Mainboard and server

Abstract

The invention discloses a mainboard and a server, and relates to the technical field of servers. According to the mainboard and the server, all functions of the mainboard of the server are modularly designed to form all functional modules, and all the functional modules are detachably connected with a management carrier plate by adopting a unified high-speed data interface standard; according to the invention, rapid plugging and replacement can be realized, the convenience of upgrading and maintaining the server component is improved, the installation module can be flexibly selected to be installed to the corresponding function module according to the configuration requirement, the use of redundant modules is reduced, and the configuration cost and the occupied space are reduced; a uniform high-speed data interface standard is adopted for different functional modules, so that high-speed transmission of data among the different functional modules is ensured; the identification circuit is arranged in the function module, so that when the function module exists, the in-place signal contact in the identification circuit is pulled to a low level, the connection state of each function module is obtained, and the management efficiency and flexibility are further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, and particularly relates to a mainboard and a server. BACKGROUND

[0002] With the continuous development of server technology, the functions contained on the server mainboard are more and more rich. The current server mainboard basically concentrates the design of each functional hardware on a board card, and the storage and other expansion functions are realized through an external expansion small board. According to the design requirements and structure design, different projects basically need to open a complete mainboard for adaptation, which leads to low board card reusability, and the number and complexity of components on the server mainboard are large, and once a fault occurs, the difficulty of troubleshooting and maintenance is large, when the hardware is damaged, the entire mainboard needs to be replaced, which is low in flexibility and efficiency, and is easy to cause resource waste. SUMMARY

[0003] The present application provides a mainboard and a server, to at least solve the problem of low flexibility and low efficiency of the server mainboard in the related art.

[0004] The present application provides a mainboard, comprising: a plurality of functional modules, at least including a core module, a high-speed module, a network module and an input and output module; the plurality of functional modules are respectively provided with an identification circuit; a management carrier plate, detachably connected with the plurality of functional modules through a plurality of connectors; the plurality of connectors adopt a unified high-speed data interface standard; the identification circuit is connected with the connector corresponding to the functional module; the management carrier plate is used for reading the identification signals corresponding to the plurality of functional modules from the identification circuit respectively, to determine the connection state of the plurality of functional modules respectively; the identification circuit at least includes a ground contact, a power contact and an in-place signal contact with the extension length decreasing in turn; the functional module is used for pulling down the level of the in-place signal contact when the corresponding connection state is connected; the management carrier plate is further used for determining the connection state of the corresponding functional module according to the level of the in-place signal contact.

[0005] The present application further provides a server comprising the above mainboard.

[0006] This application modularizes the various functions of the server motherboard into functional modules. These modules are then detachably connected to the management carrier board using a unified high-speed data interface standard. In case of failure, these modules can be quickly swapped out without replacing the entire motherboard, reducing maintenance costs and complexity. This improves the ease of server component upgrades and maintenance, accelerates product iteration and innovation, and allows for flexible selection of installation modules based on configuration requirements, significantly enhancing system flexibility and scalability. Furthermore, installing these modules onto their corresponding functional modules to connect to the management carrier board reduces redundant modules, enabling precise configuration and efficient utilization of hardware resources. The system enhances hardware reusability, reducing configuration costs and space requirements. By adopting a unified high-speed data interface standard for different functional modules, it ensures high-speed data transmission between modules, effectively solving the multi-module compatibility problem and enhancing system reliability and stability. Furthermore, by incorporating identification circuits within functional modules, the presence signal pin is pulled low when a module is present, allowing the system to obtain the connection status of each module and further improving management efficiency and flexibility. Finally, by setting ground contacts, power contacts, and presence signal contacts with sequentially decreasing extension lengths, hot-swapping of functional modules is possible, ensuring safety and stability during module connection. Attached Figure Description

[0007] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of a motherboard structure provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of the functional modules provided in the embodiments of this application; Figure 3 This is a schematic flowchart of a motherboard control method provided in an embodiment of this application; Figure 4 A schematic diagram illustrating the communication between the management carrier board and various functional modules provided in this embodiment of the application; Figure 5 This is a structural block diagram of a motherboard control device according to an embodiment of this application; Figure 6 This is a schematic diagram of the hardware structure of a computer device according to an embodiment of this application. Detailed Implementation

[0009] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0010] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0011] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0012] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0013] With the continuous development of server technology, server motherboards contain increasingly rich functions. Current server motherboards generally integrate all functional hardware designs onto a single board, with expansion functions such as storage implemented through external expansion boards. Depending on design requirements and structural design, different projects typically require a completely new motherboard for adaptation, resulting in low board reusability. Depending on the project configuration, some functions on the motherboard may not be used, leading to redundant design and wasted resources. Motherboards in different projects may contain duplicate functional designs, and designs based on the same hardware principles can lead to different failures due to inconsistent design layouts in different projects. These failures cannot be resolved uniformly, easily resulting in wasted manpower and time costs.

