Wafer anti-sticking transmission mechanism

Abstract

The invention relates to a wafer anti-sticking transmission mechanism, which comprises a machine base, a driving motor, a first eccentric wheel, a sliding piece, a supporting assembly and a second eccentric wheel, and is characterized in that the supporting assembly comprises a swinging piece and a rod piece; the rod piece is inserted into the wafer loading frame to extract the wafer, the first eccentric wheel is driven by the driving motor to rotate so as to drive the sliding piece to reciprocate in the vertical direction, the second eccentric wheel is further driven by the sliding piece to rotate, and finally the swing pieces on the two sides and the rod piece are driven to swing synchronously. Continuous static contact between the surface of the rod piece and the surface of the wafer is effectively avoided, in the cooling stage after the wafer is subjected to chemical liquid treatment, the dynamic contact mode can remarkably break the solidification and crystallization process of a corrosive residual liquid film at a contact point, and therefore the adhesion problem between the rod piece and the wafer is fundamentally solved; along with the completion of the process, the temperature of the wafer is gradually reduced to room temperature or a preset safe temperature range in a controllable environment; at this time, since adhesion has been successfully prevented, the wafer can be extracted or transferred efficiently and without loss.

Description

Technical Field

[0001] This invention belongs to the technical field of wafer quality inspection equipment, and specifically relates to a wafer anti-sticking transport mechanism. Background Technology

[0002] Currently, in the silicon carbide crystal manufacturing process, to accurately assess the crystal crystallization quality, the silicon carbide crystal is typically cut into wafers, which are then supported by a wafer frame and immersed in a high-temperature corrosive molten liquid (such as molten potassium hydroxide KOH at approximately 400°C) for etching treatment. By observing the etching morphology on the wafer surface, key quality indicators such as internal crystal defects and dislocation density can be effectively determined.

[0003] However, after high-temperature etching and removal from the molten metal, existing wafer frames often leave some molten etching solution on the wafer surface. As the temperature drops below the freezing point, the remaining KOH and other corrosive media rapidly solidify, causing a strong bond between the wafer and the wafer frame. This bonding phenomenon makes it difficult to safely and completely separate the wafer from the frame. Forcible disassembly can easily cause wafer breakage or microcracks, severely affecting subsequent wafer processing and performance evaluation, thereby reducing overall process efficiency and product yield.

[0004] Therefore, there is an urgent need to develop a transfer mechanism that can effectively prevent the wafer and the wafer frame from sticking together after the high-temperature etching process, so as to improve the operability and reliability of the silicon carbide wafer processing process and ensure the integrity of the wafer structure and the accuracy of detection. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer anti-sticking transport mechanism.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: This invention provides a wafer anti-sticking transport mechanism, comprising: Base; A drive motor is mounted on the base; The first eccentric wheel is fixedly connected to the output shaft of the drive motor; A sliding member is slidably disposed on the machine base in the vertical direction and slides in cooperation with the eccentric shaft of the first eccentric wheel; Two sets of support assemblies are symmetrically arranged on the left and right sides of the machine base. Each set of support assemblies includes at least one swing member and at least one rod. The swing member is rotatably mounted on the machine base, and at least one rod is fixedly connected to each swing member; and, A second eccentric wheel is provided corresponding to the ornament, and the second eccentric wheel is coaxially and fixedly connected to the corresponding ornament, and its eccentric shaft is slidably embedded in the sliding member; The drive motor is configured to drive the first eccentric wheel to rotate, and through the cooperation between the eccentric shaft of the first eccentric wheel and the sliding member, the rotational motion is converted into the up-and-down reciprocating sliding of the sliding member; The sliding member, through its cooperation with the eccentric shaft of the second eccentric wheel, converts the up-and-down reciprocating sliding into the reciprocating swing of the second eccentric wheel and the pendulum, thereby driving the rod to reciprocate synchronously, so that the rod and the wafer placed on it form dynamic contact.

