Nail correction method for improving integrity of surgery by reducing foreign body sensation and increasing adhesion using inward growing nail corrector

Abstract

Provided is a nail correction method for improving the integrity of a surgery by reducing foreign body sensation and improving adhesive power using an inward growing nail corrector. A nail correction method in which the feeling of foreign matter is reduced and the adhesive force is increased to improve the integrity of a program using an inward-growing nail wrap is a process in which an adhesive is applied to an inward-growing portion of one of inward-growing regions formed on both sides of a nail or a toenail, one side of the inward-growing nail wrap is fixed to the adhesive, and the adhesive is applied to the inward-growing portion of one of the inward-growing regions formed on both sides of the nail or toenail. The method comprises the following steps: applying an additional adhesive to an inner growing part of an inner growing part on the other side of an inner growing area formed on two sides of a nail or a toenail, fixing the other side of a nail support growing inwards to the adhesive, and adhering a nail cover growing inwards to the nail or the toenail as a whole. And adhering the inwardly growing fingernail cover as a whole to the fingernail or toenail.

Description

Technical Field

[0001] This invention relates to a nail correction method using an ingrown nail support, which uses an ingrown nail support to reduce the feeling of a foreign body and improve adhesion to increase the integrity of the procedure, and a nail correction method using an ingrown nail support to improve adhesion by reducing the feeling of a foreign body when the user corrects ingrown nails or toenails, thereby increasing the integrity of the procedure. Background Technology

[0002] Generally, ingrown toenails are a condition where the toenail of the thumb or big toe digs into the flesh, causing inflammation and pain.

[0003] These ingrown toenails can occur in various situations, such as when the toenail becomes deformed due to long-term neglect of nail fungus, when the nail tip naturally bends due to obesity or aging, or when the nail constantly presses against the flesh on the outside of the nail, such as when the nail is worn for a long time.

[0004] Most of these ingrown toenails are much thicker than normal toenails, which forces the toenails to dig into the flesh with greater force, resulting in increased inflammation and pain.

[0005] In addition, in order to correct ingrown toenails, it is necessary to stretch the tip of the toenail that has dug into the flesh, but because the toenails are thick, it is difficult to straighten the tip of the toenail.

[0006] On the other hand, these ingrown toenails can be treated surgically, but there are various orthodontic devices that can treat them without surgery.

[0007] Traditional orthodontic appliances apply glue to the top of the nail or toenail, while wire braces attach to ingrown toenails. However, the relatively thick layer of adhesive on the nail or toenail can interfere with other fingers or toes, potentially causing chafing. Furthermore, the relatively thick adhesive can create a foreign body sensation in users.

[0008] Furthermore, traditional orthodontic appliances present a problem: the technical difficulty of applying glue and fixing the appliances is high, and the results are uneven across treatment periods, leading to lower patient satisfaction. In addition, traditional orthodontic appliances can reduce orthodontic effectiveness and cause inconvenience to patients.

[0009] Existing technical documents

[0010] Patent documents

[0011] Patent Document 1: Korean 10-2001-0038873 Summary of the Invention

[0012] The problem that the invention aims to solve

[0013] This invention provides a nail correction method using ingrown nail supports to reduce foreign body sensation and improve adhesion, thereby increasing the integrity of the procedure by reducing foreign body sensation. When a user corrects ingrown nails or toenails, the foreign body sensation can be suppressed.

[0014] means for solving problems

[0015] According to one embodiment of the present invention, a nail correction method using ingrown nail supports to reduce the sensation of foreign objects and improve adhesion addresses the aforementioned problems. The method includes: applying an adhesive to an ingrown portion of one of the ingrown areas formed on either side of the nail or toenail; fixing one side of the ingrown nail support to the adhesive; applying additional adhesive to an ingrown area on the other side of the ingrown area formed on either side of the nail or toenail; fixing the other side of the ingrown nail support to the adhesive, applied to the ingrown portion on the other side, so that the ingrown nail support adheres as a whole to the nail or toenail; and correcting the temperature of the ingrown nail support and the body temperature of the ingrown nail or toenail, since one side of the ingrown nail support is separated from the other, while the other side of the ingrown nail or toenail is corrected.

[0016] The process of applying an adhesive to the inward-growing portion on the other side of the inward-growing area formed on both sides of the nail or toenail includes applying an adhesive to the nail or toenail with a thickness of 3 mm or more to 4 mm in both horizontal and vertical lengths; securing one side of the inward-growing nail cover to the adhesive on the other side of the inward-growing portion and adhering the inward-growing nail cover as a whole to the nail or toenail, while securing one side of the inward-growing nail cover to the inward-growing portion on the other side, and securing the other side of the inward-growing nail cover to the adhesive applied to the other side of the inward-growing area; covering the other side of the adhesive and the inward-growing nail support with a covering agent; pressurizing the covering agent onto the nail or toenail so that the other side of the inward-growing nail support contacts the nail or toenail; and curing the adhesive when the covering layer is pressed.

[0017] The process includes, prior to the application of an adhesive to one of the inner growth regions formed on either side of the nail or toenail, the preparation of an inward-growing nail support, the preparation of an adhesive including a preparation of a cover, and a process of hardening the adhesive under pressure from the cover; the formation of the adhesive and the other side of the inward-growing nail support under conditions where the other side of the inward-growing nail support is accommodated between the adhesive and the cover; pulling the inward-growing nail cover towards the inner growth region on the other side, while fixing one side to the inner growth portion on the other side, and placing the upper inward-growing nail... The process involves attaching one side of the nail extension to an adhesive applied to the ingrown area on the other side. Through this process, the ingrown nail extension, which has at least some elasticity, tilts so that its curvature corresponds to the outer surface of the nail or toenail. As the temperature difference between the ingrown nail extension and the body temperature of the nail or toenail decreases, one side of the ingrown nail extension and the other side of the ingrown nail extension separate from each other. This process corrects the ingrown portion of the nail or toenail. The ingrown nail extension responds to temperatures exceeding 20°C to less than 40°C, and the ingrown nail orthodontic device undergoes elastic deformation, resulting in a smaller curvature.

