Integrated circuit board surface dust-free heat dissipation and cooling assembly

Abstract

The invention relates to the technical field of circuit board heat dissipation, and provides an integrated circuit board surface dust-free heat dissipation and cooling assembly which comprises a PCB and further comprises a heat collection cover, a plurality of heat dissipation fins and a plurality of heat dissipation fins, the heat collection cover is fixedly installed at the top of the PCB through screws, and the heat dissipation fins are installed at the top of the heat collection cover at equal intervals; the beam cover is fixedly installed at the top of the heat collection cover through screws, and an exhaust filter plate is installed on the rear side of the beam cover; a plurality of inverted-T-shaped plates are installed on the top wall of the beam cover at equal intervals, a sliding transverse groove is formed between every two inverted-T-shaped plates, a wall attaching block is installed in each sliding transverse groove in a sliding mode, a spring pressing column slides at the bottom of each wall attaching block, a thin plate is fixedly installed at the bottom end of each spring pressing column, and a plurality of splayed plates are installed at the bottom of each thin plate at equal intervals. When the device is used, the airflow corridor structure is utilized to accurately cover a high-power-consumption device, dynamic matching of a heat source and a heat dissipation resource is achieved, and the problem that temperature rise of a local hot spot exceeds the standard due to the fact that uniform direct current air cooling cannot be matched with loads of a high-heat area is solved.

Description

Technical Field

[0001] This invention relates to the field of circuit board heat dissipation technology, and more specifically, to an integrated circuit board surface dust-free heat dissipation and cooling component. Background Technology

[0002] As electronic devices rapidly develop towards high performance and high integration, the power density of integrated circuit boards (such as server motherboards, communication equipment PCBs, and high-performance chip carrier boards) continues to rise. The heat generated during their operation increases significantly. If the heat dissipation efficiency is insufficient, the temperature of components may exceed the safety threshold, which may lead to a chain of risks such as performance degradation, signal distortion, or even hardware damage.

[0003] Currently, circuit board heat dissipation mainly adopts two solutions: air cooling and water cooling. In terms of air cooling, some circuit boards are encapsulated in a sealed protective enclosure to achieve environmental isolation and protection. Heat sinks are integrated on the outer wall of the enclosure to increase the heat conduction area. At the same time, an external independent heat dissipation box is configured to force convection heat exchange on the surface of the heat sink through direct current airflow, ultimately achieving the removal of heat from inside the enclosure.

[0004] Based on the above principle, due to the significant differences in power consumption of different heat-generating devices on the circuit board, their heat flux density distribution is uneven. When heat is transferred to the heat sink through the thermal interface material, a non-uniform temperature field will be formed on the surface of the heat sink. Under these circumstances, when the DC air force performs forced convection cooling on the heat sink, the uniform DC air force will make it impossible for the heat dissipation airflow to effectively match the heat load demand of the high heat flux density area, which will eventually cause the local hot spot temperature to rise excessively, resulting in system frequency reduction or even failure.

[0005] Therefore, this application proposes an integrated dust-free heat dissipation and cooling component for circuit board surfaces to solve the above problems. Summary of the Invention

[0006] Technical problem to be solved: In view of the problems existing in the prior art, the purpose of this invention is to provide an integrated circuit board surface dust-free heat dissipation and cooling component, which solves the problem that the heat flux density distribution is unbalanced due to the difference in power consumption of the devices, the temperature field non-uniformity of the heat sink is aggravated, the uniform DC air cooling cannot match the load of high heat area, and the risk of local hot spot overheating and system failure.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an integrated circuit board surface dust-free heat dissipation and cooling component, including a PCB board, and further including: a heat collection cover, which is fixedly installed on the top of the PCB board with screws, and multiple heat sinks are equidistantly installed on the top of the heat collection cover; a beam shroud, which is fixedly installed on the top of the heat collection cover with screws, and an exhaust filter plate is installed on the rear side of the beam shroud; multiple inverted T-plates are equidistantly installed on the top wall of the beam shroud, and a sliding groove is provided between two inverted T-plates, and a wall-adhesive block is slidably installed in the sliding groove. A spring-loaded column slides along the bottom of the wall-mounted block. A thin plate is fixedly installed at the bottom of the spring-loaded column. Multiple figure-eight plates are equidistantly installed at the bottom of the thin plate, and cooling pads are installed on the curved inner walls of the figure-eight plates. A base plate is installed at the front end of the heat collection hood, and the base plate is divided into an air supply section and an air inlet section. The height of the base plate is the same as the height of the heat collection hood. A wind turbine is installed at the top of the air supply section, and a dust-free component is installed at the top of the air inlet section. A reversing component is also installed on both sides of the dust-free component. The dust-free component is triggered when it is supplied with air by the wind turbine.

