Wafer feeding and discharging machine, chip testing equipment and control method of chip testing equipment

Abstract

The invention provides a wafer feeding and discharging machine, chip testing equipment and a control method thereof, and relates to the technical field of wafer testing. A conveying mechanism comprises a conveying disc used for conveying among a wafer feeding mechanism, a wafer discharging mechanism and a testing machine, the conveying disc is provided with a feeding area and a discharging area, the feeding area is used for placing a to-be-tested chip, and the discharging area is used for placing a tested chip. A first adsorption assembly of the loading and unloading carrying mechanism is used for carrying a tested chip on the wafer loading mechanism to the loading area, and a second adsorption assembly is used for carrying a tested chip in the unloading area to the wafer unloading mechanism. According to the technical scheme, the same conveying disc is adopted to carry the to-be-tested chips and the tested chips, discharging can be carried out while feeding is carried out, the conveying frequency can be reduced, and therefore the testing efficiency of the chips is improved.

Description

Technical Field

[0001] The present invention relates to the field of wafer testing technology, and in particular to a wafer loading and unloading machine, chip testing equipment and a control method thereof. Background Art

[0002] During chip testing, a loading tray is used to transport the chips from the loading mechanism to the testing mechanism for testing. After the chips are tested, an unloading tray is used to transport the chips from the testing mechanism to the unloading mechanism for unloading. This method of transporting the chips results in a high number of chip transfers, which leads to low chip testing efficiency. Therefore, it is urgent to design a wafer loading and unloading machine that can improve testing efficiency. Summary of the Invention

[0003] One object of the present invention is to provide a wafer loading and unloading machine to solve the technical problem in the prior art that the chip loading and unloading machine has a large number of conveying times resulting in low testing efficiency.

[0004] A further object of the present invention is to provide a chip testing device having the above-mentioned wafer loading and unloading machine.

[0005] Another object of the present invention is to provide a control method applied to the above chip testing equipment.

[0006] In particular, the present invention provides a wafer loading and unloading machine, comprising: A wafer loading mechanism, configured to transfer a wafer along a first horizontal direction to a loading position, wherein the wafer has a plurality of chips to be tested; At least one wafer unloading mechanism, arranged on the same side as the wafer loading mechanism, for transporting the carrier tray carrying the tested chips from the unloading position to the silo; The conveying mechanism includes a first conveying section, a second conveying section, and at least one conveying tray; the first conveying section and the second conveying section are arranged in a docking relationship; the first conveying section is located on one side of the wafer loading mechanism and the wafer unloading mechanism, and the second conveying section is located on one side of the testing mechanism; the conveying tray can be controlled to move back and forth between a first loading and unloading position of the first conveying section and a second loading and unloading position of the second conveying section; the conveying tray has a loading area and an unloading area, the loading area is used to place chips to be tested, and the unloading area is used to place tested chips after testing; The loading and unloading material handling mechanism includes a first adsorption component and a second adsorption component. The first adsorption component and the second adsorption component are both configured to be movable along a second horizontal direction. The first adsorption component is used to transport the chip to be tested on the wafer loading mechanism to the loading area; the second adsorption component is used to transport the tested chip in the unloading area to the carrying plate of the wafer unloading mechanism. The second horizontal direction is perpendicular to the first horizontal direction.

[0007] Optionally, the loading and unloading transport mechanism includes a loading and unloading transport guide rail; The loading and unloading transport guide rail is arranged along the second horizontal direction, and the first adsorption component is controlled to move along the loading and unloading transport guide rail, and is able to move back and forth between the loading position and the first loading and unloading position, and is able to transport the chips to be tested on the wafer to the conveyor tray; The second adsorption component is controlled to move along the loading and unloading conveying guide rail, and can move back and forth between the first loading and unloading position and the unloading position, and can convey the measured chips in the conveying tray to the carrying tray of the unloading position.

[0008] Optionally, the wafer unloading mechanism includes a first wafer unloading mechanism and a second wafer unloading mechanism arranged on the same side and in parallel, and the first wafer unloading mechanism is arranged between the wafer loading mechanism and the second wafer unloading mechanism; the first wafer unloading mechanism and the second wafer unloading mechanism are respectively used to unload chips with different test results.

[0009] Optionally, the first wafer unloading mechanism includes: A first carrying platform is arranged opposite to the conveying mechanism, and a first carrying tray is provided on the first carrying platform, and the first carrying tray is used to receive the corresponding tested chip; a first guide rail, arranged on one side of the conveying mechanism along the first horizontal direction; A material unloading tray is slidably mounted on the first guide rail, and the second adsorption assembly is controlled to place the tested chips on the conveying tray on the material unloading tray; a first sliding assembly, arranged above the first carrying platform along the second horizontal direction; The third adsorption component is slidably mounted on the first sliding component and is used to transport the tested chips on the unloading tray to the first carrying tray.

[0010] Optionally, the first wafer unloading mechanism further includes: A first unloading silo is provided in front of the first carrying platform; The first manipulator is slidably mounted on the first guide rail and is used to clamp the first carrying plate and drive it to move into the first unloading bin.

[0011] Optionally, the loading and unloading transport mechanism further includes: a second sliding assembly, mounted on top of the wafer loading mechanism, the wafer unloading mechanism, and the conveying mechanism along the second horizontal direction, and arranged parallel to the first sliding assembly, and the first adsorption assembly and the second adsorption assembly are both slidably mounted on the second sliding assembly; The wafer loading and unloading machine also includes: A waste tray is installed on a side of the conveying mechanism close to the wafer unloading mechanism and is used to place damaged tested chips.

[0012] Optionally, the second wafer unloading mechanism includes: A second unloading silo is arranged in parallel with the first unloading silo; A second carrying platform is arranged along the first horizontal direction, and a second carrying tray is provided on the second carrying platform, and the second carrying tray is used to receive the corresponding tested chip; a second guide rail arranged along the first horizontal direction; The second manipulator is slidably mounted on the second guide rail and is used to clamp the second carrying plate to drive it to move into the second unloading bin.

[0013] Optionally, the wafer loading mechanism includes: Loading silo, used to store wafers to be loaded; a third carrying platform, arranged along the first horizontal direction, for carrying the wafer; a third guide rail arranged along the first horizontal direction; The third robot is slidably mounted on the third guide rail, and is used for clamping the wafer in the loading bin and driving the wafer to move onto the third carrying platform.

