Display device

Abstract

The invention provides a display device. The display device comprises a display panel; the display device comprises a display panel, a conductive mesh layer, a transparent conductive layer and a frame body, the frame body comprises a conductive material, the display panel is arranged in the frame body, and the frame body is electrically connected with the transparent conductive layer to form a grounding path. According to the display device, static electricity generated by the display panel and the external environment is prevented from directly invading the display driving circuit through an electrical path between the display panel and the display driving circuit; meanwhile, light passing through a path is ensured, and light loss is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device. Background Art

[0002] Currently, when designing a display panel, it is necessary to prevent damage to the display panel caused by electrostatic discharge (ESD).

[0003] ESD is one of the main threats to display screens during manufacturing and use. In severe cases, it can disrupt the alignment of liquid crystal molecules in LCD screens and burn out the self-luminous pixels of organic light-emitting display panels. However, current protection solutions are unable to further improve ESD protection levels. Summary of the Invention

[0004] The embodiments of the present application provide a display device that can further improve the level of protection against ESD while reducing light loss.

[0005] In order to achieve the above-mentioned object, the first aspect of the present application provides a display device, comprising:

[0006] Display panel;

[0007] A conductive grid layer is provided on the display panel;

[0008] a transparent conductive layer, the transparent conductive layer being disposed on a side of the conductive grid layer away from the display panel; and

[0009] A frame body comprises a conductive material, the display panel is arranged in the frame body, and the frame body is electrically connected to the transparent conductive layer to form a ground path.

[0010] Optionally, the conductive grid layer is a mesh structure, the transparent conductive layer is in a grid shape, and a plurality of first grids and first grid lines surrounding the first grids are formed in the transparent conductive layer.

[0011] Optionally, a plurality of second grids and second grid lines surrounding the second grids are formed in the conductive grid layer, wherein at least part of the first grid lines and at least part of the second grid lines intersect with each other.

[0012] Optionally, the line width of the first grid line is 50 nm to 200 nm; and / or,

[0013] The thickness of the transparent conductive layer is 30 nm to 50 nm; and / or,

[0014] The material of the transparent conductive layer includes indium tin oxide.

[0015] Optionally, the conductive grid layer includes a plurality of grid units, each of the grid units includes at least one second grid and a plurality of second grid lines surrounding the second grid;

[0016] In the plurality of grid units, at least some of the second grid lines in at least some of the grid units have different lengths and / or line widths from those of the second grid lines in adjacent grid units.

[0017] Optionally, the material of the conductive grid layer includes an alloy material, the line width of the second grid line is 2 μm to 4 μm; and / or the length of the second grid line is 40 μm to 70 μm.

[0018] Optionally, the frame is made of an electrothermal magnetic material.

[0019] Optionally, the display device further includes a shielding layer, which is located on a side of the display panel away from the conductive grid layer, and the shielding layer is disposed in the frame and electrically connected to the frame.

[0020] Optionally, the shielding layer is made of a conductive material, and has a mesh structure.

[0021] Optionally, the display device further includes a quantum dot layer, which is located on a side of the display panel away from the conductive grid layer, and is located in the frame and electrically connected to the shielding layer, and is configured to be electroluminescent.

[0022] Optionally, the display device further includes a conductive adhesive, the conductive adhesive including a first side and a second side arranged opposite to each other, the first side being connected to the frame, and the second side being connected to at least the display panel and the transparent conductive layer at the same time, and the material of the conductive adhesive includes a conductive elastic material.

[0023] The present application forms a double-layer conductive structure by arranging a transparent conductive layer and a conductive grid layer on the surface of the display panel to enhance the conductivity, and electrically connects the transparent conductive layer to a frame containing a conductive material to form a Faraday cage effect, thereby blocking the static electricity generated by the display panel and the external environment from directly invading the display driving circuit through the electrical path between the display panel and the display driving circuit; moreover, the transparent conductive layer adopts a transparent material, and the conductive grid layer has a grid structure, which can ensure the passage path of light and reduce light loss while enhancing the conductivity.