[0008] In a new embodiment, the wind power component includes: a brushless fan, rotatably mounted at the top center of the air supply section; a fan shroud, screwed and fixedly mounted at the top of the air supply section, with a circular filter screen installed in the center of the fan shroud; and a single-port frame, mounted on the inner wall of the fan shroud, with multiple cooling fins equidistantly mounted on the inner ring wall of the single-port frame.

[0009] In a new embodiment, the cleanroom assembly includes: an airflow box, which is fixedly installed at the top of the air inlet section with screws; a central trough, which is opened in the middle of the airflow box; connecting rods are slidably mounted on the rear part of the left and right inner walls of the central trough, and multiple dust flow plates are equidistantly mounted on the two connecting rods, and the dust flow plates are rotatably installed in the central trough; electrostatic adsorption layers are installed on the left and right side surfaces of the dust flow plates, and the left and right side surfaces of the dust flow plates are both inclined.

[0010] In a new embodiment, the bottom wall of the central trough is provided with multiple dust collection channels at equal intervals, and the dust collection channels are located between the two dust flow plates; the dust collection channels are embedded in the top of the air inlet section, and each dust collection channel is equipped with a slanted slider; a dust collection box is provided at the bottom of the dust collection channel, and the dust collection box is fixedly installed at the bottom of the air inlet section with screws.

[0011] In a new embodiment, the reversing assembly further includes: two side slots, respectively located on the left and right sides of the airflow box, with the two side slots situated on the left and right sides of the central slot; a magnetic slider installed at the outward end of the connecting rod, and the magnetic slider also sliding within a groove on the top wall of the side slot; a return spring, one end of which is connected to the inward end of the magnetic slider, and the other end of which is connected to the inner wall of the side slot; and an electromagnet installed on the outer inner wall of the side slot, with the electromagnet and the magnetic slider aligned at the center.

[0012] In a new embodiment, temperature measuring tubes are installed on the inner walls of both sides of the heat collection cover, and the temperature measuring tubes are electrically connected to the power supply terminal of the electromagnet.

[0013] In a new embodiment, the figure-eight plates are all located between two adjacent heat sinks, and a soft layer is also provided at the bottom of the figure-eight plates.

[0014] In a new embodiment, a sealing strip is installed on the front of the top wall of the beam hood, and the sealing strip is bonded to the rear of the airflow box with adhesive.

[0015] In a new embodiment, a cleaning assembly is also included, comprising four fixed plates mounted in a rectangular shape on the inner wall of the hood; a sliding rod disposed between two opposing fixed plates; a slider sleeved on the outer wall of the sliding rod; a brush mounted between two sliders; a guide opening extending through the top surface of the hood; and a guide rod disposed within the guide opening, the guide rod being connected to one of the sliders.

[0016] In a new embodiment, it also includes a baffle net disposed below the brush; two limiting plates disposed at both ends of the bottom surface of the baffle net, the baffle net being movable on the limiting plates; a rectangular opening extending through one side of the outer wall of the hood; one end of the baffle net passing through the rectangular opening.

[0017] Beneficial effects: Compared with the prior art, the advantages of this invention are: 1. By combining the passive heat dissipation of the heat sink with the active cooling of the cooling pad, and the airflow corridor structure, i.e. the multi-bend airflow guided by the figure-eight plate, a heat dissipation system of heat conduction, convection and contact cooling is formed, which improves the overall heat dissipation efficiency. The airflow corridor structure can slide and adjust its position along the sliding groove to accurately cover high-power devices, realize the dynamic matching of heat source and heat dissipation resources, and solve the problem that uniform DC air cooling cannot match the load of high heat area, causing local hot spot temperature rise and system failure risk.

[0018] 2. By utilizing the sliding fit between the spring-loaded column and the wall-mounted block, the airflow corridor structure can adapt to changes in the distance between the heat collector hood and the beam hood. On the other hand, the airflow corridor structure maintains stable contact with the surface of the heat collector hood through the elastic pressure of the spring-loaded column, thus ensuring its stability in the placement position.

