Method for copper plating of superconducting tapes and continuous thickness measurement device

Abstract

The application discloses a kind of superconducting strip copper plating method and continuous thickness measuring equipment.The method comprises the following steps: S1, initial electrochemical copper plating is carried out on the strip to be processed;S2, high-precision continuous thickness measuring equipment is used to test the thickness of the coating in the length and width direction of the strip;S3, the thickness distribution data obtained by testing is used to dynamically control the subsequent electroplating process parameters;S4, the steps of copper plating and testing-control are repeated until the cumulative coating reaches the target thickness.The application combines copper plating process with testing, feedback control, breaks through the bottleneck of copper plating uniformity control caused by long production line dynamic deformation, realizes accurate control of the uniformity of the copper plating layer of superconducting strip, and is especially suitable for high-magnetic-field coil applications with extremely high coating uniformity requirements, effectively improving the winding quality and stability of electromagnetic performance.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of superconducting materials, and in particular relates to a copper plating method for superconducting tape and a continuous thickness measuring device, in particular to a copper plating method for superconducting tape and a test control method. BACKGROUND

[0002] In recent years, with the gradual maturity of superconducting tape preparation process, the electromagnetic performance and mechanical performance of the second generation high-temperature superconducting material have been significantly improved. The progress and cost-effective of the second generation high-temperature superconducting tape technology further develops in the fields of physics, biology, chemistry, materials, medicine and engineering, and the application of superconducting tape also goes from the laboratory to various application scenarios. The second generation high-temperature superconducting tape has extremely high current-carrying capacity and excellent mechanical performance at low temperature, so it plays an irreplaceable role in the manufacture of high-field magnets.

[0003] Superconducting coil winding is the first step and the core link of high-field magnet device research and development, and the quality of coil winding directly determines the performance of the coil. In the actual winding process of the coil, the thickness of the tape is one of the key factors that determine the winding quality. The poor thickness uniformity of the superconducting tape along the length direction or the large thickness difference along the width direction will have a great impact on the wound coil.

[0004] The poor thickness uniformity of the superconducting tape along the length direction will cause the outer diameters of the wound double-pie coil to be inconsistent, which seriously affects the mechanical balance of the coil under high field. The first coil 301 and the second coil 302 of the above double-pie coil are as shown in Figure 8 ;

[0005] When the superconducting tape has a thickness difference along the width direction, after being wound into a coil, a thickness difference of 1 μm can reach 300 μm after 300 turns are accumulated, and the thinner side will periodically deviate to fill the horizontal difference, and the deviation layer 401 is as shown in Figure 9 ; The thicker side will present a bowl shape under a large tension, and the case is as shown in Figure 12 ; A gap 402 is generated between the superconducting tape and the inner wall.

[0006] With the rapid development of low-temperature high-field magnets (>20T), it puts forward more stringent mechanical requirements for the superconducting coil winding process - in the environment of more than 20T ultra-high magnetic field, in order to resist the huge Lorentz force and maintain the stability of the coil structure, the winding tension needs to be increased to 50-70MPa (equivalent to 3-5 times of the conventional magnet). The ultra-high tension will amplify the damage effect of the uneven thickness of the tape, causing the deformation of the edge of the tape, as shown in Figure 13 .

[0007] In the process of electrochemical copper plating of superconducting tapes, due to the edge electric field concentration effect, a concentration polarization phenomenon occurs, which leads to a local increase in current density at the sharp part of the tape cross section, resulting in an abnormal thickening of the copper layer in this area, forming a plated layer with a "bone-shaped" cross-section distribution, as shown in Figure 6 .

[0008] To suppress this effect, patent document CN113089060B discloses a roll-to-roll superconducting tape copper plating device and method, which mainly uses a shielding plate 201 structure ( Figure 7 ) to selectively shield the electric field, making the electric field distribution tend to be uniform, and the tape cross-section bone shape is small.

[0009] However, this method faces major challenges in the continuous production of long-size tapes: in order to improve the copper plating efficiency, a relatively long copper plating production line is often needed. As shown in Figure 10 When the length of the copper plating production line is large, such as 31m, the two ends of the production line are respectively the feeding end 206 and the receiving end 207, and the superconducting tape 202 will produce vertical deformation due to gravity during the tape running process. The local enlarged view shows the situation that the superconducting tape 202 deviates from the center line 205, i.e. the "smile-shaped" under-bending phenomenon, which causes the local area of the tape to deviate from the pre-set electric field optimization interval of the shielding plate 201.

[0010] This dynamic position deviation makes the electric field regulation of the shielding plate 201 hole / slot inaccurate, causing uncontrollable thickness fluctuations (left / right deviation up to ±5μm) in the tape, which seriously restricts the overall uniformity of the plated layer. Therefore, it is urgent to develop a copper plating uniformity control method that can adapt to the dynamic working conditions of long production lines.

[0011] The existing tape thickness detection technology has serious bottlenecks:

[0012] The thickness measurement of the current second-generation high-temperature superconducting tape mainly relies on manual micrometer contact point detection. This contact measurement has the risk of physical damage and is easy to produce indentation / scratch on the surface of the tape ( Figure 11 ), with a damage rate of >5%, affecting product quality.

[0013] In addition, manual detection has the problem of insufficient efficiency and accuracy. To evaluate the thickness uniformity of 100 meters of tape, one detection point needs to be selected every 2 meters (only 50 discrete data are obtained), and a single person's single detection takes ≥60 minutes. This low sampling density + high time cost mode makes it impossible for the production line to respond to thickness fluctuations in a timely manner, and the process adjustment is severely lagging.

[0014] Therefore, developing a non-contact, fully automatic, high-density continuous thickness measurement method has become a core prerequisite for breaking through the bottleneck of copper plating uniformity control.

[0015] Patent document CN113089038B discloses a superconducting tape pre-copper plating method, copper plating method and copper plating device. The superconducting tape copper plating device includes a feeding mechanism, a first cleaning mechanism, a pre-copper plating mechanism, a bright copper plating mechanism, a sand surface copper plating mechanism, a second cleaning mechanism, a passivation mechanism, a drying mechanism and a material collecting mechanism. The feeding mechanism is used for unwinding the processed tape. The processed tape sequentially passes through the first cleaning mechanism, the pre-copper plating mechanism, the bright copper plating mechanism, the sand surface copper plating mechanism, the second cleaning mechanism, the passivation mechanism, the drying mechanism and is wound on the material collecting mechanism during processing. The pre-copper plating mechanism adopts first current electroplating treatment. The bright copper plating mechanism adopts third current electroplating treatment. The sand surface copper plating mechanism adopts second current electroplating treatment. The present application solves the problem of liquid corrosion of the superconducting layer by adopting the design of pre-copper plating, copper plating and the like. At the same time, the quality of the superconducting tape after electroplating is good, and the electroplating efficiency is high.

