Micro-fluidic liquid cooling heat dissipation module integrated with piezoelectric drive, chip and application of micro-fluidic liquid cooling heat dissipation module

Abstract

The invention discloses a micro-fluidic liquid cooling heat dissipation module integrated with piezoelectric driving, a chip and application, and belongs to the technical field of chip liquid cooling heat dissipation. The micro-fluidic liquid cooling heat dissipation module comprises a micro-fluidic substrate and a piezoelectric film, the piezoelectric film covers the surface of one side of the microfluidic substrate; a groove channel is formed in the surface of one side, facing the piezoelectric film, of the micro-fluidic substrate; a loop cavity defined by the piezoelectric film and the groove channel forms a micro-channel; a metal electrode layer, a heat source area and a heat exchange area are respectively arranged at different positions, corresponding to the micro-channel, on the surface of one side, deviating from the micro-fluidic substrate, of the piezoelectric film. The micro-fluidic liquid cooling heat dissipation module can actively drive the cooling liquid to flow to a heat source area, and compared with a traditional micro-channel heat dissipation mode, the micro-fluidic liquid cooling heat dissipation module has very high flexibility in fluid driving, does not need an external driving pump, can greatly reduce the size of a packaged chip, and is beneficial to development of chip integration and microminiaturization.

Description

TECHNICAL FIELD

[0001] The application relates to an integrated piezoelectric driving microfluidic liquid cooling heat dissipation module, a chip and application, and belongs to the technical field of chip liquid cooling heat dissipation. BACKGROUND

[0002] With the rapid development of semiconductor technology, the integration and operation performance of chips continue to improve, but the power consumption and heat flux density also increase substantially. Especially in the fields of artificial intelligence, high-performance computing (HPC), 5G communication, etc., the peak power consumption of chips can reach hundreds of watts or even kilowatts. High temperature not only causes the chip performance to be reduced, the signal integrity to be deteriorated, but also can cause thermal failure, which seriously affects the reliability and service life of the system. The traditional air cooling heat dissipation is limited by the low thermal conductivity of air, and has gradually faced a bottleneck. Although the heat pipe technology can achieve local temperature equalization, the heat transfer distance is limited and there is a capillary limit, which all promotes the industry to explore more breakthrough heat dissipation solutions.

[0003] Liquid cooling technology has become the optimal solution to cope with high power density heat dissipation demand due to the high specific heat capacity and forced convection characteristics of liquid medium. It can quickly take away the heat generated by the chip, significantly reduce the junction temperature, and has the advantages of low noise and strong adaptability. Among them, the micro-channel liquid cooling can improve the heat dissipation efficiency by several times compared with the traditional scheme. Especially the integrated liquid cooling module, through the three-dimensional stacked flow channel design, nanofluid enhanced heat transfer technology, not only can realize the precise temperature control of the chip, but also can be optimized with the packaging process, greatly reducing the volume of the heat dissipation system.

[0004] However, the cooling liquid in the current liquid cooling system still needs to rely on an external pressure pump for driving, which brings two main limitations: on the one hand, the existing pressure pump is large in size, which is not conducive to the miniaturization development of integrated chips; on the other hand, the external pump is difficult to realize precise control of the movement of the cooling liquid in the micro-channel, which leads to the inability to direct and efficient heat dissipation for the high power density area in the chip. Therefore, the development of efficient and miniaturized integrated active liquid cooling technology has become an important way to break through the heat management difficulties of high-power chips. SUMMARY

[0005] In order to solve the problem in the prior art that the chip liquid cooling heat dissipation is limited by the driving mode and the control mode, and it is difficult to make the chip have both miniaturization and directional heat dissipation for the high power density area, the application provides a technical scheme of an integrated piezoelectric driving microfluidic liquid cooling heat dissipation module, which has the ability to flexibly control the flow of the cooling liquid and can be integrated in a three-dimensional packaged chip to realize adaptive and efficient heat dissipation of the integrated chip.

[0006] The application adopts the following technical scheme:

[0007] According to a first aspect of the application, an integrated piezoelectric driving microfluidic liquid cooling heat dissipation module is provided, comprising a microfluidic substrate and a piezoelectric film.

[0008] The piezoelectric film covers the surface of one side of the microfluidic substrate;

[0009] The surface of one side of the microfluidic substrate facing the piezoelectric film is provided with a groove channel;

[0010] The loop cavity formed by the piezoelectric film and the groove channel forms a microfluidic channel;

[0011] On the surface of the side of the piezoelectric film away from the microfluidic substrate, different positions corresponding to the microfluidic channel are respectively provided with a metal electrode layer, a heat source area, and a heat exchange area.

