Multifunctional photonic device based on glass substrate

Abstract

The invention belongs to the technical field of semiconductor devices, and particularly relates to a multifunctional photonic device based on a glass substrate, which comprises the glass substrate, a transition layer is arranged on the first surface of the glass substrate, and a high-refractive-index functional material layer is arranged on the first surface of the transition layer as a waveguide layer. The high-refractive-index functional material layer refers to a functional material layer with the refractive index larger than or equal to 1.7, the waveguide layer is coated with a protective layer, and the protective layer covers the glass substrate, the transition layer and the waveguide layer at the same time; wherein a first boundary layer is formed between the glass substrate and the transition layer, and a second boundary layer is formed between the transition layer and the waveguide layer. According to the anti-warping photonic device with the multi-layer buffer structure, through the specific partition design and the design of the multi-layer buffer structure, the anti-warping photonic device with the multi-layer buffer structure is obtained; the situation of warping aggravation caused by the amplification effect of a large-size photonic device can be at least partially relieved or solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor devices, and particularly relates to a multifunctional photonic device based on a glass substrate. BACKGROUND

[0002] As the core and basic element of modern optical communication, optical sensing and photonic integrated chip (PIC), the performance and reliability of the optical waveguide device directly determine the advantages and disadvantages of the entire optical system. In recent years, with the rapid development of data center interconnection, high-performance computing and artificial intelligence, higher requirements have been put forward for the transmission capacity, integration density and physical size of the optical waveguide device.

[0003] At present, the substrate material used for preparing the optical waveguide device in the industry is mostly silicon substrate (such as SOI-Silicon on Insulator). The silicon substrate has the advantages of high surface flatness, good compatibility with CMOS process, easy micro-nano processing and the like, so it has become the mainstream choice for high-performance and high-integration optical waveguide. However, the silicon substrate also has its inherent limitations: for example, the silicon material itself has high absorption loss in the communication band, and its high refractive index, although conducive to device miniaturization, also brings higher transmission loss and packaging alignment difficulty.

[0004] Therefore, people think of using glass as a substrate to reduce the packaging difficulty of the chip and improve the performance of the chip. For example, the prior art CN119028829A proposes a glass substrate structure and a preparation method thereof. The application uses a glass substrate as a packaging substrate, utilizes the characteristics of adjustable glass substrate size, adjustable thermal expansion coefficient and low dielectric loss factor, can realize smaller size packaging, reduces the risk of connection warping between the packaging substrate and the chip, and improves the dielectric performance of the packaging, thereby reducing the processing difficulty and processing cost. That is, the application provides a small-size glass substrate packaging scheme.

[0005] However, for some application scenarios that require long transmission distance or large-area optical field operation (such as large optical phased arrays, some types of biological sensors, etc.), it is necessary to realize the preparation of large-size optical waveguide devices on a single large-size glass substrate. In addition, for some multifunctional photonic devices, it is also necessary to realize the integration of multiple devices on a single large-size glass substrate. Therefore, how to realize the manufacturing of large-size optical waveguide devices with suppressed packaging warping while fully utilizing the low-cost and high-performance advantages of the glass substrate is still a key technical problem to be solved in the field. SUMMARY

[0006] The present application aims to provide a glass substrate-based multifunctional photonic device to partially alleviate or solve the above problems, and realize large-size multifunctional optical waveguide device manufacturing with suppressed packaging warping.

[0007] To solve the above-mentioned technical problems, the present application specifically adopts the following technical solutions: A glass substrate-based multifunctional photonic device comprises: a glass substrate; A first surface of the glass substrate is provided with a transition layer, a first surface of the transition layer is provided with a high refractive index functional material layer as a waveguide layer, the high refractive index functional material layer refers to a functional material layer with a refractive index greater than or equal to 1.7, the waveguide layer is coated with a protective layer, and the protective layer covers the glass substrate, the transition layer and the waveguide layer at the same time; wherein, a first boundary layer is formed between the glass substrate and the transition layer, and a second boundary layer is formed between the transition layer and the waveguide layer; the first boundary layer comprises at least one first interface control structure, the first interface control structure comprises at least one of a microcavity structure, a crack structure and a sodium ion layer; the second boundary layer comprises at least one second interface control structure, the second interface control structure comprises at least one of a crack structure and a hole structure.