[0014] In particular, the present invention further provides a chip testing device, comprising: Such as the wafer loading and unloading machine mentioned above; A testing mechanism is provided at one end of the wafer loading mechanism and the wafer unloading mechanism along the wafer loading direction; the testing mechanism includes a testing machine, at least one testing handling device and at least one testing carrier; The test handling device is configured to controllably carry the tested chips in the test carrier to the conveyor tray, and controllably carry the chips to be tested in the conveyor tray on the second conveying section to the test carrier; The test carrier is configured to move back and forth between the test machine and the test handling device, thereby being able to carry the chip to be tested and cooperate with the test machine to perform a functional test on the chip to be tested.

[0015] Optionally, it also includes: A sealing assembly, the sealing assembly being provided at the junction of the second conveying section and the first conveying section and being arranged on one side of the testing mechanism; The sealing assembly has a sealing cavity for accommodating the conveying disc; an air circuit assembly is provided in the sealing cavity, and the air circuit assembly is controlled to evacuate or inflate the sealing cavity, so that when the conveying disc is conveyed from the first conveying section through the sealing cavity to the second conveying section, the conveying environment of the conveying disc can be switched by controlling the air circuit assembly.

[0016] Optionally, the testing mechanism includes two testing transport devices and two testing bearing seats; The two test handling devices are respectively arranged on both sides of the test machine; the two test bearing seats are arranged in a one-to-one correspondence with the two test handling devices; The conveying mechanism includes two conveying trays; the second conveying section includes a branch conveying section 1 and a branch conveying section 2, and the branch conveying section 1 and the branch conveying section 2 are collinearly arranged along the second horizontal direction; The sealing assembly is arranged between the branch line 1 conveying section and the branch line 2 conveying section; The two conveying trays can alternately pass through the sealed cavity and move along the first conveying section of the branch line and the second conveying section of the branch line respectively; The two groups of test transport devices are used to transport the chips to be tested in the corresponding conveyor tray to the corresponding test carrier, and to transport the tested chips in the test carrier to the conveyor tray; the two test carriers can be controlled to move alternately along the second direction to the test position of the testing machine.

[0017] Optionally, the present invention further provides a control method for a chip testing device, which is applied to the above-mentioned chip testing device and comprises the following steps: In response to a trigger instruction for loading, the first adsorption component is controlled to absorb the chip to be tested on the wafer loading mechanism and move the chip to be tested to the loading area of ​​the conveyor tray; in response to a trigger instruction for unloading, the second adsorption component is controlled to absorb the tested chip on the unloading area of ​​the conveyor tray and move the tested chip to the carrier tray of the wafer unloading mechanism. The trigger instruction for loading and the trigger instruction for unloading are triggered synchronously. Controlling the conveyor tray to be conveyed along the first upper and lower material positions of the first conveying section to the second upper and lower material positions of the second conveying section; Controlling the test transport device to transport the tested chips on the test carrier to the unloading area of ​​the conveyor tray; Controlling the test transport device to transport the chip to be tested in the loading area to the test carrier; The test carrier is controlled to move to a test position of a test machine, and the test machine is controlled to perform a performance test on the chip to be tested.

[0018] Optionally, the step of controlling the second adsorption component to absorb the tested chips on the unloading area of ​​the conveyor tray and transporting the tested chips to the wafer unloading mechanism specifically includes the following steps: According to the test result of the tested chip, the second adsorption component is controlled to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism.

[0019] Optionally, the step of controlling the second adsorption component to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism according to the test result of the tested chip specifically includes the following steps: If the test result of the tested chip meets the first preset condition, controlling the second adsorption component to adsorb the tested chip in the unloading area and move along the second sliding component to place the tested chip on the unloading tray; Controlling the unloading tray to move along the first guide rail to a target unloading position; The third adsorption component is controlled to adsorb the tested chip on the unloading tray and move along the first sliding component to place the tested chip on the first carrying tray.

[0020] Optionally, the step of controlling the second adsorption component to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism according to the test result of the tested chip further includes the following steps: If the test result of the tested chip meets the second preset condition, the second adsorption component is controlled to adsorb the tested chip in the unloading area and move along the second sliding component to place the tested chip on the second carrier plate. The second preset condition is different from the first preset condition.

[0021] The conveying mechanism of the present invention includes a conveyor tray for conveying between a wafer loading mechanism, a wafer unloading mechanism, and a testing machine. The conveyor tray has a loading area and a unloading area. The loading area is used to place the chip to be tested, and the unloading area is used to place the tested chip. The first adsorption component of the loading and unloading mechanism is used to transport the chip to be tested on the wafer loading mechanism to the loading area, and the second adsorption component is used to transport the tested chip in the unloading area to the wafer unloading mechanism. The above technical solution uses the same conveyor tray to transport the chip to be tested and the tested chip. Unloading can be carried out simultaneously, which can reduce the number of conveying times and thus improve the chip testing efficiency. In addition, the first conveying section and the second conveying section are arranged in a docking manner to form a single-track conveying form. The conveyor tray can be controlled to move back and forth between the first loading and unloading position of the first conveying section and the second loading and unloading position of the second conveying section, which can realize the reciprocating conveying form of loading the chip to be tested and unloading the tested chip. Compared with the prior art that adopts a dual-track parallel arrangement to realize the circular conveying method of chip carrier, the conveying efficiency is higher and the equipment occupies less space.

[0022] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings: Figure 1 1 is a schematic structural diagram of a wafer loading and unloading machine according to an embodiment of the present invention from one angle; Figure 2 is a schematic structural diagram of a wafer loading and unloading machine according to an embodiment of the present invention from another angle; Figure 3 is a schematic structural diagram of a first wafer unloading mechanism according to an embodiment of the present invention; Figure 4 is a schematic structural diagram of a conveying mechanism according to one embodiment of the present invention; Figure 5 is a schematic structural diagram of a first visual detection mechanism and a second visual detection mechanism according to an embodiment of the present invention; Figure 6 is a schematic structural diagram of a first adsorption component according to one embodiment of the present invention; Figure 7 is a schematic structural diagram of a sealing assembly according to one embodiment of the present invention; Figure 8is a schematic structural diagram of a testing mechanism according to one embodiment of the present invention; Figure 9 is a schematic flow chart of a control method of a chip testing device according to an embodiment of the present invention; Figure 10 is a schematic flow chart of a control method for a chip testing device according to another embodiment of the present invention.

