An electronic skin having blackened metal mesh conductors and a method of making the same

Abstract

This invention relates to the technical field of electronic device manufacturing, specifically to an electronic skin with a blackened metal mesh conductor and its preparation method. The electronic skin, from the substrate side to the outer side, comprises: a flexible adhesion layer, a flexible base layer, a metal mesh conductive layer, a blackened functional layer, a flexible buffer layer, a corrosion-resistant encapsulation layer, and a hydrophobic and wear-resistant surface layer. The electronic skin of this invention, through a seven-layer gradient composite structure design, achieves synergistic cooperation among the functions of each layer, significantly improving overall flexibility and structural stability, with no interlayer peeling or cracking during deformation. The design of the blackened functional layer retains the high conductivity of the metal mesh conductive layer while achieving low reflectivity and anti-light interference effects, adapting to the application requirements of multiple optical scenarios, and simultaneously improving the oxidation resistance of the metal mesh. Each functional layer has a clear division of labor and is closely integrated, making the overall device suitable for large-scale fabrication and possessing good practical application value.

Description

Technical Field

[0001] This invention relates to the technical field of electronic device manufacturing, specifically to an electronic skin with a blackened metal mesh conductor and its preparation method. Background Technology

[0002] Electronic skin, as a core component in the field of flexible electronics, is widely used in human-computer interaction, soft robotics, wearable monitoring, and other scenarios. It places stringent requirements on the conductivity, flexibility, and anti-interference properties of its conductive layer. Existing electronic skins mostly use pure metal meshes as the conductive layer. While these possess good conductivity and flexibility, their high surface reflectivity makes them susceptible to interference from optical equipment, hindering their suitability for applications requiring tactile and visual integration. Furthermore, the metal mesh is prone to oxidation, affecting the device's lifespan. Simultaneously, the layered structure design of traditional electronic skins often suffers from poor mechanical compatibility, leading to interlayer delamination and functional layer cracking during deformation. Overall structural stability and durability require improvement. Summary of the Invention

[0003] The purpose of this invention is to provide an electronic skin with a blackened metal mesh conductor and a method for preparing the same, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: an electronic skin with a blackened metal mesh conductor, comprising: A flexible adhesive layer is used to tightly and reversibly attach electronic skin to the substrate; The flexible substrate layer, as a flexible support framework for electronic skin, provides high tensile strength, high resilience, and fatigue resistance, supports subsequent functional layers, and avoids interlayer delamination and overall cracking during deformation. The metal mesh conductive layer is used to convert and transmit physical signals into electrical signals, while providing a uniform and firm adhesion substrate for the blackened functional layer, taking into account both high conductivity and flexible fatigue resistance. The blackened functional layer is used to achieve high resistance to light interference, low reflectivity, and visual stealth in electronic skin, while also improving the oxidation resistance of the metal mesh conductive layer. The flexible buffer layer alleviates interlayer stress during the deformation of the electronic skin, prevents cracking and peeling of the blackened functional layer and the corrosion-resistant encapsulation layer due to mechanical mismatch, and further improves the flexibility and fatigue resistance of the overall structure. The corrosion-resistant encapsulation layer seals and protects the internal metal mesh conductive layer and blackened functional layer, isolating them from air, moisture, and acid and alkali media, preventing the metal mesh from oxidizing and the blackened layer from failing. At the same time, it is flexible and does not affect the overall deformation performance, thus improving the environmental tolerance and durability of the electronic skin. The hydrophobic and wear-resistant surface layer is the outermost protective layer of the electronic skin, achieving the functions of hydrophobicity, anti-fouling, and wear resistance. It prevents external dust, liquids, and scratches from damaging the internal structure, further improving the service life and practical application adaptability of the electronic skin, while retaining flexibility. The overall thickness of the electronic skin is no more than 60 μm.

[0005] Preferably, the surface of the flexible adhesive layer has a micro-nano porous structure, which increases the contact area with the substrate.

[0006] Preferably, the flexible substrate has a non-porous dense thin film structure with an internal interpenetrating network phase structure.

[0007] Preferably, the conductive metal mesh layer is a silver-copper alloy mesh, and the mesh is a biomimetic regular hexagonal honeycomb array with rounded transitions at the nodes to avoid stress concentration during deformation that could lead to mesh breakage.