[0012] Optionally, the microfluidic channel is closed and filled with a cooling liquid.

[0013] Optionally, the metal electrode layer includes at least one pair of metal interdigital electrodes.

[0014] The interdigital electrodes of each pair of metal interdigital electrodes are arranged in a coplanar interdigital manner along the length direction of the microfluidic channel.

[0015] Optionally, the width of the microfluidic channel is 10um-10000um; and optionally, the depth of the microfluidic channel is 0.5um-300um.

[0016] Optionally, the thickness of the piezoelectric film is 0.3um-50um.

[0017] Optionally, the heat exchange area includes a high-thermal-conductivity material layer.

[0018] According to a second aspect of the present application, a chip is provided, including the integrated piezoelectric-driven microfluidic liquid cooling heat dissipation module as described above.

[0019] According to a third aspect of the present application, the application of the integrated piezoelectric-driven microfluidic liquid cooling heat dissipation module described above in a chip system is provided.

[0020] Optionally, the chip system is a patch chip system or a three-dimensional integrated chip system.

[0021] Optionally, the chip system includes at least one chip functional layer.

[0022] The surface of one side of the chip functional layer is integrated with the integrated piezoelectric-driven microfluidic liquid cooling heat dissipation module.

[0023] Optionally, a temperature detection module is further provided between the chip functional layer and the integrated piezoelectric-driven microfluidic liquid cooling heat dissipation module.

[0024] The beneficial effects of the present application include:

[0025] (1) The microfluid channel structure in the piezoelectric microfluidic liquid cooling module of the present application is located in the substrate. Compared with other piezoelectric microfluidic channel structures, the preparation process is simple, does not need to occupy more space resources, and greatly promotes the integration of the chip.

[0026] (2) The piezoelectric microfluidic liquid cooling module of the present application can actively drive the cooling liquid to the heat source area. Compared with the traditional microfluid channel cooling method, it has high flexibility in driving fluid.

[0027] (3) The piezoelectric microfluidic liquid cooling module of the present application can be matched with a temperature detection module to dynamically control the flow of cooling liquid in the high-temperature area, thereby realizing rapid heat dissipation of the heat source area.

[0028] (4) The piezoelectric microfluidic liquid cooling module of the present application does not need an external driving pump, which can greatly reduce the size of the packaged chip. The module can be integrated on a chip with a patch type, three-dimensional stacked structure, etc., and is suitable for artificial intelligence, high-performance computing (HPC), 5G communication, etc. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a structural schematic diagram of the piezoelectric microfluidic liquid cooling module of the present application;

[0030] Figure 2 is a working cycle schematic diagram of the piezoelectric microfluidic liquid cooling module of the present application

[0031] Figure 3 is a structural schematic diagram of a patch type chip with a piezoelectric microfluidic liquid cooling module of the present application;

[0032] Figure 4 is a structural schematic diagram of a three-dimensional stacked chip with a piezoelectric microfluidic liquid cooling module of the present application; the figure mark

[0033] 1, microfluidic substrate; 2, microfluidic channel; 3, piezoelectric film layer; 4, metal electrode layer; 5, piezoelectric microfluidic liquid cooling module; 6, heat source area; 7, heat exchange area; 8, temperature detection module; 311, patch type structure chip functional layer; 411, three-dimensional stacked structure chip functional layer; 412, layer via; 413, metal wiring layer. DETAILED DESCRIPTION

[0034] The present application will be described in detail below in conjunction with examples, but the present application is not limited to these examples.

[0035] Unless otherwise specified, the raw materials in the examples of the present application are purchased through commercial channels.

[0036] Unless otherwise specified, the test methods all use conventional methods, and the instrument settings all use the recommended settings of the manufacturer.

[0037] At present, the traditional heat dissipation method is difficult to meet the demand when facing the chip system with high power consumption and high density integration. Although the micro-channel liquid cooling heat dissipation has good heat dissipation effect, the driving of the cooling liquid needs an external driving pump to realize, which is not conducive to the development trend of integrated chip miniaturization, and the reported driving pump cannot flexibly control the fluid movement in each part of the micro-channel, so as to realize the efficient heat dissipation of high power density chip. Therefore, it is an urgent problem to be solved in this field to meet the chip integration and miniaturization while realizing the efficient heat dissipation of heat.

