Feeding die bonder with four vibrating discs and four hopper bins

Abstract

The invention relates to the technical field of semiconductor packaging equipment, and discloses a four-vibration-disc and four-funnel stock bin feeding die bonder which comprises a machine body and four vibration discs, four XY-axis manual moving tables are arranged on the table top of the machine body, a bearing table is fixedly connected to a moving plate of each XY-axis manual moving table, and a feeding mechanism is arranged on the bearing table. The four vibration discs are installed at the tops of the four bearing tables respectively, every two adjacent vibration discs are in axial symmetry, feeding rails are arranged at the tops of the bearing tables, and the feeding ends of the feeding rails are connected with the discharging ends of the vibration discs; the top of the bearing table is provided with a detection assembly and a material supplementing assembly. According to the invention, parallel feeding of four vibration discs is combined with visual screening, the production efficiency and productivity are improved, the design of bulk material direct connection die bonding is adopted, the technological process is simplified, the cost is reduced, the vibration discs are rapidly replaced, the universality of equipment is enhanced, a front-back bidirectional plate feeding mode is adopted, and the flexibility of production line layout and the comprehensive utilization rate of the equipment are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging equipment, and particularly to a four-vibration-plate and four-hopper-warehouse feeding die bonder. BACKGROUND

[0002] Die bonder is a key equipment in the process of semiconductor back-end packaging and LED manufacturing, and its core task is to accurately pick up and mount tiny electronic components, such as LED dies, from a feeding system to a designated substrate (e.g., PCB board or bracket). As LED devices develop towards smaller size and higher density, the market puts forward increasingly stringent requirements on the production capacity and cost efficiency of the die bonding process.

[0003] The current die bonding feeding technology in the industry generally faces the dilemma of being difficult to balance efficiency and cost. One common way is to use a vibration plate for direct feeding. After the bulk material is sorted by the vibration plate, a CCD image system determines whether the polarity direction is correct. However, this method has inherent defects, as the theoretical probability of the material direction being correct is only 50%, resulting in nearly half of the material being rejected due to incorrect direction and unable to participate in subsequent processes, which severely restricts production efficiency and makes it difficult to meet the needs of large-scale production.

[0004] To solve the problem of directionality, another mainstream technology uses a tape-fed feeding method. This scheme uses a pre-positioned light sorting device to pre-sort bulk materials and load them into a specially designed tape in a uniform direction, and the die bonder then takes each die from the tape. Although this method ensures the consistency of the incoming material direction, it makes the production process more lengthy and complex, introducing additional light sorting, sorting, and tape loading processes. This not only increases equipment investment and workshop floor space, but also introduces continuous material turnover costs for the tape as a consumable, making the overall cost of the die bonding process high. Therefore, the existing technology cannot meet the urgent needs of modern LED industry for efficient, low-cost, and direct-connected production mode in terms of process simplification, production efficiency, and cost control. SUMMARY

[0005] The purpose of the present application is to provide a four-vibration-plate and four-hopper-warehouse feeding die bonder, which solves the problems caused by low efficiency of single-vibration-plate feeding and the complicated and high-cost tape-fed feeding process.

[0006] In order to achieve the above object, the present application is realized by the following technical scheme: four-vibration disc and four-hopper material bin feeding die bonding machine, including machine body and four vibration discs, the tabletop of the machine body is provided with four XY-axis manual moving tables, the moving plate of the XY-axis manual moving table is fixedly connected with a bearing table, four vibration discs are respectively installed on the top of four bearing tables, every adjacent two vibration discs are axisymmetric, the top of the bearing table is provided with a feeding track, the feeding end of the feeding track is connected with the discharging end of the vibration disc; the top of the bearing table is respectively provided with a detection assembly and a replenishment assembly, the detection assembly is used for detecting whether the posture of the element fed by the vibration disc meets the requirement, the replenishment assembly is used for replenishing when there is no element in the vibration disc; the tabletop of the machine body is provided with two groups of substrate moving assemblies, the substrate moving assembly is used for moving the PCB substrate to the required position; the tabletop of the machine body is fixedly connected with a workbench, the top of the workbench is installed with a plurality of die picking lens barrels and a plurality of die bonding welding heads, the die picking lens barrel is aligned with the die starting point of the feeding track, used for picking the element with correct posture, moving above the PCB substrate, the die bonding welding head is used for executing the downward pressing action, fixing the element on the preset pad of the PCB substrate; the top of the bearing table is fixedly connected with a positioning plate one and a positioning plate two, the middle part of the positioning plate two is installed with a quick release assembly, used for replacing the vibration disc with different internal tracks.