[0016] However, patent document CN113089038B does not solve the problem of vertical deformation of the superconducting tape due to gravity when the superconducting tape is on a long copper plating production line, and the overall uniformity of the plating layer is low.

[0017] In summary, the existing second-generation high-temperature superconducting tape copper plating technology cannot adapt to the dynamic working condition requirements of long production line continuous copper plating with static control means and discrete detection mode. Therefore, there is an urgent need for a high-uniformity superconducting tape copper plating method and testing and control method suitable for strong magnetic field coil winding. SUMMARY

[0018] In view of the defects in the prior art, the purpose of the present application is to provide a superconducting tape copper plating method and a continuous thickness measuring device.

[0019] According to the superconducting tape copper plating method provided by the present application, the following steps are included:

[0020] S1: initial electrochemical copper plating is performed on the processed superconducting tape;

[0021] S2: a continuous thickness measuring device is used to test the plating layer thickness in the length and width directions of the superconducting tape;

[0022] S3: the plating layer thickness distribution data obtained by monitoring is used to control the subsequent electroplating process parameters;

[0023] S4: the above steps are repeated until the plating layer accumulates to the target thickness.

[0024] Preferably, the S3 further includes adjusting the position of the shielding plate according to the plating layer thickness distribution data obtained by monitoring.

[0025] Preferably, the S3 further includes adjusting the position of the shielding plate according to the plating layer thickness distribution data obtained by monitoring.

[0026] The regulating electroplating processing mode comprises: turning the superconducting strip material to be processed by 180° around the center axis in the length direction thereof.

[0027] Preferably, in S1, comprising:

[0028] S1.1: sequentially performing once cleaning treatment, bright copper plating treatment, matte copper plating treatment and twice cleaning treatment on the superconducting strip material;

[0029] S1.2: performing passivation and drying treatment on the superconducting strip material after the twice cleaning treatment.

[0030] Preferably, in S1.1, the pre-copper plating treatment is performed before the bright copper plating and the matte copper plating treatment, the pre-copper plating treatment adopts first current electroplating treatment, and the matte copper plating treatment adopts second current electroplating treatment.

[0031] The current density of the first current is greater than that of the second current.

[0032] The pre-copper plating electroplating solution used in the pre-copper plating treatment has a weight composition of: copper sulfate 200-240 parts, sulfuric acid 50-70 parts, chloride ion 0.08-0.1 parts, and a pre-copper plating acid additive allowing the current density of the first current to work is added.

[0033] The pre-copper plating acid additive has a weight composition of: opening agent 6-8 parts, supplement 2-3 parts.

[0034] The matte copper electroplating solution used in the matte copper plating treatment has a weight composition of: copper sulfate 180-220 parts, sulfuric acid 50-80 parts, chloride ion 0.06-0.13 parts, and a matte copper acid copper additive allowing the current density of the second current to work is added.

[0035] Preferably, the superconducting strip material adopts vertical strip running mode in the copper plating process, so that the width direction of the superconducting strip material is perpendicular to the horizontal direction, and the upper and lower edges of the width direction of the superconducting strip material are respectively set as A edge and B edge.

[0036] Preferably, the superconducting strip material is silver strip with initial thickness X μm before copper plating, and is processed into superconducting strip material with total thickness Y μm by the superconducting strip material copper plating method of the application, the number of copper plating is N, N is an even number, the thickness of the n-th copper plating layer at the A edge is a n , the thickness of the n-th copper plating layer at the B edge is b n , the cumulative thickness of the copper plating layer at the A edge side after the n-th copper plating is T An =a1+a2+...+a n , the cumulative thickness of the copper plating layer at the B edge side after the n-th copper plating is T Bn =b1+b2+...+b n , and the average thickness of the n-th copper plating layer in the length direction of the strip material is d.n ;

[0037] In the S3, the regulation mode is determined according to the current plating times:

[0038] When n n -(Y-X) / N|≤e1, and |b n -(Y-X) / N|≤e1, e1 is the maximum allowable deviation value between the single plating thickness and the ideal thickness;

[0039] After N / 2 times of copper plating, the total plating thickness of the superconducting tape A and B edges is T A(N / 2) =a1+a2+...+a N / 2 , T B(N / 2) =b1+b2+...+b N / 2 , and the average total plating thickness of the tape length direction is F (N / 2) =d1+d2+...+d N / 2 ;

[0040] The copper plating process for n>N / 2 is adjusted as follows:

[0041] If |T A(N / 2) -T B(N / 2) |>e0, the regulation processing mode is adopted, thereby reversing the A and B edges, for the kth plating after N / 2 times, a (N / 2+k) / b (N / 2+k) =b k / a k , 1≤k≤N / 2, e0 is the maximum allowable thickness difference in the width direction;

[0042] If T A(N / 2) +T B(N / 2) ≠Y-X, the current density and the tape running speed are adjusted to ensure that |a n +b n -[(2n / N)*(Y-X)-(T A(n-1) +T B(n-1) )]|≤e2, where N / 2

[0043] Preferably, the copper plating method of the superconducting tape of the present application uses a plating tank provided with a cathode, an anode and a shielding plate;

[0044] The cathode is the processed superconducting tape, and the anode is made of copper;

[0045] The shielding plate has holes or grooves and is arranged between the cathode and the anode and parallel to the cathode and the anode;

[0046] The cathode is located at the center of the electroplating tank, the electroplating tank has a plating solution jet hole at a position 0.5-3.5 cm away from the cathode, the anode is 4-8 cm away from the cathode, and the shielding plate can be arranged at any adjustable position 0-8 cm away from the cathode.

[0047] Preferably, when n≠N / 2, if T An ≠T Bn , the thickness difference of the plating layer in the width direction of the strip is compensated by adjusting the distance between the shielding plate and the cathode:

[0048] If T An >T Bn , the shielding plate is adjusted to be 0-3 cm away from the superconducting strip, so that b n+1 -a n+1 =T An -T Bn =H λ , and |T A(n+1) -T B(n+1) |≤e3;

[0049] If T An <T Bn , the shielding plate is adjusted to be 4-8 cm away from the superconducting strip, so that a n+1 -b n+1 =T Bn -T An =H λ , and |T A(n+1) -T B(n+1) |≤e3;

[0050] e3 is the maximum difference allowed between the cumulative plating layer thicknesses in the width direction of the strip at positions A and B during any one electroplating process, H represents the thickness difference of the copper plating layer at the edges of the strip at different positions of the shielding plate, and λ represents the relative position of the shielding plate to the cathode. When the shielding plate is 4-8 cm away from the cathode, the thickness of the copper plating layer on the upper side of the superconducting strip is greater than that on the lower side. When the shielding plate is 0-3 cm away from the cathode, the thickness of the copper plating layer on the lower side of the superconducting strip is greater than that on the upper side.