[0024] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0026] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0027] Figure 1 is a front view of a display device according to an embodiment of the present application;

[0028] Figure 2 yes Figure 1 Cross-sectional view in the BB direction;

[0029] Figure 3 Schematic diagram of the structure of the transparent conductive layer;

[0030] Figure 4 Schematic diagram of the structure of the conductive grid layer;

[0031] Figure 5 yes Figure 1 A magnified schematic diagram of part A;

[0032] Figure 6 It is a structural diagram of the shielding layer;

[0033] Figure 7 is a cross-sectional view of the frame;

[0034] Explanation of the accompanying drawings: 1. Display panel; 2. Conductive grid layer; 2a. Grid unit; 201. Second grid; 202. Second grid line; 3. Transparent conductive layer; 301. First grid; 302. First grid line; 4. Frame; 401. Frame; 5. Conductive adhesive; 501. First conductive adhesive; 502. Second conductive adhesive; 5a. First side; 5b. Second side; 6. Housing; 7. Backlight module; 8. Shielding layer; 9. Quantum dot layer; 10. Electrothermal magnetic material. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0036] ESD is one of the main threats faced by display screens during manufacturing and use. In severe cases, it can cause the liquid crystal molecules of liquid crystal screens to be arranged in disorder and the self-luminous pixels of organic light-emitting display panels to burn out.

[0037] Furthermore, the display driver circuit establishes an electrical connection with the display panel via flexible circuit boards or chip packaging, converting image signals into drive voltage and current signals. These signals then control the deflection of the liquid crystal in each pixel or the illumination of the light-emitting diodes (LEDs) within the panel through the thin-film transistor array within the panel, thereby achieving image display. The numerous electrical circuits and interfaces between the two make the display panel a potential channel for static electricity to enter the display driver circuit.

[0038] Because the display panel surface is directly exposed to the external environment, static electricity is easily accumulated during production and use due to friction, induction, and other factors. Furthermore, due to the electrical pathways between the display panel and the display driver circuit, when static electricity accumulates to a certain level, the static charge will flow along these pathways, generating transient high voltages and large currents. Furthermore, the semiconductor devices in the display driver circuit are extremely sensitive to static electricity. Static voltages of just a few hundred volts can penetrate their internal insulation layers, damaging critical components like transistors, interfering with signal transmission, causing display anomalies, and even permanent circuit damage. However, current protection solutions are unable to further improve ESD protection levels.

[0039] To achieve the above purpose, see Figures 1 to 7 The present application provides a display device 100, comprising: a display panel 1; a conductive grid layer 2, disposed on the display panel 1; a transparent conductive layer 3, the transparent conductive layer 3 being disposed on a side 1 of the conductive grid layer 2 away from the display panel; and a frame 4, the frame 4 comprising a conductive material, the display panel 1 being disposed in the frame 4, the frame 4 being electrically connected to the transparent conductive layer and forming a ground path.

[0040] The present application forms a double-layer conductive structure by arranging a transparent conductive layer 3 and a conductive grid layer 2 on the surface of the display panel to enhance the conductive ability, and electrically connects the transparent conductive layer 3 to a frame 4 containing a conductive material to form a Faraday cage effect, thereby blocking the static electricity generated by the display panel 1 and the external environment from directly invading the display driving circuit through the electrical path between the display panel 1 and the display driving circuit; not only that, the transparent conductive layer 3 is made of transparent material, and the conductive grid layer 2 has a grid structure, which can ensure the passage path of light and reduce light loss while enhancing the conductive ability.

[0041] In the embodiment of the present application, the frame 4 is electrically connected to the transparent conductive layer 3 to form a ground path by directly or indirectly connecting the frame 4 to the transparent conductive layer 3 and connecting a ground wire to the frame 4 .

[0042] Furthermore, the transparent conductive layer 3 is disposed in the frame 4 and is directly or indirectly connected to the frame 4 .

[0043] It is understood that in the embodiment of the present application, the conductive grid layer 2 may or may not be connected to the frame 4. In a preferred embodiment, the conductive grid layer 2 is directly or indirectly connected to the frame 4 to further improve the conductive performance.

[0044] In some embodiments, a side of the frame 4 facing the display panel 1 is directly or indirectly connected to the display panel 1 .

[0045] In a specific embodiment, the frame 4 includes a frame 401 and a cavity enclosed by the frame 401, and the frame 401 includes an inner side facing the cavity; the display panel 1, the transparent conductive layer 3 and the conductive grid layer 2 are arranged in the cavity, and the display panel 1 and / or the transparent conductive layer 3 and / or the conductive grid 2 are directly or indirectly connected to the inner side of the frame 401.