[0014] In addition, server motherboards have a large number of complex components, making troubleshooting and repair difficult once a fault occurs. When hardware is damaged, the entire motherboard needs to be replaced, which is inflexible, inefficient, and can easily lead to a waste of resources.

[0015] Based on this, embodiments of this application provide a motherboard. Figure 1 This is a schematic diagram of a motherboard provided in an embodiment of the present application. The motherboard includes a management carrier board and multiple functional modules.

[0016] These multiple functional modules include at least a core module, a high-speed module, a network module, and an input / output module. The core module configures the processor and memory, including power supply design and signal configuration design related to the processor and memory. The high-speed module configures high-speed signal links and can be equipped with different settings to meet various peripheral expansion needs. The network module configures the Ethernet controller, network interface circuitry, and related network acceleration chips. The input / output (I / O) module configures input / output interfaces and input devices.

[0017] Optionally, the functional module includes a carrier and a circuit that can be detachably mounted on the carrier. The circuit that can be detachably mounted on the carrier can be an installation module corresponding to the functional module, which can be selected according to actual needs. For example, the installation module corresponding to the core module can be various types of processors, memory, etc.

[0018] Each of these multiple functional modules is equipped with an identification circuit. In other words, each functional module has a corresponding identification circuit that can provide an identification signal to indicate the connection status of the corresponding functional module.

[0019] The management carrier board is detachably connected to the multiple functional modules via multiple connectors, with each connector corresponding to one functional module. In other words, each functional module is detachably connected to the management carrier board through a single connector. Each connector is a physical component used to connect different circuits or devices, enabling signal and power transmission. These connectors employ a unified high-speed data interface standard and serve as the physical carrier for implementing the high-speed data interface. The management carrier board houses the multiple functional modules, providing a channel for interconnection between them. It also includes management and control functions, such as battery management.

[0020] The identification circuit is connected to the connector corresponding to the functional module, enabling the management board to read the identification signal of the identification circuit through the connector. The management board is used to read the identification signals corresponding to the multiple functional modules from the identification circuit to determine the connection status of the multiple functional modules respectively.

[0021] The identification circuit includes at least a ground contact, a power contact, and an in-situ signal contact with sequentially decreasing extension lengths. The functional module is used to pull the level of the in-situ signal contact low when the corresponding connection state is connected. The management board is also used to determine the connection state of the corresponding functional module based on the level of the in-situ signal contact.

[0022] In related technologies, server motherboards have tightly integrated components, with each function designed as a single unit. When a component's performance is insufficient or malfunctions, upgrading or replacing it becomes extremely complex, potentially requiring extensive replacements. For example, upgrading a processor might necessitate replacing the entire motherboard, as the motherboard socket, power supply, and cooling are all designed around the processor, resulting in wasted resources and time. This application addresses this by modularizing the server motherboard's functions into functional modules. These modules are then detachably connected to the management board using a unified high-speed data interface standard, allowing for rapid replacement in case of failure. For instance, the core module of this application can be configured with an independent computing module, detachably connected to the management board via a high-speed connector. This independent computing module includes a processor, memory controller, and some cache. If this module fails, the entire motherboard doesn't need to be replaced; only the independent computing module needs upgrading to meet the computing performance requirements of different business stages, significantly improving the convenience of server component upgrades and maintenance.