[0018] The ingrown nail support is an ingrown nail support; a pair of first ingrown nail correctors are connected to each side of the ingrown nail support, formed of a tiltable elastic material, and change into a preset shape in response to a first recovery temperature; and a pair of second ingrown nail correctors are connected to each side of the first ingrown nail correctors, formed of a tiltable elastic material, and change into a predetermined shape in response to a second recovery temperature; the pair of first ingrown nail correctors and the pair of second ingrown nail correctors are formed of an elastic shape memory alloy (SMA) material, and the pair of first ingrown nail correctors are configured to change from a tilted state to a horizontal state in response to a first recovery temperature, which is in contact with the outer surface of the nail or toenail during the tilted ingrown nail orthodontic process, in a temperature range of above 28°C to 40°C. A pair of second inward-growing nail orthotics are configured to respond to a second recovery temperature from an inclined state to a horizontal state during contact between the inclined inward-growing nail orthotics and the outer surface of the nail or toenail, and in response to the second recovery temperature, the temperature range being 20°C or higher to 32°C or lower, and the length of the second inward-growing nail orthotics is formed to be 1.2 to 1.5 times the protruding length of the first inward-growing nail orthotics.More than 5 times, the first internal growth nail corrector is prepared by a process of preparing a raw material containing multiple grain boundaries with different orientations from the austenite phase. The raw material is subjected to thermomechanical treatment to induce at least a portion of the austenite phase to transform into martensite. The coefficient of thermal expansion of the first internal growth nail corrector is adjusted according to the magnitude of the mechanical and thermal loads applied to the raw material. The thermomechanical treatment process includes applying a mechanical rod to the raw material and applying a hot rod to the raw material. At a predetermined temperature, this induces at least a portion of the austenite phase to deform into martensite, achieving anisotropic thermal expansion properties in the raw material. The application of the mechanical rod to the raw material increases the proportion of the martensite phase. The hot rod is applied at temperatures below and above the predetermined temperature. To further increase the proportion of the austenite phase, the second internal growth nail corrector is formed from a Ti-Ni-Hf shape memory alloy. The second internal growth nail corrector is made of Ni, Ti, The process of providing raw materials for each element, Hf and Ta, and the melting of each raw material by plasma generation, including the homogenization heat treatment process of the molten raw materials in a vacuum furnace, and the solidification process of the raw materials treated by homogenization heat treatment, the second internal nail corrector includes Ni above 46 at% to less than 50 at%, Ti above 42 at% and less than 47 at%, Hf from 42 at% to less than 47 at%, Ta from 3 at% to less than 12 at%, the temperature during the homogenization heat treatment process not exceeding 80°C. The temperature during the solution heat treatment process is above 800℃ and below 1000℃, and the adhering substances include bisphenol A diglycidyl ether, 1,6-bis(2,3-epoxypropoxy)hexane, and silver-based inorganic antibacterial agent. The main adhering components include bisphenol A diglycidyl ether in 100 parts by weight of the main adhesion part, 1,6-bis(2,3-epoxypropoxy)hexane in 100 parts by weight, and 14 parts by weight in 100 parts by weight. The silver-based inorganic antibacterial agent contains 0.Two parts by weight of the main adhesive portion and 100 parts by weight of the covering agent are used; and a covering adhesive is applied to the underside of the cover plate; the cover plate comprises 100 parts by weight of acrylic resin, 30-40 parts by weight of polylactic acid, 5-10 parts by weight of alumina powder, 5-10 parts by weight of yttrium, 10-15 parts by weight of CZ (N-cyclohexylbenzothiazole-2-sulfenamide), 8-12 parts by weight of Ds (dichlorodimethylsilane), 10-15 parts by weight of SB (sodium benzoate), and a mixture of silica powder and sodium silicate in a 1:20-30 weight ratio, with a 1:1 weight ratio of alumina powder and yttrium powder added. The covering adhesive is prepared by mixing the polymer monomer and free radical initiator into a styrene-ethylene-butene-styrene (SEBS) polymer grafted with maleic anhydride. The adhesive monomer is prepared by grafting an adhesive monomer onto a SEBS polymer. The adhesive monomer is selected from one or more of glycidyl methacrylate, 2-ethylhexyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate, β-carboxyethyl acrylate, and acrylic acid. The free radical initiator is selected from azobisisobutyronitrile, bis(2,4-dichlorobenzoyl)-peroxide, bis(2,4-dichlorobenzoyl)-peroxide, 1,1-bis(tert-butylperoxy-3,3,5-trimethylcyclohexane), bis(tert-butylperoxy)benzene, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, bis(tert-butylperoxyisopropyl)benzene (PK-14), tert-butylisopropylbenzene peroxide, and 2,5-dimethyl-2,5-bis(tert-butylperoxy)-hexane.

[0019] The inward-growing nail guard is an inward-growing nail support; a pair of first inward-growing nail correctors are connected to each side of the inward-growing nail support, formed of a tiltable elastic material, and change into a predetermined shape in response to a first recovery temperature; a pair of second inward-growing nail correctors are connected to each side of the first inward-growing nail correctors, formed of a tiltable elastic material, and change into a predetermined shape in response to a second recovery temperature; and a pair of second inward-growing nail correctors connected to each other on both sides of the second inward-growing nail correctors, formed of a tiltable elastic material, and change into a predetermined shape in response to a second recovery temperature; the second pair of inward-growing nail correctors are curved into a circle, in On both sides facing each other, there is a pair of third inward-growing nail correctors, the ends of which are formed of a supportable, tiltable elastic material, hooking onto the inner portion of the growth area inside the nail or toenail, and changing into a predetermined shape in response to a third recovery temperature; the first inward-growing nail corrector and the second inward-growing nail corrector of the pair and the third inward-growing nail corrector of the pair are formed of an elastic shape memory alloy (SMA) material, the first inward-growing nail corrector being configured to change from a tilted state to a horizontal state in response to a first recovery temperature (in the temperature range of 32°C to 40°C or lower), the temperature range of which is 32°C to 40°C or lower. A pair of second ingrown nail correctors are configured to contact the outer surface of the nail or toenail during the tilting ingrown nail sheath process and respond to a second recovery temperature ranging from 24°C or higher to 34°C or lower, and from the tilted state to the horizontal state. The pair of ingrown nail correctors are engaged within the inner portion of the ingrown area and configured to be deformable so that the curved portion straightens horizontally in the tilted state, responding to a third recovery temperature ranging from 20°C to 26°C or lower. The second ingrown nail corrector is formed with a length greater than 1.2 times to less than 1.5 times the length of the first ingrown nail corrector. A third ingrown nail corrector is formed with a length 0.5 times to 0.8 times the length of the second ingrown nail corrector. The third ingrown nail corrector is formed on the outer surface of the circular denim, gradually tapering to the inner side of the third ingrown nail corrector. The third ingrown nail correctors are spaced apart along the stretching direction of the third ingrown nail corrector; and in the ingrown area.Multiple obstructions protrude upwards from the end of the third inward-facing nail corrector so that they can be suspended and supported on the inner portion; the third inward-facing nail corrector is prepared by a process of cold-rolling an alloy composed of Zr: 30-50 at%, Nb: 0-10 at%, Sn: 1-3 at%, and the remainder Ti, annealing the alloy at a temperature of 550°C to 700°C, with Zr of 40-50 at%, Nb of 7-8 at%, and Sn of 1-2 at%. The third inward-facing nail corrector has a hyperelastic strain of more than 5% and a tensile strength of... A gel-like state is formed, consisting of a cover agent with a critical slip shear stress of 800 MPa or higher, attached to release paper on one side, having a predetermined area, and adhering to the adhesive portion of the adhesive applied to fingernails or toenails and the inward-growing nail support, forming a gel state between liquid and solid; the cover portion, attached to the other side of the adhesive, is made of a fabric composed of polyolefin fibers and filament fibers; the lengths of the release sheet and the adhesive are respectively between greater than 3 mm and less than 4 mm, and the adhesive is formed by a medium-adhesive material containing indium and gallium metals, and the adhesive is capable of... The ingrown nail support, formed of a conductive metallic material, changes from a gel state to a solid state. When it adheres to an adhesive applied to the nail or toenail and the ingrown nail support, at least partially, it is partially solidified in stages and adheres to the adhesive applied to the nail or toenail and the ingrown nail support. A release paper is formed on the side where the adhesive is attached. The adhesion includes friction portions protruding in a shape corresponding to the shape of the groove portion. The friction portions are internal friction meshes forming the inner angles of the friction portions. The outermost friction mesh, through penetrating the center, forms the outermost friction component. The outer corners form an elliptical ring shape to surround the inner friction mesh; multiple internal radial fragments extend radially from the periphery of the inner friction mesh and are connected to the outermost friction mesh; multiple internal circular pieces are interconnected by a pair of adjacent inner shafts to form a circle, with their centers adjacent to the inner friction mesh and spaced apart from the inner corner friction mesh to the outermost friction mesh; the thickness of the multiple inner main shafts and the plurality of inner circular pieces is less than the thickness of the outermost friction mesh, while the thickness of the plurality of inner main shafts and the plurality of inner circular pieces is 3 / 4 to less than 5 / 6 of the thickness of the outermost friction mesh, and the friction portion forms a spider web structure.

