Contact-type signal acquisition method and related equipment

Abstract

The invention provides a contact signal acquisition method and related equipment, a contact signal acquisition system provided by the scheme generates a test instruction through framework innovation and automatic control and computing equipment, and a control module automatically analyzes and executes the test instruction to control a contact signal test device to automatically complete probe contact and circuit switching, so that the test efficiency is improved. And an electronic measuring instrument is driven to automatically complete measurement. The whole process does not need manual intervention of gear switching, meter pen connection and reading recording. Original discrete and serial manual operation is effectively converted into a continuous and automatic process, the single test time is shortened from the minute level to the second level, the method is particularly suitable for a large-scale batch production environment, the test flux is improved by the order of magnitude, and the production bottleneck is effectively eliminated. Manual operation errors are thoroughly avoided, and the accuracy and reliability of test results are guaranteed. The control module accurately controls the selection and switching of the test circuit, and the possibility of misuse of gears or wrong wiring is completely eradicated from physical connection.

Description

Technical Field

[0001] This application relates to the field of circuit board testing technology, and in particular to a contact-type signal acquisition method and related equipment. Background Technology

[0002] In the manufacturing of computer motherboards, motherboards must undergo rigorous electrical performance testing before leaving the factory. One key test is the real-time clock (RTC) battery test on the motherboard. This test typically includes battery voltage testing and battery leakage current testing to ensure that the battery voltage is within the rated range and that there is no abnormal leakage in the motherboard circuitry that would cause the battery to deplete too quickly.

[0003] Currently, the traditional method commonly used in factory production testing involves operators manually testing with handheld multimeters. The operator first connects the multimeter probes to the corresponding contacts on the motherboard battery socket, then manually switches the multimeter's knob or button to the DC voltage (DCV) range to read the battery voltage. After completing the voltage test, the operator needs to disconnect the multimeter from the circuit, manually switch the range to the DC current (DCA) range again, and then connect the multimeter in series with the battery circuit to measure the leakage current.

[0004] However, because voltage and current tests need to be performed separately, and each test requires manual switching of the multimeter's measurement range and reconnection of the probes, the entire testing process is cumbersome and time-consuming. In a large-scale mass production environment, this inefficiency becomes a production bottleneck, severely impacting test throughput and overall production efficiency. Furthermore, frequent manual range switching and probe connection / disconnection not only increase the workload of operators but also greatly increase the risk of errors due to human negligence. For example, misusing the current range when measuring voltage, or failing to correctly connect the circuit in series when measuring current, can lead to inaccurate test results or even damage to the testing equipment or motherboard. This means that test results largely depend on the operator's skill and sense of responsibility. Differences in operator techniques and reading habits, and even the same operator under fatigue, can lead to misjudgments, making it difficult to effectively guarantee the consistency and reliability of test data, which is detrimental to stable product quality control. Moreover, manual testing is inherently a discrete and discontinuous operation, making effective integration with other testing stations on automated production lines difficult, hindering the construction of fully automated testing pipelines, and thus restricting the improvement of production intelligence. Therefore, there is an urgent need in the existing technology for a solution that can automatically, quickly and accurately complete the testing of computer motherboard battery voltage and leakage current, in order to overcome the various defects caused by the manual testing mentioned above. Summary of the Invention

[0005] This application aims to at least solve one of the aforementioned technical defects. In view of this, this application provides a contact signal acquisition method and related equipment to solve the technical defect of low circuit board testing efficiency in the prior art.

[0006] A contact signal acquisition system includes: a control module, an electronic measuring instrument, a contact signal testing device, and a computing device; the control module is connected to both the contact signal testing device and the electronic measuring instrument; the computing device is connected to both the control module and the electronic measuring instrument; the computing device is responsible for generating target test instructions for a target object based on user test requirements and transmitting them to the control module; the control module receives and analyzes the target test instructions to obtain analysis results; and switches the control mode of the control module based on the analysis results of the target test instructions, synchronizing the analysis results of the target test instructions and the control mode of the control module to the contact signal testing device and the electronic measuring instrument; the contact signal testing device includes a fixture and a testing component; the fixture is used to place the target object; the testing component includes several test probes and several test circuits for testing various test points of the target object; the contact signal testing device is responsible for acquiring information from the target object and transmitting it to the control module, and is also responsible for receiving and analyzing the target test instructions based on user test requirements. The analysis results of the test command are used to switch the current test circuit to the test circuit corresponding to the analysis results of the target test command and the current control mode of the control module. The target object placed in the fixture is then pressed down onto the test component, ensuring that each test probe of the test component is in close contact with each test point of the target object. This allows the test circuit to collect the target signal of the target object based on the analysis results of the target test command and transmit it to the control module. The information of the target object includes identity information for uniquely identifying the target object and test configuration information for defining the test process and pass / fail standards. The control module receives and transmits the target signal of the target object to the electronic measuring instrument. The electronic measuring instrument receives the target signal of the target object, the analysis results of the target test results, and the control mode of the control module, measures the target signal of the target object, and transmits the measurement results to the computing device. The computing device receives and analyzes the measurement results of the target signal of the target object and generates a test report for the target object based on the information of the target object.

[0007] Preferably, the method further includes: the computing device binding the test report of the target object with the information of the target object.

[0008] Preferably, the target test instruction includes at least a test item sequence and test type and parameters; the target signal includes the voltage signal and current signal of the target object.

[0009] Preferably, the control module includes a microcontroller and a low-power signal relay; the control module receives and analyzes the target test command to obtain the analysis result of the target test command; and switches the control mode of the control module based on the analysis result of the target test command, including: the microcontroller receives and analyzes the target test command to obtain the analysis result of the target test command and transmits it to the low-power signal relay; the low-power signal relay switches its control mode based on the analysis result of the target test command.

[0010] A contact signal acquisition method, applied to any of the systems described above, includes: placing a target object to be tested within a fixture of a contact signal testing device; generating a target test instruction for the target object based on user testing requirements; analyzing the target test instruction to obtain an analysis result; switching the test circuit of the contact signal testing device and the measurement mode of the electronic measuring instrument based on the analysis result; acquiring information about the target object; wherein the information about the target object includes identity information for uniquely identifying the target object and test configuration information for defining the test process and pass / fail standards; acquiring a target signal of the target object based on the analysis result of the target test instruction; measuring the target signal of the target object based on the analysis result of the target test, the test circuit of the contact signal testing device, and the measurement mode of the electronic measuring instrument to obtain a measurement result of the target object; analyzing the measurement result of the target signal of the target object and generating a test report of the target object based on the information of the target object.

[0011] Preferably, it further includes: binding the test report of the target object with the information of the target object.

