Cleaning device applied to semiconductor equipment parts

Abstract

The invention provides a cleaning device applied to semiconductor equipment parts, and belongs to the technical field of semiconductor equipment part cleaning, the cleaning device comprises a cleaning box, the outer wall of the cleaning box is fixedly connected with a base, the outer wall of the cleaning box is fixedly provided with a communicating groove, and the outer wall of the cleaning box is fixedly connected with a collecting box; a flow guide block is fixedly connected to the inner wall of the collecting box, and the mounting assembly comprises connecting plates symmetrically connected to the outer wall of the collecting box in a sliding mode. According to the cleaning device, cleaning liquid is collected through the arranged collecting box, pollutants in the cleaning liquid are effectively removed and purified through the honeycomb activated carbon plate and the ion exchange resin, and then the cleaning liquid flows back to the cleaning box through the backflow groove and the communicating groove to be recycled, so that waste of the cleaning liquid is effectively avoided; according to the method, the cleaning solution purchasing cost of an enterprise is greatly reduced, meanwhile, the consumption of water resources is reduced, the sustainable development concept is met, and remarkable economic benefits and environmental benefits are brought to the enterprise.

Description

Technical Field

[0001] The present invention relates to the technical field of cleaning semiconductor equipment parts, and in particular to a cleaning device applied to semiconductor equipment parts. Background Art

[0002] As the cornerstone of semiconductor manufacturing equipment, semiconductor equipment components play an irreplaceable and key role in core links such as chip manufacturing, packaging and testing. From the perspective of functional and structural segmentation, mechanical structural parts include wafer transfer arms, reaction chambers, etc., which provide stable physical space and motion support for semiconductor manufacturing. Their materials must have high strength and corrosion resistance to ensure high-precision operation in complex manufacturing environments. Optical components such as lithography machine lenses directly determine the accuracy of chip lithography. Semiconductor equipment components have extremely high requirements for cleanliness. Ultrasonic cleaning plays an indispensable role in this. It uses the cavitation effect generated by high-frequency sound waves to efficiently remove tiny particles, which is especially suitable for complex structures. At the same time, it reduces chemical residues and meets the ultra-high purity requirements of components in advanced processes.

[0003] A search revealed Chinese patent application number CN202323611507.4, which discloses a cleaning device for semiconductor equipment parts. The device comprises a cleaning box, an ultrasonic cleaning machine being provided at the lower end of one side of the cleaning box, a movably mounted accommodating screen frame within the inner cavity of the cleaning box, a support frame being welded to the lower end of the inner cavity of the cleaning box, the accommodating screen frame being placed on the support frame, a servo motor being fixedly mounted at the upper end of the other side of the cleaning box, and a transmission rod being mounted at the output end of the servo motor.

[0004] Although the above patent is equipped with a cleaning box, ultrasonic cleaning machine, containing mesh frame, gear, scraper plate, collection box and protective shell, after cleaning is completed, the gear on the transmission rod cooperates with the rack to drive the scraper plate to move to the left, so that the floating pollutants are discharged into the collection box through the overflow port, further facilitating the removal of semiconductor equipment components in the containing mesh frame and eliminating the trouble of secondary cleaning. The floating pollutants can be accumulated by the containing groove on the scraper plate, thereby ensuring the removal effect of the scraper plate. The scrapers in front and behind the scraper plate can also scrape the inner wall of the cleaning box, thereby reducing the floating pollutants adhering to the inner wall of the cleaning box, further ensuring the treatment of floating pollutants, and eliminating the trouble of manual cleaning. However, there are still the following deficiencies during use: 1. The device uses the scraper plate to push the floating objects for cleaning, which is cumbersome to operate, and the cleaning device lacks flexibility in floating object treatment and is difficult to adapt to the cleaning needs of different stages; 2. There is no recycling structure for the cleaning liquid, resulting in waste of resources and increased cleaning costs.

[0005] Therefore, there is an urgent need for a cleaning device for semiconductor equipment parts to solve the above problems. Summary of the Invention

[0006] The object of the present invention is to provide a cleaning device for semiconductor equipment parts to solve the problems raised in the above background technology.

