Vapor chamber

Abstract

The invention discloses a vapor chamber, and belongs to the technical field of heat dissipation of electronic devices. The vapor chamber comprises a shell assembly, an evaporation capillary structure, a condensation capillary structure and a plurality of capillary column structures, the shell assembly comprises a first inner wall and a second inner wall which are oppositely arranged in the first direction. The evaporation capillary structure is arranged on the first inner wall, a first middle area is arranged in the middle of the evaporation capillary structure, and the first middle area is concavely arranged towards the first inner wall; the condensation capillary structure is arranged on the second inner wall, and the condensation capillary structure and the condensation capillary structure are arranged at intervals; one end of each capillary column structure is connected to the condensation capillary structure, and the other end of each capillary column structure is connected to the evaporation capillary structure. According to the vapor chamber, collaborative optimization of circulation of the liquid working medium and the vapor working medium is achieved, the heat transfer efficiency and the temperature equalizing performance of the vapor chamber are improved, and the efficient heat dissipation requirement of a high-power-density electronic device is met.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and more particularly to a heat spreader. Background Technology

[0002] With the rapid development of electronic technology, the integration and power density of chips are constantly increasing, and the heat generated by electronic devices during operation is increasing significantly. If the heat generated by electronic devices during operation is not dissipated in a timely and effective manner, it will cause heat to accumulate continuously on the chip surface, leading to a rapid rise in chip temperature, which will reduce the stability of device operation, cause the degradation of electrical performance, and shorten the service life.

[0003] Vapor chambers (VCs) are widely used in the heat dissipation of electronic devices due to their high heat transfer efficiency. They mainly consist of a housing, capillary structure, and a working fluid (water). The continuous phase change and circulation of the water facilitates rapid heat transfer, effectively dissipating the heat generated by the chip. However, current vapor chamber technologies often employ relatively simple internal capillary structures, typically using either a monolithic copper mesh or a monolithic powder sintering structure. These designs struggle to balance the flow resistance of both liquid and gaseous working fluids, resulting in low working fluid circulation efficiency. Consequently, the heat transfer efficiency and temperature uniformity of the vapor chamber are limited, making it difficult to meet the heat dissipation requirements of high-power-density devices. Summary of the Invention

[0004] One embodiment of the present invention aims to provide a heat spreader that achieves synergistic optimization of the flow of liquid and gaseous working fluids, improves the heat transfer efficiency and temperature uniformity of the heat spreader, and meets the high-efficiency heat dissipation requirements of high-power-density electronic devices.

[0005] One embodiment of the present invention adopts the following technical solution: A heat spreader includes a housing assembly, the housing assembly including a first inner wall and a second inner wall disposed opposite to each other along a first direction; the housing assembly contains: An evaporation capillary structure is provided on the first inner wall, and a first intermediate region is provided at the middle position of the evaporation capillary structure, and the first intermediate region is recessed towards the first inner wall. A condensation capillary structure is disposed on the second inner wall and spaced apart from the condensation capillary structure. Multiple capillary columns are arranged at intervals, with one end connected to the condensation capillary structure and the other end connected to the evaporation capillary structure.

[0006] In some embodiments, the evaporation capillary structure further includes a first surrounding region circumferentially disposed around the first intermediate region, the first intermediate region and the first surrounding region being smoothly connected, and the first intermediate region being concave inward relative to the first surrounding region, the first intermediate region being a conical groove or a pyramidal groove; and / or, the evaporation capillary structure further includes a first surrounding region circumferentially disposed around the first intermediate region and a connecting region connecting the first intermediate region and the first surrounding region, the first intermediate region, the connecting region and the first surrounding region being smoothly connected, the surfaces of the first intermediate region and the first surrounding region being planar, the surface of the connecting region being an inclined surface, the first intermediate region being concave inward relative to the first surrounding region; the first intermediate region and the connecting region forming a frustum-shaped groove or a frustum-shaped groove.

[0007] In some embodiments, the evaporation capillary structure includes a first intermediate region and a first surrounding region, wherein the pore size of the first intermediate region is less than or equal to the pore size of the first surrounding region; and / or, the evaporation capillary structure further includes a connecting region, wherein the pore size of the connecting region is equal to the pore size of the first surrounding region.