[0024] Reference numerals: 100-wafer unloader, 200-wafer, 300-chip to be tested, 10-wafer loading mechanism, 11-loading silo, 12-third carrying platform, 21-first wafer unloading mechanism, 22-second wafer unloading mechanism, 211-first unloading silo, 212-first manipulator, 213-first guide rail, 214-first carrying platform, 215-unloading tray, 216-third adsorption component, 217-second slide rail, 218-first bracket, 221-second unloading silo, 222-second carrying platform, 223-second manipulator, 224-second guide rail, 225-fourth slide rail, 30-rack, 40-unloading and loading Mechanism, 41-third slide rail, 42-first adsorption component, 421-adsorption rod, 43-second adsorption component, 44-second bracket, 50-conveyor mechanism, 51-first conveying section, 52-conveyor tray, 521-loading area, 522-unloading area, 53-second conveying section, 531-branch one conveying section, 532-branch two conveying section, 60-first visual inspection mechanism, 70-second visual inspection mechanism, 80-waste tray, 90-sealing assembly, 91-first sealing door, 92-second sealing door, 94-testing machine, 95-test bearing seat, 96-test handling device, 961-handling device, 962-handling guide rail. DETAILED DESCRIPTION

[0025] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0026] In the description of the present invention, it should be understood that the terms "upper" and "lower" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0027] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or more of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0028] Unless otherwise specified or limited, the terms "connection" and "installation" should be interpreted broadly. For example, they can refer to fixed or detachable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art should be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0029] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0030] Figure 1 FIG. 1 is a schematic structural diagram of a wafer loading and unloading machine 100 according to an embodiment of the present invention from one angle. Figure 2 FIG. 1 is a schematic structural diagram of a wafer loading and unloading machine 100 according to an embodiment of the present invention from another angle. Figure 3 is a schematic structural diagram of a first wafer unloading mechanism 21 according to an embodiment of the present invention. Figure 4 is a schematic structural diagram of a conveying mechanism 50 according to an embodiment of the present invention.

[0031] like Figures 1 to 4As shown, in a specific embodiment, the wafer loading and unloading machine 100 includes a wafer loading mechanism 10, at least one wafer unloading mechanism, a conveying mechanism 50 and a loading and unloading transport mechanism 40. The wafer loading mechanism 10 is used to transfer the wafer 200 to the loading position along a first horizontal direction. The wafer 200 has a plurality of chips 300 to be tested. The wafer unloading mechanism is arranged on the same side as the wafer loading mechanism 10, and is used to transport the carrier tray carrying the tested chips from the unloading position to the silo. The conveying mechanism 50 includes a first conveying section 51, a second conveying section 53 and at least one conveying tray 52. ​​The first conveying section 51 is arranged to be docked with the second conveying section 53; the first conveying section 51 is located on one side of the wafer loading mechanism 10 and the wafer unloading mechanism, and the second conveying section 53 is located on the side of the testing mechanism. The conveying tray 52 can be controlled to move back and forth between the first loading and unloading position of the first conveying section 51 and the second loading and unloading position of the second conveying section 53. The conveyor tray 52 has a loading area 521 and a unloading area 522. The loading area 521 is used to place the chip to be tested 300, and the unloading area 522 is used to place the tested chip after the test is completed. The loading and unloading conveying mechanism 40 includes a first adsorption component 42 and a second adsorption component 43. The first adsorption component 42 and the second adsorption component 43 are both configured to be movable along the second horizontal direction. The first adsorption component 42 is used to transport the chip to be tested 300 on the wafer loading mechanism 10 to the loading area 521. The second adsorption component 43 is used to transport the tested chip in the unloading area 522 to the carrier plate of the wafer unloading mechanism. The second horizontal direction is perpendicular to the first horizontal direction. Here, the first horizontal direction is Figure 2 The Y direction in the second horizontal direction is Figure 2 The X direction in the middle. The chip types conveyed in this embodiment include but are not limited to memory chips. When the conveyor tray 52 is located at the first loading and unloading position of the first conveying section 51, the first adsorption component 42 and the second adsorption component 43 can work synchronously, that is, synchronously transporting the chip to be tested 300 on the wafer loading mechanism 10 to the loading area 521 and transporting the tested chip in the unloading area 522 to the wafer unloading mechanism. When the conveyor tray 52 is controlled to move from the first loading and unloading position of the first conveying section 51 to the second loading and unloading position of the second conveying section 53, the loading area 521 of the conveyor tray 52 is filled with the chip to be tested 300, and the unloading area 522 is empty. The purpose is to synchronously load and unload when the conveyor tray 52 is located at the second loading and unloading position. It can be understood that the conveyor tray 52 does not need to wait for chip testing when it is at the second loading and unloading position, thereby improving the conveying efficiency.

[0032] This embodiment uses a conveyor tray 52 to synchronously convey the chip to be tested 300 and the tested chip, and can simultaneously unload the material while loading, thereby reducing the number of conveyances and improving the chip testing efficiency.

[0033] The docking arrangement of the first conveying section 51 and the second conveying section 53 can be understood as the second conveying section 53 being an extension of the first conveying section 51, forming a single-track conveying form; and the conveying tray 52 with the loading area 521 and the unloading area 522 can be controlled to move back and forth between the first upper and lower material positions of the first conveying section 51 and the second upper and lower material positions of the second conveying section 53, thereby realizing the reciprocating conveying form of loading the chip to be tested and unloading the tested chip; compared with the traditional method of using two tracks arranged in parallel and cooperating with a pushing mechanism to realize the cyclic conveying of the chip carrier, this scheme has higher conveying efficiency, smaller equipment space occupation and lower investment cost.

[0034] In some embodiments, the first conveying section 51 is a slide rail arranged along a first horizontal direction, and the conveyor tray 52 is slidably mounted on the first conveying section 51. It can be understood that the conveyor tray 52 can slide along the slide rail in the first horizontal direction. The testing mechanism is located behind the wafer loading and unloading machine 100, and the conveyor tray 52 can move along the first conveying section 51 into the testing mechanism.

[0035] In some embodiments, the first conveying section 51 and the second conveying section 53 are arranged vertically; a multi-directional conveying device is provided between the first conveying section 51 and the second conveying section 53. The multi-directional conveying device includes a moving mechanism and a lifting motion module. The moving mechanism can reciprocate the conveying tray 52 along the first horizontal direction, that is, it can receive the conveying tray 52 delivered from the first conveying section 51, and can also transfer the conveying tray 52 to the first conveying section 51. The lifting motion module includes a lifting platform and at least one transmission mechanism provided on the lifting platform. The lifting platform can drive the transmission mechanism to rise and fall. The transmission mechanism can reciprocate the conveying tray 52 along the second horizontal direction, that is, it can receive the conveying tray 52 delivered from the second conveying section 53, and can also transfer the conveying tray 52 to the second conveying section 53.

