Special exposure machine for DBC (Direct Bonding Copper) ceramic copper-clad substrate

Abstract

The invention discloses an exposure machine special for a DBC ceramic copper-clad substrate, and belongs to the technical field of exposure machines, the exposure machine comprises a machine table, the top of the machine table is provided with a heat exchange heat dissipation port, one side of the machine table is fixedly connected with an illumination plate, the bottom of the illumination plate is provided with an LED lamp panel, and one side of the machine table corresponding to the illumination plate is provided with a table frame exchange port. A pair of exposure table frames are arranged in the table frame exchange port, and a storage box and an extension working plate are arranged on the two sides of the table frame exchange port respectively. According to the invention, through the arrangement of the substrate warping degree detection mechanism and the combination of a large-lead ball screw pair and an incremental rotary encoder, the micro displacement of the pressing plate is directly converted into a high-precision digital pulse signal, and the fine measurement of the flatness of the substrate is realized, so that the original invisible warping deformation becomes measurable and digitized; a basic data basis is provided for subsequent accurate compensation, and the problems of Mark point focusing failure and alignment deviation caused by warping are solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of exposure machines, in particular to a DBC ceramic copper-clad substrate special exposure machine. BACKGROUND

[0002] The DBC ceramic copper-clad substrate special exposure machine is a high-precision photoetching device for the manufacturing process of a ceramic copper-clad substrate (DBC). The device is mainly used for completing a patterned exposure process on the surface of a DBC substrate and is a key equipment for realizing the transfer of a fine pattern of an electronic circuit. In the fields of electronic power modules, semiconductor packaging, new energy vehicles, and aerospace electronics, a DBC substrate has become a key basic material due to its excellent insulation performance, high thermal conductivity, and a thermal expansion coefficient matching that of a chip. The manufacturing process involves coating copper on the surface of a ceramic substrate (such as aluminum oxide or aluminum nitride) and realizing the firm combination of the copper layer and the ceramic through a high-temperature eutectic process. Subsequently, a series of patterned processes such as photoresist coating, exposure, and development need to be performed on the copper layer to form a circuit wiring pattern required by design.

[0003] The prior art also has the following disadvantages: the existing substrate exposure machine is not designed for DBC ceramic copper-clad substrates. Since a DBC substrate is bonded by ceramic and copper layers at high temperature, the substrate is prone to slight warping and deformation after etching, heat treatment, and roughening in the production and processing flow. In other words, the surface of part of the substrate in the exposure process is not a completely flat surface. The alignment system used by mainstream exposure machines is a Through-The-Lens (TTL) or Off-Axis visual alignment system. The heights of Mark points at different positions of the substrate in a slight warping state are different, which causes the camera to fail to capture all the marks and thus cannot accurately focus, thereby seriously affecting the alignment accuracy. To solve this problem, the existing device uses multi-point focusing and 3D curved surface compensation technology, but the cost is high and the compensation effect is very limited. SUMMARY

[0004] To overcome the above-mentioned defects, the application provides a DBC ceramic copper-clad substrate special exposure machine, which solves the problems of the prior art.

[0005] To achieve the above-mentioned purposes, the application provides the following technical scheme: a DBC ceramic copper-clad substrate special exposure machine, comprising: The machine table top is provided with a heat exchange heat dissipation port, one side of the machine table is fixedly connected with an illumination plate, the bottom of the illumination plate is provided with an LED lamp plate, the side corresponding to the illumination plate of the machine table is provided with a table frame exchange port, a pair of exposure table frames are arranged in the table frame exchange port, a storage box and an extension workboard are arranged on the two sides of the table frame exchange port, an interactive port and an adjusting support are arranged on the table top where the table frame exchange port is located, an emergency stop switch and a table frame forward switch are arranged on the interactive port, and a machine table control PC end is arranged on the adjusting support; A sealing cover plate is hingedly connected to one side of the exposure table frame, a jig plate is arranged on the exposure table frame, a special jig plate is mounted on the jig plate, and six load plate frames are arranged on the special jig plate. Both sides of the exposure table frame are rotatably connected with a supporting arm and an electric telescopic rod, the output end of the electric telescopic rod is rotatably connected with the supporting arm, both sides of the sealing cover plate are provided with a matching groove, the supporting arm is slidably connected in the matching groove at the end close to the electric telescopic rod, both sides of the exposure table frame are fixedly connected with a sliding seat, two slide rails are fixedly connected to the inner walls on the two sides of the table frame exchange port, the exposure table frame is slidably connected with the slide rails through the sliding seat, the two sliding seats are fixedly connected with a rack on the side close to each other, a drive gear is rotatably connected to the inner walls on the two sides of the table frame exchange port, a servo motor is arranged in the machine table and used for driving the drive gear, and the drive gear is in mesh with the two racks on the corresponding side.

