Heat dissipation method and system for ultra-thin small-size integrally-formed inductor

Abstract

The invention relates to the field of thermodynamics and fluid mechanics, and discloses a heat dissipation method and system for an ultra-thin small-size integrally-formed inductor, and the method comprises the steps: fitting an electromagnetic-thermal coupling analysis network of the integrally-formed inductor, calculating a core heat source of the integrally-formed inductor, and constructing a heat distribution diagram of the integrally-formed inductor. Determining the flow channel layout of the integrally formed inductor, analyzing the flow channel Nusselt number and the flow channel friction factor of the micro-flow channel corresponding to the integrally formed inductor, determining the flow channel geometric characteristics of the micro-flow channel, and constructing a micro-flow channel heat dissipation network of the integrally formed inductor; determining a circulating heat dissipation path of the micro-channel heat dissipation network, analyzing an equivalent heat conductivity coefficient of a heat dissipation medium corresponding to the micro-channel heat dissipation network, and calculating a convective heat transfer coefficient and a total heat dissipation amount of the micro-channel heat dissipation network so as to analyze the heat dissipation performance of the micro-channel heat dissipation network; and determining the circulation flow rate of the micro-channel heat dissipation network so as to execute circulation heat dissipation of the integrally formed inductor. The heat dissipation effect of the ultra-thin small-size integrally-formed inductor can be improved.

Description

Technical Field

[0001] This invention relates to an ultra-thin, small-sized, one-piece molded inductor heat dissipation method and system, belonging to the field of thermodynamics and fluid mechanics. Background Technology

[0002] Ultra-thin, small-size molded inductor thermal management refers specifically to a series of thermal management technologies employed to control the operating temperature and improve the reliability and efficiency of molded inductors used in modern high-performance, high-power-density electronic devices (such as ultrabooks, smartphones, wearable devices, and server GPU / CPU peripherals). Effective thermal management allows inductors to operate continuously and stably at higher currents and power levels, increasing power density, extending device lifespan and mean time between failures (MTBF), and enhancing product quality and reputation.

[0003] Traditional heat dissipation methods for ultra-thin, small-size molded inductors involve copper plating on the PCB. This method uses thermally conductive magnetic powder adhesive to conduct heat to the outer surface of the inductor. The solder pads on the bottom of the inductor are tightly connected to a large area of ​​copper foil. The large copper foil quickly diffuses the heat from the bottom of the inductor to a larger planar area, and then utilizes natural air convection and thermal radiation to achieve heat dissipation. However, due to the ultra-thin and small-size requirements of molded inductors, the area of ​​the copper foil is limited, resulting in poor heat dissipation performance of PCB copper plating and failing to meet the heat dissipation requirements of molded inductors. Summary of the Invention

[0004] This invention provides a method and system for heat dissipation of ultra-thin, small-sized integrated molded inductors, the main purpose of which is to improve the heat dissipation effect of ultra-thin, small-sized integrated molded inductors.

[0005] To achieve the above objectives, the present invention provides an ultra-thin, small-size, integrally molded inductor heat dissipation method, comprising: An electromagnetic-thermal coupling analysis network is fitted to a molded inductor to calculate the core heat source of the molded inductor, wherein the core heat source includes: winding heat and core loss heat. Based on the core heat source, a heat distribution map of the integral molded inductor is constructed to determine the flow channel layout of the integral molded inductor. The flow channel Nusselt number and flow channel friction factor of the corresponding microchannel of the integral molded inductor are analyzed, and the flow channel geometry characteristics of the microchannel are determined. Based on the flow channel layout, the flow channel Nusselt number, the flow channel friction factor, and the flow channel geometry characteristics, a microchannel heat dissipation network of the integral molded inductor is constructed. The circulating heat dissipation path of the microchannel heat dissipation network is determined, the equivalent thermal conductivity of the heat dissipation medium corresponding to the microchannel heat dissipation network is analyzed, and the convective heat transfer coefficient and total heat dissipation of the microchannel heat dissipation network are calculated based on the circulating heat dissipation path and the equivalent thermal conductivity to analyze the heat dissipation performance of the microchannel heat dissipation network. Based on the heat dissipation performance, the circulation velocity of the microfluidic heat dissipation network is determined to perform circulating heat dissipation of the integrally molded inductor.

[0006] Optionally, determining the flow channel layout of the integrally molded inductor includes: Based on the heat distribution map corresponding to the integral molded inductor, identify the hot spot area of ​​the integral molded inductor; Analyze the temperature gradient in the hotspot region; Based on the heat distribution map, a heat power density map of the integrally molded inductor is generated; Based on the heat power density diagram and temperature gradient, the flow channel gradient distribution diagram of the integrally molded inductor is determined; Identify the stress concentration areas of the integrally molded inductor; The flow channel layout of the integrally molded inductor is determined based on the stress concentration area and the flow channel gradient distribution diagram.

[0007] Optionally, the analysis of the channel Nusselt number and channel friction factor of the microchannel corresponding to the integrally molded inductor includes: Identify the heat dissipation medium in the microchannel and analyze the medium characteristics of the heat dissipation medium; Calculate the Reynolds number of the heat dissipation medium based on the medium's properties; Based on the Reynolds number, the flow state of the heat dissipation medium is determined, wherein the flow state includes turbulent flow and laminar flow; Based on the flow state, calculate the channel Nusselt number and channel friction factor of the microchannel corresponding to the integrally molded inductor.

[0008] Optionally, constructing the microchannel heat dissipation network of the integrally molded inductor based on the channel layout, the channel Nusselt number, the channel friction factor, and the channel geometry includes: The flow channel layout is optimized based on the flow channel Nusselt number and the flow channel friction factor to obtain the optimized flow channel layout. Based on the optimized flow channel layout and the flow channel geometry, an initial heat dissipation network for the integrally molded inductor is constructed. The initial heat dissipation network was simulated and tested, and the simulation results were obtained. Based on the simulation test results, analyze the temperature distribution, flow rate distribution, and pressure distribution of the initial heat dissipation network. The overall network performance of the initial heat dissipation network is determined based on the temperature distribution value, the flow velocity distribution value, and the pressure distribution value. When the overall performance of the network meets the preset performance standards, the initial heat dissipation network is used as the microchannel heat dissipation network of the integrally molded inductor.

[0009] Optionally, the electromagnetic-thermal coupling analysis network for fitting the integrally molded inductor includes: The inductance geometry and material properties of the integrally molded inductor are collected; Based on the aforementioned inductor geometric features, a three-dimensional inductor model of the integrally molded inductor is fitted. Based on the material properties, the electromagnetic parameters, core parameters, and thermophysical parameters of the integrally molded inductor are determined. Based on the electromagnetic parameters and the magnetic core parameters, fit the electromagnetic field model of the integrally molded inductor; Based on the aforementioned thermophysical parameters, a heat conduction model for the integrally molded inductor is fitted. Determine the electric field-thermal coupling relationship of the integrally molded inductor; Based on the electric field-thermal coupling relationship, the three-dimensional inductance model, the electromagnetic field model, and the heat conduction model are integrated to obtain an electromagnetic-thermal coupling analysis network.

