Cooling device and computing equipment with same
By using the main wall frame and main heat pipe of the modular cooling device, combined with the adjustable installation mechanism, the problem of low heat dissipation efficiency in the existing technology is solved, and efficient thermal management and cost reduction of cassette equipment are achieved.
Patent Information
- Application Number
- CN202511566736.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-30
- Publication Date
- 2026-01-30
AI Technical Summary
In existing technologies, the air-cooled passive and active heat sinks of modular systems lack scalability and adaptability to different layouts and component settings, resulting in low heat dissipation efficiency and an inability to efficiently manage the heat of high-performance computing systems.
It adopts an adjustable modular cooling device, including a main wall frame, a main heat pipe and a main fastener. The heat is conducted away through the side contact between the main wall frame and the cassette device. A secondary wall frame and a secondary heat pipe can be optionally added to achieve double-sided cooling. The bending tongue structure and adjustable mounting mechanism can be used to adapt to cassette devices of different thicknesses and heights.
It provides a flexible thermal management solution, improves the heat dissipation efficiency of card-type devices, adapts to different layouts and component settings, shortens production time and reduces manufacturing costs.
Smart Images
Figure CN121433469A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to cooling devices and computing devices having cooling devices attached thereto. BACKGROUND
[0002] Modern electronic systems, particularly high performance computing systems, generate a large amount of heat during operation. Various heat generating components, such as processors, memory modules, and power conversion components, mounted on printed circuit boards (PCBs) or card-like devices, require efficient thermal management to maintain performance and prevent overheating. For modular system architectures, conventional thermal management solutions, including air-cooled passive heat sinks and active heat sinks, are typically bulky, inefficient, and lack flexibility. In particular, air-cooled passive heat sinks and active heat sinks lack scalability and adaptability to cards having different layouts and component placements. SUMMARY
[0003] According to one aspect, the present application provides a cooling device including a primary bracket, a primary heat pipe, and a primary fastener. The primary bracket includes a primary base sheet and a primary tab fabricated on the primary base sheet. The primary tab has a first primary portion extending along a first primary direction transverse to the primary base sheet and a second primary portion bent from the first primary portion along a second primary direction parallel to the primary base sheet. The primary base sheet, the first primary portion, and the second primary portion constitute a primary pocket portion having a primary side opening positioned opposite the first primary portion of the primary tab. The primary heat pipe has a primary retention segment portion received in the primary pocket portion. The primary fastener is connected to the primary base sheet to block the primary heat pipe from moving out of the primary pocket portion through the primary side opening. The primary bracket is attachable to a card-like device to bring a first side of the card-like device into contact with the primary heat pipe to conduct heat away from the first side of the card-like device. The cooling device further includes a secondary bracket and a secondary heat pipe. The secondary bracket is attachable to the primary bracket to bring a second side of the card-like device into contact with the secondary heat pipe to conduct heat away from the second side of the card-like device.
[0004] According to another aspect, the application provides a computing device including a card device having a first side and a second side opposite the first side, a primary bracket, a primary heat pipe, and a primary fastener. The primary bracket includes a primary base sheet and a primary tab fabricated on the primary base sheet. The primary tab has a first primary portion extending along a first primary direction transverse to the primary base sheet and a second primary portion bent from the first primary portion along a second primary direction parallel to the primary base sheet. The primary base sheet, the first primary portion, and the second primary portion constitute a primary pocket portion having a primary side opening positioned opposite the first primary portion of the primary tab. The primary heat pipe has a primary retention segment portion received in the primary pocket portion through the primary side opening. The primary fastener is connected to the primary base sheet to block the primary heat pipe from moving out of the primary pocket portion through the primary side opening. The primary bracket is attachable to the card device to bring the first side of the card device into contact with the primary heat pipe to conduct heat away from the first side of the card device. The computing device also includes a secondary bracket and a secondary heat pipe. The secondary bracket is attachable to the primary bracket to bring the second side of the card device into contact with the secondary heat pipe to conduct heat away from the second side of the card device. BRIEF DESCRIPTION OF DRAWINGS
[0005] Various embodiments of the application will be described in terms of the following figures in which:
[0006] Figure 1A is a perspective view showing a cooling device according to an embodiment of the application;
[0007] Figure 1B and Figure 1C is a perspective view showing Figure 1A a partial cross-sectional side view of the primary tab of the cooling device shown in
[0008] Figure 2 is a perspective view of the cooling device shown in FIG. 1 when attached to a card device.
