Multi-surface adhesion device with angle tolerance and adhesion test system thereof

Abstract

The invention discloses a multi-surface adhesion device with angle tolerance and an adhesion test system thereof, and relates to the technical field of bionic adhesion. The adhesion device comprises an upper substrate layer, a lower substrate layer, a buffer layer located between the upper substrate layer and the lower substrate layer, a bionic nano array layer arranged on the surface of the upper substrate layer and a connecting structure penetrating through the buffer layer. The bionic nano array layer is composed of mushroom-shaped microstructures, and lossless and reversible adhesion is achieved through Van der Waals force. The buffer layer can deform along with the angular deviation of the target surface, and an angle tolerance of 0-15 degrees is provided. The testing system comprises a fixing frame, a simple pendulum suspension mechanism, an angle adjusting structure and a collision impulse control structure, and is used for simulating working conditions under different angles and impact conditions and carrying out standardized quantitative testing on the adhesion performance. Repeatable and lossless adhesion of the surfaces of various materials is achieved, stable performance can be kept within the range of 120-150 DEG C, and the method is suitable for surface fixing, temporary mounting and reinforcing tasks in a complex environment.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of bionic adhesion technology, in particular to a multi-surface adhesion device with angle tolerance and an adhesion test system thereof. BACKGROUND

[0002] In complex environments, there is an increasing demand for surface fixation, temporary installation and flexible clamping. However, traditional mechanical clamping, magnetic adhesion and electrostatic adhesion have certain limitations. For example, mechanical clamping can damage the target surface, magnetic adhesion is only suitable for metal materials, and electrostatic adhesion is greatly affected by environmental humidity and surface charge distribution. Therefore, it is of great significance to develop an efficient, stable and suitable adhesion device for various material surfaces. Existing new adhesion technologies include vacuum adhesion, electromagnetic adhesion and adhesive fixation, but all have limitations. Vacuum adhesion requires a specific airtight environment and is difficult to use in an open environment; electromagnetic adhesion is only effective for metals; and adhesives limit reusability due to aging and contamination. Therefore, there is an urgent need for a non-destructive, reusable and suitable adhesion solution for different materials.

[0003] In nature, geckos, insects and other organisms use their microscopic structures to achieve controllable and efficient adhesion through van der Waals forces, and have the characteristics of reusability. Inspired by this, bionic nano-adhesion technology has become a research hotspot. The patent document with publication number CN221921597U discloses a bionic microstructure adhesion device, which includes a rigid support layer and a microstructure layer on the surface thereof, and achieves surface adhesion through van der Waals forces. The device can provide a certain adhesion force to the surface under static conditions.

[0004] However, the above-mentioned invention has the following disadvantages: when there is an angle deviation or roughness change of the target surface, the microstructure does not fully contact the surface, resulting in a decrease in adhesion ability. In addition, the performance verification of the device mainly relies on static pull-off experiments, and there is a lack of standardized test methods for dynamic impact or collision conditions, which cannot accurately evaluate the adhesion effect of the device under instantaneous impact in actual application. SUMMARY

[0005] The purpose of the present application is to: 1. Provide a multi-surface adhesion device with angle tolerance, which can achieve non-destructive and reversible adhesion under different materials and contact angles.

[0006] 2. Provide a collision adhesion test system based on the principle of a simple pendulum, which can simulate the dynamic collision process in actual application and quantitatively verify the performance of the device.

[0007] In order to achieve the above-mentioned purposes, the present application adopts the following technical solutions: The adhesion device comprises an upper substrate layer (1), a lower substrate layer (2), a buffer layer (3), a biomimetic nano-array layer (4) and a connecting structure (5).

[0008] The upper substrate layer (1) and the lower substrate layer (2) are made of high-strength and light-weight materials (such as carbon fiber composite materials or aluminum alloy) to ensure the structural stability and light weight of the device, facilitating integrated application.

[0009] The buffer layer (3) is arranged between the upper substrate layer (1) and the lower substrate layer (2) and is composed of a flexible polymer material or an open-cell foam material, which is used to absorb impact and provide deformation space, so that the device can adapt to a surface angle deviation of 0-15°.

[0010] The biomimetic nano-array layer (4) is arranged on the outer surface of the upper substrate layer (1) and is fixed by flexible adhesion technology. The layer is composed of mushroom-shaped microstructures and realizes efficient and reversible adhesion by van der Waals force.