[0008] As an improvement, the transition layer is a SiO2 layer.

[0009] As an improvement, the high refractive index functional material layer comprises at least one of a niobium oxide (Nb2O5) material layer, a tantalum oxide (Ta2O5) material layer and a polymer waveguide material layer.

[0010] As an improvement, the refractive index of the niobium oxide (Nb2O5) material layer is 2.1-2.3, the refractive index of the tantalum oxide (Ta2O5) material layer is 2-2.3, and the refractive index of the polymer waveguide material layer is 1.7-1.9.

[0011] As an improvement, the polymer waveguide material layer is a high refractive photoresist layer.

[0012] As an improvement, the thickness of the glass substrate is 300 um -1mm, the thickness of the transition layer is 50 nm-200nm, the thickness of the waveguide layer is 300nm-400nm, the thickness of the first boundary layer is 10nm-50nm, and the thickness of the second boundary layer is 10nm-50nm.

[0013] As an improvement, a heteromaterial chip structure is integrated on the waveguide layer, and the heteromaterial chip structure includes functional units of at least one of the following: a III-V compound semiconductor active device, a phase change material unit, a two-dimensional material unit, a piezoelectric material unit, or a sensing material unit.

[0014] As an improvement, the glass substrate is divided into at least three functional regions, including at least a first functional region provided with a tantalum oxide (Ta2O5) material layer, a second functional region provided with a niobium oxide (Nb2O5) material layer, and a third functional region provided with a polymer waveguide material layer.

[0015] As an improvement, the first functional region is arranged at an external light source entrance of the photonic device, the tantalum oxide (Ta2O5) material layer is configured to receive external input light and perform filtering or wavelength division multiplexing functions, the second functional region and the third functional region are arranged in sequence on a side of the first functional region away from the light source entrance, wherein the second functional region is optically coupled to the first functional region, the niobium oxide (Nb2O5) material layer is configured to receive filtered light and realize low-loss optical signal distribution and routing; the third functional region is optically coupled to the second functional region, and the polymer waveguide material layer is configured to realize optical sensing or beam shaping functions. Wherein, the optical signal is sequentially transmitted along the paths of the first functional region, the second functional region and the third functional region.

[0016] As an improvement, the third functional region is located at the center of the photonic device, the second functional region is located on the first side and / or the third side opposite to the third functional region, and the first functional region is located on the second side of the third functional region.

[0017] The principles and beneficial technical effects of the present application are: In the prior art, due to the limitations of material properties and process compatibility, it is difficult to realize large-size, multi-material system photonic integration on a single substrate. Generally, small-size chip-level integration or single-material platform is preferred to avoid problems such as warping, stress concentration and interface delamination caused by mismatch of thermal expansion coefficients. However, this limits the expansion of photonic devices in terms of functional complexity and scale.

[0018] The present application breaks through the above design constraints and provides a scheme for multi-material hetero-integration on a large-size glass substrate. Through specific partition design and multi-layer buffer structure design, the warping caused by the "amplification effect" of large-size photonic devices can be at least partially alleviated or solved, thereby realizing the feasibility and reliability of large-size multi-functional devices.

[0019] Specifically, first, the scheme provides a waveguide partition arrangement scheme, by partitioning the light waveguide materials (such as niobium oxide, tantalum oxide, polymer waveguide) with different functions, and optimizing the relative position relationship according to the stress characteristics, to a certain extent, the local stress accumulation is relieved, and the further amplification of warping is avoided. At the same time, contrary to the idea of using integrated components in the prior art, the application adopts a split design for complex structures and disperses them to different functional areas, for example, the optical signal distribution and optical sensing functions are distributed to the second functional area and the third functional area respectively, so that the photonic device can be processed in large scale at the same time to realize multi-functional integration, without excessively increasing the complexity and design difficulty of the structure.

[0020] Further, contrary to the idea of pursuing ideal complete interface (in the prior art, in order to ensure the connection strength between adjacent components, such as the substrate and the waveguide layer, the upper surface of the substrate and the lower surface of the waveguide layer are required to be directly attached as much as possible), the application sets a transition layer and a boundary layer with a specific thickness and structure between the glass substrate and the waveguide layer, and at the same time introduces microcavities, cracks or sodium ion layers and other micro-nano structures in the boundary layer, which can absorb and release part of the stress to a certain extent, thereby inhibiting the amplitude of the overall warping to a certain extent.

