Energy source position adjusting device, magnet device, magnetron sputtering device and method
By designing an energy source position adjustment device and using a transmission mechanism to adjust the magnet position, the problem of uneven magnetic field distribution in the magnetron sputtering device was solved, thereby achieving uniformity of film thickness and improved production efficiency.
Patent Information
- Application Number
- CN202511569530.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-30
- Publication Date
- 2026-03-13
AI Technical Summary
In existing magnetron sputtering equipment, the magnetic field is fixed or the rotating magnet cannot be effectively adjusted, resulting in uneven sputtering on the target surface, which affects the uniformity of the coating. Furthermore, adjusting the position of the magnet requires breaking the vacuum and disassembling, which delays the production sequence.
Design an energy source position adjustment device that converts the rotation of the transmission mechanism in different directions into linear motion of the energy source, adjusts the position of the magnet, optimizes the magnetic field distribution, and achieves uniformity of the thickness of the magnetron sputtered thin film.
Adjusting the magnet position without breaking the vacuum improves the uniformity of sputtered films, reduces production delays, and enhances production continuity and deposition efficiency.
Smart Images

Figure CN121653585A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of magnetron sputtering technology and relates to an energy source position adjustment device, a magnet device, a magnetron sputtering device and method. Background Technology
[0002] In modern industrial film deposition, magnetron sputtering is an important branch of physical vapor deposition (PVD) technology. It utilizes the interaction of magnetic and electric fields in a vacuum environment to generate plasma that bombards the target material with high energy, causing sputtering. In the sputtered particles, neutral target atoms or molecules are deposited on the substrate, forming a dense thin film. The magnetic field can significantly enhance the plasma density while confining electrons to the vicinity of the target, greatly accelerating the sputtering frequency and deposition rate.
[0003] Existing magnetron sputtering devices use fixed or rotating permanent magnets, which, while meeting the basic requirements of magnetron sputtering, still present several technical challenges: like Figure 1 As shown, the magnetic field of a fixed magnet is fixed, which limits the strength and distribution of the magnetic field. Some areas on the target with higher magnetic field strength are subjected to greater sputtering effect. Under long-term sputtering, the surface of the target becomes uneven, which further affects the uniformity of the coating.
[0004] like Figure 2 As shown, the rotating magnet avoids the unevenness of the target surface caused by long-term sputtering because the magnet is constantly rotating. However, since the magnet rotates as a whole and the positions of the individual magnetic poles in the magnet are relatively fixed, it is still impossible to adjust the film thickness when it is uneven during the process (such as thick in the middle and thin at the edges, or thin in the middle and thick at the edges).
[0005] If you want to adjust the relative positions of the magnetic poles inside the magnet, you must break the vacuum, disassemble the magnet and make adjustments, which greatly delays the production sequence and deposition efficiency of the equipment.
[0006] Therefore, the need for adjustable magnetic fields in magnetron sputtering thin film deposition is an important issue that the industry urgently needs to address. Summary of the Invention
[0007] In view of the above problems, one embodiment of the present invention aims to provide an energy source position adjustment device that can adjust the position of the energy source during process production.
[0008] Another objective of one embodiment of the present invention is to provide a magnet device, a magnetron sputtering apparatus, and a magnetron sputtering method capable of adjusting the position of a magnet in magnetron sputtering thin film deposition.
[0009] According to a first aspect of the present invention, an energy source position adjustment device is provided, comprising a first transmission mechanism, a second transmission mechanism, a third transmission mechanism, and a fourth transmission mechanism: When the first transmission mechanism rotates in one direction, it is rotatably connected to the second, third, and fourth transmission mechanisms in sequence. When the first transmission mechanism rotates in another direction, it is rotatably connected to the fourth transmission mechanism via the third transmission mechanism. The fourth transmission mechanism is connected to the energy source and converts the rotation of the first transmission mechanism into linear motion to adjust the position of the energy source.
[0010] In one possible implementation, the first transmission mechanism includes a primary shaft that is rotated by an external drive.
[0011] In one possible implementation, the first transmission mechanism further includes a first gear connected to the first-stage shaft, and the rotation of the first gear drives the first-stage shaft to rotate.
[0012] In one possible implementation, the first gear is a bevel gear.
[0013] In one possible implementation, the first transmission mechanism further includes a one-way rotation structure configured to control one-way rotation between the first transmission mechanism and the second transmission mechanism.
[0014] In one possible implementation, the unidirectional rotation structure includes a ratchet structure comprising a ratchet and a pawl assembly, the pawl assembly being connected to a primary shaft while simultaneously engaging with the ratchet's asymmetrical tooth profile.