[0007] Preferably, the detection assembly comprises a bracket one, the bracket one is fixedly connected on the top of the bearing table, the mounting end of the bracket one is provided with a CCD vision camera, the lens of the CCD vision camera is aligned with the feeding track.

[0008] Preferably, the replenishment assembly comprises a bracket two, the bracket two is fixedly connected on the top of the bearing table, the side surface of the bracket two is provided with a bracket three, the top of the bracket two and the bracket three is respectively installed with a replenishment track and a hopper.

[0009] Preferably, the top of the feeding track is provided with an element positioning groove, the inner part of the feeding track is respectively provided with an air suction hole one, an air suction hole two and an air blowing hole, the element positioning groove is communicated with the air suction hole one, the air suction hole two and the air blowing hole.

[0010] Preferably, the substrate moving assembly comprises a substrate moving table, two substrate moving tables are axisymmetric, the substrate moving table is installed on the tabletop of the machine body, the moving end of the substrate moving table is fixedly connected with a work combination table.

[0011] Preferably, the quick release assembly comprises a sliding rod, one end of the sliding rod is fixedly connected with a clamping block, the other end of the sliding rod is rotatably connected with a handle, the side of the positioning plate II close to the handle is fixedly connected with a baffle, and the sliding rod is slidably connected in the middle of the baffle.

[0012] Preferably, the side of the vibration disc bottom plate is provided with a clamping groove, and the clamping block and the clamping groove are clamped with each other.

[0013] Preferably, the outer periphery of the sliding rod is sleeved with a spring, and the spring is arranged between the clamping block and the baffle.

[0014] Preferably, the inside of the handle is provided with a limiting groove, and the sliding rod is rotatably connected in the middle of the limiting groove.

[0015] Preferably, the other side of the vibration disc bottom plate is fixedly connected with a sliding plate, the side of the positioning plate I is provided with a sliding groove, and the sliding plate is slidably connected in the middle of the sliding groove.

[0016] In summary, the present application has the following at least one beneficial technical effect: 1. The present application realizes extremely high production efficiency and capacity by four vibration discs simultaneously feeding and combining visual screening. The device utilizes four vibration discs and corresponding CCD vision cameras to work cooperatively to arrange the bulk material in order and simultaneously judge the posture in real time and remove defective products. The parallel and instant screening feeding mode ensures that one or more energy sources continuously provide qualified materials, effectively makes up for the efficiency loss caused by a single vibration disc, thereby forms a high-throughput material supply flow, and greatly improves the overall production capacity compared with the traditional scheme.

[0017] 2. The present application simplifies the production process and reduces the comprehensive cost through integrated design. The device realizes one-stop operation from bulk material to PCB substrate mounting, seamlessly integrates material sorting, screening, picking and mounting and other processes in a single machine, and eliminates the independent independent sorting and tape packaging and other cumbersome intermediate links in the traditional process. This direct production mode not only greatly shortens the product manufacturing cycle and reduces the equipment occupation and material turnover, but also avoids the dependence on tape consumables, thereby reducing the production cost.

[0018] 3. The application gives the equipment strong versatility and convenient maintenance through the innovative quick replacement structure. The positioning and locking mechanism composed of handle, slide rod and clamping block and other components can realize quick disassembly and replacement. When different sizes or specifications of materials need to be processed, the operator can quickly replace the vibration disc that is suitable for the internal track of the new material without complex tools, greatly enhancing the adaptability of the equipment to different products, shortening the downtime of type changing and debugging, and improving the utilization rate and market competitiveness of the equipment.

