Composite radiator with microstructure and preparation method thereof

By incorporating microstructures and needle-fin composites inside the heat sink, and utilizing laser-assisted electrodeposition technology and ultrasonic transducer array modules, the problem of low convective heat transfer efficiency at the bottom of the heat sink substrate was solved, achieving a more efficient heat dissipation effect.

CN121969149APending Publication Date: 2026-05-01HUANGSHAN GUANGJIE SURFACE TREATMENT TECH CO LTD
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Patent Information

Application Number
CN202610132391.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-01-30
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

In existing liquid cooling technologies for power modules, the convective heat transfer efficiency at the bottom of the heat dissipation substrate is low, making it difficult to effectively improve heat dissipation efficiency to cope with the thermal stress problem of highly integrated, high-power-density chips.

Method used

Microstructures and needle-fin composites are set inside the heat sink. By arranging teardrop-shaped and wave-shaped microstructures in the gaps between the needle fins, combined with laser-assisted electrodeposition technology and ultrasonic transducer array modules, high-precision molding and uniform deposition of microstructures are achieved, thereby enhancing fluid convection heat transfer.

Benefits of technology

It significantly improves the heat dissipation capacity of the radiator, increases the heat dissipation area and fluid turbulence, ensures that the heat of high power density modules is quickly dispersed, and improves the overall heat dissipation performance of the radiator.

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Abstract

The invention discloses a composite radiator with a microstructure and a preparation method thereof, which are used in the technical field of power semiconductor packaging. The array substrate comprises a substrate body and a cover plate, densely-arranged microstructures are arranged in pin fin gaps of the substrate body, and the microstructures comprise water-drop-shaped microstructures and wave-shaped microstructures; the shape of the drop-shaped microstructure is the upper half part of a rotating ellipsoid, and the short radius of the rotating ellipsoid is perpendicular to the pin fin surface of the substrate; the cross section of the wave-shaped microstructure is a wave-shaped pattern with two sharp ends and the same width in the middle; the radiator formed by connecting the cover plate and the substrate is of a hollow closed structure, the pin fins and the microstructures are located in the closed structure, and a liquid inlet and a liquid outlet are formed in the two ends of the cover plate. Directional forming of a high-precision microstructure is achieved through laser-assisted electro-deposition, the transmitting transducer is used for generating normal resonance so that deposition liquid components can be homogenized, and the heat dissipation capacity of a radiator is improved through the synergistic turbulent flow effect of the manufactured microstructure and the pin fins.
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