[0015] In one possible implementation, the inner surface of the ratchet is provided with a toothed structure that engages asymmetrically with the toothed structure of the pawl assembly and a through hole through which the primary shaft passes.
[0016] In one possible implementation, the ratchet assembly includes a spring, a slide rail, and a slider, one end of which is connected to the primary shaft via the spring, and the other end of which engages with the ratchet's asymmetrical tooth profile.
[0017] In one possible implementation, the first transmission mechanism further includes a zero-adjustment structure configured such that the first transmission mechanism directly drives the third transmission mechanism to rotate in another direction.
[0018] In one possible implementation, the zero-adjustment structure includes a first toothed member, a second toothed member, a spring, and an annular guide rail: One end of the first toothed member is connected to the primary shaft via a spring passing through an annular guide rail, and the other end of the first toothed member meshes with one end of the second toothed member; The other end of the second toothed member is connected to the third transmission mechanism.
[0019] In one possible implementation, the zeroing structure further includes a guide sleeve that surrounds the first toothed member, the second toothed member, the spring, and the annular guide rail and is clearance-fitted with the annular guide rail.
[0020] In one possible implementation, the second transmission mechanism includes a secondary shaft that receives power from the first transmission mechanism in one direction and transmits it to the third transmission mechanism.
[0021] In one possible implementation, the third transmission mechanism includes a three-stage shaft that receives power from the third transmission mechanism to rotate in one direction and receives power from the first transmission mechanism to rotate in the other direction.
[0022] In one possible implementation, the fourth transmission mechanism includes a lead screw and nut structure, with the lead screw connected to the third transmission mechanism and the nut connected to the energy source.
[0023] In one possible implementation, the energy source position adjustment device further includes a clamp connected to the fourth transmission mechanism for holding the energy source.
[0024] In one possible implementation, the energy source includes one or more of a magnet and a heating element.
[0025] According to a second aspect of the present invention, a magnet device is provided, comprising the above-described energy source position adjustment device and a magnet, wherein the magnet is connected to the fourth transmission mechanism as an energy source.
[0026] In one possible implementation, a plurality of magnets are included, comprising fixed magnets and adjustable magnets, the adjustable magnets being connected to the fourth transmission mechanism.
[0027] In one possible implementation, the plurality of magnets are symmetrically distributed around the target surface.
[0028] According to a third aspect of the present invention, a magnetron sputtering apparatus is provided, comprising a main drive mechanism and at least one of the aforementioned magnet devices, wherein the main drive mechanism is configured to drive a first transmission mechanism of the energy source position adjustment device.
[0029] In one possible implementation, the main transmission device includes a motor, a transmission belt, and a main transmission shaft, wherein the motor drives the main transmission shaft to rotate via the transmission belt, and the main transmission shaft drives the first transmission mechanism to rotate.
[0030] In one possible implementation, the main drive unit further includes a frame configured to support the main drive shaft.
[0031] In one possible implementation, the end of the main drive shaft of the main drive unit connected to the first drive mechanism, as well as the energy source position adjustment device and the magnet, are located in the vacuum chamber.
[0032] According to a fourth aspect of the present invention, a magnetron sputtering method is also provided, comprising: During magnetron sputtering, the position of the magnet is adjusted so that the magnet's position expands or shrinks proportionally.
[0033] In one possible implementation, the magnetron sputtering method further includes: Return the adjusted magnet to its original position.
[0034] The energy source position adjustment device of the present invention achieves the adjustment of the energy source position by rotating the first transmission mechanism in different directions, and by using two types of transmission in different rotation directions between the first transmission mechanism and the second to fourth transmission mechanisms, as well as by converting the rotation into linear motion of the energy source through the fourth transmission mechanism. This is beneficial for the regulation of energy field energy, especially when producing thin films through energy fields, as it is beneficial for the uniformity of film thickness.
[0035] The magnet device of the present invention connects a magnet as an energy source to an energy source position adjustment device, and adjusts the magnetic field energy by adjusting the position of the magnet.
[0036] The magnetron sputtering apparatus and method of the present invention can adjust the position of the magnets during magnetron sputtering by adjusting the position of the energy source position adjustment device, thereby optimizing the magnetic field distribution, homogenizing the plasma density, and improving the uniformity of the sputtered film thickness. The energy source adjustment device can adjust the magnets at the protruding positions on the target surface to move away from the center during long-term sputtering, or adjust the magnets at the concave positions on the target surface to move towards the center, thereby weakening the magnetic field corresponding to the protruding positions and strengthening the magnetic field at the concave positions, thereby improving the uniformity of the sputtered film.