[0023] With the diversification of server application scenarios, different types of functional modules need to be integrated, such as GPUs (Graphics Processing Units) for deep learning acceleration, FPGAs (Field-Programmable Gate Arrays) for specific algorithm acceleration, and high-speed storage expansion modules for big data storage. However, the interfaces of server motherboards in related technologies are complex, and the interface standards of each functional module are inconsistent, leading to frequent compatibility issues. For example, a new high-speed storage module may not work properly on an older server motherboard due to incompatible interface protocols. Even if the physical form of the interface is the same, differences in signal transmission specifications may result in unstable data transmission or even failure to recognize the data. In this application, a unified high-speed data interface standard is adopted for different functional modules. This high-speed data interface standard defines the data transmission format, timing, control signals, and electrical characteristics to establish a unified data transmission logic specification, ensuring high-speed data transmission and communication compatibility between different functional modules, effectively solving the multi-module compatibility problem.

[0024] Optionally, when designing a unified high-speed data interface standard for different functional modules, a high-speed data interface protocol is first selected. Next, hardware protocol layer optimization is performed. Specifically, the protocol stack is reconstructed based on the high-speed data interface protocol, optimizing the Physical Layer (PHY) and Data Link Layer (DLL). Adaptive equalization technology is employed, dynamically adjusting the transmitter pre-emphasis and receiver equalization parameters to compensate for signal attenuation differences when different modules are connected. A time delay synchronization mechanism is used to introduce global timestamps for these multiple functional modules, resolving clock skew issues caused by differences in cable length or PCB traces. Channel bonding technology is used for multi-channel aggregation and splitting. When a functional module is connected, the number of channels in the functional module is identified, and the channels to be enabled or disabled are determined based on the number of channels. For example, when connecting an x16 functional module, all 16 channels are enabled; when connecting an x4 functional module, 4 channels are enabled, and other redundant channels are disabled to reduce power consumption. Next, interface standardization design is implemented to ensure mechanical and electrical compatibility. Specifically, a unified physical interface is set up, and an expandable slot design is adopted. Compatibility is achieved through pin definition multiplexing and foolproof structure optimization. Pin definition multiplexing can be achieved by fixing the position of key signal pins (such as differential pairs and reference clocks) and dynamically allocating auxiliary pins according to module requirements. Foolproof structure optimization can be achieved by setting mechanical locking for slots to support functional modules of different sizes (such as full-height / half-height) to avoid misinsertion. Electrical characteristic adaptation design is also implemented, such as setting an adaptive voltage regulation module to dynamically adjust the power supply voltage and current according to the requirements of the connected functional modules to ensure compatibility with high-power functional modules (such as graphics processors) and low-power functional modules (such as memory modules). Dynamic resource allocation and system collaboration mechanisms can also be configured. Specifically, a bandwidth-on-demand allocation mechanism can be set up, using non-transparent bridging (NTB) technology to ensure isolated communication between different functional modules, and priority-based flow control to allocate bandwidth to functional modules with high real-time requirements. Firmware-level collaboration functions can be set up, using a pre-built functional module identification database to detect the type of a functional module upon access, automatically load the corresponding driver, and initialize the link width and speed corresponding to the functional module. Verification and debugging mechanisms can also be set up. Specifically, a compatibility test suite can be set up to establish a modular certification system, such as signal integrity testing and protocol conformance testing. Hot-swap support can be set up, inrush current suppression can be implemented when functional modules are hot-swapped, and link status can be monitored in real time. When a link is interrupted, the system can be notified to re-enumerate devices.

[0025] For example, this high-speed data interface standard is deeply optimized based on the PCI-Express (Peripheral Component Interconnect Express) protocol, and can be compatible with multiple speed and bandwidth configurations such as PCI-Express 4.0 x4, x8, and x16, allowing various functional modules to be connected smoothly.

[0026] Server configurations in related technologies may not require the full functionality of the original motherboard. For example, a single-processor configuration may not require multi-processor configurations, and a low-power configuration may not require multi-power modules. To address this issue in related technologies, the only solution is to manage component configurations on the original motherboard to reduce component usage. However, existing redundant designs on the original motherboard cannot be eliminated, wasting material and time resources, and resulting in significant space waste. In this application, however, functional modules can be installed or removed according to configuration requirements. Installation modules that can be detached and mounted on the carrier of the functional modules can be flexibly selected, and then installed onto the corresponding functional modules to connect to the management carrier board. This reduces the use of redundant modules, lowers configuration costs, and reduces space requirements.