[0007] In order to achieve the above-mentioned object of the invention, the present invention provides the following technical solutions:

[0008] A cleaning device for semiconductor equipment parts, comprising a cleaning box, wherein the outer wall of the cleaning box is fixedly connected to a base, the outer wall of the cleaning box is fixedly provided with a connecting groove, the outer wall of the cleaning box is fixedly connected to a collection box, and the inner wall of the collection box is fixedly connected to a guide block, and further comprising:

[0009] The mounting assembly includes a connecting plate symmetrically slidably connected to the outer wall of the collection box, a card slot is opened on the outer wall of the connecting plate, a connecting handle is fixedly connected to the outer wall of the connecting plate, a sealing mounting plate is fixedly connected to the outer wall of the connecting handle, and the outer wall of the sealing mounting plate is abutted against the outer wall of the collection box, the outer wall of the sealing mounting plate is fixedly connected to evenly distributed card plates, and the outer wall of the card plate is clamped with a filter plate;

[0010] A limiting assembly is provided on the outer wall of the collection box, and the limiting assembly cooperates with the installation assembly;

[0011] The regulating and cleaning component is arranged on the outer wall of the guide block.

[0012] As a preferred technical solution of the present application, the limiting assembly includes a guide rod symmetrically fixedly connected to the inner wall of the collection box, the outer wall of the guide rod is sleeved with a strong spring, and the strong spring is fixedly connected to the collection box, the outer wall of the guide rod is slidably connected with a clamping block, and the clamping block is fixedly connected to the strong spring, the outer wall of the clamping block is fixedly connected with a guide block, and the guide block is slidably connected to the collection box, the outer wall of the guide block is fixedly connected with a pressing plate, and the clamping block is slidably connected to the clamping slot.

[0013] As the preferred technical solution of the present application, the adjustment and cleaning assembly includes an adjustment screw A and an adjustment screw B rotatably connected to the outer wall of the guide block, the outer wall of the adjustment screw A is threadedly connected to a water level control plate, and the water level control plate is slidingly connected to the guide block, the outer wall of the adjustment screw B is threadedly connected to a return baffle, and the return baffle is slidingly connected to the guide block, and the return baffle and the outer wall of the water level control plate are both against the outer wall of the collection box.

[0014] As a preferred technical solution of the present application, the top walls of the adjusting screw A and the adjusting screw B are both fixedly connected with knobs, and the outer walls of the knobs are provided with anti-slip grooves.

[0015] As a preferred technical solution of the present application, an overflow groove is provided on the outer wall of the collection box, and a reflux groove is also provided on the outer wall of the collection box, and the reflux groove and the overflow groove are both connected to the connecting groove.

[0016] As a preferred technical solution of the present application, a honeycomb activated carbon plate is detachably connected between the collecting box and the guide block, and the inner wall of the collecting box is provided with evenly distributed ion exchange resin.

[0017] As a preferred technical solution of the present application, the outer wall of the guide block is fixedly connected with evenly distributed positioning blocks, and the positioning blocks are slidably connected to the filter plate.

[0018] As a preferred technical solution of the present application, a drainage pipe is fixedly connected to the outer wall of the cleaning box, and a valve is provided on the outer wall of the drainage pipe.

[0019] As a preferred technical solution of the present application, the inner wall of the cleaning box is fixedly connected to a support frame, and the top wall of the support frame is fixedly connected to a accommodating screen frame.

[0020] As a preferred technical solution of the present application, an ultrasonic cleaning machine is fixedly connected to the outer wall of the cleaning box for ultrasonic cleaning of semiconductor equipment parts.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] In the scheme of this application:

[0023] 1. The overflow chute enables the cleaning device to automatically discharge floating debris. The adjustable water level control plate and backflow baffle design enable the cleaning device to flexibly adapt to water level changes at different cleaning stages. In the early stages of cleaning, there are more pollutants on the surface of components and a large amount of floating debris is generated. The water level control plate can be raised to collect more floating debris. As the cleaning process progresses, the floating debris decreases, and the position of the water level control plate can be adjusted accordingly to accurately collect the remaining floating debris. This improves the flexibility and targeting of floating debris collection and ensures the stability of the cleaning effect. This solves the problem that the existing device uses a scraper plate to push and clean floating debris, which is cumbersome to operate and lacks flexibility in floating debris handling, making it difficult to adapt to the cleaning needs of different stages.

