Lens processing method
By improving the processing methods for germanium lenses, including annealing, annular wire cutting, centerless grinding, and multi-wire cutting, the problems of breakage and material waste during the processing of germanium lenses have been solved, and the processing efficiency and yield rate have been improved.
Patent Information
- Application Number
- CN202511131236.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-13
- Publication Date
- 2025-11-18
AI Technical Summary
Existing germanium lens processing methods suffer from low cutting accuracy, significant material waste, and high breakage rates, leading to increased processing costs and low yield rates.
The crystal rods, grown from single crystals and annealed, are radially cut into coarse segments using a ring wire cutter, then axially nested into fine segments. The segments are then ground and multi-wire cut into blank wafers using a centerless grinder, and finally milled to form lenses.
It effectively reduces thermal and mechanical stress, prevents breakage, and improves the processing yield and quality of lenses.
Smart Images
Figure CN120962497A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical manufacturing technology, and in particular to a lens processing method. Background Technology
[0002] Lens fabrication is a core technology in optical manufacturing. Its purpose is to process optical materials (such as glass, crystals, and plastics) into lenses with specific curvature, thickness, and optical properties, thereby achieving the refraction, focusing, or divergence of light. In related technologies, the fabrication method for germanium lenses is as follows: A germanium crystal rod is grown from a single crystal; the germanium crystal rod is cut into several coarse germanium crystal segments using a ring saw; these coarse germanium crystal segments are vertically bonded to a graphite plate (i.e., the axis of each coarse germanium crystal segment is perpendicular to the graphite plate), and CNC machining is used to nest each coarse germanium crystal segment, thereby cutting each coarse germanium crystal segment into several fine germanium crystal segments; each fine germanium crystal segment is externally cylindrically ground using an external cylindrical grinder; all the externally cylindrically ground fine germanium crystal segments are vertically bonded to a graphite plate, and each fine germanium crystal segment is cut into several germanium wafers using an internal cylindrical cutter; each germanium wafer is then milled to obtain several germanium lenses. However, this processing method for germanium lenses has many drawbacks. For example, the saw blade of the ring saw is relatively thick, and the kerf is wide, reducing cutting accuracy and wasting material. The diameter of the coarse germanium crystal segment is usually 1-1.2 mm larger than the diameter of the germanium lens as a allowance, resulting in excessive material loss. The fine germanium crystal segment experiences greater mechanical stress at both ends during outer circumferential grinding, making it prone to breakage. Furthermore, the fine germanium crystal segment has lower efficiency and higher material loss during inner circumferential cutting. Ultimately, these drawbacks increase the processing cost of germanium lenses and reduce their yield, hindering the production of high-quality germanium lenses. Summary of the Invention
[0003] This application provides a lens processing method, which aims to solve the problems of low yield, poor quality and insufficient performance caused by the easy breakage of germanium lenses during processing in related technologies.
[0004] To address the aforementioned drawbacks in related technologies, this application provides a lens processing method, comprising: growing a single crystal rod required for lens processing and annealing the crystal rod; cutting the crystal rod radially to obtain multiple coarse crystal segments; nesting the coarse crystal segments axially to obtain multiple fine crystal segments; grinding the fine crystal segments using a centerless grinder to obtain blank crystal segments; cutting the blank crystal segments radially to obtain multiple blank wafers; and milling the blank wafers to obtain a lens.
[0005] In some implementations, the annealing process for the crystal ingot includes placing the crystal ingot in an annealing furnace and slowly cooling it to the sum of room temperature and a preset temperature threshold.
[0006] In some implementations, the step of cutting the crystal rod radially includes cutting the crystal rod radially using a toroidal wire EDM machine.
[0007] In some implementation schemes, the axial dimension of the coarse-grained segment is 100~150mm.
[0008] In some implementation schemes, the step of nesting the coarse-grained segments along their axial direction includes: erecting multiple coarse-grained segments parallel to each other on a first fixture; assembling the first fixture with a CNC machine tool; and using the CNC machine tool to nest each coarse-grained segment. Further, the CNC machine tool includes a cylindrical cutter for nesting the coarse-grained segments, the inner wall of which has a water inlet hole communicating with the outside, for introducing cooling water during the nesting process of the coarse-grained segments. Further, the corresponding nesting diameter during the nesting process of the coarse-grained segments is the sum of the lens diameter and a preset diameter threshold.