[0012] A contact signal acquisition device, applied to any of the methods described above, the device comprising: a placement unit for placing a target object to be tested within a fixture of the contact signal testing device; a test instruction generation unit for generating a target test instruction for the target object based on user test requirements; a first analysis unit for analyzing the target test instruction to obtain an analysis result of the target test instruction; a switching unit for switching the test circuit of the contact signal testing device and the measurement mode of the electronic measuring instrument based on the analysis result of the target test instruction; a first acquisition unit for acquiring information about the target object; wherein the information about the target object includes identity information for uniquely identifying the target object, and test configuration information for defining test procedures and pass / fail standards; a second acquisition unit for acquiring a target signal of the target object based on the analysis result of the target test instruction; a measurement unit for measuring the target signal of the target object based on the analysis result of the target test result, the test circuit of the contact signal testing device, and the measurement mode of the electronic measuring instrument to obtain a measurement result of the target object; and a second analysis unit for analyzing the measurement result of the target signal of the target object and generating a test report of the target object based on the information of the target object.

[0013] Preferably, it further includes: The information binding unit is used to bind the test report of the target object with the information of the target object.

[0014] A contact-type signal acquisition device includes: one or more processors and a memory; the memory stores computer-readable instructions, which, when executed by the one or more processors, implement the steps of the contact-type signal acquisition method as described above.

[0015] A readable storage medium storing computer-readable instructions, which, when executed by one or more processors, cause the one or more processors to perform the steps of any of the contact signal acquisition methods described above.

[0016] As can be seen from the above description, when performance testing or pre-shipment quality testing of circuit boards is required, this application can provide a contact signal acquisition system. This system includes a control module, electronic measuring instruments, a contact signal testing device, and a computing device. The control module is connected to both the contact signal testing device and the electronic measuring instruments. The computing device is connected to both the control module and the electronic measuring instruments. The computing device is responsible for generating target test instructions for the target object based on the user's testing requirements and transmitting them to the control module. The control module receives and analyzes the target test instructions, obtaining the analysis results. Based on the analysis results, the control module switches its control mode, synchronizing the analysis results and the control mode to the contact signal testing device and the electronic measuring instruments. The contact signal testing device may include a fixture and a testing component. The fixture can be used to place the target object. The testing component includes several test probes and several test circuits for... The test circuit performs tests on each test point of the target object. The contact signal testing device collects information about the target object and transmits it to the control module. It also receives and, based on the analysis results of the target test command, switches the current test circuit to the test circuit corresponding to the analysis results of the target test command and the current control mode of the control module. The target object, placed in the fixture, is then pressed down onto the test assembly, ensuring that each test probe of the test assembly makes close contact with each test point of the target object. This allows the test circuit to collect the target signal of the target object based on the analysis results of the target test command and transmit it to the control module. The control module receives and transmits the target signal of the target object to the electronic measuring instrument. The electronic measuring instrument receives the target signal of the target object, the analysis results of the target test results, and the control mode of the control module, measures the target signal of the target object, and transmits the measurement results to the computing device. The computing device receives and analyzes the measurement results of the target signal of the target object and, based on the information of the target object, generates a test report for the target object.

[0017] Compared to existing technologies that rely on manual multimeter operation, this solution's contact signal acquisition system, through innovative architecture and automated control, generates test commands via computing devices. These commands are then automatically parsed and executed by the control module, controlling the contact signal testing device to automatically complete probe contact, circuit switching, and driving the electronic measuring instrument to automatically complete the measurement. The entire process requires no manual intervention for range switching, probe connection, or reading recording. This effectively transforms the previously discrete, serial manual operation into a continuous, automated process, reducing single test time from minutes to seconds. It is particularly suitable for large-scale mass production environments, significantly increasing test throughput and effectively eliminating production bottlenecks. Human error is completely avoided, ensuring the accuracy and reliability of test results. The system provided in this application uses programmed instructions, with the control module precisely controlling the selection and switching of the test circuit. This ensures that the circuit is in parallel mode for voltage measurement and in series mode for current measurement, physically eliminating the possibility of "misuse of range" or "incorrect wiring." The testing process in this application is completely standardized, eliminating operational variations and misjudgments caused by differences in personnel skills, fatigue, or lack of responsibility. The consistency and repeatability of test results are fundamentally guaranteed, providing a reliable data foundation for stable product quality control. It significantly reduces the labor intensity and skill threshold for operators. Furthermore, through the system of this application, the role of the test operator shifts from a specific executor to a system monitor; their core task is simplified to placing the motherboard and starting the test program, while all complex connection, switching, measurement, and recording tasks are automatically completed by the system. This greatly reduces the physical and mental burden on operators, while reducing reliance on their professional skills and experience, simplifying the training process, and benefiting enterprise human resource management and cost control. It achieves seamless integration with automated production lines, laying the foundation for intelligent production. The system provided by this application can be easily embedded into fully automated testing lines, working collaboratively with robotic arms, conveyors, and other automated testing equipment to achieve unmanned, continuous production and testing from upstream to downstream, strongly supporting intelligent manufacturing and Industry 4.0 transformation in modern factories, and providing more comprehensive test data management and analysis capabilities. The computing device of this application not only generates test instructions but also receives and analyzes measurement results, and automatically generates structured test reports. All test data can be recorded, stored, and traced, enabling electronic and systematic management of test data. This facilitates statistical process control (SPC), quality traceability, and big data analysis, thereby enabling timely detection of potential problems in the production process, continuous optimization of processes, and improvement of overall product yield.This application systematically and fundamentally solves the core problems inherent in traditional manual testing modes, such as low efficiency, poor reliability, reliance on manual labor, and difficulty in integration, by constructing an automated system that integrates control, measurement, execution, and data analysis. It has made outstanding and substantial progress in improving production efficiency, ensuring product quality, and promoting intelligent manufacturing. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This application provides a schematic diagram of a system architecture for implementing contact signal testing; Figure 2 This application provides a schematic diagram of the structure of a contact-type signal testing device; Figure 3 A UI interface display effect diagram of a computing device provided in this application; Figure 4 A flowchart of a contact-type signal acquisition method provided in this application; Figure 5 This is a schematic diagram of a contact-type signal acquisition device as an example of this application; Figure 6 This is a hardware structure block diagram of a contact-type signal acquisition device disclosed in this application. Detailed Implementation

[0020] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] Given that most current contact-based signal acquisition solutions are ill-suited to complex and ever-changing business needs, the applicant has developed a contact-based signal acquisition solution. This solution systematically and fundamentally addresses the core problems inherent in traditional manual testing methods, such as low efficiency, poor reliability, reliance on manual labor, and difficulty in integration, by constructing an automated system that integrates control, measurement, execution, and data analysis. It represents a significant and substantial advancement in improving production efficiency, ensuring product quality, and promoting intelligent manufacturing.

[0022] The method provided in this application can be used in a wide variety of general-purpose or special-purpose computing device environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor devices, and distributed computing environments including any of the above devices. This application provides a contact-based signal acquisition method, which can be applied to various electronic product management systems, as well as to various computer terminals or smart terminals. The executing entity can be the processor or server of the computer terminal or smart terminal.

[0023] The following is combined Figure 1 This application introduces an optional system architecture for automatically testing contact signals, as provided in its embodiments. Figure 1 As shown, the system architecture may include: a control module, electronic measuring instruments, a contact signal testing device, and a computing device; the control module is connected to both the contact signal testing device and the electronic measuring instruments; the computing device is connected to both the control module and the electronic measuring instruments.

