Laser processing grinding wheel and preparation method thereof

Abstract

The invention belongs to the technical field of precision grinding tool manufacturing, discloses a laser processing grinding wheel and a preparation method thereof, and aims to solve the problems that in the prior art, the bonding strength of a grinding material layer and a base body is weak, and harsh grinding requirements such as high-speed grinding, heavy-load grinding and composite material large-engagement synchronous grinding are difficult to meet. A laser machining grinding wheel comprises a grinding wheel base body and a grinding wheel abrasive layer. Inclined array blind holes are formed in the surface of the grinding wheel base body, and the grinding wheel abrasive layer is located on the surface of the grinding wheel base body and in the array blind holes. The raw materials of the grinding wheel abrasive material layer comprise amido modified titanate and phthalonitrile resin. According to the grinding wheel, the grinding material layer containing the phthalonitrile resin is subjected to 3D photocuring forming through the large-focus laser, the blind hole array is fully filled with the high-temperature-resistant, low-shrinkage and high-strength grinding material layer, and the grinding wheel product which is formed by high-strength combination of the grinding material layer and the base body and can be used at the high temperature for a long time is obtained.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of precision abrasive tool manufacturing, in particular to a preparation method of a grinding wheel. BACKGROUND

[0002] With the continuous emergence of new materials and new processes, enterprises have increasingly high requirements for grinding processing quality and efficiency. Among them, high-speed grinding, heavy-load grinding, and large-cut synchronous grinding of composite materials require the abrasive layer of the grinding wheel to have sufficient high-temperature resistance and impact resistance, and stricter requirements are also put forward for the bonding strength of the abrasive layer and the substrate of the grinding wheel.

[0003] Photocurable resin is widely used in printing, packaging, electronics, dentistry and other industries due to its energy-saving and efficient characteristics. Commercially available photocurable resins are mainly composed of resin monomers and prepolymers, containing active functional groups that can initiate polymerization under light irradiation with a photosensitizer. In the abrasive tool industry, photocurable resins are mainly used in the preparation of flexible coated abrasive tools such as sandpaper. Common photocurable resins in the abrasive tool industry include acrylic resin, epoxy resin, polyimide, phenolic resin, and hybrid resin.

[0004] Phthalonitrile resin is a new type of thermosetting resin (Table 1) with excellent thermal stability and mechanical properties, and has been widely used in the fields of aviation technology, electronic engineering, and mechanical manufacturing. However, without a catalyst, traditional phthalonitrile resin requires nearly 100 hours of heating at 280°C to observe significant gelation, which is extremely time-consuming. Currently, research on phthalonitrile resin mainly focuses on reducing its curing temperature, imparting self-catalytic properties, and modifying other resins. Phthalonitrile resin has higher heat resistance and abrasive holding force than phenolic resin and polyimide resin commonly used in grinding wheel production, but its high curing temperature, long curing time, and high production cost have strictly limited its widespread application.

[0005] Table 1 The prior art such as patent CN105196196A (abrasive ordered arrangement of electroplated diamond grinding wheel) opens the ordered arrangement of blind holes on the surface of the base body, the purpose is to improve the holding force of the electroplated diamond grinding wheel coating on the abrasive, the abrasive blade height and the service life of the grinding wheel. The patent does not explicitly state the opening method of the grinding wheel, and the small shallow holes it opens can only accommodate a small part of a single abrasive powder (the hole depth is 20%-30% of the average particle size of the abrasive), which is similar to the surface sandblasting and shot blasting treatment, and the contribution to improving the bonding strength of the abrasive layer and the base body is very limited. In addition, enterprises will use methods such as gluing, adding a transition layer, sandblasting, and grooving to increase the bonding strength of the abrasive layer and the base body. Although these methods can improve the bonding strength to some extent, they still have deficiencies when facing harsh grinding requirements such as high-speed grinding, heavy load grinding, and composite material large infeed synchronous grinding. Therefore, it is urgent to propose an innovative grinding wheel preparation method to better meet these high-demand grinding scenarios, thereby improving the bonding strength of the abrasive layer and the base body while further improving the performance and service life of the grinding wheel. SUMMARY

[0006] In view of the above technical problems, the present application provides a laser processing grinding wheel and a preparation method thereof.