[0046] See also Figure 2 When indirectly connected, in some embodiments, the display device 100 further includes a conductive adhesive 5, the conductive adhesive 501 includes a first side and a second side that are oppositely arranged, the first side is connected to the inner side of the frame 401, and the second side is connected to at least the display panel 1 and the transparent conductive layer 3.

[0047] In some embodiments, the material of the conductive adhesive 5 includes a first conductive elastic material; specifically, the first conductive material is conductive silicone.

[0048] In the embodiment of the present application, when the display panel 1 and the transparent conductive layer 3 are connected to the frame 4 through the conductive adhesive 5, a continuous conductive path is formed with the frame 4, eliminating the gap antenna effect between the screen and the housing and avoiding the introduction of ESD interference.

[0049] In a further preferred embodiment, the second side is connected to the display panel 1 , the transparent conductive layer 3 and the conductive grid layer 2 at the same time, thereby further eliminating the slot antenna effect and improving the conduction speed.

[0050] See also Figure 3In some embodiments, the transparent conductive sublayer 3 includes a plurality of first grids 301 and first grid lines 302 surrounding the first grids 301. The line width of the first grid lines 302 is 50 nm to 200 nm, for example, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 120 nm, 150 nm, 180 nm, 200 nm, etc. In this embodiment, by providing the transparent conductive layer 3 with a mesh structure and nanometer-scale line width, light pathways can be further ensured and light loss can be reduced. Furthermore, by further setting the line width of the first grid lines 302 to 50 nm to 200 nm, both conductivity, light transmittance, and stress dispersion can be achieved. Furthermore, the mesh structure of the transparent electronic layer 3 and the conductive structure of the conductive grid layer 2 are superimposed on each other to form a synergistic electromagnetic wave reflection and absorption mechanism, achieving shielding effectiveness over a wide frequency band (0.1-40 GHz), capable of both absorbing and transmitting ESD energy and providing protection against electromagnetic interference (EMI).

[0051] In some embodiments, the area of ​​the first grid lines 301 is 500 nm*500 nm. In the embodiment of the present application, the area of ​​the first grid lines 301 is set to 500 nm*500 nm, which can take into account both electrical conductivity, light transmittance and stress dispersion.

[0052] In some embodiments, the thickness of the transparent conductive layer 3 is 30 nm to 50 nm, for example, 30 nm, 35 nm, 40 nm, 45 nm, 50 nm, etc.; the embodiment of the present application further reduces the light loss rate by controlling the thickness of the transparent conductive layer 3 at the nanometer level; and specifically limiting it to 30 nm to 50 nm can take into account both conductivity, transmittance and stress dispersion.

[0053] It is understandable that in the embodiment of the present application, the specific material selected for the transparent conductive layer 3 is not limited as long as its transparency and conductivity are ensured.

[0054] In one embodiment, the material of the transparent conductive layer 3 includes indium tin oxide (ITO). ITO material has good electrical conductivity and high transparency, which can improve the electrical conductivity while ensuring the passage of light.

[0055] See also Figures 4 and 5In some embodiments, the conductive grid layer 2 is a mesh structure, in which a plurality of second grids 201 and second grid lines 202 surrounding the second grids 201 are formed, wherein at least some of the first grid lines 301 and 302 are cross-fixed with at least some of the second grid lines 201. Since the mesh structure of the transparent electron layer 3 and the conductive structure of the conductive grid layer 2 are superimposed on each other, a magnetic wave reflection-absorption synergistic mechanism can be formed. In the embodiment of the present application, by further cross-fixing the first grid lines 302 and the second grid lines 202, a three-dimensional interlocking structure can be formed, thereby improving the mechanical stability of the conductive grid layer 2 and the transparent conductive layer 3, and making the material less likely to crack under stress. The three-dimensional interlocking design can shorten the electron transmission path, reduce the interface resistance, and further ensure the reliability of the electromagnetic wave reflection-absorption synergy.

