A laser drilling method, system, control device and readable storage medium

Abstract

The application discloses a laser drilling method, system, control device and readable storage medium, and relates to the technical field of circuit board processing. The laser drilling method comprises the following steps: identifying the material of the surface layer of a drilling area; determining a laser light source according to the material of the surface layer of the drilling area; configuring and exciting the laser light source to irradiate the drilling area; adjusting the energy of the excited laser light source according to the surface layer temperature of the drilling area, and exciting the laser light source to irradiate the drilling area with the adjusted energy until the material of the surface layer of the drilling area is removed. Through the implementation of the laser drilling method, system, control device and readable storage medium provided in the application, the metal layer can be processed by using ultraviolet laser, and the substrate layer can be processed by using carbon dioxide laser; and the energy of the excited laser light source can be adjusted according to the temperature of the surface layer of the drilling area during the drilling process, so that the surface layer of the drilling area cannot be overheated, the hole wall is smooth, the carbonization of the substrate of the drilling area can be avoided, and the drilling yield is improved.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a laser drilling method, system, control device and readable storage medium. Background Technology

[0002] In the field of printed circuit board (PCB) manufacturing, laser drilling is a commonly used method. It primarily relies on a single-wavelength laser outputting a fixed-energy laser to irradiate the PCB, removing the substrate and metal. However, the effectiveness of single-wavelength lasers in removing substrate and metal varies greatly. For carbon dioxide lasers, they are effective at removing substrate, but metals strongly reflect carbon dioxide laser light. For ultraviolet lasers, they are effective at removing metal, but the high temperatures generated during substrate removal can cause defects in the PCB substrate, affecting the physical and electrical properties of the PCB and resulting in low PCB processing yield. Furthermore, using fixed-energy laser pulses for drilling makes it difficult to control the localized temperature rise in the drilling area, degrading PCB performance. Summary of the Invention

[0003] This application provides a laser drilling method, system, control device, and readable storage medium, which at least solves the problem of low circuit board yield caused by using a single-wavelength laser with fixed output energy for drilling printed circuit boards.

[0004] In a first aspect, this application provides a laser drilling method and a control device applied to a laser drilling system. The laser drilling system includes a replaceable laser source. The control device controls the replaceable laser source to drill a drilling area on a circuit board to be drilled to a target depth from a drilling direction. The circuit board to be drilled includes metal and a substrate. The replaceable laser source includes at least two laser sources. The drilling direction is along the optical axis of the replaceable laser source from the replaceable laser source to the circuit board to be drilled.

[0005] Laser drilling methods include:

[0006] Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by a replaceable laser light source;

[0007] The laser source is determined based on the material of the surface layer in the drilling area;

[0008] Configure and activate the laser source to illuminate the drilling area;

[0009] The energy of the excitation laser source is adjusted according to the surface temperature of the drilling area, and the adjusted energy is used to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed.

[0010] Secondly, this application also provides a laser drilling system, which includes: a control device and a replaceable laser light source. The control device controls the replaceable laser light source to drill to a target depth in the drilling area of ​​the circuit board to be drilled from the drilling direction. The circuit board to be drilled includes metal and a substrate. The replaceable laser light source includes at least two laser light sources. The drilling direction is along the optical axis of the replaceable laser light source from the replaceable laser light source to the circuit board to be drilled.

[0011] The control device is configured as follows:

[0012] Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by a replaceable laser light source;

[0013] The laser source is determined based on the material of the surface layer in the drilling area;

[0014] Configure and activate the laser source to illuminate the drilling area;

[0015] The energy of the excitation laser source is adjusted according to the surface temperature of the drilling area, and the adjusted energy is used to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed.

[0016] Thirdly, this application also provides a control device, including a memory, a processor, and a laser drilling program stored in the memory and executable on the processor. When the processor executes the laser drilling program, it implements the laser drilling method described in the first aspect, including:

[0017] Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by a replaceable laser light source;

[0018] The laser source is determined based on the material of the surface layer in the drilling area;

[0019] Configure and activate the laser source to illuminate the drilling area;

[0020] The energy of the excitation laser source is adjusted according to the surface temperature of the drilling area, and the adjusted energy is used to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed.

[0021] Fourthly, this application also provides a computer-readable storage medium storing a laser drilling program thereon. When the laser drilling program is executed by a processor, it implements the laser drilling method described in the first aspect, including:

[0022] Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by a replaceable laser light source;

[0023] The laser source is determined based on the material of the surface layer in the drilling area;

[0024] Configure and activate the laser source to illuminate the drilling area;

[0025] The energy of the excitation laser source is adjusted according to the surface temperature of the drilling area, and the adjusted energy is used to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed.

[0026] Fifthly, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the laser drilling method described in the first aspect, including:

[0027] Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by a replaceable laser light source;

[0028] The laser source is determined based on the material of the surface layer in the drilling area;

[0029] Configure and activate the laser source to illuminate the drilling area;

[0030] The energy of the excitation laser source is adjusted according to the surface temperature of the drilling area, and the adjusted energy is used to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed.

[0031] The beneficial effects of the technical solution provided in this application are as follows: By implementing the laser drilling method, system, control device, and readable storage medium provided in this application, a laser drilling system with a replaceable laser light source can be used to drill circuit boards. When drilling, the laser light source can be switched according to the material of the hole surface layer; ultraviolet laser can be used to process the metal layer, and carbon dioxide laser can be used to process the substrate layer. This simplifies the laser drilling process and improves the drilling yield of circuit boards.

[0032] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser source is adjusted according to the temperature of the surface layer of the drilling area. This ensures that the surface layer of the drilling area does not overheat, the hole wall is smooth, and carbonization of the substrate in the drilling area is avoided, thereby improving the drilling yield. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of a laser drilling method provided in an embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the surface of the drilling area provided in an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of drilling a hole in a circuit board using a laser drilling system, provided in an embodiment of this application.