[0019] 4. The application greatly improves the flexibility and comprehensive utilization rate of the production line layout of the equipment by setting the front and rear bidirectional substrate moving assembly. The equipment allows the PCB substrate to enter the working area from the front or rear, which can more flexibly adapt to different workshop layouts and process flow. This bidirectional compatibility breaks the layout restrictions of traditional one-way board feeding equipment, making the production line planning more efficient and compact, significantly improving the overall utilization rate of the equipment and the smoothness of the production line. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a three-dimensional schematic view of the application; Figure 2 is a structural schematic view of the body of the application; Figure 3 is a structural schematic view of the workbench of the application; Figure 4 is a structural schematic view of the bearing table of the application; Figure 5 is a structural schematic view of the XY axis manual moving table of the application; Figure 6 is a structural schematic view of the CCD vision camera of the application; Figure 7 is a structural schematic view of the hopper of the application; Figure 8 is a structural schematic view of the vibration disc of the application; Figure 9 is a structural schematic view of the feeding track of the application; Figure 10 is a structural schematic view of the slide rod of the application.

[0021] Wherein, 1, body; 2, workbench; 3, pick-up lens barrel; 4, die bonding welding head; 5, XY axis manual moving table; 6, bearing table; 7, vibrating disc; 8, feeding track; 9, component positioning groove; 10, air suction hole one; 11, air suction hole two; 12, air blowing hole; 13, support one; 14, CCD vision camera; 15, support two; 16, support three; 17, replenishment track; 18, hopper; 19, positioning plate one; 20, positioning plate two; 21, sliding rod; 22, clamping block; 23, handle; 24, baffle; 25, clamping groove; 26, spring; 27, limiting groove; 28, sliding groove; 29, sliding plate; 30, base plate moving table; 31, workbench combination table. DETAILED DESCRIPTION

[0022] The following will be described in detail in combination with the accompanying drawings Figure 1 The accompanying drawings Figure 10 The application will be further described in detail.

[0023] The application provides a four-vibrating-disc-and-four-hopper-warehousing die bonding machine, which comprises a body 1 and four vibrating discs 7, the tabletop of the body 1 is provided with four XY axis manual moving tables 5, the moving plate of each XY axis manual moving table 5 is fixedly connected with a bearing table 6, and the four vibrating discs 7 are respectively installed on the top of the four bearing tables 6; the four vibrating discs 7 can effectively improve the efficiency of material supply, and each adjacent two vibrating discs 7 are axisymmetric; the top of the bearing table 6 is provided with a feeding track 8, the feeding end of the feeding track 8 is connected with the discharging end of the vibrating disc 7; the top of the bearing table 6 is respectively provided with a detection assembly and a replenishment assembly, the detection assembly is used for detecting whether the posture of the component conveyed on the vibrating disc 7 meets the requirement, and the replenishment assembly is used for replenishing when there is no component in the vibrating disc 7; the tabletop of the body 1 is provided with two groups of base plate moving assemblies, the base plate moving assemblies are used for moving the PCB base plate to the required position; the tabletop of the body 1 is fixedly connected with a workbench 2, the top of the workbench 2 is installed with a plurality of pick-up lens barrels 3 and a plurality of die bonding welding heads 4, the pick-up lens barrel 3 is aligned with the die starting point of the feeding track 8, is used for picking up the component with correct posture, and is moved above the PCB base plate, and the die bonding welding head 4 is used for executing a pressing and mounting action to fix the component on the preset pad of the PCB base plate. The top of the bearing table 6 is fixedly connected with a positioning plate one 19 and a positioning plate two 20, the middle part of the positioning plate two 20 is installed with a quick release assembly, which is used for replacing the vibrating disc 7 with different internal tracks.