[0024] 2. The cleaning liquid is collected by the provided collection box and the pollutants in the cleaning liquid are effectively removed through the honeycomb activated carbon plate and ion exchange resin. After purification, the liquid is returned to the cleaning box through the reflux tank and the connecting tank for recycling, effectively avoiding the waste of cleaning liquid, greatly reducing the company's cost expenditure on cleaning liquid procurement, and also reducing water resource consumption. This is in line with the concept of sustainable development, bringing significant economic and environmental benefits to the company, and solving the problem of the lack of a recycling structure for cleaning liquid in the existing technology, resulting in resource waste and increased cleaning costs.

[0025] 3. By setting the filter plate and honeycomb activated carbon plate, combined with the quick-disassembly installation components, when the filter plate is blocked or the honeycomb activated carbon plate is saturated with adsorption, no complicated tools are required. Just press the pressing plate and pull the connecting handle to quickly disassemble the relevant parts for replacement or cleaning, which greatly reduces the difficulty and time of equipment maintenance, reduces equipment downtime, and ensures production continuity. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is one of the overall structural schematic diagrams of the cleaning device for semiconductor equipment parts provided in this application;

[0027] Figure 2 This is the second schematic diagram of the overall structure of the cleaning device for semiconductor equipment parts provided in this application;

[0028] Figure 3 A schematic diagram of the structure of the connecting groove portion of the cleaning device for semiconductor equipment parts provided in this application;

[0029] Figure 4 A schematic diagram of the structure of a collection box portion of a cleaning device for semiconductor equipment parts provided in this application;

[0030] Figure 5 A schematic diagram of the structure of the guide block portion of the cleaning device for semiconductor equipment parts provided in this application;

[0031] Figure 6 A schematic diagram of the structure of a sealing mounting plate portion of a cleaning device for semiconductor equipment components provided in this application;

[0032] Figure 7 A schematic diagram of the structure of the cardboard portion of the cleaning device for semiconductor equipment parts provided in this application;

[0033] Figure 8 A schematic diagram of the structure of a water level control panel of a cleaning device for semiconductor equipment components provided in this application;

[0034] Figure 9 A schematic diagram of the structure of the ion exchange resin portion of the cleaning device for semiconductor equipment parts provided in this application;

[0035] Figure 10 A schematic diagram of the structure of the guide rod portion of the cleaning device for semiconductor equipment parts provided in this application;

[0036] Figure 11 This is a schematic diagram of the structure of the strong spring portion of the cleaning device for semiconductor equipment parts provided in this application.

[0037] Indicated in the figure:

[0038] 1. Cleaning box; 2. Drain pipe; 3. Valve; 4. Base; 5. Support frame; 6. Receiver frame; 7. Ultrasonic cleaning machine; 8. Connecting trough; 9. Collecting box; 10. Overflow trough; 11. Backflow trough; 12. Connecting handle; 13. Connecting plate; 14. Sealing mounting plate; 15. Guide block; 16. Adjusting screw A; 17. Knob; 18. Water level control board; 19. Card plate; 20. Filter plate; 21. Card slot; 22. Backflow baffle; 23. Adjusting screw B; 24. Ion exchange resin; 25. Honeycomb activated carbon plate; 26. Positioning block; 27. Guide rod; 28. Strong spring; 29. ​​Card block; 30. Guide block; 31. Pressing plate. DETAILED DESCRIPTION

[0039] To make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them.