[0037] Figure 4 This is a schematic diagram of a control device provided in an embodiment of this application. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0039] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The numbers in the accompanying drawings are only used to distinguish individual functional parts or modules and do not indicate logical relationships between parts or modules. The terms “comprising,” “including,” or “including,” and similar terms mean that the element or object preceding the term encompasses the element or object listed following the term and its equivalents, without excluding other elements or objects. The terms “connected,” “linked,” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. “Above,” “below,” “left,” “right,” etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0040] The various embodiments according to this disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that in the drawings, the same reference numerals are assigned to components having substantially the same or similar structure and function, and repeated descriptions of them will be omitted.

[0041] To address the problem of low circuit board yield caused by using a single-wavelength laser with fixed output energy for drilling holes in printed circuit boards in existing technologies, this application provides the following implementation method:

[0042] In some embodiments, such as Figure 1As shown, a laser drilling method is applied to a control device in a laser drilling system. The laser drilling system includes a replaceable laser source. The control device controls the replaceable laser source to drill to a target depth in the drilling area of ​​the circuit board to be drilled from the drilling direction. The circuit board to be drilled includes metal and a substrate. The replaceable laser source includes at least two laser sources. The drilling direction is along the optical axis of the replaceable laser source from the replaceable laser source to the circuit board to be drilled.

[0043] Laser drilling methods include:

[0044] S100: Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by a replaceable laser light source;

[0045] S200: The laser source is determined based on the material of the surface layer of the drilling area;

[0046] S300: Configures and activates a laser source to illuminate the drilled area;

[0047] S400: Adjusts the energy of the excitation laser source according to the surface temperature of the drilling area, and uses the adjusted energy to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed.

[0048] The circuit board to be drilled in this application is preferably a printed circuit board. The circuit board to be drilled has a layered structure, typically a repeated stacking structure of metal layers and substrate layers. The metal layer is preferably made of copper; the substrate layer is preferably made of FR4 resin. FR4 resin is a composite material with epoxy resin as the matrix and glass fiber cloth as the reinforcing material. Preferably, a flame retardant (usually a bromide) is also added to the FR4 resin.

[0049] The target depth, for blind vias, is the distance from the bottom of the hole to the surface of the hole, and can also be expressed as the sum of the number of metal layers and substrate layers removed; for through vias, there is no bottom, and the target depth is the circuit board thickness.

[0050] The laser drilling system disclosed in this application may be a multi-wavelength laser with a replaceable laser source. The replaceable laser source includes at least two laser sources: a first laser source and a second laser source. The first laser source is used to drill holes in the metal of the circuit board to be drilled; the second laser source is used to drill holes in the substrate of the circuit board to be drilled.

[0051] Schematic illustration: The first laser source is an ultraviolet (UV) laser. UV lasers typically have an output wavelength of 355nm, suitable for drilling holes in the metal layers of circuit boards. However, its efficiency is low when penetrating substrate layers thicker than 150μm, and it easily creates a heat-affected zone (HAZ) near the drilling area, affecting the electrical performance of the circuit board, degrading the substrate performance, and increasing the difficulty and cost of subsequent processes. For example, it can carbonize low thermal stability media (substrate, such as FR4 resin); increase hole wall roughness, making the electroplating metallization process more difficult; and easily form gaps between hole walls, allowing electroplated copper to enter the substrate layer, affecting the electrical performance of the circuit board. The second laser source is a carbon dioxide (CO2) laser. CO2 lasers typically have an output wavelength of 10.6μm, very suitable for drilling holes in the substrate layers of circuit boards, but it has high reflectivity in the metal layers of the circuit board, especially for copper foil, where the reflectivity can reach over 90%. Therefore, using a carbon dioxide laser as a single light source to drill holes in circuit boards requires etching copper foil, which is a complex process.

[0052] When using a laser drilling system with a replaceable laser source, the laser source can be switched according to the material of the hole surface layer during the drilling process of circuit boards. Ultraviolet lasers are used to process the metal layer, and carbon dioxide lasers are used to process the substrate layer, which simplifies the process and improves the drilling yield of circuit boards.

[0053] The drilling area refers to the area where a hole is machined by the laser drilling system. The surface layer of the drilling area refers to the layered material closest to the laser drilling system at that hole. For example... Figure 2 As shown, the material on the surface of the drilled area changes as the laser drilling process proceeds, such as... Figure 2 As shown in section (a), at the beginning of laser drilling, the surface of the drilling area is a substrate; as Figure 2 As shown in section (b), when the substrate layer is removed, the surface layer of the drilled area is metal; as Figure 2 As shown in section (c), when the metal layer is removed, the surface of the drilled area is another substrate layer.

[0054] Since both the metal layer and the substrate layer have a certain thickness, removing the material from the surface layer of the drilled area typically requires one or more laser pulses to irradiate the drilled area, removing a portion of the material each time until the entire layer is removed. The laser source is excited in pulses. For example, for the substrate layer, approximately 20 laser pulses are used, with a single laser pulse energy density of 1-5 joules / cm² and a pulse duration of 50-200 nanoseconds.

[0055] While removing the surface layer of the drilling area layer by layer, it is necessary to monitor the temperature of the surface layer in real time and adjust the energy of the excitation laser source according to the temperature. Typically, the substrate of the circuit board (FR4 resin) will carbonize when the temperature exceeds 200℃, resulting in rough hole walls or cracks, affecting the electrical performance of the circuit board. Adjusting the energy of the excitation laser source in real time based on temperature feedback ensures that the surface layer of the drilling area does not overheat, the hole walls are smooth, and carbonization of the substrate in the drilling area is avoided.

