Semiconductor device and preparation method thereof
By using conductive adhesive to form bumps on the top of the conductive pillars of the chip and carrier board and then bonding them at low temperature, the high cost and long cycle caused by the complexity of UBM manufacturing are solved, and the process is simplified and the semiconductor device production is made cheaper.
CN121843556APending Publication Date: 2026-04-10MIDEA GROUP CO LTD +1
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Patent Information
- Application Number
- CN202511923695.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-18
- Publication Date
- 2026-04-10
AI Technical Summary
Technical Problem
In existing technologies, the UBM manufacturing process is complex, resulting in long production times and high manufacturing costs for semiconductor devices.
Method used
Conductive adhesive is used to form bumps on the top of the conductive pillars of the chip and the carrier board. After curing, they are bonded and heated, abandoning the traditional UBM structure and using a low-temperature process for encapsulation.
Benefits of technology
It simplifies the manufacturing process of semiconductor devices, shortens the production cycle, reduces packaging costs, solves the problem of high-temperature failure, and improves the long-term reliability and yield of the packaging structure.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses a semiconductor device and a preparation method thereof, and the preparation method comprises the steps: applying a conductive adhesive to the top ends of a plurality of first conductive columns of a chip, so as to form corresponding first bumps on the plurality of first conductive columns; drying the first salient points on the plurality of first conductive columns so as to cure the first salient points; applying conductive adhesive to the top ends of a plurality of second conductive columns of the carrier plate so as to form corresponding second salient points on the plurality of second conductive columns; inverting the chip with the cured first salient points so as to enable the cured first salient points to be aligned with the second salient points; and pressing and heating the chip and the carrier plate so as to bond and cure the second salient points and the cured first salient points. According to the preparation method, the technological process of the semiconductor device can be simplified, the production period of the semiconductor device can be shortened, and the packaging cost of the semiconductor device can be greatly reduced.
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