[0056] It is understandable that in the embodiment of the present application, the cross-fixing method is not limited. For example, at the intersection of the first grid line 302 and the second grid line 202, the first grid line 302 and the second grid line 202 are connected by conductive glue. For another example, a first connecting structure is provided on the first grid line 302 at a position connected to the second grid line 202; correspondingly, a second connecting structure is provided on the second grid line 202 at a position connected to the first grid line 302, and the second connecting structure and the first connecting structure can be interlocked with each other. In the embodiment of the present application, the first connecting structure and the second connecting structure can be mutually mating grooves or mutually mating concave-convex structures. It is understandable that the mutually mating structures of the embodiment of the present application are not limited to the above examples. The three-dimensional interlocking structure forms a continuous mechanical support network through physical interlocking.

[0057] In some embodiments, the material of the conductive grid layer 2 includes an alloy material.

[0058] In the embodiment of the present application, the alloy material of the conductive grid layer enhances the reflection of electromagnetic interference signals, and at the same time cooperates with the ITO material of the transparent conductive layer to absorb electromagnetic interference signals, further enhancing the synergistic effect of electromagnetic wave reflection and absorption.

[0059] In some embodiments, the alloy material includes copper (Cu) and nickel (Ni), wherein the mass ratio of Cu to Ni is 7:3. A mass ratio of Cu:Ni = 7:3 is a good balance between conductivity, corrosion resistance, and processability, which can improve the overall performance of the display screen.

[0060] In some embodiments, the conductive grid layer 2 includes a plurality of grid units 2a, each of which includes a second grid 201 and a plurality of second grid lines 202 surrounding the second grid 201. In other words, in the embodiments of the present application, the grid formed is a polygon, such as a triangle, a quadrilateral, a pentagon, or a hexagon. In one specific embodiment, the grid is a quadrilateral structure.

[0061] In the embodiment of the present application, among the plurality of grid units, at least some of the second grid lines 202 of at least some of the grid units 2a have different lengths and / or line widths than corresponding second grid lines 202 of adjacent grid units 2a.

[0062] Specifically, taking a quadrilateral grid as an example, second grid lines 202a1, 202a2, 202b1, and 202b2 surround and form a grid, constituting a first grid unit. Second grid lines 202a2, 202a3, 202b3, and 202b4 surround and form a grid, constituting a second grid unit adjacent to the first grid unit. 202a1 and 202a3 correspond to second grid lines 202, 202b1 and 202b3 correspond to second grid lines 202, and 202b2 and 202b4 correspond to second grid lines 201. 202b1 and 202b3 have different lengths and different line widths. 202b2 and 202b4 have different lengths and different line widths. In the embodiments of the present application, employing an asymmetric structure with different lengths and / or line widths can disrupt the symmetrical scattering pattern of ESD shocks and increase dissipation capability.

[0063] In some embodiments, the line width of the second grid lines 202 is 2 μm to 4 μm, such as 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, etc. The side length of the second grid lines 202 is 40 μm to 70 μm, such as 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 70 μm, etc. This application optimizes the line width and side length to improve the mechanical properties and low-frequency resistance of the grid unit. The narrower the line width, the higher the grid density, and the higher the reflection loss of high-frequency electromagnetic waves. At the same time, too narrow a line width will increase the difficulty of the process. When the side length to line width ratio is controlled at (10-20):1, the resulting grid structure has good mechanical properties and strong low-frequency resistance.

[0064] In the embodiment of the present application, the grid cells of the conductive grid layer 2 are designed by using a topological algorithm, as follows:

[0065] The design dynamically adjusts the mutation probability Pm (adjustable from 0.1% to 5%), forcing the side length difference between the corresponding different second grid lines 202 of adjacent grid cells to be greater than 15%, so as to improve the absorption and transmission capability of ESD impact.

[0066] Dynamic topology optimization algorithm:

[0067] Algorithm goal: Maximize shielding effectiveness SE = 10log (P_in / P_out), while satisfying the mesh edge length variation rate Δd ≥ 15%, material cost C ≤ threshold (the threshold is adjusted according to actual market conditions), shielding effectiveness (Shielding Effectiveness, SE), P_in is the incident power (the total power of the electromagnetic wave (including ESD pulse) when it reaches the surface of the shield, the original energy input that the shielding structure needs to attenuate), P_out (the remaining power after passing through the shield, the energy leaked due to the shielding structure not being effectively attenuated).