[0021] In summary, the application provides a split type partition scheme with a multi-layer transition structure, which reduces the warping degree between the glass substrate and the waveguide layer through the transition structure, so that the partition can be realized, and further realizes multi-functional integration through the partition, and at the same time, through reasonable division of the functional areas, the warping possibility can be reduced through the partition itself, thereby improving the stability of the entire photonic device. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual proportion. Obviously, the drawings described below are some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without paying creative labor.

[0023] Figure 1 A first structure schematic diagram of a photonic device in an exemplary embodiment of the present application; Figure 2 A second structure schematic diagram of a photonic device in an exemplary embodiment of the present application; Figure 3 A third structure schematic diagram of a photonic device in an exemplary embodiment of the present application; Figure 4 Figure 1 is a schematic diagram of the glass substrate in an exemplary embodiment of the present application; Figure 5 Figure 2 is a schematic diagram of the waveguide layer in an exemplary embodiment of the present application.

[0024] In the figure, 100 is a glass substrate, 200 is a transition layer, 300 is a waveguide layer, 310 is a tantalum oxide (Ta2O5) material layer, 320 is a niobium oxide (Nb2O5) material layer, 330 is a polymer waveguide material layer, 331 is a computing unit, 332 is a row waveguide, 500 is a protective layer, 600 is a first boundary layer, 700 is a second boundary layer, 800 is a substrate contact layer, and 900 is an external light source. DETAILED DESCRIPTION

[0025] In order to make the objects, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0026] In this document, the suffixes such as "module", "part", or "unit" used for an element are merely intended for facilitating description of the present application, and have no particular meaning by themselves. Therefore, "module", "part", or "unit" can be mixedly used. In this document, the terms "upper", "lower", "inner", "outer", "front", "back", "one end", "the other end", and the like indicate the orientation or positional relationship based on the drawings shown, and are merely intended for facilitating the description of the present application and simplifying the description, and do not indicate or imply that a specified device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and the like are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance.

[0027] In this document, unless otherwise clearly specified and limited, the terms "mount", "provided with", "connected", and the like should be understood in a broad sense, for example, "connected" can be fixed connection, can be detachable connection, or integrally connected; can be mechanical connection, can be direct connection, or indirect connection through an intermediate medium, can be the communication inside two elements. For a person of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. In this document, "a plurality of" means two or more, that is, it includes two, three, four, five, and the like.

[0028] Embodiment one The area of the large-size glass substrate is usually 100mm-2000mm or even larger. Compared with the commonly used silicon wafer, the surface of the glass panel has a lower flatness due to its rough characteristics. In addition, the coefficient of thermal expansion of glass and the waveguide layer (for example, silicon nitride (Si3N4) waveguide) is significantly different, and local cracking, warping, film delamination is more likely to occur. Based on this, the present application provides a multifunctional photonic device based on a glass substrate, which realizes the integration of multifunctional devices on a large glass substrate under the premise of reducing the possibility of warping.

[0029] Referring to Figures 1-5 , the present application provides a multifunctional photonic device based on a glass substrate, comprising: a glass substrate 100; The first surface (i.e. the upper surface) of the glass substrate 100 is provided with a transition layer 200, the first surface of the transition layer 200 is provided with a high refractive index functional material layer as a waveguide layer 300, the high refractive index functional material layer refers to a functional material layer with a refractive index greater than or equal to 1.7, the waveguide layer 300 is covered with a protective layer 500, the protective layer 500 covers the glass substrate 100, the transition layer 200 and the waveguide layer 300 at the same time; wherein the glass substrate 100 and the transition layer 200 form a first boundary layer 600, and the transition layer 200 and the waveguide layer 300 form a second boundary layer 700 (see Figure 2 ). The first boundary layer 600 comprises at least one first interface control structure, and the first interface control structure comprises at least one of a microcavity structure, a crack structure and a sodium ion layer; the second boundary layer 700 comprises at least one second interface control structure, and the second interface control structure comprises at least one of a crack structure and a hole structure. Wherein, the "microcavity structure" refers to a closed or semi-closed cavity formed in the first boundary layer, with a scale of nanometers to sub-microns, for example, a cavity formed by a bubble structure, and the "sodium ion layer" refers to a chemically modified transition zone formed by the outward migration and enrichment of sodium ions (Na + ) in the glass substrate in the first boundary layer region.