[0037] The magnetron sputtering apparatus and method of the present invention can set the energy source adjustment device in the vacuum chamber, thereby achieving the adjustment of the magnet position without breaking the vacuum, and without delaying the production sequence and deposition efficiency. Attached Figure Description
[0038] Figure 1 This is a schematic diagram of the structure of a fixed permanent magnet in the prior art; Figure 2 This is a schematic diagram of the structure of a rotating magnet in the prior art; Figure 3 This is a schematic block diagram of one embodiment of the magnetron sputtering apparatus of the present invention; Figure 4 This is a schematic diagram of an embodiment of the energy source position adjustment device described in this invention; Figure 5 This is a schematic diagram of an embodiment of the unidirectional rotation structure described in this invention; Figure 6 This is a schematic diagram of one embodiment of the ratchet structure described in this invention; Figure 7 This is a perspective schematic diagram of an embodiment of the zero-adjustment structure described in this invention; Figure 8 This is a schematic diagram of the internal structure of an embodiment of the zero-adjustment structure described in this invention; Figure 9 This is a three-dimensional schematic diagram of the first toothed component of the present invention; Figure 10 This is a three-dimensional schematic diagram of the second toothed component of the present invention; Figure 11 This is a schematic diagram of one embodiment of the clamp described in this invention; Figure 12 This is a schematic diagram of one embodiment of the total transmission device described in this invention; Figure 13 This is a schematic diagram of an embodiment of the connection between the total transmission device and the energy source position adjustment device described in this invention; Figure 14 This is a schematic diagram of an embodiment of the positional relationship of the plurality of magnets described in this invention; Figure 15 This is a schematic diagram of an embodiment of the magnetron sputtering method described in this invention; The components are as follows: 1000, magnetron sputtering device; 100, energy source position adjustment device; 1, first transmission mechanism; 11, first gear; 12, primary shaft; 13, unidirectional rotation structure; 131, ratchet; 1311, toothed structure; 1312, through hole; 1313, first step; 1314, second step; 132, pawl assembly; 1321, first spring; 1322, slide rail; 1323, slider; 1324, pawl; 1325, ratchet pad; 14, zeroing structure; 141, first toothed component; 142, second toothed component; 143, second spring; 144, annular guide rail; 145, guide rail sleeve; 2, second transmission mechanism; 21, secondary shaft; 3, third transmission mechanism; 31, tertiary shaft; 4, fourth transmission mechanism. 5. Fixture; 51. Base; 52. Buckle; 6. Second housing; 200. Main transmission device; 210. Motor; 220. Transmission belt; 230. Main transmission shaft; 240. Frame; 250. Second gear; 300. Magnet; 310. Adjustable magnet; 320. Fixed magnet; 400. Vacuum chamber. Detailed Implementation
[0039] Numerous specific details are set forth in the following description to provide a full understanding of the invention. However, the invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.
[0040] The terminology used in one or more embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The singular forms “a” and “the” as used in one or more embodiments of the invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in one or more embodiments of the invention refers to and includes any or all possible combinations of one or more associated listed items.
[0041] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of the present invention, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of the present invention, and similarly, second may also be referred to as first.
[0042] Hereinafter, one or more embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can clearly and completely understand the present invention. When the description of well-known structures or features would unnecessarily obscure the main points of the present invention, the description of such well-known structures or features will be omitted.
[0043] Figure 3 This is a schematic block diagram of one embodiment of the magnetron sputtering apparatus of the present invention, as shown below. Figure 3 As shown, the magnetron sputtering device 1000 includes a main transmission device 200, at least one energy source position adjustment device 100, and multiple magnets 300. The main transmission device 200 rotates in two opposite directions; The energy source position adjustment device 100 is rotatably connected to the main transmission device 200 and simultaneously connected to the magnet 300. The energy source position adjustment device 100 converts the rotation of the main transmission device 200 into the linear motion of the magnet 300.
[0044] The magnetron sputtering device 1000 of the present invention automatically adjusts the position of the magnet 300 by driving the energy source position adjustment device 100 through the main transmission device 200, thereby realizing the magnetic field adjustment of magnetron sputtering, which is beneficial to the uniformity of the magnetron sputtered film thickness. There is no need to stop the process to adjust the magnet 300, thus improving the continuity of production.
[0045] In one feasible embodiment, the main drive unit 200 is located outside the vacuum chamber 400 of the magnetron sputtering device 1000, while the energy source position adjustment device 100 and the magnet 300 are located inside the vacuum chamber 400.
[0046] The energy source position adjustment device 100 of the present invention is located in the vacuum chamber 400 of the magnetron sputtering device 1000. It can adjust the position of the magnet 300 without breaking the vacuum, without disassembling the magnet 300 for position adjustment, and will not delay the production sequence and deposition efficiency of the equipment.