[0009] In some implementation schemes, the step of radially cutting the blank crystal segment includes: erecting multiple blank crystal segments in parallel on a second fixture; assembling the second fixture with a multi-wire cutting machine; and using the multi-wire cutting machine to radially cut the multiple blank crystal segments.
[0010] In some implementation schemes, both the first and second tooling are graphite plates.
[0011] In some implementations, after the step of radially cutting the blank crystal segment to obtain multiple blank wafers, the process further includes: performing a protective chamfer on the blank wafers.
[0012] The lens processing method provided in this application comprises the following steps: growing a single crystal rod required for lens processing and annealing the rod; cutting the rod radially to obtain multiple coarse crystal segments; nesting the coarse crystal segments axially to obtain multiple fine crystal segments; grinding the fine crystal segments using a centerless grinder to obtain blank crystal segments; cutting the blank crystal segments radially to obtain multiple blank wafers; and milling the blank wafers to obtain the lens. It is understood that before cutting the rod radially to obtain multiple coarse crystal segments, annealing is required to eliminate the internal stress generated during single crystal growth and reduce crystal cracking caused by stress release during subsequent processing. After nesting the coarse crystal segments axially to obtain multiple fine crystal segments, a centerless grinder is used to grind the fine crystal segments, instead of using a conventional cylindrical grinder. This eliminates the mechanical stress experienced by the ends of the fine crystal segments when the cylindrical grinder performs axial positioning. In other words, this application can effectively reduce thermal and mechanical stress during lens processing, prevent lenses from breaking during processing, thereby significantly improving the pass rate of lens processing and ensuring the quality and performance of lenses. Attached Figure Description
[0013] To more clearly illustrate the related technologies or the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the related technologies or the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application, and not all embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0014] Figure 1 A schematic flowchart of the lens processing method provided in the embodiments of this application;
[0015] Figure 2 Provided for the embodiments of this application Figure 1 Flowchart of S103;
[0016] Figure 3 Provided for the embodiments of this application Figure 1 A flowchart of the S105 process. Detailed Implementation
[0017] In related technologies, the processing method for germanium lenses (lenses made of germanium material) is as follows: a germanium crystal rod is grown from a single crystal; the germanium crystal rod is cut into several coarse germanium crystal segments using a ring saw; the several coarse germanium crystal segments are vertically bonded to a graphite plate (i.e., the axis of each coarse germanium crystal segment is perpendicular to the graphite plate), and each coarse germanium crystal segment is nested using a CNC (computer numerical control machining center) to cut each coarse germanium crystal segment into several fine germanium crystal segments; each fine germanium crystal segment is externally cylindrically ground using an external cylindrical grinding machine; all the fine germanium crystal segments after external cylindrical grinding are vertically bonded to a graphite plate, and each fine germanium crystal segment is cut into several germanium wafers using an internal cylindrical cutting machine; each germanium wafer is milled to obtain several germanium lenses. However, this processing method for germanium lenses still has many drawbacks. For example, the saw blade of the ring saw is relatively thick, and the kerf is wide, which reduces cutting accuracy and wastes material. The diameter of the coarse germanium crystal segment is usually 1-1.2 mm larger than the diameter of the germanium lens as a allowance, resulting in excessive material loss. The fine germanium crystal segment experiences greater mechanical stress at both ends during outer circumferential grinding, making it prone to breakage. The fine germanium crystal segment has lower efficiency and higher material loss during inner circumferential cutting. Ultimately, these drawbacks increase the processing cost of germanium lenses and reduce their yield, which is very detrimental to the production of high-quality germanium lenses. In view of this, this application proposes a lens processing method in the embodiments below to solve the above-mentioned drawbacks existing in the related art.
[0018] To make the objectives, technical solutions, and advantages of this application more apparent and understandable, this application will be clearly and completely described below in conjunction with its embodiments and corresponding drawings. Throughout, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. It should be understood that the embodiments of this application described below are only for explaining this application and are not intended to limit this application. That is, all other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. Furthermore, the technical features involved in the various embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0019] Please see Figure 1 , Figure 1 This is a schematic flowchart of a lens manufacturing method. This embodiment provides a lens manufacturing method, including the following steps 101 to 106 (abbreviated as S101 to S106).
[0020] S101, a single crystal rod required for lens processing is grown, and the crystal rod is annealed.