[0009] Figure 3 is a top view of Figure 2
[0010] Figure 4 is an exploded perspective view of Figure 2
[0011] Figure 5 is a perspective view of a cooling device according to another embodiment of the application when attached to a card device.
[0012] Figure 6 is a top view of Figure 5
[0013] Figure 7 is an exploded perspective view of Figure 5
[0014] Figure 8A is a perspective view showing Figure 5 a secondary bracket of the cooling device shown in
[0015] Figure 8B is a partial cross-sectional side view of a sub-tongue of the cooling device shown; Figure 8A
[0016] Figure 9 is a cross-sectional view of the cooling device shown. Figure 5
[0017] Figure 10 is a perspective view showing a computing device according to embodiments of the present application; and
[0018] Figure 11 is an exploded perspective view of Figure 10 DETAILED DESCRIPTION
[0019] The following detailed description will reference and incorporate, where appropriate, the drawings into the description, which illustrate details and embodiments of the present application. The detailed description, together with the drawings, will make apparent to those of ordinary skill in the art how the embodiments described herein can be implemented in practice. Features described in the context of one embodiment can be applied, mutatis mutandis, to the same or similar features in other embodiments, even if not explicitly described in those other embodiments. Application and / or combination and / or substitution of features described in the context of one embodiment for features of the same or corresponding features in other embodiments can be made accordingly.
[0020] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided, such as examples of materials, processes, etc., to give a thorough understanding of embodiments. One skilled in the relevant art will recognize, however, that the various embodiments can be practiced without one or more of the specific details, or with other methods, components, materials, etc. In other instances, some well-known structures, materials, or operations are not shown or described in detail in order to avoid obscuring aspects of the various embodiments.
[0021] In the context of this application, references to the terms “engage” (verb), “engaging” (gerund, participle), “engagement” (noun), “coupled” (participle), “coupling” (gerund, participle), or similar terms should be understood to include positional and / or connection relationships between two or more components that are in direct or indirect contact with each other, or directly or indirectly connected to each other, for structural and / or functional connections or assemblies, such as mounting two or more components onto a reference component or base component to form or achieve a structural connection between the two or more components. Furthermore, the terms “a,” “an,” and “the” used for a feature or element include references to one or more features or elements. The term “and / or” includes any and all combinations of one or more of the related listed items.
[0022] This application relates to a modular cooling device configured for use with card-type devices (such as graphics cards or network cards) to provide an adjustable mechanism for establishing efficient thermal contact with heat-generating components located on one or both sides of the card-type device, thereby supporting single-sided and double-sided cooling setups. The cooling device offers structural flexibility by using removable heat pipes, a modular siding structure allowing side insertion of the heat pipes, and an adjustable mounting mechanism to accommodate card-type devices of varying thicknesses and component heights. The cooling device can be manufactured from a single sheet of metal (such as galvanized steel) using bending or stamping processes, significantly reducing production time and manufacturing costs compared to conventional cooling solutions that rely on die casting and extensive post-processing.
[0023] According to one embodiment, such as Figures 1A-4 As shown, the cooling device 100 includes a main frame 110 and a main heat pipe 130 coupled to the main frame 110. A card-type device 300 may be attached to the main frame 110. The card-type device 300 may be a function module card for a computing system. For example, the card-type device 300 may be a display card or graphics card for a server and is electrically connected to a card socket mounted on the server motherboard. Components 182 and 183 of the card-type device 300 may be mounted on a first side 310, a second side 312, or both sides, depending on the application (see [reference]). Figure 9 ).