[0007] To achieve the above object, the technical scheme of the present application is as follows: A laser processing grinding wheel, comprising a grinding wheel base body and a grinding wheel abrasive layer; wherein the surface of the grinding wheel base body is provided with an array of inclined blind holes, and the grinding wheel abrasive layer is located on the surface of the grinding wheel base body and in the array of blind holes; the raw material of the grinding wheel abrasive layer comprises amine-modified titanate and phthalonitrile resin.

[0008] Further, the raw material of the grinding wheel abrasive layer comprises 10-40 wt% abrasive, 10-40 wt% phthalonitrile resin, 1-10 wt% amine-modified titanate and 20-50 wt% auxiliary materials.

[0009] The above phthalonitrile resin is a main chain containing amine group phthalonitrile resin, such as TPN-03, PN-2524, etc. The resin powder has three main functions: first, the resin is a new type of heat-resistant resin powder, which can withstand the high temperature of laser 3D photocuring, and the glass transition temperature after curing can reach more than 300℃, and the grinding performance is excellent. Second, the resin melts quickly during laser processing, and the cross-linked strength of the resin after curing is high (forming heterocyclic structures such as oxazine ring, phthalocyanine ring, isoindoline ring, etc.), which has good holding force on the abrasive, and the grinding wheel has long service life. Third, the volume of the resin changes little before and after curing, which can be well filled in the micro-pore array and has strong riveting effect with the substrate. Among them, the amine group plays a catalytic curing role, which can reduce the curing time and temperature, and improve the production efficiency. The abrasive coating is a transition metal, which can also improve the cross-linking speed of the resin to a certain extent.

[0010] The above amine-modified titanate (such as KR-44, GR-311W, etc.) has two main functions: the multi-functional groups (such as mono-alkoxy, amine group and aromatic group) in the titanate respectively adhere to inorganic particles and resin powder, playing a bridging role to strengthen the binding strength between the abrasive, auxiliary material and resin; the amine group in the strengthening agent can catalyze the curing of the resin, which can greatly accelerate the 3D photocuring process of the abrasive layer and improve the strength after curing.

[0011] The above abrasive is diamond or cubic boron nitride with a plated layer on the surface. Further, the material of the plated layer is selected from any one of titanium, titanium carbide, titanium nitride, aluminum titanium nitride and titanium carbonitride. The plated abrasive has four main functions: first, the bonding strength between the plated abrasive and the resin powder is high, the grinding wheel has long service life and good impact resistance. Second, the titanium-plated or titanium carbide-plated abrasive can withstand high temperatures during laser 3D photocuring and subsequent grinding, reducing thermal degradation and oxidation of the abrasive. Third, the plated metal has good thermal conductivity, which can improve the heat transfer efficiency of 3D photocuring. Fourth, the titanium element on the surface of the plated layer has good compatibility with the resin powder (promoting curing) and the strengthening agent (containing titanium system).

[0012] Further, the above auxiliary material includes but is not limited to at least one of titanium hydride powder, zinc oxide, copper powder, graphite powder and silicon carbide. The function of the auxiliary material is to promote resin curing, resin reinforcement, improve thermal conductivity, reduce grinding power consumption and assist grinding, etc.

[0013] The above method for preparing a laser processing grinding wheel has the following steps: (1) a. Process the substrate material to the size of the drawing. The substrate material includes but is not limited to titanium alloy and titanium-containing composite material. The mechanical properties of the substrate need to ensure the safe use of the grinding wheel. Titanium alloy has low density, high specific strength and strong high-temperature resistance, which is more suitable for high-speed and high-grinding resistance environments. b. Clean and dry the processed substrate material to make the surface of the substrate material clean and free of foreign matter.

[0014] (2) Fix the substrate after step (1), and use high-energy laser to punch the substrate to form an array of inclined blind holes on the surface of the substrate. Specifically, the substrate is fixed on the rotating shaft of the laser equipment, and after starting, the substrate can rotate at a constant speed to ensure that the laser can irradiate all the areas to be processed, and then high-energy laser is used to punch the substrate. The power of high-energy laser should be enough to melt the substrate material (more than 10-100℃ above the melting point of the substrate material). The punching position is the bonding surface of the substrate and the abrasive layer. The hole is an inclined blind hole, and the inclination angle with the vertical direction is 10-80°. Further, the inclination angle with the vertical direction is 20-60°. To ensure the holding of the blind hole to the abrasive layer, the raw material powder of the abrasive layer of the grinding wheel should be fully entered into the blind hole, and the diameter D of the blind hole should be 2-6 times the diameter of the coarsest powder in the raw material, and the depth should be 1-20 times the diameter of the coarsest powder in the raw material. 孔 To improve the bonding strength, the direction of the blind hole is perpendicular to the stress direction (the resultant force of the tangential force and the axial force) of the abrasive layer of the grinding wheel. The inclined blind hole can resist the tangential force and the axial force during the use of the grinding wheel, effectively preventing the grinding wheel from coming off the ring. For the grinding wheel with uncertain grinding force direction, two or more blind hole arrays with different directions can be matched to offset the stress during the use of the grinding wheel.