[0007] In some embodiments, the rod is provided with a plurality of protrusions spaced apart along the extension direction of the rod.

[0008] In some embodiments, the radial cross-sectional width of the protrusion gradually decreases from the inside to the outside, so that the tip of the protrusion can form point contact or line contact with the wafer placed thereon.

[0009] In some specific embodiments, the protrusion is annular and sleeved on the rod.

[0010] In some specific embodiments, the two side walls of the protrusion extend obliquely from its base to its top, together forming a conical structure.

[0011] In some embodiments, each of the ornaments is connected to two rods, and the two rods are symmetrically arranged with the rotation axis of the corresponding ornament as the center of symmetry.

[0012] In some embodiments, the extension direction of the rod is perpendicular to the vertical direction.

[0013] In some embodiments, the slider has a first groove and a plurality of second grooves extending in a left-right direction. The eccentric shaft of the first eccentric wheel is slidably embedded in the first groove and is constrained to slide relative to it only along the extending direction of the first groove; the eccentric shafts of each second eccentric wheel are slidably embedded in a second groove and are constrained to slide relative to it only along the extending direction of the second groove.

[0014] In some specific embodiments, the first groove is a blind groove or through groove formed on the side wall of the slider.

[0015] In some specific embodiments, the second groove is a blind groove or through groove formed on the side wall of the slider.

[0016] In some embodiments, the wafer anti-sticking transfer mechanism further includes a vibration motor mounted on the base.

[0017] In some embodiments, the slider is slidably connected to the base via a linear sliding assembly, the linear sliding assembly including a linear guide rail mounted on the base and a slider cooperating with the linear guide rail, the slider being fixedly connected to the slider.

[0018] In some embodiments, when the support assembly has multiple swing members, the multiple swing members are arranged at intervals in the vertical direction.

[0019] Due to the application of the above-described technical solution, the present invention has at least the following advantages compared with the prior art: The wafer anti-adhesion transfer mechanism of this invention uses rods inserted into the wafer frame to extract the wafer, and a drive motor drives two side swinging members to perform reciprocating oscillations, thereby causing the rods to oscillate synchronously. The oscillation of the rods effectively avoids continuous static contact between their surfaces and the wafer surfaces. During the cooling stage after the wafer undergoes chemical treatment, this dynamic contact mode can significantly interrupt the solidification and crystallization process of corrosive residual liquid film at the contact point, thus fundamentally solving the adhesion problem between the rods and the wafer. As the process is completed, the wafer temperature is gradually reduced to room temperature or a preset safe temperature range under controlled conditions. At this point, because adhesion has been successfully prevented, the wafer can be extracted or transferred efficiently and without damage. Attached Figure Description

[0020] Figure 1 This is a front view of the wafer anti-sticking transport mechanism provided in Embodiment 1 of the present invention; Figure 2 for Figure 1 An enlarged schematic diagram of part A in the middle; Figure 3 This is a top view of the wafer anti-sticking transport mechanism provided in Embodiment 1 of the present invention; Figure 4 A side view of the wafer anti-sticking transfer mechanism provided in Embodiment 1 of the present invention (the drive motor and the first eccentric wheel are not shown). Among them, 1. base; 2. drive motor; 21. output shaft; 3. first eccentric wheel; 31. first eccentric shaft; 4. sliding member; 41. first slide groove; 42. second slide groove; 5. second eccentric wheel; 51. second eccentric shaft; 6. support assembly; 61. swing member; 62. rod; 63. protrusion; 7. vibration motor; 8. linear sliding assembly; 81. linear guide rail; 82. slider; 9. wafer. Detailed Implementation