[0036] Specifically, the moving mechanism and the lifting motion module can be stacked, that is, the lifting platform can drive the transmission mechanism to move up and down relative to the transmission surface of the moving mechanism. Furthermore, the lifting platform can drive the transmission mechanism to move to a first working height or a second working height. The first working height is the height at which the transmission surface of the transmission mechanism is lower than the transmission surface of the moving mechanism, and the second working height is the height at which the transmission surface of the transmission mechanism is higher than the transmission surface of the moving mechanism. When the lifting platform drives the transmission mechanism to move to the first working height, the transmission surface of the transmission mechanism is lower than the transmission surface height of the moving mechanism. At this time, the moving mechanism can receive the conveying disc 52 transported along the first conveying section 51 and drive it to move along the first horizontal direction, thereby moving the conveying disc 52 into the cavity of the multi-directional conveying device. In this state, when the lifting platform drives the transmission mechanism to rise from the first working height to the second working height, the transmission surface of the transmission mechanism can receive the conveying disc 52 on the moving mechanism and drive it to move along the second horizontal direction, thereby transferring it to the second conveying section 53, thereby achieving reciprocating movement of the conveying disc 52 on the first conveying section 51 and the second conveying section 53. The first horizontal direction is perpendicular to the second horizontal direction.

[0037] In another embodiment, the first conveying section 51 and the second conveying section 53 are arranged to extend and butt joint along the first horizontal direction. A belt transmission mechanism may be provided between the first conveying section 51 and the second conveying section 53. The moving mechanism can reciprocate the conveyor tray 52 along the first horizontal direction. In other words, the moving mechanism can receive the conveyor tray 52 delivered from the first conveying section 51 and transfer it to the second conveying section 53; it can also receive the conveyor tray 52 delivered from the second conveying section 53 and transfer it to the first conveying section 51. This enables the conveyor tray 52 to reciprocate between the first conveying section 51 and the second conveying section 53.

[0038] In some embodiments, the loading area 521 and the unloading area 522 are of the same size, which can be understood as each occupying half of the conveyor tray 52. ​​In other embodiments, the sizes of the loading area 521 and the unloading area 522 can also be designed according to specific design requirements.

[0039] In some embodiments, the loading and unloading mechanism 40 includes loading and unloading guide rails. The loading and unloading guide rails are arranged along the second horizontal direction. The first suction assembly 42 is controlled to move along the loading and unloading guide rails, thereby being able to reciprocate between the loading position and the first loading and unloading position, thereby transporting the chips 300 to be tested on the wafer 200 to the conveyor tray 52. ​​The second suction assembly 43 is controlled to move along the loading and unloading guide rails, thereby being able to reciprocate between the first loading and unloading position and the unloading position, thereby transporting the tested chips from the conveyor tray 52 to the carrier tray at the unloading position.

[0040] In some embodiments, the wafer unloading mechanism includes a first wafer unloading mechanism 21 and a second wafer unloading mechanism 22 arranged on the same side and in parallel, and the first wafer unloading mechanism 21 is arranged between the wafer loading mechanism 10 and the second wafer unloading mechanism 22. The first wafer unloading mechanism 21 and the second wafer unloading mechanism 22 are respectively used to unload chips with different test results. In other embodiments, the number and arrangement position of the wafer unloading mechanism can also be determined according to specific design requirements. The carrier includes a first carrier and a second carrier, which are respectively arranged on the first wafer unloading mechanism 21 and the second wafer unloading mechanism 22.

[0041] In some embodiments, the wafer loading and unloading machine 100 further includes a frame 30, on which the first conveying section 51 of the conveying mechanism 50 and the loading and unloading transport mechanism 40 are both mounted. At least a portion of the wafer loading mechanism 10 is mounted on the frame 30, and at least a portion of the wafer unloading mechanism is mounted on the frame 30. Here, the loading and unloading transport guide rails are arranged on the frame 30 along the second horizontal direction.

[0042] In some embodiments, the first wafer unloading mechanism 21 includes a first loading platform 214, a first guide rail 213, a loading tray 215, a first sliding assembly, and a third suction assembly 216. The first loading platform 214 is arranged opposite the conveyor mechanism 50. A first loading tray is provided on the first loading platform 214 for receiving the corresponding tested wafers. The first guide rail 213 is arranged on one side of the conveyor mechanism 50 along a first horizontal direction. The loading tray 215 is slidably mounted on the first guide rail 213. The second suction assembly 43 controls the placement of tested wafers from the conveyor tray 52 onto the loading tray 215. The first sliding assembly is arranged above the first loading platform 214 along a second horizontal direction. The third suction assembly 216 is slidably mounted on the first sliding assembly for transferring the tested wafers from the loading tray 215 to the first loading tray. The first sliding assembly includes a second slide rail 217 and a first bracket 218. The first bracket 218 is mounted on the frame 30 along the second horizontal direction and above the first loading tray. The second slide rail 217 is mounted on the first bracket 218 along the second horizontal direction, and the third adsorption assembly 216 is slidably mounted on the second slide rail 217. The chip to be tested is placed on the blue film of the first carrier plate.

[0043] In some embodiments, the first wafer unloading mechanism 21 further includes a first unloading bin 211 and a first manipulator 212. The first unloading bin 211 is arranged on the front side of the first carrying platform 214. The first manipulator 212 is slidably mounted on the first guide rail 213, and is used to clamp the first carrying plate and drive it to move into the first unloading bin 211. It can be understood that the first carrying plate is a wafer-level carrier, and the first manipulator 212 and the unloading plate 215 share a first guide rail 213, which can make the structure more compact and save layout space. The first manipulator 212 clamps the steel ring on the outer periphery of the first carrying plate. In other embodiments, the first manipulator 212 and the unloading plate 215 can also each use a guide rail, which is specifically determined according to design requirements.

[0044] This embodiment is equivalent to arranging the first unloading bin 211, the first carrying platform 214 and the conveying mechanism 50 in sequence along the first horizontal direction, which can make the structure of the wafer unloader 100 more compact and reduce the size of the wafer unloader 100 in the second horizontal direction.

[0045] In some embodiments, the loading and unloading mechanism 40 further includes a second sliding assembly, which is mounted on top of the wafer loading mechanism 10, the wafer unloading mechanism, and the conveying mechanism 50 along the second horizontal direction and is arranged parallel to the first sliding assembly. The first adsorption assembly 42 and the second adsorption assembly 43 are both slidably mounted on the second sliding assembly. Here, the second sliding assembly includes a third slide rail 41 and a second bracket 44, and the second bracket 44 is mounted on the frame 30 along the second horizontal direction. The third slide rail 41 is mounted on the second bracket 44 along the second horizontal direction. The first adsorption assembly 42 and the second adsorption assembly 43 are both slidably mounted on the third slide rail 41, thereby being able to slide along the second horizontal direction.

[0046] The wafer unloader 100 further includes a waste tray 80 mounted on a side of the conveyor mechanism 50 near the wafer unloading mechanism for placing damaged tested chips. The damaged tested chips can be placed in the waste tray 80 via the first suction assembly 42 or the second suction assembly 43.

