Supporting structure of thin film probe card and testing method of thin film probe card

Abstract

The invention relates to a supporting structure of a thin film probe card and a testing method of the thin film probe card. The supporting structure comprises a frame body, a fixing piece, a plurality of adjusting mechanisms and a plurality of first elastic structures. The frame body is used for contacting the film sheet. The fixing part is used for fixing the frame body on the substrate and limiting the movable direction of the frame body perpendicular to the substrate. The fixing piece is provided with a plurality of through holes. The plurality of adjusting mechanisms are respectively and movably arranged in the plurality of through holes in a close fit mode. The plurality of first elastic structures are arranged in the first space of the frame body, and each first elastic structure is arranged corresponding to one adjusting mechanism. The plurality of adjusting mechanisms are used for adjusting the elastic force of the plurality of first elastic structures.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a thin film probe card and a testing method thereof. In particular, the present disclosure relates to a thin film probe card with an adjustable support structure and a testing method thereof. BACKGROUND

[0002] During the manufacturing process of an integrated circuit, electrical testing is an important step to ensure the proper function of the device. For today's high-speed circuits, a thin film probe card has the advantage of high frequency testing. However, the thin film is not a rigid material, so the force of each probe contacting the object under test is not uniform, thereby reducing the quality of the test.

[0003] Furthermore, the flatness of the probe card itself or the object under test itself can be different, or the force applied to the probe card is not uniform, so the thin film will exhibit different flatness. When the flatness of the thin film does not match the flatness of the object under test, the results of the electrical test can deviate from the true situation.

[0004] Therefore, how to solve the contact quality between the thin film and the object under test has become an important issue in the art.

[0005] The above description of the prior art is provided merely as background information and does not admit that the above description of the prior art discloses the subject matter of the present disclosure, does not constitute the prior art of the present disclosure, and any description of the above "prior art" should not be considered as part of the present disclosure. SUMMARY

[0006] In view of the above, in order to solve the problems of the prior art, the purpose of the present disclosure is to provide a support structure of a thin film probe card and a testing method thereof.

[0007] An embodiment of the present disclosure provides a support structure of a thin film probe card, wherein the support structure is disposed between a substrate and a thin film sheet fixed on the substrate to support a test area in the thin film sheet. The support structure includes a frame, a fixing member, a plurality of adjustment mechanisms, and a plurality of first elastic structures. The frame is used to contact the thin film sheet. The fixing member is used to fix the frame on the substrate and limit the movable direction of the frame perpendicular to the substrate. The fixing member has a plurality of through holes. The plurality of adjustment mechanisms are movably and tightly fitted in the plurality of through holes, respectively. The plurality of first elastic structures are disposed in a first space of the frame, and each of the first elastic structures is disposed corresponding to one of the adjustment mechanisms. The plurality of adjustment mechanisms are used to adjust the elastic force of the plurality of first elastic structures.

[0008] Another embodiment of the present disclosure provides a test method of a thin film probe card, wherein the thin film probe card comprises a substrate, a support structure, and a thin film sheet, wherein the support structure is disposed between the substrate and the thin film sheet to support a test region in the thin film sheet. The test method comprises: applying a first stress to the substrate to cause the test region of the thin film probe card to contact a test object and to have a first contact stress between the test region and the test object; measuring a second stress between the support structure and the test region; adjusting an elastic force of at least one of a plurality of elastic structures in the support structure according to the second stress; applying the first stress to the substrate to cause the test region of the thin film probe card to contact the test object and to have a second contact stress between the test region and the test object. The second contact stress is different from the first contact stress.

[0009] Accordingly, the support structure of the thin film probe card and the test method thereof can maintain the thin film sheet at a desired contact force with the test object and obtain reliable test results.

[0010] The foregoing has outlined rather broadly the features and technical advantages of the present disclosure in order that the detailed description of the present disclosure that follows can be better understood. Additional features and advantages of the present disclosure will be described hereinafter which form the subject of the claims of the present disclosure. It should be appreciated by those skilled in the art that the conception and specific embodiments disclosed can be readily utilized as a basis for modifying or designing other structures or processes for carrying out the same purposes. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the present disclosure as set forth in the appended claims. BRIEF DESCRIPTION OF DRAWINGS

[0011] The disclosure will be more fully understood and appreciated by referring to the following detailed description taken in conjunction with the accompanying drawings. Like reference numerals refer to like elements throughout the several views of the drawings.