[0010] Optionally, the calculation of the core heat source of the integrally molded inductor includes: The skin effect coefficient, hysteresis loss coefficient, eddy current loss coefficient, and residual loss coefficient of the integral molded inductor are analyzed using the electromagnetic-thermal coupling analysis network corresponding to the integral molded inductor. Determine the operating frequency and DC conductivity of the integrally molded inductor during operation; Calculate the current distribution density and magnetic flux distribution density of the integrally molded inductor during operation; Based on the skin effect coefficient, the operating frequency, and the DC conductivity, the winding heat of the integrally molded inductor is calculated using the following formula: ; in, Indicates the heat of the winding. This indicates the winding volume of a molded inductor. Represents the skin effect coefficient. Indicates the operating frequency. Represents the current distribution density. Indicates DC conductivity. This indicates integrating over the winding volume; Based on the magnetic flux distribution density, the core loss index and magnetic flux density amplitude of the integrally molded inductor are analyzed. Based on the core loss index, the magnetic flux density amplitude, the hysteresis loss coefficient, the eddy current loss coefficient, and the residual loss coefficient, the core loss heat of the integrally molded inductor is calculated using the following formula: ; in, This indicates the heat loss of the magnetic core. This indicates the core volume of a molded inductor. Indicates the operating frequency. Indicates the hysteresis loss coefficient. This indicates the core loss index. Indicates the magnitude of magnetic flux density. This represents the eddy current loss coefficient. Indicates the residual loss coefficient. This indicates integrating over the core volume; The core heat source of the integrally molded inductor is determined based on the heat loss of the magnetic core and the heat of the winding.

[0011] Optionally, calculating the convective heat transfer coefficient and total heat dissipation of the microchannel heat dissipation network based on the circulating heat dissipation path and the equivalent thermal conductivity includes: Determine the actual hydraulic radius of the flow channel heat dissipation network; The convective heat transfer coefficient of the microchannel heat dissipation network is calculated based on the Nusselt number corresponding to the microchannel heat dissipation network, the equivalent thermal conductivity, and the actual hydraulic radius of the channel. The effective heat dissipation area of ​​the microchannel heat dissipation network is determined based on the described circulating heat dissipation path. Determine the average temperature difference between the channel wall surface corresponding to the microchannel heat dissipation network and the heat dissipation medium corresponding to the microchannel heat dissipation network; The total heat dissipation of the microchannel heat dissipation network is calculated based on the effective heat dissipation area and the average temperature difference.

[0012] Optionally, analyzing the heat dissipation performance of the microchannel heat dissipation network includes: The heat transfer efficiency of the microchannel heat dissipation network is calculated based on the convective heat transfer coefficient corresponding to the microchannel heat dissipation network. Based on the total heat dissipation corresponding to the microchannel heat dissipation network, calculate the heat dissipation efficiency and thermal resistance of the microchannel heat dissipation network; The heat dissipation performance of the microchannel heat dissipation network is determined based on the heat exchange efficiency, the heat dissipation efficiency, and the thermal resistance.

[0013] Optionally, determining the circulation velocity of the microchannel heat dissipation network based on the heat dissipation performance includes: Based on the heat dissipation performance, analyze the correlation coefficient between the convective heat transfer coefficient of the microchannel heat dissipation network and the flow velocity of the cooling medium corresponding to the microchannel heat dissipation network; Based on the correlation coefficient, the flow heat transfer coefficient-flow velocity curve of the microchannel heat dissipation network is constructed; Identify the peak value of the heat transfer coefficient-flow velocity curve; The circulation velocity of the microchannel heat dissipation network is determined based on the peak value of the curve.

[0014] To address the aforementioned problems, the present invention also provides an ultra-thin, small-sized, integrally molded inductor heat dissipation system, the system comprising: A heat source analysis module is used to fit the electromagnetic-thermal coupling analysis network of the integral molded inductor to calculate the core heat source of the integral molded inductor, wherein the core heat source includes: winding heat and core loss heat. The heat dissipation network construction module is used to construct a heat distribution map of the integral molded inductor based on the core heat source, so as to determine the flow channel layout of the integral molded inductor, analyze the flow channel Nusselt number and flow channel friction factor of the microchannel corresponding to the integral molded inductor, and determine the flow channel geometry characteristics of the microchannel. Based on the flow channel layout, the flow channel Nusselt number, the flow channel friction factor and the flow channel geometry characteristics, the microchannel heat dissipation network of the integral molded inductor is constructed. The heat dissipation performance analysis module is used to determine the circulating heat dissipation path of the microchannel heat dissipation network, analyze the equivalent thermal conductivity of the heat dissipation medium corresponding to the microchannel heat dissipation network, and calculate the convective heat transfer coefficient and total heat dissipation of the microchannel heat dissipation network based on the circulating heat dissipation path and the equivalent thermal conductivity, so as to analyze the heat dissipation performance of the microchannel heat dissipation network. A circulating heat dissipation execution module is used to determine the circulating flow rate of the microchannel heat dissipation network based on the heat dissipation performance, so as to perform circulating heat dissipation of the integrally molded inductor.

[0015] Compared to the problems described in the background art, this invention, by constructing an electromagnetic-thermal coupling analysis network for a monolithic inductor, accurately identifies the core heat source and establishes a heat distribution map based on this, thereby guiding the optimized layout and design of the microchannel heat dissipation network. First, it achieves precise heat dissipation design driven by the heat source. Through electromagnetic-thermal coupling analysis, the solution can accurately quantify winding heat and core loss heat, avoiding the blind spots of traditional empirical design. The construction of the heat distribution map allows the microchannel layout to closely conform to the actual heat flow path, prioritizing the allocation of cooling resources to high-temperature areas, greatly improving heat dissipation efficiency and targeting, thereby effectively suppressing local hot spots and extending the inductor's lifespan. Second, it optimizes the comprehensive matching of microchannel structure and flow performance. Based on the analysis of the channel Nusselt number and friction factor, the solution scientifically determines the geometric characteristics of the channel, ensuring high heat transfer performance while considering flow resistance and energy consumption. This structure-fluid synergistic optimization method enables the microchannel heat dissipation network to achieve optimal thermal-hydraulic performance within a limited space, especially suitable for the compact structural requirements of ultra-thin, small-sized inductors. Furthermore, the controllability and adaptability of the heat dissipation system are significantly improved. By introducing the equivalent thermal conductivity analysis of the heat dissipation medium and modeling the circulating heat dissipation path, the solution can accurately calculate the convective heat transfer coefficient and total heat dissipation, achieving quantitative evaluation and prediction of heat dissipation performance. Based on this, the circulation velocity can be dynamically adjusted according to actual operating conditions, enabling the heat dissipation system to maintain efficient and stable operation under different load conditions, exhibiting strong environmental adaptability and robustness. Finally, an innovative solution is provided for the thermal management of high power density electronic devices. This solution deeply integrates microchannel heat dissipation with molded inductors, not only breaking through the bottlenecks of traditional heat dissipation methods in terms of space, efficiency, and reliability, but also laying a technical foundation for the future development of electronic devices towards higher power, smaller size, and higher integration. Its systematic, multi-physics coupling design concept has good scalability and can be extended to the heat dissipation design of other high heat flux density electronic components, possessing broad engineering application prospects and market value. Therefore, the heat dissipation method for ultra-thin, small-size molded inductors provided in this embodiment of the invention can improve the heat dissipation effect of ultra-thin, small-size molded inductors. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart of an embodiment of the heat dissipation method for an ultra-thin, small-sized, integrally molded inductor provided by the present invention. Figure 2 This is a schematic diagram of a module for implementing the ultra-thin, small-size, integrated inductor heat dissipation system according to an embodiment of the present invention.