[0047] In some embodiments, the second wafer unloading mechanism 22 includes a second unloading bin 221, a second supporting platform 222, a second guide rail 224, and a second manipulator 223. The second unloading bin 221 is arranged parallel to the first unloading bin 211. The second supporting platform 222 is arranged along a first horizontal direction. A second carrier plate is provided on the second supporting platform 222 for receiving the corresponding tested wafers. The second guide rail 224 is arranged along the first horizontal direction. The second manipulator 223 is slidably mounted on the second guide rail 224 and is used to clamp the second carrier plate and move it into the second unloading bin 221. Here, the second carrier plate is a wafer-level carrier plate. The second wafer unloading mechanism 22 also includes a fourth slide rail 225 mounted on the frame 30 along the first horizontal direction. The second supporting platform 222 is slidably mounted on the fourth slide rail 225. The second manipulator 223 clamps the steel ring around the outer periphery of the second carrier plate. It can be understood that the second supporting platform 222 is movable along the first horizontal direction.

[0048] In some embodiments, the wafer loading mechanism 10 includes a loading bin 11, a third carrying platform 12, a third guide rail and a third manipulator. The loading bin 11 is used to store wafers 200 to be loaded. The third carrying platform 12 is arranged along the first horizontal direction and is used to carry the wafers 200. The third guide rail is arranged along the first horizontal direction. The third manipulator is slidably mounted on the third guide rail and is used to clamp the wafers 200 in the loading bin 11 and drive the wafers 200 to move to the third carrying platform 12. Here, the wafer loading mechanism 10 also includes a fifth slide rail mounted on the frame 30 along the first horizontal direction, the third carrying platform 12 is slidably mounted on the fifth slide rail, and the third manipulator clamps the steel ring on the outer periphery of the wafer 200. It can be understood that the third carrying platform 12 can move along the fifth slide rail toward the first horizontal direction. According to the size of the third carrying platform 12 , the wafer loading mechanism 10 is suitable for loading wafers 200 of different sizes, such as 8-inch wafers or 12-inch wafers. In this solution, the wafer loading mechanism 10 is suitable for loading 12-inch wafers 200 .

[0049] Figure 5 FIG is a schematic structural diagram of a first visual inspection mechanism 60 and a second visual inspection mechanism 70 according to an embodiment of the present invention. Figure 5As shown, in some embodiments, the wafer loading and unloading machine 100 further includes a first visual inspection mechanism 60 and a second visual inspection mechanism 70. The first visual inspection mechanism 60 is installed between the wafer loading mechanism 10 and the first conveying section 51 of the conveying mechanism 50, and is installed on the rack 30. The first visual inspection mechanism 60 is used to perform surface defect detection on the chip to be tested 300 adsorbed by the first adsorption component 42, which can be understood as loading detection. The second visual inspection mechanism 70 is installed between the second wafer unloading mechanism 22 and the first conveying section 51 of the conveying mechanism 50, and is installed on the rack 30. The second visual inspection mechanism 70 is used to perform surface defect detection on the tested chip adsorbed by the second adsorption component 43, which can be understood as unloading detection. Here, the first visual inspection mechanism 60 and the second visual inspection mechanism 70 are both existing technologies and are not described here one by one.

[0050] In some embodiments, the wafer loading and unloading machine 100 further includes an edge-finding camera, which is slidably mounted on the third slide rail 41 and is used to find the edge of the wafer 200 on the third supporting platform 12 and guide the first adsorption component 42 to adsorb the chip 300 to be tested.

[0051] Figure 6 FIG is a schematic structural diagram of the first adsorption component 42 according to an embodiment of the present invention. Figure 6 As shown, the first adsorption assembly 42 includes multiple adsorption rods 421 arranged side by side. Each adsorption rod 421 is used to adsorb a chip under test 300. The first adsorption assembly 42 can simultaneously adsorb multiple chips under test 300 and can transport multiple chips under test 300 at a time. Here, the structures of the second adsorption assembly 43 and the third adsorption assembly 216 are the same as those of the first adsorption assembly 42 and are not described in detail here.

[0052] In some embodiments, the chip testing equipment includes the wafer loading and unloading machine 100 and the testing mechanism of any of the above-mentioned embodiments. The testing mechanism is arranged at one end of the wafer loading mechanism 10 and the wafer unloading mechanism along the loading direction of the wafer 200. The testing mechanism includes a testing machine, at least one test handling device and at least one test carrier. The test handling device is configured to controllably transport the tested chip in the test carrier to the conveyor tray 52, and can controllably transport the chip to be tested in the conveyor tray 52 on the second conveying section 53 to the test carrier. The test carrier is configured to move back and forth between the testing machine and the test handling device, so as to be able to carry the chip to be tested 300 and cooperate with the testing machine, and then perform functional testing on the chip to be tested 300.

[0053] Figure 7 FIG is a schematic structural diagram of a sealing assembly 90 according to an embodiment of the present invention. Figure 7As shown, in some embodiments, the chip testing equipment further includes a sealing assembly 90. The sealing assembly 90 is disposed at the junction of the second conveying section 53 and the first conveying section 51 and is arranged on one side of the testing mechanism. The sealing assembly 90 has a sealed cavity for accommodating the conveying tray 52. ​​The sealed cavity is provided with an air circuit assembly. The air circuit assembly is controlled to evacuate or inflate the sealed cavity. As the conveying tray 52 is conveyed from the first conveying section 51 through the sealed cavity to the second conveying section 53, the conveying environment of the conveying tray 52 can be switched by controlling the air circuit assembly.

[0054] Here, the air circuit assembly is used to fill the sealed chamber with dry air or to evacuate the sealed chamber. As the conveyor tray 52 enters the sealed chamber, the air circuit assembly continuously fills the sealed chamber with dry air, preventing air from entering the sealed chamber. As the conveyor tray 52 is transferred from the sealed chamber to the second conveying section 53, the air circuit assembly continuously evacuates the sealed chamber, generating a negative pressure. This allows air within the test chamber to enter the sealed chamber, preventing air from entering the test chamber, thereby effectively controlling the dew point environment within the test chamber.

[0055] In some embodiments, the sealing assembly 90 is provided with a first sealing door 91 and at least one second sealing door 92. The first sealing door 91 is docked with the first conveying section 51, and the second sealing door 92 is docked with the second conveying section 53, and both the first sealing door 91 and the second sealing door 92 can be opened and closed in a controlled manner. When the first sealing door 91 is open, the sealing chamber is connected to the first conveying section 51. The first conveying section 51 conveys the conveying tray 52 to the sealing chamber of the sealing assembly 90. When the second sealing door 92 is open, the sealing chamber is connected to the second conveying section 53. The second conveying section 53 receives the conveying tray 52 conveyed in the sealing chamber of the sealing assembly 90. Here, when the first sealing door 91 is open, the air circuit assembly continuously fills the sealing chamber with dry air until the first sealing door 91 is closed. When the second sealing door 92 is open, the air circuit assembly continuously evacuates the sealing chamber until the second sealing door 92 is closed.