[0008] Preferably, the grid line width is 8-15μm, the grid spacing is 80-150μm, and the overall duty cycle is 15%-20%, maximizing flexibility while ensuring conductivity; the grid surface has a micro-nano rough structure with a roughness Ra=0.2-0.5μm, increasing the contact area with the blackened functional layer, improving interlayer bonding, and preventing the blackened layer from falling off; the grid thickness is 1-3μm, and an electroplating thickening process is used to ensure the mechanical stability of the conductive layer.

[0009] Preferably, the blackening functional layer is based on CuO-Ag2O composite oxide grown in situ on the surface of the metal mesh, loaded with 5-8wt% multi-walled carbon nanotubes with a diameter of 20-30nm and a length of 1-2μm, forming a blackening layer with high light absorption and low reflectivity, no conductive loss, and no impact on the electrical signal transmission of the metal mesh.

[0010] Preferably, the flexible buffer layer has a closed-cell microbubble structure with a bubble diameter of 1-5 μm and a uniform and disordered distribution. The microbubble structure can be compressed and rebounded during deformation, effectively absorbing and dispersing interlayer stress. The flexible buffer layer has a thickness of 5-8 μm, and its low modulus characteristics ensure overall flexibility. When the elongation is ≤200%, the microbubble structure does not break, and the interlayer stress buffering rate is ≥60%.

[0011] Preferably, the corrosion-resistant encapsulation layer is a non-porous, dense thin film structure with a thickness of 8-12 μm and a smooth surface. It is embedded with the microbubble structure surface of the flexible buffer layer, providing a seal without dead corners, and effectively blocking water vapor and oxygen.

[0012] Preferably, the hydrophobic and wear-resistant surface layer has a micro-nano lotus leaf-shaped protrusion structure to achieve a superhydrophobic effect, with a water contact angle ≥135° and a roll-off angle ≤10°; the thickness of the hydrophobic and wear-resistant surface layer is 2-4μm, thin and flexible, and no cracking occurs when the elongation is ≤150%.

[0013] A method for preparing an electronic skin includes the following steps: S1: Prepare a flexible substrate layer, activate the surface, cast and cure to form a flexible substrate layer, double-sided activation to improve interlayer bonding; S2: Composite flexible adhesive layer, forming an inner double-layer structure, hot-pressed composite flexible adhesive layer and base layer to form inner support; S3: Prepare a metal mesh conductive layer, integrally molded on the substrate layer, and form the metal mesh by photolithography and electroplating, which is then integrated with the substrate layer. S4: Prepare a blackening functional layer, coat it with a metal mesh conductive layer, and perform in-situ oxidation combined with carbon nanotube loading to form a blackening functional layer; S5: Layer by layer composite buffer layer and encapsulation layer to build intermediate protective structure, spray-cured buffer layer, and coated with UV-cured encapsulation layer; S6: Prepare a hydrophobic and wear-resistant surface layer, form an outer protective layer, spray wear-resistant coating, and plasma modify to form a hydrophobic surface layer; S7: Post-curing treatment, full performance testing to obtain the finished product, low-temperature post-curing to relieve stress, and multi-index testing to screen the finished product.

[0014] Compared with the prior art, the beneficial effects of the present invention are: The electronic skin of this invention employs a seven-layer gradient composite structure design, achieving synergistic function among the layers and significantly improving overall flexibility and structural stability, without interlayer delamination or cracking during deformation. The blackened functional layer retains the high conductivity of the metal mesh conductive layer while achieving low reflectivity and anti-light interference, adapting to the application requirements of various optical scenarios, and simultaneously enhancing the oxidation resistance of the metal mesh. With clearly defined functions and close integration among the layers, the outer protective structure effectively improves the electronic skin's environmental tolerance and lifespan. The overall device is suitable for large-scale fabrication and possesses significant practical application value. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the cross-sectional structure of the electronic skin of the present invention. Detailed Implementation

[0016] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Please see Figure 1The present invention provides a technical solution: an electronic skin with a blackened metal mesh conductor, which consists of, from the side of the substrate to the outside: a flexible adhesive layer, a flexible base layer, a metal mesh conductive layer, a blackened functional layer, a flexible buffer layer, a corrosion-resistant encapsulation layer, and a hydrophobic and wear-resistant surface layer, with the overall total thickness of the electronic skin not exceeding 60 μm.