[0017] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0019] This application provides a method for heat dissipation of an ultra-thin, small-sized, integrated molded inductor. The executing entity of this method includes, but is not limited to, at least one of the following electronic devices that can be configured to execute the method provided in this application: a server, a terminal, etc. In other words, the ultra-thin, small-sized, integrated molded inductor heat dissipation method can be executed by software or hardware installed on a terminal device or a server device. The server includes, but is not limited to, a single server, a server cluster, a cloud server, or a cloud server cluster.

[0020] Reference Figure 1 The diagram shown is a flowchart illustrating a method for heat dissipation of an ultra-thin, small-size, integrally molded inductor according to an embodiment of the present invention. In this embodiment, the method for heat dissipation of an ultra-thin, small-size, integrally molded inductor includes: S1. Fit an electromagnetic-thermal coupling analysis network of the integral molded inductor to calculate the core heat source of the integral molded inductor, wherein the core heat source includes: winding heat and core loss heat.

[0021] This invention, through an electromagnetic-thermal coupling analysis network fitted to a molded inductor, can accurately capture the winding copper losses and core iron losses generated by current changes and magnetic field alternations during inductor operation, and convert them into spatially distributed heat source inputs. The electromagnetic-thermal coupling analysis network refers to a simulation analysis system based on the principle of multiphysics coupling, used to accurately describe and predict the interaction and influence between the electromagnetic field and temperature field during the operation of a molded inductor.

[0022] As an embodiment of the present invention, the electromagnetic-thermal coupling analysis network for fitting a molded inductor includes: The inductance geometry and material properties of the integrally molded inductor are collected; Based on the aforementioned inductor geometric features, a three-dimensional inductor model of the integrally molded inductor is fitted. Based on the material properties, the electromagnetic parameters, core parameters, and thermophysical parameters of the integrally molded inductor are determined. Based on the electromagnetic parameters and the magnetic core parameters, fit the electromagnetic field model of the integrally molded inductor; Based on the aforementioned thermophysical parameters, a heat conduction model for the integrally molded inductor is fitted. Determine the electric field-thermal coupling relationship of the integrally molded inductor; Based on the electric field-thermal coupling relationship, the three-dimensional inductance model, the electromagnetic field model, and the heat conduction model are integrated to obtain an electromagnetic-thermal coupling analysis network.

[0023] The inductor's geometric features refer to its physical characteristics in spatial structure, such as dimensions, shape, and layout, including core dimensions (outer diameter, inner diameter, height), winding structure (number of turns, wire diameter, winding method), and packaging structure (shell thickness, shape). The material properties refer to the inherent physical properties of each component of the inductor (core, winding, packaging material, etc.) in electromagnetic and thermal aspects. The three-dimensional model of the inductor refers to a digital three-dimensional geometric model constructed based on its geometric features (size, shape, structural layout, etc.). The electromagnetic parameters describe the inductor's response characteristics under electromagnetic fields, such as conductivity, permeability, dielectric constant, and loss tangent. The core parameters describe the response characteristics of the core material under magnetic fields, such as hysteresis characteristics, saturation magnetic induction, and iron loss parameters. The thermophysical parameters describe the physical properties of the material during heat conduction, convection, and radiation, such as thermal conductivity, specific heat capacity, and coefficient of thermal expansion. The electromagnetic field model refers to a mathematical model that describes the distribution of the electromagnetic field and electromagnetic losses inside an inductor based on electromagnetic parameters and core parameters. The heat conduction model refers to a mathematical model that describes the heat transfer and temperature rise distribution inside an inductor based on thermophysical parameters. The electric field-thermal coupling relationship refers to the physical mechanism describing the interaction and influence between the electromagnetic field and the temperature field.

[0024] Optionally, the electromagnetic field model of the integrally molded inductor can be fitted using machine learning techniques, such as neural networks, random forests, and support vector machines.

[0025] Optionally, the electric field-thermal coupling relationship of the integrally molded inductor can be determined by finite element method coupling simulation, such as COMSOL Multiphysics, ANSYS, etc.

[0026] This invention provides data support for subsequent analysis and construction of a heat dissipation network by calculating the core heat source of the integrally molded inductor. The core heat source refers to the main energy loss source that causes temperature rise during inductor operation due to the electromagnetic field. The winding heat refers to the heat generated by the current flowing through the inductor coil during operation. The core loss heat refers to the heat converted from energy loss due to the alternating magnetic field on the core material.

[0027] As an embodiment of the present invention, the calculation of the core heat source of the integrally molded inductor includes: The skin effect coefficient, hysteresis loss coefficient, eddy current loss coefficient, and residual loss coefficient of the integral molded inductor are analyzed using the electromagnetic-thermal coupling analysis network corresponding to the integral molded inductor. Determine the operating frequency and DC conductivity of the integrally molded inductor during operation; Calculate the current distribution density and magnetic flux distribution density of the integrally molded inductor during operation; Based on the skin effect coefficient, the operating frequency, and the DC conductivity, the winding heat of the integrally molded inductor is calculated using the following formula: ; in, Indicates the heat of the winding. This indicates the winding volume of a molded inductor. Represents the skin effect coefficient. Indicates the operating frequency. Represents the current distribution density. Indicates DC conductivity. This indicates integrating over the winding volume; Based on the magnetic flux distribution density, the core loss index and magnetic flux density amplitude of the integrally molded inductor are analyzed. Based on the core loss index, the magnetic flux density amplitude, the hysteresis loss coefficient, the eddy current loss coefficient, and the residual loss coefficient, the core loss heat of the integrally molded inductor is calculated using the following formula: ; in, This indicates the heat loss of the magnetic core. This indicates the core volume of a molded inductor. Indicates the operating frequency. Indicates the hysteresis loss coefficient. This indicates the core loss index. Indicates the magnitude of magnetic flux density. This represents the eddy current loss coefficient. Indicates the residual loss coefficient. This indicates integrating over the core volume; The core heat source of the integrally molded inductor is determined based on the heat loss of the magnetic core and the heat of the winding.