[0019] 3. By utilizing the inclined design of the dust flow plate combined with the electrostatic adsorption layer, the dust removal and dust reduction functions are achieved through gravity falling and electrostatic capture. The inclined slider of the dust falling channel then guides the falling dust into the dust collection box, extending the maintenance cycle. The dust collection box also supports quick disassembly, avoiding downtime losses.

[0020] 4. By using temperature measuring tubes on the inner walls of both sides of the beam shroud to monitor the temperature in real time, the electromagnet is triggered to drive the magnetic slider, deflecting the angle of the dust flow plate and forcing the airflow to deflect to the left and right sides, thus scouring the concentrated high-temperature areas on the left and right sides. The electromagnet is triggered only in the high-heat area, making the cooling of the high-temperature areas on the left and right sides of the interior more targeted, and avoiding continuous full-load operation, resulting in a significant reduction in overall energy consumption.

[0021] 5. By setting up a wind power component, the airflow provided by the brushless fan passes through the cooling fins distributed on the inner ring wall of the single-port frame to pre-cool the intake airflow, reducing the heat load of the subsequent heat sink and cooling pads. In addition, during the pre-cooling process, water vapor in the incoming airflow can be condensed, reducing the relative humidity of the airflow entering the area between the heat collector and the beam shroud, thus avoiding condensation and short circuits of components in high humidity environments.

[0022] 6. By moving the guide rod horizontally along the guide opening, the movement of the guide rod drives the slider, brush and another slider on it to move horizontally along the guide rod. The movement of the brush can clean the dust attached to the circular filter screen on the fan cover, improving the ventilation and heat dissipation efficiency of the circular filter screen. The dust swept off by the brush is collected by the baffle, which can be removed through the rectangular opening for easy subsequent cleaning or replacement. The limiting plate ensures that the baffle screen is stable in position during the cleaning process, avoiding displacement that affects the cleaning effect. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0024] Figure 2 This is a three-dimensional structural diagram of the present invention from another perspective.

[0025] Figure 3 This is a schematic diagram of the disassembled structure of the wind shield of the present invention.

[0026] Figure 4 This is a schematic diagram of the single-port frame structure of the present invention.

[0027] Figure 5 This is a schematic diagram of the airflow box location structure of the present invention.

[0028] Figure 6 This is a schematic diagram of the disassembled structure of the airflow box and substrate of the present invention.

[0029] Figure 7 This is a schematic diagram of the internal structure of the airflow box of the present invention.

[0030] Figure 8 This is a schematic diagram of the dust flow plate structure of the present invention.

[0031] Figure 9 This is a schematic diagram of the tilted state of the dust flow plate of the present invention.

[0032] Figure 10 This is a schematic diagram of the internal structure of the dust collection duct of the present invention.

[0033] Figure 11 This is a schematic diagram of the position and structure of the temperature measuring tube of the present invention.

[0034] Figure 12This is a schematic diagram showing the disassembled structure of the PCB board, heat collector cover, and beam cover of the present invention.

[0035] Figure 13 This is a schematic diagram of the beam hood structure of the present invention.

[0036] Figure 14 This is a schematic diagram of the wall-mounted block structure of the present invention.

[0037] Figure 15 This is a schematic diagram of the figure-eight plate structure of the present invention.

[0038] Figure 16 This is a schematic diagram of the airflow state of the figure-eight plate of the present invention;

[0039] Figure 17 This is a schematic diagram of the cleaning component of the present invention;

[0040] Figure 18 This is a schematic diagram of the guide port structure of the present invention.

[0041] The attached diagram is labeled as follows: 1. PCB board; 2. Heat collector cover; 3. Heat sink; 4. shroud; 5. Exhaust filter plate; 6. Inverted T-plate; 7. Sliding groove; 8. Wall-mounted block; 9. Spring-loaded column; 10. Thin plate; 11. Herringbone plate; 111. Soft layer; 12. Cooling pad; 13. Substrate; 131. Air supply section; 132. Air inlet section; 14. Wind power assembly; 1401. Brushless fan; 1402. Fan cover; 1403. Single-port frame; 1404. Cooling element; 15. Cleanroom assembly; 1501. Airflow box; 15 02. Middle trough; 1503. Connecting rod; 1504. Dust flow plate; 1505. Electrostatic adsorption layer; 1506. Dust collection chute; 1507. Inclined slider; 1508. Dust collection box; 16. Turning assembly; 1601. Side trough; 1602. Magnetic slider; 1603. Return spring; 1604. Electromagnet; 17. Temperature measuring tube; 18. Fixing plate; 181. Slider; 182. Sliding rod; 183. Brush; 184. Limiting plate; 185. Baffle; 186. Rectangular opening; 187. Guide rod; 188. Guide port. Detailed Implementation