[0020] Invention Effects

[0021] According to the present invention, the ingrown nail sheath is primarily supported by an adhesive, and the upper part of the ingrown nail sheath is covered with a covering agent so as to inhibit or prevent the ingrown nail sheath or adhesive from interfering with other fingers or toes and causing abrasions.

[0022] In addition, the inward-growing nail sheath is supported by the first support with an adhesive, and the upper part of the inward-growing nail sheath is covered with a covering agent to provide a second support, thus having the function of stabilizing, fixing and supporting the inward-growing nail sheath. Attached Figure Description

[0023] Figure 1 This is a flowchart of a nail correction method according to an embodiment of the present invention, which uses inward-growing nail supports to reduce foreign body sensation, improve adhesion, and enhance procedure integrity.

[0024] Figure 2 It shows the shape of the nail or toenail and the area that grows inward.

[0025] Figure 3 A diagram showing an attachment attached to one side of a nail or toenail according to an embodiment is shown.

[0026] Figure 4 As shown, according to one embodiment, one side of the nail or toenail is connected to one side of the inward-growing nail orthodontic device, and according to one embodiment, a cover is connected.

[0027] Figure 5 The image shows the appearance of the other side of a fingernail or toenail according to one embodiment, the other side of an ingrown nail correction device, and the attachment cover according to one embodiment.

[0028] Figure 6 An embodiment is shown in which an ingrown nail support deforms into a preset shape in response to body temperature, and corrects the ingrown portion of the nail or toenail.

[0029] Figure 7 It is a diagram that details the structure of an inwardly growing nail orthodontic ball according to one embodiment.

[0030] Figure 8 It is a diagram that shows in detail the structure of a coverage system according to one embodiment.

[0031] Figure 9 This is a flowchart of a nail correction method according to another embodiment of the present invention, which uses an inward-growing nail support to reduce foreign body sensation and improve adhesion to enhance the integrity of the procedure.

[0032] Figure 10 It is a diagram that details the structure of an ingrown nail orthodontic according to another implementation scheme.

[0033] Figure 11 It is a diagram that shows in detail the structure of a coverage system according to another embodiment.

[0034] Figure 12This is a schematic diagram of correcting an ingrown area using an adhesive of another embodiment, an ingrown nail support of another embodiment, and a covering agent of another embodiment.

[0035] Figure 13 This is a flowchart of a nail correction method according to another embodiment of the present invention, which uses inward-growing nail supports to reduce foreign body sensation and improve adhesion to enhance procedure integrity.

[0036] Figure 14 An adhesive according to another embodiment, an inward-growing nail orthodontic device according to another embodiment, and a covering agent according to another embodiment are shown being sequentially attached to a fingernail or toenail.

[0037] Figure 15 The fixation on the other side of the inward-growing nail straightener according to another embodiment is shown.

[0038] Figure 16 An inward-growing nail support is shown according to another embodiment for fixing the inward-growing nail or toenail portion with a bend.

[0039] Figure 17 The fixation on the other side of another inward-growing nail corrector according to another embodiment is shown.

[0040] Figure 18 The correction of the inward-growing region is shown by one inward-growing nail support according to another embodiment and another inward-growing nail support according to another embodiment.

[0041] Figure 19 This is a schematic diagram illustrating an inward-growing nail orthodontic structure according to another embodiment.

[0042] Explanation of reference numerals in the attached figures

[0043] 10, 100, 1000: Attachments;

[0044] 20, 200, 2000: Inward-growing nail sheaths;

[0045] 30, 300, 3000: Coverage system. Detailed Implementation

[0046] The embodiments are described in detail below with reference to the accompanying drawings. However, various modifications can be made to the embodiments, and therefore the scope of the patent application is not limited to or restricted by these embodiments. Any alterations, equivalents, or substitutions to the implementation methods should be understood to be included within the scope of the claims.

[0047] The specific structural or functional descriptions of the embodiments are for illustrative purposes only and can be modified and implemented in various forms. Therefore, the embodiments are not limited to the specific form of disclosure, and the scope of this specification includes changes, uniformities, or substitutions incorporated into the descriptive ideas.

[0048] Terms such as "first" or "second" can be used to describe various components, but the interpretation of these terms should only be used to distinguish one component from another. For example, a first component can be named a second component, and similarly, a second component can be named a first component.

[0049] When a component is said to be "connected" to another component, it should be understood that it may be directly connected to another component or connected to that other component, but there may be another component.

[0050] The terminology used in the embodiments is for illustrative purposes only and should not be construed as limiting. Singular expressions include plural expressions unless the context clearly implies otherwise. In this specification, the terms "comprising" or "having" should be understood to mean the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described herein, and should not exclude the presence or addition of one or more other features or numbers, steps, actions, components, parts, or combinations thereof.

[0051] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments pertain. Terms as defined in common dictionaries should be interpreted as having the same meaning as they have in the relevant description and should not be interpreted in an idealistic or overly formal sense unless expressly defined in this application.

[0052] Furthermore, when describing the accompanying drawings, regardless of the drawing codes, the same reference numerals should be assigned to the same components, and identical repetitive descriptions should be omitted. When describing embodiments, detailed descriptions should be omitted if it is determined that a specific description of the relevant notifying technology might unnecessarily obscure the essence of the embodiment.

[0053] The advantages and features of the present invention, as well as the methods for achieving these advantages and features, will be illustrated by reference to the embodiments described in detail below and the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be practiced in various different forms. The embodiments are provided only to ensure that the disclosure of the invention is complete and to enable those skilled in the art to fully understand the scope of the invention, which is defined only by the class of the claims.

[0054] In embodiments of the invention, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Unless explicitly defined in embodiments of the invention, terms defined in common dictionaries should be interpreted as having the same meaning as in the relevant technical context, and should not be interpreted in an idealistic or overly formal sense.

[0055] The shapes, sizes, proportions, angles, and quantities disclosed in the accompanying drawings to illustrate embodiments of the present invention are illustrative and not limited to the matters shown. Furthermore, in describing the present invention, detailed descriptions should be omitted if it is determined that a detailed description of related known technologies might unnecessarily obscure the essence of the invention. When using terms such as "comprising," "possessing," and "completing" as used in this specification, other parts may be added unless "only" is used. This includes cases where components are represented in the singular, and includes the plural unless explicitly stated otherwise.

[0056] When interpreting a component, it will be interpreted as including a range of errors, even if not explicitly stated.

[0057] If the description of the positional relationship is "~above", "~top", "~below", "~side", etc., it can be placed between two parts unless "immediately" or "directly" is used.

[0058] The term "open" for an element or another element or layer includes any situation where another layer or other element is directly inserted into another device or is located in the middle of another device. Throughout the specification, the same reference numerals denote the same components.

[0059] The dimensions and thicknesses of each configuration shown in the figures are for illustrative purposes only, and the invention is not necessarily limited to the dimensions and thicknesses of the structures shown.

[0060] Features of each of the various embodiments of the present invention may be combined with each other in part or in whole, and as those skilled in the art will fully understand, they may be technically interlocked and driven, and each embodiment may be performed independently of each other or together in an association.