[0038] In order to solve the foregoing technical problems, the present application provides a micro-fluidic liquid cooling heat dissipation module integrated with piezoelectric drive, which has the ability to flexibly control the flow of cooling liquid, and can be integrated in a three-dimensional packaged chip to realize adaptive and efficient heat dissipation of integrated chip. The liquid cooling module is composed of a substrate with a micro-channel, a piezoelectric film and a driving electrode, and is integrated with a functional chip through three-dimensional advanced packaging. When a driving signal is applied to the metal interdigital electrode, the piezoelectric film above the cooling liquid can produce bending vibration under the action of inverse piezoelectric effect, drive the cooling liquid to flow to the heat source area and carry away the heat, and by changing the excitation voltage of the interdigital electrode, the size of the cooling liquid flow can be controlled, thereby forming a liquid cooling heat dissipation module with adjustable flow, cooperating with the built-in temperature detection module of the chip, dynamically adjusting and controlling the flow of cooling liquid in the high temperature area, so as to realize the dynamic adaptive adjustment and heat dissipation of the integrated chip. The process flow of the micro-fluidic device is simple, which greatly reduces the area of the driving source, is conducive to the integration and miniaturization of the chip, and can realize the function of efficient heat dissipation of the chip.

[0039] According to an embodiment of the present application, the micro-fluidic liquid cooling heat dissipation module integrated with piezoelectric drive, the structure and working cycle schematic diagram are shown as Figure 1 and Figure 2 The micro-fluidic liquid cooling heat dissipation module integrated with piezoelectric drive includes a micro-fluidic substrate 1 and a piezoelectric film 3.

[0040] The piezoelectric film 3 is covered on the surface of one side of the micro-fluidic substrate 1.

[0041] The surface of one side of the micro-fluidic substrate 1 facing the piezoelectric film 3 is provided with a groove channel.

[0042] The loop cavity formed by the piezoelectric film 1 and the groove channel forms a micro-channel 2.

[0043] On the surface of the piezoelectric film 1 away from the micro-fluidic substrate 2, different positions corresponding to the micro-channel 2 are respectively provided with a metal electrode layer 4, a heat source area 6 and a heat exchange area 7.

[0044] In one embodiment, the micro-channel is closed and filled with cooling liquid, and the cooling liquid is a high specific heat liquid such as water.

[0045] In one embodiment, the metal electrode layer 4 comprises at least one pair of metal interdigital electrodes.

[0046] The interdigital electrodes of each pair of the metal interdigital electrodes are arranged along the length direction of the microfluidic channel 2 in a coplanar interdigital manner.

[0047] In one embodiment, the material of the metal interdigital electrodes is selected from at least one of chromium, titanium, molybdenum, aluminum, gold, silver, and copper.

[0048] In one embodiment, the width of the microfluidic channel 2 is 10 um to 10000 um; and / or, the depth of the microfluidic channel 2 is 0.5 um to 300 um. The size range of the microfluidic channel 2 covers a common size of the microfluidic channel heat dissipation, which can be adjusted according to the size of the specific product.

[0049] In one embodiment, the microfluidic channel 2 is directly prepared on the microfluidic substrate 1, for example, by using an etching process.

[0050] In one embodiment, the cross-sectional shape of the microfluidic channel 2, i.e., the cross-sectional shape of the groove channel, can be rectangular, trapezoidal, etc., and is preferably rectangular.

[0051] In one embodiment, the material of the microfluidic substrate 1 is not strictly limited, for example, it can be silicon or glass material, and the microfluidic substrate 1 is preferably a silicon wafer, because silicon has mature processes in etching, bonding, etc.

[0052] In one embodiment, the thickness of the piezoelectric film 3 is 0.3 um to 50 um. This thickness range can reduce the driving signal frequency required to be applied to the interdigital electrodes to excite acoustic waves of the same wavelength to several megahertz, thereby reducing the requirement for the performance of the driving circuit.

[0053] In one embodiment, the material of the piezoelectric film 3 is not strictly limited, and is preferably selected from at least one of aluminum nitride, lead zirconate titanate, lithium niobate, and lithium tantalate. These excellent piezoelectric coefficients are conducive to the vibration of the film, which in turn drives the flow of the cooling liquid.

[0054] In one embodiment, the heat source region 6 is a region in the chip that needs to be cooled. The flowing cooling liquid can carry away the heat of the heat source region 6.

[0055] In one embodiment, the heat exchange region 7 comprises a layer of high thermal conductivity material. The heat exchange region 7 is used to complete the heat exchange between the cooling liquid and the external environment.