[0042] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0043] This application provides an integrated circuit board surface dust-free heat dissipation and cooling component, which solves the problems of uneven heat flux density distribution caused by differences in device power consumption, aggravated non-uniformity of the heat sink temperature field, and the inability of uniform DC air cooling to match the load of high-heat areas, leading to excessive local hot spot temperature rise and system failure risk. In use, it achieves precise coverage of high-power devices by the cooling structure and realizes dynamic matching between heat source and heat dissipation resources.

[0044] The technical solutions in this application are intended to solve the above-mentioned technical problems, and the overall approach is as follows.

[0045] Example 1

[0046] Please see Figures 1-16 An integrated dust-free heat dissipation and cooling component for a circuit board surface includes a PCB board 1, and further includes: a heat collection cover 2, which is screwed and fixedly installed on the top of the PCB board 1, and multiple heat sinks 3 are equidistantly installed on the top of the heat collection cover 2; a beam shroud 4, which is screwed and fixedly installed on the top of the heat collection cover 2, and an exhaust filter plate 5 is installed on the rear side of the beam shroud 4; multiple inverted T-plates 6 are equidistantly installed on the top wall of the beam shroud 4, a sliding groove 7 is provided between two inverted T-plates 6, a wall-adhering block 8 is slidably installed in the sliding groove 7, and a spring pressure column 9 is slidably installed at the bottom of the wall-adhering block 8, and the bottom end of the spring pressure column 9 is fixed. A thin plate 10 is fixedly installed, and multiple figure-eight plates 11 are equidistantly installed on the bottom of the thin plate 10. Cooling patches 12 are installed on the curved inner wall of the figure-eight plates 11. A base plate 13 is installed at the front end of the heat collection cover 2. The base plate 13 is divided into an air supply section 131 and an air inlet section 132. The height of the base plate 13 is the same as the height of the heat collection cover 2. A wind power component 14 is installed on the top of the air supply section 131, and a dust-free component 15 is installed on the top of the air inlet section 132. A reversing component 16 is also installed on both sides of the dust-free component 15. The dust-free component 15 is triggered after being supplied with air by the wind power component 14.

[0047] The heat collection cover 2 is fixed to the surface of the PCB board 1 with screws to absorb the heat of the heat-generating area on the surface of the PCB board 1. The heat sinks 3 distributed at equal intervals on the top form the first barrier for passive heat dissipation. The cooling airflow is provided by the fan assembly 14. The airflow enters between the heat collection cover 2 and the beam cover 4 through the dust-free assembly 15 to cool the heat sinks 3. Finally, the airflow is discharged through the exhaust filter plate 5.

[0048] A dynamic adaptive heat dissipation system is constructed through the coordinated operation of the shroud 4, inverted T-plate 6, sliding groove 7, wall-mounted block 8, spring-loaded column 9, figure-eight plate 11, and cooling pad 12. Its core working principle is as follows: An inverted T-plate 6 is installed at the bottom of the shroud 4, and a sliding groove 7 is formed between adjacent inverted T-plates 6. An airflow corridor structure (composed of wall-mounted block 8, spring-loaded column 9, thin plate 10, figure-eight plate 11, and cooling pad 12) is slidably installed within each sliding groove 7. When the cooling airflow enters the gap of the heat sink 3 for heat dissipation, the airflow is guided by the curved inner wall of the figure-eight plate 11, forming... The multi-bend flow (at least two directional changes) enhances the point-to-point heat dissipation capability of high-heat areas by extending the airflow contact time and expanding the heat dissipation surface area. At the same time, the airflow corridor structure can slide and adjust along the sliding groove 7, so that it can be positioned and installed according to the distribution of high-power devices (such as CPU and GPU) on the PCB board 1 (i.e., feedback to the corresponding areas of the heat collection cover 2 and heat sink 3). This enables spatial matching of heat dissipation resources according to different heat levels, solving the problem that uniform DC air cooling cannot match the load of high-heat areas, causing local hot spot temperature rise exceeding the standard and the risk of system failure.