[0021] In this embodiment, the lens fabrication process first requires obtaining the necessary crystal rod through single-crystal growth, followed by annealing. It should be noted that single-crystal growth refers to the process of arranging atoms or molecules in an ordered manner according to the same crystallographic orientation to form a single crystal through specific processes (such as Czochralski, zone melting, vapor phase epitaxy, etc.). Only a single-crystal structure can guarantee the uniformity and low loss of infrared light transmission, thus meeting optical performance requirements. Therefore, single-crystal growth is the fundamental and crucial first step in lens fabrication, directly determining the performance of subsequent materials and the feasibility of processing. It is understood that annealing the crystal rod effectively eliminates the internal stress generated during single-crystal growth, reducing crystal cracking caused by stress release during subsequent processing and laying the foundation for stability in subsequent processing. Furthermore, the crystal rod in this embodiment uses a hard and brittle material, which may include, but is not limited to, germanium, silicon, zinc selenide, zinc sulfide, cadmium telluride, quartz glass, sapphire, calcium fluoride, strontium titanate, and ultraviolet fused silica, etc. The specific material can be selected according to actual needs, and this embodiment does not impose a unique limitation.
[0022] In some embodiments, the crystal rod can be placed in an annealing furnace and slowly cooled to the sum of room temperature (typically 20~25°C) and a preset temperature threshold, thereby annealing the crystal rod. Understandably, after placing the crystal ingot in the annealing furnace, the cooling rate needs to be controlled by the furnace, rather than by natural cooling or rapid air / water cooling. The purpose is to reduce internal thermal stress by slowly cooling the material (when temperatures change drastically, different parts of the material contract / expand at different rates, easily causing cracks, deformation, uneven hardness, and decreased optical performance). If the material has just undergone high-temperature treatment (e.g., above 500°C), direct exposure to room temperature will cause a sudden increase in internal stress due to the large temperature difference (e.g., 500°C → 25°C), potentially leading to microcracks invisible to the naked eye, affecting the strength or optical performance of subsequent processing. In other words, the sum of slowly cooling to room temperature and a preset temperature threshold is equivalent to setting a "buffer temperature" before reaching room temperature, avoiding the impact of temperature fluctuations (e.g., unstable ambient temperature) on the material during the later stages of annealing. After reaching this "buffer temperature," it needs to continue cooling to room temperature at an even slower rate (or naturally held at room temperature) to further release residual stress. For example, the preset temperature threshold is 10°C.
[0023] S102, the crystal rod is cut radially to obtain multiple coarse crystal segments.
[0024] In this embodiment, after annealing the crystal rod, it can be cut along the radial direction to obtain multiple coarse grain segments; that is, the crystal rod is cut into multiple segments along its axial direction (i.e., length direction). It should be noted that extensive experimental verification has shown that when the axial dimension (i.e., length) of the coarse grain segment is greater than 150mm, the cooling water cannot fully contact the bottom of the coarse grain segment during the subsequent S103 nesting process. This leads to a rapid increase in thermal stress, which can easily cause material cracking. In severe cases, it may cause the nesting tool (i.e., the cylindrical tool mentioned below) to shatter and scatter, ultimately leading to significant safety issues. Therefore, in this embodiment, the length of the coarse grain segment is designed to be 100~150mm. In some embodiments, a coarse grain segment length of 120mm optimizes processing efficiency and product yield.
[0025] In some embodiments, a ring wire EDM machine can be used to cut the crystal rod radially to obtain multiple coarse crystal segments. It is understood that, compared to conventional ring saw cutting machines, this application uses a ring wire EDM machine to cut the crystal rod, resulting in higher precision, narrower kerf, and reduced material waste.
[0026] S103, multiple fine-grained segments are obtained by nesting the coarse-grained segment along the axial direction of the coarse-grained segment.
[0027] In this embodiment, after cutting the crystal rod radially to obtain multiple coarse segments, it is necessary to nest the coarse segments along the axial direction of the coarse segments to finally obtain multiple fine segments; that is, multiple smaller diameter fine segments are processed from the larger diameter coarse segments by a special tool (i.e., the cylindrical tool below), and the feed direction of the special tool is along the axial direction of the coarse segments.