[0024] The main ledge 110 includes a main base sheet 111 having a substantially planar structure and one or more main tabs 112 fabricated on the main base sheet 111, such as two main tabs 112 as a non-limiting example shown in FIG. 1. Each main tab 112 has a first main portion 113, a second main portion 114, and a main pocket portion 115 having a main side opening 116. The first main portion 113 extends in a first main direction (along the x-axis direction as shown Figure 1A ) transverse to the main base sheet 111. The second main portion 114 is bent from the first main portion 113 in a second main direction (along the y-axis direction as shown Figure 1A ) parallel to the main base sheet 111. The main base sheet 111, the first main portion 113, and the second main portion 114 collectively form the main pocket portion 115 having the main side opening 116 positioned directly opposite the first main portion 113. The main side opening 116 is an open face of the main pocket portion 115 that allows the main heat pipe 130 to be inserted into the main pocket portion 115 through the opening. The open pocket portion facilitates easy insertion and removal of the main heat pipe 130 without completely disassembling the cooling device 100.
[0025] The main heat pipe 130 is a heat-conductive structure containing a working fluid or coolant sealed within a tube to conduct heat away from components on the cassette device 300 in thermal contact with the main heat pipe 130. The main heat pipe 130 is removably coupled to the main ledge 110. A main retention section of the main heat pipe 130 is received in the main pocket portion 115 of the main tab 112 by insertion through the main side opening 116. The main heat pipe 130 spans the main ledge 110 with a length sufficient to contact a plurality of components on the first side 310 of the cassette device 300. When the cassette device 300 is attached to the main ledge 110, the main heat pipe 130 is in contact with the plurality of components on the first side 310 of the cassette device 300, thereby establishing a first heat conduction path for heat to be conducted away from the plurality of components through the main heat pipe 130.
[0026] One or more main fasteners 150 can be used to secure the main heat pipe 130 to the main ledge 110 and to stop the main heat pipe 130 from being removed out of the main pocket portion 115 through the main side opening 116 (see Figure 1C ). Figure 1A The two main fasteners 150 shown are non-limiting examples, and a single main fastener 150 can also be used as appropriate. For example, the main fastener 150 can include a mounting screw or bolt that is directly mounted to the main ledge 110. Alternatively or additionally, other types of fasteners such as spring clips, latches, etc. can be used depending on the structure of the main ledge 110 and the main heat pipe 130.
[0027] The cassette device 300 can be attached to the main ledge 110 by one or more mounting members 160, such as Figure 4Three mounting members 160 are shown as non-limiting examples. For example, the mounting members 160 can include mounting screws or bolts that pass through the main wall bracket 110 and engage with threaded holes of the cassette device 300. The cassette device 300 is mounted to the first wall bracket 110 by one or more mounting members 160 such that the main heat pipe 130 is in thermal contact with multiple components on the cassette device 300, thereby achieving heat dissipation.
[0028] The cooling device 100 further includes one or more thermally conductive pads 180 disposed between the main heat pipe 130 and the components 182 on the first side 310 of the cassette device 300 (see Figure 9 ). The thermally conductive pads 180 are elastically deformable to conform to surface irregularities of the main heat pipe 130 or the components 182.
[0029] For the cassette device 300 having multiple components 182 with different heights, the cooling device 100 can further include one or more main pad spacers 140 that can be attached to the main heat pipe 130 at locations where the components 182 are relatively short in height (see Figure 9 ). In other words, the main pad spacers 140 are used to compensate or balance the height differences among the multiple components so that the heat pipe can be in thermal contact with the multiple components of different heights, thereby improving the overall heat conduction efficiency. The main pad spacers 140 are made of a thermally conductive material (same as the material of the main heat pipe 130), such as copper, to maximize the heat transfer efficiency. The main pad spacers 140 can be provided in various shapes, such as block or cylindrical.