[0051] The thickness of the processed superconducting strip in the length direction after N-1 times of copper plating is determined, and d n =(Y-X)-F (N-1) is controlled, so that the cumulative plating layer thickness F N =d1+d2+...+d n in the length direction of the strip after the Nth time of copper plating, and finally |F N -(Y-X)|≤e4 is achieved, e4 being the maximum difference allowed between the actual plating layer thickness and the target plating layer thickness in the length direction of the strip.

[0052] A continuous thickness measuring device is provided according to the application, which is used in the copper plating method of the superconducting tape, and the continuous thickness measuring device comprises:

[0053] a whole frame 101;

[0054] a tape running system, comprising a winding system 102, an unwinding system 103, a speed encoder system 104 and a tension control system 105;

[0055] a capacitive thickness measuring unit 106, comprising a first capacitive thickness gauge and a second capacitive thickness gauge fixed to the whole frame 101, and the capacitive thickness measuring unit 106 is used for measuring the thickness uniformity of the superconducting tape in the length direction;

[0056] a laser thickness measuring unit 107, comprising a first laser thickness gauge and a second laser thickness gauge fixed to the whole frame 101, and the laser thickness measuring unit 107 is used for measuring the thickness uniformity of the superconducting tape in the width direction;

[0057] a control system 108, which is electrically connected with the tape running system, the capacitive thickness measuring unit 106 and the laser thickness measuring unit 107, and is used for outputting thickness measuring data in real time.

[0058] Compared with the prior art, the application has the following beneficial effects:

[0059] 1. The application provides a copper plating method and test and control method of high-uniformity superconducting tape suitable for strong magnetic field coil winding, which adjusts the plating power parameters, the relative position of the plating shielding plate and the plating processing mode through test data, compensates for position deviation, solves the problem of that the thickness deviation in the width direction is greater than ±5 μm due to the misalignment of the traditional shielding plate caused by the gravity deformation of the tape, and the thickness difference of the prepared tape in the width direction is less than or equal to 1 μm.

[0060] 2. The application provides a copper plating method and test and control method of high-uniformity superconducting tape suitable for strong magnetic field coil winding, which solves the problems of surface damage (damage rate greater than 5%) and low efficiency of artificial contact detection through non-contact efficient thickness measurement and process linkage, realizes zero damage of the tape surface, and dynamically adjusts the process.

[0061] 3. The application provides a copper plating method and test and control method of high-uniformity superconducting tape suitable for strong magnetic field coil winding, which reduces the comprehensive manufacturing cost of the strong magnetic field coil. The traditional copper plating process has poor copper plating uniformity, which leads to a coil winding scrap rate greater than 40%, the yield of the coil winding of the prepared tape is improved to 98% by the process, and the production cost is reduced by 40%. BRIEF DESCRIPTION OF DRAWINGS

[0062] Other features, objects, and advantages of the application will become apparent from the detailed description of non-limiting embodiments thereof as described below, taken in conjunction with the accompanying drawings:

[0063] Figure 1 Flow chart of the copper plating method and test regulation method for the superconducting tape in the embodiments of the present application;

[0064] Figure 2 Adjustment schematic diagram of the position of the shielding structure during copper plating in the embodiments of the present application;

[0065] Figure 3 Schematic diagram of the flow of the electroplating solution near the cathode at different shielding positions in the embodiments of the present application;

[0066] Figure 4 Relationship diagram of the current density and the plating layer thickness under the solution ratio in the embodiments of the present application;

[0067] Figure 5 High-precision continuous thickness measuring equipment diagram in the embodiments of the present application;

[0068] Figure 6 Superconducting bone-shaped tape cross-sectional diagram in the background art of the present application;

[0069] Figure 7 Shielding structure and tape cross-sectional schematic diagram between the anode and the cathode during copper plating in the background art of the present application;

[0070] Figure 8 Double-coil winding physical diagram in the background art of the present application;

[0071] Figure 9 Layered winding schematic diagram in the background art of the present application;

[0072] Figure 10 Tape offset relative to the center line schematic diagram under the influence of gravity in the background art of the present application;

[0073] Figure 11 Superconducting tape micrometer test damage physical diagram in the background art of the present application;

[0074] Figure 12 Bowl-shaped winding schematic diagram in the background art of the present application;

[0075] Figure 13 Tape winding edge plastic deformation physical diagram in the background art of the present application.

[0076] The drawings show:

[0077] DETAILED DESCRIPTION

[0078] The application will be described in detail below with specific examples. The following examples will help those skilled in the art to further understand the application, but do not limit the application in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the application. These are within the scope of the application.

[0079] High-field magnets play an extremely important role in the development of science and technology, and give birth to many major scientific discoveries and the generation of new technologies. High-field nuclear magnetic resonance technology, used for analyzing and determining the structure of proteins and other macromolecules, greatly improves the resolution of resonance spectra and becomes an important medical diagnostic tool; high-energy accelerators and detectors can generate strong confinement magnetic fields with very small excitation power, greatly reducing the size of the accelerator and reducing the power consumption of the accelerator, which has great economic and technical advantages; magnetic confinement fusion, which is safe, economical and environmentally friendly, is the ideal energy source for the future, and so on. These applications cannot be separated from the rapid development of high-field magnet application technology.

[0080] The application provides a copper plating method for high-uniformity superconducting tape for high-field coil winding and a testing and regulating method.

[0081] S1, initial electrochemical copper plating is performed on the processed tape;

[0082] S2, a high-precision continuous thickness measuring device is used to test the plating layer thickness in the length and width directions of the processed tape;

[0083] S3, the subsequent electroplating process parameters, the position of the shielding plate 201 and the electroplating processing mode are dynamically regulated according to the thickness distribution data obtained by monitoring;

[0084] The regulated electroplating processing mode includes the following operation: the processed superconducting tape 202 is turned over by 180 degrees around the center axis in the length direction, so that the upper and lower edges are exchanged. In the direction of the arrow in the figure, the length direction of the superconducting tape 202 is perpendicular to the direction of the paper, and the width direction is parallel to the vertical direction. Therefore, in the figure, the upper and lower sides of the superconducting tape 202 are the two sides in the width direction. Figure 7 Figure 7

[0085] In S3, only the electroplating process parameters or only the position of the shielding plate 201 can be adjusted.