[0049] The cooling patch 12 is embedded in the inner wall of the figure-eight plate 11. The figure-eight plate 11 (made of thermally conductive material) is located between two adjacent heat sinks 3, providing contact-type heat conduction and cooling to the high-temperature area of ​​the gap. This, combined with forced convection cooling, forms an airflow cooling effect, achieving dual-mode cooling and improving overall heat dissipation efficiency. The sliding engagement between the spring-loaded column 9 and the wall-mounted block 8 allows the airflow corridor structure to adapt to changes in the distance between the heat collector hood 2 and the beam hood 4. Furthermore, the elastic pressure of the spring-loaded column 9 maintains stable contact with the surface of the heat collector hood 2, ensuring stable placement. It is important to note that the airflow corridor structure is a single component; multiple airflow corridor structures can be arranged according to the heat dissipation area, either in contact or spaced apart. The arrangement is adjustable based on specific heat dissipation requirements.

[0050] Further, please refer to Figure 11 and Figure 15 The figure-eight plates 11 are located between two adjacent heat sinks 3, and a soft layer 111 is provided at the bottom of the figure-eight plates 11. Since the figure-eight plates 11 are located between adjacent heat sinks 3, the soft layer 111 (made of high thermal conductivity silicone material) at the bottom of the figure-eight plates 11 can prevent the airflow from escaping through the gap at the bottom of the figure-eight plates 11 after being guided by the figure-eight plates 11. This ensures that the airflow flows completely along the curved path of the figure-eight plates 11, improving the airflow guidance efficiency. In addition, the soft layer 111 covers the bottom edge of the figure-eight plates 11, preventing the metal figure-eight plates 11 from directly contacting the surface of the heat collection cover 2, preventing scratches on the surface of the heat collection cover 2 during installation or vibration, and providing external protection. However, the soft layer 111 does not affect the thermal conductivity of the figure-eight plates 11.

[0051] Furthermore, a sealing strip is installed on the front of the top wall of the beam hood 4, and the sealing strip is bonded to the rear of the airflow box 1501 with adhesive. The seamless connection between the beam hood 4 and the airflow box 1501 is achieved by using the sealing strip (made of silicone rubber or fluororubber) and adhesive bonding (not shown in the figure), eliminating the airflow escape channel at the interface between the two, ensuring that the cooling airflow flows completely along the designed path, reducing turbulence loss, improving airflow utilization, and avoiding air pressure fluctuations and pollution caused by the infiltration of external air and dust, thus maintaining a stable airflow environment inside the beam hood 4 and a clean and dust-free surface of the heat collection hood 2.

[0052] Example 2

[0053] Please see Figures 1-4 The wind power assembly 14 includes: a brushless fan 1401, which is rotatably mounted on the top center of the air supply section 131; a fan cover 1402, which is fixedly mounted on the top of the air supply section 131 with screws, and a circular filter screen is mounted on the center of the fan cover 1402; and a single-port frame 1403, which is mounted on the inner wall of the fan cover 1402, and multiple cooling plates 1404 are equidistantly mounted on the inner ring wall of the single-port frame 1403.

[0054] By setting up a brushless fan 1401, a fan cover 1402, a single-port frame 1403, and a cooling chip 1404, the brushless fan 1401 is suitable for long-term high-load operation scenarios (the circular filter can also effectively prevent dust from entering the air). The airflow provided by the brushless fan 1401 is pre-cooled by the cooling chips 1404 (such as semiconductor cooling chips) distributed on the inner ring wall of the single-port frame 1403, which reduces the heat load of the subsequent heat sink and cooling pad 12. In addition, during the pre-cooling process, water vapor in the incoming airflow can be condensed, which reduces the relative humidity of the airflow entering the area between the heat collector hood 2 and the beam hood 4, and avoids condensation and short circuit of components in high humidity environments.

[0055] Example 3

[0056] Please see Figures 5-10 The cleanroom assembly 15 includes: an airflow box 1501, which is fixedly installed on the top of the air inlet section 132 with screws; a middle trough 1502, which is opened in the middle of the airflow box 1501; connecting rods 1503 are slidably mounted on the rear part of the left and right inner walls of the middle trough 1502, and multiple dust flow plates 1504 are equidistantly mounted on the two connecting rods 1503, and the dust flow plates 1504 are rotatably mounted in the middle trough 1502; electrostatic adsorption layers 1505 are installed on the left and right side plates of the dust flow plates 1504, and the left and right side plates of the dust flow plates 1504 are both set at an angle.