[0027] Optionally, the presence signal contact is connected to the functional module and management board via a specific pin of the connector. On the functional module side, the presence signal contact is pulled down to ground, so that when the functional module is present, the presence signal contact is pulled low. On the management board side, the presence signal pin corresponding to the presence signal contact is pulled up to the monitoring module in the management board, so that the management board will pull the presence signal pin high by default. When the functional module is not present, the pull-up resistor on the management board will keep the presence signal pin high. When the monitoring module in the management board detects a high level, it determines that the functional module is not present and does not load the driver or configuration related to that functional module.

[0028] Optionally, the identification circuit includes a first presence signal contact and a second presence signal contact. The functional module is further configured to pull down the level of both the first and second presence signal contacts when the corresponding connection status is "connected." The management board is further configured to determine that the functional module is connected when it detects that both the first and second presence signal contacts are low. By setting dual presence signal contacts, the accuracy of detecting the connection status of the functional module can be further ensured, avoiding errors in judging the connection status of the functional module due to a single presence signal contact failure, and preventing losses caused by premature connection.

[0029] In one optional embodiment, the power contact includes a pre-charge power contact and a main power contact; the extension length of the pre-charge power contact is greater than the extension length of the main power contact; the management board is also used to sequentially connect each contact according to its extension length from longest to shortest. By setting the management board to connect each contact sequentially according to its extension length from longest to shortest, it can be ensured that each contact is connected in the set extension length order. That is, contacts with different extension lengths can be pre-set for different functions according to actual needs to achieve the required functional connection sequence. For example, setting the extension length of the pre-charge power contact to be greater than the extension length of the main power contact enables pre-charging before formal power supply, improving safety when connecting functional modules.

[0030] Optionally, the identification circuit includes multiple gold finger contacts with different extension lengths; each gold finger contact includes at least a ground contact, a power contact, and an in-position signal contact with sequentially decreasing extension lengths; the connector is a gold finger socket corresponding to the multiple gold finger contacts; the gold finger socket has pins corresponding to each of the multiple gold finger contacts. By setting multiple gold finger contacts with different extension lengths, when a functional module is connected to the corresponding connector, the different gold finger contacts are connected to the connector in order of their extension lengths. For example, at least the ground contact is connected first to ground the system, preventing surge current damage to the power system. Then, power is supplied through the power contact, and the in-position signal contact ensures a normal connection status, thereby enabling hot-swapping of functional modules. This ensures that various functional modules can be replaced even while the motherboard is running, improving flexibility and safety.

[0031] In one optional implementation, the functional module further includes a storage unit for storing attribute information of the functional module. This attribute information includes at least module type, module model, protocol type, maximum power consumption, firmware version, and compatibility information. The identification circuit also includes a bus interface contact. The extension length of the bus interface contact is less than that of the presence signal contact. The management board is further configured to read the attribute information of the corresponding functional module through the bus interface contact when the level of the presence signal contact is low. By setting corresponding storage units and corresponding bus interface contacts for each functional module, the attribute information of the corresponding functional module can be read through the bus interface contact. Furthermore, the management board can automatically configure the functional module based on its attribute information, further improving the flexibility and convenience of the solution.

[0032] In one optional implementation, the management board is further configured to determine that the functional module is falsely present and issue an alarm when the level of the presence signal contact is low and the number of communication failures detected with the bus interface contact reaches a preset number. The presence signal contact may erroneously go low due to dust accumulation or other reasons. By combining this with the communication status of the bus interface contact, the connection status of the functional module can be further determined, thereby improving the accuracy of the solution. The preset number of failures can be set according to actual needs, for example, three times.

[0033] In practical applications, there may be multiple functional modules of the same type, which need to be distinguished to identify different functional modules. In one optional implementation, these multiple functional modules include multiple functional modules of the same type. Each functional module of the same type has a distinguishing signal contact in its identification circuit. When the corresponding connection state is "connected," the functional module of the same type pulls the level of the distinguishing signal contact high or low according to its corresponding number. The management board is also used to determine the corresponding number of each functional module of the same type based on the level of its distinguishing signal contact.

[0034] Optionally, the distinguishing signal contacts connect to the functional modules and management board via specific contacts on the connector, assigning a number to each functional module of the same type. On the functional module side, an option to ground each distinguishing signal contact is reserved; on the management board side, the distinguishing signal contacts are pulled up to the monitoring module within the management board. Depending on the number and quantity of functional modules of the same type, some distinguishing signal contacts can be selectively pulled down to ground to distinguish multiple functional modules of the same type, facilitating management and configuration. Different functional modules are combined by pulling down distinguishing signal contacts with different numbers to form a unique binary number. For example, if the module number is 3 (binary 011), then the first and second distinguishing signal contacts are pulled down to ground, and the third distinguishing signal contact is left floating, maintaining a high level.