[0086] S4, the steps of copper plating and testing-regulating are repeated until the cumulative plating layer reaches the target thickness.

[0087] I. Step S1

[0088] The electrochemical copper plating includes the following steps: ​​

[0089] S1.1: The strip to be processed is subjected to a first cleaning treatment, a bright copper plating treatment, a sandblasted copper plating treatment, and then a second cleaning treatment.

[0090] S1.2: Passivation and drying treatments are performed on the strip material after secondary cleaning.

[0091] Preferably, in step S1.1, a pre-copper plating process is performed before the copper plating process. The pre-copper plating process uses a first current electroplating process, and the sandblasted copper plating process uses a second current electroplating process.

[0092] The first current uses a current density of 5–20 A / dm². 2 The second current uses a current density of 2–8 A / dm³. 2 ;

[0093] The pre-plating copper treatment uses a pre-plating copper electroplating solution with an allowable concentration of 5-20 A / dm³. 2 The pre-plating acid copper additive for current density operation, and the weight composition of the pre-plating copper electroplating solution are as follows:

[0094] 200-240 parts of copper sulfate;

[0095] 50-70 parts of sulfuric acid;

[0096] Chloride ions: 0.08–0.1 parts;

[0097] The sandblasted copper plating treatment uses a sandblasted copper electroplating solution with an allowable concentration of 2-8 A / dm³. 2 The current density-operated copper oxide additive for sand-surfaced copper plating solution has the following weight composition:

[0098] 180-220 parts of copper sulfate;

[0099] 50-80 parts of sulfuric acid;

[0100] Chloride ions: 0.06–0.13 parts;

[0101] The weight composition of the pre-plated copper acid additive is as follows:

[0102] 6-8 parts of starter;

[0103] 2-3 servings of supplement.

[0104] II. Step S2

[0105] like Figure 5 As shown, the high-precision continuous thickness measurement device includes:

[0106] Overall rack 101;

[0107] The running system comprises a winding system 102, an unwinding system 103, a speed encoder system 104, and a tension control system 105;

[0108] A capacitive thickness measuring unit 106 comprising a first capacitive thickness gauge and a second capacitive thickness gauge fixed on the upper and lower sides;

[0109] A laser thickness measuring unit 107 comprising a first laser thickness gauge and a second laser thickness gauge fixed on the upper and lower sides;

[0110] A control system 108 electrically connected with the running system, the capacitive thickness measuring unit 106, and the laser thickness measuring unit 107, and outputting real-time thickness data.

[0111] Preferably, the capacitive thickness measuring unit 106 precisely tests the thickness uniformity of the processed strip in the length direction, and the laser thickness measuring unit 107 precisely tests the thickness uniformity of the processed strip in the width direction.

[0112] III. Step S3

[0113] The processed strip is vertically run during the copper plating process, so that the width direction of the processed strip is perpendicular to the horizontal plane, and the two edges of the width direction of the processed strip are respectively set as A edge and B edge.

[0114] A silver strip with an initial thickness of X μm is processed into a copper-plated superconducting strip with a total thickness of Y μm through the copper plating process, and a total of N (N is an even number) times of electroplating copper is required. The thickness of the n-th plating layer at the A edge is a n , the thickness of the n-th plating layer at the B edge is b n , the cumulative plating layer thicknesses on both sides after the n-th copper plating are respectively T An =a1+a2+...+a n ; T Bn =b1+b2+...+b n , and the average thickness of the n-th copper plating in the length direction of the strip is d n .

[0115] When n < N / 2, the copper plating parameters are set according to the relationship between the current density and the plating layer thickness under the solution ratio, so as to ensure that the absolute value of the difference between the single plating thickness and (Y-X) / N (μm) is less than a preset value. That is, |a n -(Y-X) / N|≤e1, and |b n -(Y-X) / N|≤e1, e1 is the maximum allowable deviation value between the single plating thickness and the ideal thickness.

[0116] After completing the N / 2 times of copper plating, the total plating layer thickness T A(N / 2) =a1+a2+...+a N / 2, T B(N / 2) = b1 + b2 +... + b N / 2 The average value of the total coating thickness increased in the strip length direction is F (N / 2) = d1 + d2 +... + d N / 2 .

[0117] Next, according to various situations of T A(N / 2) and T B(N / 2) , the copper plating process when n > N / 2 will be adjusted:

[0118] If |T A(N / 2) - T B(N / 2) | > e0, it indicates that the edge coatings of A and B are uneven. The strip needs to be rotated 180° along the length direction to reverse the upper and lower positions of the A and B edges to compensate for the accumulated thickness error in the width direction. e0 is the maximum allowable thickness difference in the width direction and can be 1μm.

[0119] In the remaining N / 2 copper plating processes, adjust the parameters according to the following ratio relationship: a (N / 2+k) / b (N / 2+k) = b k / a k , 1 ≤ k ≤ N / 2;

[0120] If T A(N / 2) + T B(N / 2) ≠ Y - X, it means that the thickness of the coating does not meet the requirements. It is necessary to adjust the current density and the strip running speed according to the relationship between the current density and the coating thickness under the solution ratio ( Figure 4 ), ensuring that |a n + b n - [(2n / N) * (Y - X) - (T A(n-1) + T B(n-1) )]| ≤ e2, where N / 2 < n ≤ N, and e2 is the sum of the maximum allowable deviation values between the coating thicknesses at A and B and their respective ideal coating thicknesses in a single copper plating, so that finally |T AN - (Y - X)| ≤ e0 and |T BN - (Y - X)| ≤ e0 can be achieved.

[0121] Preferably, a cathode, an anode, and a shielding plate 201 are provided in the electroplating cell. The cathode is a superconducting strip 202, and the anode is an anode copper material 203; the shielding plate 201 is provided with holes or grooves and is arranged between the cathode and the anode ( Figure 2 ).