[0057] By setting up an airflow box 1501, a central trough 1502, a connecting rod 1503, a dust flow plate 1504, and an electrostatic adsorption layer 1505, the electrostatic adsorption layer 1505, made of electret material, exerts a dual effect on micro-dust through an electrostatic field: on the one hand, it directly adsorbs charged particles using electric field force; on the other hand, it induces uncharged particles to polarize and then adsorb through dielectric electrophoresis. The 15-20° inward tilt angle on both sides of the dust flow plate 1504, combined with the principle that the electrostatic field disappears after power is cut off, allows the dust to naturally slide into the dust collection channel 1506 for collection by gravity.

[0058] Secondly, since gravity cannot completely remove all the dust attracted by electrostatic attraction, a miniature vibration motor can be installed on the dust flow plate 1504 to achieve small-amplitude vibration, thereby shaking off all the dust attracted by electrostatic attraction (not shown in the figure).

[0059] Further, please refer to Figure 5 , Figure 6 and Figure 10 The bottom wall of the middle trough 1502 is provided with multiple dust collection channels 1506 at equal intervals, and the dust collection channels 1506 are located between two dust flow plates 1504; the dust collection channels 1506 are embedded in the top of the air inlet section 132, and each dust collection channel 1506 is equipped with a slanted slider 1507; a dust collection box 1508 is provided at the bottom of the dust collection channel 1506, and the dust collection box 1508 is fixedly installed at the bottom of the air inlet section 132 with screws.

[0060] By setting up a dust collection channel 1506, a slanted slider 1507, and a dust collection box 1508, the dust collection channel 1506 is equidistantly distributed between the dust flow plates 1504. After the dust is initially captured by the electrostatic adsorption layer 1505, it is guided to flow again by the slanted slider 1507 of the dust collection channel 1506. Under the action of gravity, the micro-dust slides down the 30-45° inclined channel in an orderly manner. The slanted setting of the slanted slider 1507 ensures that there is only one horizontal long opening at the dust discharge inlet, avoiding the problem of one-time backflow and dust re-entrainment. The dust collection box 1508 is fixed to the bottom of the air inlet section 132 with screws, which not only ensures the sealing but also facilitates disassembly and maintenance, effectively avoiding the problem of cleaning dead corners caused by traditional welded structures. In addition, another slanted slider 1507 (not shown in the figure) mirrors the slanted slider 1507 and is located on the same vertical horizontal plane can be installed in the dust collection box 1508 to further avoid the problem of backflow.

[0061] It is important to note that the falling dust must be in the vertical position of the dust flow plate 1504, not in the inclined position; otherwise, the dust will not be able to enter the dust duct 1506.

[0062] Further, please refer to Figure 6 and Figure 7The reversing assembly 16 further includes: two side slots 1601, which are respectively opened on the left and right sides of the airflow box 1501, and the two side slots 1601 are respectively located on the left and right sides of the central slot 1502; a magnetic slider 1602, which is installed on the outward end of the connecting rod 1503, and the magnetic slider 1602 also slides in the groove on the top wall of the side slot 1601; a return spring 1603, one end of which is connected to the inward end of the magnetic slider 1602, and the other end of which is connected to the inner wall of the side slot 1601; and an electromagnet 1604, which is installed on the outer inner wall of the side slot 1601, and the electromagnet 1604 is aligned with the magnetic slider 1602.

[0063] Further, please refer to Figure 11 Temperature measuring tubes 17 are installed on the inner walls of both sides of the beam hood 4, and the temperature measuring tubes 17 are electrically connected to the power supply terminal of the electromagnet 1604.