[0012] Figure 1 is a schematic diagram of a test system of some embodiments of the present disclosure.

[0013] Figure 2 is a schematic diagram of a support structure of some embodiments of the present disclosure.

[0014] Figure 3 is a schematic diagram of a test object of a thin film probe card of some embodiments of the present disclosure.

[0015] Figure 4 、 Figure 5 and Figure 6 is a top view schematic diagram of a configuration of a support structure of some embodiments of the present disclosure.

[0016] Figure 7A and Figure 7B is a top view schematic diagram of a configuration of an adjustment mechanism of some embodiments of the present disclosure.

[0017] Figure 8A and Figure 8B This is a top view schematic diagram of the configuration of the adjustment mechanism in some embodiments of this disclosure.

[0018] Figure 9A and Figure 9B This is a top view schematic diagram of the configuration of the adjustment mechanism in some embodiments of this disclosure.

[0019] Figure 10A and Figure 10B This is a top view schematic diagram of the configuration of the adjustment mechanism in some embodiments of this disclosure.

[0020] Figure 11A and Figure 11B This is a top view schematic diagram of the configuration of the adjustment mechanism in some embodiments of this disclosure.

[0021] Figure 12 This is a schematic diagram of a test system according to other embodiments of this disclosure.

[0022] Figure 13 This is a schematic diagram of a test system according to other embodiments of this disclosure.

[0023] Figure 14 This is a flowchart illustrating the testing methods for some embodiments of this disclosure.

[0024] The reference numerals in the attached figures are explained as follows:

[0025] 1: Testing System

[0026] 10: Thin-film probe card

[0027] 100: Supporting structure

[0028] 110: Frame

[0029] 111: Space

[0030] 120: Fastener

[0031] 121: Perforation

[0032] 122: Limiting post

[0033] 130: Elastic Structure

[0034] 131: First End

[0035] 132: Second End

[0036] 140: Adjustment of the organization

[0037] 150: Plate

[0038] 160: Soft rubber

[0039] 170: Pressure sensor

[0040] 2: Testing System

[0041] 20: Platform

[0042] 200: Substrate

[0043] 201: First Surface

[0044] 202: Second Surface

[0045] 210: Perforation

[0046] 3: Testing System

[0047] 30: Circuit board

[0048] 310: Probe

[0049] 311: Probe

[0050] 312: Probe

[0051] 313: Probe

[0052] 314: Probe

[0053] 4: Testing Methods

[0054] 40: Connection Structure

[0055] DUT: Test Material

[0056] EG: edge

[0057] L: Length

[0058] L1: Length

[0059] L2: Length

[0060] S42: Steps

[0061] S44: Steps

[0062] S46: Steps

[0063] S48: Steps

[0064] TA: Test Area

[0065] X: Direction

[0066] Y: direction

[0067] Z: Direction

[0068] σ1: Stress

[0069] σ2: Stress Detailed Implementation

[0070] The following description of this disclosure, accompanied by the accompanying drawings which are incorporated in and form part of this specification, illustrates embodiments of the disclosure; however, the disclosure is not limited to these embodiments. Furthermore, the following embodiments may be appropriately integrated to complete another embodiment.

[0071] Terms such as “an embodiment,” “an embodiment,” “an exemplary embodiment,” “another embodiment,” and “another embodiment” refer to embodiments described in this disclosure that may include specific features, structures, or characteristics; however, not every embodiment must include that specific feature, structure, or characteristic. Furthermore, repeated use of the phrase “in an embodiment” does not necessarily refer to the same embodiment, but may refer to the same embodiment.

[0072] To enable a full understanding of this disclosure, the following description provides detailed steps and structures. It is obvious that implementation of this disclosure does not limit the specific details known to those skilled in the art. Furthermore, known structures and steps are not detailed further to avoid unnecessarily limiting this disclosure. Preferred embodiments of this disclosure are detailed below. However, in addition to the detailed description, this disclosure can also be widely implemented in other embodiments. The scope of this disclosure is not limited to the detailed description, but is defined by the claims.