[0011] The connecting structure (5) penetrates the buffer layer (3) and is made of fine soft steel wire, elastic fiber or high-strength polymer fiber. The two ends are respectively arranged to penetrate the upper fixed hole (11) and the lower fixed hole (21) and are fixed to the upper substrate layer (1) and the lower substrate layer (2) by a mechanical method, so as to ensure that the upper substrate layer (1), the buffer layer (3) and the lower substrate layer (2) form a stable whole when bearing tensile stress, maintain the structural integrity of the device and provide high tensile strength.

[0012] In order to verify the performance of the adhesion device, the present application also provides a collision adhesion test system based on the principle of a simple pendulum, which comprises: A fixing frame (6) is used to install the adhesion object to be tested. A suspended simple pendulum structure (7) is connected with the adhesion device through a suspension rope and is used to simulate the free collision process in space operation. A first angle adjusting mechanism (8) is used to control the collision impulse by adjusting the initial height of the simple pendulum. A second angle adjusting mechanism (9) is used to change the contact angle of the adhesion device and the target surface, so as to realize the angle tolerance performance test. The test system can standardize the verification of the performance of the adhesion device under controllable impulse and angle conditions and truly simulate the dynamic adhesion working condition.

[0013] Compared with the prior art, the technical scheme of the present application has the following advantages: The device of the present application realizes lossless and reversible adhesion under an angle deviation of 0-15° through the synergistic effect of the biomimetic mushroom-shaped microstructure and the flexible buffer layer, which is suitable for various materials and complex surfaces and has the advantages of light weight and high strength.

[0014] The proposed test system is based on the principle of single pendulum impulse, which can quantitatively evaluate the adhesion performance under controllable impulse and angle conditions. The experimental conditions are repeatable and the data are accurate, which can truly simulate the actual working conditions of dynamic operation.

[0015] Excellent environmental adaptability and engineering application prospect. The adhesion device remains stable performance at extreme temperatures of-120℃ to 150℃, combined with the environmental simulation function of the test system, providing an integrated technical solution for surface fixation, temporary installation of components and flexible clamping in complex environments. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed in the description of the specific embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0017] Figure 1 The adhesion device structure schematic diagram provided by the present application is shown in the figure; Figure 2 The collision adhesion test system structure schematic diagram provided by the present application is shown in the figure; Figure 3 The single pendulum collision test principle schematic diagram provided by the present application is shown in the figure; Figure 4 The adhesion device test result diagram for glass surface under single pendulum test provided by the present application is shown in the figure; Figure 5 The adhesion device test result diagram for glass surface under-120℃-150℃ high and low temperature cycle test provided by the present application is shown in the figure; Figure 6 The adhesion device main body schematic diagram provided by the present application is shown in the figure. DETAILED DESCRIPTION

[0018] The present application will be described in detail below, and the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0019] 1. Preparation of biomimetic adhesion microarray The present application refers to the existing patent method (CN113148944A, CN112590083A) when preparing the biomimetic adhesion microarray, and adopts the dipping method to prepare the biomimetic microstructure. The method obtains a regularly arranged microstructure array by repeatedly dipping a high-viscosity elastomer precursor solution on an elastomer template with low surface energy and curing at a set temperature.

[0020] During the preparation process, by controlling the template surface features and the precursor curing conditions, a variety of microstructure units with different morphologies can be obtained, including cylindrical, conical, and mushroom-shaped. Among them, the mushroom-shaped microstructure can effectively increase the actual contact area during contact because the diameter of the top end is larger than that of the column, thereby significantly improving the adhesion strength and reversibility.

[0021] Therefore, the present application finally selects the mushroom-shaped biomimetic microstructure as the adhesion unit among a variety of candidate structures, and uses it for subsequent multi-surface adhesion device construction and performance testing 2. Multi-surface self-adaptive adhesion device construction Reference Figure 1 On the basis of the biomimetic adhesion microarray provided by the present application, a multi-surface adhesion device with angle tolerance function is further constructed, and the specific structure composition and assembly method are as follows: Upper substrate layer (1): 1 mm thick carbon fiber plate, used for setting the biomimetic nanoarray layer, providing lightweight and high-strength support.

[0022] Lower substrate layer (2): 5 mm thick aluminum alloy plate, as a rigid support and fixed interface.

[0023] Buffer layer (3): 10 mm thick open-cell polyurethane foam, bonded with the upper and lower substrate layers by high-strength double-sided adhesive, with good flexibility and elastic recovery capacity, capable of achieving 0-15° angle tolerance adjustment.