[0061] Figure 1 This is a flowchart of a nail correction method according to an embodiment of the present invention, which uses an inward-growing nail orthodontic device to reduce foreign body sensation and improve adhesion to enhance the integrity of the procedure. Figure 2 It is a drawing showing the appearance of a fingernail or toenail and the appearance of the ingrown part. Figure 3 The accompanying drawing shows an adhesive applied to one side of a nail or toenail according to one embodiment. Figure 4This is a drawing showing one side of an inward-growing nail corrector according to one embodiment on one side of a nail or toenail, and an adhesive for a covering agent according to one embodiment. Figure 5 It is a diagram showing the other side of an inwardly growing nail support according to one embodiment and a covering agent connected according to one embodiment. Figure 6 It is an image showing an ingrown nail support structure according to one embodiment that deforms into a preset shape in response to body temperature, correcting the ingrown portion of the nail or toenail. Figure 7 This is a drawing showing the structure of an inwardly growing nail support according to one embodiment. Figure 8 It is a diagram that shows in detail the structure of a coverage system according to one embodiment.

[0062] In the following text, refer to Figures 1 to 8 This describes a nail straightening method using an inward-growing nail straightener, which, according to an embodiment of the invention, reduces foreign body sensation and improves adhesion to enhance the integrity of the procedure.

[0063] In describing a nail correction method according to an embodiment of the present invention that uses an ingrown nail support to reduce foreign body sensation and improve adhesion and increase procedure integrity, a method for reducing foreign body sensation and improving adhesion using an ingrown nail support is described. This method reduces foreign body sensation and improves adhesion by using an adhesive 10 according to one embodiment, an ingrown nail support 20 according to one embodiment described later, and a covering agent 30 according to one embodiment, thereby improving procedure integrity.

[0064] According to one embodiment of the present invention, a nail correction method using an ingrown nail support to reduce the feeling of foreign objects and improve adhesion is a process of applying an adhesive 10 to an ingrown portion IN (ingrwon nail) of one of the ingrown regions IN formed on both sides of the nail or toenail N, a process of fixing one side of the ingrown nail corrector 20 (i.e., the second ingrown nail corrector 23) to the adhesive 10, a process of applying the adhesive 10 additionally to the other side of the ingrown region IN formed on both sides of the nail or toenail N, a process of fixing the other side of the ingrown nail support 20 to the attachment 10 on the other side of the ingrown region IN and adhering the ingrown nail support 20 as a whole to the nail or toenail N, and a process of reducing the temperature difference between the ingrown nail support 20 and the body temperature of the nail or toenail N, spacing one side and the other side of the ingrown nail support 20 apart from each other, and correcting the ingrown portion of the nail or toenail N as S150.

[0065] On the other hand, before applying the adhesive 10 to the inward growth portion IN of one of the inward growth areas formed on both sides of the nail or toenail N, the processes of preparing the inward-growing nail cover 20, preparing the adhesive 10, and preparing the covering agent 30 can be performed first.

[0066] Subsequently, the adhesive 10 can be applied to the inward growth region IN S110 on one side of the inward growth region IN formed on both sides of the nail or toenail N.

[0067] The process of applying adhesive 10 to the inward growth portion IN of one of the inward growth regions IN formed on both sides of the nail or toenail N includes applying an adhesive with a thickness of 10 to 1 mm to 1.2 mm or less, and a horizontal and vertical length of 3 mm to 4 mm or less, respectively. Therefore, the adhesive can be applied relatively thinly and over a wide area.

[0068] Subsequently, one side of the internally grown nail corrector 20 (i.e., the second internally grown nail corrector 23) can be fixed to the adhesive 10 S120.

[0069] Here, the process of attaching one side of the ingrown nail corrector 20 (i.e., the second ingrown nail corrector 23) to the adhesive 10 involves placing one side of the ingrown nail corrector 20 (i.e., the second ingrown nail corrector 23) onto the adhesive 10 and covering the upper part of the ingrown nail corrector 20 (i.e., the second ingrown nail corrector 23) located in the adhesive 10 with a covering agent 30. This involves the process of hardening the adhesive 10 toward the nail or toenail N under the pressure of the covering agent 30. Therefore, one side of the ingrown nail corrector 20 (i.e., the second ingrown nail corrector 23) can adhere to the nail or toenail N, while the adhesive 10 is covered by the covering agent 30 and simultaneously induced into the adhesive 10.

[0070] Subsequently, additional adhesive 10 can be applied to the other side S130 of the inward growth area IN formed on both sides of the nail or toenail N.

[0071] Here, the process of attaching the adhesive 10 to the inner growth region IN on the other side of the inward growth region IN formed on both sides of the nail or toenail N involves applying an adhesive thickness of 10 to 1 mm or more to 1.2 mm or less, and applying a horizontal and vertical length of not less than 3 mm to 4 mm respectively. Therefore, the adhesive 10 is relatively thin and can be widely applied.

[0072] Subsequently, the other side of the inward-growing nail support 20 can be fixed to the other side of the inward-growing nail support 20 to apply the fixation 10 to the inward-growing portion IN on the other side, so that the inward-growing nail support 20 can be adhered as a whole to the nail or toenail N S140.

[0073] Here, the process of fixing one side of the inward-growing nail support 20 to the adhesive 10 on the inward-growing portion IN on the other side and adhering the inward-growing nail support 20 as a whole to the nail or toenail N involves pulling the inward-growing nail support 20 towards the inward-growing portion IN on the other side, while fixing one side to the inward-growing portion on the other side (i.e., pulling from one side of the inward-growing nail support 20 to the other side). It involves fixing the other side of the inward-growing nail support 20 to the adhesive applied to the inward-growing area IN on the other side. Here, the inward-growing nail support 20, which is at least partially elastic, can be tilted to have a curvature corresponding to the peripheral surface of the nail or toenail.

[0074] In addition, the other side of the inward-growing nail support 20 is fixed to the attachment 10 on the inward-growing portion IN on the other side, and the inward-growing nail support 20 is adhered as a whole to the nail or toenail N, including the process of covering the other side of the adhered object 10 and the other side of the inward-growing nail support 20 with a covering agent 30.

[0075] In addition, the other side of the inward-growing nail support 20 is fixed to the fixation 10 on the inward-growing portion IN on the other side, and the inward-growing nail support 20 is adhered as a whole to the nail or toenail N, the covering agent 30 is compressed toward the nail or toenail N, and the other side of the inward-growing nail support 20 contacts the nail or toenail N.

[0076] In addition, the other side of the inward-growing nail support 20 is fixed to the attachment 10 on the inward-growing portion IN on the other side, and the inward-growing nail support 20 is adhered as a whole to the nail or toenail N, including the process of hardening the adhered object 10 when applying pressure cover 30.

[0077] Here, the process of curing the adhesive 10 under the pressure of the covering agent 30 involves forming the other side of the ingrown nail orthodontic device 20 and the covering agent 30 as a whole, wherein the other side of the ingrown nail support 20 is positioned between the adhesive 10 and the covering agent 30. Therefore, the two sides of the ingrown nail orthodontic device 20 are respectively fixed to the ingrown region IN on one side and the ingrown region IN on the other side, provided that the area between one side and the other side of the ingrown nail support 20 can be in close contact with the outer peripheral surface of the nail or toenail N.

[0078] Subsequently, as the temperature difference between the ingrown nail support 20 and the body temperature of the nail or toenail N decreases, one side of the ingrown nail support 20 and the other side of the ingrown nail support 20 separate from each other, and the ingrown area of ​​the nail or toenail N can be corrected S150.