[0008] In some embodiments, a plurality of capillary structures are further included, which are radially distributed, with one end of the capillary structure connected to the outer edge of the first intermediate region and the other end extending to the outer edge of the first surrounding region.

[0009] In some embodiments, the thickness of the capillary structure gradually increases along the first direction from the first intermediate region to the first surrounding region.

[0010] In some embodiments, a plurality of guide grooves are arranged circumferentially on the outer side of the capillary column structure, and the guide grooves are disposed through the first direction; and / or, the outer side of the capillary column structure is a smooth surface.

[0011] In some embodiments, a support column is further included, one end of which passes through the condensation capillary structure and is supported on the first inner wall, and the other end of which passes through the evaporation capillary structure and is supported on the second inner wall.

[0012] In some embodiments, multiple support columns are provided, and the multiple capillary column structures are fitted onto the multiple support columns in a one-to-one correspondence.

[0013] In some embodiments, a second intermediate region is provided at the middle position of the condensation capillary structure, and the second intermediate region protrudes toward the first intermediate region.

[0014] In some embodiments, the condensation capillary structure further includes a second surrounding region surrounding the second intermediate region, the second surrounding region and the second intermediate region being smoothly connected, and the second intermediate region protruding outward relative to the second surrounding region; and / or, the second intermediate region is a frustum-shaped protrusion, a conical protrusion, a frustum-shaped pyramidal protrusion, or a pyramidal protrusion.

[0015] Beneficial effects of the embodiments of the present invention: One embodiment of the present invention provides a heat spreader, in which an evaporation capillary structure is disposed on a first inner wall and a condensation capillary structure is disposed on a second inner wall, such that the evaporation capillary structure and the condensation capillary structure are spaced apart along a first direction; multiple capillary columns are arranged spaced apart between the condensation capillary structure and the evaporation capillary structure, thereby forming a channel between the condensation capillary structure, the evaporation capillary structure and the multiple capillary columns. The heat transfer process of the heat spreader includes: the liquid working fluid in the evaporation capillary structure evaporates into a vapor working fluid under the heat of the heat source, and flows upward through the channel to the condensation capillary structure, avoiding the flow resistance generated by the vapor working fluid passing through the capillary structure, so that the vapor working fluid can quickly reach the condensation capillary structure, reducing the transmission thermal resistance and improving the phase change efficiency; the vapor working fluid condenses into a liquid working fluid at the condensation capillary structure, and the liquid working fluid flows back to the evaporation capillary structure along the capillary columns under the combined action of capillary force and gravity, completing the circulation. The capillary columns ensure that the liquid working fluid flows back to the evaporation capillary structure accurately and quickly, preventing the evaporation capillary structure from dry burning. By setting up a capillary column structure with intervals, the paths of the gaseous and liquid working fluids are separated, achieving synergistic optimization of the flow, reducing flow resistance, improving the working fluid circulation efficiency, and ultimately enhancing the heat transfer capacity and thermal conductivity of the heat spreader.

[0016] By setting the first middle region of the evaporation capillary structure as a concave structure, that is, setting the evaporation capillary structure as thin in the middle and thick around the edges, the thinness of the middle of the evaporation capillary structure can reduce the contact thermal resistance and further improve the thermal conductivity; the thickness of the edges of the evaporation capillary structure results in a large contact thermal resistance, and heat is conducted from the high-temperature first middle region to the low-temperature first surrounding region. This allows the heat absorbed by the first middle region to be quickly diffused to the surrounding area, thereby improving the heat transfer capacity, reducing the temperature difference between the first middle region and the first surrounding region, and thus improving the heat transfer efficiency and temperature uniformity performance of the heat spreader, meeting the high-efficiency heat dissipation requirements of high-power-density electronic devices. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a heat spreader provided in some embodiments of the present invention; Figure 2 This is a front view of a heat spreader provided in some embodiments of the present invention; Figure 3 yes Figure 2 AA section view; Figure 4 These are schematic diagrams of the coverless and condensation capillary structures provided in some embodiments of the present invention; Figure 5 These are exploded views of the heat spreader provided in some embodiments of the present invention; Figure 6 These are schematic diagrams of condensation capillary structures provided in some embodiments of the present invention; Figure 7 These are schematic diagrams of capillary column structures provided in some embodiments of the present invention; Figure 8 This is a schematic diagram of a coverless condenser capillary structure provided in some other embodiments of the present invention; Figure 9 These are schematic diagrams of evaporation capillary structures and capillary strips provided in other embodiments of the present invention; Figure 10 This is a schematic diagram of a condensation capillary structure provided in some other embodiments of the present invention; Figure 11 This is a cross-sectional view of a heat spreader provided in some other embodiments of the present invention.