[0056] Specifically, S100: Identifies the material of the surface layer of the drilled area, including:

[0057] S110: Activate the illumination source in the laser drilling system to illuminate the drilling area;

[0058] S120: Acquire images of the drilling area using the image acquisition device in the laser drilling system;

[0059] S130: Preprocess the borehole area image to enhance the surface features of the borehole area;

[0060] S140: Extract feature parameters corresponding to surface features;

[0061] S150: Call the material identification model and determine the material of the surface layer of the borehole area based on the feature parameters of the surface features.

[0062] Using a light source to evenly illuminate the drilling area can reduce the influence of interference factors such as shadows and reflected light, which is beneficial for image acquisition equipment to capture clear images of the surface of the drilling area.

[0063] Indicatively, the image acquisition device can be a high-resolution industrial camera. The acquired images of the drilled area primarily express visual information such as the color, texture, and gloss of the surface layer. This visual information can be converted into digital images for subsequent material identification.

[0064] Preprocessing the drilled area image can remove noise and enhance contrast to highlight the surface features of the drilled area. Region of Interest (ROI) extraction is then used to precisely separate the surface image of the drilled area. Surface feature parameters include at least hue, saturation, value, and texture features. Typically, metallic copper exhibits an orange-red metallic luster and a relatively smooth surface texture; while FR4 resin, the substrate, is mostly green or brown with a glass fiber woven texture. Using an HSV (Hue, Saturation, Value) histogram, the surface color of the drilled area can be further analyzed; local binary mode (LBP) or gray-level co-occurrence matrix (GLCM) can be used to extract corresponding texture features to identify the corresponding materials.

[0065] The material identification model can determine the material type based on the feature parameters of surface features. This application does not limit the specific algorithm for material identification.

[0066] Preferably, S100: Before identifying the material of the surface layer of the drilled area, the method further includes:

[0067] S010: Turn off the ambient light source in the laser drilling system;

[0068] S020: Place a reflectivity calibration plate on the support platform of the circuit board to be drilled, so that the surface of the reflectivity calibration plate is flush with the surface of the circuit board to be drilled.

[0069] S030: Start the lighting source and run it continuously for the preset lighting time to allow the lighting source to reach thermal equilibrium.

[0070] S040: Control the image acquisition device to acquire images of the reflectivity calibration plate under illumination from the lighting source, and obtain an image of the illumination field distribution;

[0071] S050: Based on the illumination field distribution image, adjust the illumination parameters of the illumination source to ensure that the illumination source evenly illuminates the circuit board to be drilled.

[0072] The above process allows for the calibration of the illumination source in the laser drilling system. To ensure the accuracy of the illumination source calibration, it should be performed with ambient light sources off to eliminate the influence of interfering sources. The reflectivity calibration plate is preferably a standard reflectivity calibration plate, which can be a white diffuse reflective plate or a neutral gray plate with known reflectivity characteristics. The reflectivity calibration plate provides known and stable optical reflectivity characteristics, serving as a benchmark for measuring illumination uniformity and intensity, and is the foundation for quantitative calibration. Starting the illumination source and continuously running it for a preset illumination time allows it to reach thermal equilibrium, preventing the output spectrum and light intensity from drifting with temperature changes, ensuring the repeatability and reliability of the calibration. The preset illumination time can be set to 5-10 minutes. The illumination field distribution image reflects the brightness distribution within the illumination area. Whether there are dark corners, overly bright areas, etc., can be identified based on the illumination field distribution image, allowing for adjustments to the illumination parameters. Illumination parameters can include the position and angle of the illumination source, the driving current of the illumination source, etc. Adjusting the illumination parameters based on the illumination field distribution image is an iterative optimization process; through multiple measurements and adjustments, the consistency of illumination from the illumination source is achieved.

[0073] The laser source includes: a first laser source and a second laser source. S200: The laser source is determined based on the material of the surface layer of the drilling area, including:

[0074] S210a: In response to the identification that the material of the surface layer of the drilling area is metal, the first laser source is used as the laser source;

[0075] S210b: In response to the identification that the material on the surface of the drilled area is a substrate, the second laser source is used as the laser source.

[0076] Preferably, S200: After determining the laser source based on the material of the surface layer of the drilling area, the process further includes:

[0077] S221: Obtain the alignment mark on the circuit board to be drilled, and compare the alignment mark with the positioning mark of the laser drilling system to determine the actual offset between the circuit board to be drilled and the support platform.

[0078] S222: Based on the actual offset, correct the coordinate system of the laser drilling system to make the coordinate system associated with the actual position of the circuit board to be drilled;

[0079] S223: Determine the location of the drilling area based on the drilling process documents;

[0080] S224: Move the replaceable laser light source so that it is aligned with the drilling area.

[0081] The actual offset between the circuit board to be drilled and the support platform was used to establish a relationship between the circuit board to be drilled and the positioning system of the laser drilling system. During the drilling process, the position of the circuit board to be drilled was aligned with the position in the laser drilling system's table. Even after changing the laser source, the same hole can still be precisely machined.

[0082] The laser source is the first laser source, S300: The laser source is configured and excited to irradiate the drilling area, including:

[0083] S330a: The initial energy of the first laser source is configured as the first initial energy;

[0084] S340a: Configure the initial pulse interval of the first laser source as the first initial pulse interval;

[0085] S350a: Excites a first laser source with a beam size, a first initial energy, and a first initial pulse interval to irradiate the drilling area.

[0086] The laser source is a second laser source, S300: This involves configuring and exciting the laser source to irradiate the drilling area, including:

[0087] S330b: The initial energy of the second laser source is configured as the second initial energy;

[0088] S340b: Configure the initial pulse interval of the second laser source as the second initial pulse interval;

[0089] S350b: Excites a second laser source with a beam size, a second initial energy, and a second initial pulse interval to irradiate the borehole area.