[0040] like Figure 1-11 As shown, the present embodiment proposes a cleaning device for semiconductor equipment parts, including a cleaning box 1, a base 4 fixedly connected to the outer wall of the cleaning box 1, a connecting groove 8 fixedly opened on the outer wall of the cleaning box 1, a collection box 9 fixedly connected to the outer wall of the cleaning box 1, and a guide block 15 fixedly connected to the inner wall of the collection box 9, and further comprising:

[0041] The installation assembly includes a connecting plate 13 symmetrically slidably connected to the outer wall of the collection box 9, a card slot 21 is opened on the outer wall of the connecting plate 13, a connecting handle 12 is fixedly connected to the outer wall of the connecting handle 12, and a sealing mounting plate 14 is fixedly connected to the outer wall of the sealing mounting plate 14, and the outer wall of the sealing mounting plate 14 is against the outer wall of the collection box 9, and the outer wall of the sealing mounting plate 14 is fixedly connected to the evenly distributed card plates 19, and the outer wall of the card plate 19 is clamped with a filter plate 20, and the filter plate 20 is clamped on the card plate 19, which is convenient for disassembly, maintenance or replacement following the sealing mounting plate 14. The joints between the sealing mounting plate 14, the water level control plate 18 and the backflow baffle 22 are all sealed to prevent side leakage of the cleaning liquid;

[0042] The limiting assembly is arranged on the outer wall of the collection box 9, and the limiting assembly cooperates with the installation assembly;

[0043] The regulating and cleaning component is arranged on the outer wall of the guide block 15 .

[0044] like Figure 10-11As shown, as a preferred embodiment, on the basis of the above-mentioned method, further, the limiting component includes a guide rod 27 symmetrically fixedly connected to the inner wall of the collection box 9, the outer wall of the guide rod 27 is provided with a strong spring 28, and the strong spring 28 is fixedly connected to the collection box 9, the outer wall of the guide rod 27 is slidably connected to a card block 29, and the card block 29 is fixedly connected to the strong spring 28, the outer wall of the card block 29 is fixedly connected to a guide block 30, and the guide block 30 is slidably connected to the collection box 9, the outer wall of the guide block 30 is fixedly connected to a pressing plate 31, and the card block 29 is slidably connected to the card slot 21. When the filter plate 20 needs to be cleaned or replaced, the pressing plate 31 fixedly connected to the outer wall of the guide block 30 is pressed. The guide block 30 drives the card block 29 to slide along the guide rod 27, compressing the strong spring 28, so that the card block 29 is disengaged from the card slot 21 on the outer wall of the connecting plate 13. At this time, the connecting handle 12 is pulled to drive the connecting plate 13, the sealing mounting plate 14 and the filter plate 20 to slide out from the outer wall of the collection box 9. The filter plate 20 can be maintained. After the maintenance is completed, the reverse operation can be performed to reinstall it.

[0045] like Figure 8 As shown, as a preferred embodiment, on the basis of the above-mentioned method, further, the adjustment and cleaning assembly includes an adjusting screw A16 and an adjusting screw B23 rotatably connected to the outer wall of the guide block 15, the outer wall of the adjusting screw A16 is threadedly connected to the water level control plate 18, and the water level control plate 18 is slidably connected to the guide block 15, the outer wall of the adjusting screw B23 is threadedly connected to the return baffle 22, and the return baffle 22 is slidably connected to the guide block 15, the return baffle 22 and the outer wall of the water level control plate 18 are both against the outer wall of the collection box 9, and are fixedly connected by rotating the top wall of the adjusting screw A16. The knob 17 connected to the water level control plate 18 and the adjusting screw A16 rotate on the outer wall of the guide block 15. Since the water level control plate 18 is threadedly connected to the adjusting screw A16 and is slidingly connected to the guide block 15, the water level control plate 18 will slide up and down along the guide block 15 as the adjusting screw A16 rotates. Similarly, by rotating the knob 17 on the top wall of the adjusting screw B23, the return flow baffle 22 can be controlled to slide on the guide block 15. In this way, the positions of the water level control plate 18 and the return flow baffle 22 can be freely adjusted according to actual cleaning needs, thereby cleaning floating objects at different water levels and ensuring that floating objects can be fully collected.