[0068] Establish mathematical model 1:

[0069] f=max di ∑ k＝1 n (α·SE k +β·Δd k / d avg )

[0070] Parameter description: di: line width of the i-th grid (μm); SE k : Shielding effectiveness (dB) in the kth frequency band (0.1-40GHz); Δd k : standard deviation of the grid side length of the kth frequency band (μm); d avg : average mesh side length (μm); α, β: weight coefficients (α+β=1, initial value α=0.7, β=0.3).

[0071] Dynamic adjustment rule: initial mutation probability Pm = 2%, each generation is adjusted according to mathematical model 1. If Δd < 15% for 5 consecutive generations, then Pm = Pm × 1.2 (upper limit 5%), and the difference in adjacent grid side lengths Δd is forced to be ≥ 15%.

[0072] Dynamic topology optimization algorithm process

[0073] Parameter setting: initial grid parameter set D = {d1, d2, ..., dn} (n is the total number of grids), frequency band division set F = {f1, f2, ..., fm} (m = 40, 0.1-40 GHz step 1 GHz).

[0074] Iterative process: According to the frequency band division, the objective function mathematical model 1 is calculated for each frequency band, the weight coefficients α and β are adjusted according to the mutation probability Pm, the maximum number of iterations is set (for example, 100), the largest part of the objective function value (for example, the first 20%) is selected, and it is verified that Δd ≥ 15% and the material cost C ≤ the threshold value, and di is calculated.

[0075] Therefore, in the embodiment of the present application, the difference Δd between the second grid lines 202 corresponding to adjacent grid cells is ≥ 15%; (i.e., Δd = (side length of the larger second grid line 202 - side length of the smaller second grid line 202) * 100% / side length of the smaller second grid line 202)

[0076] In some embodiments, the display device 100 further includes a shielding layer 8, which is located on a side of the display panel 1 away from the conductive grid layer 2. The shielding layer 8 is disposed within the frame 4 and is electrically connected to the frame 4. By adding the shielding layer 8, the electrostatic discharge path can be further optimized.

[0077] See also Figure 6 In some embodiments, the shielding layer 8 is made of a conductive material and has a mesh structure. By designing the shielding layer 8 as a mesh structure, light paths are prevented from being blocked.

[0078] In a specific embodiment, the shielding layer 8 has a pore size of 50 μm and a pore density of 1000 pores / cm 2 , thereby balancing shielding effectiveness, light transmittance and process feasibility.

[0079] In some embodiments, the shielding layer 8 is made of at least one of Cu, Au, and Ag. In a preferred embodiment, the shielding layer 8 is made of Cu. Copper has higher electrical conductivity, thermal conductivity, and yield strength than aluminum, and is less expensive than gold and silver.

[0080] In the embodiment of the present application, the inner side of the frame 4 is directly or indirectly connected to the shielding layer 8 .

[0081] When indirectly connected, in some preferred embodiments, the inner side is connected to the shielding layer 8 through the conductive adhesive 5 .

[0082] In some embodiments, the conductive adhesive includes a first conductive adhesive 501 and a second conductive adhesive 502 arranged along the stacking direction of the display panel 1 and the transparent conductive grid 2. The first conductive adhesive 501 is connected to the frame on the side facing the frame 4, and the first conductive adhesive 501 is connected to the display panel 1, the transparent conductive layer 3 and the conductive grid layer 2 on the side facing away from the frame 4. The second conductive adhesive 502 is connected to the frame 4 on the side facing the frame 4, and the second conductive adhesive 502 is connected to the shielding layer 8 on the side facing away from the frame 4.

[0083] In the embodiment of the present application, the impedance after the second conductive adhesive 502 is connected to the shielding layer 8 is less than 0.1Ω.

[0084] In the embodiment of the present application, the first conductive adhesive 501 and the second conductive adhesive 502 can be provided as a whole. It can be understood that, in this case, the first conductive adhesive 501 and the second conductive adhesive 502 are made of the same material. Of course, the first conductive adhesive 501 and the second conductive adhesive 502 can also be provided separately. In this case, the material of the first conductive adhesive 501 is the same as or different from the material of the second conductive adhesive 502. When the material of the first conductive adhesive 501 is different from the material of the second conductive adhesive 502, the material of the first conductive adhesive 501 is conductive silicone and the material of the first conductive adhesive 502 is conductive foam.