[0064] The reversing component 16 achieves intelligent duct directional control based on temperature feedback through the coordinated action of the side groove 1601, magnetic slider 1602, return spring 1603, and electromagnet 1604. The specific process is as follows: Temperature measuring tubes 17 (such as PT100 thermal resistors) installed on the left and right sides of the beam cover 4 monitor the temperature on both sides in real time. When the temperature on one side exceeds the set threshold (such as 65℃), the signal is transmitted to the controller, triggering the corresponding electromagnet 1604 to be energized. The electromagnet 1604 is set as the N pole, and the magnetic slider 1602 is the S pole (permanent magnet). After being energized, opposite pole magnetic attraction is generated, and the magnetic slider 1602 moves outward along the top wall groove of the side groove 1601, overcoming the tension of the return spring 1603. The magnetic slider 1602 moves outward through the connecting rod 1 503 pulls the dust flow plate 1504, causing it to deflect 15 to 25 degrees around the axis of the central slot 1502, changing the tilt angle of the dust flow plate 1504 and guiding the airflow to concentrate on the high-temperature side. The tilted surface of the dust flow plate 1504 after deflection forms a flow guide barrier, forcing most of the cooling airflow to deflect to the high-temperature side and directly scouring the heat concentration point on the corresponding side of the beam shroud 4. The increased deflection angle of the dust flow plate 1504 simultaneously expands the windward area of ​​the electrostatic adsorption layer 1505, improving the dust interception efficiency in the airflow on the high-temperature side. Subsequently, when the temperature drops below the threshold, the controller cuts off the power to the electromagnet 1604, the reset spring 1603 pulls the magnetic slider 1602 back to its original position, the dust flow plate 1504 returns to its initial vertical state, and the system returns to the balanced air supply mode.

[0065] Example 4

[0066] Please see Figure 3 , Figure 17 , Figure 18It also includes a cleaning component, which includes four fixed plates 18, which are rectangularly fixedly installed on the inner wall of the hood 1402; a sliding rod 182, which is fixedly disposed between two opposite fixed plates 18; a slider 181, which is slidably sleeved on the outer wall of the sliding rod 182; a brush 183, which is installed between two sliders 181; a guide opening 188, which is opened through the top surface of the hood 1402; and a guide rod 187, which is disposed in the guide opening 188 and is fixedly connected to one of the sliders 181.

[0067] By moving the guide rod 187 horizontally along the guide port 188, the movement of the guide rod 187 causes the slider 181, brush 183 and another slider 181 on it to move horizontally along the slide rod 182. The movement of the brush 183 can clean the dust attached to the circular filter screen on the fan cover 1402, thereby improving the ventilation and heat dissipation efficiency of the circular filter screen.

[0068] It also includes a baffle 185, which is set below the brush 183, and two limiting plates 184, which are set at both ends of the bottom surface of the baffle 185 and are fixedly connected to the wind cover 1402. The baffle 185 is moved on the limiting plates 184. A rectangular opening (186) is opened through one side of the outer wall of the wind cover 1402, and one end of the baffle 185 passes through the rectangular opening 186.

[0069] The dust swept up by the brush 183 is collected by the baffle 185, which also provides a heat dissipation channel. The baffle 185 can be removed through the rectangular opening 186 for easy cleaning or replacement later. The limiting plate 184 ensures that the baffle 185 is stable in position during cleaning, preventing it from shifting and affecting the cleaning effect.

[0070] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated circuit board surface dust-free heat dissipation and cooling component, comprising a PCB board (1), characterized in that, Also includes: The heat collection cover (2) is fixedly installed on the top of the PCB board (1) with screws, and multiple heat sinks (3) are installed at equal intervals on the top of the heat collection cover (2). The beam hood (4) is fixedly installed on the top of the heat collection hood (2) with screws, and an exhaust filter plate (5) is installed on the rear side of the beam hood (4). The top wall of the beam hood (4) is equidistantly equipped with multiple inverted T-plates (6), and a sliding groove (7) is provided between two inverted T-plates (6). A wall-attaching block (8) is slidably installed in the sliding groove (7). A spring-loaded column (9) is slidably installed at the bottom of the wall-attaching block (8). A thin plate (10) is fixedly installed at the bottom end of the spring-loaded column (9). Multiple figure-eight plates (11) are equidistantly installed at the bottom of the thin plate (10), and a cooling patch (12) is installed on the curved inner wall of the figure-eight plate (11). The substrate (13) is installed at the front end of the heat collector cover (2), and the substrate (13) is divided into an air supply section (131) and an air inlet section (132). The height of the substrate (13) is the same as the height of the heat collector cover (2). The top of the air supply section (131) is equipped with a wind power component (14), the top of the air inlet section (132) is equipped with a dust-free component (15), and the sides of the dust-free component (15) are also equipped with a reversing component (16). The dust-free component (15) is triggered after being supplied with air by the wind power component (14).