[0030] In another embodiment, as shown in Figures 5-9 , the cooling device 100 can further include a secondary wall bracket 120 and a secondary heat pipe 135 coupled to the secondary wall bracket 120. The secondary wall bracket 120 can be attached to the main wall bracket 110 to achieve double-sided cooling of the cassette device 300 located between the main wall bracket 110 and the secondary wall bracket 120. The secondary wall bracket 120, the secondary heat pipe 135, and other elements can be similar in structure and function to the main wall bracket 110, the main heat pipe 130, and other corresponding elements. Therefore, for brevity, some common features of the two will not be repeated in the following description.
[0031] The secondary wall bracket 120 includes a secondary substrate 121 and one or more secondary tabs 122 fabricated on the secondary substrate 121. Each secondary tab 122 has a first secondary portion 123, a second secondary portion 124, and a secondary pocket portion 125 having a secondary side opening 126. The first secondary portion 123 extends in a first secondary direction (along the x-axis direction shown in Figure 8A , which is consistent with the x-axis of the xyz axes shown in Figure 1A ) transverse to the secondary substrate 121. The second secondary portion 124 extends from the first secondary portion 123 in a second secondary direction (along the y-axis direction shown in Figure 8AThe second side opening 126 is an opening face of the second pocket portion 125 that allows the second heat pipe 135 to be inserted into or removed from the second pocket portion 125 through the opening.
[0032] The second heat pipe 135 is removably coupled to the second ledge 120. The second holding section of the second heat pipe 135 is received in the second pocket portion 125 of the second tongue 122 through the second side opening 126 by insertion. The second heat pipe 135 spans the second ledge 120, and the length of the second heat pipe 135 is sufficient to contact the plurality of components on the second side 312 of the card device 300. When the second ledge 120 is attached to the first ledge 110, the second heat pipe 135 is in thermal contact with the plurality of components on the second side 312 of the card device 300, thereby establishing a second heat conduction path to facilitate heat conduction away from the plurality of components through the second heat pipe 135. The first and second heat pipes 130 and 135 contact the plurality of components on the first and second sides 310 and 312 of the card device 300, respectively, thereby enabling balanced and efficient heat dissipation from the plurality of components on both sides of the card device 300.
[0033] The first ledge 110 can also include one or more first attachment tabs 170 extending perpendicularly from an edge of the first base 111. Each first attachment tab 170 has a slot 171 to receive a fastener 173 (e.g., a mounting screw or bolt) and to allow the fastener 173 to be tightened at a selectable position along the length of the slot 171. The second ledge 120 also includes one or more second attachment tabs 175 extending perpendicularly from an edge of the second base 121. Each second attachment tab 175 has a threaded through-hole 176 to receive the fastener 173. The first and second attachment tabs 170 and 175 are connected by the fastener 173, which passes through the slot 171 of the first attachment tab 170 and engages the threaded through-hole 176 of the second attachment tab 175, thereby forming a gap 178 between the first and second ledges 110 and 120 to receive the card device 300 in the gap 178. When the fastener 173 is released, the first and second ledges 110 and 120 can be moved relative to each other to change the width of the gap 178, and when the fastener 173 is tightened in the threaded through-hole 176, the first and second ledges 110 and 120 are locked to each other to fix the width of the gap 178. This adjustment is particularly beneficial to support card devices 300 of different thicknesses and to receive pluralities of components of different heights.
[0034] The cooling device 100 may also include one or more secondary fasteners 155 to secure the secondary heat pipe 135 to the secondary wall frame 120 and to prevent the secondary heat pipe 135 from exiting the secondary pocket portion 125 through the secondary side opening 126. For example, the secondary fastener 155 may include mounting screws or bolts that are directly mounted to the secondary wall frame 120.