[0079] Here, as the temperature difference between the ingrown nail support 20 and the body temperature of the nail or toenail N decreases, one side and the other side of the ingrown nail support 20 are spaced apart. The process of correcting the ingrown portion of the nail or toenail N involves the elastic deformation of the ingrown nail support 20, causing it to respond to temperatures above 20°C and below 40°C. In other words, the ingrown nail orthodontic device 20, formed of shape memory alloy (SMA) material, responds to temperatures above 20°C and below 40°C (i.e., temperatures similar to body temperature), stretching from an inclined to a horizontal curvature, and the ingrown nail support 20 horizontally elongates, thus correcting the ingrown area IN.

[0080] In the following description, the structure of the adhesive according to an embodiment of the present invention, using an inward-growing nail orthodontic device to perform a nail correction method, to reduce foreign body sensation and improve adhesion to enhance the integrity of the process, is described as follows: the structure of the adhesive 10 according to an embodiment, the inward-growing nail corrector 20 according to an embodiment, and the cover 30 according to an embodiment.

[0081] According to one embodiment, the adhesive 10 includes a primary adhesive (unknown) comprising bisphenol A diglycidyl ether, 1,6-bis(2,3-epoxypropoxy)hexane, and a silver-based inorganic antimicrobial agent.

[0082] According to one embodiment, the main adhesive portion 10 comprises bisphenol A diglycidyl ether 85 as a portion by weight of the main adhesive portion 100, 1,6-bis(2,3-epoxypropoxy)hexane as a portion by weight of the main adhesive portion 100, and an inorganic antimicrobial agent containing 0.2 g / w of silver as a portion by weight of the main adhesive portion 100. Therefore, the wall adhesive 10 has antimicrobial properties and provides antimicrobial properties to the user.

[0083] On the other hand, the adhesive 10 can be prepared using resin.

[0084] According to one embodiment, the inward-growing nail straightener 20 includes an inward-growing nail support 21, a pair of first inward-growing nail straighteners 22, and a pair of second inward-growing nail straighteners 23.

[0085] More specifically, according to one embodiment, the inward-growing nail orthodontic device 20 is connected to the inward-growing nail support 21 and both sides of the inward-growing nail support 21, and is formed of a tiltable elastic material, and is connected to a pair of first inward-growing nail correctors 22 and both sides of the pair of first inward-growing nail correctors 22, which are converted into a preset shape in response to a first recovery temperature, and are formed of a tiltable elastic material and are converted into a preset shape in response to a second recovery temperature.

[0086] The inward-growing nail support 21 is formed of an elastic shape memory alloy material.

[0087] A pair of first inward-growing nail straighteners 22 are connected to each side of the inward-growing nail support 21, are formed of a tiltable elastic material, and can be converted into a predetermined shape in response to a first recovery temperature.

[0088] Here, a pair of first ingrown nail correctors 22 are configured to change shape in response to a first recovery temperature from an inclined state to a horizontal state, the temperature range being above 28°C to 40°C, in response to the first recovery surface of the ingrown nail or toenail support 20 during the tilting process.

[0089] More specifically, the first inward-growing nail corrector 22 is prepared by preparing a raw material containing multiple grain boundaries that are oriented differently from the austenite phase, and by applying thermomechanical treatment to the raw material to induce at least a portion of the austenite phase to transform into the martensite phase.

[0090] Here, the coefficient of thermal expansion of the first inward-growing nail corrector 22 is adjusted according to the magnitude of the mechanical load and the heat load applied to the raw material.

[0091] Furthermore, the thermomechanical treatment of the raw material during the manufacture of the first inward-growing nail corrector 22 involves applying a mechanical bar to the raw material at a predetermined temperature and applying a hot bar to the raw material to induce deformation of the martensitic phase of at least a portion of the austenitic phase.

[0092] The raw material of the aforementioned first inward-growing nail corrector 22 is made to have anisotropic thermal expansion properties.

[0093] The process of applying a mechanical rod to the raw material involves applying a hot rod at a temperature below a predetermined temperature to increase the proportion of martensite phase, and applying a hot rod at a temperature relatively above a predetermined temperature to increase the proportion of austenite phase.

[0094] A pair of second ingrown nail correctors 23 are connected to each side of a pair of first ingrown nail correctors 22. The correctors are made of a tiltable elastic material and can be converted into a preset shape according to a second recovery temperature.

[0095] A pair of second inward-growing nail straighteners 23 are configured to, during the tilting process, as the inward-growing nail support 20 contacts the outer surface of the nail or toenail N, respond to a second recovery temperature and a temperature range of 20°C above and below 32°C, transition from a tilted state to a horizontal state. Therefore, the deformation of the pair of second inward-growing nail straighteners 23 is relatively earlier than that of the pair of first inward-growing nail straighteners 222. Since the deformation of the first inward-growing nail straightener 22 in the pair is relatively later than that of the second inward-growing nail straightener 23, correction can be performed to make it easier to straighten the ends of the inward-growing portion IN.

[0096] On the other hand, the length of the second inward-growing nail corrector 23 is greater than 1.2 times but less than 1.5 times the length of the first inward-growing nail corrector 22.

[0097] The second inward-growing nail corrector 23 is formed of a Ti-Ni-Hf shape memory alloy.

[0098] More specifically, the second growth nail calibrator 23 includes a process of supplying raw materials for each of the elements Ni, Ti, Hf and Ta, a process of melting each raw material into a plasma generating device, a process of homogenizing the molten raw material in a vacuum furnace, and a process of solidification heat treatment of the homogenized raw material.

[0099] In addition, the second inward-growing nail orthodontic device 23 includes Ni greater than or equal to 46 at% to less than or equal to 50 at%, Ti greater than or equal to 42 at% to less than or equal to 47 at%, Hf greater than or equal to 42 at% and less than or equal to 3 at% and less than or equal to 12 at%.

[0100] In addition, the temperature during homogeneous heat treatment can be above 800℃ and below 1000℃.

[0101] Furthermore, the temperature in the solution heat treatment well can be above 800℃ and below 1000℃.

[0102] According to one embodiment, the covering agent 30 includes a cover plate 31 coated on the lower part of a cover plate 31 and a covering adhesive 32.

[0103] The cover plate 31 is composed of 100 parts by weight of acrylic resin, 30-40 parts by weight of polylactic acid, 5-10 parts by weight of alumina powder, 5-10 parts by weight of yttrium, 10-15 parts by weight of CZ (N-cyclohexylbenzothiazole-2-sulfenamide), 8-12 parts by weight of Ds (dichlorodimethylsilane), 10-15 parts by weight of SB (sodium benzoate), and 20-30 parts by weight of a mixture of silica powder and sodium silicate, in a weight ratio of 1:1. Alumina powder and yttrium oxide powder are added at the same time, while maintaining a weight ratio of 1:1.

[0104] The covering adhesive 32 can be prepared by mixing the polymer monomer and free radical initiator into a styrene-ethylene-butene-styrene (SEBS) polymer grafted with maleic anhydride, and grafting the adhesive monomer onto the SEBS polymer.

[0105] Here, the adhesive monomer of the covering adhesive 32 may be selected from one or more of glycidyl methacrylate, 2-ethylhexyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate, β-carboxyacrylate, and acrylic acid.

[0106] In addition, the free radical initiators of the cover adhesive 32 are azobisisobutyronitrile (azobisisobutyronitrile), bis(2,4-dichlorobenzoyl peroxide (bis-(2,4-dichlorobenzoyl)-peroxide), benzoyl peroxide, di-tert-butyl benzoate peroxide, dibutyl peroxide, di-tert-butyl peroxide, 1,1-bis(tert-butyl peroxide)-3,3,5-trimethylcyclohexane, bis(tert-butyl peroxide)benzene, PK-14, tert-butylisopropylbenzene, 2,5-optionally dimethyl-2,5-bis(tert-butylperoxy)-hexane (2,5-dimethyl-2,5-bis(tert-butylperoxy)-hexane).