[0073] It should be understood that the following disclosure provides numerous different embodiments or examples for implementing various features of this disclosure. Specific embodiments or examples of components and arrangements are described below to simplify this disclosure. Of course, these are merely examples and are not intended to be limiting. For example, the dimensions of elements are not limited to the disclosed range or values, but may depend on process conditions and / or the desired properties of the apparatus. Furthermore, the description below of a first feature being formed "on" or "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, thereby potentially preventing direct contact between the first and second features. For simplicity and clarity, various features may be drawn at any scale. In the drawings, some layers / features may be omitted for simplicity.

[0074] Furthermore, for ease of explanation, spatial relative terms such as "beneath," "below," "lower," "above," and "upper" may be used herein to describe the relationship between one element or feature shown in the figures and another element or feature. These spatial relative terms are intended to encompass not only the orientations shown in the figures but also different orientations of the elements during use or operation. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein can be interpreted accordingly.

[0075] Figure 1 This is a schematic diagram of a test system 1 according to some embodiments of the present disclosure. Test system 1 is used to test a device under test (DUT). In some embodiments, the DUT is an electronic device having multiple contacts. In some embodiments, the DUT is a die-on-chip (DEC) or wafer-level integrated circuit. However, the present disclosure is not limited thereto, and various electronic components capable of transmitting electrical signals can be the DUTs described in this disclosure.

[0076] The test system 1 includes a thin-film probe card 10, a stage 20, a circuit board 30, and a connection structure 40. The stage 20 holds the device under test (DUT). The thin-film probe card 10 contacts the DUT and transmits electronic signals to the DUT via the circuit board 30 and the connection structure 40 to perform the test operation. For the sake of brevity, the accompanying drawings are omitted. Figure 1 Only one DUT is shown. However, this disclosure is not limited to this; the thin film probe card 10 can test one or more DUTs at a time.

[0077] The thin-film probe card 10 includes a support structure 100, a substrate 200, and a thin-film sheet 300. For example... Figure 1 As shown, the thin film 300 is fixed to the substrate 200 on both sides, while the support structure 100 is disposed between the substrate 200 and the thin film 300 to support the test area TA of the thin film 300. The range of the test area TA corresponds to the range of the device under test (DUT) to be tested. It should be understood that different test areas TA correspond to different DUTs. The test area TA can be adaptively adjusted according to the DUT. For example, one test area TA can correspond to one or more DUTs.

[0078] like Figure 1 As shown, the thin film 300 is fixed on the second surface 202 of the substrate 200. In different embodiments, the thin film 300 may be fixed on the first surface 201 of the substrate 200, wherein the first surface 201 is opposite to the second surface 202.

[0079] The thin-film probe card 10 has multiple probes 310 disposed in the test area TA of the thin film 300. When the thin-film probe card 10 approaches and contacts the device under test (DUT), the probes 310 directly contact the electronic contacts of the DUT. The thin film 300 also has multiple traces for transmitting electronic signals between the circuit board 30 and / or the connection structure 40 and the probes 310.

[0080] The thin film is made of a flexible material. In some existing technologies, due to tolerances in the flatness of the probe card itself or the device under test (DUT), uneven contact force occurs when the probe contacts the DUT. Some probes apply too little force, while others apply too much. When the force is too light, the contact quality between the probe and the DUT is poor, potentially resulting in excessive impedance in signal transmission or even an open circuit. When the force is too heavy, the probe may damage the DUT contacts or even the probe itself. If the damaged DUT contacts are bumps and the DUT undergoes a reflow process, the damaged bumps may generate bubbles, reducing their electrical properties. All of these situations will affect the test results.

[0081] Compared to existing technologies, the embodiments of this disclosure provide an elastically adjustable support structure 100. By adjusting the elasticity of the support structure 100, the preload in different parts of the thin film test area TA can be adjusted to compensate for uneven contact stress. Furthermore, the problem of poor test results caused by inconsistent flatness of the thin film probe card 10 or the test object DUT can also be addressed by adjusting the contact force to a more even level, resulting in more consistent flatness.