[0035] In one optional implementation, the functional module is equipped with a light source module connected to the management carrier board. The management carrier board is also used to illuminate the light source module when the functional module malfunctions, to provide a fault warning and notify relevant technical personnel to promptly repair the faulty functional module. For example, the light source module is an LED light.

[0036] Optionally, the light source module connects to the functional module and management carrier board via specific pins of a connector. On the module assembly side, the cathode of the light source module is grounded, and the anode of the light source module is connected to the monitoring module of the management carrier board via a series resistor. On the management carrier board side, the general-purpose input / output (GPIO) pins of the monitoring module are connected to the anode of the light source module on the module assembly side via a series resistor. This series resistor limits the current flowing through the light source module, protecting both the light source module and the monitoring module. Under normal conditions, the GPIO pins of the monitoring module output a low level, and the voltage across the light source module is insufficient to light it up. When the monitoring module detects a functional malfunction or damage to the functional module, it pulls the GPIO pins high. At this time, a positive voltage is formed across the light source module, and the light source module lights up, prompting the user to perform maintenance.

[0037] For example, Figure 2 This is a schematic diagram of the structure of a functional module provided in an embodiment of this application. The functional module includes a main functional part and an identification circuit. The identification circuit includes an in-position signal contact and multiple distinguishing signal contacts (corresponding to...). Figure 2 The same type of module in the module distinguishes signals 1 to n) and the light source module (corresponding to Figure 2 (Functional abnormality alarm signals).

[0038] Since the functional modules are physically and electrically connected to the management carrier board via connectors, and the connectors themselves have a certain height, a height difference exists between the functional modules and the management carrier board. Therefore, to accommodate more components within a limited area, components can be laid out on both sides of the management carrier board, saving space. In one optional embodiment, the first functional module among the multiple functional modules is disposed on the surface of the management carrier board; simultaneously, the second functional module among the multiple functional modules is disposed on the bottom surface of the management carrier board. In related technologies, server motherboards need to be placed on a chassis tray, and the bottom height is limited, basically only small resistors and capacitors can be placed, resulting in low overall space utilization of the board. However, this application uses functional modules to configure separate modular boards, and there is a sufficient height difference between the separate modular boards and the management carrier board. Therefore, components can be placed on both the surface and the bottom surface of the management carrier board simultaneously, making full use of the layout space of the management carrier board, reducing the overall size of the motherboard, and thus saving or reducing the server space occupied, expanding the application scenarios of the server.

[0039] Because different components may interfere with each other or with components on the management carrier board itself, or to ensure the transmission quality of high-speed signals, targeted layout and impedance control of signal lines between components and the management carrier board are required. Therefore, custom connectors of appropriate height can be used to achieve the desired height difference. Additional support structures can also be used to support or fix the functional modules, preventing them from loosening or being damaged by external forces or vibrations. This support structure can be pillars or gaskets, providing additional support by adding pillars or gaskets between the functional modules and the management carrier board. The support structure can also be a snap-fit ​​or locking mechanism, used to fix the functional modules to the management carrier board, enhancing the stability of the connection. A certain height can also be set for the functional modules themselves, or space can be reserved at the edges of the functional modules for installing connectors and support structures.

[0040] In one optional implementation, each of the multiple functional modules is provided with an independent power supply module, which can independently supply power to the corresponding installation module, thereby improving power supply flexibility and stability.

[0041] In one optional implementation, the management carrier board is also used to send corresponding management signals to the plurality of functional modules respectively, so as to control the power supply timing and startup logic of the plurality of functional modules.

[0042] In one optional implementation, the management carrier board further includes a Baseboard Management Controller (BMC) for remotely managing and monitoring the server, such as monitoring temperature, voltage, and fan speed, and performing remote power on / off and restart operations. The management carrier board also includes a Complex Programmable Logic Device (CPLD) for implementing customized logic functions, such as address decoding and timing control. The management carrier board also includes a Microcontroller Unit (MCU) for controlling and managing various modules, such as identifying module types, configuring module parameters, and monitoring module status. The management carrier board also includes memory for storing the Basic Input Output System (BIOS), BMC firmware, etc. The management carrier board also includes a network interface for remote management.

