A pin adjustment device for integrated circuit manufacturing

Abstract

This invention discloses a pin adjustment device for integrated circuit manufacturing, relating to the field of semiconductor processing equipment technology. The pin adjustment device for integrated circuit manufacturing includes a base, a C-shaped toothed rail fixedly connected to the top of the base, a suspension bracket fixedly connected to the outer surface of the C-shaped toothed rail, a toothed plate fixedly connected to the top of the inner wall of the C-shaped toothed rail, and a stabilizing and moving mechanism slidably connected inside the C-shaped toothed rail. The stabilizing and moving mechanism includes an adsorption slide, which comprises a slide body slidably connected to the bottom of the inner wall of the C-shaped toothed rail. This pin adjustment device for integrated circuit manufacturing, by incorporating a stabilizing and moving mechanism, a progressive adjustment mechanism, and a stabilizing auxiliary mechanism, optimizes the amount of motion of the device, improves the adsorption and fixation effect on the chip, helps improve the adjustment accuracy and lifespan of the device, and increases the processing efficiency of the device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment technology, specifically to a pin adjustment device for integrated circuit manufacturing. Background Technology

[0002] Pins, also called traces, are the wiring that leads from the internal circuitry of a chip to the external circuitry. All the pins together form the interface of the chip. The end of the lead is soldered to the pads on the printed circuit board to form a solder joint.

[0003] Patent application CN215869298U discloses a pin adjustment device for integrated circuit manufacturing, including a base, a processing table and a support seat on the top outer surface of the base, a support plate on the front outer surface of the support seat, two sets of cylinder boxes on the top outer surface of the support plate, a cylinder rod on the bottom outer surface of the support plate, and a fixing mechanism on the base.

[0004] The pin adjustment device provided by this patent will have an increased error after repeated adjustment over a long period of time, which will reduce the adjustment accuracy of the device and ultimately lead to a decrease in the yield of integrated circuits. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the present invention provides a pin adjustment device for integrated circuit manufacturing to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solution: a pin adjustment device for integrated circuit manufacturing, comprising a base, a C-shaped toothed rail fixedly connected to the top of the base, a suspension bracket fixedly connected to the outer surface of the C-shaped toothed rail, a toothed plate fixedly connected to the top of the inner wall of the C-shaped toothed rail, and a stabilizing moving mechanism slidably connected inside the C-shaped toothed rail.

[0007] The stabilizing movement mechanism includes:

[0008] An adsorption slide includes a slide body slidably connected to the bottom of the inner wall of a C-shaped toothed rail. The top of the slide body has a circular through hole, and the bottom of the slide body is connected to an external air extraction device. An elastic perforated ring is fixedly connected to the top of the circular through hole of the slide body, and an isolation mesh plate is fixedly connected to the inner side of the outer surface of the elastic perforated ring.

[0009] Side clamp, the side clamp is slidably connected to the top of the slide body, and the side clamp is fixedly connected to the top of the slide body by a push-pull electromagnet;

[0010] The pre-cleaning component includes an air jet pipe connected to the front of the slide body, a split pipe connected to the bottom of the air jet pipe, the air jet pipe and the split pipe being connected, and the bottom of the split pipe being connected to an external air pump.

[0011] Preferably, the left and right sides of the slide body are rotatably connected to transmission teeth, the outer surface of the transmission teeth meshes with the tooth plate at the top of the inner wall of the C-shaped toothed rail, one end of the transmission teeth is fixedly connected to a servo motor, the servo motor is fixedly connected to the left and right sides of the slide body, the servo motor is electrically connected to an external control device, and the left and right sides of the slide body are rotatably connected to a ranging sensor array, the ranging sensor array including a laser ranging sensor, the ranging sensor array is electrically connected to an external control device through wires.

[0012] Preferably, a vibrating scraper is fixedly connected to the front of the slide body, and an inclined scraper is fixedly connected to the top of the vibrating scraper. The inclined scraper is made of rubber, and a vibrating motor is embedded inside the vibrating scraper. The vibrating motor is connected to an external control device through a wire.