[0122] The shielding plate 201, the cathode, and the anode are arranged parallel to each other; the relative positions of the shielding plate 201, the cathode, and the anode in the electroplating cell are distributed as follows:

[0123] (1) The cathode superconducting strip 202 is located at the center of the plating bath;

[0124] (2) A plating liquid jet hole 204 is opened at a distance of 0.5-3.5 cm from the cathode superconducting strip;

[0125] (3) The anode copper material 203 is located at a distance of 4-8 cm from the cathode superconducting strip;

[0126] (4) The shielding plate 201 is located between the cathode superconducting strip 202 and the anode copper material 203, and the end of the shielding plate 201 is provided with an adjustable buckle, which can be adjusted to any position at a distance of 0-8 cm from the superconducting strip.

[0127] The movement of the shielding plate 201 between the cathode and the anode can change the liquid flow rate on the upper and lower edges of the strip during the plating liquid jet process, Figure 3 and the electric field line distribution shielding the superconducting strip 202.

[0128] When the shielding plate 201 is located at a distance of 4-8 cm from the cathode strip, the copper plating of the superconducting strip 202 will have a thickness of the upper side larger than that of the lower side; when the shielding plate 201 is located at a distance of 0-3 cm from the cathode strip, the copper plating of the superconducting strip will have a thickness of the lower side larger than that of the upper side.

[0129] Therefore, according to the real-time monitoring of the thickness data of the superconducting strip 202, the thickness of the upper and lower sides of the strip can be adjusted by adjusting the position of the shielding plate 201 between the cathode and the anode.

[0130] When n≠N / 2, according to the cases of T An and T Bn , the following adjustment method is adopted:

[0131] If T An ≠T Bn , the strip does not need to be rotated along the length direction, and only the relative position between the shielding plate 201 and the cathode needs to be adjusted according to Table 1 to compensate for the thickness difference in the width direction, and the adjustment mode of the shielding plate 201 satisfies the following relationship:

[0132] If T An >T Bn , the shielding plate 201 is adjusted to a suitable position in the interval of 0-3 cm from the cathode superconducting strip to compensate for the thickness of the B edge of the n+1 copper plating, and to ensure that:

[0133] b n+1 -a n+1 =T An -T Bn =H λ , and |T A(n+1) -T B(n+1) |≤e3;

[0134] If TAn <T Bn Adjust the shield plate 201 to the appropriate position in the interval of 4-8 cm from the cathode superconducting tape 4, compensate the thickness of the N+1th copper plating A edge, and ensure that:

[0135] a n+1 -b n+1 =T Bn -T An =H λ , |T A(n+1) -T B(n+1) |≤e3;

[0136] Wherein, e3 is the maximum difference allowed between the cumulative plating thickness in the width direction of the tape at A and B during any plating, H represents the thickness difference of the copper plating at the edges of A and B when the shield plate 201 is at different positions, and λ represents the relative position of the shield plate 201 from the cathode.

[0137] Table 1 Thickness difference of copper plating at the upper and lower edges of the superconducting tape at different positions of the shield plate relative to the cathode

[0138]

[0139] Judge the thickness of the tape in the length direction after N-1th copper plating, and control d n =(Y-X)-F (N-1) So that the cumulative plating thickness F N =d1+d2+...+d n in the length direction of the tape after the Nth copper plating, and finally realize |F N -(Y-X)|≤e4, e4 is the maximum difference allowed between the actual plating thickness and the target plating thickness in the length direction of the tape, which can be 0.3 μm.

[0140] Through repeated thickness compensation, the thickness difference of the superconducting tape 202 prepared at both ends in the width direction is ≤1 μm, and the thickness standard deviation in the length direction is ≤0.3 μm. The superconducting tape 202 prepared is suitable for strong magnetic field coil winding.

[0141] Preferably, the electroplating production line uses a pulse power supply, and the pulse waveform control parameters are forward pulse (5-50 ms), negative pulse (1-10 ms), and pause time (0-5 ms).

[0142] The surface roughness of the superconducting tape 202 produced is greater than 50 nm. Four, specific embodiment 1

[0144] By the continuous thickness measuring device and method, the electrochemical copper plating is guided, a 55 μm thick and 4 mm wide silver-plated superconducting tape is plated with copper for 4 times to 95±5 μm (effective length of copper plating line is 27 m), so that the final thickness difference of the tape is controlled within 1 μm and the length direction standard deviation is within 0.3 μm.

[0145] Specifically comprising the following steps:

[0146] S1, the processed tape is cleaned once, pre-plated with copper, cleaned twice, passivated, dried.

[0147] Preferably, the weight composition of the pre-plating copper plating solution is:

[0148] Copper sulfate 200-220 parts;

[0149] Sulfuric acid 60-70 parts;

[0150] Chloride ion 0.08-0.1 parts;

[0151] Preferably, the pre-plating copper additive uses copper sulfate additive, and the weight composition of the copper sulfate additive is:

[0152] Opening agent 6-8 parts;

[0153] Supplement 2-4 parts.

[0154] Preferably, the pre-plating copper treatment uses a forward current of 10 A / dm 2 , the opening time is 15 ms; the negative current is 4 A / dm 2 , the opening time is 2 ms; the pause time is 3 ms;

[0155] Preferably, the pre-plating copper treatment uses a tape running speed of 350 m / h, so that copper is quickly deposited on the surface of the double-sided silver-plated superconducting bare tape, preventing acid corrosion of the superconducting film layer in the copper plating solution.

[0156] Preferably, the A edge of the tape is located on the upper side of the tape.

[0157] S2, the thickness of the dried tape is measured continuously for the first time by the thickness measuring device, the average thickness of the tape is 65.61 μm, the length direction standard deviation is 0.76 μm, the thickness of the A and B edges of the tape is 66.79 μm and 64.34 μm respectively, a1=11.79 μm, b1=9.34 μm, the thickness difference between the A and B edges is 2.45 μm.

[0158] S3, after the first rapid copper plating is completed, the second copper plating reduces the current density and the tape running speed of the plating solution.

[0159] S4, the tape is cleaned once, plated with sand copper, cleaned twice, passivated, and dried.

[0160] Preferably, the plating solution for sand surface copper plating has the following weight composition:

[0161] Copper sulfate 180-220 parts;

[0162] Sulfuric acid 50-80 parts;

[0163] Chloride ion 0.08-0.13 parts;

[0164] Preferably, the forward current used for sand surface copper plating is 3 A / dm 2 , the opening time is 15 ms; the reverse current is 1 A / dm 2 , the opening time is 2 ms; the pause time is 3 ms;

[0165] Preferably, the running speed used for sand surface copper plating is 120 m / h.

[0166] Preferably, the strip A edge is located on the upper side of the running.