[0024] Biomimetic nanoarray layer (4): fixed to the outer surface of the upper substrate layer by silicone adhesive, composed of mushroom-shaped microstructures, capable of achieving efficient and reversible adhesion on various spatial material surfaces.

[0025] Connection structure (5): 0.3 mm high-strength steel wire, sequentially penetrating the upper fixing hole (11), the buffer layer, and the lower fixing hole (21), with both ends knotted and fixed with adhesive, ensuring the stability and high tensile strength of the overall structure Through the synergistic design of the above multi-layer composite structure, the device significantly improves the adaptability to different surface topographies and angle deviations, while having excellent reusability and spatial environmental stability, and can be widely used in surface fixation, temporary installation of components, and flexible clamping in complex environments.

[0026] 3. Design of single pendulum collision test system To comprehensively evaluate the performance of the adhesion device, a special pendulum test system was designed, which has the following characteristics: Figure 2 and Figure 3 The special pendulum test system was designed, which has the following characteristics: The fixed frame (6) is used to install the adhesion object and ensure the stability of the target position during the test; The suspended pendulum structure (7) is connected to the adhesion device through a suspension rope, which eliminates the interference of gravity on the adhesion force test; The first angle adjustment mechanism (8) adjusts the initial height of the pendulum to achieve different collision impulses; The second angle adjustment mechanism (9) adjusts the contact angle of the adhesion device and the target surface to simulate a 0-15° angle deviation and achieve angle tolerance testing.

[0027] The system installs the adhesion object on the fixed frame and maintains vertical contact with the adhesion device below through a suspension rope to eliminate the interference of gravity on the adhesion force test. The suspension rope is set to 1.005 m long, and the adhesion device weighs 1.204 kg. By changing the suspension angle a, the collision impulse can be adjusted to test the adhesion performance of the device on different materials. By adjusting the fixed frame angle β, the contact angle can be simulated to change from 0 to 15°, thereby testing the angle tolerance capability.

[0028] Different surface tests According to Figure 4 , a pendulum collision adhesion test was carried out on a glass surface as a typical adhesion object under a load of 1 kg. By adjusting the suspension angle a, the initial height was controlled to obtain different collision impulses. The fixed frame angle β was adjusted at intervals of 5° from 0° to 10° to simulate the contact angle deviation. The test results showed that when the impulse was 0.76 Ns, 1.22 Ns and 2.41 Ns, the device could achieve stable adhesion, and the results are shown in the following table: Adherend Test conditions Suspension angle Mount angle Impulse size Glass surface 1 11.5 0 Impulse 0.76 Ns 2 18 0 Impulse 1.22 Ns 3 18 5 Impulse 1.22 Ns 4 18 10 Impulse 1.22 Ns 5 36 0 Impulse 2.41 Ns 6 36 5 Impulse 2.41 Ns 7 36 10 Impulse 2.41 Ns The comprehensive results show that the device can maintain stable performance in the typical impulse range of 0.76 Ns to 2.41 Ns, and has the ability to adapt to a wider range of impulses, meeting the adhesion requirements under different intensity impacts.

[0029] In addition, although this embodiment only uses a glass surface as the test object, the device is also suitable for various engineering surfaces such as metal plates, phased array antennas and coated structures, showing good multi-surface adaptability and application value.

[0030] 5. High temperature cycle test In addition, to investigate the performance stability of the adhesion device in extreme environments, reference Figure 5High-low temperature cycle test was carried out. In the temperature range of-120°C to 150°C, the temperature was changed in steps of 20°C, each temperature point was kept for 5 min, and the adhesion test was carried out on the glass surface. The test results show that the adhesion performance of the device remains stable in the whole temperature range, and no obvious decay occurs, which verifies the good high-low temperature environment adaptability.

[0031] In addition, the device is not only suitable for glass surfaces, but also can maintain reliable adhesion performance under cold and hot alternating conditions on metal plates, phased array antennas, coated structures and other surfaces.

[0032] In summary, the adhesion device proposed in the application significantly improves the adhesion performance under different surface topography and angle deviation conditions through the synergistic design of mushroom-shaped microstructure and flexible buffer layer. Experimental results show that the device can not only work stably under the typical impulse condition of 0.76 Ns-2.41 Ns, but also has the ability to adapt to a wider impulse range. At the same time, under the high-low temperature cycle condition of-120°C to 150°C, its adhesion performance remains stable, showing excellent environmental adaptability and durability.