[0024] The control module consists of an ESP32-S3 MCU and a low-power signal relay. The ESP32-S3 MCU is the "brain" of the control module, while the low-power signal relay acts as its "smart switch." In practice, the ESP32-S3 MCU is a powerful microcontroller capable of executing preset test programs. For example, the ESP32-S3 MCU can execute a test program that first powers the motherboard's PCIe slot, waits 500 milliseconds, and then triggers the power button signal. It can also receive instructions from a host computer (such as test software on a PC) via USB, Wi-Fi, or Bluetooth and report the test status.

[0025] The ESP32-S3 MCU can also be used as a GPIO output, which is crucial for controlling low-power signal relays. The GPIO port can output a high level (typically 3.3V) or a low level (0V). This weak electrical signal is the "command stick" used to drive the low-power signal relay.

[0026] A relay is essentially an electronic switch that uses a small current to control a large current. Its internal structure contains a coil and a set of movable metal contacts (called "normally open", "normally closed", and "common").

[0027] When a high-level signal is applied to the coil of the low-power signal relay via the GPIO port of the ESP32-S3 MCU, the coil is energized, generating a magnetic field. Like an electromagnet, this attracts the internal metal spring, connecting the "common terminal" and the "normally open" contact, thus completing the circuit. When the ESP32-S3 MCU's GPIO port outputs a low level, the coil is de-energized, the magnetic field disappears, and the spring returns under spring pressure, disconnecting the "normally open" contact and breaking the circuit. The ESP32-S3 MCU provides only a small current (typically less than 20mA) to drive the electromagnet of the low-power signal relay, while the low-power signal relay itself can withstand and switch circuits with higher voltages and larger currents (such as controlling a 12V fan or 24V power supply on the motherboard).

[0028] Therefore, in practice, the computing device of this application can be responsible for generating target test instructions for the target object based on the user's test requirements and transmitting them to the control module. The target test instructions include at least a sequence of test items and test types and parameters.

[0029] The target test instructions generated by the computing device based on the user's test requirements are a structured set of commands that define the flow, parameters, and standards of the entire test task. Specifically, these target test instructions may include, but are not limited to, the following: 1. Target object identification information Content: Information used to uniquely identify the target object being tested (such as a computer motherboard), such as product model, serial number, production batch number, etc.

[0030] Purpose: This information is a key index for test reports and data traceability, ensuring that measurement results are accurately linked to specific products.

[0031] 2. Test Item Sequence Content: Defines the test tasks to be performed and their sequence. For example, it explicitly indicates that the test procedure is "first perform the voltage test, then perform the leakage current test".

[0032] Function: It standardizes the testing process, ensures consistency in each test operation, and forms the basis for automated execution.

[0033] 3. Test Types and Parameters Content: Specify the type and electrical parameters for each test item. See details below: For voltage testing: specify that it is a DC voltage measurement and specify the expected voltage range (e.g., 2.7V - 3.3V).

[0034] For current testing: specify that it is a DC current measurement and specify the acceptable threshold for leakage current (e.g., less than or equal to 1 μA).

[0035] Function: It provides accurate information for the control module to switch to the correct measurement mode (control mode) and for electronic measuring instruments to set the correct range.

[0036] 4. Test point mapping relationship Content: The correspondence between the physical test points (such as the positive and negative contacts of a battery holder) on the target object to be measured and the corresponding test probes and test circuits on the contact signal testing device.

[0037] Function: To guide the testing equipment to accurately establish electrical connections and ensure that signals are collected from the correct points.

[0038] 5. Control Logic and Judgment Conditions Content: Contains simple logical judgment instructions. For example, "If the voltage test result is lower than 2.7V, it is judged as a failure and the subsequent current test is terminated"; or "If the current test passes, the green indicator light is lit; otherwise, the red indicator light is lit".

[0039] Function: It gives the system preliminary decision-making ability, improves testing efficiency and intelligence, and avoids continuing meaningless testing when failure is known.

[0040] 6. Data Recording and Output Requirements Content: Specifies how to process measurement results data. For example, it requires recording the original measurement values, test timestamps, operator employee numbers, and specifies the format (such as PDF, CSV) and save path for generating test reports.

[0041] Function: It enables automated management and archiving of test data, facilitating quality traceability and analysis.

[0042] By incorporating the aforementioned comprehensive target test instructions, the system provided in this application is no longer a simple measurement tool, but a programmable and configurable automated testing platform. Users can flexibly adapt to the testing needs of different product models by modifying or calling different test instructions, greatly enhancing the system's versatility and flexibility. This in itself represents a significant advancement compared to traditional fixed, single, manual testing methods.

[0043] The control module receives and analyzes the target test commands generated by the computing device, thereby obtaining the analysis results of the target test commands. Based on the analysis results, it can switch the control mode of the control module and synchronize the analysis results and control mode of the target test commands with the contact signal testing device and electronic measuring instruments. As described above, the control module may include a low-power signal relay and an ESP32-S3 MCU. By analyzing the target test commands, the items and parameters that the user needs to test can be determined. The ESP32-S3 MCU can then switch the control mode of the low-power signal relay based on the analysis results of the target test commands.

[0044] For example, the control module includes a microcontroller and a low-power signal relay; the control module receives and analyzes the target test command, obtains the analysis result of the target test command, and switches the control mode of the control module based on the analysis result of the target test command, which may include the following: the microcontroller receives and analyzes the target test command, obtains the analysis result of the target test command and transmits it to the low-power signal relay; the low-power signal relay can then switch its control mode based on the analysis result of the target test command.

[0045] like Figure 2 As shown, Figure 2 A schematic diagram of a contact signal testing device is provided. To achieve automated and highly reliable testing, the contact signal testing device of this application may include a fixture and a testing component. The fixture is used to place the target object. The testing component includes several test probes and several test circuits for testing various test points of the target object. The contact signal testing device is responsible for collecting information from the target object and transmitting it to the control module. It is also responsible for receiving and, based on the analysis results of the target test command, switching the current test circuit to the test circuit corresponding to the analysis results of the target test command and the current control mode of the control module. The target object placed in the fixture is then pressed down onto the testing component, so that each test probe of the testing component is in close contact with each test point of the target object. This allows the test circuit to collect the target signal of the target object based on the analysis results of the target test command and transmit it to the control module. The target signal includes the voltage signal and current signal of the target object.

[0046] In this application, a "fixture" is provided for the contact signal testing device, mainly to solve a series of problems caused by inaccurate positioning and poor contact in manual testing.