[0030] The photonic device with the above structure is actually a warping-preventing photonic device with a multi-layer buffer structure (including a transition layer, a first boundary layer and a second boundary layer). First, the transition layer 200 can alleviate the problem of low adhesion between the glass substrate 100 and the waveguide layer 300 caused by material differences and the like. Second, the first boundary layer 600 between the transition layer 200 and the glass substrate 100 and the second boundary layer 700 between the transition layer 200 and the waveguide layer 300 can strengthen the connection strength between the transition layer 200 and the adjacent components, further reducing the possibility of warping. In other words, unlike the prior art, which pursues an ideal complete interface (in the prior art, the upper surface of the substrate and the lower surface of the waveguide layer 300 are required to be directly attached as much as possible to ensure the connection strength between the adjacent components, such as the substrate and the waveguide layer 300), the present application introduces the transition layer 200 and the boundary layer with a specific thickness and structure between the glass substrate 100 and the waveguide layer 300, and forms microcavities, cracks or sodium ion layers and other micro-nano structures in the boundary layer, which can absorb and release part of the stress to some extent, thereby inhibiting the overall warping amplitude to some extent.

[0031] In some embodiments, the high-refractive-index functional material layer has a refractive index of 1.7-3.5.

[0032] In some embodiments, the glass substrate 100 has a thickness of 300 um-1 mm, the transition layer 200 has a thickness of 50 nm-200 nm, the waveguide layer 300 has a thickness of 300 nm-400 nm, the first boundary layer 600 has a thickness of 10 nm-50 nm, and the second boundary layer 700 has a thickness of 10 nm-50 nm.

[0033] In some embodiments, a substrate contact layer 800 (see Figure 3 ) is further arranged between the transition layer 200 and the glass substrate 100.

[0034] In some embodiments, the substrate contact layer 800 is a silicon oxide layer. By arranging the substrate contact layer 800, the rough surface of the glass substrate 100 or the unevenness problem caused by the large area span of the glass substrate can be flattened, that is, the surface of the glass substrate 100 is optimized by the substrate contact layer 800, the flatness is improved, and the bonding degree with the waveguide layer is improved. In this embodiment, the first boundary layer 600 is located between the substrate contact layer 800 and the transition layer 200, and it should be noted that the first boundary layer 600 is still located between the glass substrate 100 and the transition layer 200.

[0035] In some embodiments, the transition layer 200 is a SiO2 (silicon dioxide) layer.

[0036] In some embodiments, the high-refractive-index functional material layer includes at least three different material layers. For example, the high-refractive-index functional material layer includes a first refractive-index material layer, a second refractive-index material layer, and a third refractive-index material layer. The refractive index of the first refractive-index material layer and the third refractive-index material layer is greater than that of the second refractive-index material layer.

[0037] In some embodiments, the high-refractive-index functional material layer includes at least one of a Nb2O5 material layer 320, a Ta2O5 material layer 310, and a polymer waveguide material layer 330.

[0038] In some embodiments, the refractive index of the Nb2O5 material layer 320 is 2.1-2.3, the refractive index of the Ta2O5 material layer 310 is 2-2.3, and the refractive index of the polymer waveguide material layer 330 is 1.7-1.9.

[0039] In some embodiments, the polymer waveguide material layer 330 is a high-refractive-index photoresist layer.

[0040] In some embodiments, the waveguide layer 300 is integrated with a hetero-material chip structure, which includes at least one functional unit of a III-V compound semiconductor active device, a phase-change material unit, a two-dimensional material unit, a piezoelectric material unit, or a sensing material unit. By integrating different hetero-material chip structures, the photonic device can meet different application requirements. The multi-layer buffer structure allows multiple hetero-materials to be integrated on the waveguide layer 300 at the same time, while avoiding the possibility of significant warping of the waveguide layer 300.

[0041] In some embodiments, the glass substrate 100 is divided into at least three functional regions, including at least a first functional region, a second functional region, and a third functional region. The first functional region is provided with a first refractive-index material layer, the second functional region is provided with a second refractive-index material layer, and the third functional region is provided with a third refractive-index material layer. The first refractive-index material layer is configured to at least receive external input light and perform filtering or wavelength division multiplexing functions. The second refractive-index material layer is configured to at least receive filtered light and implement low-loss optical signal distribution and routing. The third refractive-index material layer is configured to implement optical sensing or beam shaping functions.