[0046] like Figure 8As shown, as a preferred embodiment, on the basis of the above method, further, the top walls of the adjusting screw A16 and the adjusting screw B23 are fixedly connected with a knob 17, and the outer wall of the knob 17 is provided with an anti-slip groove. The knob 17 is rotated to drive the adjusting screw A16 or the adjusting screw B23 to rotate, and the position of the water level control plate 18 is adjusted by the threaded cooperation between the adjusting screw A16 and the water level control plate 18 to adapt to the automatic discharge of floating objects at different water levels. The position of the reflux baffle 22 is adjusted by the threaded cooperation between the adjusting screw B23 and the reflux baffle 22, and then the reflux groove 11 is opened to facilitate the recovery and use of the treated cleaning liquid.

[0047] like Figure 4 As shown, as a preferred embodiment, on the basis of the above-mentioned method, an overflow groove 10 is further provided on the outer wall of the collection box 9, and a reflux groove 11 is further provided on the outer wall of the collection box 9, and the reflux groove 11 and the overflow groove 10 are both connected to the connecting groove 8. During the ultrasonic cleaning process, the floating objects generated by cleaning flow with the cleaning liquid, pass through the connecting groove 8 fixed on the outer wall of the cleaning box 1, and automatically flow into the collection box 9 through the overflow groove 10 on the outer wall of the collection box 9. By utilizing the natural flow of the cleaning liquid, the floating objects can be transferred from the cleaning box 1 to the collection box 9 without additional power, and automatic collection is achieved. The cleaning liquid after filtration and purification, under the guidance of the guide block 15, passes through the reflux groove 11 on the outer wall of the collection box 9, and then flows back into the cleaning box 1 through the connecting groove 8. In this way, the cleaning liquid can be reused, which effectively saves cleaning liquid resources and reduces production costs while ensuring the cleaning effect.

[0048] like Figure 9 As shown, as a preferred embodiment, on the basis of the above method, a honeycomb activated carbon plate 25 is further detachably connected between the collecting box 9 and the guide block 15, and an evenly distributed ion exchange resin 24 is provided on the inner wall of the collecting box 9. When floating objects and cleaning liquid enter the collecting box 9, the filter plate 20 plays an interception role to block the floating objects. At the same time, the ion exchange resin 24 will undergo ion exchange reaction with impurities such as metal ions in the cleaning liquid to remove harmful ions. The honeycomb activated carbon plate 25, with its rich pore structure and huge specific surface area, adsorbs and purifies organic pollutants, odors, etc. in the cleaning liquid, so that the cleaning liquid is further purified.

[0049] like Figure 9 As shown, as a preferred embodiment, on the basis of the above method, further, the outer wall of the guide block 15 is fixedly connected with evenly distributed positioning blocks 26, and the positioning blocks 26 are slidingly connected to the filter plate 20, and the positioning blocks 26 cooperate with the clamping plate 19 to realize the clamping positioning of the filter plate 20.

[0050] like Figure 3As shown, as a preferred embodiment, on the basis of the above method, further, the outer wall of the cleaning box 1 is fixedly connected to a drain pipe 2, and a valve 3 is provided on the outer wall of the drain pipe 2. After the cleaning box 1 is used, the drain pipe 2 can be opened by turning the handle of the valve 3, thereby realizing the discharge of the cleaning liquid in the cleaning box 1.

[0051] like Figure 1 As shown, as a preferred embodiment, on the basis of the above method, further, the inner wall of the cleaning box 1 is fixedly connected to a support frame 5, and the top wall of the support frame 5 is fixedly connected to a containing mesh frame 6, which is a mesh structure to facilitate full contact between the cleaning liquid and the semiconductor equipment components.