[0056] Figure 8 FIG is a schematic structural diagram of a testing mechanism according to an embodiment of the present invention. Figure 8 As shown, in a specific embodiment, the test mechanism includes two test handling devices 96 and two test bearing seats 95; Two test handling devices 96 are disposed opposite each other on either side of the test machine 94; two test carriers 95 are disposed in a one-to-one correspondence with the two test handling devices 96; the conveying mechanism 50 includes two conveying trays 52; the second conveying section 53 includes a first branch conveying section 531 and a second branch conveying section 532, which are collinearly arranged along the second horizontal direction; The sealing assembly 90 is arranged between the branch 1 conveying section 531 and the branch 2 conveying section 532; the two conveying trays 52 can alternately pass through the sealing cavity and move along the branch 1 conveying section 531 and the branch 2 conveying section 532 respectively; the two sets of test handling devices 96 are used to transport the chips 300 to be tested in the corresponding conveying trays 52 to the corresponding test carriers 95, and to transport the tested chips in the test carriers 95 to the conveying trays 52; the two test carriers 95 can be controlled to move alternately along the second direction to the test position of the testing machine 94.

[0057] Specifically, the sealing assembly 90 is provided with two oppositely arranged second sealing doors 92, and the two second sealing doors 92 are respectively arranged corresponding to the branch 1 conveying section 531 and the branch 2 conveying section 532; the first conveying section 51 and the branch 1 conveying section 531 and the branch 2 conveying section 532 are arranged in a T shape.

[0058] Specifically, the test transport device 96 includes a transport rail 962 and a material handling device 961; the material handling device 961 can move along the transport rail 962 in a controlled manner; the two transport rails 962 are arranged on both sides of the testing machine 94 along the first horizontal direction and correspond to the branch one conveying section 531 and the branch two conveying section 532 respectively.

[0059] Specifically, the layout of the left and right sides of the test machine 94 is identical; The layout on one side of the testing machine 94 is explained as follows: the conveyor tray 52 can be moved along a branch conveying section 531 to the first upper and lower material positions, and the corresponding material handling device 961 can transport the chip 300 to be tested in the conveyor tray 52 to the corresponding test carrier 95, and the material handling device 961 can also transport the tested chip in the test carrier 95 to the conveyor tray 52.

[0060] Figure 9 FIG. 1 is a schematic flow chart of a control method for a chip testing device according to an embodiment of the present invention. Figure 9 As shown, in a specific embodiment, a control method of a chip testing device is applied to the above-mentioned chip testing device, comprising the following steps: Step S100: In response to a trigger instruction for loading, the first suction component 42 is controlled to absorb the chip under test 300 on the wafer loading mechanism 10 and transport the chip under test 300 to the loading area 521 of the conveyor tray 52. ​​In response to a trigger instruction for unloading, the second suction component 43 is controlled to absorb the tested chip on the unloading area 522 of the conveyor tray 52 and transport the tested chip to the carrier tray of the wafer unloading mechanism. The trigger instructions for loading and unloading are triggered synchronously. Step S200, controlling the conveyor tray 52 to be conveyed along the first upper and lower material positions of the first conveying section 51 to the second upper and lower material positions of the second conveying section 53; Step S300 , controlling the test transport device to transport the tested chip on the test carrier to the unloading area 522 of the conveyor tray 52 ; Step S400 , controlling the test transport device to transport the chip 300 to be tested in the loading area 521 to the test carrier; Step S500 , controlling the test carrier to move to a test position of a test machine, and controlling the test machine to perform a performance test on the chip 300 to be tested.

[0061] This embodiment uses the same conveyor tray 52 to transport the chips to be tested 300 and the tested chips. The chips can be unloaded while being loaded, which can reduce the number of conveyances and thus improve the chip testing efficiency.

[0062] Figure 10 FIG. 1 is a schematic flow chart of a control method for a chip testing device according to another embodiment of the present invention. Figure 10 As shown, in some embodiments, the step of controlling the second adsorption component 43 to absorb the tested chips on the unloading area 522 of the conveyor tray 52 and transporting the tested chips to the wafer unloading mechanism specifically includes the following steps: According to the test results of the tested chips, the second adsorption assembly 43 is controlled to transport the tested chips on the unloading area 522 to the corresponding first wafer unloading mechanism 21 or the second wafer unloading mechanism 22 .

[0063] This embodiment provides a first wafer unloading mechanism 21 and a second wafer unloading mechanism 22 for unloading. The second adsorption component 43 drives the tested chip to move to the first wafer unloading mechanism 21 or the second wafer unloading mechanism 22 for unloading according to the Bin value information of the tested chip given by the tester. The Bin value information corresponding to the first wafer unloading mechanism 21 and the second wafer unloading mechanism 22 is different.

[0064] In some embodiments, the step of controlling the second adsorption assembly 43 to move the tested chips on the unloading area 522 to the corresponding first wafer unloading mechanism 21 or second wafer unloading mechanism 22 according to the test results of the tested chips specifically includes the following steps: Step S111: If the test result of the tested chip meets the first preset condition, the second adsorption assembly 43 is controlled to adsorb the tested chip in the unloading area 522 and move along the second sliding assembly to place the tested chip on the unloading tray 215; Step S112, controlling the unloading tray 215 to move along the first guide rail 213 to a target unloading position; In step S113 , the third adsorption assembly 216 is controlled to adsorb the tested chips on the unloading tray 215 and move along the first sliding assembly to place the tested chips on the first carrier tray.

[0065] In step S111, the first preset condition corresponds to the first Bin value information. The tested chip is placed on the blue film of the first carrier.

[0066] After step S113, the following steps are further included: The first manipulator 212 is controlled to clamp the first carrier plate on the first carrier platform 214 and slide along the first guide rail 213 to drive the first carrier plate to move into the first unloading bin 211, thereby completing unloading. Here, the first manipulator 212 clamps the steel ring on the first carrier plate.

[0067] In some embodiments, the step of controlling the second adsorption assembly 43 to move the tested chips on the unloading area 522 to the corresponding first wafer unloading mechanism 21 or second wafer unloading mechanism 22 according to the test results of the tested chips further includes the following steps: In step S114, if the test results of the tested chip meet the second preset condition, the second suction assembly 43 is controlled to suction the tested chip from the unloading area 522 and move along the second sliding assembly to place the tested chip on the second carrier. The second preset condition is different from the first preset condition and corresponds to the second Bin value information. It should be noted that there is no order relationship between step S114 and step S111. The tested chip is placed on the blue film of the second carrier.