[0018] In the picture: 1. Housing assembly; 11. Cover plate; 111. First inner wall; 12. Housing; 121. Second inner wall; 2. Evaporation capillary structure; 21. First intermediate region; 22. First surrounding region; 221. First annular region; 222. Second annular region; 23. Connecting region; 3. Condensation capillary structure; 31. Second intermediate region; 32. Second surrounding region; 321. First part; 322. Second part; 4. Capillary column structure; 41. Guide channel; 5. Capillary structure; 51. First surface; 52. Second surface; 6. Support columns. Detailed Implementation

[0019] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] like Figures 1-11 As shown, this embodiment provides a heat spreader, including a shell assembly 1 and an evaporation capillary structure 2, a condensation capillary structure 3, and a plurality of capillary column structures 4 disposed within the shell assembly 1; the shell assembly 1 includes a first inner wall 111 and a second inner wall 121 disposed opposite to each other along a first direction; the evaporation capillary structure 2 is disposed on the first inner wall 111, and a first intermediate region 21 is provided at the middle position of the evaporation capillary structure 2, the first intermediate region 21 being recessed toward the first inner wall 111; the condensation capillary structure 3 is disposed on the second inner wall 121, and is disposed at intervals from the condensation capillary structure 3; the plurality of capillary column structures 4 are arranged at intervals, one end of which is connected to the condensation capillary structure 3, and the other end of which is connected to the evaporation capillary structure 2.

[0023] Evaporation capillary structure 2 is disposed on the first inner wall 111, and condensation capillary structure 3 is disposed on the second inner wall 121, such that evaporation capillary structure 2 and condensation capillary structure 3 are spaced apart along the first direction; multiple capillary column structures 4 are spaced apart between condensation capillary structure 3 and evaporation capillary structure 2, thereby forming a channel between condensation capillary structure 3, evaporation capillary structure 2 and multiple capillary column structures 4.

[0024] The heat transfer process of the vapor chamber includes: the liquid working fluid in the evaporation capillary structure 2 evaporates into a vapor working fluid under the heat of the heat source, and flows upward through the channel to the condensation capillary structure 3. This avoids the vapor working fluid passing through the capillary structure and generating flow resistance, allowing the vapor working fluid to quickly reach the condensation capillary structure 3, reducing transmission thermal resistance and improving phase change efficiency. The vapor working fluid condenses into a liquid working fluid at the condensation capillary structure 3. Under the combined action of capillary force and gravity, the liquid working fluid flows back to the evaporation capillary structure 2 along the capillary column structure 4, completing the circulation. The capillary column structure 4 ensures precise and rapid return of the liquid working fluid to the evaporation capillary structure 2, preventing the evaporation capillary structure 2 from dry burning. By setting up the spaced capillary column structure 4, the paths of the vapor and liquid working fluids are separated, achieving synergistic optimization of the flow, reducing flow resistance, improving the working fluid circulation efficiency, and ultimately enhancing the heat transfer capacity and thermal conductivity of the vapor chamber.

[0025] By setting the first middle region 21 of the evaporation capillary structure 2 as a concave structure, that is, setting the evaporation capillary structure 2 as a structure that is thin in the middle and thick around the edges, the thinness in the middle of the evaporation capillary structure 2 can reduce the contact thermal resistance and further improve the thermal conductivity; the thickness around the edges of the evaporation capillary structure 2 results in a large contact thermal resistance, and heat is conducted from the high-temperature first middle region 21 to the low-temperature first surrounding region 22, so that the heat absorbed by the first middle region 21 can be quickly diffused to the surrounding area, improving the heat transfer capacity and reducing the temperature difference between the first middle region 21 and the first surrounding region 22, thereby improving the heat transfer efficiency and temperature uniformity of the heat spreader and meeting the high-efficiency heat dissipation requirements of high-power-density electronic devices.