[0082] Please refer to Figure 2 . Figure 2 This is a schematic diagram of a support structure 100 according to some embodiments of the present disclosure. The support structure 100 includes a frame 110, a fastener 120, a plurality of elastic structures 130, a plurality of adjustment mechanisms 140, and a plurality of plates 150. The fastener 120 is disposed on a first surface 201 of the substrate 200, and the frame 110 is disposed on a second surface 202 of the substrate 200. The fastener 120 is used to lock the frame 110 onto the substrate 200 by screws.

[0083] The frame 110 has multiple spaces 111 for accommodating the elastic structure 130. For example... Figure 2 As shown, a space 111 accommodates an elastic structure 130.

[0084] The fastener 120 has multiple through holes 121. The substrate 200 has multiple through holes 210 (marked in...). Figure 1 (In the middle). The through hole 121 of the fastener 120 is provided corresponding to the through hole 210 of the substrate 200, so that when the fastener 120 is provided on the substrate 200, the through hole 121 of the fastener 120 and the through hole 210 of the substrate 200 together form a continuous through hole. In one embodiment, the fastener 120 and the frame 110 are connected by a plurality of limiting posts 122, which allow the frame 110 to move up and down in a direction perpendicular to the substrate 200 (i.e., move in the Z direction), without causing movement in the X or Y directions or rotation about the X or Y directions as axes.

[0085] The plurality of adjustment mechanisms 140 are movably fitted into the plurality of through holes 121 in the fixing member 120. The plurality of plates 150 are respectively disposed between the plurality of adjustment mechanisms 140 and the plurality of elastic structures 130. More specifically, one end of the adjustment mechanism 140 contacts one side of the plate 150, the first end 131 of the elastic structure 130 is connected to the other side of the plate 150, and the second end 132 of the elastic structure 130 is connected to the frame 110.

[0086] In some embodiments, the adjusting mechanism 140 is a screw. The fixing member 120 has threads in the through hole 121, and the adjusting mechanism 140 can engage with the threads and move up and down (i.e., move in the Z direction) by rotating the threads, thereby causing the plate member 150 to move up and down as well. Because the first end 131 of the elastic structure 130 is connected to the plate member 150, the position of the first end 131 of the elastic structure 130 also moves when the adjusting mechanism 140 moves up and down in the through hole 121.

[0087] In some embodiments, the elastic structure 130 is a spring. When the distance L between the first end 131 and the second end 132 of the elastic structure 130 changes, according to Hooke's Law (F = -x·κ), the elastic force (F) of the elastic structure 130 changes with the change in distance L (x), where κ is the elastic coefficient. When the adjusting mechanism 140 moves to different positions, the elastic structure 130 will have different elastic forces. In other words, the adjusting mechanism 140 is used to adjust the elastic force of the elastic structure 130.

[0088] In some embodiments, the frame 110 contacts the thin film 300, and the elasticity of the elastic structure 130 within the frame 110 affects the contact stress when the probe 310 on the thin film 300 contacts the test object (DUT). Accordingly, the contact stress when the probe 310 contacts the DUT can be adjusted by changing the position of the adjustment mechanism 140. In some embodiments, one frame 110 may correspond to one or more DUTs.

[0089] Please refer to Figure 3 . Figure 3This is a schematic diagram of a thin-film probe card 10 testing a device under test (DUT) according to some embodiments of this disclosure. When a stress σ1 is applied to the substrate 200 and the probe 310 contacts the DUT, the thin film 300 bends at the edge EG of the test area TA. Therefore, the contact stress between probes 311 and 312 may differ due to the bending at the edge EG. Because of the different contact stresses, the flatness of the test area TA on the thin film 300 will also be uneven. For example, probe 311, which is closer to the edge EG, is farther from the DUT, so the stress between probe 311 and the DUT is smaller than the contact stress between probe 312 and the DUT. To compensate for this difference in contact stress, the adjustment mechanism 140, which is closer to the edge EG, is adjusted to a lower position to compress the corresponding elastic structure 130, compressing the original length L to L1. This allows the corresponding elastic structure 130 to provide stronger elasticity to the thin film 300, thereby increasing the contact stress between probe 311 and the DUT. With the increased contact stress between probe 311 and the test object (DUT), the contact stress between probe 311 and probe 312 on the DUT becomes more uniform. The flatness of the thin film 300 at probe 311 and probe 312 can also be closer (i.e., more uniform). In some embodiments, after adjusting the elastic force of the elastic structure 130 corresponding to probe 311, the elastic forces of the elastic structures 130 corresponding to probe 311 and probe 312 are different when probe 311 and probe 312 contact the DUT. In some embodiments, after adjusting the elastic force of the elastic structure 130 corresponding to probe 311, the contact stress between probe 311 and probe 312 on the DUT is approximately equal. In some embodiments, after adjusting the elastic force of the elastic structure 130 corresponding to probe 311, the test area TA can be maintained at a preset flatness when probe 311 and probe 312 contact the DUT.