[0043] In one optional implementation, the core module includes at least one processor socket, at least one memory slot, and a clock circuit. The processor socket is used to install various types of server-grade processors. The memory slot is used to install various types of memory modules, such as ECC (Error Checking and Correcting) DDR (Double Data Rate) memory modules, the number of which is set according to actual needs. The clock circuit provides clock signals to the processor and the memory modules. The core module also includes a separate power supply module to provide stable and reliable power to the processor and memory. This power supply module may employ a multi-phase power supply design to meet the processor's power consumption requirements under high load. The core module also includes a configuration module for storing configuration information for the processor and memory, such as the processor model, frequency, and memory timing parameters. The core module also includes a heatsink mounting location for providing mounting holes and fixing mechanisms for heat sinks (e.g., heatsinks, fans, or liquid cooling).

[0044] In one optional implementation, the input / output module includes at least one Universal Serial Bus (USB) interface, at least one serial port, at least one parallel port, and at least one Video Graphics Array (VGA) interface. The USB interface is used to connect various types of USB devices, such as keyboards, mice, USB flash drives, and printers. It supports different specifications such as USB 2.0, USB 3.0, and USB 3.2. The serial port is used to connect debugging equipment. The parallel port is used to connect a printer. The VGA interface is used to connect a monitor. The input / output module also includes buttons, such as a power button and a reset button. The module also includes indicator lights for displaying system status, such as power indicators and status indicators.

[0045] In one alternative implementation, the high-speed module includes a PCIe controller and at least one PCIe slot. This PCIe slot is used to connect various expansion cards, such as graphics cards, network cards, RAID cards, and accelerator cards. The PCIe slot can be PCIe x16, PCIe x8, PCIe x4, or PCIe x1, depending on actual needs. The PCIe controller manages data transmission on the PCIe bus. The high-speed module also includes a clock generator to provide a reference clock signal for the PCIe bus. The high-speed module also includes a retimer / repeater to enhance the transmission distance and signal quality of high-speed signals. The high-speed module also includes a channel switching module for flexibly switching the number of PCIe channels; for example, x16 can be switched to two x8 channels or one x8 channel plus two x4 channels as needed.

[0046] In one optional implementation, the network module includes an Ethernet controller for handling the sending and receiving of Ethernet packets. The network module also includes a physical layer (PHY) chip for handling physical layer transmission of network signals, such as electrical / optical signal conversion, signal encoding / decoding, and driving network cables. The network module also includes a PHY retimer for restoring the timing and quality of high-speed network signals. The network module also includes a LAN switch for network data exchange between multiple devices within the LAN. The network module also includes a network interface for connecting network cables or fiber optic cables; exemplarily, this network interface can be an RJ45 interface, an SFP+ interface, a QSFP+ interface, etc. The network module also includes a network acceleration chip for accelerating network data processing and improving network performance; exemplarily, this network acceleration chip can be an RDMA controller, etc.

[0047] In one optional implementation, the motherboard also includes a power module for supplying power to external devices mounted on the motherboard. This power module includes a power input interface, a DC-DC converter, a filtering circuit, and a protection circuit. The power input interface (also known as the power connector) is used to connect to an external power source or internal power distribution lines, serving as the physical interface for power input / distribution. The DC-DC converter converts the voltage provided by the external power source to the voltage corresponding to the external device, such as 12V, 5V, or 3.3V. The filtering circuit filters the voltage provided by the external power source to remove noise and interference. The protection circuit performs overvoltage protection, overcurrent protection, and short-circuit protection to ensure the safe and stable operation of the server. For example, the protection circuit can be an electronic fuse (EFUSE) to quickly blow or limit current in the event of overcurrent or overvoltage in the circuit, protecting downstream hardware.

[0048] Optionally, the size of the functional modules can be designed. For functional modules with relatively simple functions and high space requirements, a miniaturized design should be adopted. For multiple closely related functional modules that frequently collaborate, appropriate integration should be performed to form functionally complete and appropriately sized combined modules. Functional modules of the same type should use the same design to maintain versatility and reusability. Depending on specific layout requirements, the positional relationship between different functional modules and the management carrier board can be adjusted appropriately, and some functional modules can be split up as needed. For example, in a dual-processor configuration motherboard, the first and second processors can be separated for flexible layout.