[0015] In addition, according to the preset punching path, the substrate is rotated and the laser is moved synchronously to form an array of inclined micro-holes on the bonding surface of the substrate. The number and arrangement of the micro-holes need to ensure the bonding strength of the abrasive layer and the substrate, and meet the high-speed and safe use of the grinding wheel. The estimation formula of the number of micro-holes N is as follows: In the formula, N 切向 is the minimum number of micro-holes required for the grinding wheel to resist the tangential force during grinding, F 切向 is the tangential force suffered by the grinding wheel during grinding, F 剪切 is the shear strength of the abrasive layer of the grinding wheel, S 总 is the area of the bonding surface of the abrasive layer of the grinding wheel, S1 is the cross-sectional area of the laser micro-hole, N 轴向 is the minimum number of micro-holes required for the grinding wheel to resist the axial force during grinding, F 轴向 is the axial force suffered by the grinding wheel during grinding, S2 is the longitudinal cross-sectional area of the laser micro-hole, N is the minimum number of micro-holes required for the grinding wheel to resist all forces during grinding, Max is the larger value of the two, and K is the safety factor (generally 1.1-2.0). The tangential force F 切向 and the axial force F 轴向 suffered by the grinding wheel during grinding are related to the grinding parameters and can be measured or simulated. The shear strength F 剪切 of the abrasive layer of the grinding wheel is measured and related to the formula of the abrasive layer of the grinding wheel.

[0016] (3) After the abrasive layer raw materials are uniformly mixed, the laser 3D printing equipment is introduced, and the powder is laid on the surface of the base body and in the array blind hole layer by layer, the laser light curing treatment is used to treat the raw material powder, the abrasive layer is formed, and then the laser processing grinding wheel is formed. The laser 3D printing equipment and the later laser light curing can be collectively referred to as a laser 3D light curing equipment, and the following is not described in detail.

[0017] Specifically, S1. The abrasive layer raw materials are mixed uniformly and poured into the 3D light curing device. S2. The laser-processed base body is placed in the forming chamber and positioned at the origin. S3. The abrasive layer is formed by using the laser 3D light curing equipment. The abrasive layer raw material powder reaches the surface of the base body and the inside of the micro-hole array through the nozzle. The large focal point laser increases the irradiation area and reduces the energy density, and can quickly melt and solidify the resin powder. According to the characteristics of the raw material powder, the laser beam diameter is 50 μm-5 mm, and the molten pool (or binder molten pool) temperature is 240℃-290℃. The nozzle feeds layer by layer, and the laser quickly solidifies the resin powder. The binding of the binder in the micro-hole array and the base body is very firm, achieving the effect of improving the bonding strength of the two.

[0018] S4. After inspection, it becomes a finished grinding wheel.

[0019] The present application has the following beneficial effects: (1) The present application uses high-energy laser to form an inclined blind hole array on the bonding surface of the grinding wheel, thereby improving the bonding strength of the abrasive layer and the base body. The large focal point laser is used for 3D light curing forming of the abrasive layer containing phthalonitrile resin, so that the blind hole array is fully filled with abrasive layer with high temperature resistance, low shrinkage and high strength, and a grinding wheel with high strength bonding between the abrasive layer and the base body is obtained.

[0020] (2) The present application innovatively proposes a 3D light curing process of phthalonitrile resin powder. The components synergize with each other, and the abrasive, the reinforcing agent and the auxiliary material promote the rapid curing of the resin powder under the action of laser, so that the heat resistance of the cured binder is improved by 100℃-150℃ compared with the traditional phenolic binder, the shrinkage is reduced by 50%, and the strength and holding force are improved by about 100%.