[0018] The flexible adhesive layer is used to tightly and reversibly attach electronic skin to substrates such as human skin, robotic curved surfaces, and flexible devices. It ensures that the layer deforms synchronously with the substrate after attachment, without detachment or residue, providing a stable adhesion foundation for the overall structure. Its composition is a blend of hydroxyl-terminated polydimethylsiloxane (PDMS) and acrylate pressure-sensitive adhesive in a 6:4 mass ratio, with the addition of 1-3 wt% nano-silica to enhance adhesion and temperature resistance / aging resistance. The flexible adhesive layer has a micro-nano porous structure with pore sizes of 50-100 nm, exhibiting a disordered yet uniform distribution. This increases the contact area with the substrate, improving adhesion while maintaining flexibility; the porous structure does not collapse when the elongation is ≤150%.

[0019] The flexible substrate layer serves as the flexible support framework for electronic skin, providing high tensile strength, high resilience, and fatigue resistance. It supports subsequent functional layers and prevents interlayer delamination and overall cracking during deformation. Its composition is a blend of modified polyimide (PI) and thermoplastic polyurethane (TPU) in a 7:3 mass ratio, with the addition of 2wt% organic nano-montmorillonite to enhance mechanical strength and bending resistance, balancing the high temperature resistance and aging resistance of PI with the high flexibility and resilience of TPU. The flexible substrate layer has a non-porous, dense film structure with an interpenetrating network phase structure. PI forms the rigid support phase, while TPU forms the flexible resilience phase. There are no stress concentration points; the phase structure deforms synchronously during stretching and exhibits no permanent deformation after rebound.

[0020] The metallic mesh conductive layer is used to convert and transmit physical signals such as pressure, strain, and temperature into electrical signals. It also provides a uniform and robust substrate for the blackened functional layer, balancing high conductivity with flexibility and fatigue resistance. The metallic mesh conductive layer is made of a silver-copper alloy mesh in a biomimetic hexagonal honeycomb array, with rounded transitions at the nodes to prevent stress concentration and mesh breakage during deformation. The mesh linewidth is 8-15μm, the mesh spacing is 80-150μm, and the overall duty cycle is 15%-20%, maximizing flexibility while ensuring conductivity. The mesh surface has a micro-nano rough structure with a roughness Ra=0.2-0.5μm, increasing the contact area with the blackened functional layer, improving interlayer adhesion, and preventing the blackened layer from peeling off. The mesh thickness is 1-3μm, achieved through an electroplating thickening process to ensure the mechanical stability of the conductive layer.

[0021] The blackening functional layer is used to achieve high resistance to light interference, low reflectivity, and visual stealth in electronic skin, while also enhancing the oxidation resistance of the conductive layer of the metal mesh. The blackening functional layer uses CuO-Ag2O composite oxide grown in situ on the surface of the metal mesh as a substrate, loaded with 5-8wt% multi-walled carbon nanotubes with a diameter of 20-30nm and a length of 1-2μm, to form a blackening layer with high light absorption and low reflectivity, no conductive loss, and no impact on the electrical signal transmission of the metal mesh. The surface of the blackened functional layer features a multi-level rough structure consisting of micron-sized pits and nano-sized needle-like protrusions. The pits have a diameter of 1-3 μm and a depth of 0.5-1 μm, while the needle-like protrusions have a height of 200-500 nm and are arranged in a disordered and uniform manner. This multi-level structure enables multiple reflections and absorptions of visible and near-infrared light, significantly reducing reflectivity. The blackened layer is a dense and continuous film structure with a thickness of 0.1-0.3 μm. It is embedded with the micro-nano rough structure on the surface of the metal mesh, forming a strong bond. During deformation, it is stretched synchronously without cracking or falling off. The overall visible light reflectivity is ≤8%, and the near-infrared light reflectivity is ≤10%, effectively avoiding light reflection interference from optical devices and enabling tactile and visual functions to work in tandem.

