Device and method for controlling mounting flatness of large-size CMOS (Complementary Metal Oxide Semiconductor) chip

Abstract

The invention relates to a large-size CMOS chip mounting flatness control device and method, the device comprises a cross-shaped sliding table, a bottom plate, a grounding corner connector, two supports and a cross beam, the cross-shaped sliding table is fixed on the bottom plate, the two supports are fixed on the bottom plate through the grounding corner connector, the cross beam stretches across the two supports and is fixed with the two supports, the cross beam is located right above the cross-shaped sliding table, and the cross beam is fixed on the cross-shaped sliding table through the grounding corner connector. Multiple through holes and multiple threaded holes are formed in the middle of the beam. According to the method, an image measuring instrument with a laser ranging function is adopted to measure the planeness of the chip, the position of the chip is adjusted through a cross-shaped sliding table, pressure is applied to a designated area of the chip through a pressing nail, and the mounting planeness of the chip is iteratively adjusted. The surface mounting device is used for surface mounting of the large-size CMOS chip, and surface mounting flatness control can be achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit micro-assembly, and relates to a device and method for controlling the flatness of large-size (length exceeding 50 mm, width exceeding 20 mm) CMOS chip mounting. Background Art

[0002] Chip placement is an important part of integrated circuit microassembly, and the research direction in the industry is mainly to control placement accuracy and improve placement speed. A chip placement device (CN202121368967.7) by Xiang Gang et al. includes a substrate and a clamping unit installed on the substrate. By reducing the friction between the chip and the substrate, it can effectively improve the placement and positioning speed of semiconductor chips. An adsorption device and a robotic arm for precision chip placement (CN202111284827.6) by Ruan Jingneng et al. include an external support, a shock-absorbing baffle, a motion component and other structures, realizing an adsorption device and a robotic arm for precision chip placement, which can effectively speed up the production cycle. A pressurizing device and pressurizing method for chip placement (CN202211163751.6) by Li Wanli et al. include a lever, a pressure head assembly and other structures. The lever is adjusted by rotating the cam to effectively adjust the chip press-fitting, and is suitable for the synchronous press-fitting of multiple rows of chips, especially for chip placement in heating and other occasions.

[0003] The above chip mounting technology lacks control over the chip mounting flatness, which has a significant impact on the quality of optoelectronic devices such as CMOS chips. Summary of the Invention

[0004] The technical problem solved by the present invention is to overcome the deficiencies of the prior art and provide a large-size CMOS chip mounting flatness control device and control method.

[0005] The solution of the present invention is:

[0006] A large-size CMOS chip mounting flatness control device includes a cross slide, a base plate, a grounding angle bracket, a bracket, a crossbeam and a pressure pin;

[0007] The cross slide is fixed on the base plate, and the two brackets are fixed on the base plate through grounding angle brackets. The cross beam spans the two brackets and is fixed to the two brackets. The cross beam is located directly above the cross slide. Several through holes and several threaded holes are set in the middle of the cross beam. The threaded holes are used to install threaded pressure nails.

[0008] Preferably, a guide groove is provided on the bracket, the adapter block is fixed in the guide groove, and the crossbeam is fixed on the adapter block.

[0009] Preferably, the sliding surface of the cross slide is used for placing a chip tray with adhesive.

[0010] Preferably, it also includes an image measuring instrument with a laser ranging function, and the image measuring instrument can measure the flatness of the chip through the through hole opened by the beam.

[0011] The large-size CMOS chip mounting flatness control method implemented by the large-size CMOS chip mounting flatness control device includes:

[0012] (1) Place the chip on top of the adhesive in the chip tray, and place the chip tray on the sliding surface of the cross slide;

[0013] (2) Adjust the sliding surface position of the cross slide so that the chip is located directly below the through hole in the middle of the beam;

[0014] (3) Use an image measuring instrument with a laser ranging function to measure the initial flatness of the chip through the hole opened by the beam;

[0015] (4) According to the measured flatness, screw the threaded pressure pins into the threaded holes of the beam to apply pressure to the areas with high flatness;

[0016] (5) Use an image measuring instrument with a laser ranging function to re-measure the flatness of the fine-tuned chip;

[0017] (6) Repeat steps (4)-(5) until the chip flatness reaches the expected index.

