which can quickly cool it down. The oxygen is transported through the provided transport pipes and branch pipes, and then enters the interior of the box. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 Schematic diagram of the internal structure of the present invention;

[0019] Figure 3 It is a schematic diagram of the planar structure of the present invention;

[0020] Figure 4 It is a side structural schematic diagram of the present invention;

[0021] Figure 5 It is a schematic diagram of the back structure of the present invention.

[0022] In the figure: 1. Box body; 2. Partition; 3. Strip hole; 4. Slide rail; 5. Wafer; 6. Heating wire; 7. Temperature sensor; 8. Alarm; 9. Oxygen generator; 10. Humidifier bottle; 11. Connecting pipe; 12. Transport pipe; 13. Branch pipe; 14. Housing; 15. Motor; 16. Fan blade; 17. Protective net; 18. Controller; 19. Timer; 20. Sealed door; 21. Observation window; 22. Universal wheel. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] See also Figure 1-5 The present invention provides a technical solution: an electronic integrated chip manufacturing device and a preparation method thereof, comprising a box body 1 and a partition 2, a partition 2 is provided inside the box body 1, the partition 2 and the box body 1 are fixedly connected, a strip hole 3 is embedded on the surface of the partition 2, and a plurality of strip holes 3 are provided. A slide rail 4 is provided on one side of the partition 2, a wafer 5 is provided inside the slide rail 4, and a plurality of slide rails 4 and wafers 5 are provided. A heating wire 6 is provided on one side of the partition 2, and the partition 2 and the heating wire 6 are provided in two groups, respectively located on both sides of the box body 1, a temperature sensor 7 is provided on one side of the partition 2, and the temperature sensor 7 and the partition 2 are fixed by screws. An alarm 8 is provided on the top of the box body 1, and the alarm 8 and the temperature sensor 7 are electrically connected. An oxygen concentrator 9 is provided on the top, through the partition 2, strip hole 3, slide rail 4, wafer 5, heating wire 6, temperature sensor 7, alarm 8 and oxygen concentrator 9. Since the heating wire 6 is arranged on both sides of the box 1, the wafer 5 is heated evenly during heating, which can effectively improve the quality of the product. During heating, the oxygen concentrator 9 can transport oxygen to the inside of the box 1, accelerate the oxidation rate of the wafer 5, and quickly generate silicon dioxide on its surface, thereby improving production efficiency. The temperature sensor 7 can detect the temperature inside the box 1, so as to better control its temperature. When it is detected that the temperature is not at the preset value, the alarm 8 can start to alarm, reminding the staff to check the cause in time, making it safer to use.

[0025] Specifically, a humidifier bottle 10 is provided on one side of the oxygen concentrator 9. The humidifier bottle 10 and the oxygen concentrator 9 are detachably connected. A connecting tube 11 is provided on the top of the humidifier bottle 10. Through the humidifier bottle 10 and the connecting tube 11, the oxygen concentrator 9 is cooperated to achieve oxygen preparation.

[0026] Specifically, a transport pipe 12 is provided on the top of the humidification bottle 10, and a branch pipe 13 is provided on one side of the transport pipe 12. The branch pipe 13 and the box body 1 are interconnected. There are multiple branch pipes 13. Through the transport pipe 12 and the branch pipe 13, oxygen is transported into the interior of the box body 1.

[0027] Specifically, a shell 14 is provided on one side of the box body 1, and the shell 14 and the box body 1 are fixed by screws. A motor 15 is provided on one side of the shell 14, and the fan blades 16 are driven by the shell 14 and the motor 15.

[0028] Specifically, fan blades 16 are provided inside the outer shell 14, and a protective net 17 is provided on the inner wall of the box body 1. The protective net 17 and the box body 1 are detachably connected. The fan blades 16 can accelerate the cooling of the wafer 5. When the oxidation of the wafer 5 is completed, the sealing door 20 is opened, the motor 15 is started, and the fan blades 16 are driven to rotate, so that it can be cooled quickly.

[0029] Specifically, a controller 18 is provided on one side of the box body 1, and the controller 18 and the box body 1 are fixed by screws. A timer 19 is provided on one side of the controller 18. The heating time can be controlled by the provided controller 18 and timer 19, which is more convenient to use.

[0030] Specifically, a sealing door 20 is provided on one side of the box body 1 , and the sealing door 20 and the box body 1 are rotatably connected via a hinge. The sealing door 20 is provided to achieve sealing of the box body 1 .

[0031] Specifically, an observation window 21 is embedded in the surface of the sealing door 20 . The observation window 21 is made of a transparent material. Through the observation window 21 , the situation inside the box body 1 can be easily checked at any time.

[0032] Specifically, universal wheels 22 are provided at the bottom of the box body 1 . Four universal wheels 22 are provided, which are respectively located at the four corners of the bottom of the box body 1 . The universal wheels 22 facilitate the movement of the device.