[0026] In one embodiment, such as Figure 5 As shown, the evaporation capillary structure 2 also includes a first surrounding region 22 surrounding the first intermediate region 21. The first intermediate region 21 and the first surrounding region 22 are smoothly connected, and the first intermediate region 21 is concave inward relative to the first surrounding region 22. The first intermediate region 21 is a conical groove or a pyramidal groove. By setting the first intermediate region 21 as a groove of a regular shape, the temperature uniformity is improved. Taking the evaporation capillary structure 2 as a metal powder sintering structure as an example, the first surrounding region 22 is sintered first, and then the first intermediate region 21 is sintered. Optionally, for ease of fabrication, the first surrounding region 22 is divided into a first annular region 221 and a second annular region 222, and the second annular region 222, the first annular region 221, and the first intermediate region 21 are sintered sequentially from the outside to the inside.

[0027] In another embodiment, such as Figure 9As shown, the evaporation capillary structure 2 also includes a first surrounding region 22 surrounding the first intermediate region 21 and a connecting region 23 connecting the first intermediate region 21 and the first surrounding region 22. The first intermediate region 21, the connecting region 23, and the first surrounding region 22 are smoothly connected, and the surfaces of the first intermediate region 21 and the first surrounding region 22 are both planar, while the surface of the connecting region 23 is an inclined surface. The first intermediate region 21 is concave inward relative to the first surrounding region 22. The first intermediate region 21 and the connecting region 23 form a frustum-shaped or truncated pyramidal groove. By setting the first intermediate region 21 as a planar surface and the connecting region 23 smoothly connected, a groove with a regular shape is formed, improving the temperature uniformity performance. The evaporation capillary structure 2 can be configured according to actual needs. For example, the frustum-shaped or truncated pyramidal groove is suitable for larger devices, while the conical or truncated pyramidal groove is suitable for smaller devices.

[0028] The evaporation capillary structure 2 includes a first intermediate region 21 and a first surrounding region 22. The pore size of the first intermediate region 21 is less than or equal to that of the first surrounding region 22. The two regions are independently configured with different pore sizes, forming differentiated capillary pores between the first surrounding region 22 and the first intermediate region 21. This further improves the thermal conductivity of the first intermediate region 21 and reduces the thermal conductivity of the first surrounding region 22, allowing the heat absorbed by the first intermediate region 21 to diffuse rapidly to the surrounding areas, thus enhancing heat transfer capacity. Similarly, when the evaporation capillary structure 2 also includes a connecting region 23, the pore size of the first intermediate region 21 is less than or equal to that of the first surrounding region 22, and the pore size of the connecting region 23 is equal to that of the first surrounding region 22. By setting three independent regions, it is convenient to form a structure of a predetermined shape, and the thermal conductivity of the first intermediate region 21 is optimized, facilitating heat diffusion to the connecting region 23 and the first surrounding region 22, thereby improving heat transfer capacity. By using two or three independently configured regions and different pore sizes and thicknesses, the thermal conductivity is improved by utilizing the principle of molecular diffusion. Experiments show that the thermal conductivity is improved by about 30%, meeting the requirements of low thermal resistance and high power design.

[0029] A second intermediate region 31 is provided in the middle of the condensing capillary structure 3, and the second intermediate region 31 protrudes towards the first intermediate region 21. Due to the large thickness of the capillary structure in the second intermediate region 31, the capillary force is enhanced, making it easier for the liquid working fluid to gather in the second intermediate region 31, increasing the liquid working fluid reflux rate, improving the water return efficiency, and thus improving the continuous liquid replenishment efficiency of the first intermediate region 21.

[0030] The condensing capillary structure 3 also includes a second surrounding region 32 arranged around the second intermediate region 31. The second surrounding region 32 and the second intermediate region 31 are smoothly connected, and the second intermediate region 31 protrudes outward relative to the second surrounding region 32. The first intermediate region 21 corresponds to the second intermediate region 31, and the first surrounding region 22 corresponds to the second surrounding region 32. The second surrounding region 32 is used to reduce the backflow resistance and accelerate the circulation of the liquid working medium to the first surrounding region 22. The capillary force of the second intermediate region 31 is stronger, further reducing the backflow resistance and improving the return water efficiency to the first intermediate region 21. As a result, the backflow speed from the second intermediate region 31 to the first intermediate region 21 is greater than the backflow speed from the second surrounding region 32 to the first surrounding region 22, thereby improving the temperature uniformity effect.