[0035] The cooling device 100 may further include one or more thermal pads 180 disposed between the secondary heat pipe 135 and a plurality of components 183 on the second side 312 of the cartridge device 300 (see [link]). Figure 9 The cooling device 100 may also include one or more secondary heat pipes 145, which may be attached to the secondary heat pipe 135 at the location of the relatively short component 183 (see...). Figure 9 The secondary spacer 145 is used to compensate for or balance the height differences between multiple components on the second side 312 of the cassette device 300, so that the heat pipe can maintain thermal contact with multiple components at different heights. The secondary spacer 145 is made of a thermally conductive material such as copper and can be manufactured in various shapes, such as block or cylindrical.
[0036] According to another aspect, this application provides a computing device 200 having a cooling device for heat dissipation of a card-type device 300. In one embodiment, such as Figure 10 and Figure 11 As shown, the computing device 200 includes a card-type device 300 having a first side 310 and a second side 312, a main wall frame 210 attached to the card-type device 300, and a main heat pipe 230 coupled to the main wall frame 210.
[0037] The main frame 210 includes a main substrate 211 and one or more main tabs 212 manufactured on the main substrate 211. Each main tab 212 has a first main portion 213, a second main portion 214, and a main pocket portion 215 having a main side opening 216. The first main portion 213 extends in a first main direction transverse to the main substrate 211 (along the x-axis direction shown in FIG. 1). The second main portion 214 bends from the first main portion 213 in a second main direction parallel to the main substrate 211 (along the y-axis direction shown in FIG. 1). The main substrate 211, the first main portion 213, and the second main portion 214 together constitute the main pocket portion 215 having the main side opening 216, which is positioned directly opposite to the first main portion 213. The main side opening 216 is the opening surface of the main pocket portion 215, which allows the main heat pipe 230 to be inserted into or removed from the main pocket portion 215.
[0038] The main heat pipe 230 is removably received in the main pocket 215. A main retention section of the main heat pipe 230 is received in the main pocket 215 of the main tongue 212 by insertion through the main side opening 216. The main heat pipe 230 spans the main ledge 210, the length of the main heat pipe 230 being sufficient to contact a plurality of components on the first side 310 of the card device 300. When the card device 300 is attached to the main ledge 210, the main heat pipe 230 contacts the plurality of components on the first side 310 of the card device 300, establishing a first heat conduction path to facilitate heat transfer away from the plurality of components through the main heat pipe 230.
[0039] One or more main fasteners 250 can be employed to secure the main heat pipe 230 to the main ledge 210 and to retain the main heat pipe 230 from being removed from the main pocket 215 through the main side opening 216. For example, the main fasteners 250 can include mounting screws or bolts that are mounted directly to the main ledge 210.
[0040] The card device 300 can be attached to the main ledge 210 by one or more mounting members 260. For example, the mounting members 260 can include mounting screws or bolts that pass through the main ledge 210 and engage threaded holes of the card device 300. The card device 300 is mounted to the first ledge 210 by the one or more mounting members 260 such that the main heat pipe 230 is in thermal contact with the plurality of components on the card device 300 for heat dissipation.
[0041] The computing device 200 can also include one or more main spacer pads 240 that can be attached to the main heat pipe 230 at locations where components of relatively low height are located (see FIG. 2). The main spacer pads 240 are used to compensate or balance height differences between the plurality of components on the card device 300 so that the heat pipe can be in thermal contact with the plurality of components of different heights, thereby improving overall heat conduction efficiency. The main spacer pads 240 are made of a thermally conductive material such as copper and can be manufactured in various shapes such as blocks or cylinders. Figure 9
[0042] The computing device 200 can also include a secondary ledge 220 and a secondary heat pipe 235 coupled to the secondary ledge 220. The secondary ledge 220 can be attached to the main ledge 210 to enable dual-sided cooling of the card device 300 located between the main ledge 210 and the secondary ledge 220. The secondary ledge 220, the secondary heat pipe 235, and other elements can be similar in structure and function to the main ledge 210, the main heat pipe 230, and other corresponding elements.