[0024] As Figure 1 , Figure 2 , Figure 4 and Figure 6As shown in the preferred embodiment of the present application, the detection assembly includes a bracket I 13 fixedly connected to the top of the carrier table 6, and a CCD vision camera 14 is arranged at the mounting end of the bracket I 13, with the lens of the CCD vision camera 14 aiming at the feeding track 8. The bracket I 13 can stably support the CCD vision camera 14, which can take real-time photos and analyze the materials passing by to determine whether the posture meets the requirements of die bonding. If the requirements are met, the materials continue to move to the die bonding point of the feeding track 8, and if the requirements are not met, the materials are blown away from the feeding track 8.

[0025] As shown in the preferred embodiment of the present application, Figure 1 , Figure 2 , Figure 4 and Figure 7 As shown in the preferred embodiment of the present application, the feeding assembly includes a bracket II 15 fixedly connected to the top of the carrier table 6, and a bracket III 16 is arranged on the side of the bracket II 15. A feeding track 17 and a hopper 18 are respectively arranged at the top of the bracket II 15 and the bracket III 16. The bracket II 15 and the bracket III 16 stably support the feeding track 17 and the hopper 18. The LED materials in the hopper 18 fall into the vibration disc 7 through the feeding track 17.

[0026] As shown in the preferred embodiment of the present application, Figure 3 , Figure 4 , Figure 8 and Figure 9 As shown in the preferred embodiment of the present application, the top of the feeding track 8 is provided with an element positioning groove 9, and the inside of the feeding track 8 is respectively provided with an air suction hole I 10, an air suction hole II 11, and a gas blowing hole 12. The element positioning groove 9 communicates with the air suction hole I 10, the air suction hole II 11, and the gas blowing hole 12. The air suction hole I 10 and the gas blowing hole 12 are opposite in direction, which can more stably adsorb the materials.

[0027] As shown in the preferred embodiment of the present application, Figure 1 and Figure 2 As shown in the preferred embodiment of the present application, the substrate moving assembly includes two substrate moving tables 30 which are axisymmetrically arranged. The substrate moving tables 30 are installed on the table top of the machine body 1, and a working combination table 31 is fixedly connected to the moving end of the substrate moving tables 30. The two substrate moving tables 30 are symmetrically arranged at the front and rear parts of the device, allowing the PCB substrate to enter the working area from the front or rear parts in two directions, thereby enhancing the compatibility and utilization rate of the device.

[0028] As shown in the preferred embodiment of the present application, Figure 5 , Figure 8 and Figure 10As shown in the preferred embodiment of the present application, the quick release assembly comprises a sliding rod 21, which is slidingly connected to the middle of the positioning plate 20, one end of the sliding rod 21 is fixedly connected with a clamping block 22, and the other end of the sliding rod 21 is rotatably connected with a handle 23, when the handle 23 is positioned vertically to the positioning plate 20, the sliding rod 21 is away from the positioning plate 20, and when the handle 23 is positioned horizontally to the positioning plate 20, the sliding rod 21 is close to the positioning plate 20, the positioning plate 20 is fixedly connected with a baffle 24 on the side close to the handle 23, and the sliding rod 21 is slidingly connected to the middle of the baffle 24, and the baffle 24 is used to protect the structure inside the positioning plate 20.

[0029] As shown in the preferred embodiment of the present application, Figure 5 , Figure 8 and Figure 10 , the bottom plate of the vibration disc 7 is provided with a clamping groove 25 on one side, the clamping block 22 is clamped with the clamping groove 25, the clamping block 22 is clamped into the clamping groove 25, and the position of the vibration disc 7 is fixed.

[0030] As shown in the preferred embodiment of the present application, Figure 5 , Figure 8 and Figure 10 , the sliding rod 21 is provided with a spring 26 on the outer periphery, the spring 26 is arranged between the clamping block 22 and the baffle 24, the clamping block 22 is subjected to the pressure of moving inwardly by the pressure generated by the cooperation of the spring 26 and the baffle 24.