[0042] In some embodiments, the at least three functional regions include at least a first functional region provided with a tantalum pentoxide (Ta2O5) material layer 310, a second functional region provided with a niobium pentoxide (Nb2O5) material layer 320, and a third functional region provided with a polymer waveguide material layer 330. That is, the first refractive index material layer can be a tantalum pentoxide (Ta2O5) material layer 310, the second refractive index material layer can be a niobium pentoxide (Nb2O5) material layer 320, and the third refractive index material layer can be a polymer waveguide material layer 330.

[0043] The first functional region is arranged at the entrance of the external light source 900 of the photonic device, and the tantalum pentoxide (Ta2O5) material layer 310 is configured to receive external input light and perform filtering or wavelength division multiplexing functions. The second functional region and the third functional region are arranged in sequence on the side away from the light source entrance of the first functional region, wherein the second functional region is optically coupled to the first functional region, and the niobium pentoxide (Nb2O5) material layer 320 is configured to receive filtered light and realize low-loss optical signal distribution and routing. The third functional region is optically coupled to the second functional region, and the polymer waveguide material layer 330 is configured to realize optical sensing or beam shaping functions. The optical signal is sequentially transmitted along the paths of the first functional region, the second functional region, and the third functional region.

[0044] In some embodiments, the first functional region is provided with at least a filter, the second functional region is provided with at least a beam splitter and a micro-ring, and the third functional region is provided with at least a sensor and a micro-lens.

[0045] Exemplarily (see Figure 5 ), the external light source A (single-wavelength signal) first enters the tantalum pentoxide (Ta2O5) material layer 310, excites a series of lights a1, a2, a3… with different wavelengths, and then enters the niobium pentoxide (Nb2O5) material layer 320 to be distributed as a multi-beam light source. The multi-beam light source enters different row waveguides 332, then is calculated by different calculation units 331, and finally is integrated and output.

[0046] That is, the present application also provides a split-type partitioning scheme with a transition structure, which enables the partitioning design to be realized through a multi-layer buffer structure. In the specific partitioning process, high-refractive-index functional material layers with different functions are first arranged in different regions to realize different functions. At the same time, complex components are handled externally (for example, the beam splitter and the sensor are arranged in the second region and the third region, respectively), which can to some extent avoid the stress concentration and warping problems caused by the concentration of components due to partitioning.

[0047] In some embodiments, the third functional region is located at a central position of the photonic device, the second functional region is located at opposite first and / or third sides of the third functional region, and the first functional region is located at a second side of the third functional region. By reasonably dividing the functional regions, the distribution of various components can be more uniform, and stress concentration caused by excessive concentration of components can be reduced, thereby causing a serious problem of warping.

[0048] In summary, the present application provides a split-type zoning scheme with a multi-layer transition structure, which can at least partially alleviate or solve the problem of warping caused by the "amplification effect" of large-size photonic devices, thereby realizing the feasibility and reliability of large-size multifunctional devices. The "amplification effect" specifically refers to the fact that compared with a wafer, the probability of thermal stress, structural defects and other problems occurring in a glass substrate will greatly increase after the size area is expanded, thereby causing the performance of the photonic device (especially the optical waveguide and the hetero-material chip structure) above to be reduced or even unable to work.

[0049] Embodiment Two The present embodiment provides a multifunctional photonic device based on a glass substrate. Unlike embodiment one, the substrate in the present embodiment includes but is not limited to a glass substrate. Specifically, the optical waveguide device includes: a substrate; a first surface of the substrate is provided with a transition layer 200, a first surface of the transition layer 200 is provided with an X-silicon-based waveguide layer 300, the X-silicon-based waveguide layer 300 is integrated with a hetero-material chip layer, a first surface of the X-silicon-based waveguide layer 300 is coated with a protective layer 500, and the protective layer 500 covers the substrate, the X-silicon-based waveguide layer 300 and the hetero-material chip layer at the same time; wherein the transition layer 200 contains the same X element as the X-silicon-based waveguide layer 300.

[0050] In some embodiments, the substrate can be one of a sapphire substrate (single-crystal aluminum oxide, Al2O3), an aluminum nitride substrate, and a polymer substrate.