[0018] Preferably, after the chip flatness reaches the expected index, it is placed in an oven for baking to solidify the adhesive.

[0019] The beneficial effects of the present invention compared with the prior art are:

[0020] To address the problem of poor flatness control during the mounting of optoelectronic devices such as large-size CMOS chips, the present invention provides a control device and method. By using laser to measure the flatness of the chip during the mounting process, an XY-axis displacement platform is used to adjust the chip position, and press pins are used to locally pressurize the chip to adjust the chip flatness. Through iterative adjustment, the chip mounting flatness can be achieved to no more than 30μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A top view of the chip placement flatness control device;

[0022] Figure 2 This is a side view of the chip placement flatness control device. DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the accompanying drawings.

[0024] like Figure 1and 2 As shown, a large-size CMOS chip mounting flatness control device includes a cross slide, a base plate, a grounding angle code, a bracket, a crossbeam, and a transfer block.

[0025] The cross slide is bolted to the baseplate, and the two brackets are fixed to the baseplate via grounding angle brackets. A crossbeam spans the two brackets and is fixed to them. The crossbeam is located directly above the cross slide. The center of the crossbeam has several through-holes for measuring chip flatness, as well as threaded holes for installing threaded pressure pins. The brackets are provided with guide grooves, into which the adapter blocks are fixed, and the crossbeam is fixed to the adapter blocks. The sliding surface of the cross slide is used to place the chip tray with adhesive.

[0026] The control device assembly method of the present invention is as follows:

[0027] 1) Place the cross slide on the base plate and fix it with bolts, see Figure 1 ;

[0028] 2) Place the grounding bracket on the bottom plate and fix it with M5 screws, see Figure 1 ;

[0029] 3) Place the bracket on the base plate and fix it with M5 screws and ground brackets, see Figure 1 ;

[0030] 4) Install the T-screw M5 into the guide groove of the bracket, install the adapter block to the bracket, and fix it with the butterfly nut M5, see Figure 2 ;

[0031] 5) Use M5 screws to fix the beam to the adapter block, see Figure 2 .

[0032] The present invention describes a method for controlling the flatness of large-scale CMOS chip placement using a localized pressure-based iterative fine-tuning method. Using a chip placement flatness control device, the chip is held and fixed. An image measuring instrument with a laser rangefinder is used to initially check flatness. Threaded pressure pins are then screwed into threaded holes in a beam. Localized pressure is applied to specific areas of the chip to fine-tune the flatness. This process is repeated until the desired flatness is achieved.

[0033] The large-size CMOS chip mounting flatness control method of the present invention is as follows:

[0034] 1) Place the chip on the cross slide through the chip tray, and fine-tune the chip position through the cross slide so that it is located below the cross beam through hole. Figure 2 ,Use an image measuring instrument with a laser ranging function to measure the initial flatness of the chip through the hole opened by the beam;

[0035] 2) According to the measured flatness, use the threaded press pin to screw into the threaded hole of the cross beam to apply pressure to the chip locally to adjust the flatness of the chip, see Figure 2 ;

[0036] 3) Use the image measuring instrument with laser ranging function to measure the fine-tuned flatness of the chip again;

[0037] 4) Iterate steps 2) and 3) until the flatness of the chip reaches the expected index;

[0038] 5) Put the chip and the chip tray with the flatness reaching the expected index into the oven for baking to solidify the adhesive.

[0039] Embodiment

[0040] The size of a certain TDI-CMOS chip is 93mm x 31mm x 750μm, the flatness is 3μm, and the flatness of the part where the chip is mounted in the tube shell is 49μm. It is required that the flatness of the chip after being glued and mounted is controlled within 30μm.