[0090] In some embodiments, the contact point on the surface of the device under test (DUT) at probe 313 is higher than the contact point at probe 314 (having a higher level in the Z direction). When probes 313 and 314 contact the DUT, the contact stress between probe 313 and the DUT is greater than that between probe 314 and the DUT. To compensate for this difference in contact stress, the adjustment mechanism 140 corresponding to probe 314 is adjusted to a higher position to stretch the corresponding elastic structure 130, elongating the original length L to L2. This allows the corresponding elastic structure 130 to provide lower elasticity to the thin film 300, thereby reducing the contact stress between probe 313 and the DUT. With the reduced contact stress between probe 313 and the DUT, the contact stress between probes 313 and 314 is more uniform. The flatness of the thin film 300 at probe 313 and probe 314 can also be closer (i.e., more uniform). In some embodiments, after the elastic force of the elastic structure 130 corresponding to probe 313 is adjusted, the elastic forces of the elastic structure 130 corresponding to probe 313 and the elastic structure 130 corresponding to probe 314 are different when probe 313 and probe 314 contact the test object (DUT). In some embodiments, after the elastic force of the elastic structure 130 corresponding to probe 313 is adjusted, the contact stress of probe 313 and probe 314 contacting the test object (DUT) is approximately equal. In some embodiments, after the elastic force of the elastic structure 130 corresponding to probe 313 is adjusted, the test area TA can be maintained at a preset flatness when probe 314 contacts the test object (DUT).

[0091] Therefore, after adjusting the elasticity of the elastic structure 130, applying stress σ1 to the substrate 200 again to bring the probe 310 into contact with the test object (DUT) can make the contact stress between the probes 311-314 and the DUT more uniform. The thin film 300 also has a suitable flatness for testing the DUT. In some embodiments, the contact stress between the probes 311-314 and the DUT is approximately equal.

[0092] In other embodiments, the elastic force of the adjusted elastic structure 130 may be the same as that of the unadjusted elastic structure 130.

[0093] In other embodiments, the contact stress of the probe corresponding to the adjusted elastic structure 130 may be different from the contact stress of the probe corresponding to the unadjusted elastic structure 130.

[0094] In some embodiments, the thin-film probe card 10 includes a plurality of support structures 100, and the elastic structures 130 in each support structure 100 may be the same or different. For example, in some embodiments, different support structures 100 use springs with different wire diameters or different diameters. In other embodiments, the same support structure 100 may use springs with different wire diameters or different diameters. In other words, the elastic coefficient κ of the elastic structure 130 in each support structure 100 may be the same or different.

[0095] It should be understood that, Figure 1 , Figure 2 and Figure 3 Each of the illustrated support structures 100 includes two adjustment mechanisms 140 and two spaces 111 for accommodating two elastic structures 130, but this disclosure is not limited thereto, and various numbers of adjustment mechanisms 140, spaces 111 and elastic structures 130 are within the consideration and scope of this disclosure.

[0096] In some embodiments, an adjustment mechanism 140 is used to adjust an elastic structure 130, and one elastic structure 130 corresponds to one probe 310. In some embodiments, an adjustment mechanism 140 is used to adjust at least two elastic structures 130, and one elastic structure 130 corresponds to one probe 310. In some embodiments, an adjustment mechanism 140 is used to adjust at least two elastic structures 130, and one elastic structure 130 corresponds to at least two probes 310.