[0028] The skin effect coefficient refers to the degree of current concentration on the conductor surface at high frequencies. The hysteresis loss coefficient refers to the intensity of hysteresis loss of the core material under an alternating magnetic field. The eddy current loss coefficient refers to the intensity of loss caused by eddy currents in the core. The residual loss coefficient refers to the coefficient of irrational losses (such as magnetic aftereffects, domain wall resonance, etc.). The operating frequency refers to the signal frequency at which the inductor operates. The DC conductivity refers to the conductivity of the winding coil material under DC conditions. The current distribution density refers to the current distribution per unit area. The magnetic flux distribution density refers to the spatial distribution density of the magnetic field. The core loss index refers to the nonlinear relationship between core loss and magnetic flux density. The magnetic flux density amplitude refers to the maximum value of the magnetic flux density.

[0029] Optionally, the skin effect coefficient, hysteresis loss coefficient, eddy current loss coefficient, and residual loss coefficient of the integrally molded inductor can be determined by coupled simulation using the finite element method, such as COMSOL Multiphysics or ANSYS.

[0030] Optionally, the current distribution density can be calculated using electromagnetic field simulation, such as COMSOL or ANSYS Maxwell, while the magnetic flux distribution density can be calculated using finite element method simulation.

[0031] It needs to be explained that in this application, the formula... This represents the skin effect coefficient, with a value range of [0.01, 0.1]. The larger the value, the more concentrated the current is on the conductor surface, resulting in increased AC resistance, increased winding losses, and more severe heat generation. This represents the hysteresis loss coefficient, with a value range of []. , ], The larger the value, the larger the hysteresis loop area and the stronger the hysteresis loss. This represents the eddy current loss coefficient, with a value range of []. , ], The larger the value, the stronger the eddy current effect, resulting in a significant increase in core loss and more concentrated heat generation at high frequencies. This represents the residual loss coefficient, and its value range is []. , ], The larger the value, the more significant the non-ideal losses (such as magnetic aftereffects and dielectric losses), and the higher the total losses. This represents the core loss index, with a value range of [1.5, 2.5]. The larger the value, the faster the core loss increases at high frequencies, and the more significant the impact on the inductor's thermal management, efficiency, and reliability.

[0032] For example, the parameters of a molded inductor are shown in the table below. Table 1. Parameter Examples of Molded Inductors

[0033] The winding heat can be calculated using the example values ​​in Table 1. Heat loss in the magnetic core .

[0034] S2. Based on the core heat source, construct a heat distribution map of the integral molded inductor to determine the flow channel layout of the integral molded inductor, analyze the flow channel Nusselt number and flow channel friction factor of the corresponding microchannel of the integral molded inductor, and determine the flow channel geometry characteristics of the microchannel. Based on the flow channel layout, the flow channel Nusselt number, the flow channel friction factor, and the flow channel geometry characteristics, construct a microchannel heat dissipation network for the integral molded inductor.

[0035] This invention, by constructing a heat distribution map of the integrally molded inductor based on the core heat source, allows the microchannel layout to closely match the actual heat flow path, prioritizing the allocation of cooling resources to high-temperature areas. This significantly improves heat dissipation efficiency and targeting, effectively suppressing local hot spots and extending the inductor's lifespan. The heat distribution map refers to a visual chart showing the spatial distribution of heat generated within the windings and core of the integrally molded inductor during operation.

[0036] Optionally, the heat distribution map of the integrally molded inductor can be constructed using neural networks, such as CNN, GAN, etc.

[0037] This invention, through determining the flow channel layout of the integrally molded inductor, can significantly reduce local peak temperatures, prevent material thermal aging, extend inductor lifespan, reduce thermal stress concentration, lower the risk of structural deformation, and improve the mechanical stability of the inductor. The flow channel layout refers to the spatial distribution and connection method of the microchannel structure designed inside or on the surface of the integrally molded inductor to enhance heat dissipation performance.

[0038] As an embodiment of the present invention, determining the flow channel layout of the integrally molded inductor includes: Based on the heat distribution map corresponding to the integral molded inductor, identify the hot spot area of ​​the integral molded inductor; Analyze the temperature gradient in the hotspot region; Based on the heat distribution map, a heat power density map of the integrally molded inductor is generated; Based on the heat power density diagram and temperature gradient, the flow channel gradient distribution diagram of the integrally molded inductor is determined; Identify the stress concentration areas of the integrally molded inductor; The flow channel layout of the integrally molded inductor is determined based on the stress concentration area and the flow channel gradient distribution diagram.

[0039] The hotspot region refers to a localized area where the temperature of the inductor is significantly higher than the surrounding area during operation. The temperature gradient refers to the rate of temperature change per unit distance. The heat power density map is a graphical representation of the heat generated per unit volume or area within the inductor. The flow channel gradient distribution map is a spatial distribution of the designed flow channel parameters (such as width, depth, and spacing) based on the heat power density and temperature gradient. The stress concentration region refers to an area where, under thermo-mechanical loads, the local stress is significantly higher than the surrounding average stress.

[0040] Optionally, the temperature gradient of the hot spot area can be analyzed by finite element thermal simulation and reverse heat source identification technology. For example, based on the finite element thermal simulation model and combined with measured temperature data, the heat source distribution and temperature gradient can be inferred by reverse algorithm.

[0041] Optionally, the flow channel gradient distribution map of the integrally molded inductor can be determined by topology optimization algorithms, such as SIMP, Level Set, etc.

[0042] Optionally, the stress concentration area of ​​the integrally molded inductor can be identified by a combination of finite element simulation and topology optimization techniques. For example, the stress distribution of the inductor under mechanical and thermal loads can be simulated by finite element analysis, and the high-stress area can be identified by combining topology optimization algorithms (such as the SIMP method).

[0043] This invention, through analysis of the Nusselt number and friction factor of the microchannels corresponding to the integrally molded inductor, can optimize the channel cross-sectional shape (e.g., rectangular, circular, trapezoidal), channel spacing, bending radius, etc., to achieve a balance between heat transfer and resistance. The Nusselt number characterizes the intensity of convective heat transfer between the fluid and the channel wall. The friction factor characterizes the magnitude of the wall friction resistance experienced by the fluid flowing in the channel.

[0044] As an embodiment of the present invention, the analysis of the channel Nusselt number and channel friction factor corresponding to the microchannel of the integrally molded inductor includes: Identify the heat dissipation medium in the microchannel and analyze the medium characteristics of the heat dissipation medium; Calculate the Reynolds number of the heat dissipation medium based on the medium's properties; Based on the Reynolds number, the flow state of the heat dissipation medium is determined, wherein the flow state includes turbulent flow and laminar flow; Based on the flow state, calculate the channel Nusselt number and channel friction factor of the microchannel corresponding to the integrally molded inductor.