[0013] Preferably, a progressive adjustment mechanism is fixedly connected to the top of the C-shaped toothed rail. The progressive adjustment mechanism includes an inclined straightening plate rotatably connected to the top of the C-shaped toothed rail. A heated pressing plate is rotatably connected to the back of the inclined straightening plate. The heated pressing plate includes a heating plate body slidably connected to the top of the C-shaped toothed rail. A heating plate is embedded on the left side of the heating plate body. The heating plate is connected to an external control device through a wire. A long connecting rod is rotatably connected to the bottom of the heating plate body.

[0014] Preferably, the top of the C-shaped toothed rail has a circular through hole, and the back of the inclined straightening plate is rotatably connected to a shaping pressure plate. The shaping pressure plate is located to the left of the heated pressure plate. The shaping pressure plate includes an open plate body slidably connected to the top of the C-shaped toothed rail. A rectangular blind hole is opened on the right side of the open plate body. An action plate is connected inside the rectangular blind hole of the open plate body. A shaping hot knife is fixedly connected to the right side of the action plate body by bolts. A horizontal hook-shaped blind hole is opened at the top of the rectangular blind hole of the action plate body. The bottom of the hook-shaped blind hole communicates with the top of the rectangular blind hole of the action plate body. The hook-shaped blind hole is filled with hydraulic oil. A hydraulic pressure limiting block is slidably connected inside the hook-shaped blind hole of the action plate body. The hydraulic pressure limiting block has a C-shaped cross-section. A short connecting rod is rotatably connected to the bottom of the open plate body.

[0015] Preferably, a magnetic plate is fixedly connected to the left side of the motion slide via a cylindrical rod, and the magnetic plate is fixedly connected to the left side of the motion slide via a spring. A square electromagnet is fixedly connected to the left side of the motion slide. An electric heating tube is embedded inside the shaping hot knife. The other end of the hydraulic limit block and the short connecting rod are fixedly connected to the motor of the drive motor via connecting rods. The motor of the drive motor is a servo motor, and the drive motor is fixedly connected to the left and right sides of the C-shaped toothed rail.

[0016] Preferably, a stabilizing auxiliary mechanism is slidably connected to the top of the inner wall of the suspension frame. The stabilizing auxiliary mechanism includes a slide plate slidably connected to the top of the inner wall of the suspension frame. The top of the slide plate is fixedly connected to the top of the inner wall of the suspension frame by a spring. An upper scraper is fixedly connected to the bottom of the slide plate. A lower nozzle is connected to the bottom of the slide plate through a vent pipe. The lower nozzle is located at the top of the C-shaped toothed rail. The back of the slide plate is connected to an external air pump device. A vibration generating rod is fixedly connected to the bottom of the slide plate. An ultrasonic vibration rod is embedded inside the vibration generating rod.

[0017] Preferably, a reversing discharge mechanism is fixedly connected to the back of the C-shaped toothed rail. The reversing discharge mechanism includes a fixed plate fixedly connected to the back of the C-shaped toothed rail. A whistle-shaped arm is rotatably connected to the back of the fixed plate. A servo motor is fixedly connected to the right side of the whistle-shaped arm. The servo motor is fixedly connected to the right side of the fixed plate. An adsorption suction cup is connected to the bottom of the whistle-shaped arm. The top of the adsorption suction cup is connected to an external air extraction device.

[0018] This invention provides a pin adjustment device for integrated circuit manufacturing. It has the following advantages:

[0019] 1. This pin adjustment device for integrated circuit manufacturing, by setting a stable moving mechanism, through the cooperation of the slide body, elastic hole ring and isolation mesh plate, allows the slide body to make fuller contact with the bottom of the chip, thereby improving the adsorption and fixation effect of the device on the chip. By using the adsorption slide body in conjunction with the pre-cleaning component, the bottom of the chip is cleaned as the chip enters the top of the slide body, preventing impurities from interfering with the adsorption and fixation process, further improving the fixation stability of the device and assisting in improving the adjustment accuracy of the device.