[0006] As a further scheme of the present application: the two sides of the load plate frame are provided with a substrate warping degree detection mechanism, the substrate warping degree detection mechanism comprises a detection port arranged on one side of the load plate frame, a bidirectional screw rod is rotatably connected in the detection port, screw nuts are threadedly connected to the two sides of the bidirectional screw rod, pull rods are rotatably connected to one side of the screw nuts, a detection plate is rotatably connected to the two pull rods, two hollow tubes are fixedly connected to the bottom of the detection plate, a pressing plate is slidably connected to the two hollow tubes, a ball screw is rotatably connected in the hollow tube, a ball screw nut is arranged in the hollow tube, the ball screw nut is fixedly connected with the pressing plate, a rotary encoder is arranged in the detection plate, the detection end of the rotary encoder is connected with the ball screw, and the rotary encoder contains a grating disc and a photoelectric interrupter.

[0007] As a further scheme of the present application: a plurality of grooves are arranged in the load plate frame, an adsorption point is arranged at the intersection of two mutually perpendicular grooves, the adsorption points are divided into two parts corresponding to the positions of the two detection ports on the two sides of the single load plate frame, a vacuum pump is arranged in the exposure table frame, the vacuum pump is communicated with each part of the adsorption points, and an electromagnetic valve is arranged at the communication position.

[0008] As a further scheme of the present application: the machine table is provided with a control port, the control port is provided with a control module and a detection module, the control module is signal connected with the detection module, the control module is signal connected with the electromagnetic valve, and the detection module is signal connected with the rotary encoder.

[0009] Compared with the prior art, the present application has the beneficial effects that: The present application realizes fine measurement of the flatness of the substrate by setting the substrate warping degree detection mechanism, directly converting the small displacement amount of the pressing plate into a high-precision digital pulse signal through the combination of the large-lead ball screw pair and the incremental rotary encoder, making the originally invisible warping deformation measurable and data-based, providing basic data basis for subsequent accurate compensation, and solving the problems of Mark point focusing failure and alignment deviation caused by warping. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 It is a perspective structural schematic diagram of the present application; Figure 2 It is a perspective structural schematic diagram of the present application; Figure 1 It is an enlarged view of part A in the figure; Figure 3 It is a perspective structural schematic diagram of the present application from another angle; Figure 4 It is a perspective structural schematic diagram of the carrier plate frame part of the present application; Figure 5 It is a top view schematic diagram of the carrier plate frame of the present application; Figure 6 It is a perspective structural schematic diagram of the present application; Figure 5 It is an enlarged view of part B in the figure; Figure 7 It is a perspective structural schematic diagram of the detection port of the present application; Figure 8 It is a perspective structural schematic diagram of the pressing plate part of the present application; Figure 9 It is a perspective structural schematic diagram of the hollow tube part of the present application.

[0011] In the figure: 1, machine table; 2, heat exchange heat dissipation port; 3, illumination plate; 4, LED lamp plate; 5, exposure table frame; 6, storage box; 7, extension work plate; 8, interaction port; 9, adjusting support; 10, emergency stop switch; 11, table frame forward switch; 12, machine table control PC end; 13, sealing cover plate; 14, special jig plate; 15, carrier plate frame; 16, supporting arm; 17, electric telescopic rod; 18, sliding seat; 19, sliding rail; 20, rack; 21, driving gear; 22, detection port; 23, bidirectional screw; 24, nut; 25, pull rod; 26, detection plate; 27, hollow tube; 28, pressing plate; 29, ball screw; 30, ball nut; 31, rotary encoder; 32, adsorption point. DETAILED DESCRIPTION

[0012] The technical solutions of the present application will be further described in detail below in combination with the specific embodiments.