[0047] In manual testing, operators need to manually align and contact the test leads with the test points. For small, densely packed test points, positioning deviations and unstable contact pressure are prone to occur, leading to fluctuating test results or even probe slippage and circuit damage. The fixture of this contact-type signal testing device can be specially designed according to the physical dimensions of the target object (such as a motherboard) and the location of the test points, providing a standardized, mechanized placement position. This ensures that the target object can be quickly and accurately placed in the same preset position for each test. This lays the physical foundation for subsequent test probes to be repeatedly and accurately aligned with the target test points. It ensures stable and reliable electrical contact between the test probes and the test points. In practice, manually holding the test leads can lead to inconsistent contact pressure and angle, easily introducing contact resistance and causing voltage measurement errors; in current measurement, unstable contact may even cause momentary circuit breaks, resulting in abnormal readings. After fixing the target object, the fixture of this application drives the test components to press down (via a power source such as a cylinder or motor), causing all test probes to simultaneously and with constant pressure form tight contact with the test points of the target object. The clamp effectively eliminates contact resistance variations caused by different manual operation forces and angles, ensuring the consistency and reliability of electrical connections, thereby directly improving the accuracy and repeatability of voltage and current measurement results. In manual testing, the process of "finding the test point - alignment - contact" is the most time-consuming and is the main factor affecting testing efficiency. In practice, the operator only needs to place the target object into the clamp, and the subsequent positioning, pressing, contact, and testing are all completed automatically by the system. This greatly simplifies the operator's actions, reducing the clamping time of a single test to the second level, which is a key link in improving the overall test throughput and lays the foundation for achieving production line rhythm matching. In practice, careless manual operation may cause the probes to slip and scratch the precision components or circuits on the motherboard; misoperation may also cause the probes to hit the test point at the wrong angle, causing damage. The clamp's guiding and positioning functions, combined with the automatic pressing mechanism, ensure that the probes contact the test point with a vertical and standardized movement trajectory, avoiding lateral stress. This effectively protects the expensive motherboard (target object) and precision test probes, reducing material loss and equipment maintenance costs during the production process.

[0048] Therefore, the "clamp" in this application is not a simple supporting structure, but a bridge connecting automated control with precise execution in the physical world. Through mechanical constraints and guidance, it transforms unstable human operations into predictable and repeatable mechanical movements, thus providing fundamental guarantees for the entire contact signal acquisition system in terms of accuracy, reliability, efficiency, and safety. Without this component, the system's automation advantages and testing quality would be meaningless.

[0049] Specifically, this application employs a test component containing multiple test probes to acquire and test signals from the target object, aiming to fundamentally solve all the drawbacks of the "serial and discrete" operation mode in manual testing. It is not a simple stacking of multiple probes, but rather the construction of a parallel and integrated test architecture. The specific objectives and effects are as follows: 1. Achieve true parallel testing and multi-point synchronous measurement Manual testing uses two probes, which can only contact one or two test points (such as positive and negative voltage terminals) at a time, resulting in serial measurements. To measure multiple voltages or different types of signals at different locations, the probes must be repeatedly moved and reconnected, which is the main time bottleneck. The test component integrates multiple test probes, whose physical layout corresponds one-to-one with all the test points on the target object (motherboard) that need to be measured. When the component is pressed down, all probes simultaneously establish electrical connections with all test points. This allows the system to complete the acquisition preparation of all signals in an instant, or route the signals to the corresponding instruments, achieving a qualitative leap from "serial" to "parallel" processing, resulting in an order-of-magnitude improvement in testing efficiency.

[0050] 2. Enable automatic and non-destructive switching between test circuits and measurement modes. The most tedious and error-prone part of manual testing is manually switching the multimeter range and reconnecting the probes (such as switching from parallel connection for voltage measurement to series connection for current measurement).

[0051] The test assembly integrates several test circuits (such as parallel circuits for voltage measurement, series circuits for current measurement, and bridge circuits for resistance measurement). These circuits are automatically switched under the command of the control module via relays or analog switches.

[0052] Once the operator initiates the test, the system automatically controls the switching of internal circuits without any manual plugging, unplugging, or alteration of physical connections. For example, within milliseconds, the same set of probes first switches to the voltage measurement circuit to read the voltage, and then automatically switches to the current measurement circuit to read the leakage current. This completely eliminates equipment damage and test errors caused by incorrect manual switching of ranges / connection methods.

[0053] 3. Ensure high consistency and reliability of test connections. The contact pressure, angle, and position of the manual probes vary each time, introducing unstable contact resistance and affecting measurement accuracy, especially for low voltage and microampere current measurements.

[0054] All probes are precisely fixed in a test module (i.e., test assembly), and their positions and contact force after being pressed down are pre-set and highly consistent.

[0055] It eliminates random errors caused by human operation, ensures that the physical conditions of each test are exactly the same, greatly improves the repeatability, consistency and reliability of test data, and provides a guarantee for accurate quality judgment.

[0056] 4. Enables single-clamp completion of complex, multi-functional tests. Traditional methods make it difficult to perform comprehensive electrical testing on a motherboard (such as simultaneously monitoring multiple power supply voltages, clock signals, leakage current, etc.).

[0057] The multi-probe design allows for the simultaneous connection of dozens or even hundreds of test points. Combined with the internal programmable circuit network, complex test paths can be constructed.

[0058] Users only need to place the motherboard to be tested once, and the system can automatically and continuously complete all tests according to the pre-programmed sequence (such as power supply voltage 1, power supply voltage 2, main chip leakage current, interface signal level, etc.), realizing "one-stop" fully automated testing, which greatly expands the test coverage and depth.

[0059] The test component provided in this application, comprising multiple test probes and several test circuits, serves as the "intelligent hand" of the entire system. Through hardware integration and program automation, it replaces the discrete manual operations of "moving, connecting, and switching," transforming the traditional multimeter from a general-purpose handheld tool into a dedicated, integrated, and automated test engine. This not only brings a leap in efficiency but also achieves a revolutionary improvement in quality control and test reliability, which is the core reason why this application is suitable for modern mass production environments.

[0060] The control module can receive and transmit the target signal from the target object to the electronic measuring instrument. In practice, this application sets the "control module" as the central hub of the signal path, rather than allowing the "contact signal testing device" to communicate directly with the "electronic measuring instrument." This is a well-thought-out design. The purpose of setting the "control module" as the signal transmission hub is to achieve central control of signal routing and system integration.

[0061] In practice, electronic measuring instruments can be such as high-performance digital multimeters and data acquisition cards. These instruments typically have standardized interfaces (e.g., GPIB, USB, LAN), but they do not manage complex test fixtures, probes, and circuit switching. Directly connecting contact signal testing devices to electronic measuring instruments can lead to overly tight coupling between the instrument interface and numerous test channels, resulting in a rigid system that is difficult to expand and reuse. By using a control module as an intelligent intermediary and router, it receives the raw physical signals from the testing device and routes them to the designated electronic measuring instrument according to test instructions. This design decouples "signal acquisition" (testing device) from "signal measurement" (electronic measuring instrument). The same testing device can connect to different models or brands of measuring instruments through the control module, enhancing the system's versatility and configurability.

[0062] Furthermore, the control module can manage multiple measurement channels and multiplex them onto the limited input channels of a single electronic measuring instrument, achieving efficient utilization of hardware resources. For example, through the multiplexer inside the control module, a multimeter can sequentially measure the voltage at dozens of points.