[0033] In addition, the device has the characteristics of non-destructive, reversible and reusable, and is suitable for a variety of typical surfaces, including glass, metal plates, phased array antennas, coated structures and the like. In practical applications, the device can be widely used in temporary fixing and surface mounting of engineering structures, flexible clamping and handling operations in complex environments, reversible connection and disassembly between multi-material surfaces, and stable surface attachment under high-low temperature conditions.

[0034] In summary, the adhesion device proposed in the application has good environmental adaptability, structural compatibility and multi-scene applicability, and has broad application prospects in the fields of industrial manufacturing, detection and maintenance, automation clamps and flexible operation.

[0035] The above description enables those skilled in the art to implement or use the application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the application. Therefore, the application will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-surface adhesion device with angular tolerance and its adhesion testing system, characterized in that: The adhesion device includes an upper substrate layer (1), a lower substrate layer (2), a buffer layer (3) disposed between the two, a biomimetic nanoarray layer (4) located on the upper substrate layer (1) away from the buffer layer (3), and a connection structure (5) penetrating the buffer layer (3). The upper substrate layer (1) and the lower substrate layer (2) are made of carbon fiber composite material or aluminum alloy to provide strength and lightweight performance of the overall structure; The buffer layer (3) is made of flexible polymer or open-cell foam material, which can absorb impact and generate controllable deformation when there is an angular deviation of 0 to 15° on the target surface, so as to maintain full contact between the biomimetic nanolayer (4) and the target surface. The biomimetic nanoarray layer (4) is composed of mushroom-shaped microstructures, which achieve non-destructive and reversible adhesion through van der Waals forces; The connecting structure (5) is made of steel wire rope, elastic fiber or high fiber strength reinforced material, penetrates the buffer layer (3) and is connected to the upper base layer (1) and the lower base layer (2) respectively, so as to form a stable whole when subjected to tensile stress; The adhesion testing system is built on the single-frame principle and includes a fixed frame (6), a suspended pendulum structure (7) and an angle adjustment mechanism (8) to adjust the contact angle and impact impulse between the adhesion device and the target surface, thereby realizing the adhesion performance test and quantitative evaluation under dynamic impact conditions with different angles and impulses.

2. The multi-surface adhesion device with angular tolerance according to claim 1, characterized in that: The buffer layer (3) is connected to the upper base layer (1) and the lower base layer (2) by one of the following methods: adhesive bonding, hot pressing or mechanical fixation.

3. The multi-surface adhesion device with angular tolerance according to claim 1, characterized in that: The connecting structure (5) is a thin and soft steel wire rope, elastic fiber or high-strength polymer fiber.

4. The multi-surface adhesion device with angular tolerance according to claim 1, characterized in that: The upper base layer (1) and the lower base layer (2) are respectively provided with an upper fixing hole (11) and a lower fixing hole (21). The two ends of the connecting structure (5) pass through the upper fixing hole (11) and the lower fixing hole (21) respectively and are fixed.

5. The multi-surface adhesion device with angular tolerance according to claim 1, characterized in that: The biomimetic nanoarray layer (4) is fixed to the surface of the upper substrate layer (1) by flexible adhesion technology. It is composed of mushroom-shaped microstructures and can be prepared by dip-taking, etching or 3D printing.

6. The multi-surface adhesion device with angular tolerance according to claim 1, characterized in that: The upper substrate layer (1) and the lower substrate layer (2) are made of carbon fiber composite material or aluminum alloy, and the buffer layer is made of flexible polymer or open-cell foam material.

7. The multi-surface adhesion device with angular tolerance according to claim 1, characterized in that: The device can maintain repeatable adhesion function within a temperature range of -120°C to 150°C.

8. A collision adhesion test system for verifying the performance of a multi-surface adhesion device with angular tolerance as described in claim 1, characterized in that: The aforementioned testing system includes Fixture (6) is used to mount the object to be adhered; The suspended pendulum structure (7) is connected to the adhesive device by a suspension rope; The first angle adjustment mechanism (8) is used to adjust the initial height and impulse of the suspension. The second angle adjustment mechanism (9) is used to adjust the contact angle between the adhesive device and the adhesive object.

9. The testing system according to claim 8, characterized in that: The system includes an angle adjustment mechanism and an impulse control structure. The angle adjustment mechanism can precisely adjust the contact angle between the adhesive device and the target surface within the range of 0° to 15°. The impulse control structure can adjust the impact impulse within the range of 0.1Ns to 3Ns to quantitatively test the adhesive performance of the adhesive device under different angles and impact conditions.

Images