[0107] Figure 9 This is a flowchart of another embodiment of the nail correction method that uses inward-growing nail supports to reduce foreign body sensation and improve adhesion to enhance procedure integrity. Figure 10 11 is a detailed diagram showing the structure of an inwardly growing nail support according to another embodiment, and 12 is a detailed diagram showing the structure of a covering agent according to another embodiment. Figure 12 It is a diagram showing the use of an adhesive according to another embodiment, an ingrown nail support according to another embodiment, and a cover agent according to another embodiment to correct the ingrown area.

[0108] In the following text, see references Figures 9 to 12 The invention describes a nail straightening method using inward-growing nail supports, which, according to other embodiments of the invention, reduces foreign body sensation and improves adhesion to enhance the integrity of the procedure.

[0109] In describing a nail correction method that uses ingrown nail covers to reduce foreign body sensation and improve adhesion to enhance the integrity of the procedure, an adhesive 100 according to other embodiments of the invention, an ingrown nail orthodontic device 200 according to other embodiments, and a covering agent 300 according to other embodiments are described to reduce foreign body sensation and improve adhesion to enhance the integrity of the procedure.

[0110] According to another embodiment of the present invention, a nail correction method using an inward-growing nail support to reduce foreign body sensation and improve adhesion involves applying an adhesive 100 to an inward-growing portion IN of one of the inward-growing regions IN formed on both sides of the nail or toenail N; fixing a bent one-sided end of the inward-growing nail support 200 (i.e., the third inward-growing nail corrector 240) to one side of the inward-growing nail corrector 200 (i.e., the second inward-growing nail corrector 230) to the adhesive 100; applying additional adhesive 100 to the inward-growing region IN on the other side of the inward-growing region IN formed on both sides of the nail or toenail N; and bonding... In the process S230, agent 100 is applied to the inward growth region IN on the other side, the curved outer end of the inward-growing nail support 200 (i.e., the other side of the inward-growing nail corrector 200 (i.e., the second inward-growing nail corrector 230) is fixed to the adhesive 100 applied to the other side of the inward-growing nail corrector 240, and the inward-growing nail corrector 200 is adhered as a whole to the nail or toenail N, and the temperature difference between the inward-growing nail support 200 and the body temperature N of the nail or toenail is reduced, one side and the other side of the inward-growing nail support 200 are spaced apart from each other, and the inward-growing portions IN and N of the nail or toenail are corrected as S250.

[0111] On the other hand, before applying the adhesive 100 to the inward growth region IN formed on both sides of the nail or toenail N, the processes of preparing the inward growth nail support 200, preparing the adhesive 100, and preparing the covering agent 300 can be performed first.

[0112] The following describes the structures of adhesive 100, ingrown nail corrector 200, and cover agent 300 in other embodiments to utilize the ingrown nail corrector to reduce foreign body sensation and improve adhesion to enhance procedure integrity.

[0113] According to another embodiment, the adhesive 100 includes a primary adhesive (unknown) comprising bisphenol A diglycidyl ether, 1,6-bis(2,3-epoxypropoxy)hexane, and a silver-based inorganic antimicrobial agent.

[0114] According to another embodiment, the main adhesive portion of the adhesive 100 comprises bisphenol A diglycidyl ether 85 as a weight portion of the main adhesive portion 100, 1,6-bis(2,3-epoxypropoxy)hexane as a weight portion of the main adhesive portion 100, and 0.2 g / w of a silver inorganic antibacterial agent as a weight portion of the main adhesive portion 100. Therefore, the adhesive 100 has antibacterial properties and can provide antibacterial properties to the user.

[0115] On the other hand, the adhesive 100 can be prepared using resin.

[0116] According to another embodiment, the inward-growing nail straightener 200 includes an inward-growing nail support 210, a pair of first inward-growing nail straighteners 220, a pair of second inward-growing nail straighteners 230, and a pair of third inward-growing nail straighteners 240.

[0117] More specifically, according to another embodiment, an inward-growing nail straightener 200 is connected to an inward-growing nail support 210, both sides of the inward-growing nail support 210, and is made of a tiltable elastic material. It is connected to each side of a pair of first inward-growing nail straighteners 220, a pair of first inward-growing nail straighteners 220, and a pair of first inward-growing nail straighteners 220, which are connected to each side of a predetermined shape in response to a first recovery temperature. It is formed of a tiltable elastic material and changes into a predetermined shape in response to a second recovery temperature of a pair of second inward-growing nail straighteners 230. It is bent into a circle with both sides facing each other and the ends are formed of a supportable, tiltable elastic material that is held in place on the inner part of the inward growth region IN of the nail or toenail N. It also includes a pair of third inward-growing nail straighteners 240, which are converted into a predetermined shape in response to a third recovery temperature.

[0118] Here, a pair of first ingrown nail correctors 220, a pair of second ingrown nail correctors 230 and a pair of third ingrown nail correctors 240 are formed of elastic shape memory alloy (SMA) material.

[0119] The inward-growing nail support 210 is formed of an elastic shape memory alloy material.

[0120] A pair of first inward-growing nail straighteners 220 are connected to each side of the inward-growing nail support 210 and are formed of a tiltable elastic material that can be converted into a predetermined shape in response to a first recovery temperature.

[0121] Here, a pair of first inward-growing nail correctors 220 are configured to transition from an inclined state to a horizontal state in response to a primary recovery temperature during the process of the inclined inward-growing nail cap 200 contacting the peripheral surface of the nail or toenail N, the temperature range being 32°C or higher up to 40°C.

[0122] The first inward-growing nail corrector 220 according to another embodiment is formed of the same material and structure as the first inward-growing nail corrector 22 according to one embodiment, and can be manufactured in the same manner.

[0123] A pair of second inward-growing nail straighteners 230 are connected to each side of a pair of first inward-growing nail straighteners 220 and are formed of a tiltable elastic material that can be converted into a preset shape in response to a second recovery temperature.

[0124] Here, a pair of second inward-growing nail correctors 230 are configured to contact the peripheral surface of the nail or toenail N during the process of tilting the inward-growing nail support 200, and respond to a second recovery temperature ranging from 24°C to 34°C or lower, and change from a tilted state to a horizontal state.

[0125] Furthermore, the length of the second inward-growing nail corrector 230 is not less than 1.2 times the length of the first inward-growing nail corrector 220, but does not exceed 1.2 times the extension length.

[0126] The second inward-growing nail corrector 230 according to another embodiment is formed of the same material and structure as the second inward-growing nail corrector 23 according to one embodiment, and can be manufactured in the same manner.

[0127] A pair of third inward-growing nail correctors 240 are bent into a circle on both sides of a pair of second inward-growing nail correctors 230 to face each other. Their ends can hook onto the inner portion IP of the inner growth region IN of the nail or toenail N and are formed of a tiltable elastic material, configured to change into a predefined shape in response to a third recovery temperature.

[0128] In addition, a pair of third inward-growing nail straighteners 240 are attached to the inner IP of the inward-growing region IN and are configured to be modifiable so that the curved portion is horizontally straightened in response to a third recovery temperature, which ranges from above 20°C to below 26°C.

[0129] Furthermore, the length of the third inward-growing nail corrector 240 is 0.5 to 0.8 times the length of the second inward-growing nail corrector 230.

[0130] In addition, the third inward-growing nail corrector 240 includes a plurality of short larynxes 241 and a plurality of obstructions 242.