[0033] In this embodiment, when using the device, the wafer 5 is placed inside the slide rail 4 and the heating wire 6 is started. Since the heating wire 6 is arranged on both sides of the box 1, the wafer 5 is heated evenly during heating, which can effectively improve the quality of the product. During heating, the oxygen generator 9 is started, and the oxygen generated by the oxygen generator 9 enters the interior of the box 1 through the transport pipe 12 and the branch pipe 13, which accelerates the oxidation speed of the wafer 5 and quickly generates silicon dioxide on its surface, thereby improving production efficiency. The temperature sensor 7 can detect the temperature inside the box 1 to better control its temperature. When it is detected that the temperature is not at the preset value, the alarm 8 can start to alarm, reminding the staff to check the cause in time, which is safer to use. When the oxidation of the wafer 5 is completed, the sealing door 20 is opened, the motor 15 is started, and the fan blades 16 are driven to rotate, so that it can be cooled quickly.

[0034] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An electronic integrated chip manufacturing device and a manufacturing method thereof, comprising a box (1) and a partition (2), characterized in that: The box (1) is provided with a partition (2) inside, the partition (2) and the box (1) are fixedly connected, the surface of the partition (2) is embedded with a strip hole (3), and the strip hole (3) is provided in plurality. A slide rail (4) is provided on one side of the partition (2), and a wafer (5) is provided inside the slide rail (4). There are a plurality of slide rails (4) and wafers (5). A heating wire (6) is provided on one side of the partition (2). There are two groups of the partition (2) and the heating wire (6), which are respectively located on both sides of the box (1). A temperature sensor (7) is provided on one side of the partition (2), and the temperature sensor (7) and the partition (2) are fixed by screws. An alarm (8) is provided on the top of the box (1), and the alarm (8) and the temperature sensor (7) are electrically connected. An oxygen concentrator (9) is provided on the top of the box (1).

2. The electronic integrated chip manufacturing device and the manufacturing method thereof according to claim 1, characterized in that: A humidifier bottle (10) is provided on one side of the oxygen concentrator (9). The humidifier bottle (10) and the oxygen concentrator (9) are detachably connected. A connecting pipe (11) is provided on the top of the humidifier bottle (10).

3. The electronic integrated chip manufacturing device and the manufacturing method thereof according to claim 2, characterized in that: A transport pipe (12) is provided on the top of the humidifying bottle (10), a branch pipe (13) is provided on one side of the transport pipe (12), the branch pipe (13) and the box body (1) are interconnected, and a plurality of branch pipes (13) are provided.

4. The electronic integrated chip manufacturing device and the manufacturing method thereof according to claim 1, characterized in that: A shell (14) is provided on one side of the box body (1), the shell (14) and the box body (1) are fixed by screws, and a motor (15) is provided on one side of the shell (14).

5. The electronic integrated chip manufacturing device and the manufacturing method thereof according to claim 4, characterized in that: The interior of the housing (14) is provided with fan blades (16), the inner wall of the box body (1) is provided with a protective net (17), and the protective net (17) and the box body (1) are detachably connected.

6. The electronic integrated chip manufacturing device and the manufacturing method thereof according to claim 1, characterized in that: A controller (18) is provided on one side of the box (1), the controller (18) and the box (1) are fixed by screws, and a timer (19) is provided on one side of the controller (18).

7. The electronic integrated chip manufacturing device and the manufacturing method thereof according to claim 1, characterized in that: A sealing door (20) is provided on one side of the box body (1), and the sealing door (20) and the box body (1) are rotatably connected via a hinge.

8. The electronic integrated chip manufacturing device and the manufacturing method thereof according to claim 7, characterized in that: An observation window (21) is embedded on the surface of the sealing door (20), and the observation window (21) is made of a transparent material.

9. The electronic integrated chip manufacturing device and the manufacturing method thereof according to claim 1, characterized in that: The bottom of the box body (1) is provided with universal wheels (22), and four universal wheels (22) are provided and are respectively located at the four corners of the bottom of the box body (1).

10. An electronic integrated chip manufacturing device and a manufacturing method thereof, characterized in that: The following steps are involved: When using the device, a wafer (5) is placed inside the slide rail (4), and the heating wire (6) is started. Since the heating wire (6) is arranged on both sides of the box (1), the wafer (5) is heated evenly during heating, which can effectively improve the quality of the product. During heating, the oxygen generator (9) is started, and the oxygen generated by the oxygen generator (9) enters the inside of the box (1) through the transport pipe (12) and the branch pipe (13), which accelerates the oxidation speed of the wafer (5) and quickly generates silicon dioxide on its surface, thereby improving production efficiency. The temperature sensor (7) can detect the temperature inside the box (1), thereby better controlling its temperature. When it is detected that the temperature is not at the preset value, the alarm (8) can start to alarm, reminding the staff to check the cause in time, making it safer to use.

Images