[0049] The motherboard provided in this embodiment modularizes the various functions of the server motherboard, forming individual functional modules. These modules are then detachably connected to the management carrier board using a unified high-speed data interface standard. In case of failure, these modules can be quickly plugged in and replaced without replacing the entire motherboard, reducing maintenance costs and complexity. This improves the convenience of server component upgrades and maintenance, accelerates product iteration and innovation, and allows for flexible selection of installation modules corresponding to each functional module based on configuration requirements. This significantly enhances system flexibility and scalability. Furthermore, the installation modules are installed onto the corresponding functional modules to connect to the management carrier board, reducing the use of redundant modules and achieving precise configuration and efficient utilization of hardware resources. This system increases hardware reusability, reduces configuration costs and space requirements; by adopting a unified high-speed data interface standard for different functional modules, it ensures high-speed data transmission between different functional modules, effectively solving the multi-module compatibility problem and enhancing system reliability and stability; by setting identification circuits in functional modules, the presence signal contact in the identification circuit is pulled low when a functional module is present, thereby obtaining the connection status of each functional module and further improving management efficiency and flexibility; by setting ground contacts, power contacts, and presence signal contacts with sequentially decreasing extension lengths, hot-swapping of functional modules can be achieved, ensuring the safety and stability of functional module access.

[0050] This application provides a server, including a motherboard corresponding to the above embodiments or any of their implementations. By applying the motherboard to the server, it is possible to quickly plug and unplug and replace the entire motherboard in case of failure, improving the convenience of server component upgrades and maintenance. Furthermore, installation modules can be flexibly selected according to configuration requirements and then installed onto corresponding functional modules to connect to the management carrier board, reducing the use of redundant modules and lowering configuration costs and space requirements. By setting an identification circuit in the functional modules, the presence signal contact in the identification circuit is pulled low when the functional module is present, thereby obtaining the connection status of each functional module, further improving management efficiency and flexibility.

[0051] The embodiments of this application provide a motherboard control method, applied to Figure 1 The motherboard shown in the embodiment is executed by the management carrier board in the motherboard. Figure 3 This is a schematic flowchart of a motherboard control method provided in an embodiment of this application, such as... Figure 3 As shown, the process includes the following steps.

[0052] For specific steps, please refer to the following: Step S301: Obtain the level of the in-situ signal contact corresponding to each functional module.

[0053] Figure 4This is a schematic diagram illustrating the communication between the management carrier board and various functional modules provided in this embodiment. The core module can send configuration signals to the management carrier board. The core module can also provide high-speed signals to the high-speed module for external connection. The management carrier board can send management signals to the core module, high-speed module, power supply module, network module, and input / output module respectively to perform power supply, monitoring, timing, and other logic operations. The power supply module only provides external power supply; the power supply of each functional module is designed internally within the module or initially designed on the management carrier board. The network module can send network signals to the external network to provide network connectivity. The input / output module can send input / output signals to external devices to provide external interconnection interfaces. After the motherboard is initially powered on, it is generally powered by a 12V standby power supply (STBY) and a 3V3 standby power supply. The monitoring module on the management carrier board starts running, first monitoring the presence and type of each functional module to determine the relevant configuration, and then loading the corresponding monitoring logic and startup logic according to different configuration requirements. After power-on, it performs power supply timing, startup logic, and other control functions.

[0054] Specifically, when monitoring the presence of each functional module, the management carrier board can read the level of the presence signal contact corresponding to each functional module through the connector.

[0055] Step S302: Determine the connection status of each functional module based on the level of the corresponding in-situ signal contact of each functional module.

[0056] After the management carrier board obtains the level of the in-situ signal contact corresponding to each functional module, it determines the connection status of each functional module based on the level. If the level is low, the connection status is connected; if the level is high, the connection status is not connected.

[0057] Step S303: When a fault is detected in the target functional module, the light source module of the target functional module is lit.

[0058] The target functional module is one of the faulty modules. When the management board detects that the target functional module has failed, it lights up the light source module of the target functional module to alert the relevant personnel to carry out timely repairs.

[0059] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.

[0060] Embodiments of this application also provide a motherboard control device, which is applied to a motherboard and can be disposed in the management carrier board of the motherboard. Figure 5 This is a structural block diagram of a motherboard control device according to an embodiment of this application.Figure 5 As shown, the device includes an acquisition module 501, a judgment module 502, and an alarm module 503.