[0013] Embodiment 1 Reference Figures 1-3 For the first embodiment of the present application, the embodiment provides a DBC ceramic copper-clad substrate dedicated exposure machine, which can realize semi-automatic copper-clad ceramic substrate exposure work, which comprises a machine table 1, the top of the machine table 1 is provided with a heat exchange and heat dissipation port 2, one side of the machine table 1 is fixedly connected with an illumination plate 3, the bottom of the illumination plate 3 is provided with an LED lamp plate 4, the machine table 1 is provided with a table frame exchange port corresponding to one side of the illumination plate 3, a pair of exposure table frames 5 are arranged in the table frame exchange port, a storage box 6 and an extension workboard 7 are arranged on both sides of the table frame exchange port, an interactive port 8 and an adjusting support 9 are arranged on the table surface where the table frame exchange port is located, an emergency stop switch 10 and a table frame forward switch 11 are arranged on the interactive port 8, and a machine table control PC end 12 is arranged on the adjusting support 9.

[0014] Specifically, the cooling system used by the present application is water cooling + air cooling, cooling water can enter the internal exposure light source for heat dissipation, the temperature of the cooling water after absorbing heat is increased, and the cooling water is discharged after preliminary heat dissipation through the heat exchange and heat dissipation port 2, the illumination plate 3 on the machine table 1 can provide good lighting conditions for the staff when loading the substrate to be exposed for pre-checking, the emergency stop switch 10 on the interactive port 8 can stop the operation of the whole device in an emergency, and the machine table control PC end 12 can further pre-check the substrate and specifically check the exposure condition.

[0015] The exposure table frame 5 is hingedly connected with a sealing cover plate 13, a jig plate is arranged on the exposure table frame 5, a special jig plate 14 is mounted on the jig plate, and six loading plate frames 15 are arranged on the special jig plate 14.

[0016] Specifically, in order to adapt to the DBC copper-clad ceramic substrate, the special jig plate 14 of the special type is mounted on the exposure table frame 5, and the parameters of the loading plate frame 15 are determined according to the substrate parameters required by production.

[0017] Embodiment 2 Reference Figures 4-5For the second embodiment of the present application, unlike the previous embodiment, the embodiment provides the opening and closing functions of the sealing cover plate 13 of the DBC ceramic copper-clad substrate special exposure machine and the switching function of the double exposure table frame 5, which can automatically open and close the sealing cover plate 13 on the exposure table frame 5 and switch the two sets of exposure table frames 5. It comprises a branch arm 16 and an electric telescopic rod 17 rotatably connected to the two sides of the exposure table frame 5, the output end of the electric telescopic rod 17 is rotatably connected with the branch arm 16, the sealing cover plate 13 is provided with a matching groove on both sides, the branch arm 16 is slidably connected in the matching groove at one end close to the electric telescopic rod 17, the exposure table frame 5 is slidably connected with the slide rail 19 through the slide seat 18, the two slide seats 18 are fixedly connected with a gear rack 20 on the side close to each other, the inner walls on both sides of the table frame exchange port are rotatably connected with a drive gear 21, and the machine table 1 is provided with a servo motor for driving the drive gear 21. The drive gear 21 and the two gear racks 20 on the corresponding side are in meshing relationship.

[0018] Specifically, the opening and closing of the sealing cover plate 13 can be realized by the electric telescopic rod 17. When the electric telescopic rod 17 is extended, the branch arm 16 rotatably connected with the output end will lift the sealing cover plate 13, and the end of the branch arm 16 will slide a certain distance in the matching groove. Since the present application is in a double-table frame alternating mode, the two sets of exposure table frames 5 need to work alternately. The servo motor can drive the drive gear 21 to rotate. When the drive gear 21 rotates, the two gear racks 20 engaged with it will move relatively, and the two sets of exposure table frames 5 can move relatively. When one set of exposure table frame 5 is loaded, the other set of exposure table frame 5 can enter the machine table 1 for exposure treatment.

[0019] It should be noted that the exposure machine proposed in the present application is essentially a semi-automatic exposure machine, which needs manual loading and exposure treatment after evaluating the surface conditions of the substrate. Therefore, in order to further improve the exposure efficiency, a double-table frame alternating mode is specially provided, which maximizes the production efficiency without affecting the exposure quality.