[0020] 2. This pin adjustment device for integrated circuit manufacturing, by setting a progressive adjustment mechanism, uses an inclined straightening plate in conjunction with a heating and shaping pressure plate to passively pre-adjust the pins before formal adjustment, optimizing the device's action amount, and helping to improve the device's service life and adjustment accuracy. By using the heating and shaping pressure plate in conjunction with the shaping pressure plate, the pins are heated and adjusted while the pin length is shaped and adjusted, further improving the product quality of the chip.

[0021] 3. This pin adjustment device for integrated circuit manufacturing, by setting a progressive adjustment mechanism and cooperating with a ranging sensor array, enables the device to adapt to chips of different sizes, and at the same time achieves precise adjustment of the heating pressure plate and the shaping pressure plate, thereby improving the adjustment accuracy of the device.

[0022] 4. This pin adjustment device for integrated circuit manufacturing, by setting a stabilizing auxiliary mechanism, utilizes a sliding plate frame in conjunction with a scraper and a stabilizing moving mechanism to further stabilize and fix the chip while removing small impurities from the chip's surface, improving the stability and reliability of the subsequent reverse discharge mechanism in removing the chip, and thus enhancing the processing efficiency of the device. The sliding plate, in conjunction with a lower nozzle and a progressive adjustment mechanism, cleans up debris after pin length trimming and adjustment, preventing debris from causing jamming in the progressive adjustment mechanism, further improving the processing efficiency of the device. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the overall structure of the top of the C-shaped toothed rail of the present invention;

[0025] Figure 3 This is a schematic diagram showing the positional relationship between the C-shaped toothed track and the adsorption slide of the present invention;

[0026] Figure 4 This is a schematic diagram of the overall structure of the adsorption slide of the present invention;

[0027] Figure 5 For the present invention Figure 4 Enlarged schematic diagram of the structure at point A in the diagram;

[0028] Figure 6 For the present invention Figure 2 Enlarged schematic diagram of the structure at point B in the diagram;

[0029] Figure 7 This is a schematic diagram of the overall structure of the progressive adjustment mechanism of the present invention;

[0030] Figure 8 This is a schematic diagram of the overall structure of the shaping and pressing plate of the present invention;

[0031] Figure 9 This is a cross-sectional schematic diagram of the internal structure of the shaping and pressing plate of the present invention;

[0032] Figure 10 This is a schematic diagram of the overall front structure of the present invention;

[0033] Figure 11 This is a schematic diagram of the internal structure of the suspension frame of the present invention;

[0034] Figure 12 This is a schematic diagram of the overall structure of the reverse discharge mechanism of the present invention.

[0035] In the diagram: 1. Base; 2. C-shaped toothed rail; 3. Suspension bracket; 4. Stabilizing and moving mechanism; 41. Adsorption slide; 411. Slide body; 412. Elastic perforated ring; 413. Isolation mesh plate; 414. Transmission gear; 415. Distance sensor array; 42. Side clamp; 43. Pre-cleaning assembly; 431. Air jet pipe; 432. Diverter pipe; 433. Vibrating scraper; 5. Progressive adjustment mechanism; 51. Inclined correction plate; 52. Heated sliding plate. 521. Heating plate; 522. Long connecting rod; 53. Shaping and pressing plate; 531. Perforated plate; 532. Action plate; 533. Shaping hot knife; 534. Hydraulic limit block; 535. Short connecting rod; 54. Drive motor; 6. Stabilizing auxiliary mechanism; 61. Slide plate; 62. Upper scraper; 63. Lower nozzle; 64. Vibration generating rod; 7. Reverse discharge mechanism; 71. Fixed plate; 72. Whistle-shaped arm; 73. Adsorption suction cup. Detailed Implementation

[0036] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0037] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.