[0021] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the embodiments of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0022] In the description of the embodiments of the present invention, it should be understood that the terms "upper" and "lower," etc., indicate the orientation or positional relationship as described above. Figure 1 The orientations are defined as shown, such as the orientation of the drive motor 2 being "down" and the orientation of the vibration motor 7 being "up". The above description of orientation terms is only for the convenience of describing the embodiments of the present invention and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of the present invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] The following disclosure provides many different implementations or examples for carrying out different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0026] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0027] Example 1: This example provides a wafer anti-sticking transport mechanism, such as... Figures 1 to 4As shown, it includes a base 1, a drive motor 2, a first eccentric wheel 3, a sliding member 4, a support assembly 6, and a second eccentric wheel 5. The drive motor 2 is mounted on the base 1. As an example, the drive motor 2 includes, but is not limited to, a servo motor, a stepper motor, etc. The first eccentric wheel 3 is fixedly connected to the output shaft 21 of the drive motor 2. The sliding member 4 is slidably mounted on the base 1 in the vertical direction, and it is in sliding engagement with the eccentric shaft (i.e., the first eccentric shaft 31) of the first eccentric wheel 3. The support assembly 6 has two sets symmetrically arranged on the left and right sides of the base 1. Each set of support assemblies 6 includes at least one swing member 61 and at least one rod member 62; wherein, the swing member 61 is rotatably mounted on the base 1, and at least one rod member 62 is fixedly connected to each swing member 61. The second eccentric wheel 5 is arranged in a one-to-one correspondence with the swing member 61, and the second eccentric wheel 5 is coaxially fixedly connected to the corresponding swing member 61, and its eccentric shaft (i.e., the second eccentric shaft 51) is slidably embedded in the sliding member 4.

[0028] When the drive motor 2 drives the first eccentric wheel 3 to rotate continuously, the first eccentric shaft 51 of the first eccentric wheel 3, through its cooperation with the sliding member 4, converts the rotational motion into the up-and-down reciprocating linear motion of the sliding member 4. The sliding member 4 further converts its own up-and-down sliding motion into the reciprocating oscillation of the second eccentric wheel 5 and the swing member 61 through its cooperation with the second eccentric shaft 51 of the second eccentric wheel 5, thereby driving the rod 62 to achieve synchronous reciprocating oscillation. Finally, dynamic contact is formed between the rod 62 and the wafer 9 placed on it. Through the ingenious cooperation between the eccentric wheel and the sliding member 4, the rotational motion of the drive motor 2 is progressively converted into the stable reciprocating oscillation of the rod 62. This dynamic contact mechanism can effectively interrupt the solidification and crystallization process of the corrosive residual liquid film at the contact point, thus fundamentally solving the adhesion problem between the wafer 9 and the rod 62 during the cooling process. Furthermore, this mechanism can achieve complex dynamic contact with only a single motor drive, has a compact mechanical structure, few wear points, reliable operation, and is easy to maintain.

[0029] In this embodiment, each support assembly 6 has one swing member 61. In other embodiments, each support assembly 6 may be provided with two, three or more swing members 61 according to actual needs. When each support assembly 6 has multiple swing members 61, the multiple swing members 61 are arranged at intervals in the vertical direction, thereby simultaneously cooling multiple wafers 9 that have been treated with high-temperature corrosive molten liquid. Further, each swing member 61 is connected to two rods 62, and the two rods 62 are symmetrically arranged with the rotation axis of the corresponding swing member 61 as the center of symmetry.

[0030] The rod 62 is provided with a plurality of protrusions 63 spaced apart along its extension direction. The radial cross-sectional width of the protrusions 63 preferably gradually decreases from the inside to the outside, so that the top of the protrusion 63 can form point or line contact with the wafer 9 placed on it, thereby transforming traditional surface contact into controllable point / line contact. This ensures effective support while minimizing the actual contact area with the back of the wafer 9, further preventing adhesion of the wafer 9. The two sidewalls of the protrusions 63 extend obliquely from their base to their top, forming a conical structure. The obliquely extending sidewall design facilitates the drainage of corrosive residual liquid during contact. As a further preferred embodiment, the protrusions 63 are annular and fitted onto the main body of the rod 62.