[0167] S5, the second continuous thickness measurement is performed on the dried strip, the average thickness of the strip is 75.45 μm, the standard deviation in the length direction is 0.64 μm, the thicknesses of the strip A and B edges are 77.43 μm and 73.30 μm respectively, a2=10.64 μm, b2=8.96 μm, T A2 =22.43 μm, T B2 =18.30 μm, the thickness difference between the strip A and B edges is 4.13 μm. T A2 / T B2 =1.23>1, (T A2 +T B2 ) / 40=1.02>1. The theoretical value of the next plating thickness is calculated: a3 / b3=b1 / a1=9.34 / 11.79, a3+b3=19.27, and the third plating theoretical value is a3=8.52 μm, b3=10.75 μm, which is used as a reference to adjust the third plating parameters.

[0168] S6, the plating process parameters of the next step are adjusted according to the thickness measurement results: the B edge is adjusted to be plated on the upper side, the current density of the plating solution is increased, and the thickness difference between the upper and lower edges of the third plating is increased to reduce the thickness difference between the A and B edges.

[0169] S7, the strip is subjected to one cleaning treatment, sand surface copper plating, two cleaning treatments, passivation treatment, and drying treatment.

[0170] Preferably, the plating solution for sand surface copper plating has the same weight composition as S4;

[0171] Preferably, the forward current used for sand surface copper plating is 4 A / dm 2Turn-on time: 15ms; negative current: 1A / dm 2 Activation time: 2ms; Pause time: 3ms;

[0172] Preferably, the conveyor belt speed for sand-plated copper is 100m / h.

[0173] Preferably, the edge of strip B is located on the upper side of the strip.

[0174] S8. A third continuous thickness measurement was performed on the dried strip. The average thickness of the strip was 84.98 μm, and the standard deviation in the length direction was 0.23 μm. The thicknesses of edges A and B of the strip were 85.86 μm and 84.26 μm, respectively. a3 = 8.43 μm, b3 = 10.54 μm, T A3 =30.86μm, T B3 =28.84μm, the thickness difference between the edges of strip A and B is 2.02μm. T A3 / T B3 =1.05>1. Calculate the theoretical values: a4 / b4=b2 / a2=8.96 / 10.64, a4+b4=20.30, d4=95-84.98=10.02. Therefore, the theoretical values ​​for the fourth copper plating pass are a4=9.28μm, b4=11.02μm, and d4=10.02μm. Adjust the parameters for the fourth copper plating pass using these values ​​as a reference.

[0175] S9. Adjust the copper plating process parameters for the next step based on the thickness measurement results: reduce the current density of the electroplating solution to ensure that the total thickness of the strip reaches 95±5μm after the last copper plating pass, and the standard deviation of the thickness in the length direction is ≤0.3μm.

[0176] S10. Perform a first cleaning, bright copper plating, sandblasted copper plating, second cleaning, passivation, and drying on the processed strip.

[0177] Preferably, the weight composition of the copper plating solution for sandblasted surfaces is the same as that in S4;

[0178] Preferably, the forward current for sandblasted copper is 3A / dm. 2 Turn-on time: 10ms; negative current: 1A / dm 2 Activation time: 2ms; Pause time: 3ms;

[0179] Preferably, the conveyor belt speed for sand-plated copper is 100m / h.

[0180] Preferably, the edge of strip B is located on the upper side of the strip.

[0181] S11, finally, the dried strip is measured for the fourth time in succession, the average thickness of the strip is 95.04 μm, the standard deviation in the length direction is 0.2 μm; the thickness of the edges of the strip A and B is 95.17 μm and 94.99 μm respectively, a4=9.31 μm, b4=10.73 μm, the thickness difference of the edges of the strip A and B is 0.18 μm. The thickness uniformity of the strip meets the expected target.

[0182] The embodiment prepares the final product with the thickness standard deviation in the length direction of 0.2 μm and the thickness difference of the two ends in the cross direction of 0.18 μm by testing the copper-plated strip each time and adjusting the copper-plating parameters in time. The problem that the thickness of the strip cannot be reflected and evaluated in time is effectively solved, and the problem of thickness non-uniformity commonly existing in the electrochemical copper plating is improved. Five, specific embodiment 2

[0184] The strip is guided for electrochemical copper plating by the continuous thickness measuring device and method, and a 57 μm thick and 4 mm wide silver-plated superconducting strip is plated with copper for 4 times to 95±5 μm (effective length of copper-plating line is 27 m), so that the thickness difference of the strip in the width direction is controlled within 1 μm, and the standard deviation in the length direction is within 0.3 μm.

[0185] Specifically, the method comprises the following steps:

[0186] S1, the strip to be processed is cleaned once, pre-plated with copper, cleaned twice, passivated, and dried.

[0187] Preferably, the weight composition of the pre-plating copper electroplating solution is:

[0188] Copper sulfate 200-220 parts;

[0189] Sulfuric acid 60-70 parts;

[0190] Chloride ion 0.08-0.1 parts;

[0191] Preferably, the pre-plating copper additive is an acid copper additive, and the weight composition of the acid copper additive is:

[0192] Tank opening agent 6-8 parts;

[0193] Supplement 2-4 parts.

[0194] Preferably, the pre-plating copper treatment uses a forward current of 10 A / dm 2 , the opening time is 15 ms; the negative current is 4 A / dm 2 , the opening time is 2 ms; the pause time is 3 ms;

[0195] Preferably, the pre-plating copper treatment uses a strip running speed of 350 m / h, so that copper is quickly deposited on the surface of the double-sided silver-plated superconducting bare strip, preventing the acid in the electroplated copper solution from corroding the superconducting film layer.

[0196] Preferably, the strip A edge is located on the upper side of the running strip.

[0197] S2, the first continuous thickness measurement of the dried strip is carried out by using the thickness measuring device, the average thickness of the strip is 67.35 μm, the standard deviation in the length direction is 0.82 μm, the thicknesses of the strip A and B edges are 68.29 μm and 65.70 μm respectively, a1 = 11.29 μm, b1 = 8.70 μm, T A2 = 11.29 μm, T B2 = 8.70 μm, the thickness difference between the A and B edges is 2.59 μm. That is, T A1 > T B1 ; T A1 - T B1 = 2.59.

[0198] S3, according to the thickness measurement results, the next step copper plating process parameters are adjusted by referring to Table 1: referring to the thickness difference value of the A and B edges, the shielding plate 201 position is adjusted to be located at 1.5 cm away from the cathode superconducting strip 1.

[0199] S4, the strip is subjected to one cleaning treatment, sand surface copper plating, two cleaning, passivation treatment and drying treatment.