[0045] The heat dissipation medium refers to a fluid flowing in the microchannel to remove heat generated by the integrally molded inductor, such as water, ethylene glycol aqueous solution, liquid metal, or nanofluid. The medium properties refer to the physical and thermodynamic parameters of the heat dissipation medium, such as density, dynamic viscosity, thermal conductivity, specific heat capacity, and Prandtl number. The Reynolds number is the ratio of inertial force to viscous force used to characterize the fluid. The flow state refers to the flow pattern of the fluid in the microchannel. Turbulence refers to irregular fluid particle motion, with vortices and mixing, typically occurring under high Reynolds number conditions. Laminar flow refers to fluid flowing in layers without mixing, typically occurring under low Reynolds number conditions.

[0046] Optionally, the heat dissipation medium in the microchannel can be determined by a multi-objective optimization algorithm, such as automatically recommending the optimal medium based on heat exchange efficiency, flow resistance, and stability.

[0047] As another implementation, the Reynolds number can be calculated using the following formula: ; in, Represents the Reynolds number. Fluid density, representing the properties of a medium Indicates the fluid velocity in the microchannel. Indicates the hydraulic diameter of the microchannel. Fluid viscosity represents the properties of a medium.

[0048] The hydraulic diameter refers to a parameter in fluid mechanics used to describe the equivalent diameter of a non-circular cross-section flow channel. The fluid viscosity refers to the fluid's internal resistance to shear deformation, a physical quantity that measures the fluid's viscosity.

[0049] This invention, by determining the flow channel geometry characteristics of the microchannel, can improve heat transfer efficiency, reduce flow resistance, improve temperature uniformity, enhance structural strength, and support system integration and miniaturization. The flow channel geometry characteristics refer to the specific parameters and layout features of the microchannel in its physical morphology and structure, such as cross-sectional shape, channel length, curved structure, and channel density.

[0050] This invention, through the construction of a microchannel heat dissipation network for the integrally molded inductor based on the channel layout, the channel Nusselt number, the channel friction factor, and the channel geometry, can effectively eliminate local hot spots, achieve uniform overall temperature distribution of the inductor, extend its service life, eliminate the need for an additional heat sink, reduce system size and weight, and is suitable for space-constrained scenarios. The microchannel heat dissipation network refers to a thermal management system based on microscale channel structure design for efficient heat dissipation.

[0051] As an embodiment of the present invention, the step of constructing the microchannel heat dissipation network of the integrally molded inductor based on the channel layout, the channel Nusselt number, the channel friction factor, and the channel geometry includes: The flow channel layout is optimized based on the flow channel Nusselt number and the flow channel friction factor to obtain the optimized flow channel layout. Based on the optimized flow channel layout and the flow channel geometry, an initial heat dissipation network for the integrally molded inductor is constructed. The initial heat dissipation network was simulated and tested, and the simulation results were obtained. Based on the simulation test results, analyze the temperature distribution, flow rate distribution, and pressure distribution of the initial heat dissipation network. The overall network performance of the initial heat dissipation network is determined based on the temperature distribution value, the flow velocity distribution value, and the pressure distribution value. When the overall performance of the network meets the preset performance standards, the initial heat dissipation network is used as the microchannel heat dissipation network of the integrally molded inductor.

[0052] The optimized flow channel layout refers to the final flow channel design scheme formed by systematically adjusting the geometry, distribution, and flow path of the flow channels to improve heat dissipation efficiency and reduce flow resistance. The initial heat dissipation network refers to a microchannel heat dissipation system model initially constructed based on the optimized flow channel layout and combined with the geometric characteristics of the flow channels (such as cross-sectional shape, hydraulic diameter, length, and roughness). The simulation test results refer to the data output obtained after numerical simulation of the initial heat dissipation network using computational fluid dynamics (CFD) simulation software, such as temperature, flow velocity, and pressure. The temperature distribution value refers to the temperature data at each point in the heat dissipation network. The flow velocity distribution value refers to the flow velocity distribution of the heat dissipation medium in the flow channel. The pressure distribution value refers to the pressure change at each point in the flow channel. The comprehensive network performance refers to the comprehensive evaluation index of the heat dissipation network performance, including a comprehensive score across multiple dimensions such as heat dissipation efficiency, flow resistance, temperature uniformity, and energy consumption.

[0053] Optionally, the optimized flow channel layout can be obtained by a multi-objective genetic algorithm, such as taking the flow channel Nusselt number and flow channel friction factor as optimization objectives, generating multiple flow channel layout schemes iteratively through the genetic algorithm, and using the Pareto front to select the optimal solution set.

[0054] Optionally, the initial heat dissipation network of the integrally molded inductor can be constructed using multiphysics coupling techniques, such as thermal-fluid-structure interaction simulation and virtual prototyping techniques.

[0055] Optionally, the temperature distribution, flow rate distribution, and pressure distribution of the initial heat dissipation network can be analyzed using reinforcement learning algorithms, such as DQN and PPO.

[0056] S3. Determine the circulating heat dissipation path of the microchannel heat dissipation network, analyze the equivalent thermal conductivity of the heat dissipation medium corresponding to the microchannel heat dissipation network, and calculate the convective heat transfer coefficient and total heat dissipation of the microchannel heat dissipation network based on the circulating heat dissipation path and the equivalent thermal conductivity, so as to analyze the heat dissipation performance of the microchannel heat dissipation network.

[0057] This invention, by defining the circulating heat dissipation path of the microchannel heat dissipation network, can increase the effective heat exchange area, improve the convective heat transfer coefficient, significantly reduce hot spot temperature, avoid local overheating, and ensure that the inductor's operating temperature remains within a safe range. The circulating heat dissipation path refers to the complete thermal management path in which the cooling medium circulates according to a preset flow route within the microchannel heat dissipation network to remove the heat generated by the integrally molded inductor, and then dissipates the heat to the environment through an external heat dissipation device.

[0058] Optionally, the circulating heat dissipation path of the microchannel heat dissipation network can be determined by computational fluid dynamics simulation technology. For example, by using software such as ANSYS Fluent or COMSOL Multiphysics, a numerical model of fluid flow and heat transfer in the microchannel can be established to simulate the temperature field, pressure field, and velocity distribution under different paths. Based on topology optimization algorithms (such as the SIMP method), the circulating heat dissipation path can be automatically generated.

[0059] This invention quantifies the heat transfer capacity of the heat dissipation medium by analyzing the equivalent thermal conductivity of the corresponding heat dissipation medium in the microfluidic heat dissipation network, laying the foundation for subsequent analysis of heat dissipation effects. The equivalent thermal conductivity refers to the macroscopic thermal conductivity exhibited in multiphase, multi-component, and structurally complex media, after comprehensively considering multiple heat transfer mechanisms such as conduction, convection, and radiation.

[0060] Optionally, the equivalent thermal conductivity of the heat dissipation medium corresponding to the microchannel heat dissipation network can be determined by numerical simulation methods, such as ANSYS Fluent, COMSOL Multiphysics, and OpenFOAM.