[0068] After step S114, the following steps are further included: The second manipulator 223 is controlled to clamp the second carrier plate on the second carrier platform 222 and slide along the second guide rail 224 to drive the second carrier plate to move into the second unloading bin 221, thereby completing unloading. Here, the second manipulator 223 clamps the steel ring on the second carrier plate.

[0069] In some embodiments, after the second adsorption component 43 adsorbs the tested chip in the unloading area 522, it is necessary to first drive the tested chip to move to the second visual inspection mechanism 70 for surface defect detection, and unload the tested chip that has been inspected normally according to the first preset condition or the second preset condition that is met. The tested chip that has been inspected abnormally is placed on the waste tray 80. Specifically, the second visual inspection mechanism 70 first inspects the two sides of the tested chip. After the inspection is completed, the second adsorption component 43 drives the tested chip to rotate 90°, and the second visual inspection mechanism 70 then inspects the other two sides of the tested chip. The second visual inspection mechanism 70 here can be understood as a lower visual inspection camera. The second adsorption component 43 can complete the visual inspection by adsorbing the tested chip in the inspection area of ​​the lower visual inspection camera. In other words, the tested chip is always adsorbed by the second adsorption component 43 during the inspection process.

[0070] In some embodiments, in response to a loading trigger instruction, the step of controlling the first adsorption assembly 42 to absorb the chip under test 300 on the wafer loading mechanism 10 and transporting the chip under test 300 to the loading area 521 of the conveyor tray 52 specifically includes the following steps: Step S115: Control the third manipulator to clamp the first carrier tray in the loading bin 11 and control the third manipulator to slide along the third guide rail to drive the first carrier tray to move to the third carrier platform 12; Step S116: controlling the edge-finding camera to find the edge of the first carrier plate on the third carrier platform 12, and controlling the adsorption rod 421 of the first adsorption assembly 42 to adsorb the chip 300 to be tested on the third carrier plate; Step S117: Control the first adsorption component 42 to move the chip to be tested 300 to the first visual inspection mechanism 60 for inspection; Step S118: Control the first adsorption assembly 42 to place the normal chips 300 on the loading area 521 of the conveyor tray 52, and place the abnormal chips 300 on the waste tray 80. It should be noted that there is no order between step S115 and step S111.

[0071] In step S117, the first visual inspection mechanism 60 first inspects two sides of the chip under test 300. After the inspection is complete, the suction rod 421 of the first suction assembly 42 rotates the chip under test 300 90°, and the first visual inspection mechanism 60 then inspects the other two sides of the chip under test 300. The first visual inspection mechanism 60 here can be understood as the lower visual inspection camera. The first suction assembly 42 suctions the chip under test 300 to the inspection area of ​​the lower visual inspection camera to complete the visual inspection. In other words, the chip under test 300 is always suctioned by the first suction assembly 42 during the inspection process. Steps 1 to 4 can be understood as the loading steps of the wafer loading and unloading machine 100.

[0072] In some embodiments, the two test carriers 95 are defined as a first test carrier and a second test carrier, and the control method of the chip testing device further includes the following steps: Step 1: Control the first test carrier to move to the test station, and control the first test carrier to be electrically connected to the test machine 94, so as to perform a performance test on the chip 300 under test on the first test carrier; Step 2: After the chip under test 300 completes the test, the first test carrier is controlled to move out of the test station; Step 3: Control the second test carrier to move to the test station, and control the second test carrier to be electrically connected to the test machine 94, so as to perform performance testing on the chip 300 to be tested on the second test carrier.

[0073] This embodiment uses two test carriers 95 to move alternately to the test station, reducing the loading waiting time. The test machine 94 alternately tests the chips 300 to be tested on the two test carriers 95 and is always in a testing state, thereby improving the chip testing efficiency.

[0074] At this point, those skilled in the art will recognize that, although a number of exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications consistent with the principles of the present invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A wafer loading and unloading machine, characterized in that: include: A wafer loading mechanism, configured to transfer a wafer along a first horizontal direction to a loading position, wherein the wafer has a plurality of chips to be tested; At least one wafer unloading mechanism, arranged on the same side as the wafer loading mechanism, for transporting the carrier tray carrying the tested chips from the unloading position to the silo; The conveying mechanism includes a first conveying section, a second conveying section, and at least one conveying tray; the first conveying section and the second conveying section are arranged in a docking relationship; the first conveying section is located on one side of the wafer loading mechanism and the wafer unloading mechanism, and the second conveying section is located on one side of the testing mechanism; the conveying tray can be controlled to reciprocate between a first loading and unloading position of the first conveying section and a second loading and unloading position of the second conveying section; The conveyor tray has a loading area and a unloading area, the loading area is used to place the chips to be tested, and the unloading area is used to place the tested chips after the test is completed; The loading and unloading material handling mechanism includes a first adsorption component and a second adsorption component. The first adsorption component and the second adsorption component are both configured to be movable along a second horizontal direction. The first adsorption component is used to transport the chip to be tested on the wafer loading mechanism to the loading area; the second adsorption component is used to transport the tested chip in the unloading area to the carrying plate of the wafer unloading mechanism. The second horizontal direction is perpendicular to the first horizontal direction.

2. The wafer loading and unloading machine according to claim 1, characterized in that: The loading and unloading material handling mechanism includes a loading and unloading material handling guide rail; The loading and unloading transport guide rail is arranged along the second horizontal direction, and the first adsorption component is controlled to move along the loading and unloading transport guide rail, and is able to move back and forth between the loading position and the first loading and unloading position, and is able to transport the chips to be tested on the wafer to the conveyor tray; The second adsorption component is controlled to move along the loading and unloading conveying guide rail, and can move back and forth between the first loading and unloading position and the unloading position, and can convey the measured chips in the conveying tray to the carrying tray at the unloading position.

3. The wafer loading and unloading machine according to any one of claims 1-2, characterized in that: The wafer unloading mechanism includes a first wafer unloading mechanism and a second wafer unloading mechanism arranged on the same side and in parallel, and the first wafer unloading mechanism is arranged between the wafer loading mechanism and the second wafer unloading mechanism; the first wafer unloading mechanism and the second wafer unloading mechanism are respectively used to unload chips with different test results.