[0041] The method of the application, the local pressure iteration fine-tuning method, includes the following specific steps:

[0042] 1) Place the cross slide on the base plate and fix it with bolts, see Figure 1 ;

[0043] 2) Place the grounding corner code on the base plate and fix it with M5 screws, see Figure 1 ;

[0044] 3) Place the bracket on the base plate and fix it with M5 screws and the grounding corner code, see Figure 1 ;

[0045] 4) Install the T-shaped screw M5 into the guide groove of the bracket, install the adapter block to the bracket, and fix it with the butterfly nut M5, see Figure 2 ;

[0046] 5) Fix the cross beam to the adapter block with M5 screws, see Figure 2 ;

[0047] 6) Place the tube shell with the mounted chip on the cross slide, fine-tune the position of the chip, see Figure 2 , and measure the initial flatness of the chip through the through hole of the cross beam using the image measuring instrument with laser ranging function. The actual measured value is 43μm;

[0048] 7) According to the measured flatness, screw the threaded press pin into the mounting hole of the cross beam, and then use the press pin to apply pressure to the chip locally to adjust the flatness of the chip, see Figure 2 ;

[0049] 8) Using an image measuring instrument with a laser ranging function, the flatness of the fine-tuned chip was measured again, and the measured value was 38μm;

[0050] 9) Iterate steps 7) and 8) until the chip flatness reaches the expected level, which is 29 μm.

[0051] 10) Place the chip and tube shell whose flatness reaches the expected index into an oven for baking to solidify the adhesive.

[0052] This method uses an image measuring instrument with a laser rangefinder to measure chip flatness, adjusts chip position via an XY-axis displacement platform (cross slide), and applies pressure to designated areas of the chip using pressure pins to iteratively adjust chip placement flatness. This method is used for mounting large-scale CMOS chips and can achieve placement flatness control. This method can also be applied to the placement process of optoelectronic devices such as large-scale CMOS chips, ensuring the quality of CMOS device packaging.

[0053] Parts of the present invention that are not described in detail belong to common knowledge among those skilled in the art.

Claims

1. A large-size CMOS chip mounting flatness control device, characterized by: Including cross slide, base plate, ground angle bracket, bracket, cross beam and pressure nail; The cross slide is fixed on the base plate, and the two brackets are fixed on the base plate through grounding angle brackets. The cross beam spans the two brackets and is fixed to the two brackets. The cross beam is located directly above the cross slide. Several through holes and several threaded holes are set in the middle of the cross beam. The threaded holes are used to install threaded pressure nails.

2. The large-size CMOS chip mounting flatness control device according to claim 1, characterized in that: The bracket is provided with a guide groove, the adapter block is fixed in the guide groove, and the crossbeam is fixed on the adapter block.

3. The large-size CMOS chip mounting flatness control device according to claim 1, characterized in that: The sliding surface of the cross slide is used for placing a chip tray with adhesive.

4. The large-size CMOS chip mounting flatness control device according to claim 1, characterized in that: It also includes an image measuring instrument with a laser distance measuring function, which can measure the flatness of the chip through the through hole opened by the beam.

5. A method for controlling the flatness of a large-size CMOS chip mounted using the large-size CMOS chip mounted flatness control device according to any one of claims 1 to 4, characterized in that: include: (1) Place the chip on top of the adhesive in the chip tray, and place the chip tray on the sliding surface of the cross slide; (2) Adjust the sliding surface position of the cross slide so that the chip is located directly below the through hole in the middle of the beam; (3) Use an image measuring instrument with a laser ranging function to measure the initial flatness of the chip through the hole opened by the beam; (4) According to the measured flatness, screw the threaded pressure pins into the threaded holes of the beam to apply pressure to the areas with high flatness; (5) Use an image measuring instrument with a laser ranging function to measure the flatness of the chip after fine-tuning; (6) Repeat steps (4)-(5) until the chip flatness reaches the expected index.

6. The large-size CMOS chip mounting flatness control method according to claim 5, characterized in that: After the chip flatness reaches the expected index, it is placed in an oven for baking to cure the adhesive.

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