[0043] The secondary ledge 220 includes a secondary substrate 221 and one or more secondary tongues 222 fabricated on the secondary substrate 221. Each secondary tongue 222 has a first secondary section 223, a second secondary section 224, and a secondary pocket 225 having a secondary side opening 226. The first secondary section 223 is oriented in a first secondary direction transverse to the secondary substrate 221 (along theFigure 8A The second sub-portion 224 is bent from the first sub-portion 223 in a second sub-direction (the y-axis direction as shown) that is parallel to the sub-base 221. The sub-base 221, the first sub-portion 223, and the second sub-portion 224 collectively form a sub-pouch portion 225 having a sub-side opening 226 positioned directly opposite the first sub-portion 223. The sub-side opening 226 is an opening face of the sub-pouch portion 225 that allows the sub-heat pipe 235 to be inserted into or removed from the sub-pouch portion 225 through the opening. Figure 8A The second sub-portion 224 is bent from the first sub-portion 223 in a second sub-direction (the y-axis direction as shown) that is parallel to the sub-base 221. The sub-base 221, the first sub-portion 223, and the second sub-portion 224 collectively form a sub-pouch portion 225 having a sub-side opening 226 positioned directly opposite the first sub-portion 223. The sub-side opening 226 is an opening face of the sub-pouch portion 225 that allows the sub-heat pipe 235 to be inserted into or removed from the sub-pouch portion 225 through the opening.
[0044] The sub-heat pipe 235 is removably coupled to the sub-ledge 220. The sub- holding segment of the sub-heat pipe 235 is received in the sub-pouch portion 225 of the sub-ledge 222 through the sub-side opening 226 by insertion. The sub-heat pipe 235 spans the sub-ledge 220, and the length of the sub-heat pipe 235 is sufficient to contact the plurality of components on the second side 312 of the card device 300. When the sub-ledge 220 is attached to the main ledge 210, the sub-heat pipe 235 is in thermal contact with the plurality of components on the second side 312 of the card device 300, thereby establishing a second heat conduction path to facilitate heat conduction away from the plurality of components through the sub-heat pipe 235. The main heat pipe 230 and the sub-heat pipe 235 contact the plurality of components on the first side 310 and the second side 312 of the card device 300, respectively, thereby enabling balanced and efficient heat dissipation for the plurality of components on both sides of the card device 300.
[0045] The main ledge 210 can also include one or more main tabs 270 that extend perpendicularly from the edge of the main base 211. Each main tab 270 has a slot 271 to receive a locking member 273 (e.g., a mounting screw or bolt) and to allow the locking member 273 to be locked at a selectable position along the length of the slot 271. The sub-ledge 220 also includes one or more sub-tabs 275 that extend perpendicularly from the edge of the sub-base 221. Each sub-tab 275 has a threaded through-hole 276 to receive the locking member 273. The main tabs 270 and the sub-tabs 275 are connected by the locking member 273, which passes through the slot 271 of the main tab 270 and engages the threaded through-hole 276 of the sub-tab 275, thereby forming a spacing 278 between the main ledge 210 and the sub-ledge 220 to receive the card device 300 in the spacing 278. When the locking member 273 is released, the main ledge 210 and the sub-ledge 220 can be moved relative to each other to change the width of the spacing 278, and when the locking member 273 is locked in the threaded through-hole 276, the main ledge 210 and the sub-ledge 220 are locked to each other to fix the width of the spacing 278. This adjustment is particularly beneficial to support card devices 300 of different thicknesses and to receive multiple components of different heights.
[0046] The computing device 200 can also include one or more secondary fasteners 255 (e.g., mounting screws or bolts) to secure the secondary heat pipe 235 to the secondary ledge 220 and to retain the secondary heat pipe 235 from exiting the secondary pocket 225 through the secondary side opening 226.