[0090] For the ultraviolet laser used as the first laser source, the initial energy can be set to 8 joules per square centimeter, the pulse duration can be set to the nanosecond level, and the initial pulse interval can be set according to temperature rise statistics, which is not limited here.

[0091] For the carbon dioxide laser used as the second laser source, the second initial energy can be set to 3 joules / square centimeter, its pulse duration can be set to the nanosecond level, and the second initial pulse interval can be set according to temperature rise statistics, which is not limited here.

[0092] Preferably, S300: before illuminating the drilling area with a configured and excited laser light source, the process further includes:

[0093] S310: Obtain the dimensions of the drilling area;

[0094] S320: Adjust the beam size of the laser source according to the size of the drilling area.

[0095] Preferably, adjusting the beam size of the laser source includes:

[0096] S321: Determine the laser spot diameter based on the size of the drilling area;

[0097] S322: Determine the laser spot diameter based on: d=K·λ·f / D, where λ represents the laser wavelength, f represents the focal length of the laser, D represents the diameter of the beam incident on the scanning lens, d represents the focused spot diameter, i.e., the laser spot diameter, and K represents a constant.

[0098] S323: Adjust the beam expander so that the diameter of the laser beam on the surface of the drilling area is equal to the diameter of the laser spot.

[0099] The scanning lens in a laser is a crucial optical component used to precisely focus the laser beam onto a flat working plane, while working in conjunction with the galvanometer system to achieve rapid, large-area laser scanning.

[0100] The aperture of a hole obtained by laser drilling is closely related to the diameter of the focused spot, but there are slight differences. Typically, the diameter of the focused spot (d) is used to characterize the aperture of the hole obtained by laser drilling. In most cases, the aperture will be larger than the diameter of the focused spot. The diameter of the focused spot can be likened to a very hot nail tip with a diameter of 0.5 mm. If this nail tip is used to burn a hole in paper, and if the burning is prolonged or the nail becomes very hot, the scorch mark on the paper will spread to a width of 1 mm. This scorch mark is analogous to the "aperture," and it is larger than the nail tip analogous to the "diameter of the focused spot."

[0101] Each material has a minimum energy density threshold that initiates ablation or melting, and the focused spot diameter *d* determines the energy density distribution. Most of the laser pulse's energy is concentrated within the region defined by the spot diameter *d*, and only areas with energy densities exceeding the material's threshold can effectively remove the material. Since laser energy typically exhibits a Gaussian distribution (highest energy at the center, decreasing towards the edges), only a small portion at the center of the spot reaches the effective ablation threshold. The diameter of the ultimately removed material region (i.e., the aperture) is the area defined by the intersection of the energy density profile and the material threshold, and this area is almost always greater than *d*.

[0102] There are also differences in the processing of single-pulse and multi-pulse pulses:

[0103] Single-pulse drilling produces holes with a diameter closest to the focused spot size, but still slightly larger due to pulse energy distribution and thermal effects. This method is commonly used for high-quality, high-precision micro-hole machining. Multi-pulse drilling (spiral / circular cutting), on the other hand, uses a galvanometer to control the beam to scan multiple times along a circular path, gradually "hollowing out" the material. This method can produce holes much larger than the focused spot diameter. The hole diameter is determined by the diameter of the scanning path, while the spot diameter determines the edge quality and precision of the machining; a smaller spot can produce larger, finer, and smoother holes.

[0104] Preferably, adjusting the energy of the laser source according to the surface temperature of the drilling area includes:

[0105] S410: Obtain the surface temperature of the borehole area;

[0106] S420: In response to the surface temperature of the drilling area exceeding the temperature threshold, the energy of the current laser source is reduced by a first preset amount and used as the energy of the laser source for the next pulse.

[0107] S430: If the energy of the laser source in response to the next pulse is less than or equal to the energy density threshold, then the energy density threshold shall be used as the energy of the laser source in the next pulse.

[0108] Preferably, the method further includes:

[0109] If the material on the surface of the drilling area is not completely removed within a preset number of pulses, the energy of the current laser source is increased by a second preset amount and used as the energy of the laser source for the next pulse.

[0110] The pulse interval of the laser source is adjusted according to the surface temperature of the drilling area to keep the surface temperature of the drilling area within the temperature threshold.

[0111] For adjusting the energy of the excitation laser source, before each excitation laser pulse, in order to effectively remove material from the drilling area, the energy density range of the first laser source for metallic copper is 5-15 joules / cm², and its pulse width is less than or equal to 10 nanoseconds to overcome high reflectivity. Therefore, the first initial energy can be set to 8 joules / cm² to ensure that each pulse can remove a portion of the copper layer. The energy density threshold for the first laser source is 5 joules / cm².

[0112] For FR4 material in the substrate, the second laser source can effectively remove the FR4 material in the drilled area. Its energy density range is 1-5 joules / cm², and its pulse width is 50-200 nanoseconds to reduce carbonization and ensure smooth hole walls. Typically, the substrate also contains a prepreg for bonding. For prepreg material, the second laser source can effectively remove the prepreg material in the drilled area. Its energy density range is 2-4 joules / cm², and its pulse width is 20-50 nanoseconds to avoid substrate delamination. Therefore, the initial energy can be set to 3 joules / cm² to ensure that each pulse removes a portion of the substrate layer. The energy density threshold for the second laser source is 2 joules / cm². Table 1 shows the laser energy density, pulse parameters, and target for different materials.