[0131] The plurality of short slots 241 are tapered on the outer surface of the round denim jeans, inside the third ingrown nail corrector 240, and spaced apart along the direction in which the third ingrown nail corrector 240 extends. During the unfolding of the third ingrown nail corrector 240, the width of the plurality of ingrown nail correctors 241 decreases, and the inner walls of the third ingrown nail corrector 240, which form the plurality of slots 241, can contact each other.

[0132] The plurality of cardstock 242 protrudes upward from the end of the third inward-growing nail straightener 240 so that it can be captured and supported by the inner IP of the inward-growing region IN. The plurality of barriers 242 may form a rounded shape with the protruding ends to avoid damaging the skin (not visible) bordering the inner IP of the inward-growing region IN.

[0133] On the other hand, the third inner growth nail corrector 240 can be prepared by cold rolling an alloy consisting of Zr: 30-50 at%, Nb: 0-10 at%, Sn: 1-3 at%, and the remaining Ti (and unavoidable impurities), and then annealing the cold-rolled alloy to a temperature of 550°C to 700°C.

[0134] Here, the alloy of the third endogenous nail corrector 240 can be composed of Zr of 40-50 at%, Nb of 7-8 at%, and Sn of 1-2 at%.

[0135] In addition, the third inward growth nail corrector 240 has a hyperelastic strain of 5% or higher, a tensile strength of more than 1 GPa, and a slip critical shear stress greater than 800 MPa.

[0136] The covering agent 300 consists of an adhesive portion 310 and a covering portion 320.

[0137] The adhesive component 310 is attached to the release paper T on one side, has a predetermined area, can be attached to the adhesive 100 and the inwardly growing nail support 200 applied to the nail or toenail N, and forms a gel state between liquid and solid.

[0138] The adhesive portion 310 and the release paper T have lengths greater than 3 mm and not exceeding 4 mm, respectively.

[0139] More specifically, adhesive 310 is formed from an interlayer adhesive material containing indium and gallium.

[0140] By applying adhesive 100 to the nail or toenail N, the adhesive 310 can be gradually changed from a gel state to a solid state, and the inward-growing nail orthodontic device 200 formed of at least partially conductive metal material 200 can change from a gel state to a solid state and adhere to the adhesive 100 and the inward-growing nail orthodontic agent 200 applied to the nail or toenail N.

[0141] On the other hand, the release paper T attached to the adhesive component 310 forms an inwardly recessed groove component OP on the side where the adhesive component 310 is attached, and its shape is mesh-like.

[0142] Correspondingly, the adhesive portion 310 includes a friction member 311 with a protruding shape corresponding to the shape of the groove portion OP.

[0143] The friction component 311 includes an inner friction web 311a, an outermost friction web 311b, an inner heat sink 311c, and an inner circular plate 311d.

[0144] The cabinet friction mesh 311a constitutes the largest cabinet of the friction component 311.

[0145] The outermost friction web 311b is formed, which surrounds the inner friction web 311a by penetrating the center, forming the outermost corner of the friction part 311 and forming an elliptical ring shape.

[0146] The internal radiating plates 311c are arranged in a plurality and extend radially from the periphery of the inner friction mesh 311a and are connected to the outermost friction mesh 311b.

[0147] The inner circular member 311d is provided with a plurality of inner members 311c, which connects a pair of adjacent inner radial members 311c. The center of the inner member 311c is adjacent to the center of the inner friction net 311a, and is separated from the outermost friction net 311b by the angle friction member 311a.

[0148] Furthermore, the thickness of the multiple internal radiative fragments 311c and multiple internal circular fragments 311d is thinner than the thickness of the outermost friction network 311b.

[0149] Furthermore, the thickness formed by the thickness of the complex internal radiation fragments 311c and the thickness of the complex internal discs 311d is greater than 3 / 4 and less than 5 / 6 of the thickness of the outermost friction web 311b.

[0150] For example, the friction component 311 forms a spider web structure.

[0151] On the other hand, the adhesion portion 310 can be provided with a mesoglue, i.e., a material containing indium (In) and gallium (Ga) metals, as described above. More specifically, the mesoglue can be fabricated by coating two comb-shaped metal nanorods with indium and gallium metals respectively, and then bonding each coated metal nanorod to an overlapping comb-shaped component. Therefore, when indium and gallium metals meet, a gel-like mesolayer can be created by utilizing the principle that it turns into a gel through a chemical reaction. Mesoglue typically remains in a gel state, but when it comes into contact with a conductive material (e.g., a metal), it liquefies the surface in contact with the metal material, and during the process of the metal surface becoming liquid, the liquid metal surface reverts to a solid state, and the mesoglue can also become solid. Utilizing these properties of mesoglue, materials formed of metals and materials formed of different materials can be joined together, or materials formed of metals can be bonded together.

[0152] Generally, metallic materials, due to the foreign film covering their surfaces, cannot match the wettability of ordinary adhesives. Here, wettability refers to the degree to which a substance readily diffuses, specifically the extent to which a liquid flows and diffuses upon contact with a solid. In other words, the foreign film prevents the adhesive from spreading across the metal surface, thus preventing it from adhering to the metal. Furthermore, because the coefficient of thermal expansion of metals differs from that of ordinary adhesives, interfacial breakdown may occur between the metal and the adhesive over time, leading to separation.

[0153] Therefore, by using mesoglobulin, which has excellent wettability, materials formed of metal can be bonded together. In other words, mesoglobulin can smoothly diffuse onto the surface of the contacting object, turning the surface of the metal object into a liquid state, and the metal material can be bonded to the prepared inward-growing nail orthodontic device 200 through the above-described bonding process.

[0154] The cover portion 320 is attached to the other side of the adhesive portion 310 and is made of a fabric composed of polyolefin fibers and silk fibers. Therefore, it feels more comfortable when the user applies pressure to the cover portion 320.

[0155] Figure 13 This is a flowchart of a nail correction method that uses an inward-growing nail orthodontic device according to another embodiment of the present invention to reduce foreign body sensation and improve adhesion to enhance procedure integrity. Figure 14 Figure 15 shows an attachment agent according to another embodiment, an inward-growing nail orthodontic device according to another embodiment, and a cover agent sequentially attached to a nail or toenail; Figure 16 shows a drawing showing the other side of the inward-growing nail support fixed according to another embodiment. Figure 16This is a diagram showing the curved end of another ingrown nail orthodontic treatment according to another embodiment, fixed to the ingrown portion of the nail or toenail. Figure 17 This is a diagram showing the fixation on the other side of another inward-growing nail orthodontic treatment according to another embodiment. Figure 18 This is a diagram showing an inwardly growing nail support according to another embodiment and another inwardly growing nail support according to another embodiment correcting the inwardly growing portion. Figure 19 This is a schematic diagram illustrating an inward-growing nail orthodontic structure according to another embodiment.

[0156] In the following text, refer to Figures 13 to 19 Another embodiment of the present invention describes a nail correction method that uses inward-growing nail supports to reduce foreign body sensation and improve adhesion to enhance the integrity of the procedure.

[0157] In describing a nail correction method according to another embodiment of the invention, which uses an inward-growing nail cover to reduce foreign body sensation, improve adhesion, and enhance procedure integrity, a method is described that uses an inward-growing nail cover to reduce foreign body sensation and improve adhesion. An adhesive 1000 according to another embodiment described later is used. An inward-growing nail orthodontic device 2000 according to another embodiment and a covering agent 3000 according to another embodiment are also described to reduce foreign body sensation and improve adhesion, thereby enhancing procedure integrity.