[0020] Embodiment 3 Reference Figures 5-9For the third embodiment of the present application, unlike the previous embodiment, the embodiment provides a detection function of the substrate warping for the exposure machine special for the DBC ceramic copper clad substrate, which comprises a carrier frame 15, and the carrier frame 15 is provided with a substrate warping detection mechanism on both sides, the substrate warping detection mechanism comprises a detection port 22 arranged on one side of the carrier frame 15, a bidirectional screw rod 23 is rotatably connected in the detection port 22, a nut 24 is threadedly connected on both sides of the bidirectional screw rod 23, a pull rod 25 is rotatably connected on one side of the nut 24, a detection plate 26 is rotatably connected between the two pull rods 25, two hollow tubes 27 are fixedly connected to the bottom of the detection plate 26, a pressing plate 28 is slidably connected on the two hollow tubes 27, a ball screw 29 is rotatably connected in the hollow tube 27, a ball nut 30 is arranged in the hollow tube 27, the ball nut 30 is fixedly connected with the pressing plate 28, a rotary encoder 31 is arranged in the detection plate 26, the detection end of the rotary encoder 31 is connected with the ball screw 29, the rotary encoder 31 contains a grating disc and a photoelectric interrupter, a plurality of grooves are arranged in the carrier frame 15, and an adsorption point 32 is arranged at the intersection of two mutually perpendicular grooves, the adsorption points 32 are divided into two parts corresponding to the positions of the two detection ports 22 of a single carrier frame 15, a vacuum pump is arranged in the exposure table frame 5, the vacuum pump is communicated with each part of the adsorption points 32, and an electromagnetic valve is arranged at the communication position, a control port is arranged in the machine table 1, a control module and a detection module are arranged in the control port, the control module is signal connected with the detection module, the control module is signal connected with the electromagnetic valve, and the detection module is signal connected with the rotary encoder 31.

[0021] The purpose of arranging the substrate warping detection mechanism is that the DBC substrate is bonded by ceramic and copper layer at high temperature, and the substrate is prone to slight warping and deformation after etching, heat treatment and roughening in the production and processing process. In other words, the surface of part of the substrate in the exposure process is not a completely flat surface. The mainstream exposure machine uses a through-the-lens (TTL) or off-axis visual alignment system. The height of the mark points at different positions of the substrate in the slight warping state is different, which causes the camera to fail to capture all the marks, and thus cannot be accurately focused, thereby seriously affecting the alignment accuracy. In view of this problem, the existing equipment processes through multi-point focusing and 3D curved surface compensation technology, but the cost is high, and the compensation effect is very limited.

[0022] Specifically, the working principle of the substrate warping detection mechanism is as follows: after the worker finishes loading the board, the sealing cover plate 13 is covered, and before exposure, the bidirectional screw rod 23 in the detection port 22 on both sides of the carrier plate frame 15 is rotated, the screw nut 24 on both sides of the bidirectional screw rod 23 is close to each other, supported by the support arm 16, so that the detection plate 26 protrudes to one side of the substrate, and the pressing plate 28 freely falls under the action of its own gravity, the surface flatness of the warped substrate affects the position of the pressing plate 28, so that the pressing plate 28 cannot be in the lowest position, the position of the pressing plate 28 is also the position of the ball screw nut 30, the downward movement of the ball screw nut 30 drives the ball screw rod 29 to rotate a certain number of turns, the rotary encoder 31 is connected with the ball screw rod 29, and the grating disc in the rotary encoder 31 cooperates with the photoelectric interrupter to realize accurate counting of the number of turns of the ball screw rod 29, so that the downward movement distance of the pressing plate 28 can be converted into the number of turns of the ball screw rod 29, and then converted into an electric pulse signal and sent to the control port, the control port calculates the displacement / angle according to the two-way square wave pulse signals with a phase difference of 90° output by the rotary encoder 31, so as to judge the warping degree and send a command to control the opening and closing of the electromagnetic valve to perform negative pressure air suction on the specified side of the adsorption point 32, so as to adsorb the substrate and ensure its flatness.