[0200] Preferably, the weight composition of the sand surface copper plating solution is:

[0201] copper sulfate 180-220 parts;

[0202] sulfuric acid 50-80 parts;

[0203] chloride ion 0.08-0.13 parts;

[0204] Preferably, the forward current used for sand surface copper plating is 3.0 A / dm 2 , the opening time is 15 ms; the negative current is 1 A / dm 2 , the opening time is 2 ms; the pause time is 3 ms;

[0205] Preferably, the running speed of the sand surface copper plating is 100 m / h.

[0206] S5, the second continuous thickness measurement of the dried strip is carried out, the average thickness of the strip is 77.41 μm, the standard deviation in the length direction is 0.72 μm, the thicknesses of the strip A and B edges are 76.94 μm and 77.08 μm respectively. a2 = 8.65 μm, b2 = 11.38 μm, T A2 = 19.94 μm, T B2 = 20.08 μm, the thickness difference between the A and B edges is -0.14 μm. b2-a2≈T A1 -T B1 ; TA2 ≈T B2 .

[0207] S6. Based on the thickness measurement results, the copper plating process in the next step does not need to be adjusted.

[0208] S7. Perform a first cleaning, copper plating, second cleaning, passivation, and drying on the strip.

[0209] Preferably, the weight composition of the copper plating solution for sandblasted surfaces is the same as that in S4;

[0210] Preferably, the forward current for sandblasted copper is 3A / dm. 2 Turn-on time: 15ms; negative current: 1A / dm 2 Activation time: 2ms; Pause time: 3ms;

[0211] Preferably, the conveyor belt speed for sand-plated copper is 100m / h.

[0212] S8. A third continuous thickness measurement was performed on the dried strip. The average thickness of the strip was 88.25 μm, and the standard deviation in the length direction was 0.32 μm. The edge thicknesses of strip A and B were 85.80 μm and 88.67 μm, respectively, a3 = 8.86 μm, b3 = 11.59 μm, T A3 =28.80μm, T B3 =31.67μm, the thickness difference between the edges of strip A and B is -2.87μm. That is, T A3 <T B3 ;T A3 -T B3 =-2.87.

[0213] S9. Based on the thickness measurement results, refer to Table 1 to adjust the copper plating process parameters for the next step: Referring to the thickness difference between the A and B edge plating layers, adjust the position of the shielding plate 201 so that it is located 6.0 cm away from the cathode superconducting strip. Keep the current density in the electroplating solution constant and increase the copper plating strip speed. Ensure that after the final copper plating pass, the total thickness of the strip reaches 95±5μm, and the standard deviation of the thickness in the length direction is ≤0.3μm.

[0214] S10. Perform a first cleaning, bright copper plating, sandblasted copper plating, second cleaning, passivation, and drying on the processed strip.

[0215] Preferably, the weight composition of the copper plating solution for sandblasted surfaces is the same as that in S4;

[0216] Preferably, the forward current for sandblasted copper is 3A / dm. 2 Turn-on time: 15ms; negative current: 1A / dm 2 Activation time: 2ms; Pause time: 3ms;

[0217] Preferably, the plating sand face copper adopts a running speed of 120 m / h.

[0218] S11, finally, the dried strip is measured for the fourth time, the average thickness of the strip is 97.02 μm, the standard deviation of the length direction is 0.27 μm; the thickness of the A and B edges of the strip is 96.65 μm and 96.55 μm respectively, a4=10.85 μm, b4=7.88 μm, the thickness difference of the A and B edges of the strip is 0.1 μm. The thickness uniformity of the strip meets the expected target.

[0219] The embodiment can timely adjust the copper plating parameters by testing the copper plated strip each time, and the final product prepared has a length direction thickness standard deviation of 0.27 μm, and a thickness difference of 0.1 μm at the two ends in the cross-sectional width direction. The problem that the thickness of the strip cannot be timely reflected and evaluated is effectively solved, and the problem of thickness unevenness commonly existing in the current electrochemical copper plating is improved.

[0220] The application realizes the accurate control of the thickness uniformity of the copper plated layer of the superconducting strip by the close combination of the copper plating process and the testing, feedback and regulation, breaks through the bottleneck of the copper plating uniformity control caused by the dynamic deformation of the long production line, and is particularly suitable for the strong magnetic field coil application with extremely high requirements for the plating layer uniformity, and effectively improves the winding quality and the stability of the electromagnetic performance.

[0221] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0222] The specific embodiments of the present application are described above. It should be understood that the present application is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essential content of the present application. The embodiments of the present application and the features in the embodiments can be arbitrarily combined with each other without conflict.

Claims

1. A method for copper plating on superconducting tapes, characterized in that, include: S1: Initial electrochemical copper plating is performed on the superconducting tape with an initial thickness of X μm; S2: Using a continuous thickness measurement device, the average coating thickness in the length direction and the coating thickness at edges A and B in the width direction of the superconducting strip are tested to obtain coating thickness distribution data, which includes the cumulative thickness at edges A and B and the cumulative total thickness in the length direction. S3: Based on the coating thickness distribution data, if the cumulative thickness difference between the edges of A and B exceeds the preset threshold e0, the superconducting strip will be rotated 180° around its length direction central axis by adjusting the electroplating process to compensate for the thickness error. S4: Repeat steps S2-S3 until N copper platings are completed, and the total thickness of the strip reaches Yμm through the final copper plating adjustment, and the deviation between the actual plating thickness in the length direction and the target value does not exceed the preset value e4. When repeating steps S2-S3, the electroplating process is controlled in stages. The control method includes adjusting the electroplating process parameters, wherein: The phased control is based on a preset total number of copper plating cycles N. When the number of plating cycles n is greater than N / 2, compensation is made based on the cumulative thickness of edges A and B when the N / 2th copper plating cycle is completed. If the sum of the cumulative plating thicknesses at edges A and B is not equal to the difference between the total thickness Y of the strip after copper plating and the initial thickness X, then adjust the current density and the tape speed to ensure that the deviation between the sum of the plating thicknesses at edges A and B in a single copper plating operation and the sum of the ideal plating thicknesses for that operation does not exceed the preset value e2.

2. The method for copper plating of superconducting tape according to claim 1, characterized in that, S1 includes: S1.1: The superconducting tape is subjected to a first cleaning process, a bright copper plating process, a sandblasted copper plating process, and a second cleaning process in sequence. S1.2: Passivate and dry the superconducting tape after secondary cleaning.