[0085] See also Figure 7 In some embodiments, the frame 4 includes a main body material and an electrothermal magnetic material 10 distributed within the main body material. The electrothermal magnetic material 10 can absorb high-frequency EMI (>1 GHz) and convert edge ESD pulse energy into heat, breaking through the traditional purely conductive blocking solution and converting ESD shock into other forms of energy.

[0086] In some embodiments, the electrothermal magnetic material 10 is in the form of an annular magnetic ring, a sheet, a column, or a spiral. In a preferred embodiment, the electrothermal magnetic material 10 is an annular magnetic ring, which can form a closed magnetic circuit. The annular structure closes the magnetic flux lines along the circumference, lowering the magnetic resistance compared to an open structure, thereby improving shielding efficiency. The annular magnetic ring can also evenly disperse ESD pulse energy, avoiding local hot spots.

[0087] In one specific embodiment, the electrothermal magnetic material 10 includes a ferrite / nanocrystalline composite magnetic ring, wherein the inner layer of the ferrite / nanocrystalline composite magnetic ring is Mn-Zn ferrite, and the outer layer is coated with FeSiAl nanocrystalline ribbon, and the thickness of the outer layer is 20-30μm. Ferrite (Mn-Zn ferrite) has high magnetic permeability in the low-frequency band, but the magnetic permeability decreases in the high-frequency band, resulting in insufficient shielding effectiveness at high frequencies; nanocrystalline materials complement this. Nanocrystalline alloys have stable magnetic permeability and better high-frequency characteristics than ferrite. Ferrite dominates low-frequency shielding, while nanocrystals cover medium and high frequencies, achieving wide-band protection. Nanocrystals are more efficient in converting high-frequency losses into heat energy than ferrite. In addition, ferrite is low-cost, while nanocrystals are more expensive. Using them together can reduce overall costs.

[0088] In some embodiments, the display device further includes a quantum dot layer 9, which is located on the side of the display panel 1 away from the conductive grid layer 2, and the quantum dot layer 9 is located in the frame 4 and electrically connected to the shielding layer 8, and the quantum dot layer 9 is configured to be electroluminescent.

[0089] The quantum dot layer 9 converts ESD pulse energy into photons of a specific wavelength (480-520 nm) through the quantum confinement effect, thereby achieving the purpose of resisting ESD shock.

[0090] In some embodiments, the material of quantum dot layer 9 comprises CdSe / ZnS core-shell quantum dots. In one specific embodiment, the CdSe / ZnS core-shell quantum dots have a CdSe core diameter of 3.5 nm and a ZnS shell with a thickness of 0.8 nm. The 3.5 nm CdSe core size is close to the exciton Bohr radius (the Bohr radius of CdSe is 4.5 nm), significantly improving the electron-hole wave function overlap through quantum confinement, thereby increasing the fluorescence quantum yield. The 0.8 nm ZnS shell (approximately two monolayers) provides strong optical gain.

[0091] In some embodiments, the thickness of the quantum dot layer 9 is in the nanometer range. In a specific embodiment, the thickness of the quantum dot layer 9 is 50-100 nm, for example, 50 nm, 60 nm, 65 nm, 70 nm, 80 nm, 90 nm, 100 nm, etc.

[0092] It can be understood that the quantum dot layer 9 of the present application is connected to the frame 4 or not.

[0093] In some embodiments, the quantum dot layer 9 is in contact with a side of the second conductive adhesive layer 502 facing away from the frame.

[0094] In this embodiment, quantum dot layer 9 is directly connected to shielding layer 8, and shielding layer 8 is made of a conductive material. This direct connection further enhances electrostatic conduction between the two layers, accelerating the extraction and conversion of static electricity into light energy.

[0095] It can be understood that in the embodiment of the present application, the connection order of the quantum dot layer 9 and the shielding layer 8 is not limited.

[0096] In one embodiment, the quantum dot layer 9 is disposed on a side of the display panel 1 away from the conductive grid layer 2, and the shielding layer 8 is disposed on a side of the quantum dot layer 9 away from the display panel. In another embodiment, the shielding layer 8 is disposed on a side of the display panel 1 away from the conductive grid layer 2, and the quantum dot layer 9 is disposed on a side away from the shielding layer 8.