[0038] Example 1

[0039] Please see Figure 1-5 The present invention provides a technical solution: a pin adjustment device for integrated circuit manufacturing, including a base 1, a C-shaped toothed rail 2 fixedly connected to the top of the base 1, the front of the C-shaped toothed rail 2 communicating with the chip conveying mechanism, a suspension bracket 3 fixedly connected to the outer surface of the C-shaped toothed rail 2, and a toothed plate fixedly connected to the top of the inner wall of the C-shaped toothed rail 2.

[0040] In existing technologies, chips are typically fixed and moved using negative pressure adsorption. However, the surface of the produced chips may be covered with tiny impurities. These impurities can affect the seal between the adsorption structure and the chip surface, impacting the adsorption effect and consequently affecting the processing flow and overall efficiency. Therefore, a stabilizing and moving mechanism 4 is slidably connected inside the C-shaped toothed rail 2. The stabilizing and moving mechanism 4 includes:

[0041] The adsorption slide 41 includes a slide body 411 slidably connected to the bottom of the inner wall of the C-shaped toothed rail 2. A circular through hole is opened at the top of the slide body 411, and the bottom of the slide body 411 communicates with an external air extraction device. An elastic perforated ring 412 is fixedly connected to the top of the circular through hole of the slide body 411. An isolation mesh plate 413 is fixedly connected to the inner side of the outer surface of the elastic perforated ring 412 to prevent impurities from entering the circular through hole of the slide body 411 and causing blockage. Rotatably connected to both the left and right sides of the slide body 411 are... The transmission gear 414 has an outer surface that meshes with the toothed plate on the top of the inner wall of the C-shaped toothed rail 2. One end of the transmission gear 414 is fixedly connected to a servo motor, which is fixedly connected to the left and right sides of the slide body 411. The servo motor is electrically connected to an external control device. Both sides of the slide body 411 are rotatably connected to a ranging sensor array 415, which includes a laser ranging sensor. The ranging sensor array 415 is electrically connected to an external control device through wires.

[0042] Side clamp 42 is slidably connected to the top of slide body 411, and the side clamp 42 is fixedly connected to the top of slide body 411 by a push-pull electromagnet.

[0043] The pre-cleaning component 43 includes an air jet pipe 431 connected to the front of the slide body 411, a diverter pipe 432 connected to the bottom of the air jet pipe 431, the air jet pipe 431 and the diverter pipe 432 connected, the bottom of the diverter pipe 432 connected to an external air pump, a vibrating scraper 433 fixedly connected to the front of the slide body 411, an inclined scraper fixedly connected to the top of the vibrating scraper 433, the inclined scraper is made of rubber, a vibrating motor is embedded inside the vibrating scraper 433, and the vibrating motor is connected to an external control device through a wire.

[0044] In use, the chip is fed into the top of the slide body 411 from the conveying device on the front of the C-shaped toothed rail 2. During the feeding process, the bottom of the chip passes through the air jet pipe 431 and the vibrating scraper 433 in sequence. The air jet pipe 431 blows high-speed airflow to the bottom of the chip to clean it. The vibrating scraper 433 removes residual impurities from the bottom of the chip through the combined action of mechanical scraping and vibration generated by the vibrating motor. After cleaning, the bottom of the chip is in complete contact with the top of the slide body 411. At this time, the control device starts the air extraction device, forming a negative pressure inside the circular through hole of the slide body 411. Under the action of the negative pressure, the bottom of the chip is in complete contact with the top of the elastic hole ring 412. The elastic hole ring 412 slides and clamps the bottom of the chip under the action of the push-pull electromagnet, thereby achieving a stable fixation of the chip.