[0097] Please refer to Figure 4 , Figure 5 and Figure 6 . Figure 4 , Figure 5 and Figure 6 This is a top view schematic diagram showing the configuration of the support structure 100 according to some embodiments of this disclosure. For ease of understanding, Figure 4 , Figure 5 and Figure 6 Only the relative positions of the thin film 300 and the support structure 100 are shown.

[0098] like Figure 4 As shown in the embodiment, the thin-film probe card 10 includes two support structures 100, and the support structures 100 are arranged along the main dimension (e.g., the X direction) of the thin-film sheet 300. Figure 5 As shown in the embodiments, the thin-film probe card 10 includes more than two support structures 100, and the more than two support structures 100 are arranged in a straight line along the main dimension (e.g., the X direction) of the thin film sheet 300. Figure 6 As shown in the embodiments, the thin film probe card 10 includes a plurality of support structures 100, and the plurality of support structures 100 are arranged in a matrix.

[0099] Please refer to Figure 7Aand Figure 7B . Figure 7A and Figure 7B This is a top view schematic diagram showing the configuration of the adjustment mechanism 140 according to some embodiments of this disclosure. Figure 7A In the illustrated embodiment, a support structure 100 includes two adjustment mechanisms 140, and the adjustment mechanisms 140 are arranged in a straight line along the X direction. Figure 7B In the embodiment shown, a support structure 100 includes more than two adjustment mechanisms 140, and the more than two adjustment mechanisms 140 are arranged in a straight line along the X direction.

[0100] Please refer to Figure 8A and Figure 8B . Figure 8A and Figure 8B This is a top view schematic diagram showing the configuration of the adjustment mechanism 140 according to some embodiments of this disclosure. Figure 8A In the illustrated embodiment, a support structure 100 includes two adjustment mechanisms 140, which are arranged in a straight line along the Y direction, wherein the Y direction is perpendicular to the X direction. Figure 8B In the embodiment shown, a support structure 100 includes more than two adjustment mechanisms 140, and the more than two adjustment mechanisms 140 are arranged in a straight line along the Y direction.

[0101] Please refer to Figure 9A and Figure 9B . Figure 9A and Figure 9B This is a top view schematic diagram showing the configuration of the adjustment mechanism 140 according to some embodiments of this disclosure. Figure 9A In the illustrated embodiment, a support structure 100 includes two adjustment mechanisms 140, which are arranged in a straight line along a direction that is not parallel to the X and Y directions. Figure 9B In the embodiment shown, a support structure 100 includes more than two adjustment mechanisms 140, and the more than two adjustment mechanisms 140 are arranged in a straight line along a direction that is not parallel to the X and Y directions.

[0102] Please refer to Figure 10A and Figure 10B . Figure 10A and Figure 10B This is a top view schematic diagram showing the configuration of the adjustment mechanism 140 according to some embodiments of this disclosure. Figure 10A In the illustrated embodiment, a support structure 100 includes four adjustment mechanisms 140, which are arranged in a 2×2 matrix. Figure 10B In the embodiment shown, a support structure 100 includes more than four adjustment mechanisms 140, and the more than four adjustment mechanisms 140 are arranged in an N×M matrix, where N and M are positive integers.

[0103] Please refer toFigure 11A and Figure 11B . Figure 11A and Figure 11B This is a top view schematic diagram showing the configuration of the adjustment mechanism 140 according to some embodiments of this disclosure. Figure 11A In the illustrated embodiment, a support structure 100 includes four adjustment mechanisms 140 arranged in two rows, wherein the adjustment mechanisms 140 in the first row and the second row are offset in the Y direction. Figure 11B In the embodiment shown, a support structure 100 includes more than four adjustment mechanisms 140, which are arranged in multiple rows, wherein the adjustment mechanisms 140 in adjacent rows are offset in the Y direction.

[0104] exist Figure 10A , Figure 10B , Figure 11A and Figure 11B In one embodiment, the spacing between the adjustment mechanisms 140 in each row is equal.

[0105] Figure 12 This is a schematic diagram of test system 2 according to another embodiment of this disclosure. Test system 2 is similar to test system 1, but the support structure 100 of test system 2 further includes a soft adhesive 160. The soft adhesive 160 is disposed between the frame 110 and the diaphragm sheet 300, and the soft adhesive 160 directly contacts the diaphragm sheet 300 and the frame 110. The soft adhesive 160 is used to provide additional cushioning for the diaphragm sheet 300 and the frame 110.