[0021] (3) The operation of laser processing and punching blind holes is simple, the designability (array form, hole size, hole direction, hole number) of the blind hole array is good, and it can be used for grinding wheels of various specifications and models. During the forming process, the abrasive layer in a molten state can fully enter the inclined blind hole array. After solidification, the abrasive layer has almost no shrinkage, the bonding force with the base body is strong, the safety of the grinding wheel is good, and it can be used for the production of high-speed and complex load grinding wheels.

[0022] (4) The grinding wheel preparation (substrate processing and abrasive layer forming) of the present invention only requires one laser printing equipment, without the need for customized molds and high-temperature heating equipment, and the processing cost is low. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 The diagram shows four typical array arrangement methods (front view combined with the plane).

[0025] Figure 2 This is a schematic diagram of the laser processing of abrasive wheels; where 1 is the 3D photopolymerization device, 2 is the feeding nozzle, 3 is the optical path channel, 4 is the high-energy laser, 5 is the substrate, 6 is the rotating axis, 7 is the array of blind holes (micro-holes), 8 is the raw material powder for the abrasive layer, 9 is the large-focus laser, and 10 is the cured abrasive layer.

[0026] Figure 3 A schematic diagram showing the tangential force, axial force, and resultant force exerted on the abrasive material inside a blind hole.

[0027] Figure 4 This is a 3D photocuring reaction of phthalic acid resin.

[0028] Figure 5 This refers to the synergistic effect between the different components of the grinding wheel.

[0029] Figure 6 This is a comparison of the performance of coated abrasives and ordinary abrasives. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1 The method for preparing the laser-processed grinding wheel in this embodiment is illustrated in the schematic diagram of the processing procedure. Figure 2 As shown, the specific steps are as follows: (1) The TC4 titanium alloy substrate 5 is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0032] (2) Fix the substrate on the rotating shaft 6 of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser 4 to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micro-holes) 7. The holes are inclined blind holes with a diameter of 100 μm, a depth of 200 μm, and an inclination angle of 60° to the vertical direction. The size of the micro-holes needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0033] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 5966 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 25 MPa and 10 MPa, respectively. 剪切 The pressure is 60 MPa. The safety factor K is 1.2.

[0034] A schematic diagram of the tangential force, axial force, and resultant force exerted on the abrasive inside the blind hole is shown below. Figure 3 As shown, → and ↑ represent the force direction of the abrasive layer, S1 is the cross section of the abrasive layer bearing tangential force in the blind hole, and S2 is the cross section of the abrasive layer bearing axial force in the blind hole; to clearly demonstrate the arrangement and angle of the blind holes, the blind holes in the schematic diagram are enlarged and are not at the actual scale. According to the preset drilling path, the substrate is rotated and the laser is moved synchronously to make the substrate bonding surface evenly distributed with an inclined array of microholes. The number of microholes can be calculated according to formulas (1)-(3) to ensure the bonding strength between the abrasive layer and the substrate and to meet the requirements of high-speed and safe use of the grinding wheel.

[0035] According to the preset drilling path ( Figure 1-1 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈316700, N 轴向 ≈198900, therefore the required tilted micropores N≈380040.

[0036] (3) Weigh out 35 wt% titanium carbide-coated diamond, 25 wt% TPN-03 phthalonitrile resin, 7 wt% KR-44 amine-modified titanate reinforcing agent, 10 wt% titanium hydride powder, 5 wt% zinc oxide, 13 wt% copper powder, and 5 wt% graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 30 micrometers.

[0037] (4) Mix the abrasive layer raw material powder 8 from step (3) thoroughly and evenly, and pour it into the 3D photocuring device 1.

[0038] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0039] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 100 μm and the binder melt pool temperature is 250±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer 10, i.e., the grinding wheel abrasive layer.

[0040] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0041] Example 2 The method for preparing the laser-processed grinding wheel in this embodiment includes the following steps: (1) The TC11 titanium alloy substrate 5 is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0042] (2) Fix the substrate on the rotating shaft 6 of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser 4 to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micro-holes) 7. The holes are inclined blind holes with a diameter of 400 μm, a depth of 2000 μm, and an inclination angle of 20° to the vertical direction. The size of the micro-holes needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0043] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 7536 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 30 MPa and 15 MPa, respectively. 剪切 The pressure is 65 MPa. The safety factor K is 1.5.

[0044] According to the preset drilling path ( Figure 1-3 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈27692, N 轴向 ≈8695, therefore the required tilted micropores N≈41538.