[0031] Optionally, such as Figures 3-6 As shown, the shape of the condensation capillary structure 3 is adapted to the shape of the evaporation capillary structure 2. When the first intermediate region 21 is a conical groove, the second intermediate region 31 is a conical protrusion; when the first intermediate region 21 is a pyramidal groove, the second intermediate region 31 is a pyramidal protrusion.

[0032] Optionally, such as Figures 8-11 As shown, when the first intermediate region 21 and the connecting region 23 are connected to form a frustum-shaped groove, the second surrounding region 32 is divided into a first part 321 and a second part 322. The second part corresponds to the first surrounding region 22, and the first part 321 corresponds to the connecting region 23. The first part 321 and the second intermediate region 31 form a frustum-shaped protrusion. When the first intermediate region 21 and the connecting region 23 form a frustum-shaped groove, the second surrounding region 32 is divided into a first part 321 and a second part 322. The second part corresponds to the first surrounding region 22, and the first part 321 corresponds to the connecting region 23. The first part 321 and the second intermediate region 31 form a frustum-shaped protrusion.

[0033] Furthermore, the cross-sectional area of ​​the second intermediate region 31 is greater than or equal to the cross-sectional area of ​​the first intermediate region 21, ensuring the water return effect of the first intermediate region 21.

[0034] Optionally, for ease of fabrication, the condensation capillary structure 3 is made of the same material, and the capillary pores in each region are identical.

[0035] In one embodiment, such as Figure 4 , Figure 5 and Figure 7 As shown, several guide grooves 41 are arranged circumferentially on the outer side of the capillary column structure 4. The guide grooves 41 are arranged through the first direction. By setting the capillary column structure 4 as an irregular capillary, the guide grooves 41 can play a guiding role, use gravity to accelerate the return speed, and improve the return efficiency. The experiment shows that the return efficiency is improved by about 10%.

[0036] In another embodiment, such as Figure 8 As shown, the outer side of the capillary column structure 4 is a smooth surface, which is simple and easy to manufacture.

[0037] The temperature distribution plate also includes support columns 6. One end of the support column 6 passes through the condensation capillary structure 3 and is supported on the first inner wall 111, while the other end passes through the evaporation capillary structure 2 and is supported on the second inner wall 121, thus improving the overall structural strength. Multiple support columns 6 are provided to further enhance structural strength, and their even distribution improves the support effect. Furthermore, multiple capillary column structures 4 are fitted one-to-one with the multiple support columns 6, ensuring sufficient channels between the capillary column structures 4 to facilitate the rise of the vaporized working fluid and achieve a rational layout.

[0038] The heat spreader also includes several capillary structures 5, radially distributed on the evaporation capillary structure 2. One end of each capillary structure 5 is connected to the outer edge of the first intermediate region 21, and the other end extends to the outer edge of the first surrounding region 22. The capillary structures 5 can achieve heat conduction, transferring heat from the first intermediate region 21 to the first surrounding region 22. For example, as... Figure 8 and Figure 9 As shown, when used in larger devices, the vapor chamber is large, resulting in a significant temperature difference between the first surrounding area 22 and the first central area 21. By setting capillary structures 5, heat is quickly transferred to the connecting area 23 and the first surrounding area 22, improving heat transfer capacity and reducing the temperature difference between the first central area 21 and the connecting area 23, as well as the first surrounding area 22, thereby improving the heat transfer efficiency and temperature uniformity of the vapor chamber. Optionally, multiple capillary structures 5 can be provided, such as in a star-shaped arrangement. The more capillary structures 5 provided, the better the conduction effect. However, the capillary structures 5 occupy internal space, affecting the channel space and thus the efficiency of the steam working fluid rising. The specific arrangement can be determined according to requirements and is not limited. Optionally, the first surrounding area 22 can be arranged in a right-angle shape, with the capillary structures 5 extending to the right angle to maximize their extension to the farthest edge, thus improving the conduction effect.

[0039] From the first intermediate region 21 to the first surrounding region 22, the thickness of the capillary structure 5 gradually increases along the first direction, the conductivity gradually increases, and the temperature uniformity of the connecting region 23 and the first surrounding region 22 is improved.