[0056] In one embodiment, the working cycle process of the microfluidic liquid cooling heat dissipation module integrated with piezoelectric driving comprises:

[0057] An excitation voltage is applied to the metal electrode layer 4 as a driving electrode to drive the piezoelectric film layer 3 to drive the cooling liquid to flow along the micro-channel 2 to the heat source area 6 and take away the heat of the heat source area, thereby achieving heat dissipation of the heat source area;

[0058] After passing through the heat source area 6, the cooling liquid is heated and flows to the heat exchange area 7 under the driving of the piezoelectric film 3, and the heat is transferred to the external environment in the heat exchange area 7, and the temperature is reduced;

[0059] The above working cycle process can ensure that the cooling liquid flows to the heat source area in a low-temperature state, thereby achieving efficient heat dissipation of the heat source area.

[0060] According to an embodiment of the present application, the integrated piezoelectric-driven micro-fluidic liquid cooling heat dissipation module is integrated in a chip, aiming to realize adaptive and efficient heat dissipation of the integrated chip.

[0061] According to an embodiment of the present application, the integrated piezoelectric-driven micro-fluidic liquid cooling heat dissipation module is applied in a chip system, aiming to realize (1) the cooling liquid can be actively driven to flow to the heat source area, and compared with the traditional micro-channel heat dissipation method, the driving fluid has high flexibility; (2) without an external driving pump, the size of the packaged chip can be greatly reduced, which is conducive to the development of chip integration and miniaturization.

[0062] In one embodiment, the chip system is a patch chip system or a three-dimensional integrated chip system.

[0063] In one embodiment, the chip system includes at least one chip functional layer.

[0064] The surface of one side of the chip functional layer is integrated with the integrated piezoelectric-driven micro-fluidic liquid cooling heat dissipation module.

[0065] In one embodiment, the chip functional layer and the integrated piezoelectric-driven micro-fluidic liquid cooling heat dissipation module are further provided with a temperature detection module. The strength of the excitation signal is adjusted through temperature feedback, and the flow of the cooling liquid is dynamically controlled to achieve rapid heat dissipation of the heat source area.

[0066] In one embodiment, the structure of the patch chip system is as shown in Figure 3As shown, the patch type chip system includes a patch type structure chip functional layer 311, a microfluidic liquid cooling module 5, and a substrate. The microfluidic liquid cooling module 5 is the aforementioned microfluidic liquid cooling heat dissipation module integrated with the integrated piezoelectric drive. One side of the microfluidic substrate 1 of the microfluidic liquid cooling module 5 is integrated on one side surface of the patch type structure chip functional layer 311. The microfluidic liquid cooling module 5 is connected on the substrate in an inverted manner (the inverted connection can be achieved by flip-chip welding, etc.). The heat exchange region 7 is connected with the piezoelectric film and is located above the microfluidic channel structure. A support body is arranged between the piezoelectric film 3 and the substrate. The support body is made of the same material as the microfluidic substrate 1. A temperature detection module 8 is arranged between the patch type structure chip functional layer 311 and the microfluidic substrate 1. The cooling liquid is enclosed and filled in the microfluidic channel 2.

[0067] During the operation of the patch type chip system, the metal interdigital electrodes on the metal electrode layer 4 are synchronously excited by the driving circuit module. The piezoelectric film 3 drives the cooling liquid to circulate in the microfluidic channel 2 in a bending vibration manner. The cooling liquid flows to the chip heat source region 6 and carries away the heat of the heat source region to achieve efficient heat dissipation of the chip. The cooling liquid with high temperature after flowing through the heat source region 6 will diffuse the heat to the external environment in the heat exchange region 7, completing the cooling of the cooling liquid, so as to ensure that the cooling liquid can flow to the heat source region 6 again in a low-temperature state. In the process of circulation of the cooling liquid, the temperature detection module 8 can dynamically regulate the flow of the cooling liquid in the high-temperature region by adjusting the strength of the excitation signal through temperature feedback, so as to realize precise temperature control of the patch type chip.