[0045] Example 2

[0046] Please see Figure 1-9Based on Embodiment 1, the present invention provides a technical solution: the chip pin length after processing may have deviation, and the chip pin may have lateral deviation at different angles. It is necessary to correct the length deviation and lateral deviation to improve the yield of the chip. For this purpose, a progressive adjustment mechanism 5 is fixedly connected to the top of the C-shaped toothed rail 2. The progressive adjustment mechanism 5 includes an inclined correction plate 51 rotatably connected to the top of the C-shaped toothed rail 2. A heating pressure plate 52 is rotatably connected to the back of the inclined correction plate 51. The heating pressure plate 52 includes a heating plate body 521 slidably connected to the top of the C-shaped toothed rail 2. A heating plate is embedded on the left side of the heating plate body 521. The heating plate is connected to an external control device through a wire. A long connecting rod 522 is rotatably connected to the bottom of the heating plate body 521.

[0047] A shaping pressure plate 53 is rotatably connected to the back of the inclined straightening plate 51. The shaping pressure plate 53 is located to the left of the heated pressure plate 52. The shaping pressure plate 53 includes an open plate 531 slidably connected to the top of the C-shaped toothed rail 2. A rectangular blind hole is provided on the right side of the open plate 531. An actuating plate 532 is connected inside the rectangular blind hole of the open plate 531. A magnetic plate is fixedly connected to the left side of the actuating plate 532 by a cylindrical rod. The magnetic plate is fixedly connected to the left side of the actuating plate 532 by a spring. A square electromagnet is fixedly connected to the left side of the actuating plate 532. A shaping hot knife 533 is fixedly connected to the right side of the actuating plate 532 by bolts. The top of the rectangular blind hole of the motion slide 532 is provided with a horizontal hook-shaped blind hole. The bottom of the hook-shaped blind hole is connected to the top of the rectangular blind hole of the motion slide 532. The hook-shaped blind hole is filled with hydraulic oil. A hydraulic pressure limiting block 534 is slidably connected inside the hook-shaped blind hole of the motion slide 532. The hydraulic pressure limiting block 534 has a C-shaped cross section. A short connecting rod 535 is rotatably connected to the bottom of the perforated plate 531. The other end of the hydraulic pressure limiting block 534 and the short connecting rod 535 are fixedly connected to the motor of the drive motor 54 through the connecting rod. The motor of the drive motor 54 is a servo motor. The drive motor 54 is fixedly connected to the left and right sides of the C-shaped toothed rail 2.

[0048] In use, according to the pin length, the shaping hot knife 533 is installed in the corresponding hole of the action slide plate 532 with bolts before processing to accurately shape the pin length. During the fixing process of Embodiment 1, the transmission gear 414 rotates, driving the adsorption slide 41 to slide backward. When the pin passes the inclined correction plate 51, the partially deviated pin contacts the inclined correction plate 51 and is partially corrected by the inclined correction plate 51. When the pin enters the area between the heating pressure slide plate 52 and the shaping pressure slide plate 53, the adsorption slide plate 41 stops moving, and the motor of the drive motor 54 drives the heating pressure slide plate 52 and the shaping pressure slide plate 53 to slide towards the pin. During this process, the ranging sensor array 415 monitors the distance from the shaping pressure slide plate 53 to the ranging sensor array 415 in real time. The distance data is fed back to the control device, which assists the control device in adjusting the position of the heating plate 52 and the shaping plate 53. When the heating plate 521 and the opening plate 531 are in full contact with the pin, the pin is clamped and corrected. At this time, the heating plate of the heating plate 521 and the heating tube inside the shaping hot knife 533 are energized and heated. Part of the heat is transferred to the surface of the pin to promote the pin temperature rise, and the other part is transferred to the surface of the opening plate 531. The hydraulic oil inside the opening plate 531 expands due to heat and lifts the hydraulic pressure limit block 534. After the hydraulic pressure limit block 534 is lifted, the constraint of the hydraulic pressure limit block 534 on the action plate 532 is released. Under the action of the spring, the action plate 532 drives the shaping hot knife 533 to slide towards the pin and cut the excess length of the pin.