[0063] Secondly, the control module acts as an intelligent intermediary and router. It receives the raw physical signals from the testing device and routes them to the designated electronic measuring instrument according to the test instructions. This design provides signal conditioning and interface adaptation. In practice, the raw signals acquired from the test probes may not be suitable for direct input to the electronic measuring instrument. For example, the signal may be too weak, noisy, or the current signal may need to be converted to a voltage signal for measurement. The control module can have built-in signal conditioning circuitry, such as amplifiers, filters, and current-to-voltage converters. It "preprocesses" the raw signals from the testing device. Through signal conditioning, it ensures that the signal sent to the electronic measuring instrument is clean, well-defined, and within its optimal range, thereby fundamentally improving the accuracy and reliability of the measurement. Regardless of the diversity of the front-end test signals, the control module can process them and send them out with the standard interface and level "expected" by the electronic measuring instrument, acting as a "translator" and "adapter."

[0064] This design also enables synchronized control information and measurement data. In practice, electronic measuring instruments need to know "what to measure" (which signal) and "how to measure" (range, mode). If they only receive signals without control information, the instrument will not be able to operate automatically. For example, the control module sends the "analysis results of the target test command" and the "control mode" to the electronic measuring instrument simultaneously with the "target signal." This is equivalent to telling the electronic measuring instrument: "Please measure this signal using the DC voltage range and the 10V range." This allows the electronic measuring instrument to achieve fully automatic parameter configuration and measurement strictly synchronized with the testing process, which is a key link in realizing the "one-click" automation of the entire system.

[0065] This design also enables centralized system management and status monitoring. In practice, distributed systems require a central unit to coordinate the working status of various parts, handle anomalies, and record logs. As the essential pathway for information flow, the control module can monitor signal conditions in real time (e.g., open circuits, short circuits) and record all flowing data and instructions, facilitating system diagnosis and fault location. If a test fails, it can quickly determine whether the problem lies in signal acquisition, transmission, or instrument measurement, greatly improving system maintainability.

[0066] In summary, the design of the control module receiving and forwarding signals elevates it from a simple "messenger" to the system's "central dispatcher" and "signal commander." Through routing and integration, it enhances the system's flexibility and scalability; through conditioning and adaptation, it ensures the accuracy and reliability of measurements; through synchronization and control, it achieves full automation of the process; and through signal management and monitoring, it strengthens the system's maintainability. This design is the core architectural decision that transforms the entire system from a mechanical automated device into an intelligent, reliable, and efficient modern testing platform.

[0067] Therefore, in practice, electronic measuring instruments can receive the target signal of the target object, the analysis results of the target test results, and the control mode of the control module, then measure the target signal of the target object and transmit the measurement results to a computing device. The computing device receives and analyzes the measurement results of the target signal of the target object and generates a test report of the target object based on the target object's information. Furthermore, the computing device can bind the test report of the target object with the information of the target object.

[0068] The target object information includes at least identity information uniquely identifying the object, and test configuration information defining the test process and pass / fail criteria. For example, the target object information may include barcode information and log information. This target object information is a critical data set that permeates the entire process of test instructions, test execution, and report generation. In this application, the target object information is a multi-layered data set, including both identity information for identification and traceability, and configuration information to guide the correct execution of the test system. Specifically, it may include, but is not limited to, the following: 1. Identification information of the target object (used for unique identification and data traceability) This type of information acts as the "identity card" for the target, ensuring that each piece of test data can be accurately attributed.

[0069] (1) Product serial number: uniquely identifies each specific target object (such as each motherboard).

[0070] (2) Product Model: Indicates the type and specifications of the target object.

[0071] (3) Production batch number: used to trace all products produced using the same batch of raw materials and processes.

[0072] (4) Production timestamp: Records the specific time when the object enters the test station.

[0073] (5) Production line / station number: Specify the location where the test takes place.

[0074] 2. Test configuration information for the target object (used to guide the system on how to test). This type of information serves as a "test manual" for the target object, driving the system to automatically complete all settings.

[0075] (1) Test program number / name: indicates which predefined test process the computing device should call (e.g., “Motherboard Type A - Final Inspection Program”).

[0076] (2) Test point layout definition: Defines the physical correspondence between each test point (such as BAT_VCC, BAT_GND, LEAKAGE_CURRENT) on the target object and the specific probe on the test component.

[0077] (3) Pass / Fail Criteria: Preset standard ranges for each test parameter. For example: 1) Battery holder voltage acceptable range: 3.0V - 3.3V 2) Maximum allowable leakage current: 1.5μA (4) Signal routing configuration: Specifies which test circuits inside the test component need to be turned on for different test items (e.g., switch to voltage measurement circuit or current measurement circuit).

[0078] 3. Physical property information (used to guide the operation of the fixture and probe) This type of information ensures that the testing equipment can be safely and reliably coupled to the target object.

[0079] (1) Mechanical dimensions and outline drawings: used for designing and calibrating fixtures to ensure that the target object can be accurately fixed.

[0080] (2) Test point coordinates: guide the probe array of the test component to perform precise alignment.

[0081] (3) Recommended contact pressure: To prevent damage to precision circuits, the pressure of the probe should be specified.

[0082] (4) Safety area marking: Indicates the sensitive component area that needs to be avoided.

[0083] These information interact during system operation: 1. The operator scans the serial number (identification information) of the target object.

[0084] 2. The computing device is associated with its model number based on its serial number, and the corresponding test program and criteria (configuration information) are automatically loaded to generate the target test instructions.

[0085] 3. The control module, based on instructions, uses the test point layout and signal routing configuration (configuration information) to control the test components to complete circuit switching and probe contact.

[0086] 4. When the final test report is generated, the measurement results will be bound together with the serial number, model, batch (identity information), log information, and the criteria used (configuration information) to form a complete and traceable quality record.

[0087] For example, if the log information of the target object is recorded, when the test result of the target object is poor performance, the system will issue an alarm, the next process will scan the barcode and the log will also record the relevant test information. If there is a complaint, this information can also be viewed to trace the problem.

[0088] This application enables electronic measuring instruments to receive these three types of information (target signal, analysis results, and control mode), which is the core design for realizing the entire system's transition from "mechanization" to "intelligence." The core purpose of this design is to transform the electronic measuring instrument from a passive tool requiring manual settings into an active execution unit that receives central commands, thereby constructing a precise, reliable, and traceable automated closed loop at the system level. Traditional measuring instruments do not know what signal to measure, why to measure, or how to measure. In this system, by synchronously transmitting the "analysis results of the target test command" and the "control mode," it is equivalent to giving the instrument a "brain" and "context." This allows the electronic measuring instrument to automatically set the correct measurement functions (such as DCV, DCA), ranges (such as 3V range, 10mA range), sampling rates, and other parameters according to the commands. This completely eliminates equipment damage and data errors caused by manual setting errors (such as using a current range to measure voltage). The electronic measuring instrument clearly knows whether "the currently measured signal is voltage from point A" or "current in loop B," ensuring that the measurement action is strictly synchronized with the system's test process and avoiding misalignment between data and test items.