[0045] (3) Weigh out 30 wt% of titanium-plated cubic boron nitride, 30 wt% of PN-2524 phthalonitrile resin, 5 wt% of GR-311W amine-modified titanate reinforcing agent, 5 wt% of titanium hydride powder, 5 wt% of zinc oxide, 15 wt% of copper powder, and 10 wt% of silicon carbide as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available, and the particle size is less than 130 micrometers.

[0046] (4) Mix the abrasive layer raw material powder 8 from step (3) thoroughly and evenly, and pour it into the 3D photocuring device 1.

[0047] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0048] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 400 μm and the binder melt pool temperature is 260±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer 10, i.e., the grinding wheel abrasive layer.

[0049] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 11V2-250*70*50*10*5mm).

[0050] 3D photocuring reaction of phthalonitrile resin as follows Figure 4 As shown, in the resin curing reaction formula, functional group R1 is a carbon chain, and its side branches may contain groups that promote curing, such as amine groups. R2 is an inorganic-loving group of the reinforcing agent, such as a monoalkoxy group. R3 is a resin-loving group of the reinforcing agent (amine-modified titanate), which is a group containing amine groups that promotes curing. R4 is the heterocyclic structure with a network crosslinking obtained after resin curing.

[0051] Depend on Figure 5 It can be seen that, macroscopically, both the substrate and abrasive layer formulations with blind hole arrays are titanium-containing or titanium-affinity systems, exhibiting good bonding and impact resistance, meeting the stringent grinding requirements of high-speed grinding, heavy-load grinding, and simultaneous grinding of composite materials with large depths of cut. Microscopically, the powder components in the formulation are also titanium-containing or titanium-affinity systems, with good bonding between different raw material powders. Specifically, the high-temperature resistant resin powder mainly provides support and holding for other powders, forming the system's framework. The abrasive surface has a titanium-containing coating, significantly improving heat resistance and oxidation resistance, making it more compatible with resin laser forming processes and promoting resin powder curing, primarily serving a grinding function. The reinforcing agent is the hub of the binder system, interacting with all other raw material components. The titanium-containing reinforcing agent can accelerate and participate in the curing of the binder, and also has affinity with the coated abrasive and auxiliary powders, achieving a bridging effect throughout the system. The auxiliary materials mainly play a role in promoting resin curing, resin reinforcement, improving thermal conductivity, reducing grinding power consumption, and assisting grinding. They are an indispensable component of the binder system.

[0052] Example 3 The specific steps of the laser-processed grinding wheel preparation method in this embodiment are as follows: (1) The TC4 titanium alloy substrate 5 is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0053] (2) Fix the substrate on the rotating shaft 6 of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser 4 to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micro-holes) 7. The holes are inclined blind holes with a diameter of 100 μm, a depth of 200 μm, and an inclination angle of 60° to the vertical direction. The size of the micro-holes needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0054] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 5966 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 25 MPa and 10 MPa, respectively. 剪切 The pressure is 60 MPa. The safety factor K is 1.2.

[0055] According to the preset drilling path ( Figure 1-1 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈316700, N 轴向 ≈198900, therefore the required tilted micropores N≈380040.

[0056] (3) Weigh out 40 wt% titanium carbide-coated diamond, 10 wt% TPN-03 phthalonitrile resin, 8 wt% KR-44 amine-modified titanate reinforcing agent, 11 wt% titanium hydride powder, 7 wt% zinc oxide, 15 wt% copper powder, and 9 wt% graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 20 micrometers.

[0057] (4) Mix the abrasive layer raw material powder 8 from step (3) thoroughly and evenly, and pour it into the 3D photocuring device 1.

[0058] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0059] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 50 μm and the binder melt pool temperature is 280±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer 10, i.e., the grinding wheel abrasive layer.

[0060] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0061] Example 4 The specific steps of the laser-processed grinding wheel preparation method in this embodiment are as follows: (1) The TC4 titanium alloy substrate 5 is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0062] (2) Fix the substrate on the rotating shaft 6 of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser 4 to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micro-holes) 7. The holes are inclined blind holes with a diameter of 100 μm, a depth of 200 μm, and an inclination angle of 60° to the vertical direction. The size of the micro-holes needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0063] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 5966 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 25 MPa and 10 MPa, respectively. 剪切 The pressure is 60 MPa. The safety factor K is 1.2.