[0049] Example 3

[0050] Please see Figure 1-12 Based on Embodiment 1 and Embodiment 2, the present invention provides a technical solution: If the debris generated during the adjustment and correction of the pin length is not cleaned up in time, it will affect the smoothness of the device's operation over time, and thus affect the processing accuracy of the device. Therefore, a stabilizing auxiliary mechanism 6 is slidably connected to the top of the inner wall of the suspension frame 3. The stabilizing auxiliary mechanism 6 includes a slide plate 61 slidably connected to the top of the inner wall of the suspension frame 3. The top of the slide plate 61 is fixedly connected to the top of the inner wall of the suspension frame 3 by a spring. An upper scraper 62 is fixedly connected to the bottom of the slide plate 61. A lower nozzle 63 is connected to the bottom of the slide plate 61 through a vent pipe. The lower nozzle 63 is located at the top of the C-shaped toothed rail 2. The back of the slide plate 61 is connected to an external air pump device. A vibration generating rod 64 is fixedly connected to the bottom of the slide plate 61. An ultrasonic vibration rod is embedded inside the vibration generating rod 64.

[0051] A reversing discharge mechanism 7 is fixedly connected to the back of the C-shaped toothed rail 2. The reversing discharge mechanism 7 includes a fixed plate 71 fixedly connected to the back of the C-shaped toothed rail 2. A whistling arm 72 is rotatably connected to the back of the fixed plate 71. A servo motor is fixedly connected to the right side of the whistling arm 72. The servo motor is fixedly connected to the right side of the fixed plate 71. An adsorption suction cup 73 is connected to the bottom of the whistling arm 72. The top of the adsorption suction cup 73 is connected to an external air extraction device.

[0052] In use, after completing the shaping process of Example 2, the progressive adjustment mechanism 5 is reset, and the adsorption slide 41 drives the chip to continue to move backward. At this time, the top of the chip contacts the bottom of the upper scraper 62. The mechanical scraping of the upper scraper 62, combined with the high-frequency vibration generated by the vibration generator 64, removes the small impurities remaining on the top of the chip. Then, the adsorption slide 41 moves to the extreme position on the back of the C-shaped toothed rail 2. At this time, the chip is located at the bottom of the adsorption suction cup 73 and the top of the chip is completely attached to the bottom of the adsorption suction cup 73. At this time, the air extraction device is started, and the adsorption suction cup 73 forms a negative pressure by air extraction. At the same time, the adsorption slide 41 releases the adsorption effect on the chip. Then, the servo motor drives the whistle arm 72 to rotate, and the whistle arm 72 drives the chip to flip through the adsorption suction cup 73, completing the chip discharge process.

[0053] During the movement of the adsorption slide 41, the air pump exhausts air into the slide plate 61. The high-speed airflow blows onto the surface of the progressive adjustment mechanism 5 through the lower nozzle 63, blowing away the debris generated by the correction pin length remaining on the top of the progressive adjustment mechanism 5 and the C-shaped toothed rail 2. The debris falls into the interior of the C-shaped toothed rail 2 through the through hole on the top of the C-shaped toothed rail 2 for recycling.

[0054] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A pin adjustment device for integrated circuit manufacturing, comprising a base (1), wherein a C-shaped toothed rail (2) is fixedly connected to the top of the base (1), and a suspension bracket (3) is fixedly connected to the outer surface of the C-shaped toothed rail (2), characterized in that: A toothed plate is fixedly connected to the top of the inner wall of the C-shaped toothed rail (2), and a stable moving mechanism (4) is slidably connected inside the C-shaped toothed rail (2). The stabilizing and moving mechanism (4) includes: Adsorption slide (41), the adsorption slide (41) includes a slide body (411) slidably connected to the bottom of the inner wall of the C-shaped toothed rail (2), the top of the slide body (411) is provided with a circular through hole, the bottom of the slide body (411) is connected to an external air extraction device, and an elastic hole ring (412) is fixedly connected to the top of the circular through hole of the slide body (411). The pre-cleaning component (43) includes an air jet pipe (431) connected to the front of the slide body (411), and a split pipe (432) connected to the bottom of the air jet pipe (431). The air jet pipe (431) and the split pipe (432) are connected, and the bottom of the split pipe (432) is connected to an external air pump.