[0031] In this embodiment, the slider 4 is in the form of a plate, and its core function is achieved through a groove structure formed thereon. Specifically, the slider 4 has a first groove 41 extending in the left-right direction and multiple second grooves 42. The first groove 41 includes, but is not limited to, blind grooves or through grooves formed on the side wall of the slider 4. The second grooves 42 include, but are not limited to, blind grooves or through grooves formed on the side wall of the slider 4. The eccentric shaft of the first eccentric wheel 3 is slidably embedded in the first groove 41 and is constrained to slide relative to it only along the extension direction of the first groove 41. The eccentric shafts of each second eccentric wheel 5 are slidably embedded in a second groove 42 and are constrained to slide relative to it only along the extension direction of the second groove 42. The motion transmission principle is as follows: When the first eccentric wheel 3 rotates, the first eccentric shaft 31 performs circular motion. Since the shaft is constrained by the first sliding groove 41 in the left and right directions, the horizontal component of its circular motion is canceled out by the side wall of the first sliding groove 41, while its vertical motion cannot be constrained. Therefore, the vertical displacement of the first eccentric shaft 31 is directly transmitted to the slider 4, forcing the slider 4 to perform reciprocating linear motion in the up and down direction.

[0032] When the slider 4 reciprocates up and down, it transmits the vertical force to the eccentric shaft of the second eccentric shaft 51 through the second groove 42. Since this shaft is also constrained by the left-right second groove 42, the up-and-down movement of the slider 4 forces the second eccentric wheel 5 to deflect around its own central axis, thus converting the linear up-and-down input of the slider 4 into the reciprocating oscillation of the second eccentric wheel 5 and the pendulum 61. By designing the length of the second groove 42, precise and mechanical pre-setting and control of the swing amplitude of the rod 62 can be achieved.

[0033] To ensure the accuracy and stability of this linear motion, the slider 4 is connected to the base 1 via a linear sliding assembly 8. The linear sliding assembly 8 includes a linear guide rail 81 fixed to the base 1 and a matching slider 82, which is fixed to the slider 4. This structure ensures that the slider 4 can slide freely in the vertical direction while effectively overcoming all other degrees of freedom in all other directions, eliminating horizontal swaying or wobble.

[0034] In this embodiment, the wafer anti-sticking transfer mechanism also includes a vibration motor 7 mounted on the base 1. The high-frequency micro-amplitude vibration excited by the vibration motor 7 acts directly on the contact interface between the wafer 9 and the rod 62. This vibration can break the surface tension and intermolecular forces of the liquid film at an extremely high frequency, "shattering" the crystal nucleus at the beginning of its formation, thus solving the problem of rapid micro-crystallization that may not be cleared in time by macroscopic oscillation. Complementing the mechanical oscillation, this mechanism exhibits excellent and stable anti-sticking performance under various complex process conditions and liquid properties, demonstrating extremely high equipment robustness. Furthermore, even during short shutdowns, the vibration motor 7 effectively prevents the stagnant liquid film from solidifying under static conditions, achieving full-process anti-sticking coverage. The vibration motor 7 can be selected and configured according to existing technologies in the art. As an example, an inertial vibration motor with adjustable frequency and controllable amplitude can be selected.

[0035] During the process, drive motor 2 and vibration motor 7 are activated, causing rod 62 to enter a continuous swinging and vibrating state. After the wafer frame carrying wafer 9 is removed from the etching solution, the dynamically moving rod 62 is moved under wafer 9 and lifted up. The combined movement of rod 62 creates dynamic contact between wafer 9 and the frame, effectively preventing adhesion caused by the solidification of residual etching solution film. After wafer 9 cools to room temperature, it can be easily removed.

[0036] The present invention has been described in detail above, with the aim of enabling those skilled in the art to understand and implement the invention. However, this description should not be construed as limiting the scope of protection of the invention. All equivalent changes or modifications made in accordance with the spirit and essence of the invention should be included within the scope of protection of the invention.