[0113] Table 1 Relationship between material layer and laser parameters

[0114]

[0115] The higher the voltage, the lower the laser energy. Electro-optic modulators are approximately linear in the low-voltage region, but at high voltage the refractive index saturates, and the electro-optic modulator exhibits nonlinearity. Pre-distortion compensation (which can be understood as applying a "twisting" driving voltage) is required to make the final output energy change linearly.

[0116] Before each pulse, the energy of the excitation laser source can be adjusted based on the voltage-transmittance curve to achieve smooth energy regulation. The adjustment range can be from reducing the energy to 80% of the current energy or increasing it by 10% from the current energy level.

[0117] The voltage-transmittance curve can be obtained by plotting the transmittance T=0, 0.3, 0.8, and 1.0 values ​​when the voltage V=0, 1, 2, and 3KV are measured. Voltage adjustment is achieved by real-time lookup of the actual drive voltage via the FPGA. The FPGA uses a 200MHz clock and receives a new target energy value every 5ns. Using the target energy as the address, it accesses the corresponding voltage value in memory and outputs the retrieved actual drive voltage after the next clock cycle (5ns). The original energy signal is then filtered through analog and digital filters to suppress noise and smooth its changes. The digital filtering uses an FIR filter, which has linear phase characteristics, ensuring the transmitted signal waveform is distortion-free.

[0118] Preferably, after removing the surface material of the drilled area, the process further includes:

[0119] S510: Acquire images of the drilled area after drilling using an image acquisition device;

[0120] S520: Reconstruct the three-dimensional morphology of the borehole wall based on the borehole area image;

[0121] S530: Determine the flatness of the hole wall according to the defect identification algorithm, wherein the defect identification algorithm is used to identify the flatness of the hole wall;

[0122] S540: In response to the fact that the flatness of the hole wall does not reach the preset flatness, the hole wall is repaired until the preset flatness of the hole wall is reached.

[0123] Repair the hole wall until the preset flatness is achieved, including:

[0124] S541: Evaluate hole wall roughness and determine repair targets. Use a high-powered microscope (such as SEM) or a 3D profilometer to inspect the hole wall morphology after laser drilling, quantify roughness parameters, and set target roughness thresholds (e.g., roughness <5μm) according to product requirements.

[0125] S542: Select the appropriate laser type, prioritizing short-pulse or ultra-short-pulse lasers (such as picosecond lasers and femtosecond lasers), with wavelengths typically in the ultraviolet range.

[0126] S543: Set the laser repair mode and scanning path, using either circular or spiral scanning to ensure the laser beam scans uniformly along the inner surface of the hole wall. Control the laser focus to be located in the upper-middle part of the hole wall, slightly offset inward, to ensure energy is applied to the rough area.

[0127] S544: Optimize laser process parameters, and set appropriate laser energy density, pulse frequency, scanning speed and number of repetitions.

[0128] Initially, low energy was used for trial repairs, and the parameters were gradually adjusted to the optimal parameters (e.g., energy density slightly higher than the material threshold but lower than the carbonization threshold).

[0129] S545: Performs laser repair treatment. The laser system is activated and scans the target micropore multiple times along a preset path, removing surface irregularities layer by layer. A coaxial monitoring system can be used to observe changes in the hole wall in real time.

[0130] S546: Cleaning and decarburization treatment. After laser repair, use plasma cleaning or chemical decarburization processes to remove residual trace amounts of carbides or debris.

[0131] S547: Verify the repair effect by re-inspecting the roughness, roundness, and presence of cracks or delamination of the hole wall after repair. Perform electroplating verification to check the continuity and adhesion of the plating layer.

[0132] The image acquisition equipment employs a laser scanning confocal microscope, reconstructing the 3D morphology of the hole wall through point-by-point scanning with sub-micron precision. Through image processing and analysis, a 3D model of the hole wall is generated via laser scanning, quantifying geometric deviations (such as roundness and taper). A defect identification algorithm, based on defect synthesis and semi-supervised learning, automatically classifies defects (cracks, chipped edges, residual debris). Key parameter measurements quantify hole diameter, surface roughness, and hole depth.

[0133] This application employs dynamic reduction of dielectric layer energy (e.g., FR4: 3J / cm² → 1.5J / cm²) to suppress carbonization, and real-time temperature control (<200℃) to avoid material phase transformation; laser 1 is used to refine the hole wall to reduce the heat-affected zone, short pulses are used for the copper layer and long pulses are used for the dielectric layer to avoid interface unevenness; comparative data under the same conditions are shown in Table 2.

[0134] Table 2 Roughness Relationship Table

[0135]

[0136] Wherein, the roughness reduction = (1-Ra / Rb)×100%. Ra is the roughness of the hole wall after implementing the embodiments of this application with the corresponding material; Rb is the roughness of the corresponding material before implementing the embodiments of this application.

[0137] The roughness (R) of the hole wall is defined using the arithmetic mean roughness method, and the calculation formula is as follows:

[0138] ;

[0139] Where x is the horizontal displacement along the reference length L (unit: mm), representing the length direction coordinate of the measured surface, y(x) is the vertical deviation between the actual profile curve and the centerline at position x (unit: μm), i.e. the profile height offset, L is the evaluation length, and the centerline is an ideal straight line within the reference length L that divides the actual profile into equal upper and lower areas. It is a reference line dynamically calculated based on the actual profile.

[0140] It should be understood that, although Figure 1 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 1At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0141] By implementing the laser drilling method provided in this application embodiment, a laser drilling system with a replaceable laser light source can be used to drill circuit boards. When drilling, the laser light source can be switched according to the material of the hole surface layer. Ultraviolet laser is used to process the metal layer, and carbon dioxide laser is used to process the substrate layer, which simplifies the laser drilling process and improves the drilling yield of circuit boards.