[0031] As shown in the preferred embodiment of the present application, Figure 5 , Figure 8 and Figure 10 , the handle 23 is provided with a limiting groove 27 in the inside, and the sliding rod 21 is rotatably connected to the middle of the limiting groove 27, and the position of the rotation of the handle 23 is limited by arranging the limiting groove 27.

[0032] As shown in the preferred embodiment of the present application, Figure 5 , Figure 7 and Figure 9 , the bottom plate of the vibration disc 7 is fixedly connected with a sliding plate 29 on the other side, the side surface of the positioning plate 1 is provided with a sliding groove 28, the sliding plate 29 is slidingly connected to the middle of the sliding groove 28, the clamping block 22 is aligned with the clamping groove 25 by sliding the sliding plate 29 into the sliding groove 28, and the vibration disc 7 is conveniently installed.

[0033] Working principle: start the device, align the starting point of the feeding track 8 with the pick-up lens barrel 3 by manually moving the table 5 along the XY axis, prepare the material, the four hoppers 18 supply the bulk LED material to the vibration plate 7 below through the replenishment track 17, the vibration plate 7 arranges the disordered LED material into a single column along the feeding track 8 through high-frequency vibration, at the same time, the CCD vision camera 14 equipped with each vibration plate 7 takes high-speed photos and analyzes each passing material, judges in real time whether the posture meets the requirements of die bonding, and if it meets the requirements, it continues to advance to the starting point of the feeding track 8 to wait for the pick-up lens barrel 3 to pick up, and if it does not meet the requirements, it blows it away from the feeding track 8, through the simultaneous operation of the four vibration plates 7, even if a single vibration plate 7 has a theoretical rejection rate of 50%, it can form a high-throughput, uninterrupted, and qualified material supply, solving the problem of low efficiency of traditional single vibration plate 7.

[0034] At the same time of material preparation, the PCB substrate is placed on the front or rear work combination table 31, and the PCB substrate is conveyed to the working position by the substrate moving table 30, then the pick-up lens barrel 3 moves to the starting point of the feeding track 8 of a vibration plate 7 with qualified material, accurately picks up an LED material, and finally the die bonding head 4 accurately mounts the picked-up material on the pre-set pad position of the PCB substrate, eliminating the cumbersome intermediate links such as light splitting and tape mounting in the traditional process, greatly shortening the production process, and realizing the improvement of productivity and efficiency.

[0035] When it is necessary to replace the vibration plate 7 with different internal tracks, rotate the handle 23, vertically position the plate two 20, move the slide rod 21 with the clamping block 22 outward, disengage the clamping block 22 from the clamping groove 25 below the vibration plate 7, remove the currently used vibration plate 7 from the bearing table 6, place the vibration plate 7 to be replaced into the positioning plate one 19 and the positioning plate two 20, align the clamping block 22 with the clamping groove 25, rotate the handle 23 in the opposite direction, horizontally position the plate two 20, move the slide rod 21 inward, and under the cooperation of the pressure applied by the spring 26 to the clamping block 22, move the clamping block 22 inward and clamp into the clamping groove 25 to fix the position of the vibration plate 7, realize the quick replacement of the vibration plate 7 with different internal tracks, and make the device flexible to adapt to LED materials of different sizes and specifications, and enhance the versatility of the device.