[0051] It should be noted that in this document, the terms "comprising", "including", or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or other elements inherent to such a process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of additional identical elements in the process, method, article or device including the element.

[0052] The embodiments of the present application are described above with reference to the accompanying drawings, but the present application is not limited to the above-described specific embodiments, and the above-described specific embodiments are merely illustrative, but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, and these all belong to the protection of the present application.

Claims

1. A multifunctional photonic device based on a glass substrate, characterized in that, include: Glass substrate (100); A transition layer (200) is disposed on the first surface of the glass substrate (100), and a high refractive index functional material layer is disposed on the first surface of the transition layer (200) as a waveguide layer (300). The high refractive index functional material layer refers to a functional material layer with a refractive index greater than or equal to 1.

7. The waveguide layer (300) is covered by a protective layer (500), and the protective layer (500) simultaneously covers the glass substrate (100), the transition layer (200), and the waveguide layer (300). A first boundary layer (600) is formed between the glass substrate (100) and the transition layer (200), and a second boundary layer (700) is formed between the transition layer (200) and the waveguide layer (300). The first boundary layer (600) includes at least one first interface control structure, which includes at least one of a microcavity structure, a crack structure, and a sodium ion layer; the second boundary layer (700) includes at least one second interface control structure, which includes at least one of a crack structure and a pore structure.

2. The multifunctional photonic device based on a glass substrate according to claim 1, characterized in that, The transition layer (200) is a SiO2 layer.

3. The multifunctional photonic device based on a glass substrate according to claim 1, characterized in that, The high refractive index functional material layer includes at least one of niobium oxide (Nb2O5) material layer (320), tantalum oxide (Ta2O5) material layer (310), and polymer waveguide material layer (330).

4. The multifunctional photonic device based on a glass substrate according to claim 3, characterized in that, The refractive index of the niobium oxide (Nb2O5) material layer (320) is 2.1-2.3, the refractive index of the tantalum oxide (Ta2O5) material layer (310) is 2-2.3, and the refractive index of the polymer waveguide material layer (330) is 1.7-1.

9.

5. The multifunctional photonic device based on a glass substrate according to claim 4, characterized in that, The polymer waveguide material layer (330) is a high-refractive-index lithography layer.

6. The multifunctional photonic device based on a glass substrate according to any one of claims 1-5, characterized in that, The glass substrate (100) has a thickness of 300 μm - 1 mm, the transition layer (200) has a thickness of 50 nm - 200 nm, the waveguide layer (300) has a thickness of 300 nm - 400 nm, the first boundary layer (600) has a thickness of 10 nm - 50 nm, and the second boundary layer (700) has a thickness of 10 nm - 50 nm.

7. The multifunctional photonic device based on a glass substrate according to claim 1, characterized in that, The waveguide layer (300) is integrated with a heterogeneous material chip structure, which includes at least one of the following functional units: a III-V compound semiconductor active device, a phase change material unit, a two-dimensional material unit, a piezoelectric material unit, or a sensing material unit.

8. The multifunctional photonic device based on a glass substrate according to claim 1, characterized in that, The glass substrate (100) is divided into at least three functional regions, which include at least a first functional region with a tantalum oxide (Ta2O5) material layer (310), a second functional region with a niobium oxide (Nb2O5) material layer (320), and a third functional region with a polymer waveguide material layer (330).

9. The multifunctional photonic device based on a glass substrate according to claim 8, characterized in that, The first functional area is located at the entrance of the external light source (900) of the photonic device. The tantalum oxide (Ta2O5) material layer (310) is configured to receive external input light and perform filtering or wavelength division multiplexing functions. The second functional area and the third functional area are arranged sequentially on the side of the first functional area away from the entrance of the external light source (900). The second functional area is optically coupled to the first functional area. The niobium oxide (Nb2O5) material layer (320) is configured to receive filtered light and realize low-loss optical signal distribution and routing. The third functional area is optically coupled to the second functional area. The polymer waveguide material layer (330) is configured to realize optical sensing or beam shaping functions. The optical signal is transmitted sequentially along the path of the first functional area, the second functional area, and the third functional area.

10. The multifunctional photonic device based on a glass substrate according to claim 8 or 9, characterized in that, The third functional region is located at the center of the photonic device, the second functional region is located on the opposite first and / or third side of the third functional region, and the first functional region is located on the second side of the third functional region.

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