4. The wafer loading and unloading machine according to claim 3, characterized in that: The first wafer unloading mechanism includes: A first carrying platform is arranged opposite to the conveying mechanism, and a first carrying tray is provided on the first carrying platform, and the first carrying tray is used to receive the corresponding tested chip; a first guide rail, arranged on one side of the conveying mechanism along the first horizontal direction; A material unloading tray is slidably mounted on the first guide rail, and the second adsorption assembly is controlled to place the tested chips on the conveying tray on the material unloading tray; a first sliding assembly, arranged above the first carrying platform along the second horizontal direction; The third adsorption component is slidably mounted on the first sliding component and is used to transport the tested chips on the unloading tray to the first carrying tray.

5. The wafer loading and unloading machine according to claim 4, characterized in that: The first wafer unloading mechanism further includes: A first unloading silo is provided in front of the first carrying platform; The first manipulator is slidably mounted on the first guide rail and is used to clamp the first carrying plate and drive it to move into the first unloading bin.

6. The wafer loading and unloading machine according to claim 4, characterized in that: The loading and unloading transport mechanism also includes: a second sliding assembly, mounted on top of the wafer loading mechanism, the wafer unloading mechanism, and the conveying mechanism along the second horizontal direction, and arranged parallel to the first sliding assembly, and the first adsorption assembly and the second adsorption assembly are both slidably mounted on the second sliding assembly; The wafer loading and unloading machine also includes: A waste tray is installed on a side of the conveying mechanism close to the wafer unloading mechanism and is used to place damaged tested chips.

7. The wafer loading and unloading machine according to claim 5, characterized in that: The second wafer unloading mechanism includes: A second unloading silo is arranged in parallel with the first unloading silo; A second carrying platform is arranged along the first horizontal direction, and a second carrying tray is provided on the second carrying platform, and the second carrying tray is used to receive the corresponding tested chip; a second guide rail arranged along the first horizontal direction; The second manipulator is slidably mounted on the second guide rail and is used to clamp the second carrying plate to drive it to move into the second unloading bin.

8. The wafer loading and unloading machine according to claim 1, characterized in that: The wafer loading mechanism comprises: Loading silo, used to store wafers to be loaded; a third carrying platform, arranged along the first horizontal direction, for carrying the wafer; a third guide rail arranged along the first horizontal direction; The third robot is slidably mounted on the third guide rail, and is used for clamping the wafer in the loading bin and driving the wafer to move onto the third carrying platform.

9. A chip testing device, characterized in that: include: The wafer loading and unloading machine according to any one of claims 1 to 8; A testing mechanism is provided at one end of the wafer loading mechanism and the wafer unloading mechanism along the wafer loading direction; the testing mechanism includes a testing machine, at least one testing handling device and at least one testing carrier; The test handling device is configured to controllably carry the tested chips in the test carrier to the conveyor tray, and controllably carry the chips to be tested in the conveyor tray on the second conveying section to the test carrier; The test carrier is configured to move back and forth between the test machine and the test handling device, thereby being able to carry the chip to be tested and cooperate with the test machine to perform a functional test on the chip to be tested.

10. The chip testing device according to claim 9, characterized in that: Also includes: A sealing assembly, the sealing assembly being provided at the junction of the second conveying section and the first conveying section and being arranged on one side of the testing mechanism; The sealing assembly has a sealing cavity for accommodating the conveying disc; an air circuit assembly is provided in the sealing cavity, and the air circuit assembly is controlled to evacuate or inflate the sealing cavity, so that when the conveying disc is conveyed from the first conveying section through the sealing cavity to the second conveying section, the conveying environment of the conveying disc can be switched by controlling the air circuit assembly.

11. The chip testing device according to claim 10, characterized in that: The testing mechanism includes two testing transport devices and two testing bearing seats; The two test handling devices are respectively arranged on both sides of the test machine; the two test bearing seats are arranged in a one-to-one correspondence with the two test handling devices; The conveying mechanism includes two conveying trays; the second conveying section includes a branch conveying section 1 and a branch conveying section 2, and the branch conveying section 1 and the branch conveying section 2 are collinearly arranged along the second horizontal direction; The sealing assembly is arranged between the branch line 1 conveying section and the branch line 2 conveying section; The two conveying trays can alternately pass through the sealed cavity and move along the first conveying section of the branch line and the second conveying section of the branch line respectively; The two groups of test transport devices are used to transport the chips to be tested in the corresponding conveyor tray to the corresponding test carrier, and to transport the tested chips in the test carrier to the conveyor tray; the two test carriers can be controlled to move alternately along the second direction to the test position of the testing machine.

12. A control method for a chip testing device, applied to the chip testing device according to any one of claims 9 to 11, characterized in that: The steps include: In response to a trigger instruction for loading, the first adsorption component is controlled to absorb the chip to be tested on the wafer loading mechanism and move the chip to be tested to the loading area of ​​the conveyor tray; in response to a trigger instruction for unloading, the second adsorption component is controlled to absorb the tested chip on the unloading area of ​​the conveyor tray and move the tested chip to the carrier tray of the wafer unloading mechanism. The trigger instruction for loading and the trigger instruction for unloading are triggered synchronously. Controlling the conveyor tray to be conveyed along the first upper and lower material positions of the first conveying section to the second upper and lower material positions of the second conveying section; Controlling the test transport device to transport the tested chips on the test carrier to the unloading area of ​​the conveyor tray; Controlling the test transport device to transport the chip to be tested in the loading area to the test carrier; The test carrier is controlled to move to a test position of a test machine, and the test machine is controlled to perform a performance test on the chip to be tested.

13. The control method according to claim 12, characterized in that: The step of controlling the second adsorption component to absorb the tested chip on the unloading area of ​​the conveyor tray and transporting the tested chip to the wafer unloading mechanism specifically includes the following steps: According to the test result of the tested chip, the second adsorption component is controlled to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism.

14. The control method according to claim 13, characterized in that: The step of controlling the second adsorption assembly to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or the second wafer unloading mechanism according to the test result of the tested chip specifically includes the following steps: If the test result of the tested chip meets the first preset condition, controlling the second adsorption component to adsorb the tested chip in the unloading area and move along the second sliding component to place the tested chip on the unloading tray; Controlling the unloading tray to move along the first guide rail to a target unloading position; The third adsorption component is controlled to adsorb the tested chip on the unloading tray and move along the first sliding component to place the tested chip on the first carrying tray.

15. The control method according to claim 14, characterized in that: The step of controlling the second adsorption component to transport the tested chip on the unloading area to the corresponding first wafer unloading mechanism or second wafer unloading mechanism according to the test result of the tested chip also includes the following steps: If the test result of the tested chip meets the second preset condition, the second adsorption component is controlled to adsorb the tested chip in the unloading area and move along the second sliding component to place the tested chip on the second carrier plate. The second preset condition is different from the first preset condition.

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