[0047] The following details the components of the magnetron sputtering unit 1000: Energy source position adjustment device 100: Figure 4 This is a schematic diagram of an embodiment of the energy source position adjustment device described in this invention, as shown below. Figure 4 As shown, the energy source position adjustment device 100 includes a first transmission mechanism 1, a second transmission mechanism 2, a third transmission mechanism 3, and a fourth transmission mechanism 4: When the first transmission mechanism 1 rotates in one direction, it is rotatably connected to the second transmission mechanism 2, the third transmission mechanism 3 and the fourth transmission mechanism 4 in sequence. When the first transmission mechanism 1 rotates in another direction, it is rotatably connected to the fourth transmission mechanism 4 via the third transmission mechanism 3. The fourth transmission mechanism 4 is connected to the energy source and converts the rotation of the first transmission mechanism 1 into linear motion to adjust the position of the energy source.
[0048] In one feasible embodiment, the first transmission mechanism 1 includes one or more of the following components: First gear 11: The first gear 11 meshes with the second gear 250 of the main transmission device 200. The shape of the gear corresponds to the second gear 250 of the main transmission device 200. For example, the second gear 250 of the main transmission device 200 is conical, and the first gear 11 of the first transmission mechanism 1 is also conical. Primary shaft 12: The primary shaft 12 is connected to the first gear 11 and rotates through the transmission of the first gear 11; One-way rotation structure 13: The one-way rotation structure 13 is configured to control the one-way rotation between the first transmission mechanism 1 and the second transmission mechanism 2; Zeroing structure 14: The zeroing structure 14 is configured such that the first transmission mechanism 1 directly drives the third transmission mechanism 3 to rotate in another direction.
[0049] Figure 5 and Figure 6 This is a schematic diagram of one embodiment of the unidirectional rotation structure described in this invention, as shown below. Figure 5 and Figure 6 As shown, the unidirectional rotation structure 13 is a ratchet structure, which includes a ratchet 131 and a pawl assembly 132. The pawl assembly 132 is connected to the primary shaft 12 and engages with the ratchet 131 with asymmetrical teeth.
[0050] like Figure 6 As shown, the inner surface of the ratchet is provided with a tooth structure 1311 that meshes asymmetrically with the pawl assembly 132 and a through hole 1312 through which the primary shaft 12 passes. For example, on the inner surface of the ratchet 131 of the one-way ratchet structure, there is a small tooth structure 1311 biased to one side, which works together with the pawl assembly 132 to allow only the opposite (or forward) relative rotation.
[0051] In one feasible embodiment, the ratchet 131 has a stepped structure, including a first step 1313 and a second step 1314. The size of the first step 1313 is larger than the size of the second step 1314. A through hole 1312 through which the first step 1313 passes is provided, and a toothed structure 1311 is provided on the inner surface of the second step 1314.
[0052] Preferably, the first step 1313 and the second step 1314 are detachably connected, which facilitates the replacement of the second step 1314 with worn teeth.
[0053] like Figure 5 As shown, the ratchet assembly 132 includes a first spring 1321, a slide rail 1322, and a slider 1323: One end of the slider 1323 is connected to the primary shaft 12 via a first spring 1321, and the other end of the slider 1323 engages asymmetrically with the ratchet 131. The slider 1323 moves on the slide rail 1322, compressing the first spring 1321 to engage the other end of the slider 1323 asymmetrically with the ratchet 131. For example, the other end of the slider 1323 is provided with asymmetrically engaged internal teeth of the ratchet 131, thereby achieving unidirectional rotation.
[0054] In one feasible embodiment, the pawl assembly 132 further includes a pawl 1324 connected to the other end of the slider 1323. Preferably, the pawl 1324 is detachably connected to the slider 1323 to facilitate replacement of worn pawl 1324.
[0055] In one feasible embodiment, the pawl assembly 132 further includes a pawl pad 1325, which has a through hole 1312 through which the primary shaft 12 passes. The pawl pad 1325 is installed in the ratchet 131 and does not contact the toothed structure 1311 on the inner surface of the ratchet 131, and provides support for other pawl assemblies 132.
[0056] In one feasible embodiment, the pawl assembly 132 further includes baffles disposed on both sides of the slider 1323 to prevent the slider 1323 from becoming misaligned or even damaged in extreme cases.
[0057] Preferably, the slide rail 1322 of the pawl assembly 132 can be mounted on the baffle, making the structure of the pawl assembly 132 more compact.
[0058] Figure 7 and Figure 8 This is a schematic diagram of an embodiment of the zero-adjustment structure described in this invention, as shown below. Figure 7 and Figure 8 As shown, the zero-adjustment structure 14 includes a first toothed member 141, a second toothed member 142, a second spring 143, and an annular guide rail 144. One end of the first toothed member 141 is connected to the first-stage shaft 12 via a second spring 143 passing through an annular guide rail 144, and the other end of the first toothed member 141 meshes with one end of the second toothed member 142; The other end of the second toothed member 142 is connected to the third transmission mechanism 3.