[0089] Secondly, by having the electronic measuring instrument receive these three types of information (target signal, analysis results, and control mode), this design ensures the "traceability" and "data integrity" of the measurement process. It processes the original target signal along with its corresponding test commands and control logic, ensuring that each measurement is not an isolated data point. When the measurement result is generated, it is tightly bound to metadata such as "object under test information," "test items," and "pass / fail criteria." When the computing device receives these context-rich measurement results, it can easily compare them with preset pass / fail criteria and automatically generate a detailed and standardized test report. This report not only includes a "pass / fail" conclusion but also traces the source and test conditions of each data point, greatly facilitating quality traceability and problem analysis.

[0090] Furthermore, by having electronic measuring instruments receive these three types of information (target signal, analysis results, and control mode), this design can construct an efficient closed loop of "measurement-decision," a crucial link in achieving full automation. The electronic measuring instrument is no longer the end point of the process, but a key node in data acquisition. Measurement results are transmitted back to the computing device in real time, allowing the device to immediately make decisions based on the results. For example, if the current test exceeds the limit, the computing device can immediately command the control module to illuminate a red light, record the fault, and notify the production line to sort the device to the repair area. The system can easily implement conditional testing logic such as "if the voltage test passes, then perform the current test; otherwise, skip," greatly improving testing efficiency and intelligence.

[0091] By having electronic measuring instruments receive these three types of information (target signal, analysis results, and control mode), the system's "accuracy" and "professionalism" can be improved. Specialized measurement tasks are delegated to specialized electronic measuring instruments, rather than being overridden by the control module. Electronic measuring instruments (such as high-precision digital multimeters) are specifically designed for the accurate measurement of electrical parameters, and their accuracy, stability, and anti-interference capabilities far surpass those of ordinary control modules or microcontroller ADCs (analog-to-digital converters). This design clearly defines the responsibilities of each unit within the system: the contact signal testing device is responsible for reliable contact and signal routing; the control module is responsible for process scheduling and signal relay; the electronic measuring instruments are responsible for high-precision data acquisition; and the computing equipment is responsible for command and decision-making. This division of labor and collaboration ensures that the entire system achieves optimal performance at every stage.

[0092] In summary, the fundamental purpose of enabling electronic measuring instruments to receive "signals + commands + modes" and return results is to seamlessly and intelligently embed the core action of measurement into the entire automated control process. This ensures that the entire information flow, from "user needs" to "test commands," then to "physical signals," and finally to "measurement data" and "analysis reports," is continuous, accurate, error-free, and traceable. This not only multiplies efficiency but, more importantly, it enforces standardized operating procedures through technological means, eliminating all uncertainties that human intervention might introduce, thus providing crucial guarantees of quality consistency and data reliability for large-scale production.

[0093] The final step, "receiving, analyzing, and generating reports," is handled by computing devices. This crucial element elevates all the preceding hardware improvements into manageable and decision-making data value. It transforms raw, discrete measurement data into structured information with management value and decision support significance, thus elevating the process from "testing" to "quality inspection" and then to "production management." In practice, the computing devices have pre-set pass / fail criteria for various test parameters (e.g., voltage range 3.2V ~ 3.4V, leakage current < 1μA). Upon receiving measurement results, it automatically and instantly compares them with standards. This completely replaces the subjective process of operators "glancing at the readings and judging based on experience," eliminating misjudgments and omissions caused by fatigue or negligence. The analysis results can immediately trigger subsequent actions (such as controlling cylinders on the production line via I / O interfaces to push qualified and unqualified products onto different tracks), achieving 100% online real-time sorting—an essential function for building a fully automated production line. It also enables the structuring and traceability of production data. The computing equipment binds measurement results with information about the target object (such as product serial number, model, production timestamp, operator number, and test station ID) to generate a complete structured test report (such as XML, CSV, or database records), rather than fragmented paper records. When quality problems arise in the future, the original data of each test node on the production line can be accurately traced through the serial number, providing the most direct evidence for quality analysis. All reports are aggregated in the database, providing a data foundation for Statistical Process Control (SPC). Managers can clearly see product yield trends and drift of specific parameters, thereby detecting anomalies in production equipment before problems escalate, enabling predictive maintenance and process optimization. It also improves the efficiency and paperless level of the testing process, automatically generating reports to replace the tedious work of traditional manual recording, sorting, and archiving of paper documents. Report generation is almost instantaneous, significantly improving efficiency compared to time-consuming manual recording. It achieves complete paperlessness in the testing process, saving paper, printing, and management costs, while also conforming to the concept of modern green factories.

[0094] It can also form a closed-loop feedback loop to enhance system intelligence. The computing device, acting as the highest-level "brain," not only generates reports but also optimizes the testing process based on the report data. If the system finds that a certain product model consistently passes a certain test 100%, it can suggest simplifying or skipping that test to further improve overall efficiency. The system can analyze long-term data to self-diagnose whether its measurement accuracy has drifted and provide calibration prompts, demonstrating its advanced intelligence.

[0095] like Figure 3 As shown, the computing device can display the test results of the target object on the UI interface, and can display relevant content of the test report.

[0096] In summary, if the preceding modules (control, measurement, and execution) replaced human hands and eyes, then the function of the computing device in generating test reports replaces the human brain in judgment, recording, and decision-making. It elevates a simple "signal measurement system" into a complete "production quality analysis and control system." Its output is no longer a collection of cold readings, but high-quality information assets with "pass / fail" conclusions, usable for in-depth analysis and full-process traceability. This is the final and most crucial step in achieving intelligent, digital, and traceable production.

[0097] As shown in Table 1, the computing device of this application can generate a test report for the target object based on the various test results of the target object as follows:

[0098] In practice, the "power switch" on a computer motherboard is actually two pins; shorting them together powers on the motherboard. The control module in this application simulates this "short-circuit" action. For example, when a tester clicks the "Start Power-On Test" button via software (host computer) on the computing device, the test command is sent to the ESP32-S3MCU of the control module via USB. Upon receiving the test command, the ESP32-S3MCU's internal program (firmware) begins execution. The program knows that "simulating power-on" requires operating a relay connected to a specific GPIO port (e.g., GPIO12). The ESP32-S3MCU then pulls the level of GPIO12 from low (0V) to high (3.3V). This 3.3V high-level signal is applied across the relay coil, energizing the coil and generating a magnetic field. This magnetic field attracts the metal contacts inside the low-power signal relay, connecting the "common" and "normally open" terminals. The "common" and "normally open" terminals of the low-power signal relay are connected to the "power switch" header (PWR_SW) on the motherboard of the computing device via wires. When the low-power signal relay is energized, it is equivalent to shorting these two pins on the motherboard with an invisible wire. The motherboard of the computing device detects this shorting signal and then executes the power-on procedure.

[0099] Specifically, according to the program settings, the ESP32-S3 MCU will pull GPIO12 back low after holding it at a high level for tens to hundreds of milliseconds. This de-energizes the low-power signal relay coil, opens the contacts, and releases the simulated "button." This completes a full power-on signal simulation.