[0097] The display device 100 in the embodiment of the present application may be a liquid crystal display device or an organic light-emitting device.

[0098] In some embodiments, the display device 100 is a liquid crystal display device.

[0099] In some embodiments, the display device 100 further includes a shell 6, the peripheral side of the shell 6 is connected to the frame 4, the shell 6 and the frame 4 enclose a accommodating cavity with an opening, the display panel 1, the transparent conductive film 3 and the conductive grid layer 2 are arranged in the accommodating cavity, and the light-emitting side of the display panel 1 is arranged toward the outlet, and the transparent conductive film 3 and the conductive grid layer 2 are located on the light-emitting side of the display panel 1; the display device 100 further includes a backlight module 7, the backlight module 7 is arranged on the side of the display panel 1 away from the conductive grid layer 2, the backlight module 7 and the display panel 1 are both arranged in the accommodating cavity, and the side of the backlight module 7 away from the display panel 1 is away from the opening.

[0100] In some embodiments, the backlight module 7 includes a light-emitting side and a light-incident side that are oppositely disposed, the light-emitting side faces the display panel 1 , and the light-incident side faces the housing 6 .

[0101] In some embodiments, the shielding layer 8 and the quantum dot layer 9 are both disposed between the display panel 1 and the backlight module 7 .

[0102] In summary, the display device 100 of the present application solves the problem of insufficient ESD protection of the screen panel through the six-layer protection of transparent conductive layer 1, conductive grid layer 2, shielding layer 8, conductive adhesive 5, quantum dot layer 9, and electrothermal magnetic material 10. It addresses ESD issues and achieves cross-dimensional integration of ESD protection and electromagnetic compatibility for the screen panel. It breaks through the traditional purely conductive blocking solution and converts ESD shock into heat energy and / or light energy.

[0103] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0104] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0105] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0106] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display device, characterized in that: include: Display panel; A conductive grid layer is provided on the display panel; a transparent conductive layer, the transparent conductive layer being disposed on a side of the conductive grid layer away from the display panel; and A frame body comprises a conductive material, the display panel is arranged in the frame body, and the frame body is electrically connected to the transparent conductive layer to form a ground path.

2. The display device according to claim 1, wherein The conductive grid layer is a mesh structure, the transparent conductive layer is in a grid shape, and a plurality of first grids and first grid lines surrounding the first grids are formed in the transparent conductive layer.

3. The display device according to claim 2, wherein: A plurality of second grids and second grid lines surrounding the second grids are formed in the conductive grid layer, wherein at least a portion of the first grid lines and at least a portion of the second grid lines intersect with each other.

4. The display device according to claim 2, wherein: The line width of the first grid line is 50nm to 200nm; and / or, The thickness of the transparent conductive layer is 30 nm to 50 nm; and / or, The material of the transparent conductive layer includes indium tin oxide.

5. The display device according to claim 1, wherein The conductive grid layer includes a plurality of grid units, each of the grid units includes at least one second grid and a plurality of second grid lines surrounding the second grid; In the plurality of grid units, at least some of the second grid lines in at least some of the grid units have different lengths and / or line widths from those of the second grid lines in adjacent grid units.

6. The display device according to claim 3 or 5, characterized in that The material of the conductive grid layer includes an alloy material, the line width of the second grid line is 2 μm to 4 μm; and / or the length of the second grid line is 40 μm to 70 μm.

7. The display device according to claim 1, wherein The display device further includes a shielding layer, which is located on a side of the display panel away from the conductive grid layer, and is disposed within the frame and electrically connected to the frame; and / or the frame is made of an electrothermal magnetic material.

8. The display device according to claim 7, wherein: The shielding layer is made of a conductive material and has a mesh structure.

9. The display device according to claim 7, wherein: The display device further includes a quantum dot layer, which is located on a side of the display panel away from the conductive grid layer. The quantum dot layer is located in the frame and electrically connected to the shielding layer. The quantum dot layer is configured to be electroluminescent.

10. The display device according to claim 1, wherein The display device also includes a conductive adhesive, which includes a first side and a second side arranged opposite to each other, the first side is connected to the frame, and the second side is connected to at least the display panel and the transparent conductive layer at the same time, and the material of the conductive adhesive includes a conductive elastic material.

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