[0158] According to another embodiment of the present invention, a nail correction method using inward-growing nail supports to reduce foreign body sensation and improve adhesion involves applying an adhesive 1000 to an inward-growing portion IN of one of the inward-growing regions IN formed on both sides of the nail or toenail N, a bent one-sided end of any inward-growing nail corrector 2000 (i.e., applying a third inward-growing nail corrector 2400), and fixing one side of the inward-growing nail corrector 2000 (i.e., a second inward-growing nail corrector 2300) to the adhesive 1000 S320, and applying the adhesive 1000 to the central portion located between the two sides of the nail or toenail N. S330, the process of fixing the other side of the ingrown nail orthodontic bracket 2000 to the centrally applied adhesive 1000 (i.e., fixing the ingrown nail bracket 2100) and adhering an ingrown nail corrector 2000 as a whole to the nail or toenail N; S340, the process of applying the adhesive 1000 to another ingrown portion IN of the ingrown area IN formed on both sides of the nail or toenail; the process of applying the adhesive 1000 to the ingrown portion IN on the other side; S350, the process of adhering the curved one-sided end of another ingrown nail corrector 2000 to the inner portion IP of another ingrown nail corrector IN (i.e., applying the third ingrown nail corrector 2400) and attaching the other ingrown nail corrector 2000 to the nail or toenail N. The process of fixing one side of the nail 0 to the adhesive 1000 (i.e., the second ingrown nail corrector 2300) S360, applying the adhesive 1000 to the central portion located between the two sides of the nail or toenail S370, fixing the other side of the other ingrown nail corrector 2000 to the adhesive 1000 applied to the center (i.e., fixing the ingrown nail support 2100) such that the other ingrown nail alignment device 2000 is in close contact with the nail or toenail N as a whole S380, separating one side of the ingrown nail support 2000 and one side of the other ingrown nail support 2000 and the other side of the nail or toenail N from each other, and correcting the ingrown portion IN of the ingrown nail or toenail N S390.

[0159] Here, the process of applying the curved one-sided end of any ingrown nail corrector 2000 (i.e., the third ingrown nail corrector 2400) to the inner portion IP of the ingrown area IN on one side, and fixing one side of the ingrown nail corrector 2000 (i.e., the second ingrown nail corrector 2300) to the adhesive 1000 is the process of fixing one side of the ingrown nail corrector 2000 (i.e., the second ingrown nail corrector 2300) to the adhesive 1000 when fixing the second ingrown nail corrector 2300), and the process of placing the cover agent 3000 on the ingrown nail support connected to the adjacent agent 1000 and applying pressure to the deeply rooted cover agent 3000 are also included.

[0160] Furthermore, the process of securing the other side of an inward-growing nail support 2000 (i.e., an inward-growing nail support 2100) to the center to adhere the nail or toenail 2000 as a whole to the nail or toenail 2000S340 involves securing the other side of any inward-growing nail support 2000 (i.e., an inward-growing nail support 2100). While securing the other side of any inward-growing nail support 2000 (i.e., an inward-growing nail support 2100), the cover 3000 is located within the inward-growing nail support 2000 of the attachment 1000, and the deeply rooted cover 3000 is further pressurized.

[0161] Furthermore, the process of fixing one side of another inward-growing nail corrector 2000 (i.e., the third inward-growing nail corrector 2400) to the inner portion IP of another inward-growing nail corrector 2000 is applied to the adherent 1000, and the process of fixing one side of another inward-growing nail corrector 2000 (i.e., the second inward-growing nail corrector 2300) to the adherent 1000, and the process of fixing the cover 3000 to the inward-growing nail support 2000 of the adherent 1000 and pressurizing the deeply rooted cover 3000, on the side of another inward-growing nail corrector 2000 (i.e., when fixing the second inward-growing nail corrector 2300), also includes the process of fixing the cover 3000 to the inward-growing nail support 2000 of the adherent 1000.

[0162] Furthermore, the process of fixing the other side of another inward-growing nail support 2000 (i.e., the inward-growing nail support 2100) to the adhesive 1000 applied to the central portion, and adhering the other inward-growing nail support 2000 to the nail or toenail as a whole (S380) also includes the process of fixing the other side of another inward-growing nail support 2000 (i.e., the inward-growing nail support 2100) to the adhesive 1000 applied to the central portion, placing the cover 3000 on the inward-growing nail orthodontic device 2000, which is connected to the adjacent cover 1000, and applying pressure to the deeply rooted cover 3000.

[0163] On the other hand, the adhesive 1000 according to another embodiment described above can be prepared with the same structure and composition as the adhesive 100 according to another embodiment.

[0164] Furthermore, the covering system 3000 according to another embodiment described above can be fabricated with the same structure and configuration as the covering system 300 according to another embodiment.

[0165] The structure of an inwardly growing nail orthodontic device 2000 according to another embodiment is described below.

[0166] According to another embodiment, the ingrown nail straightener 2000 includes an ingrown nail support 2100, a first ingrown nail straightener 2200, a second ingrown nail straightener 2300, and a pair of third ingrown nail straighteners 2400. Furthermore, according to another embodiment, the third ingrown nail straightener 2400 includes a plurality of gussets 2410 and a plurality of obstructions 2420.

[0167] Here, according to another embodiment, the ingrown nail support 2100, the first ingrown nail corrector 2200, the second ingrown nail corrector 2300 and a pair of third ingrown nail correctors 2400, the plurality of guillotine grooves 2410 and the plurality of cardboard 2420 are configured according to different embodiments of the ingrown nail support 210, the first ingrown nail corrector 220, the second ingrown nail corrector 230 and the third ingrown nail corrector 240, respectively, and are formed in the same structure as the plurality of guillotine grooves 241 and the plurality of slide rails 242.

[0168] In this way, the ingrown nail sheath is supported by an adhesive as the main support, and a covering agent is applied to the upper part of the ingrown nail sheath. Therefore, the ingrown nail sheath or adhesive can be used to inhibit or prevent chafing from interfering with other fingers or toes. Furthermore, the ingrown nail sheath is supported by the first support with adhesive, and the upper part of the ingrown nail sheath is covered with a covering agent to provide a second support, thus providing a stable fixation and support for the ingrown nail sheath.

[0169] The embodiments of the present invention have been described in more detail with reference to the accompanying drawings. However, the present invention is not necessarily limited to such embodiments, and various modifications can be made without departing from the technical spirit of the present invention. Therefore, the embodiments disclosed in this invention are not intended to limit the technical concept of the present invention, but are intended to illustrate the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. Therefore, the above embodiments should be understood as illustrative and not limited in all respects. The scope of protection of the present invention should be interpreted in accordance with the following claims, and all technical ideas within the equivalent scope should be interpreted as falling within the scope of the claims of the present invention.

[0170] Therefore, other implementations, other methods of implementation, and implementations equivalent to the patent claims also fall within the scope of the following claims.

Claims

1. A nail correction method that improves surgical integrity by using an ingrown nail corrector to reduce foreign body sensation and increase adhesion, wherein, The nail correction method includes: Apply the adhesive to one of the inward-growing areas formed on the sides of the nail or toenail; The process of attaching one side of the inward-growing nail support to the adhesive on top; The process of applying an adhesive to the inner growth zone on the other side of the inner growth zone formed on the sides of the nail or toenail; The process of securing one side of the ingrown nail support to the adhesive is applied to the ingrown portion on the other side, so that the ingrown nail support adheres as a whole to the nail or toenail; and As the temperature difference between the ingrown nail support and the body temperature of the nail or toenail decreases, one side of the ingrown nail support separates from the other side, and the ingrown portion of the nail or toenail is corrected.

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