[0100] In practice, the GPIO ports of the ESP32-S3 are very delicate, capable of handling only 3.3V, milliamp-level current. Directly using them to short-circuit unknown circuits on the motherboard could instantly burn out the ESP32-S3 MCU if a higher voltage or current is applied to a test point on the motherboard. Using low-power signal relays in the control module plays two crucial roles: 1. Electrical isolation: The control circuit (low voltage, low current) where the ESP32-S3 MCU is located and the controlled circuit (potentially higher voltage and current) on the motherboard are physically isolated. They are only connected by magnetic fields, not by direct electrical connection, which improves the system's safety and anti-interference capability.

[0101] 2. Power Amplification: A "weak" signal (3.3V, 20mA) is used to control a "powerful" circuit (such as 12V, 1A), thus achieving signal amplification and driving.

[0102] In particular, in practical circuits, to optimize the performance of the control module, the control module provided in this application may also include several important auxiliary components: 1. Transistor / MOSFET Driver: The GPIO port of the ESP32-S3 MCU has limited driving capability, which is sometimes insufficient to directly drive the relay coil. Usually, a transistor or MOSFET is used as an "electronic switch", which is controlled by the GPIO port. The "electronic switch" then controls the flow of a larger current to the relay coil.

[0103] 2. Flyback Diode: The relay coil is an inductor, which generates a very high reverse induced electromotive force (voltage) at the moment of power failure. This voltage spike could potentially damage the GPIO port of the ESP32-S3. Connecting a diode in reverse parallel across the relay coil can discharge this voltage spike, protecting the MCU. This diode is crucial! For example, a simplified driver circuit diagram is as follows: ESP32-S3 MCUGPIO -> Resistor -> NPN transistor base; Transistor collector -> Relay coil -> VCC; Transistor emitter -> GND; The freewheeling diode is connected in reverse parallel across the coil.

[0104] In summary, the implementation process of the control module in this application can be understood as using an ESP32-S3 microcontroller as the control core. High / low level signals are output through its GPIO ports, amplified by a driver circuit (such as a transistor), and then used to control the on / off state of a low-power signal relay coil. The relay contacts act as physical switches to connect or disconnect various test signals on the computer motherboard (such as power switches, reset switches, voltage measurement points, etc.), thereby achieving fully automatic or semi-automatic testing of the motherboard functions. This architecture is flexible, reliable, and low-cost, making it a classic design in the fields of industrial control and automated testing.

[0105] As described above, the contact signal acquisition system provided by this solution, through innovative architecture and automated control, generates test commands via computing devices, which are then automatically parsed and executed by the control module. This controls the contact signal testing device to automatically complete probe contact and circuit switching, and drives the electronic measuring instrument to automatically complete the measurement. The entire process requires no manual intervention for range switching, probe connection, or reading recording. It effectively transforms the originally discrete, serial manual operation into a continuous, automated process, reducing the single test time from minutes to seconds. This is particularly suitable for large-scale mass production environments, significantly increasing test throughput and effectively eliminating production bottlenecks. It completely avoids human error, ensuring the accuracy and reliability of test results. The system provided in this application uses programmed instructions, with the control module precisely controlling the selection and switching of the test circuit. This ensures that the circuit is in parallel mode for voltage measurement and in series mode for current measurement, physically eliminating the possibility of "misuse of range" or "incorrect wiring." The testing process in this application is completely standardized, eliminating operational variations and misjudgments caused by differences in personnel skills, fatigue, or lack of responsibility. The consistency and repeatability of test results are fundamentally guaranteed, providing a reliable data foundation for stable product quality control. It significantly reduces the labor intensity and skill threshold for operators. Furthermore, through the system of this application, the role of the test operator shifts from a specific executor to a system monitor; their core task is simplified to placing the motherboard and starting the test program, while all complex connection, switching, measurement, and recording tasks are automatically completed by the system. This greatly reduces the physical and mental burden on operators, while reducing reliance on their professional skills and experience, simplifying the training process, and benefiting enterprise human resource management and cost control. It achieves seamless integration with automated production lines, laying the foundation for intelligent production. The system provided by this application can be easily embedded into fully automated testing lines, working collaboratively with robotic arms, conveyors, and other automated testing equipment to achieve unmanned, continuous production and testing from upstream to downstream, strongly supporting intelligent manufacturing and Industry 4.0 transformation in modern factories, and providing more comprehensive test data management and analysis capabilities. The computing device of this application not only generates test instructions but also receives and analyzes measurement results, and automatically generates structured test reports. All test data can be recorded, stored, and traced, achieving electronic and systematic management of test data. This facilitates statistical process control (SPC), quality traceability, and big data analysis, enabling timely identification of potential problems in the production process, continuous process optimization, and improved overall product yield. This application, by constructing an automated system integrating control, measurement, execution, and data analysis, systematically and fundamentally solves the core problems inherent in traditional manual testing methods, such as low efficiency, poor reliability, reliance on manual labor, and difficulty in integration. It represents a significant and substantial advancement in improving production efficiency, ensuring product quality, and promoting intelligent manufacturing.

[0106] The following is combined Figure 4 This paper describes the flow of the contact signal acquisition method provided in this application, such as... Figure 4 As shown, the process may include the following steps: Step S101: Place the target object to be tested into the fixture of the contact signal testing device.

[0107] Step S102: Generate target test instructions for the target object based on the user's test requirements.

[0108] Step S103: Analyze the target test instructions to obtain the analysis results of the target test instructions.

[0109] Step S104: Based on the analysis results of the target test command, switch the test circuit of the contact signal test device and the measurement mode of the electronic measuring instrument.

[0110] Step S105: Collect information about the target object.

[0111] The target object information includes identity information used to uniquely identify the target object, and test configuration information used to define the test process and pass / fail criteria.

[0112] Step S106: Collect the target signal of the target object based on the analysis results of the target test command.

[0113] Step S107: Based on the analysis results of the target test results, the test circuit of the contact signal test device, and the measurement mode of the electronic measuring instrument, the target signal of the target object is measured to obtain the measurement result of the target object.

[0114] Step S108: Analyze the measurement results of the target signal of the target object and generate a test report of the target object based on the information of the target object.

[0115] Step S109: Bind the test report of the target object with the information of the target object.

[0116] The specific processing flow of each step in the above-mentioned contact signal acquisition method can be found in the relevant introduction of the contact signal acquisition system section above, and will not be repeated here.