[0064] According to the preset drilling path ( Figure 1-1 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈316700, N 轴向 ≈198900, therefore the required tilted micropores N≈380040.

[0065] (3) Weigh out 10 wt% titanium carbide-coated diamond, 30 wt% TPN-03 phthalonitrile resin, 10 wt% KR-44 amine-modified titanate reinforcing agent, 11 wt% titanium hydride powder, 14 wt% zinc oxide, 16 wt% copper powder, and 9 wt% graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 50 micrometers.

[0066] (4) Mix the abrasive layer raw material powder 8 from step (3) thoroughly and evenly, and pour it into the 3D photocuring device 1.

[0067] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0068] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 50 μm and the binder melt pool temperature is 250±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer 10, i.e., the grinding wheel abrasive layer.

[0069] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0070] Example 5 The specific steps of the laser-processed grinding wheel preparation method in this embodiment are as follows: (1) The TC11 titanium alloy substrate 5 is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0071] (2) Fix the substrate on the rotating shaft 6 of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser 4 to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micro-holes) 7. The holes are inclined blind holes with a diameter of 400 μm, a depth of 2000 μm, and an inclination angle of 20° to the vertical direction. The size of the micro-holes needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0072] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 7536 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 30 MPa and 15 MPa, respectively. 剪切 The pressure is 65 MPa. The safety factor K is 1.5.

[0073] According to the preset drilling path ( Figure 1-3 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈27692, N 轴向 ≈8695, therefore the required tilted micropores N≈41538.

[0074] (3) Weigh out 33 wt% of titanium-plated cubic boron nitride, 40 wt% of PN-2524 phthalonitrile resin, 7 wt% of GR-311W amine-modified titanate reinforcing agent, 5 wt% of titanium hydride powder, 5 wt% of zinc oxide, 7 wt% of copper powder, and 3 wt% of silicon carbide as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 130 micrometers.

[0075] (4) Mix the abrasive layer raw material powder 8 from step (3) thoroughly and evenly, and pour it into the 3D photocuring device 1.

[0076] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0077] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 400 μm and the binder melt pool temperature is 260±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer 10, i.e., the grinding wheel abrasive layer.

[0078] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 11V2-250*70*50*10*5mm).

[0079] Comparative Example 1 The preparation method of the grinding wheel in this comparative example differs from that in Example 1 in that the substrate bonding surface is only a conventional sandblasting surface. The specific preparation steps are as follows: (1) The TC4 titanium alloy substrate is machined to the dimensions shown in the drawing, and the mating surface of the machined substrate is sandblasted to increase the surface roughness of the substrate.

[0080] (2) The substrate is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0081] (3) Weigh out 35 wt% titanium carbide-coated diamond, 25 wt% TPN-03 phthalonitrile resin, 7 wt% KR-44 amine-modified titanate reinforcing agent, 10 wt% titanium hydride, 5 wt% zinc oxide, 13 wt% copper powder, and 5 wt% graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 30 micrometers.

[0082] (4) Mix the abrasive layer raw material powder from step (3) thoroughly and evenly, and pour it into the 3D photocuring device.

[0083] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0084] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder reaches the substrate surface and the interior of the micropore array through the feeding nozzle 2. The laser beam diameter is 100 μm, and the binder melt pool temperature is 250±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer, i.e., the grinding wheel abrasive layer.

[0085] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0086] Both Example 1 and Comparative Example 1 used 6A2-200*30*30*10*10mm type grinding wheels (end-face grinding wheels) with the same formulation and substrate material. The difference was that the substrate mating surface of Example 1 was densely covered with blind holes of 100 μm diameter, 200 μm depth, and tilted at a 60° angle to the vertical direction, while the substrate mating surface of Comparative Example 1 was only a standard sandblasted surface. The rotational tests (GB / T 2493-2013 Rotational Test Method for Grinding Wheels) of Example 1 and Comparative Example 1 were compared, and the results are shown in Table 2.

[0087] Table 2 Comparison of Example 1 and Comparative Example 1 As shown in Table 2, the combination of laser blind hole array and laser 3D curing process greatly improves the grinding wheel rotation safety of Example 1, and can better meet the demanding grinding requirements such as high-speed grinding, heavy-load grinding, and synchronous grinding of composite materials with large depth of cut.