2. The pin adjustment device for integrated circuit manufacturing according to claim 1, characterized in that: An isolation mesh plate (413) is fixedly connected to the inner side of the outer surface of the elastic hole ring (412). A transmission tooth (414) is rotatably connected to both sides of the slide body (411). The outer surface of the transmission tooth (414) meshes with the tooth plate at the top of the inner wall of the C-shaped toothed rail (2). A servo motor is fixedly connected to one end of the transmission tooth (414). The servo motor is fixedly connected to both sides of the slide body (411). A ranging sensor array (415) is rotatably connected to both sides of the slide body (411). The ranging sensor array (415) includes a laser ranging sensor.

3. The pin adjustment device for integrated circuit manufacturing according to claim 2, characterized in that: The top of the slide body (411) is slidably connected to a side clamp (42), and the side clamp (42) is fixedly connected to the top of the slide body (411) by a push-pull electromagnet. The front of the slide body (411) is fixedly connected to a vibrating scraper (433), and a vibrating motor is embedded inside the vibrating scraper (433).

4. The pin adjustment device for integrated circuit manufacturing according to claim 1, characterized in that: The top of the C-shaped toothed rail (2) is fixedly connected to a progressive adjustment mechanism (5). The progressive adjustment mechanism (5) includes an inclined straightening plate (51) rotatably connected to the top of the C-shaped toothed rail (2). The back of the inclined straightening plate (51) is rotatably connected to a heating pressure plate (52). The heating pressure plate (52) includes a heating plate body (521) slidably connected to the top of the C-shaped toothed rail (2). A heating plate is embedded on the left side of the heating plate body (521).

5. A pin adjustment device for integrated circuit manufacturing according to claim 4, characterized in that: The top of the C-shaped toothed rail (2) has a circular through hole. The back of the inclined straightening plate (51) is rotatably connected to the shaping pressure plate (53). The shaping pressure plate (53) is located to the left of the heating pressure plate (52). The shaping pressure plate (53) includes an open plate body (531) slidably connected to the top of the C-shaped toothed rail (2). The right side of the open plate body (531) has a rectangular blind hole. The inside of the rectangular blind hole of the open plate body (531) is connected to the motion plate (532). The right side of the motion plate (532) is fixedly connected to the shaping hot knife (533) by bolts.

6. A pin adjustment device for integrated circuit manufacturing according to claim 5, characterized in that: The top of the rectangular blind hole of the motion slide (532) is provided with a horizontal hook-shaped blind hole. The bottom of the hook-shaped blind hole is connected to the top of the rectangular blind hole of the motion slide (532). A hydraulic limit block (534) is slidably connected inside the hook-shaped blind hole of the motion slide (532). The cross-section of the hydraulic limit block (534) is C-shaped. A short connecting rod (535) is rotatably connected to the bottom of the perforated plate (531).

7. A pin adjustment device for integrated circuit manufacturing according to claim 6, characterized in that: The other end of the hydraulic limit block (534) and the short connecting rod (535) are fixedly connected to the motor of the drive motor (54) through the connecting rod. The motor of the drive motor (54) is a servo motor. The drive motor (54) is fixedly connected to the left and right sides of the C-shaped toothed rail (2).

8. A pin adjustment device for integrated circuit manufacturing according to claim 1, characterized in that: A stabilizing auxiliary mechanism (6) is slidably connected to the top of the inner wall of the suspension frame (3). The stabilizing auxiliary mechanism (6) includes a slide plate (61) slidably connected to the top of the inner wall of the suspension frame (3). An upper scraper (62) is fixedly connected to the bottom of the slide plate (61). A lower nozzle (63) is connected to the bottom of the slide plate (61) through a vent pipe. The lower nozzle (63) is located at the top of the C-shaped toothed rail (2). A vibration generating rod (64) is fixedly connected to the bottom of the slide plate (61). An ultrasonic vibration rod is embedded inside the vibration generating rod (64).

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