[0028] In some embodiments, please refer to Figure 2 , Figure 2 yes Figure 1 The flowchart for step S103 is shown below. The process of nesting the coarse grain segments along their axial direction includes steps 1031 to 1033 (abbreviated as S1031 to S1033), namely: S1031, erecting multiple coarse grain segments in parallel on the first fixture (i.e., fixing one end of multiple coarse grain segments to the first fixture at intervals, and the axes of multiple coarse grain segments are parallel to each other); S1032, assembling the first fixture with the CNC machine tool; S1033, nesting each coarse grain segment along its axial direction using the CNC machine tool. It should be noted that the diameter of the fine-grained segment is the same as the diameter of the coarse-grained segment. In this application, the diameter of the material is equal to the sum of the diameter of the lens in the design drawing and the preset diameter threshold. The preset diameter threshold is actually a reserve, which will be ground off in the subsequent S104. For example, the preset diameter threshold of this application is equal to 0.3 mm. Compared with the reserve of 1~1.2 mm in the traditional solution, the reserve of this application is smaller and the material loss is lower.
[0029] As at least one embodiment, the CNC machine tool includes a cylindrical cutter for nesting coarse-grained segments. The inner wall of the cylindrical cutter has a water inlet hole communicating with the outside, which is used to introduce cooling water during the nesting process of the coarse-grained segments. In other words, in practical applications, the cylindrical cutter rotates at high speed under the drive of the CNC machine tool and moves from one end of the coarse-grained segment to the opposite end, so as to cut out smaller-diameter fine-grained segments from the larger-diameter coarse-grained segments. Simultaneously, external cooling water flows in through the water inlet hole on the cylindrical cutter and directly acts on the machining area, thereby ensuring that the segments receive sufficient cooling during the nesting process, preventing material damage or affecting machining accuracy due to excessive temperature, and also helping to improve nesting efficiency and the service life of the cylindrical cutter.
[0030] Specifically, the cylindrical cutting tool has an opening that communicates with the interior. The periphery of the opening is usually coated with abrasive materials such as diamond to serve as the cutting edge. The water inlet can be located at the end of the cylindrical cutting tool opposite to the opening and at the center (i.e., on the axis of the cylindrical cutting tool). Based on this, a rotary joint can be installed in the water inlet, which is connected to an external pipeline for supplying cooling water. The rotary joint can maintain a continuous supply of cooling water while the cylindrical cutting tool rotates, and can precisely control the flow rate and spray direction of the cooling water, thereby effectively cooling the cylindrical cutting tool and the crystal segment. Alternatively, a water outlet and an impeller can be installed in the water inlet, and the flow of cooling water can drive the impeller to rotate. When the impeller rotates, it drives the water outlet to rotate, so that the cooling water is sprayed onto the machining area through the water outlet in a specific manner (such as a spiral), thereby increasing the contact area between the cooling water and the machining area, improving the cooling effect and chip removal capacity.
[0031] In at least one embodiment, the first tooling is a graphite plate. Graphite plates possess excellent properties such as high temperature resistance and ease of processing, which can reduce scratches on the crystal surface and are well-suited for cooling or frictional heating during processing. It is understood that when the first tooling uses a graphite plate, multiple coarse-grained segments need to be bonded together and erected parallel to each other on the graphite plate. After the coarse-grained segments are assembled, debonding is required to separate the fine-grained segments from the graphite plate for subsequent processing.
[0032] S104, fine-grained segments are ground using a centerless grinder to obtain blank segments.
[0033] In this embodiment, after nesting the coarse-grained segment along its axial direction to obtain multiple fine-grained segments, a centerless grinder is used to grind the fine-grained segments to obtain a blank segment. It is understood that the centerless grinder uses a grinding wheel, guide wheel, and support plate to grind the outer diameter of the fine-grained segment. The principle is as follows: the fine-grained segment is placed on the support plate between the grinding wheel and the guide wheel. The guide wheel (with a lower rotation speed and an inclined axis) drives the fine-grained segment to rotate and feed it, while the grinding wheel (rotating at high speed) grinds the outer diameter of the fine-grained segment. This ultimately removes the allowance made during nesting in S103 and corrects shape errors such as roundness and straightness of the fine-grained segment, ensuring its dimensions and accuracy meet the requirements of the design drawings. Furthermore, it should be noted that this embodiment uses a centerless grinder to grind the fine-grained segment, rather than a traditional cylindrical grinder. This eliminates the mechanical stress on both ends of the fine-grained segment during the cylindrical grinder's axial positioning, preventing the fine-grained segment from breaking during grinding and reducing material loss by 75%.
[0034] S105, the blank crystal segment is radially cut to obtain multiple blank wafers.
[0035] In this embodiment, after grinding the fine crystal segment with a centerless grinder to obtain the blank crystal segment, the blank crystal segment needs to be cut along the radial direction to finally obtain multiple blank wafers.