[0040] Optionally, the capillary structure 5 is generally a rectangular strip, with a first surface 51 and a second surface 52 provided along the first direction. The second surface 52 is attached to the evaporation capillary structure 2 and is adapted to the shape of the connecting region 23 and the first surrounding region 22. The first surface 51 faces the condensation capillary structure 3 and is set as an inclined surface along the edge of the first surrounding region 22 toward the edge of the first middle region 21, thereby gradually increasing the thickness of the capillary structure 5 along the first direction.

[0041] Optionally, the capillary column structure 4 and capillary strip structure 5 can be arranged according to actual needs, with some of the capillary column structures 4 connected to the capillary strip structure 5, or none of the capillary column structures 4 connected to the capillary strip structure 5.

[0042] Optionally, the materials of the evaporation capillary structure 2, the condensation capillary structure 3, the capillary column structure 4, and the capillary strip structure 5 can be the same or different. They can all adopt one of the existing capillary structures, such as metal powder sintered bodies, metal mesh (copper mesh, stainless steel mesh, nickel mesh), fiber sintered bodies (metal fiber, carbon fiber, polymer fiber), porous foam metal, microgrooves, or composite capillary structures of the above structures (e.g., powder and wire mesh composite, groove and fiber composite).

[0043] Taking the evaporation capillary structure 2, condensation capillary structure 3, capillary column structure 4, and capillary strip structure 5 all formed by sintering metal powder as an example, the mesh size of the powder in the condensation capillary structure 3 is smaller than that in the first intermediate region 21 but larger than that in the first surrounding region 22. For example, the mesh size of the powder in the condensation capillary structure 3 ranges from 80 to 150 mesh, the mesh size of the powder in the first intermediate region 21 ranges from 120 to 200 mesh, and the mesh size of the powder in the first surrounding region 22 ranges from 30 to 80 mesh. The mesh sizes of the capillary column structure 4 and the capillary strip structure 5 can be set according to requirements and are not limited. When the capillary structure uses a metal mesh or fiber sintered body, the corresponding process parameters are set according to the above-mentioned powder mesh sizes, which will not be elaborated further.

[0044] Optionally, the shell assembly 1 includes a shell 12 and a cover plate 11. The cover plate 11 has a first inner wall 111, and the shell 12 has a second inner wall 121. A support column 6 (or the two are integrally formed) is pre-welded to the second inner wall 121 of the shell 12. The evaporation capillary structure 2 is sintered on the cover plate 11, and the condensation capillary structure 3 is sintered on the shell 12. A capillary column structure 4 is sintered on the outside of the support column 6. When a capillary strip structure 5 is provided, the capillary strip structure 5 is sintered. The shell 12 and the cover plate 11 are connected by welding or other means, forming an internal space, so that the evaporation capillary structure 2, the condensation capillary structure 3, the support column 6, the capillary column structure 4, and the capillary strip structure 5 are all located in the internal space. A working fluid is introduced, and the water inlet is sealed. The cover plate 11 and the shell 12 are made of materials such as copper, copper alloy, iron, and aluminum. Heat is transferred to the evaporation capillary structure 2 through the cover plate 11.

[0045] An evaporation capillary structure 2 is configured with a first intermediate region 21 and a first surrounding region 22, while a condensation capillary structure 3 is configured with a second intermediate region 31 and a second surrounding region 32. The first intermediate region 21 and the second intermediate region 31 correspond to each other, as do the first surrounding regions 22 and the second surrounding region 32. The first intermediate region 21 has a recessed structure, the second intermediate region 31 has a convex structure, and both the first surrounding regions 22 and the second surrounding region 32 have a flat plate structure. Furthermore, by combining the capillary pore sizes of the first intermediate region 21, the first surrounding region 22, and the condensation capillary structure 3, and through the synergistic effect of the spaced capillary column structures 4 forming channels, the contact thermal resistance of the first intermediate region 21 is reduced, improving evaporation efficiency. Heat is also conducted to the first surrounding region 22, accelerating heat diffusion and enhancing heat transfer capacity. The gaseous working fluid rises from the channels to the condensation capillary structure 3. The condensation capillary structure 3 allows the liquid working fluid to flow back to the evaporation capillary structure 2 via the capillary column structure 4, achieving path separation between the vapor and liquid working fluids and improving the working fluid circulation efficiency. The protruding second intermediate region 31 collects the liquid working fluid, accelerating the circulation of the liquid working fluid in the first intermediate region 21. The circulation speed of the working fluid in the first intermediate region 21 and the second intermediate region 31 is greater than that in the first and second surrounding regions 22 and 32. In addition, by setting the irregularly shaped capillary column structure 4, such as the guide channel 41, the liquid working fluid is further guided, improving the reflux efficiency. By setting the capillary strip structure 5, the heat of the first intermediate region 21 is conducted to the first surrounding region 22 for auxiliary heat dissipation. In summary, the heat conduction efficiency of the heat spreader is improved by about 50% compared with the conventional process. The specific combination design can be tailored to different application scenarios and is not limited.