[0106] Figure 13 This is a schematic diagram of a test system 3 according to another embodiment of this disclosure. Test system 3 is similar to test system 1, but the support structure 100 of test system 3 further includes a pressure sensor 170. The pressure sensor 170 measures the stress σ2 between the frame 110 and the diaphragm sheet 300, and the adjustment mechanism 140 adjusts the elastic force of the elastic structure 130 based on the stress σ2 measured by the pressure sensor 170. For example, when the stress σ2 measured by the pressure sensor 170 is greater than a first threshold, the corresponding adjustment mechanism 140 reduces the elastic force of the corresponding elastic structure 130. Alternatively, when the stress σ2 measured by the pressure sensor 170 is less than a second threshold, the corresponding adjustment mechanism 140 increases the elastic force of the corresponding elastic structure 130, where the first threshold is greater than the second threshold.

[0107] In some embodiments, test system 1 may simultaneously include the soft rubber 160 of test system 2 and the pressure sensor 170 of test system 3.

[0108] In other embodiments, the stress σ2 of test system 1 and / or test system 2 is measured by an external pressure sensor. Before measuring the object under test (DUT), each probe 310 of test system 1 and / or test system 2 can press against the external pressure sensor, and then adjust the adjustment mechanism 140 according to the stress σ2 measured by the external pressure sensor so that each probe 310 can reach the desired contact stress. After adjustment, the measurement of the DUT is performed.

[0109] refer to Figure 14 . Figure 14 This is a flowchart illustrating test method 4 according to some embodiments of the present disclosure. In some embodiments, test system 1, test system 2, and / or test system 3 are used to perform test method 4 to test the device under test (DUT). For ease of understanding, test method 4 is described using the same references as test system 1, test system 2, and test system 3.

[0110] Test method 4 includes steps S42, S44, S46, and S48. In step S42, a first stress σ1 is applied to the substrate 200, causing the test area TA of the thin film probe card 10 to contact the object under test (DUT), and ensuring the test area TA has a first flatness. In step S44, a second stress σ2 is measured between the support structure 100 and the test area TA. In step S46, based on the second stress σ2, the elasticity of at least one of the elastic structures 130 in the support structure 100 is adjusted. In step S48, the first stress σ1 is applied to the substrate 200, causing the test area TA of the thin film probe card 10 to contact the DUT, and ensuring the test area TA has a second flatness.

[0111] It should be understood that the test method 4 of this disclosure is not limited to steps S42, S44, S46, and S48. Various examples are shown below. Figures 1 to 13 The operations in the embodiments are all within the consideration and scope of test method 4.

[0112] In summary, the support structure and testing method of the thin-film probe card in the embodiments of this disclosure adjust the stress between the thin film and the test object through the elastic structure in the support structure, thereby controlling the flatness of the thin film. In this way, the electrical contact between the probe on the thin film and the test object can be optimized to improve the accuracy of the test and avoid damage to the probe card and the test object.

[0113] While this disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions, and alternatives may be made without departing from the concept and scope of this disclosure as defined in the claims. For example, many of the processes described above may be implemented using different methods, and other processes or combinations thereof may be substituted for many of the processes described above.

[0114] Furthermore, the scope of this application is not limited to the specific embodiments of the processes, machinery, manufacturing, material composition, means, methods, and steps described in the specification. Those skilled in the art will understand from the disclosure of this publication that existing or future processes, machinery, manufacturing, material composition, means, methods, or steps that have the same function or achieve substantially the same results as the corresponding embodiments described herein can be used according to this disclosure. Accordingly, these processes, machinery, manufacturing, material composition, means, methods, or steps are included within the scope of the claims of this application.

Claims

1. A support structure of a thin film probe card, wherein the support structure is disposed between a substrate and a thin film sheet fixed on the substrate to support a test area of the thin film sheet, and wherein the support structure comprises: a frame to contact the thin film sheet; a fixing member to fix the frame on the substrate and limit a movable direction of the frame perpendicular to the substrate, wherein the fixing member has a plurality of through holes; and a plurality of first elastic structures disposed in a first space of the frame, and each of the first elastic structures corresponds to one of the adjustment mechanisms; wherein the plurality of adjustment mechanisms are used to adjust the elastic force of the plurality of first elastic structures.