[0059] In one feasible embodiment, the zero-adjustment structure 14 further includes: The guide sleeve 145 surrounds the first toothed member 141, the second toothed member 142, the second spring 143 and the annular guide rail 144 and is in clearance fit with the annular guide rail 144.
[0060] Figure 9 This is a three-dimensional schematic diagram of the first toothed component of the present invention. Figure 10 This is a three-dimensional schematic diagram of the second toothed component of the present invention, as shown below. Figure 9 and Figure 10 As shown, the teeth of the first toothed member 141 and the second toothed member 142 mesh with each other.
[0061] like Figure 4 As shown, the second transmission mechanism 2 includes a secondary shaft 21, which receives power from the first transmission mechanism 1 in one direction and transmits it to the third transmission mechanism 3.
[0062] like Figure 4 As shown, the third transmission mechanism 3 includes a three-stage shaft 31, which receives power from the third transmission mechanism 3 to rotate in one direction, and receives power from the first transmission mechanism 1 to rotate in the other direction.
[0063] In one feasible embodiment, the fourth transmission mechanism 4 includes a lead screw and nut structure (not shown), with the lead screw connected to the third transmission mechanism 3 and the nut connected to the energy source.
[0064] exist Figures 4-10 In the energy source position adjustment device 100 shown, the first toothed component 141 and the second toothed component 142 of the zeroing structure 14 are tightly pressed together under the support of the second spring 143 and the guide sleeve 145. When the primary shaft 12 and the tertiary shaft 31 rotate relative to each other, corresponding resistance is generated. The function of the second spring 143 is to ensure that the first toothed component 141 and the second toothed component 142 can mesh together within a certain torque range.
[0065] When the primary shaft 12 rotates in the forward direction, there will be relative rotation between the primary shaft 12 and the tertiary shaft 31. However, due to the gear meshing relationship, both the secondary shaft 21 and the tertiary shaft 31 are subjected to the gear meshing force from the primary shaft 12. The resistance generated by the engagement of the first toothed member 141 and the second toothed member 142 is relatively small and can be ignored.
[0066] When the primary shaft 12 rotates in the reverse direction, the secondary shaft 21 is not subjected to any force from the primary shaft 12 (due to the ratchet 131). At this time, the tertiary shaft 31, due to its relative rotation with the primary shaft 12, will be subjected to the force fed back from the first toothed member 141 and the second toothed member 142, thereby driving the screw nut structure to rotate in the reverse direction.
[0067] When the primary shaft rotates in the forward direction, the second spring is compressed and stores energy, and the first and second toothed components rotate in the forward direction along with the primary shaft. When the primary shaft rotates in the reverse direction, the energy stored in the second spring is released, driving the first and second toothed components to rotate in the reverse direction to complete the zeroing.
[0068] Figure 11 This is a schematic diagram of the structure of one embodiment of the clamp described in this invention, as shown below. Figure 11 As shown, the clamp 5 includes a base 51 and a buckle 52. The base 51 is connected to the fourth transmission mechanism 4, and the buckle 52 on the base 51 is used to fasten to the magnet 300.
[0069] In one feasible embodiment, such as Figure 4 As shown, the energy source position adjustment device 100 also includes a first housing (not shown), and the first housing has a cavity for accommodating the first transmission mechanism 1 to the fourth transmission mechanism 4. One end of the first transmission mechanism 1 that is connected to the main transmission device 200 extends out of the housing.
[0070] Preferably, the first outer casing is provided with a window through which the magnet 300 passes.
[0071] More preferably, the first housing is also provided with a window that exposes the one-way rotation structure 13 and / or the zeroing structure 14, which facilitates the maintenance and replacement of worn components.
[0072] In one feasible embodiment, such as Figure 4 As shown, the energy source position adjustment device 100 also includes a second housing 6, which is used to protect the fourth transmission mechanism 4. For example, the second housing 6 has a cavity for accommodating the fourth transmission mechanism 4. One side of the second housing 6 is rotatably connected to the third-stage shaft 31. The other side of the second housing 6 has a window through which the clamp 5 passes. The clamp 5 passes through the window and is connected to the fourth transmission mechanism 4 (for example, connected to the nut of the fourth transmission mechanism 4).