[0061] This invention quantifies the heat dissipation effect of the microchannel heat dissipation network by calculating its convective heat transfer coefficient and total heat dissipation based on the circulating heat dissipation path and the equivalent thermal conductivity, providing a data foundation for subsequent heat dissipation performance analysis. The convective heat transfer coefficient refers to the physical quantity representing the efficiency of heat transfer between a fluid and a solid surface. The total heat dissipation refers to the total amount of heat transferred from the integrally molded inductor to the external environment or cooling medium by the microchannel heat dissipation network per unit time through heat conduction, convection, radiation, etc.

[0062] As an embodiment of the present invention, the step of calculating the convective heat transfer coefficient and total heat dissipation of the microchannel heat dissipation network based on the circulating heat dissipation path and the equivalent thermal conductivity includes: Determine the actual hydraulic radius of the flow channel heat dissipation network; The convective heat transfer coefficient of the microchannel heat dissipation network is calculated based on the Nusselt number corresponding to the microchannel heat dissipation network, the equivalent thermal conductivity, and the actual hydraulic radius of the channel. The effective heat dissipation area of ​​the microchannel heat dissipation network is determined based on the described circulating heat dissipation path. Determine the average temperature difference between the channel wall surface corresponding to the microchannel heat dissipation network and the heat dissipation medium corresponding to the microchannel heat dissipation network; The total heat dissipation of the microchannel heat dissipation network is calculated based on the effective heat dissipation area and the average temperature difference.

[0063] Wherein, the actual hydraulic radius of the flow channel refers to a dimensionless parameter describing the influence of the flow channel geometry on flow characteristics. The effective heat dissipation area refers to the surface area of ​​the flow channel wall that is in direct contact with the heat dissipation medium and participates in heat exchange. The average temperature difference refers to the difference between the temperature of the flow channel wall and the average temperature of the heat dissipation medium during the flow process.

[0064] Optionally, the actual hydraulic radius of the flow channel heat dissipation network can be determined by computational fluid dynamics inversion identification method.

[0065] Optionally, the convective heat transfer coefficient can be calculated using the following formula: ; in, Indicates the convective heat transfer coefficient. Represents the Nusel number, Indicates the equivalent thermal conductivity. This represents the actual hydraulic radius of the flow channel.

[0066] This invention, through analysis of the heat dissipation performance of the microchannel heat dissipation network, demonstrates its adaptive adjustment capability. This allows it to adapt to varying loads, avoiding frequency throttling or protection mechanisms caused by overheating, and ensuring continuous and efficient system operation. The heat dissipation performance refers to the microchannel heat dissipation network's ability to transfer heat and control temperature under specific operating conditions.

[0067] As an embodiment of the present invention, the analysis of the heat dissipation performance of the microchannel heat dissipation network includes: The heat transfer efficiency of the microchannel heat dissipation network is calculated based on the convective heat transfer coefficient corresponding to the microchannel heat dissipation network. Based on the total heat dissipation corresponding to the microchannel heat dissipation network, calculate the heat dissipation efficiency and thermal resistance of the microchannel heat dissipation network; The heat dissipation performance of the microchannel heat dissipation network is determined based on the heat exchange efficiency, the heat dissipation efficiency, and the thermal resistance.

[0068] The heat exchange efficiency refers to the ratio of actual heat exchange to the maximum possible heat exchange. The heat dissipation efficiency refers to the ratio of actual heat dissipation to input heat. The thermal resistance refers to the temperature difference generated when a unit of heat flows through the heat dissipation system.

[0069] Optionally, the heat exchange efficiency of the microchannel heat dissipation network can be calculated using theoretical methods, such as Newton's cooling method or LMTD method.

[0070] Optionally, the heat dissipation performance of the microchannel heat dissipation network can be determined by a regression model, such as random forest or XGBoost.

[0071] S4. Based on the heat dissipation performance, determine the circulation velocity of the microchannel heat dissipation network to perform circulating heat dissipation of the integrally molded inductor.

[0072] This invention, through determining the circulation velocity of the microchannel heat dissipation network based on the heat dissipation performance, can significantly improve heat exchange efficiency, enabling heat to be transferred more quickly from the heat source surface to the fluid, thereby reducing the heat source temperature. The circulation velocity refers to the speed at which the heat dissipation medium (such as water, coolant, etc.) flows within the channel.

[0073] As an embodiment of the present invention, determining the circulation velocity of the microchannel heat dissipation network based on the heat dissipation performance includes: Based on the heat dissipation performance, analyze the correlation coefficient between the convective heat transfer coefficient of the microchannel heat dissipation network and the flow velocity of the cooling medium corresponding to the microchannel heat dissipation network; Based on the correlation coefficient, the flow heat transfer coefficient-flow velocity curve of the microchannel heat dissipation network is constructed; Identify the peak value of the heat transfer coefficient-flow velocity curve; The circulation velocity of the microchannel heat dissipation network is determined based on the peak value of the curve.

[0074] The correlation coefficient refers to the strength of the mathematical relationship between the convective heat transfer coefficient and the flow velocity of the cooling medium. The convective heat transfer coefficient-flow velocity curve is a graph plotted with flow velocity on the x-axis and convective heat transfer coefficient on the y-axis. The peak value of the curve refers to the coordinate point of the maximum value of the convective heat transfer coefficient in the convective heat transfer coefficient-flow velocity curve.

[0075] Optionally, the correlation coefficient can be analyzed using a neural network regression model, such as a multilayer perceptron or a long short-term memory network.

[0076] Optionally, the flow heat transfer coefficient-flow velocity curve of the microchannel heat dissipation network can be constructed using multiphysics coupling simulation techniques, such as ANSYS Fluent, COMSOL Multiphysics, and OpenFOAM.

[0077] The embodiments of the present invention can significantly improve the thermal management performance of power electronic devices, reduce the operating temperature, and extend the inductor life by performing cyclic heat dissipation of the integrally molded inductor.