[0142] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser source is adjusted according to the temperature of the surface layer of the drilling area. This ensures that the surface layer of the drilling area does not overheat, the hole wall is smooth, and carbonization of the substrate in the drilling area is avoided, thereby improving the drilling yield.

[0143] Figure 3 A brief diagram illustrating the business logic of drilling holes in a circuit board using a laser drilling system is provided.

[0144] It can adjust the voltage of the driving laser source in a timely manner according to the temperature and the degree of residual material on the surface of the drilling area, so as to smoothly adjust the laser pulse energy, effectively remove the material in the hole, and control the temperature during the drilling process, ensuring that the physical and electrical properties of the circuit board do not deteriorate due to temperature rise.

[0145] In other embodiments, a laser drilling system includes: a control device and a replaceable laser light source. The control device controls the replaceable laser light source to drill a drilling area on a circuit board to be drilled to a target depth from a drilling direction. The circuit board to be drilled includes metal and a substrate. The replaceable laser light source includes at least two laser light sources. The drilling direction is along the optical axis of the replaceable laser light source from the replaceable laser light source to the circuit board to be drilled.

[0146] The control device is configured as follows:

[0147] S100: Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by a replaceable laser light source;

[0148] S200: The laser source is determined based on the material of the surface layer of the drilling area;

[0149] S300: Configures and activates a laser source to illuminate the drilled area;

[0150] S400: Adjusts the energy of the excitation laser source according to the surface temperature of the drilling area, and uses the adjusted energy to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed.

[0151] By implementing the laser drilling system provided in this application embodiment, a laser drilling system with a replaceable laser light source can be used to drill circuit boards. When drilling, the laser light source can be switched according to the material of the hole surface layer. Ultraviolet laser is used to process the metal layer, and carbon dioxide laser is used to process the substrate layer, which simplifies the laser drilling process and improves the drilling yield of circuit boards.

[0152] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser source is adjusted according to the temperature of the surface layer of the drilling area. This ensures that the surface layer of the drilling area does not overheat, the hole wall is smooth, and carbonization of the substrate in the drilling area is avoided, thereby improving the drilling yield.

[0153] For specific limitations regarding the laser drilling system described above, please refer to the limitations of the laser drilling method above, which will not be repeated here. Each module in the aforementioned laser drilling system can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in hardware or independently of the processor in a computer device, or stored in software in the memory of a computer device, so that the processor can call and execute the corresponding operations of each module.

[0154] In other embodiments, such as Figure 4 As shown, a control device includes a memory, a processor, and a laser drilling program stored in the memory and executable on the processor. When the processor executes the laser drilling program, it implements the laser drilling method described above, specifically including:

[0155] S100: Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by a replaceable laser light source;

[0156] S200: The laser source is determined based on the material of the surface layer of the drilling area;

[0157] S300: Configures and activates a laser source to illuminate the drilled area;

[0158] S400: Adjusts the energy of the excitation laser source according to the surface temperature of the drilling area, and uses the adjusted energy to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed.

[0159] By implementing the control device provided in the embodiments of this application, a laser drilling system with a replaceable laser light source can be used to switch the laser light source according to the material of the hole surface layer when drilling circuit boards. Ultraviolet laser is used to process the metal layer, and carbon dioxide laser is used to process the substrate layer, which simplifies the laser drilling process and improves the drilling yield of circuit boards.

[0160] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser source is adjusted according to the temperature of the surface layer of the drilling area. This ensures that the surface layer of the drilling area does not overheat, the hole wall is smooth, and carbonization of the substrate in the drilling area is avoided, thereby improving the drilling yield.

[0161] In other embodiments, a computer-readable storage medium stores a laser drilling program thereon, which, when executed by a processor, implements the laser drilling method described in the first aspect, specifically including:

[0162] S100: Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by a replaceable laser light source;

[0163] S200: The laser source is determined based on the material of the surface layer of the drilling area;

[0164] S300: Configures and activates a laser source to illuminate the drilled area;

[0165] S400: Adjusts the energy of the excitation laser source according to the surface temperature of the drilling area, and uses the adjusted energy to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed.

[0166] By implementing the computer-readable storage medium provided in the embodiments of this application, a laser drilling system with a replaceable laser light source can be used to drill circuit boards. When drilling, the laser light source can be switched according to the material of the hole surface layer. Ultraviolet laser is used to process the metal layer, and carbon dioxide laser is used to process the substrate layer, which simplifies the laser drilling process and improves the drilling yield of circuit boards.

[0167] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser source is adjusted according to the temperature of the surface layer of the drilling area. This ensures that the surface layer of the drilling area does not overheat, the hole wall is smooth, and carbonization of the substrate in the drilling area is avoided, thereby improving the drilling yield.

[0168] In other embodiments, a computer program product includes a computer program that, when executed by a processor, implements the laser drilling method described in the first aspect, specifically including:

[0169] S100: Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by a replaceable laser light source;

[0170] S200: The laser source is determined based on the material of the surface layer of the drilling area;

[0171] S300: Configures and activates a laser source to illuminate the drilled area;

[0172] S400: Adjusts the energy of the excitation laser source according to the surface temperature of the drilling area, and uses the adjusted energy to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed.

[0173] By implementing the computer program product provided in the embodiments of this application, a laser drilling system with a replaceable laser light source can be used to drill circuit boards. When drilling, the laser light source can be switched according to the material of the hole surface layer. Ultraviolet laser is used to process the metal layer, and carbon dioxide laser is used to process the substrate layer, which simplifies the laser drilling process and improves the drilling yield of circuit boards.

[0174] By implementing the laser drilling method, system, control device, and readable storage medium provided in the embodiments of this application, a laser drilling system with a replaceable laser light source can be used to drill circuit boards. When drilling, the laser light source can be switched according to the material of the hole surface layer; ultraviolet laser can be used to process the metal layer, and carbon dioxide laser can be used to process the substrate layer. This simplifies the laser drilling process and improves the drilling yield of circuit boards.