[0036] Although embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A four-vibrating tray and four-funnel hopper feeding die bonder, comprising a machine body (1) and four vibrating trays (7), characterized in that, The table top of the machine body (1) is provided with four XY-axis manual moving tables (5), the moving plate of the XY-axis manual moving table (5) is fixedly connected with a bearing table (6), four vibrating discs (7) are respectively installed on the top of the four bearing tables (6), every adjacent two vibrating discs (7) are axisymmetric, the top of the bearing table (6) is provided with a feeding track (8), the feeding end of the feeding track (8) is connected with the discharging end of the vibrating disc (7); the top of the bearing table (6) is respectively provided with a detection assembly and a feeding assembly, the detection assembly is used for detecting whether the posture of the element conveyed on the vibrating disc (7) meets the requirement, the feeding assembly is used for feeding when there is no element in the vibrating disc (7); the table top of the machine body (1) is provided with two groups of substrate moving assemblies, the substrate moving assembly is used for moving the PCB substrate to the required position; the table top of the machine body (1) is fixedly connected with a workbench (2), the top of the workbench (2) is installed with multiple crystal taking lens barrels (3) and multiple die bonding heads (4), the crystal taking lens barrel (3) is aligned with the crystal starting point of the feeding track (8), used for picking up the element with correct posture, moving above the PCB substrate, the die bonding head (4) is used for executing the pressing and mounting action, fixing the element on the preset pad of the PCB substrate. The top of the bearing table (6) is fixedly connected with a positioning plate one (19) and a positioning plate two (20), the middle part of the positioning plate two (20) is installed with a quick release assembly, used for replacing the vibrating disc (7) with different internal tracks.

2. The four-vibration disc and four-funnel hopper material bin feeding die bonding machine of claim 1, wherein, The detection assembly comprises a support one (13), the support one (13) is fixedly connected on the top of the bearing table (6), the mounting end of the support one (13) is provided with a CCD vision camera (14), the lens of the CCD vision camera (14) is aligned with the feeding track (8).

3. The four-vibration disc and four-funnel hopper material bin feeding die bonding machine of claim 1, wherein, The feeding assembly comprises a support two (15), the support two (15) is fixedly connected on the top of the bearing table (6), the side of the support two (15) is provided with a support three (16), the top of the support two (15) and the support three (16) is respectively installed with a feeding track (17) and a hopper (18).

4. The four-vibration disc and four-funnel hopper material bin feeding die bonding machine of claim 1, wherein, The top of the feeding track (8) is provided with an element positioning groove (9), the inside of the feeding track (8) is respectively provided with an air suction hole one (10), an air suction hole two (11) and a blowing hole (12), the element positioning groove (9) is communicated with the air suction hole one (10), the air suction hole two (11) and the blowing hole (12).

5. The four-vibration disc and four-funnel material bin feeding die bonding machine of claim 1, wherein, The substrate moving assembly comprises a substrate moving table (30), two substrate moving tables (30) are axisymmetric, the substrate moving table (30) is installed on the table top of the machine body (1), the moving end of the substrate moving table (30) is fixedly connected with a work combination table (31).

6. The four-vibration tray and four-funnel hopper material bin feeding die bonding machine of claim 1, wherein, Said quick release assembly includes a slide rod (21), the slide rod (21) is slidably connected in the middle of the positioning plate two (20), one end of the slide rod (21) is fixedly connected with a clamping block (22), the other end of the slide rod (21) is rotatably connected with a handle (23), the positioning plate two (20) is fixedly connected with a baffle (24) on the side close to the handle (23), the slide rod (21) is slidably connected in the middle of the baffle (24).

7. The four-vibration disc and four-funnel hopper material bin feeding die bonding machine of claim 6, wherein, The bottom plate of the vibrating disc (7) is provided with a clamping groove (25) on one side, and the clamping block (22) and the clamping groove (25) are clamped with each other.

8. The four-vibration disc and four-funnel hopper material bin feeding die bonding machine of claim 6, wherein, The outer periphery of the slide rod (21) is sleeved with a spring (26), and the spring (26) is arranged between the clamping block (22) and the baffle (24).

9. The four-vibration disc and four-funnel hopper material bin feeding die bonding machine of claim 6, wherein, The inside of the handle (23) is provided with a limiting groove (27), and the slide rod (21) is rotatably connected in the middle of the limiting groove (27).

10. The four-vibration tray and four-funnel hopper material bin feeding die bonding machine of claim 6, wherein, The other side of the bottom plate of the vibrating disc (7) is fixedly connected with a sliding plate (29), and the side surface of the positioning plate one (19) is provided with a sliding groove (28), and the sliding plate (29) is slidably connected in the middle of the sliding groove (28).

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