[0078] Compared to the problems described in the background art, this invention, by constructing an electromagnetic-thermal coupling analysis network for a monolithic inductor, accurately identifies the core heat source and establishes a heat distribution map based on this, thereby guiding the optimized layout and design of the microchannel heat dissipation network. First, it achieves precise heat dissipation design driven by the heat source. Through electromagnetic-thermal coupling analysis, the solution can accurately quantify winding heat and core loss heat, avoiding the blind spots of traditional empirical design. The construction of the heat distribution map allows the microchannel layout to closely conform to the actual heat flow path, prioritizing the allocation of cooling resources to high-temperature areas, greatly improving heat dissipation efficiency and targeting, thereby effectively suppressing local hot spots and extending the inductor's lifespan. Second, it optimizes the comprehensive matching of microchannel structure and flow performance. Based on the analysis of the channel Nusselt number and friction factor, the solution scientifically determines the geometric characteristics of the channel, ensuring high heat transfer performance while considering flow resistance and energy consumption. This structure-fluid synergistic optimization method enables the microchannel heat dissipation network to achieve optimal thermal-hydraulic performance within a limited space, especially suitable for the compact structural requirements of ultra-thin, small-sized inductors. Furthermore, the controllability and adaptability of the heat dissipation system are significantly improved. By introducing the equivalent thermal conductivity analysis of the heat dissipation medium and modeling the circulating heat dissipation path, the solution can accurately calculate the convective heat transfer coefficient and total heat dissipation, achieving quantitative evaluation and prediction of heat dissipation performance. Based on this, the circulation velocity can be dynamically adjusted according to actual operating conditions, enabling the heat dissipation system to maintain efficient and stable operation under different load conditions, exhibiting strong environmental adaptability and robustness. Finally, an innovative solution is provided for the thermal management of high power density electronic devices. This solution deeply integrates microchannel heat dissipation with molded inductors, not only breaking through the bottlenecks of traditional heat dissipation methods in terms of space, efficiency, and reliability, but also laying a technical foundation for the future development of electronic devices towards higher power, smaller size, and higher integration. Its systematic, multi-physics coupling design concept has good scalability and can be extended to the heat dissipation design of other high heat flux density electronic components, possessing broad engineering application prospects and market value. Therefore, the heat dissipation method for ultra-thin, small-size molded inductors provided in this embodiment of the invention can improve the heat dissipation effect of ultra-thin, small-size molded inductors.

[0079] like Figure 2 The diagram shown is a functional module diagram of an ultra-thin, small-sized, integrated inductor heat dissipation system according to the present invention.

[0080] The ultra-thin, small-size, integrated molded inductor heat dissipation system 200 described in this invention can be installed in electronic devices. Depending on the functions implemented, the ultra-thin, small-size, integrated molded inductor heat dissipation system may include a heat source analysis module 201, a heat dissipation network construction module 202, a heat dissipation performance analysis module 203, and a circulating heat dissipation execution module 204. The module described in this invention can also be referred to as a unit, which refers to a series of computer program segments that can be executed by the processor of an electronic device and can perform a fixed function, and are stored in the memory of the electronic device.

[0081] In this embodiment of the invention, the functions of each module / unit are as follows: The heat source analysis module 201 is used to fit the electromagnetic-thermal coupling analysis network of the integral molded inductor to calculate the core heat source of the integral molded inductor, wherein the core heat source includes: winding heat and core loss heat. The heat dissipation network construction module 202 is used to construct a heat distribution map of the integral molded inductor based on the core heat source, so as to determine the flow channel layout of the integral molded inductor, analyze the flow channel Nusselt number and flow channel friction factor of the microchannel corresponding to the integral molded inductor, and determine the flow channel geometry characteristics of the microchannel. Based on the flow channel layout, the flow channel Nusselt number, the flow channel friction factor and the flow channel geometry characteristics, the microchannel heat dissipation network of the integral molded inductor is constructed. The heat dissipation performance analysis module 203 is used to determine the circulating heat dissipation path of the microchannel heat dissipation network, analyze the equivalent thermal conductivity of the heat dissipation medium corresponding to the microchannel heat dissipation network, and calculate the convective heat transfer coefficient and total heat dissipation of the microchannel heat dissipation network based on the circulating heat dissipation path and the equivalent thermal conductivity, so as to analyze the heat dissipation performance of the microchannel heat dissipation network. The circulating heat dissipation execution module 204 is used to determine the circulating flow rate of the microchannel heat dissipation network according to the heat dissipation performance, so as to perform circulating heat dissipation of the integral molded inductor.

[0082] In detail, the modules in the ultra-thin, small-size, integrated inductive heat dissipation system 200 described in this embodiment of the invention employ the same methods as described above during use. Figure 1 The method is the same as the ultra-thin, small-size, one-piece molded inductor heat dissipation method described in the article, and can produce the same technical effect, so it will not be repeated here.

[0083] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0084] Finally, it should be noted that in the above embodiments, each embodiment can be combined with each other or independent. Deleting any one of them will not affect the technical implementation of other embodiments. The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for heat dissipation of an ultra-thin, small-sized, integrally molded inductor, characterized in that, The method includes: An electromagnetic-thermal coupling analysis network is fitted to a molded inductor to calculate the core heat source of the molded inductor, wherein the core heat source includes: winding heat and core loss heat. Based on the core heat source, a heat distribution map of the integral molded inductor is constructed to determine the flow channel layout of the integral molded inductor. The flow channel Nusselt number and flow channel friction factor of the corresponding microchannel of the integral molded inductor are analyzed, and the flow channel geometry characteristics of the microchannel are determined. Based on the flow channel layout, the flow channel Nusselt number, the flow channel friction factor, and the flow channel geometry characteristics, a microchannel heat dissipation network of the integral molded inductor is constructed. The circulating heat dissipation path of the microchannel heat dissipation network is determined, the equivalent thermal conductivity of the heat dissipation medium corresponding to the microchannel heat dissipation network is analyzed, and the convective heat transfer coefficient and total heat dissipation of the microchannel heat dissipation network are calculated based on the circulating heat dissipation path and the equivalent thermal conductivity to analyze the heat dissipation performance of the microchannel heat dissipation network. Based on the heat dissipation performance, the circulation velocity of the microfluidic heat dissipation network is determined to perform circulating heat dissipation of the integrally molded inductor.

2. The ultra-thin, small-size, one-piece molded inductor heat dissipation method as described in claim 1, characterized in that, Determining the flow channel layout of the integrally molded inductor includes: Based on the heat distribution map corresponding to the integral molded inductor, identify the hot spot area of ​​the integral molded inductor; Analyze the temperature gradient in the hotspot region; Based on the heat distribution map, a heat power density map of the integrally molded inductor is generated; Based on the heat power density diagram and temperature gradient, the flow channel gradient distribution diagram of the integrally molded inductor is determined; Identify the stress concentration areas of the integrally molded inductor; The flow channel layout of the integrally molded inductor is determined based on the stress concentration area and the flow channel gradient distribution diagram.

3. The ultra-thin, small-size, one-piece molded inductor heat dissipation method as described in claim 1, characterized in that, The analysis of the channel Nusselt number and channel friction factor of the integrally molded inductor corresponding to the microchannel includes: Identify the heat dissipation medium in the microchannel and analyze the medium characteristics of the heat dissipation medium; Calculate the Reynolds number of the heat dissipation medium based on the medium's properties; Based on the Reynolds number, the flow state of the heat dissipation medium is determined, wherein the flow state includes turbulent flow and laminar flow; Based on the flow state, calculate the channel Nusselt number and channel friction factor of the microchannel corresponding to the integrally molded inductor.