[0175] While removing the surface layer of the drilling area layer by layer, the temperature of the surface layer of the drilling area is monitored in real time, and the energy of the excitation laser source is adjusted according to the temperature of the surface layer of the drilling area. This ensures that the surface layer of the drilling area does not overheat, the hole wall is smooth, and carbonization of the substrate in the drilling area is avoided, thereby improving the drilling yield.

[0176] It can adjust the voltage of the driving laser source in a timely manner according to the temperature and the degree of residual material on the surface of the drilling area, so as to smoothly adjust the laser pulse energy, effectively remove the material in the hole, and control the temperature during the drilling process, ensuring that the physical and electrical properties of the circuit board do not deteriorate due to temperature rise.

[0177] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0178] Specifically, according to embodiments of this application, the processes described above with reference to the flowcharts can be implemented as steps controlled by a computer software program. For example, embodiments of this application include a computer program product comprising a computer program loaded on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from memory, or installed from ROM. When the computer program is executed by an external processor, it performs the functions defined in the methods of embodiments of this application.

[0179] It should be noted that the computer-readable medium in the embodiments of this application can be a computer-readable signal medium or a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In the embodiments of this application, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. In the embodiments of this application, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium can be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wires, optical fibers, RF (Radio Frequency), etc., or any suitable combination thereof.

[0180] The aforementioned computer-readable medium may be included in the aforementioned server; or it may exist independently and not assembled into the server. The aforementioned computer-readable medium carries one or more programs that, when executed by the server, cause the server to: in response to detecting that the peripheral mode of the terminal is not activated, acquire the frame rate of the application on the terminal; when the frame rate meets the screen-off condition, determine whether the user is acquiring the terminal's screen information; and in response to the determination that the user is not acquiring the terminal's screen information, control the screen to enter an immediate dimming mode.

[0181] Computer program code for performing the operations of the embodiments of this application can be written in one or more programming languages ​​or a combination thereof. Programming languages ​​include object-oriented programming languages—such as Java, Smalltalk, and C++—and conventional procedural programming languages—such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0182] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for system or system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and relevant parts can be referred to the descriptions in the method embodiments. The systems and system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0183] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only intended to help understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

[0184] The above provides a detailed description of a laser drilling method, system, control device, and readable storage medium provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. These embodiments are merely preferred embodiments of this application, used to help understand the method and its core ideas, and are not intended to limit this application. It should be noted that for those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application without departing from its principles are also within the protection scope of this application.

Claims

1. A laser drilling method, characterized in that, A control device for use in a laser drilling system, the laser drilling system including a replaceable laser source, the control device controlling the replaceable laser source to drill a drilling area on a circuit board to be drilled to a target depth from a drilling direction, the circuit board to be drilled including metal and a substrate, wherein the replaceable laser source includes at least two laser sources, and the drilling direction is along the optical axis of the replaceable laser source pointing from the replaceable laser source to the circuit board to be drilled; The laser drilling method includes: Turn off the ambient light source in the laser drilling system; A reflectivity calibration plate is placed on the support platform of the circuit board to be drilled, so that the surface of the reflectivity calibration plate is flush with the surface of the circuit board to be drilled. The lighting source is activated and runs continuously for a preset lighting time until it reaches thermal equilibrium. The image acquisition device is controlled to acquire images of the reflectivity calibration plate under the illumination source to obtain an illumination field distribution image. Based on the illumination field distribution image, adjust the illumination parameters of the illumination source so that the illumination source evenly illuminates the circuit board to be drilled; Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by the replaceable laser light source; The laser source is determined based on the material of the surface layer of the drilling area; Configure and activate the laser source to illuminate the drilled area; The energy of the laser source is adjusted according to the surface temperature of the drilling area, and the adjusted energy is used to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed. Images of the drilled area after drilling are acquired using image acquisition equipment; Based on the borehole area image, reconstruct the three-dimensional morphology of the borehole wall; The flatness of the hole wall is determined according to the defect identification algorithm, wherein the defect identification algorithm is used to identify the flatness of the hole wall; If the flatness of the hole wall does not reach the preset flatness, the hole wall is repaired until the flatness of the hole wall is reached. The step of adjusting the energy of the laser source based on the surface temperature of the drilling area includes: Obtain the surface temperature of the drilled area; In response to the surface temperature of the drilled area exceeding the temperature threshold, the energy of the current laser source is reduced by a first preset amount and used as the energy of the laser source for the next pulse. If the energy of the laser source in response to the next pulse is less than or equal to the energy density threshold, then the energy density threshold is taken as the energy of the laser source in the next pulse. If the material on the surface of the drilling area is not completely removed within a preset number of pulses, the energy of the current laser source is increased by a second preset amount and used as the energy of the laser source for the next pulse. The pulse interval of the laser source is adjusted according to the surface temperature of the drilling area so that the surface temperature of the drilling area is within the temperature threshold. Among them, the energy adjustment of the laser source is based on the voltage-transmittance curve, and the voltage is adjusted accordingly; The material used to identify the surface layer of the drilled area includes: The illumination source of the laser drilling system is activated to illuminate the drilling area; The drilling area image is acquired using the image acquisition device in the laser drilling system; The image of the drilled area is preprocessed to enhance the surface features of the drilled area; Extract feature parameters corresponding to the surface features; The material identification model is invoked, and the material of the surface layer of the drilled area is determined based on the feature parameters of the surface features.

2. The laser drilling method according to claim 1, characterized in that, The laser source includes a first laser source and a second laser source. Determining the laser source based on the material of the surface layer of the drilling area includes: In response to the identification that the material of the surface layer of the drilled area is metal, the first laser source is used as the laser source; In response to the identification that the material on the surface of the drilled area is a substrate, the second laser source is used as the laser source.