[0061] The acquisition module 501 is used to acquire the level of the in-situ signal contact corresponding to each functional module.

[0062] The judgment module 502 is used to determine the connection status of each functional module based on the level of the corresponding in-situ signal contact of each functional module.

[0063] The alarm module 503 is used to illuminate the light source module of the target functional module when a fault is detected in the target functional module.

[0064] For a description of the features in the embodiment corresponding to the motherboard control device, please refer to the relevant description in the embodiment corresponding to the motherboard control method, which will not be repeated here.

[0065] Embodiments of this application also provide an electronic device, such as... Figure 6 As shown, it includes a memory 10 and a processor 20. The memory 10 stores a computer program, and the processor 20 is configured to run the computer program to perform the steps in any of the above-described motherboard control method embodiments.

[0066] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the motherboard control method embodiments described above when it is run.

[0067] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0068] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the motherboard control method embodiments described above.

[0069] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the motherboard control method embodiments described above.

[0070] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0071] The foregoing has provided a detailed description of a motherboard and server provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A main board characterized by, The application relates to a mainboard. The mainboard comprises a plurality of functional modules, at least including a core module, a high-speed module, a network module and an input / output module. Each of the plurality of functional modules is provided with an identification circuit. A management carrier plate is detachably connected with the plurality of functional modules through a plurality of connectors; the plurality of connectors adopt a unified high-speed data interface standard; the identification circuit is connected with the connector corresponding to the functional module; the management carrier plate is used for reading the identification signals corresponding to the plurality of functional modules from the identification circuit respectively, so as to determine the connection states of the plurality of functional modules respectively. The identification circuit at least includes ground contacts, power supply contacts and in-place signal contacts with gradually decreasing extension lengths; the functional module is used for pulling down the level of the in-place signal contact when the corresponding connection state is connected; the management carrier plate is further used for determining the connection state of the corresponding functional module according to the level of the in-place signal contact.

2. The main plate of claim 1, wherein, The power supply contact includes a pre-charging power supply contact and a main power supply contact; the extension length of the pre-charging power supply contact is greater than that of the main power supply contact; the management carrier plate is further used for sequentially connecting each contact from long to short according to the extension length.

3. The main plate of claim 2, wherein, The functional module further includes a storage unit; the storage unit is used for storing attribute information of the functional module; the attribute information at least includes a module type, a module model, a protocol type, a maximum power consumption, a firmware version and compatibility information; the identification circuit further includes a bus interface contact; the extension length of the bus interface contact is less than that of the in-place signal contact; the management carrier plate is further used for reading the attribute information of the corresponding functional module through the bus interface contact when the level of the in-place signal contact is low.

4. The main plate of claim 3, wherein, The management carrier plate is further used for judging that the functional module is a false in-place and alarming when the level of the in-place signal contact is low and the communication failure times with the bus interface contact reach a preset number.

5. The main plate of claim 1, wherein, The plurality of functional modules include a plurality of same-type functional modules; each same-type functional module is provided with a distinguishing signal contact in the corresponding identification circuit; the same-type functional module is used for pulling up or pulling down the level of the distinguishing signal contact according to the corresponding number when the corresponding connection state is connected; the management carrier plate is further used for determining the numbers corresponding to the plurality of same-type functional modules respectively according to the levels of the distinguishing signal contacts corresponding to the plurality of same-type functional modules respectively.

6. The main plate of claim 1, wherein, A light source module is arranged on the functional module; the light source module is connected to the management carrier plate; the management carrier plate is further used for lighting the light source module when the functional module is faulty.

7. The main plate according to any one of claims 1 to 6, characterized in that, A first functional module in the plurality of functional modules is arranged on the surface of the management carrier plate; meanwhile, a second functional module in the plurality of functional modules is arranged on the bottom surface of the management carrier plate.

8. The main plate according to any one of claims 1 to 6, characterized in that Each of the plurality of functional modules is provided with an independent power supply module.

9. The main plate of claim 8, wherein, The management carrier plate is further used for sending corresponding management signals to the plurality of functional modules respectively, so as to control the power supply timing and starting logic of the plurality of functional modules.

10. A server, characterized by The application further relates to a mainboard comprising the mainboard as claimed in any one of claims 1 to 9.

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