[0036] In some embodiments, please refer to Figure 3 , Figure 3 yes Figure 1 The flowchart for step S105 is shown below. The process of cutting the blank crystal segment radially includes steps 1051 to 1053 (abbreviated as S1051 to S1053), namely: S1051, erecting multiple blank crystal segments in parallel on the second fixture (i.e., fixing one end of multiple blank crystal segments to the second fixture at intervals, and the axes of multiple blank crystal segments are parallel to each other); S1052, assembling the second fixture with the multi-wire cutting machine; S1053, using the multi-wire cutting machine to cut multiple blank crystal segments radially. It should be noted that the cutting line size of the multi-wire cutting machine in this application is 0.15mm, which is smaller than the 0.45mm cutting blade of the traditional inner circle cutting machine, and the material loss can be reduced by 66.7%. In addition, the inner circle cutting machine is a single blade cutting machine, and its cutting efficiency is about 50% of that of the multi-wire cutting in this application. The smaller the thickness of the blank wafer in the design drawing, the higher the efficiency of the multi-wire cutting in this application, and the lower the efficiency of the inner circle cutting in the traditional solution.
[0037] As at least one embodiment, if there are multiple different axial dimensions of the blank crystal segments, then all blank crystal segments with the same axial dimensions or multiples of natural numbers can be erected parallel to each other on the same second fixture. For example, assuming there are four types of blank crystal segments with lengths of 50mm, 60mm, 100mm, and 150mm, since 100mm is twice 50mm and 150mm is three times 50mm, the blank crystal segments of 50mm, 100mm, and 150mm can be erected parallel to each other on the same second fixture, while the blank crystal segment of 60mm (not a multiple of 50mm) needs to be fixed separately or with other blank crystal segments that are multiples of 60mm (such as 120mm) on another second fixture. This ensures that all blank crystal segments on the same second fixture are "cut through in one go" and the cutting efficiency is maximized.
[0038] As at least one embodiment, the multi-wire cutting machine has a cylindrical component called a roller, whose surface is provided with uniformly distributed grooves. These grooves are used to wind the cutting wire (metal wire) and control the spacing of the cutting wire. The number of grooves on the roller is called the winding grid number, and each grid corresponds to the position of a cutting wire. The spacing between adjacent grooves determines the thickness of the blank wafer after cutting. In S105, those skilled in the art can adjust the winding grid number of the roller according to actual needs, such as adjusting the winding grid number of the roller according to the thickness of the blank wafer in the design drawing or a natural multiple of the thickness. The core is to coordinate the total length of the blank wafer segment, the winding grid number of the roller, and the thickness of the blank wafer in the design drawing through "multiple matching" to ensure that the thickness of all blank wafers after cutting is within the tolerance range of the design drawing. For example, if the thickness of the blank wafer in the design drawing is 0.5mm, and a 1x multiplier is used for cutting, then the winding grid spacing of the roller is 0.5mm, and several 0.5mm thick blank wafers can be obtained in one multi-wire cutting. Alternatively, in order to improve the efficiency of multi-wire cutting, the winding grid number of the roller is first adjusted by a 2x multiplier (i.e., 1mm), and several 1mm thick blank wafers will be obtained after cutting. Then, the 1mm thick blank wafers can be further cut into 0.5mm thick blank wafers.
[0039] In at least one embodiment, the second tooling is a graphite plate. Graphite plates possess excellent properties such as high temperature resistance and ease of processing, which can reduce scratches on the crystal surface and are well-suited for cooling or frictional heating during processing. It is understood that when the second tooling uses a graphite plate, multiple blank crystal segments need to be bonded together and erected parallel to each other on the graphite plate. After multi-wire cutting, debonding is required to remove each blank crystal from the graphite plate for subsequent processing.
[0040] In some embodiments, after obtaining multiple blank wafers by radially cutting the blank crystal segment, the blank wafers can be protectively chamfered, that is, the edges of the blank wafers are cut and ground to process the originally sharp right angles or acute angles into bevels of a certain angle (such as 45° chamfers) or rounded transitions (rounded corners), thereby protecting the edges of the blank wafers from damage, while avoiding the risk of the blank wafers breaking and scratches caused by sharp edges during subsequent processing or use.
[0041] S106, the blank wafer is milled to obtain a lens.