[0047] The computing device 200 can also include one or more secondary gasket spacers 245 that can be attached to the secondary heat pipe 235 at locations where components of relatively lower height are located (see Figure 9 ). The secondary gasket spacers 245 are used to compensate or balance the height differences between components on the card device 300 so that the heat pipe can maintain thermal contact with components of different heights, thereby improving the overall thermal conduction efficiency. The secondary gasket spacers 245 are made of thermally conductive materials such as copper and can be manufactured in various shapes such as blocks or cylinders.
[0048] The computing device 200 can also include one or more thermally conductive pads disposed between the primary heat pipe 230 and components on the first side 310 of the card device 300 and / or between the secondary heat pipe 235 and components on the second side 312 of the card device 300.
[0049] The computing device 200 can also include a motherboard 290 and a card socket 292 mounted on the motherboard 290. The card device 300 is connected to the card socket 292 with the first side 310 and the second side 312 of the card device 300 oriented perpendicular to the motherboard 290.
[0050] The computing device 200 can also include a heat sink or condenser disposed proximate to the primary ledge 210 and the secondary ledge 220. The primary heat pipe 230 and the secondary heat pipe 235 are connected to the heat sink or condenser to establish a thermal conduction path to conduct heat away from the first side 310 and the second side 312 of the card device 300, respectively.
[0051] The computing device 200 can also include different additional features and / or alternative features of the cooling device 100 described above to form respective technical solutions of computing systems in further embodiments of the present application.
[0052] This application is intended to explain and describe the application, rather than to limit or exclude further modifications and / or alterations. Various modifications and alterations to this application will become apparent to those skilled in the art from the teachings that are set forth herein. It is intended that all such modifications and alterations be considered within this application's scope. The above examples are among others selected and described to explain the principles of the application and its best mode of operation, to further enable any person skilled in the art to make various modifications to the application for particular applications without departing from the scope of the application.
[0053] Thus, although example embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the description is not limiting, and that various other changes and modifications can be made to the embodiments without departing from the scope of the application as defined in the following claims.
Claims
1. A cooling apparatus comprising: a main bracket including a main base sheet and a main tongue fabricated on the main base sheet, the main tongue having a first main portion extending along a first main direction transverse to the main base sheet and a second main portion bent from the first main portion along a second main direction parallel to the main base sheet, wherein the main base sheet, the first main portion and the second main portion constitute a main pocket portion having a main side opening positioned opposite the first main portion of the main tongue; a main heat pipe having a main retaining segment portion received in the main pocket portion through the main side opening; and a main fastener connected to the main base sheet to block the main heat pipe from moving out of the main pocket portion through the main side opening; wherein the main bracket is attachable to a card device to bring a first side of the card device into contact with the main heat pipe to conduct heat away from the first side of the card device.
2. The cooling apparatus of claim 1, further comprising: a mounting member removably coupled to the main bracket to attach the card device to the main bracket.
3. The cooling apparatus of claim 1, further comprising: a main gasket spacer attachable to the main heat pipe to compensate for height differences of components on the first side of the card device.
4. The cooling apparatus of claim 1, further comprising: a secondary bracket including a secondary base sheet and a secondary tongue fabricated on the secondary base sheet, the secondary tongue having a first secondary portion extending along a first secondary direction transverse to the secondary base sheet and a second secondary portion bent from the first secondary portion along a second secondary direction parallel to the secondary base sheet, wherein the secondary base sheet, the first secondary portion and the second secondary portion constitute a secondary pocket portion having a secondary side opening positioned opposite the first secondary portion of the secondary tongue; a secondary heat pipe having a secondary retaining segment portion received in the secondary pocket portion through the secondary side opening; and a secondary fastener connected to the secondary base sheet to block the secondary heat pipe from moving out of the secondary pocket portion through the secondary side opening; wherein the secondary bracket is attachable to the main bracket to bring a second side of the card device into contact with the secondary heat pipe to conduct heat away from the second side of the card device.