[0117] The contact signal acquisition device provided in this application is described below. The contact signal acquisition device described below corresponds to the contact signal acquisition method described above. See also... Figure 5 , Figure 5 This is a schematic diagram of a contact-type signal acquisition device disclosed in this application. Figure 5As shown, the contact signal acquisition device may include: a placement unit 101 for placing the target object to be tested into the fixture of the contact signal testing device; a test instruction generation unit 102 for generating target test instructions for the target object based on the user's test requirements; a first analysis unit 103 for analyzing the target test instructions and obtaining the analysis results of the target test instructions; a switching unit 104 for switching the test circuit of the contact signal testing device and the measurement mode of the electronic measuring instrument based on the analysis results of the target test instructions; a first acquisition unit 105 for acquiring information about the target object; wherein, the information about the target object includes identity information for uniquely identifying the target object, and test configuration information for defining the test process and qualification standards. A second acquisition unit 106 acquires the target signal of the target object based on the analysis results of the target test instructions. A measurement unit 107 measures the target signal of the target object based on the analysis results of the target test results, the test circuit of the contact signal testing device, and the measurement mode of the electronic measuring instrument, and obtains the measurement results of the target object; a second analysis unit 108 analyzes the measurement results of the target signal of the target object and generates a test report of the target object based on the information of the target object. The information binding unit 109 is used to bind the test report of the target object with the information of the target object.

[0118] The specific processing flow of each unit included in the aforementioned contact signal acquisition device can be found in the previous section on contact signal acquisition methods, and will not be repeated here.

[0119] The contact-type signal acquisition device provided in this application can be applied to contact-type signal acquisition equipment, such as terminals: mobile phones, computers, etc. Optionally, Figure 6 The hardware structure block diagram of the contact signal acquisition device is shown below. Figure 6 The hardware structure of the contact signal acquisition device may include at least one processor 1, at least one communication interface 2, at least one memory 3, and at least one communication bus 4. In this application, the number of processor 1, communication interface 2, memory 3, and communication bus 4 is at least one, and the processor 1, communication interface 2, and memory 3 communicate with each other through the communication bus 4. The processor 1 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement this application; the memory 3 may include high-speed RAM, and may also include non-volatile memory, such as at least one disk storage device; wherein, the memory stores a program, and the processor can call the program stored in the memory, the program being used to implement various processing flows in the aforementioned terminal contact signal acquisition scheme.

[0120] This application also provides a readable storage medium that can store a program suitable for execution by a processor, the program being used to implement various processing flows of the aforementioned terminal in a contact-type signal acquisition scheme.

[0121] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The various embodiments described in this specification are presented in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. The various embodiments can be combined with each other. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A contact-type signal acquisition system, characterized in that, include: Control modules, electronic measuring instruments, contact signal testing devices, computing equipment; The control module is connected to both the contact signal testing device and the electronic measuring instrument; the computing device is connected to both the control module and the electronic measuring instrument. The computing device is responsible for generating target test instructions for the target object based on the user's test requirements and transmitting them to the control module; The control module receives and analyzes the target test command to obtain the analysis result of the target test command; Based on the analysis results of the target test command, the control mode of the control module is switched, and the analysis results of the target test command and the control mode of the control module are synchronized to the contact signal testing device and the electronic measuring instrument. The contact signal testing device includes a fixture and a testing component. The fixture is used to place the target object. The testing component includes several test probes and several test circuits for testing various test points of the target object. The contact signal testing device is responsible for collecting information of the target object and transmitting it to the control module. It is also responsible for receiving and, based on the analysis results of the target test command, switching the current test circuit to the test circuit corresponding to the analysis results of the target test command and the current control mode of the control module. The device then presses the target object placed in the fixture down onto the testing component, so that each test probe of the testing component is in close contact with each test point of the target object. This allows the test circuit to acquire the target signal of the target object based on the analysis results of the target test command and transmit it to the control module; The information of the target object includes identity information for uniquely identifying the target object, and test configuration information for defining the test process and pass / fail criteria; The control module receives and transmits the target signal of the target object to the electronic measuring instrument; The electronic measuring instrument receives the target signal of the target object, the analysis results of the target test results, and the control mode of the control module, measures the target signal of the target object, and transmits the measurement results to the computing device; The computing device receives and analyzes the measurement results of the target signal of the target object and generates a test report of the target object based on the information of the target object.

2. The system according to claim 1, characterized in that, Also includes: The computing device binds the test report of the target object with the information of the target object.

3. The system according to claim 1, characterized in that, The target test instructions include at least a sequence of test items and test types and parameters; the target signals include the voltage and current signals of the target object.

4. The system according to claim 1, characterized in that, The control module includes a microcontroller and a low-power signal relay; the control module receives and analyzes the target test command, and obtains the analysis result of the target test command; And based on the analysis results of the target test command, switch the control mode of the control module, including: The microcontroller receives and analyzes the target test command, obtains the analysis result of the target test command, and transmits it to the low-power signal relay; The low-power signal relay switches its control mode based on the analysis results of the target test command.

5. A contact-based signal acquisition method, characterized in that, Applied to the system according to any one of claims 1-4, the method comprises: Place the target object to be tested into the fixture of the contact signal testing device; Generate target test instructions for the target object based on the user's test requirements; Analyze the target test instruction to obtain the analysis results of the target test instruction; Based on the analysis results of the target test command, the test circuit of the contact signal test device and the measurement mode of the electronic measuring instrument are switched. Collect information about the target object; wherein, the information about the target object includes identity information for uniquely identifying the target object, and test configuration information for defining the test process and pass / fail criteria; Based on the analysis results of the target test command, the target signal of the target object is collected; Based on the analysis results of the target test results, the test circuit of the contact signal test device, and the measurement mode of the electronic measuring instrument, the target signal of the target object is measured to obtain the measurement result of the target object; Analyze the measurement results of the target signal of the target object and generate a test report of the target object based on the information of the target object.

6. The method according to claim 5, characterized in that, Also includes: The test report of the target object is bound to the information of the target object.

7. A contact-type signal acquisition device, characterized in that, The apparatus, applicable to the method of any one of claims 5-6, comprises: Placement unit, used to place the target object to be tested into the fixture of the contact signal testing device; A test instruction generation unit is used to generate target test instructions for the target object based on the user's test requirements. The first analysis unit is used to analyze the target test instruction and obtain the analysis result of the target test instruction; The switching unit is used to switch the test circuit of the contact signal test device and the measurement mode of the electronic measuring instrument based on the analysis results of the target test command. The first acquisition unit is used to acquire information about the target object; wherein, the information about the target object includes identity information for uniquely identifying the target object, and test configuration information for defining the test process and pass / fail criteria; The second acquisition unit acquires the target signal of the target object based on the analysis results of the target test command; The measurement unit is used to measure the target signal of the target object based on the analysis results of the target test results, the test circuit of the contact signal test device, and the measurement mode of the electronic measuring instrument, so as to obtain the measurement result of the target object; The second analysis unit is used to analyze the measurement results of the target signal of the target object and generate a test report of the target object based on the information of the target object.

8. The apparatus according to claim 7, characterized in that, Also includes: The information binding unit is used to bind the test report of the target object with the information of the target object.

9. A contact-type signal acquisition device, characterized in that, include: One or more processors, and memory; The memory stores computer-readable instructions, which, when executed by the one or more processors, implement the steps of the contact signal acquisition method as described in any one of claims 5 to 6.

10. A readable storage medium, characterized in that: The readable storage medium stores computer-readable instructions that, when executed by one or more processors, cause the one or more processors to perform the steps of the contact signal acquisition method as described in any one of claims 5 to 6.

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