[0073] In a preferred embodiment, the first transmission mechanism 1 of the energy source position adjustment device 100 includes a bevel gear, a primary shaft 12, a ratchet structure, and a zero-adjustment structure 14; the second transmission mechanism 2 includes a secondary shaft 21; the third transmission mechanism 3 includes a tertiary shaft 31; and the fourth transmission mechanism 4 includes a lead screw and nut structure (not shown). The bevel gear is connected to the bevel gear of the main transmission device 200 and receives power from the main transmission device 200. The primary shaft 12 receives transmission from the bevel gear and transmits positive power to the next primary shaft 12 (secondary shaft 21) via the ratchet structure. The secondary shaft 21 receives positive power from the primary shaft 12 and transmits it to the next primary shaft 12 (tertiary shaft 31). The tertiary shaft 31 receives positive power from the secondary shaft 21 and transmits it to the lead screw and nut structure. When the primary shaft 12 rotates in the opposite direction, it rotates in the opposite direction via the zero-adjustment structure between the primary shaft 12 and the tertiary shaft 31. The lead screw and nut structure converts the rotational motion of the tertiary shaft 31 into linear motion, driving the magnet 300 to move linearly.
[0074] Total transmission unit 200: Figure 12 This is a schematic diagram of one embodiment of the total transmission device described in this invention, as shown below. Figure 12 As shown, the main transmission device 200 includes a motor 210, a transmission belt 220, and a main transmission shaft 230. The motor 210 drives the main transmission shaft 230 to rotate via the transmission belt 220, and the main transmission shaft 230 drives the energy source position adjustment device 100 to rotate. The motor 210 provides rotational power to the main drive shaft 230; The transmission belt 220 drives the main transmission shaft 230; The main drive shaft 230 is connected to the energy source position adjustment device 100.
[0075] In one feasible embodiment, the main drive shaft 230 is geared to the first transmission mechanism 1 of the energy source position adjustment device 100. Preferably, the main drive shaft 230 is geared to the first transmission mechanism 1 via a second gear 250. Preferably, the second gear 250 is a bevel gear.
[0076] In one feasible embodiment, the main drive unit 200 further includes a frame 240 configured to support the main drive shaft 230.
[0077] A main transmission device 200 can be linked with multiple energy source position adjustment devices 100 to achieve synchronous adjustment of the positions of multiple magnets 300, such as... Figure 13 As shown, a main drive device drives six energy source position adjustment devices 100, thereby adjusting the position of the magnets 300 on the six energy source position adjustment devices 100 (e.g., Figure 14 (As shown).
[0078] Multiple magnets 300: In one feasible embodiment, such as Figure 14 As shown, the plurality of magnets 300 include an adjustable magnet 310 and a fixed magnet 320, with the adjustable magnet 310 connected to the energy source position adjustment device 100.
[0079] To improve the uniformity of the magnetic field distribution, preferably, the adjustable magnet 310 and / or the fixed magnet 320 are evenly distributed, for example, Figure 14 The diagram shows one or more fixed magnets 320 and one or more adjustable magnets 310 evenly distributed at intervals.
[0080] The fixed magnet 320 provides the basic magnetic field framework, and its position remains unchanged to maintain overall symmetry. The proportional adjustment of the adjustable magnet 310 must be based on the fixed magnet 320 to ensure that the spacing between adjacent magnetic poles is uniform (such as the angle between adjacent adjustable magnets 310 and fixed magnet 320 is equal) to avoid sudden changes in magnetic field gradient due to angular deviation.
[0081] In one feasible embodiment, the end of the main drive shaft 230 of the main drive unit 200 connected to the first drive mechanism 1, as well as the energy source position adjustment device 100 and the magnet 300, are located in the vacuum chamber 400.
[0082] Figure 15 This is a schematic flowchart of an embodiment of the magnetron sputtering magnetic method described in this invention, as shown below. Figure 15 As shown, the magnetron sputtering method includes: Step S1: During magnetron sputtering, the position of magnet 300 is adjusted so that the position of magnet 300 is expanded or reduced proportionally to optimize the magnetic field distribution, thereby making the plasma density more uniform and the thickness of the thin film formed by magnetron sputtering more uniform.
[0083] In one feasible embodiment, the magnetron sputtering method further includes: Step S2: Zero out the position of the magnet 300 after position adjustment.
[0084] In one feasible embodiment, the magnetron sputtering method further includes: When the position of magnet 300 is expanded or reduced proportionally, the sputtering power is increased to match the sputtering power with the expansion direction of the magnetic field, thus avoiding a decrease in the overall sputtering rate due to insufficient power.
[0085] In a preferred embodiment, the main transmission device 200 rotates in one direction, and the energy source position adjustment device 100 drives the magnet 300 to move, so that the position of the magnet 300 is proportionally enlarged or reduced. To prevent the impact of vibration and production precision errors when magnet 300 is returned to zero, the main transmission device 200 can be rotated in the reverse direction for a long time to bring magnet 300 on each energy source position adjustment device 100 back to zero.