[0052] like Figure 2 As shown, as a preferred embodiment, on the basis of the above method, an ultrasonic cleaning machine 7 is further fixedly connected to the outer wall of the cleaning box 1 for ultrasonic cleaning of semiconductor equipment parts. The ultrasonic cleaning machine 7 emits high-frequency vibrations to generate countless tiny cavitation bubbles in the cleaning liquid. The powerful impact force generated at the moment of bursting of these bubbles can effectively peel off stains, impurities and other pollutants attached to the surface of semiconductor parts, thereby achieving preliminary cleaning.

[0053] Specifically, when the cleaning device for semiconductor equipment parts is used: the semiconductor equipment parts are placed in the receiving net frame 6, and the ultrasonic cleaning machine 7 is started. The ultrasonic cleaning machine 7 emits high-frequency vibrations to generate countless tiny cavitation bubbles in the cleaning liquid. The powerful impact force generated at the moment of the bubble bursting can effectively peel off the stains, impurities and other pollutants attached to the surface of the semiconductor parts, thereby achieving preliminary cleaning; during the ultrasonic cleaning process, the floating objects generated by the cleaning flow with the cleaning liquid, through the connecting groove 8 fixedly opened on the outer wall of the cleaning box 1, and through the overflow groove 10 on the outer wall of the collecting box 9, and automatically flow into the collecting box 9, utilizing the natural flow of the cleaning liquid, without the need for With the additional power, the floating objects can be transferred from the cleaning box 1 to the collection box 9 for automatic collection. By turning the knob 17 fixed to the top wall of the adjusting screw A16, the adjusting screw A16 rotates on the outer wall of the guide block 15. Since the water level control plate 18 is threadedly connected to the adjusting screw A16 and is slidably connected to the guide block 15, the water level control plate 18 will slide up and down along the guide block 15 as the adjusting screw A16 rotates. Similarly, by turning the knob 17 on the top wall of the adjusting screw B23, the return baffle 22 can be controlled to slide on the guide block 15. In this way, the positions of the water level control plate 18 and the return baffle 22 can be freely adjusted according to actual cleaning needs, thereby cleaning water at different water levels. Floating objects ensure that the floating objects can be fully collected; when the floating objects and the cleaning liquid enter the collection box 9, the filter plate 20 plays an intercepting role to block the floating objects. At the same time, the ion exchange resin 24 will react with the metal ions and other impurities in the cleaning liquid to exchange ions and remove harmful ions; the honeycomb activated carbon plate 25 detachably connected between the collection box 9 and the guide block 15, with its rich pore structure and huge specific surface area, adsorbs and purifies the organic pollutants, odors, etc. in the cleaning liquid, so that the cleaning liquid is further purified; the cleaning liquid after filtration and purification, under the guidance of the guide block 15, passes through the reflux groove 11 on the outer wall of the collection box 9, and then re-circulates through the connecting groove 8. The new liquid flows back into the cleaning box 1. In this way, the cleaning liquid can be reused. While ensuring the cleaning effect, it effectively saves cleaning liquid resources and reduces production costs. When the filter plate 20 needs to be cleaned or replaced, the pressing plate 31 fixedly connected to the outer wall of the guide block 30 is pressed. The guide block 30 drives the card block 29 to slide along the guide rod 27, compressing the strong spring 28, so that the card block 29 is disengaged from the card groove 21 on the outer wall of the connecting plate 13. At this time, the connecting handle 12 is pulled to drive the connecting plate 13, the sealing mounting plate 14 and the filter plate 20 to slide out from the outer wall of the collection box 9. The filter plate 20 can be maintained. After the maintenance is completed, the reverse operation can be performed to reinstall it.

[0054] The above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. Although this specification has described the present invention in detail with reference to the above embodiments, the present invention is not limited to the above specific implementation methods. Therefore, any modification or equivalent replacement of the present invention; and all technical solutions and improvements thereof that do not depart from the spirit and scope of the invention are included in the scope of the claims of the present invention.