[0046] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A heat spreader, characterized in that, The housing assembly includes a first inner wall and a second inner wall disposed opposite each other along a first direction; the housing assembly contains: An evaporation capillary structure is provided on the first inner wall, and a first intermediate region is provided at the middle position of the evaporation capillary structure, and the first intermediate region is recessed towards the first inner wall. A condensation capillary structure is disposed on the second inner wall and spaced apart from the condensation capillary structure. Multiple capillary columns are arranged at intervals, with one end connected to the condensation capillary structure and the other end connected to the evaporation capillary structure.

2. The temperature distribution plate according to claim 1, characterized in that, The evaporation capillary structure further includes a first surrounding region encircling the first intermediate region, wherein the first intermediate region and the first surrounding region are smoothly connected, and the first intermediate region is concave inward relative to the first surrounding region, and the first intermediate region is a conical groove or a pyramidal groove; and / or, the evaporation capillary structure further includes a first surrounding region encircling the first intermediate region and a connecting region connecting the first intermediate region and the first surrounding region, wherein the first intermediate region, the connecting region and the first surrounding region are smoothly connected, and the surfaces of the first intermediate region and the first surrounding region are both planar, the surface of the connecting region is an inclined surface, and the first intermediate region is concave inward relative to the first surrounding region; the first intermediate region and the connecting region form a frustum-shaped groove or a frustum-shaped groove.

3. The temperature distribution plate according to claim 2, characterized in that, The evaporation capillary structure includes a first intermediate region and a first surrounding region, wherein the pore size of the first intermediate region is less than or equal to the pore size of the first surrounding region; and / or, the evaporation capillary structure further includes a connecting region, wherein the pore size of the connecting region is equal to the pore size of the first surrounding region.

4. The temperature distribution plate according to claim 2, characterized in that, It also includes several capillary structures that are radially distributed, with one end of each capillary structure connected to the outer edge of the first intermediate region and the other end extending to the outer edge of the first surrounding region.

5. The temperature distribution plate according to claim 4, characterized in that, The thickness of the capillary structure gradually increases along the first direction from the first central region to the first surrounding region.

6. The temperature distribution plate according to claim 1, characterized in that, The outer side of the capillary column structure has a plurality of flow guide grooves arranged circumferentially, and the flow guide grooves are arranged through the first direction; and / or, the outer side of the capillary column structure is a smooth surface.

7. The temperature distribution plate according to claim 1, characterized in that, It also includes a support column, one end of which passes through the condensation capillary structure and is supported on the first inner wall, and the other end of which passes through the evaporation capillary structure and is supported on the second inner wall.

8. The temperature distribution plate according to claim 7, characterized in that, The support column is provided in multiple ways, and the multiple capillary column structures are fitted onto the multiple support columns in a one-to-one correspondence.

9. The temperature distribution plate according to claim 1, characterized in that, The condensation capillary structure has a second intermediate region at its middle position, and the second intermediate region protrudes toward the first intermediate region.

10. The temperature distribution plate according to claim 9, characterized in that, The condensation capillary structure further includes a second surrounding region surrounding the second intermediate region, the second surrounding region and the second intermediate region being smoothly connected, and the second intermediate region protruding outward relative to the second surrounding region; and / or, the second intermediate region is a frustum-shaped protrusion, a cone-shaped protrusion, a frustum-shaped pyramidal protrusion, or a pyramidal protrusion.

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