[0088] Comparative Example 2 The preparation method of the grinding wheel in this comparative example differs from that in Example 1 in that it uses ordinary diamond raw material as the abrasive. The specific preparation steps are as follows: (1) The TC4 titanium alloy substrate is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0089] (2) Fix the substrate on the rotating shaft of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micropores). The holes are inclined blind holes with a diameter of 100 μm, a depth of 200 μm, and an inclination angle of 60° to the vertical direction. The size of the micropores needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0090] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 5966 mm 2 The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 25 MPa and 10 MPa, respectively. 剪切 The pressure is 60 MPa. The safety factor K is 1.2.

[0091] According to the preset drilling path ( Figure 1-1 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈316700, N 轴向 ≈198900, therefore the required tilted micropores N≈380040.

[0092] (3) Weigh out 35 wt% of ordinary diamond raw material, 25 wt% of TPN-03 phthalonitrile resin, 7 wt% of KR-44 amine-modified titanate reinforcing agent, 10 wt% of titanium hydride, 5 wt% of zinc oxide, 13 wt% of copper powder, and 5 wt% of graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 30 micrometers.

[0093] (4) Mix the abrasive layer raw material powder from step (3) thoroughly and evenly, and pour it into the 3D photocuring device.

[0094] (5) Place the laser-processed substrate in the forming chamber and locate the origin.

[0095] (6) The abrasive layer is formed using a laser 3D photopolymerization device. The abrasive layer raw material powder is fed to the substrate surface and the interior of the micropore array through the feeding nozzle. The laser beam diameter is 100 μm and the binder melt pool temperature is 250±10℃. The nozzle feeds the material layer by layer, and the laser quickly solidifies the resin powder to form the solidified abrasive layer, i.e., the grinding wheel abrasive layer.

[0096] (10) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0097] Figure 6 shows micrographs of the surfaces of the grinding wheels prepared in Example 1 and Comparative Example 2. It can be seen that the coated abrasive has good heat resistance and maintains better holding force after laser processing. Comparative Example 2 uses ordinary abrasive, and there is significant abrasive shedding. In practical use, the grinding wheel of Example 1 has a longer lifespan and higher grinding efficiency, and can better meet the demanding grinding requirements of high-speed grinding, heavy-duty grinding, and simultaneous grinding of composite materials with large depths of cut.

[0098] Comparative Example 3 The preparation method of the grinding wheel in this comparative example differs from that in Example 1 in that the resin material used is different. The specific steps are as follows: (1) The TC4 titanium alloy substrate is machined to the dimensions shown in the drawing, and the machined substrate material is washed and dried to make the surface of the substrate material clean and free of foreign matter.

[0099] (2) Fix the substrate on the rotating shaft of the laser device. After startup, the substrate can rotate at a constant speed. Use a high-energy laser to drill holes on the outer circular surface of the substrate to form an inclined array of blind holes (micropores). The holes are inclined blind holes with a diameter of 100 μm, a depth of 200 μm, and an inclination angle of 60° to the vertical direction. The size of the micropores needs to facilitate the entry of the raw material powder of the subsequent abrasive layer.

[0100] The bonding area S between the abrasive layer and the substrate of the grinding wheel 总 5966 mm 2The tangential force F experienced by the grinding wheel during the grinding process. 切向 and axial force F 轴向 The shear strength F of the abrasive layer is 25 MPa and 10 MPa, respectively. 剪切 The pressure is 60 MPa. The safety factor K is 1.2.

[0101] According to the preset drilling path ( Figure 1-1 The substrate is rotated synchronously and the laser is moved, so that the substrate bonding surface is uniformly distributed with an inclined array of micropores. According to formulas (1)-(3), the number of micropores is calculated as follows: N 切向 ≈316700, N 轴向 ≈198900, therefore the required tilted micropores N≈380040.

[0102] (3) Weigh out 35 wt% titanium carbide-coated diamond, 29 wt% phenolic resin, 3 wt% hexamethylenetetramine curing agent, 10 wt% titanium hydride, 5 wt% zinc oxide, 13 wt% copper powder, and 5 wt% graphite powder as raw materials for the abrasive layer of the grinding wheel. All raw materials are commercially available and have a particle size of less than 30 micrometers.

[0103] (4) Mix the abrasive layer raw material powder in step (3) thoroughly and evenly, place the substrate in the molding mold, pour in the mixed raw material powder, spread the material evenly and vibrate it.