[0086] The main reason for the unevenness of the target surface after prolonged sputtering is the uneven sputtering rate caused by local magnetic field strength differences: in areas with stronger magnetic fields (such as directly below the adjustable magnet 310), ion bombardment is more intense, and the target material is eroded faster, forming depressions; in areas with weaker magnetic fields (such as the gaps or edges of the fixed magnet 320), the sputtering rate is low, forming protrusions. To avoid the unevenness of the target surface caused by prolonged sputtering, the magnetron sputtering method of this invention includes: Adjusting the radial position of magnet 300 makes the overall magnetic field distribution match the uneven contour of the target surface, thus offsetting the sputtering rate fluctuations caused by local erosion differences.
[0087] In one feasible embodiment, the magnetron sputtering method includes: By adjusting the radial position of magnet 300, the magnetic field corresponding to the concave area is weakened, while the magnetic field corresponding to the convex area is strengthened.
[0088] In one feasible embodiment, the magnetron sputtering method includes: The adjustable magnet 310 is moved outward in a radial direction to expand the coverage of the magnetic field, ensuring that the edge of the magnetic field is aligned with the edge of the effective sputtering area of the target material, and reducing unevenness caused by edge magnetic field leakage.
[0089] In one feasible embodiment, the magnetron sputtering method includes: Based on the axial unevenness of the target surface, the position of the magnet 300 is adjusted. The position of the magnet 300 corresponding to the raised area moves towards the center to enhance the local magnetic field; the magnet 300 in the recessed area moves outward to weaken the magnetic field. Preferably, the amount of movement of the magnet 300 is proportional to the height difference between the raised and recessed areas.
[0090] When the magnet rotates, uneven local magnetic field strength (e.g., a stronger central magnetic field than the edge) leads to a faster sputtering rate at the center of the target and a slower rate at the edges, resulting in a film thickness distribution that is "thicker in the middle and thinner at the edges"; conversely, the film thickness is thicker at the edges and thinner in the middle. To avoid uneven film thickness caused by the overall rotation of the magnet and the fixed relative positions of the magnetic poles, the magnetron sputtering method of this invention includes one or more of the following steps: The distance between magnet 300 and the center corresponds to the area where the film thickness is increased; Reduce the distance between the magnet 300 and the center in the area where the thin film is thin.
[0091] In one feasible embodiment, the magnetron sputtering method includes: Increasing the circumferential distance between the adjustable magnet 310 and the fixed magnet 320 reduces the magnetic pole superposition density in the central region and lowers the local magnetic field gradient.
[0092] For films with a thickness that is "thicker in the middle and thinner at the edges," the magnetron sputtering method of the present invention includes one or more of the following steps: The adjustable magnet 310 is moved outward radially in a proportional manner. Preferably, the outward movement of the adjustable magnet 310 is adjusted according to the ratio of the target distance to the effective radius of the original magnetic field, thereby expanding the magnetic field coverage, weakening the superposition intensity of the central magnetic field, enhancing the edge ion bombardment, and balancing the sputtering rate. Increasing the circumferential angle between the adjustable magnet 310 and the fixed magnet 320 increases the axial magnetic pole spacing, reduces the magnetic pole density in the central region, and lowers the local magnetic field gradient.
[0093] For films with a thickness that is "thin in the middle and thick at the edges," the magnetron sputtering method of the present invention includes one or more of the following steps: The adjustable magnet 310 is moved radially inward proportionally. Preferably, the adjustable magnet 310 is moved outward according to the ratio of the target-base distance to the effective radius of the original magnetic field, thereby reducing the magnetic field coverage area, enhancing the superposition intensity of the central magnetic field, and improving the sputtering rate of the target center. The number of adjustable magnets 310 at the edges is reduced, thereby lowering the magnetic field strength in the edge region.
[0094] The above provides several embodiments of the application of the energy source position adjustment device 100 in the field of magnetron sputtering. However, the present invention is not limited thereto. The energy source position adjustment device 100 described in the present invention can be applied to the field of thermal energy technology. By fixing the heating element to the energy source position adjustment device 100, the thermal energy field distribution can be made more uniform by adjusting the position of the heating element. Moreover, it can be directly adjusted in the process without stopping the process for position adjustment, thus avoiding delays in production sequence and production efficiency.
[0095] The foregoing has described specific embodiments of the invention. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired results. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0096] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to the embodiments of the present invention.
[0097] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.
[0098] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. The optional embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the embodiments of the present invention. These embodiments are selected and specifically described to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention.