2. The support structure of claim 1, further comprising: a plurality of plate members respectively disposed between the plurality of adjustment mechanisms and the plurality of first elastic structures.

3. The support structure of claim 2, wherein the plurality of first elastic structures respectively comprise: a first end to contact a corresponding one of the plurality of plate members; and a second end to contact the frame. a plurality of adjustment mechanisms movably and tightly fitted in the plurality of through holes, respectively; 4. The support structure of claim 3, wherein the plurality of first elastic structures are springs, and a distance between the first end and the second end is related to the elastic force of the plurality of first elastic structures, wherein the plurality of adjustment mechanisms are used to adjust the position of the plurality of plate members, and thereby adjust the distance.

5. The support structure of claim 1, wherein the plurality of through holes have threads, and the plurality of adjustment mechanisms are screws engaged with the threads and moved along a direction perpendicular to the substrate according to the threads.

6. The support structure of claim 1, wherein each of the adjustment mechanisms is used to adjust the elastic force of the corresponding first elastic structure.

7. The support structure of claim 6, wherein the elastic force of the adjusted first elastic structures is the same for the contact force of a plurality of probes on the thin film sheet to a test object.

8. The support structure of claim 1, wherein the elastic force of the plurality of first elastic structures adjusted by the plurality of adjustment mechanisms is such that the test area of the thin film sheet is maintained at a predetermined flatness.

9. The support structure of claim 1, further comprising: a plurality of second elastic structures disposed in a second space of the frame, and each of the second elastic structures corresponds to one of the adjustment mechanisms; wherein the plurality of adjustment mechanisms are used to adjust the elastic force of the corresponding second elastic structures.

10. The support structure of claim 9, wherein the elastic force of the adjusted second elastic structures is the same for the contact stress of a plurality of probes on the thin film sheet to a test object.

11. The support structure of claim 10, wherein the elastic force of the adjusted first elastic structures is the same as or different from the elastic force of the adjusted second elastic structures.

12. The support structure of claim 9, wherein the thin film sheet includes a plurality of probes, each of the second elastic structures corresponds to at least one probe, and wherein the elastic force of the adjusted second elastic structures is different from the contact stress of at least one probe to a test object to the contact stress of at least another probe to the test object.

13. The support structure of claim 1, wherein in a top view, the plurality of adjustment mechanisms are arranged in a line along a first direction. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 14. The support structure of claim 1, wherein the plurality of adjustment mechanisms are arranged in an N x M matrix in a top view, where N and M are positive integers.

15. The support structure of claim 1, wherein the plurality of adjustment mechanisms are arranged in a first direction in a plurality of rows in a top view, wherein a spacing between the adjustment mechanisms in each of the plurality of rows is equal, and the adjustment mechanisms of adjacent two rows are offset in a second direction, wherein the first direction is perpendicular to the second direction.

16. The support structure of claim 1, further comprising: a soft gel disposed between the frame and the membrane sheet.

17. The support structure of claim 1, further comprising: a pressure sensor configured to measure a second stress between the frame and the membrane sheet.

18. The support structure of claim 17, wherein the plurality of adjustment mechanisms adjust the spring force of the plurality of elastic structures according to the second stress.

19. A method of testing a membrane probe card, wherein the membrane probe card comprises a substrate, a support structure, and a membrane sheet, wherein the support structure is disposed between the substrate and the membrane sheet to support a test region of the membrane sheet, wherein the method of testing comprises: applying a first stress to the substrate to cause the test region of the membrane probe card to contact a device under test and to have a first contact stress between the test region and the device under test; measuring a second stress between the support structure and the test region; adjusting a spring force of at least one of a plurality of elastic structures of the support structure according to the second stress; and applying the first stress to the substrate to cause the test region of the membrane probe card to contact the device under test and to have a second contact stress between the test region and the device under test, wherein the second contact stress is different from the first contact stress. ​ ​ ​ ​ ​ ​ ​ ​

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