[0104] (5) Hot pressing is performed using molding equipment. The hot pressing temperature is 180±10℃. After the mold cools, the abrasive layer solidifies, which is the grinding wheel abrasive layer.

[0105] (6) According to the drawings, the molded abrasive is processed to obtain the final shape and size of the grinding wheel.

[0106] (7) After passing the inspection, it becomes a finished grinding wheel (specification: 6A2-200*30*30*10*10mm).

[0107] The wear ratios of Example 1 and Comparative Example 3 were tested according to standard JB / T 3235 (Method for Determining the Wear Ratio of Polycrystalline Diamond). The wear ratio results showed that the ratio of grinding wheel to workpiece in Example 1 was 1:135, while that in Comparative Example 1 was 1:92. It is evident that the resin system of Example 1 exhibits better heat resistance, lower thermal expansion, better abrasive retention, and a tighter bond with the matrix; its lifespan is significantly longer than that of traditional phenolic resin grinding wheels (Comparative Example 3), with lower overall cost, making it better suited to meet the demanding grinding requirements of high-speed grinding, heavy-duty grinding, and simultaneous grinding of composite materials with large depths of cut.

[0108] Furthermore, regarding the molding process, Example 1 uses laser 3D curing, while Comparative Example 3 uses ordinary high-temperature molding. Given that the molding process of Comparative Example 3 requires customized molds, consumes more energy, and necessitates subsequent machining, the overall production cost of the grinding wheel is higher.

[0109] The phthalonitrile resin system used in this invention has superior heat resistance compared to traditional phenolic resins, and its coefficient of thermal expansion (resistance to heat deformation and abrasive holding power) is superior to that of polyimide resins, thus meeting the processing requirements under conditions of high grinding heat and high grinding vibration. The accompanying laser processing technology ensures sufficient and rapid curing of the binder and improves the bonding strength between the abrasive layer and the substrate.

[0110] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A laser-processed grinding wheel, comprising a grinding wheel substrate and a grinding wheel abrasive layer, characterized in that, The grinding wheel substrate has an inclined array of blind holes on its surface, and the grinding wheel abrasive layer is located on the surface of the grinding wheel substrate and inside the array of blind holes; the raw materials of the grinding wheel abrasive layer include amine-modified titanate and phthalonitrile resin.

2. The laser-processed grinding wheel according to claim 1, characterized in that, The raw materials of the grinding wheel abrasive layer, by mass fraction, include 10-40 wt% abrasive, 10-40 wt% phthalonitrile resin, 1-10 wt% amine-modified titanate and 20-50 wt% auxiliary materials.

3. The laser-processed grinding wheel according to claim 2, characterized in that, The phthalonitrile resin is a phthalonitrile resin with amine groups in its main chain.

4. The laser-processed grinding wheel according to claim 3, characterized in that, The abrasive is diamond or cubic boron nitride with a coating on its surface.

5. The laser-processed grinding wheel according to claim 4, characterized in that, The material of the coating layer is selected from any one of titanium plating, titanium carbide, titanium nitride, titanium aluminum nitride, and titanium carbonitride.

6. The laser-processed grinding wheel according to claim 5, characterized in that, The auxiliary materials include at least one of titanium hydride powder, zinc oxide, copper powder, graphite powder, and silicon carbide.

7. The laser-processed grinding wheel according to claim 6, characterized in that, The angle of the array blind aperture is 10-80°.

8. The laser-processed grinding wheel according to any one of claims 1-7, characterized in that, The diameter of the array of blind holes is 2-6 times the diameter of the coarsest powder particles in the raw material, and the depth is 1-20 times the diameter of the coarsest powder particles in the raw material.

9. The method for preparing the laser-processed grinding wheel according to claim 8, characterized in that, The steps are as follows: (1) The matrix material is processed, cleaned, and dried; (2) Fix the substrate after step (1) and use a high-energy laser to drill holes in the substrate to form an array of inclined blind holes on the substrate surface; (3) After the raw materials of the grinding wheel abrasive layer are mixed evenly, they are introduced into the laser 3D printing equipment and layered on the surface of the substrate in step (2) and the array blind holes. The raw material powder is cured by laser light to form the grinding wheel abrasive layer, and then the laser-processed grinding wheel is formed.

10. The method for preparing a laser-processed grinding wheel according to claim 9, characterized in that, In step (1), the matrix material is a titanium alloy or a titanium-containing composite material.

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