Claims
1. An energy source position adjustment device, characterized in that, It includes a first transmission mechanism, a second transmission mechanism, a third transmission mechanism, and a fourth transmission mechanism: When the first transmission mechanism rotates in one direction, it is rotatably connected to the second, third, and fourth transmission mechanisms in sequence. When the first transmission mechanism rotates in another direction, it is rotatably connected to the fourth transmission mechanism via the third transmission mechanism. The fourth transmission mechanism is connected to the energy source and converts the rotation of the first transmission mechanism into linear motion to adjust the position of the energy source.
2. The energy source position adjustment device according to claim 1, characterized in that, The first transmission mechanism includes a primary shaft and a first gear. The first gear is connected to the primary shaft, and the primary shaft is driven to rotate by the rotation of the first gear.
3. The energy source position adjustment device according to claim 2, characterized in that, The first transmission mechanism further includes a one-way rotation structure, which is configured to control the one-way rotation between the first transmission mechanism and the second transmission mechanism; Or / and, the first transmission mechanism further includes a zero-adjustment structure, which is configured such that the first transmission mechanism directly drives the third transmission mechanism to rotate in another direction.
4. The energy source position adjustment device according to claim 3, characterized in that, The unidirectional rotation structure includes a ratchet structure, which includes a ratchet and a pawl assembly. The pawl assembly is connected to the primary shaft and simultaneously engages with the ratchet's asymmetrical tooth profile. Or / and, the zero-adjustment structure includes a first toothed component, a second toothed component, a spring, and an annular guide rail: One end of the first toothed member is connected to the primary shaft via a spring passing through an annular guide rail, and the other end of the first toothed member meshes with one end of the second toothed member; The other end of the second toothed member is connected to the third transmission mechanism.
5. The energy source position adjustment device according to claim 4, characterized in that, The inner surface of the ratchet is provided with a toothed structure that engages with the asymmetrical toothed structure of the pawl assembly, as well as a through hole through which the primary shaft passes.
6. The energy source position adjustment device according to claim 5, characterized in that, The ratchet assembly includes a spring, a slide rail, and a slider. One end of the slider is connected to the primary shaft via the spring, and the other end of the slider engages with the ratchet's asymmetrical tooth profile.
7. The energy source position adjustment device according to claim 4, characterized in that, The zeroing structure also includes a guide rail sleeve, which surrounds the first toothed component, the second toothed component, the spring, and the annular guide rail and is in clearance fit with the annular guide rail.
8. The energy source position adjustment device according to claim 1, characterized in that, The second transmission mechanism includes a secondary shaft, which receives power from the first transmission mechanism in one direction and transmits it to the third transmission mechanism; Or / and, the third transmission mechanism includes a three-stage shaft, the three-stage shaft receiving power from the third transmission mechanism to rotate in the one direction, and the three-stage shaft receiving power from the first transmission mechanism to rotate in the other direction; Or / and, the fourth transmission mechanism includes a lead screw and nut structure, the lead screw being connected to the third transmission mechanism, and the nut being connected to the energy source; Or / and, the energy source includes one or more of a magnet and a heating element; Or / and, it also includes a clamp connected to the fourth transmission mechanism for holding the energy source.
9. A magnet device, characterized in that, The device includes an energy source position adjustment device and a magnet as described in any one of claims 1-7, wherein the magnet is connected to the fourth transmission mechanism as an energy source.
10. The magnet device according to claim 9, characterized in that, It includes multiple magnets, including fixed magnets and adjustable magnets, the adjustable magnets being connected to the fourth transmission mechanism.
11. The magnet device according to claim 10, characterized in that, The multiple magnets are symmetrically distributed around the target surface.
12. A magnetron sputtering apparatus, characterized in that, The device includes a main transmission mechanism and at least one magnet device according to any one of claims 9-11, wherein the main transmission mechanism is configured to drive a first transmission mechanism of the energy source position adjustment device.
13. The magnetron sputtering apparatus according to claim 12, characterized in that, The main transmission device includes a motor, a transmission belt, and a main transmission shaft. The motor drives the main transmission shaft to rotate through the transmission belt, and the main transmission shaft drives the first transmission mechanism to rotate. Or / and, the main drive unit further includes a frame configured to support the main drive shaft; Or / and, the end of the main drive shaft of the main drive device connected to the first drive mechanism, as well as the energy source position adjustment device and the magnet, are located in the vacuum chamber.
14. A magnetron sputtering method, characterized in that, include: During magnetron sputtering, the position of the magnet is adjusted using the magnetron sputtering device as described in claim 12 or 13, so that the position of the magnet is proportionally enlarged or reduced.
15. The magnetron sputtering method according to claim 14, characterized in that, Also includes: The position of the adjusted magnet is zeroed using the magnetron sputtering apparatus as described in claim 12 or 13.