[0023] It should be noted that the screw rod and the screw nut generally have self-locking property, the ball screw rod 29 and the ball screw nut 30 used in the present application are non-self-locking large-lead multi-head ball screw pairs, and the rotary encoder 31 used in the present application is an incremental rotary encoder with a resolution of 400CPR and a shaft sleeve type, which can be directly sleeved on the shaft body of the ball screw rod 29 without the need of using a shaft coupling.

[0024] The preferred embodiments of the present application have been described in detail above, but the present application is not limited to the above-described embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the purpose of the present application.

Claims

1. DBC ceramic copper clad substrate special exposure machine, characterized by: include: A machine (1), wherein a heat exchange and heat dissipation port (2) is provided on the top of the machine (1), a lighting board (3) is fixedly connected to one side of the machine (1), an LED light board (4) is provided at the bottom of the lighting board (3), a table frame exchange port is provided on the side of the machine (1) corresponding to the lighting board (3), a pair of exposure tables (5) are provided in the table frame exchange port, a storage box (6) and an extension work plate (7) are provided on both sides of the table frame exchange port, an interactive port (8) and an adjustment bracket (9) are provided on the table where the table frame exchange port is located, an emergency stop switch (10) and a table frame forward switch (11) are provided on the interactive port (8), and a table control PC terminal (12) is provided on the adjustment bracket (9); A sealing cover plate (13) is hingedly connected to one side of the exposure frame (5); a jig plate is provided on the exposure frame (5); a special jig plate (14) is installed on the jig plate; and six plate carrier frames (15) are provided in two rows and three columns on the special jig plate (14); Both sides of the carrier frame (15) are provided with a substrate warpage detection mechanism, and the substrate warpage detection mechanism includes a detection port (22) provided on one side of the carrier frame (15), a bidirectional lead screw (23) is rotatably connected in the detection port (22), both sides of the bidirectional lead screw (23) are threadedly connected to a nut (24), one side of the nut (24) is rotatably connected to a pull rod (25), and the two pull rods (25) are rotatably connected to a detection plate (26), and the bottom of the detection plate (26) is fixedly connected There are two hollow tubes (27), and the two hollow tubes (27) are slidably connected to a pressure plate (28). A ball screw (29) is rotatably connected in the hollow tube (27). A ball nut (30) is provided in the hollow tube (27), and the ball nut (30) is fixedly connected to the pressure plate (28). A rotary encoder (31) is provided in the detection plate (26), and the detection end of the rotary encoder (31) is connected to the ball screw (29). The rotary encoder (31) contains a grating disk and a photoelectric interrupter.

2. The DBC ceramic copper-clad substrate dedicated exposure machine according to claim 1, characterized in that: Both sides of the exposure frame (5) are rotatably connected to support arms (16) and electric telescopic rods (17), the output end of the electric telescopic rod (17) is rotatably connected to the support arms (16), and matching grooves are provided on both sides of the sealing cover plate (13), and the support arms (16) are slidably connected to the matching grooves at one end close to the electric telescopic rod (17). Both sides of the exposure frame (5) are fixedly connected to slides (18), and two slide rails (19) are fixedly connected to the inner walls of both sides of the frame exchange port. The exposure frame (5) is slidably connected to the slide rails (19) through the slides (18), and the sides of the two slides (18) close to each other are fixedly connected to racks (20), and the inner walls of both sides of the frame exchange port are rotatably connected to drive gears (21), and a servo motor is provided in the machine (1) for driving the drive gear (21), and the drive gear (21) and the two racks (20) on the corresponding side are meshed with each other.

3. The DBC ceramic copper-clad substrate dedicated exposure machine according to claim 2, characterized in that: The carrier frame (15) is provided with a plurality of grooves, and an adsorption point (32) is provided at the intersection of two mutually perpendicular grooves. A single carrier frame (15) corresponds to the positions of the detection ports (22) on both sides, and the adsorption point (32) is divided into two parts. A vacuum pump is provided in the exposure table frame (5), and the vacuum pump is connected to each part of the adsorption point (32), and a solenoid valve is provided at the connection position.

4. The DBC ceramic copper-clad substrate dedicated exposure machine according to claim 3, characterized in that: The machine (1) is provided with a control port, wherein a control module and a detection module are provided in the control port, wherein the control module is connected to the detection module by signal, wherein the control module is connected to the electromagnetic valve by signal, and wherein the detection module is connected to the rotary encoder (31) by signal.

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