3. The method for copper plating of superconducting tape according to claim 2, characterized in that, In step S1.1, a pre-plating copper treatment is performed before the bright copper plating and sandblasted copper plating treatments. The pre-plating copper treatment uses a first current electroplating treatment, and the sandblasted copper plating treatment uses a second current electroplating treatment. The current density of the first current is greater than that of the second current; The copper plating solution used in the pre-plating copper treatment has the following weight composition: 200-240 parts copper sulfate, 50-70 parts sulfuric acid, and 0.08-0.1 parts chloride ions. The pre-plating copper plating solution also contains a pre-plating acid copper additive, and the working current density of the pre-plating acid copper additive is greater than the first current. The pre-plating acid copper additive has the following weight composition: 6-8 parts of starter and 2-3 parts of supplementer; The sand-coated copper plating solution used in the above treatment has the following weight composition: 180-220 parts copper sulfate, 50-80 parts sulfuric acid, and 0.06-0.13 parts chloride ions. The sand-coated copper plating solution also contains a sand-coated copper acid additive, and the working current density of the sand-coated copper acid additive is greater than that of the second current.

4. The method for copper plating of superconducting tape according to claim 1, characterized in that, The superconducting tape is produced by a vertical tape-walking method during copper plating, so that the width direction of the superconducting tape is perpendicular to the horizontal direction. The upper and lower edges of the width direction of the superconducting tape are set as edge A and edge B, respectively.

5. The method for copper plating of superconducting tape according to claim 4, characterized in that, The superconducting tape is a silver tape, the total number of copper plating times N is an even number, and the thickness of the copper layer at edge A after the nth plating is a. n The thickness of the nth copper plating layer at edge B is b. n After the nth copper plating, the accumulated copper plating thickness on edge A is T. An =a1+a2+...+a n The cumulative copper plating thickness on edge B is T. Bn =b1+b2+...+b n The average thickness of the nth copper plating layer along the length of the strip is d. n ; In step S3, the adjustment method is determined based on the current electroplating cycle: When n < N / 2, the electroplating copper process parameters are set according to the relationship between the solution ratio, current density and coating thickness, ensuring that |a n -(Y - X) / N| ≤ e1, and |b n -(Y - X) / N| ≤ e1, where e1 is the maximum allowable deviation between the single coating thickness and the ideal coating thickness; After N / 2 copper plating cycles, the total increase in plating thickness at the edges of superconducting strips A and B is T, respectively. A(N / 2) =a1+a2+...+a N / 2 T B(N / 2) =b1+b2+...+b N / 2 The average total coating thickness increasing along the length of the strip is F. (N / 2) =d1+d2+...+d N / 2 ; For copper plating processes where n > N / 2, adjust as follows: If |T A(N / 2) -T B(N / 2) |>e0, reverse the vertical positions of edges A and B. For the k-th electroplating after N / 2 times, a (N / 2+k) / b (N / 2+k) =b k / a k , 1≤k≤N / 2, e0 is the maximum allowable thickness difference in the width direction of the superconducting tape; If T A(N / 2) + T B(N / 2) ≠ Y - X, adjust the current density and the tape running speed to ensure that |a n + b n - [(2n / N) * (Y - X) - (T A(n-1) + T B(n-1) )]| ≤ e2, where N / 2 < n ≤ N, and e2 is the sum of the maximum allowable deviation values between the coating thicknesses at A and B and their respective ideal coating thicknesses in a single copper plating.

6. The method for copper plating of superconducting tape according to claim 1, characterized in that, The electroplating bath used in the copper plating method for superconducting tape is equipped with a cathode, an anode, and a shielding plate. In step S3, the control method further includes adjusting the position of the shielding plate. The cathode is the superconducting tape being processed, and the anode is made of copper. The shielding plate has holes or slots, which are set between the cathode and the anode and are parallel to each other; The cathode is located at the center of the electroplating tank. There are plating solution spray holes on the electroplating tank at a distance of 0.5 to 3.5 cm from the cathode. The anode is 4 to 8 cm from the cathode. The shielding plate can be set at any adjustable position between 0 and 8 cm from the cathode.

7. The method for copper plating of superconducting tape according to claim 6, characterized in that, The total number of copper plating cycles N is even. When n ≠ N / 2, if T An ≠T Bn The thickness difference of the coating in the width direction of the strip is compensated by adjusting the distance between the shielding plate and the cathode: If T An >T Bn Adjust the shielding plate within the range of 0 to 3 cm from the cathode superconducting tape, so that b n+1 -a n+1 =T An -T Bn =H λ , and |T A(n+1) -T B(n+1) |≤e3; If T An <T Bn The shielding plate was adjusted to be 4 to 8 cm away from the cathode superconducting tape, so that a n+1 -b n+1 =T Bn -T An =H λ , |T A(n+1) -T B(n+1) |≤e3; e3 represents the maximum allowable difference between the cumulative plating thicknesses at points A and B in the width direction of the strip during any single electroplating operation. H represents the difference in copper plating edge thickness at different positions of the shielding plate at points A and B. λ represents the relative position of the shielding plate from the cathode. When the shielding plate is 4-8 cm away from the cathode superconducting strip, the copper plating thickness on the upper side of the superconducting strip is greater than that on the lower side. When the shielding plate is 0-3 cm away from the cathode strip, the copper plating thickness on the lower side of the superconducting strip is greater than that on the upper side. The thickness along the length of the processed superconducting tape after N-1 copper plating operations is determined, and d is controlled. n =(YX)-F (N-1) This increases the cumulative plating thickness F along the length of the strip after the Nth copper plating. N =d1+d2+...+d n Ultimately, |F N -(YX)|≤e4, where e4 is the maximum allowable difference between the actual coating thickness and the target coating thickness along the length of the strip.

8. A continuous thickness measuring device, characterized in that, The continuous thickness measuring device for the copper plating method of superconducting strip according to any one of claims 1 to 7 includes: Overall rack (101); The belt conveyor system includes: a winding system (102), an unwinding system (103), a speed encoder system (104), and a tension control system (105). The capacitance thickness measurement unit (106) includes: a first capacitance thickness gauge and a second capacitance thickness gauge fixed to the overall frame (101). The capacitance thickness measurement unit (106) is used to measure the thickness uniformity of the superconducting strip along its length. The laser thickness measurement unit (107) includes: a first laser thickness gauge and a second laser thickness gauge fixed to the overall frame (101). The laser thickness measurement unit (107) is used to measure the thickness uniformity of the superconducting strip in the width direction. The control system (108) is electrically connected to the conveyor system, the capacitor thickness measurement unit (106), and the laser thickness measurement unit (107) for real-time output of thickness measurement data.

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