[0068] In one embodiment, the structure of the three-dimensional integrated chip system is as shown in Figure 4 The three-dimensional integrated chip system includes a three-dimensional stacked structure chip functional layer 411 integrated with several layers of microfluidic liquid cooling modules 5, and a substrate. The three-dimensional stacked structure chip functional layer 411 integrated with several layers of microfluidic liquid cooling modules 5 is connected through layer through holes 412. The microfluidic liquid cooling module 5 is the aforementioned microfluidic liquid cooling heat dissipation module integrated with the integrated piezoelectric drive. One side of the microfluidic substrate 1 of the microfluidic liquid cooling module 5 is integrated on one side surface of the three-dimensional stacked structure chip functional layer 411. The microfluidic liquid cooling module 5 is arranged on the substrate in a normal manner. The heat exchange region 7 is connected with the piezoelectric film and is located above the microfluidic channel structure. A support body is arranged between the piezoelectric film 3 and the three-dimensional stacked structure chip functional layer 411 of the adjacent layer. An additional metal wiring layer 413 is arranged between the three-dimensional stacked structure chip functional layer 411 and the microfluidic substrate 1. A temperature detection module 8 is further arranged between the chip functional layer 411 and the substrate of the microfluidic liquid cooling heat dissipation module 5 integrated with the integrated piezoelectric drive. The metal wiring layer 413 on the chip functional layer 411 is used to rearrange the signal connection of each layer, and the temperature detection module 8 is used to detect the temperature of the heat source region. The cooling liquid is enclosed and filled in the microfluidic channel 2.

[0069] In operation, the three-dimensional integrated chip system drives the metal interdigital electrode on the metal electrode layer 4 synchronously through the driving circuit module, and the piezoelectric film 3 drives the cooling liquid to flow in the micro-channel 2 in a bending vibration mode, the cooling liquid flows to the chip heat source area 6, takes away the heat of the heat source area to achieve efficient heat dissipation of the chip, the cooling liquid with high temperature after flowing through the heat source area 6 will diffuse the heat to the external environment in the heat exchange area 7, and the cooling liquid is cooled down, so that the cooling liquid can flow to the heat source area 6 again in a low temperature state, and in the process of circulating flow of the cooling liquid, the temperature detection module 8 matched can dynamically control the flow of the cooling liquid in the high temperature area, so as to realize precise temperature control of the three-dimensional packaged chip.

[0070] The above is only a few embodiments of the present application, and does not limit the present application in any form. Although the preferred embodiments are disclosed above, the present application is not limited thereto. Any person skilled in the art can make some changes or modifications to the above disclosed technical contents without departing from the scope of the present application, and such changes or modifications are equivalent to equivalent embodiments, and all of them are within the scope of the technical solution.

Claims

1. An integrated piezoelectrically driven microfluidic liquid cooling heat dissipation module, characterized in that, The micro-fluidic substrate, a piezoelectric film; The piezoelectric film covers the surface of one side of the micro-fluidic substrate; The surface of one side of the micro-fluidic substrate facing the piezoelectric film is provided with a groove channel; The loop cavity formed by the piezoelectric film and the groove channel forms a micro-fluid channel; On the surface of the piezoelectric film away from the micro-fluidic substrate, different positions corresponding to the micro-fluid channel are respectively provided with a metal electrode layer, a heat source area and a heat exchange area.

2. The integrated piezoelectrically driven microfluidic liquid cooling heat dissipation module according to claim 1, wherein, The micro-fluid channel is filled with cooling liquid.

3. The integrated piezoelectrically driven microfluidic liquid cooling heat dissipation module according to claim 1, wherein, The metal electrode layer includes at least one pair of metal interdigital electrodes; The interdigital electrodes of each pair of metal interdigital electrodes are arranged in a coplanar interdigital manner along the length direction of the micro-fluid channel.

4. The integrated piezoelectrically driven microfluidic liquid cooling heat dissipation module according to claim 1, wherein, The thickness of the piezoelectric film is 0.3um-50um.

5. The integrated piezoelectrically driven microfluidic liquid cooling heat dissipation module according to claim 1, wherein, The width of the micro-fluid channel is 10um-10000um; the depth of the micro-fluid channel is 0.5um-300um.

6. The integrated piezoelectrically driven microfluidic liquid cooling heat dissipation module according to claim 1, wherein, The heat exchange area includes a high thermal conductivity material layer.

7. A chip, characterized by The integrated piezoelectric driven micro-fluidic liquid cooling heat dissipation module includes the integrated piezoelectric driven micro-fluidic liquid cooling heat dissipation module according to any one of claims 1 to 6.

8. The integrated piezoelectric driven micro-fluidic liquid cooling heat dissipation module according to any one of claims 1 to 6 is applied to a chip system.

9. Use according to claim 8, characterized in that, The chip system includes at least one chip functional layer; The surface of one side of the chip functional layer is integrated with the integrated piezoelectric driven micro-fluidic liquid cooling heat dissipation module.

10. Use according to claim 9, characterized in that, The chip functional layer and the integrated piezoelectric driven micro-fluidic liquid cooling heat dissipation module are further provided with a temperature detection module.

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