Claims

1. A cleaning device for semiconductor equipment parts, comprising a cleaning box (1), characterized in that: The outer wall of the cleaning box (1) is fixedly connected to a base (4), the outer wall of the cleaning box (1) is fixedly provided with a communication groove (8), the outer wall of the cleaning box (1) is fixedly connected to a collection box (9), the inner wall of the collection box (9) is fixedly connected to a guide block (15), and further comprises: An installation assembly, the installation assembly comprising a connecting plate (13) symmetrically slidably connected to the outer wall of the collection box (9), the outer wall of the connecting plate (13) being provided with a card slot (21), the outer wall of the connecting plate (13) being fixedly connected to a connecting handle (12), the outer wall of the connecting handle (12) being fixedly connected to a sealing installation plate (14), and the outer wall of the sealing installation plate (14) being in contact with the outer wall of the collection box (9), the outer wall of the sealing installation plate (14) being fixedly connected to evenly distributed card plates (19), and the outer wall of the card plate (19) being carded with a filter plate (20); A limiting assembly is provided on the outer wall of the collection box (9), and the limiting assembly cooperates with the installation assembly; The regulating and cleaning component is arranged on the outer wall of the guide block (15).

2. A cleaning device for semiconductor equipment parts according to claim 1, characterized in that: The limiting assembly includes a guide rod (27) symmetrically fixedly connected to the inner wall of the collection box (9), the outer wall of the guide rod (27) is provided with a strong spring (28), and the strong spring (28) is fixedly connected to the collection box (9), the outer wall of the guide rod (27) is slidably connected to a clamping block (29), and the clamping block (29) is fixedly connected to the strong spring (28), the outer wall of the clamping block (29) is fixedly connected to a guide block (30), and the guide block (30) is slidably connected to the collection box (9), the outer wall of the guide block (30) is fixedly connected to a pressing plate (31), and the clamping block (29) is slidably connected to the clamping slot (21).

3. The cleaning device for semiconductor equipment parts according to claim 1, characterized in that: The regulating and cleaning assembly comprises an regulating screw A (16) and an regulating screw B (23) which are rotatably connected to the outer wall of the guide block (15); the outer wall of the regulating screw A (16) is threadedly connected to a water level control plate (18), and the water level control plate (18) is slidably connected to the guide block (15); the outer wall of the regulating screw B (23) is threadedly connected to a return baffle (22), and the return baffle (22) is slidably connected to the guide block (15); the outer wall of the return baffle (22) and the water level control plate (18) are both against the outer wall of the collection box (9).

4. The cleaning device for semiconductor equipment parts according to claim 3, characterized in that: The top walls of the adjusting screw rod A (16) and the adjusting screw rod B (23) are both fixedly connected with a knob (17), and the outer wall of the knob (17) is provided with anti-slip grooves.

5. The cleaning device for semiconductor equipment parts according to claim 1, characterized in that: An overflow groove (10) is provided on the outer wall of the collection box (9), and a reflux groove (11) is also provided on the outer wall of the collection box (9), and both the reflux groove (11) and the overflow groove (10) are connected to the communication groove (8).

6. The cleaning device for semiconductor equipment parts according to claim 1, characterized in that: A honeycomb activated carbon plate (25) is detachably connected between the collecting box (9) and the guide block (15), and an inner wall of the collecting box (9) is provided with evenly distributed ion exchange resin (24).

7. The cleaning device for semiconductor equipment parts according to claim 1, characterized in that: The outer wall of the guide block (15) is fixedly connected with evenly distributed positioning blocks (26), and the positioning blocks (26) are slidably connected to the filter plate (20).

8. The cleaning device for semiconductor equipment parts according to claim 1, characterized in that: The outer wall of the cleaning box (1) is fixedly connected to a drainage pipe (2), and the outer wall of the drainage pipe (2) is provided with a valve (3).

9. The cleaning device for semiconductor equipment parts according to claim 1, characterized in that: The inner wall of the cleaning box (1) is fixedly connected to a support frame (5), and the top wall of the support frame (5) is fixedly connected to a accommodating screen frame (6).

10. The cleaning device for semiconductor equipment parts according to claim 1, characterized in that: An ultrasonic cleaning machine (7) is fixedly connected to the outer wall of the cleaning box (1) and is used for ultrasonic cleaning of semiconductor equipment parts.

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