[0042] In this embodiment, after obtaining multiple blank wafers by radially cutting the blank crystal segments, the blank wafers need to be milled to finally obtain the lens. It is understood that the blank wafers obtained in S105 only meet the basic requirements of thickness tolerance and flatness. These blank wafers are flat, circular thin sheets without any curved surfaces (convex or concave) or the unique optical surface contours of a lens. Therefore, milling is required (using a diamond wheel or milling cutter to cut the blank wafer to remove excess material) to ultimately form the spherical, aspherical, or specific curved surface contours of the lens (such as the convex surface of a convex lens, the concave surface of a concave lens, etc.). Furthermore, it should be noted that milling is a roughing process; the lens obtained in S106 is still a semi-finished product with a surface roughness at the micrometer level. Subsequent fine grinding and polishing processes are needed to further improve its surface precision (to the nanometer level).
[0043] The above embodiments are merely preferred implementations of this application and are not the only limitation on the lens processing method. Those skilled in the art can flexibly adjust the methods based on the above embodiments and the actual application scenario. It is understood that the implementation of the above embodiments of this application can effectively achieve lens processing. The specific processing flow includes: growing a single crystal rod required for lens processing and annealing the rod; cutting the rod radially to obtain multiple coarse crystal segments; nesting the coarse crystal segments axially to obtain multiple fine crystal segments; grinding the fine crystal segments using a centerless grinder to obtain blank crystal segments; cutting the blank crystal segments radially to obtain multiple blank wafers; and milling the blank wafers to obtain the lens. Therefore, before cutting the crystal rod radially to obtain multiple coarse segments, the crystal rod needs to be annealed to eliminate the internal stress generated during single crystal growth and reduce crystal cracking caused by stress release during subsequent processing. After nesting the coarse segments axially to obtain multiple fine segments, a centerless grinder is needed to grind the fine segments instead of the traditional cylindrical grinder. This eliminates the mechanical stress on both ends of the fine segments when the cylindrical grinder performs axial positioning. In other words, this application can effectively reduce thermal and mechanical stress during lens processing, prevent lens breakage during processing, and thus significantly improve the lens processing yield, ensuring the quality and performance of the lens.
[0044] It should be noted that the several embodiments shown above in this application are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. It should also be noted that in the textual description of this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply such an actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements may include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus; and, without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0045] Furthermore, those skilled in the art can implement or use this application by practicing the several embodiments shown above. Various modifications to the embodiments shown above will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments not shown without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the several embodiments shown above, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A lens processing method, characterized in that, include: A single crystal rod required for processing lenses is grown, and the crystal rod is annealed. The crystal rod is cut radially to obtain multiple coarse crystal segments; Multiple fine-grained segments are obtained by nesting the coarse-grained segment along its axial direction. The fine-grained segments are ground using a centerless grinder to obtain blank segments; The blank crystal segment is cut radially to obtain a plurality of blank wafers; The lens is obtained by milling the blank wafer.
2. The lens processing method according to claim 1, characterized in that, The step of annealing the crystal rod includes: The crystal rod is placed in an annealing furnace and slowly cooled to the sum of room temperature and a preset temperature threshold.
3. The lens processing method according to claim 1, characterized in that, The step of cutting the crystal rod radially includes: The crystal rod is cut radially using a ring wire cutter.
4. The lens processing method according to claim 1, characterized in that, The axial dimension of the coarse-grained segment is 100~150mm.
5. The lens processing method according to claim 1, characterized in that, The step of nesting the coarse-grained segment along its axial direction includes: The coarse-grained segments are erected in parallel on the first tooling; Assemble the first tooling with the CNC machine tool; The CNC machine tool is used to nest each of the coarse grain segments.
6. The lens processing method according to claim 5, characterized in that, The CNC machine tool includes a cylindrical cutter for nesting the coarse grain segment. The inner wall of the cylindrical cutter is provided with a water inlet hole that communicates with the outside, for introducing cooling water during the nesting process of the coarse grain segment.
7. The lens processing method according to claim 5, characterized in that, The diameter of the coarse-grained segment is the sum of the diameter of the lens and a preset diameter threshold.
8. The lens processing method according to claim 5, characterized in that, The step of radially cutting the blank segment along the blank segment includes: The multiple blank crystal segments are erected in parallel on the second tooling; Assemble the second tooling with the multi-wire cutting machine; The multi-wire cutting machine is used to cut multiple blank crystal segments radially along the blank crystal segment.
9. The lens processing method according to claim 8, characterized in that, Both the first tooling and the second tooling are graphite plates.
10. The lens processing method according to claim 1, characterized in that, After the step of radially cutting the blank crystal segment to obtain multiple blank wafers, the method further includes: The blank wafer is then subjected to a protective chamfer.