4. The ultra-thin, small-size, one-piece molded inductor heat dissipation method as described in claim 1, characterized in that, The step of constructing the microchannel heat dissipation network for the integrally molded inductor based on the channel layout, the channel Nusselt number, the channel friction factor, and the channel geometry includes: The flow channel layout is optimized based on the flow channel Nusselt number and the flow channel friction factor to obtain the optimized flow channel layout. Based on the optimized flow channel layout and the flow channel geometry, an initial heat dissipation network for the integrally molded inductor is constructed. The initial heat dissipation network was simulated and tested, and the simulation results were obtained. Based on the simulation test results, analyze the temperature distribution, flow rate distribution, and pressure distribution of the initial heat dissipation network. The overall network performance of the initial heat dissipation network is determined based on the temperature distribution value, the flow velocity distribution value, and the pressure distribution value. When the overall performance of the network meets the preset performance standards, the initial heat dissipation network is used as the microchannel heat dissipation network of the integrally molded inductor.

5. The ultra-thin, small-size, one-piece molded inductor heat dissipation method as described in claim 1, characterized in that, The electromagnetic-thermal coupling analysis network for fitting a monolithic inductor includes: The inductance geometry and material properties of the integrally molded inductor are collected; Based on the aforementioned inductor geometric features, a three-dimensional inductor model of the integrally molded inductor is fitted. Based on the material properties, the electromagnetic parameters, core parameters, and thermophysical parameters of the integrally molded inductor are determined. Based on the electromagnetic parameters and the magnetic core parameters, fit the electromagnetic field model of the integrally molded inductor; Based on the aforementioned thermophysical parameters, a heat conduction model for the integrally molded inductor is fitted. Determine the electric field-thermal coupling relationship of the integrally molded inductor; Based on the electric field-thermal coupling relationship, the three-dimensional inductance model, the electromagnetic field model, and the heat conduction model are integrated to obtain an electromagnetic-thermal coupling analysis network.

6. The ultra-thin, small-size, one-piece molded inductor heat dissipation method as described in claim 1, characterized in that, The calculation of the core heat source of the integrally molded inductor includes: The skin effect coefficient, hysteresis loss coefficient, eddy current loss coefficient, and residual loss coefficient of the integral molded inductor are analyzed using the electromagnetic-thermal coupling analysis network corresponding to the integral molded inductor. Determine the operating frequency and DC conductivity of the integrally molded inductor during operation; Calculate the current distribution density and magnetic flux distribution density of the integrally molded inductor during operation; Based on the skin effect coefficient, the operating frequency, and the DC conductivity, the winding heat of the integrally molded inductor is calculated using the following formula: ； in, Indicates the heat of the winding. This indicates the winding volume of a molded inductor. Represents the skin effect coefficient. Indicates the operating frequency. Represents the current distribution density. Indicates DC conductivity. This indicates integrating over the winding volume; Based on the magnetic flux distribution density, the core loss index and magnetic flux density amplitude of the integrally molded inductor are analyzed. Based on the core loss index, the magnetic flux density amplitude, the hysteresis loss coefficient, the eddy current loss coefficient, and the residual loss coefficient, the core loss heat of the integrally molded inductor is calculated using the following formula: ； in, This indicates the heat loss of the magnetic core. This indicates the core volume of a molded inductor. Indicates the operating frequency. Indicates the hysteresis loss coefficient. This indicates the core loss index. Indicates the magnitude of magnetic flux density. This represents the eddy current loss coefficient. Indicates the residual loss coefficient. This indicates integrating over the core volume; The core heat source of the integrally molded inductor is determined based on the heat loss of the magnetic core and the heat of the winding.

7. The ultra-thin, small-size, one-piece molded inductor heat dissipation method as described in claim 1, characterized in that, The step of calculating the convective heat transfer coefficient and total heat dissipation of the microchannel heat dissipation network based on the circulating heat dissipation path and the equivalent thermal conductivity includes: Determine the actual hydraulic radius of the flow channel heat dissipation network; The convective heat transfer coefficient of the microchannel heat dissipation network is calculated based on the Nusselt number corresponding to the microchannel heat dissipation network, the equivalent thermal conductivity, and the actual hydraulic radius of the channel. The effective heat dissipation area of ​​the microchannel heat dissipation network is determined based on the described circulating heat dissipation path. Determine the average temperature difference between the channel wall surface corresponding to the microchannel heat dissipation network and the heat dissipation medium corresponding to the microchannel heat dissipation network; The total heat dissipation of the microchannel heat dissipation network is calculated based on the effective heat dissipation area and the average temperature difference.

8. The ultra-thin, small-size, one-piece molded inductor heat dissipation method as described in claim 1, characterized in that, The analysis of the heat dissipation performance of the microchannel heat dissipation network includes: The heat transfer efficiency of the microchannel heat dissipation network is calculated based on the convective heat transfer coefficient corresponding to the microchannel heat dissipation network. Based on the total heat dissipation corresponding to the microchannel heat dissipation network, calculate the heat dissipation efficiency and thermal resistance of the microchannel heat dissipation network; The heat dissipation performance of the microchannel heat dissipation network is determined based on the heat exchange efficiency, the heat dissipation efficiency, and the thermal resistance.

9. The ultra-thin, small-size, one-piece molded inductor heat dissipation method as described in claim 1, characterized in that, Determining the circulation velocity of the microchannel heat dissipation network based on the heat dissipation performance includes: Based on the heat dissipation performance, analyze the correlation coefficient between the convective heat transfer coefficient of the microchannel heat dissipation network and the flow velocity of the cooling medium corresponding to the microchannel heat dissipation network; Based on the correlation coefficient, the flow heat transfer coefficient-flow velocity curve of the microchannel heat dissipation network is constructed; Identify the peak value of the heat transfer coefficient-flow velocity curve; The circulation velocity of the microchannel heat dissipation network is determined based on the peak value of the curve.

10. The ultra-thin, small-size, integrated inductive heat dissipation system as described in claim 1, characterized in that, The system includes: A heat source analysis module is used to fit the electromagnetic-thermal coupling analysis network of the integral molded inductor to calculate the core heat source of the integral molded inductor, wherein the core heat source includes: winding heat and core loss heat. The heat dissipation network construction module is used to construct a heat distribution map of the integral molded inductor based on the core heat source, so as to determine the flow channel layout of the integral molded inductor, analyze the flow channel Nusselt number and flow channel friction factor of the microchannel corresponding to the integral molded inductor, and determine the flow channel geometry characteristics of the microchannel. Based on the flow channel layout, the flow channel Nusselt number, the flow channel friction factor and the flow channel geometry characteristics, the microchannel heat dissipation network of the integral molded inductor is constructed. The heat dissipation performance analysis module is used to determine the circulating heat dissipation path of the microchannel heat dissipation network, analyze the equivalent thermal conductivity of the heat dissipation medium corresponding to the microchannel heat dissipation network, and calculate the convective heat transfer coefficient and total heat dissipation of the microchannel heat dissipation network based on the circulating heat dissipation path and the equivalent thermal conductivity, so as to analyze the heat dissipation performance of the microchannel heat dissipation network. A circulating heat dissipation execution module is used to determine the circulating flow rate of the microchannel heat dissipation network based on the heat dissipation performance, so as to perform circulating heat dissipation of the integrally molded inductor.

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