5. The cooling apparatus of claim 4, further comprising: a secondary gasket spacer attachable to the secondary heat pipe to compensate for height differences of components on the second side of the card device.
6. The cooling apparatus of claim 4, wherein the main bracket further includes a main connecting tab extending perpendicularly from an edge of the main base sheet, the main connecting tab having a slot formed thereon; the secondary bracket further includes a secondary connecting tab extending perpendicularly from an edge of the secondary base sheet, the secondary connecting tab having a threaded through hole formed thereon. The main and secondary connecting tabs are connected by a locking fastener that passes through the slot of the main connecting tab and engages the threaded through-hole of the secondary connecting tab to form a space between the main and secondary shelves to receive the card device in the space; And wherein when the locking fastener is released, the main and secondary shelves are movable relative to each other to change the width of the space, and when the locking fastener is locked to the threaded through-hole, the main and secondary shelves are locked to each other to fix the width of the space.
7. A computing device comprising: a card device having a first side and a second side opposite the first side; a main shelf including a main base sheet and a main tongue fabricated on the main base sheet, the main tongue having a first main portion extending along a first main direction transverse to the main base sheet and a second main portion bent from the first main portion along a second main direction parallel to the main base sheet, wherein the main base sheet, the first main portion, and the second main portion constitute a main pocket portion having a main side opening positioned opposite the first main portion of the main tongue; a main heat pipe having a main retention segment portion received in the main pocket portion through the main side opening; and a main fastener connected to the main base sheet to block the main heat pipe from moving out of the main pocket portion through the main side opening; wherein the main shelf is attachable to the card device to bring the first side of the card device into contact with the main heat pipe to conduct heat away from the first side of the card device.
8. The computing device of claim 7, further comprising: a mounting member removably coupled to the main shelf to attach the card device to the main shelf.
9. The computing device of claim 7, further comprising: a main gasket attachable to the main heat pipe to compensate for height differences of components on the first side of the card device.
10. The computing device of claim 7, further comprising: a secondary shelf including a secondary base sheet and a secondary tongue fabricated on the secondary base sheet, the secondary tongue having a first secondary portion extending along a first secondary direction transverse to the secondary base sheet and a second secondary portion bent from the first secondary portion along a second secondary direction parallel to the secondary base sheet, wherein the secondary base sheet, the first secondary portion, and the second secondary portion constitute a secondary pocket portion having a secondary side opening positioned opposite the first secondary portion of the secondary tongue; a secondary heat pipe having a secondary retention segment portion received in the secondary pocket portion through the secondary side opening; and a secondary fastener connected to the secondary base sheet to block the secondary heat pipe from moving out of the secondary pocket portion through the secondary side opening; wherein the secondary shelf is attachable to the main shelf to bring the second side of the card device into contact with the secondary heat pipe to conduct heat away from the second side of the card device.
11. The computing device of claim 10, further comprising: A secondary pad spacer attachable to the secondary heat pipe to compensate for height differences of components on the second side of the card device.
12. The computing device of claim 10, wherein The primary ledge further comprises a primary connector tab extending perpendicularly from an edge of the primary base sheet, the primary connector tab having a slot formed therein; The secondary ledge further comprises a secondary connector tab extending perpendicularly from an edge of the secondary base sheet, the secondary connector tab having a threaded through-hole formed therein; The primary connector tab and the secondary connector tab are connected by a locking fastener that passes through the slot of the primary connector tab and engages the threaded through-hole of the secondary connector tab to form a gap between the primary ledge and the secondary ledge to receive the card device in the gap; And wherein when the locking fastener is released, the primary ledge and the secondary ledge are movable relative to each other to change the width of the gap, and when the locking fastener is locked in the threaded through-hole, the primary ledge and the secondary ledge are locked to each other to fix the width of the gap.