2. The integrated circuit board surface dust-free heat dissipation and cooling component as described in claim 1, characterized in that, The wind turbine component (14) includes: A brushless fan (1401) is rotatably mounted at the top center of the air supply section (131); The fan cover (1402) is fixedly installed on the top of the air supply section (131) with screws, and a circular filter screen is installed in the middle of the fan cover (1402); A single-port frame (1403) is installed on the inner wall of the fan shroud (1402), and multiple cooling plates (1404) are installed at equal intervals on the inner ring wall of the single-port frame (1403).

3. The integrated circuit board surface dust-free heat dissipation and cooling component as described in claim 1, characterized in that, The cleanroom component (15) includes: The airflow box (1501) is fixedly installed on the top of the air inlet section (132) with screws; The middle channel (1502) is located in the middle of the airflow box (1501); The left and right inner walls of the middle tank (1502) are each equipped with a connecting rod (1503) that slides on the rear part. Multiple dust flow plates (1504) are installed at equal intervals on the two connecting rods (1503), and the dust flow plates (1504) are rotatably installed inside the middle tank (1502). The dust flow plate (1504) has an electrostatic adsorption layer (1505) installed on both the left and right sides, and both the left and right sides are sloped.

4. The integrated circuit board surface dust-free heat dissipation and cooling component as described in claim 3, characterized in that, The bottom wall of the middle trough (1502) is provided with a plurality of dust collection channels (1506) at equal intervals, and the dust collection channels (1506) are located between the two dust flow plates (1504); The dust collection duct (1506) is embedded in the top of the air inlet section (132), and each dust collection duct (1506) is equipped with a sliding block (1507). A dust collection box (1508) is installed at the bottom of the dust collection duct (1506), and the dust collection box (1508) is fixedly installed at the bottom of the air inlet section (132) with screws.

5. The integrated circuit board surface dust-free heat dissipation and cooling component as described in claim 3, characterized in that, The reversing component (16) further includes: There are two side channels (1601), which are respectively opened on the left and right sides of the airflow box (1501). The two side channels (1601) are respectively located on the left and right sides of the central channel (1502). The magnetic slider (1602) is installed at the outward end of the connecting rod (1503), and the magnetic slider (1602) also slides in the groove on the top wall of the side groove (1601); The return spring (1603) has one end connected to the inward end of the magnetic slider (1602) and the other end connected to the inner wall of the side groove (1601). An electromagnet (1604) is installed on the inner wall of the outer side groove (1601), and the electromagnet (1604) and the magnetic slider (1602) are aligned with each other.

6. The integrated circuit board surface dust-free heat dissipation and cooling component as described in claim 1, characterized in that, Temperature measuring tubes (17) are installed on the inner walls of both sides of the heat collection cover (2), and the temperature measuring tubes (17) are electrically connected to the power supply terminal of the electromagnet (1604).

7. The integrated circuit board surface dust-free heat dissipation and cooling component as described in claim 1, characterized in that, The figure-eight plates (11) are all located between two adjacent heat sinks (3), and a soft layer (111) is also provided at the bottom of the figure-eight plates (11).

8. The integrated circuit board surface dust-free heat dissipation and cooling component as described in claim 1, characterized in that, A sealing strip is installed on the front of the top wall of the beam hood (4), and the sealing strip is bonded to the rear of the airflow box (1501) with adhesive.

9. The integrated circuit board surface dust-free heat dissipation and cooling component as described in claim 1, characterized in that, It also includes a cleaning assembly comprising four fixed plates (18) mounted in a rectangular shape on the inner wall of the shroud (1402); A sliding rod (182) is set between two opposing fixed plates (18); The slider (181) is fitted onto the outer wall of the slider (182); A brush (183) is installed between two sliders (181); The guide opening (188) is opened through the top surface of the wind shield (1402); A guide rod (187) is disposed in a guide opening (188), and the guide rod (187) is connected to one of the sliders (181).

10. The integrated circuit board surface dust-free heat dissipation and cooling component as described in claim 9, characterized in that, It also includes a baffle (185) positioned below the brush (183); Two limiting plates (184) are set at both ends of the bottom surface of the baffle (185), and the baffle (185) is moved on the limiting plates (184); A rectangular opening (186) is formed through the outer wall of one side of the hood (1402); One end of the barrier (185) passes through the rectangular opening (186).

Images