Claims

1. A wafer anti-sticking transport mechanism, characterized in that, include: Base (1); A drive motor (2) is mounted on the base (1); The first eccentric wheel (3) is fixedly connected to the output shaft (21) of the drive motor (2); The sliding member (4) is slidably disposed on the base (1) in the up-down direction and is in sliding cooperation with the eccentric shaft of the first eccentric wheel (3); Two sets of support assemblies (6) are symmetrically arranged on the left and right sides of the base (1). Each set of support assemblies (6) includes at least one swing member (61) and at least one rod member (62). The swing member (61) is rotatably mounted on the base (1), and at least one rod member (62) is fixedly connected to each swing member (61); and, A second eccentric wheel (5) is provided corresponding to the ornament (61). The second eccentric wheel (5) is coaxially fixedly connected to the corresponding ornament (61), and its eccentric shaft is slidably embedded in the sliding member (4). The drive motor (2) is configured to drive the first eccentric wheel (3) to rotate. Through the cooperation between the eccentric shaft of the first eccentric wheel (3) and the sliding member (4), the rotational motion is converted into the up-and-down reciprocating sliding of the sliding member (4). The sliding member (4) converts the up-and-down reciprocating sliding into the reciprocating swing of the second eccentric wheel (5) and the pendulum (61) through its cooperation with the eccentric shaft of the second eccentric wheel (5), thereby driving the rod (62) to reciprocate synchronously, so that the rod (62) and the wafer (9) placed on it form dynamic contact.

2. The wafer anti-sticking transport mechanism according to claim 1, characterized in that, The rod (62) is provided with a plurality of protrusions (63) arranged at intervals along the extension direction of the rod (62).

3. The wafer anti-sticking transport mechanism according to claim 2, characterized in that, The radial cross-sectional width of the protrusion (63) gradually decreases from the inside to the outside, so that the tip of the protrusion (63) can form point contact or line contact with the wafer (9) placed thereon; and / or, The protrusion (63) is ring-shaped and is fitted onto the rod (62).

4. The wafer anti-sticking transport mechanism according to claim 3, characterized in that, The two side walls of the protrusion (63) extend obliquely from its base to its top, together forming a conical structure.

5. The wafer anti-sticking transport mechanism according to claim 1, characterized in that, Each of the aforementioned ornaments (61) is connected to two of the aforementioned rods (62), and the two rods (62) are symmetrically arranged with the rotation axis of the corresponding ornament (61) as the center of symmetry; and / or, The extension direction of the rod (62) is perpendicular to the vertical direction.

6. The wafer anti-sticking transport mechanism according to claim 1, characterized in that, The slider (4) is provided with a first groove (41) extending in the left-right direction and a plurality of second grooves (42). The eccentric shaft of the first eccentric wheel (3) is slidably embedded in the first groove (41) and is constrained to be able to slide relative to each other only along the extension direction of the first groove (41); The eccentric shafts of each of the second eccentric wheels (5) are slidably embedded in a second groove (42) and are constrained to be able to slide relative to each other only along the extension direction of the second groove (42).

7. The wafer anti-sticking transport mechanism according to claim 6, characterized in that, The first groove (41) is a blind groove or through groove formed on the side wall of the sliding member (4); and / or, The second groove (42) is a blind groove or through groove formed on the side wall of the sliding member (4).

8. The wafer anti-sticking transport mechanism according to claim 1, characterized in that, The wafer anti-sticking transfer mechanism also includes a vibration motor (7) mounted on the base (1).

9. The wafer anti-sticking transport mechanism according to claim 1, characterized in that, The slider (4) is slidably connected to the base (1) via a linear sliding assembly (8). The linear sliding assembly (8) includes a linear guide rail (81) mounted on the base (1) and a slider (82) cooperating with the linear guide rail (81). The slider (82) is fixedly connected to the slider (4).

10. The wafer anti-sticking transport mechanism according to claim 1, characterized in that, When the support assembly (6) has multiple ornaments (61), the multiple ornaments (61) are arranged at intervals in the vertical direction.

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