3. The laser drilling method according to claim 2, characterized in that, After determining the laser source based on the material of the surface layer of the drilled area, the method further includes: Obtain the alignment mark on the circuit board to be drilled, and compare the alignment mark with the positioning mark of the laser drilling system to determine the actual offset between the circuit board to be drilled and the support platform. Based on the actual offset, the coordinate system of the laser drilling system is corrected so that the coordinate system is associated with the actual position of the circuit board to be drilled. Determine the location of the drilling area based on the drilling process documents; Move the replaceable laser source so that it is aligned with the drilling area.

4. The laser drilling method according to claim 1, characterized in that, The laser source is a first laser source, and configuring and activating the laser source to irradiate the drilling area includes: The initial energy of the first laser source is configured as the first initial energy; Configure the initial pulse interval of the first laser source as the first initial pulse interval; The first laser source is excited with a beam size, a first initial energy, and a first initial pulse interval to irradiate the drilled area.

5. The laser drilling method according to claim 1, characterized in that, The laser source is a second laser source, and configuring and activating the laser source to irradiate the drilling area includes: The initial energy of the second laser source is configured as the second initial energy; The initial pulse interval of the second laser source is configured as the second initial pulse interval; The second laser source is excited by the beam size, the second initial energy, and the second initial pulse interval to irradiate the drilled area.

6. The laser drilling method according to claim 4 or 5, characterized in that, Before configuring and activating the laser light source to irradiate the drilling area, the method further includes: Obtain the dimensions of the drilling area; The beam size of the laser source is adjusted according to the size of the drilling area.

7. The laser drilling method according to claim 6, characterized in that, Adjusting the beam size of the laser source includes: The laser spot diameter is determined based on the dimensions of the drilling area. The laser spot diameter is determined by the formula: d = K·λ·f / D, where λ represents the laser wavelength, f represents the focal length of the laser, D represents the diameter of the beam incident on the scanning lens, d represents the focused spot diameter, and K represents a constant. Adjust the beam expander so that the diameter of the spot of the laser beam illuminating the surface of the drilled area is equal to the diameter of the spot.

8. A laser drilling system, characterized in that, The laser drilling system includes: a control device and a replaceable laser light source. The control device controls the replaceable laser light source to drill to a target depth in the drilling area of ​​the circuit board to be drilled from the drilling direction. The circuit board to be drilled includes metal and a substrate. The replaceable laser light source includes at least two laser light sources. The drilling direction is along the optical axis of the replaceable laser light source from the replaceable laser light source to the circuit board to be drilled. The control device is configured to: Turn off the ambient light source in the laser drilling system; A reflectivity calibration plate is placed on the support platform of the circuit board to be drilled, so that the surface of the reflectivity calibration plate is flush with the surface of the circuit board to be drilled. The lighting source is activated and runs continuously for a preset lighting time until it reaches thermal equilibrium. The image acquisition device is controlled to acquire images of the reflectivity calibration plate under the illumination source to obtain an illumination field distribution image. Based on the illumination field distribution image, adjust the illumination parameters of the illumination source so that the illumination source evenly illuminates the circuit board to be drilled; Identify the material of the surface layer of the drilled area, wherein the surface layer of the drilled area is the material layer surface of the drilled area that is irradiated by the replaceable laser light source; The laser source is determined based on the material of the surface layer of the drilling area; Configure and activate the laser source to illuminate the drilled area; The energy of the laser source is adjusted according to the surface temperature of the drilling area, and the adjusted energy is used to excite the laser source to irradiate the drilling area until the material on the surface of the drilling area is removed. Images of the drilled area after drilling are acquired using image acquisition equipment; Based on the borehole area image, reconstruct the three-dimensional morphology of the borehole wall; The flatness of the hole wall is determined according to the defect identification algorithm, wherein the defect identification algorithm is used to identify the flatness of the hole wall; If the flatness of the hole wall does not reach the preset flatness, the hole wall is repaired until the flatness of the hole wall is reached. The step of adjusting the energy of the laser source based on the surface temperature of the drilling area includes: Obtain the surface temperature of the drilled area; In response to the surface temperature of the drilled area exceeding the temperature threshold, the energy of the current laser source is reduced by a first preset amount and used as the energy of the laser source for the next pulse. If the energy of the laser source in response to the next pulse is less than or equal to the energy density threshold, then the energy density threshold is taken as the energy of the laser source in the next pulse. If the material on the surface of the drilling area is not completely removed within a preset number of pulses, the energy of the current laser source is increased by a second preset amount and used as the energy of the laser source for the next pulse. The pulse interval of the laser source is adjusted according to the surface temperature of the drilling area so that the surface temperature of the drilling area is within the temperature threshold. Among them, the energy adjustment of the laser source is based on the voltage-transmittance curve, and the voltage is adjusted accordingly; The material used to identify the surface layer of the drilled area includes: The illumination source of the laser drilling system is activated to illuminate the drilling area; The drilling area image is acquired using the image acquisition device in the laser drilling system; The image of the drilled area is preprocessed to enhance the surface features of the drilled area; Extract feature parameters corresponding to the surface features; The material identification model is invoked, and the material of the surface layer of the drilled area is determined based on the feature parameters of the surface features.

9. A control device, characterized in that, The method includes a memory, a processor, and a laser drilling program stored in the memory and executable on the processor. When the processor executes the laser drilling program, it implements the laser drilling method according to any one of claims 1 to 7.

10. A readable storage medium, characterized in that, It stores a laser drilling program, which, when executed by a processor, implements the laser drilling method according to any one of claims 1 to 7.

Images