[0022] The flexible buffer layer is used to alleviate interlayer stress during the deformation of electronic skin, preventing cracking and peeling between the blackened functional layer and the corrosion-resistant encapsulation layer due to mechanical mismatch, while further improving the overall structure's flexibility and fatigue resistance. It is composed of a low-modulus PDMS and polyvinylidene fluoride-hexafluoropropylene blend system at a mass ratio of 9:1, with the addition of 3wt% nano-zinc oxide to enhance buffering performance and aging resistance. The flexible buffer layer has a closed-cell microbubble structure with a bubble diameter of 1-5μm, uniformly and randomly distributed. This microbubble structure can compress and rebound during deformation, effectively absorbing and dispersing interlayer stress. The flexible buffer layer is 5-8μm thick, and its low modulus ensures overall flexibility. The microbubble structure does not rupture when the elongation is ≤200%, and the interlayer stress buffering rate is ≥60%.

[0023] The corrosion-resistant encapsulation layer seals and protects the internal conductive metal mesh layer and blackened functional layer, isolating them from air, moisture, and acidic / alkaline media. This prevents oxidation of the metal mesh and failure of the blackened layer, while maintaining flexibility without affecting overall deformability, thus improving the environmental tolerance and durability of the electronic skin. It is composed of UV-curable polysiloxane resin with 2wt% nano-titanium dioxide added to enhance corrosion resistance and interlayer adhesion. The corrosion-resistant encapsulation layer is a non-porous, dense thin-film structure, 8-12μm thick, with a smooth surface. It interlocks with the microbubble structure of the flexible buffer layer, ensuring a seamless seal and effectively blocking moisture and oxygen.

[0024] The hydrophobic and abrasion-resistant surface layer serves as the outermost protective layer of the electronic skin, achieving hydrophobicity, anti-fouling, and abrasion resistance. It prevents damage to the internal structure from external dust, liquids, and scratches, further extending the lifespan and practical application adaptability of the electronic skin while maintaining flexibility. Its composition is fluorine-modified polyurethane resin with the addition of 4wt% nano-alumina, balancing hydrophobicity, abrasion resistance, and flexibility. The surface of the hydrophobic and abrasion-resistant surface layer features a micro-nano lotus leaf-like protrusion structure, achieving a superhydrophobic effect with a water contact angle ≥135° and a roll-off angle ≤10°. The thickness of the hydrophobic and abrasion-resistant surface layer is 2-4μm, thin yet flexible, and exhibits no cracking when the elongation is ≤150%.

[0025] A method for preparing an electronic skin includes the following steps: S1: A flexible substrate layer is prepared, its surface is activated, and it is then cast and cured to form the flexible substrate layer. Double-sided activation enhances interlayer adhesion. A modified polyimide and thermoplastic polyurethane blend casting solution is coated onto a clean substrate using a casting method. After gradient temperature drying and heat setting, it is peeled off to obtain a flexible substrate layer with a thickness of 10-15 μm. Both sides of the substrate layer are treated with argon plasma to improve surface roughness and activity, providing a bonding foundation for subsequent interlayer composites. The treated substrate layer serves as the core support carrier for the entire electronic skin.

[0026] S2: Composite flexible adhesive layer, forming an inner double-layer structure. The flexible adhesive layer and the base layer are hot-pressed together to form the inner support. The pre-treated flexible adhesive layer material is coated onto the release film and cured. It is then bonded to the activated flexible base layer in S1, with the flexible adhesive layer facing the skin side. The layers are hot-pressed at 50°C and 0.3MPa for 10 minutes to allow the two layers to be tightly bonded through physical interlocking and intermolecular forces. After cooling, the release film is removed to obtain a double-layer structure of flexible adhesive layer and flexible base layer. The interlayer bonding force is tested to ensure no bubbles and no peeling.

[0027] S3: Fabrication of a conductive metal mesh layer, integrally formed on the substrate layer. The metal mesh is formed by photolithography and electroplating, and integrated with the substrate layer. Using the double-layer structure of S2 as the substrate, a honeycomb photoresist mask is prepared by laser direct-write photolithography. After magnetron sputtering of a metal seed layer, a silver-copper alloy is electroplated to thicken it. After removing the mask, electrochemical polishing and annealing are performed to directly form a 1-3 μm thick conductive metal mesh layer on the surface of the flexible substrate layer. The annealing process enables the metal mesh to form a molecular-level bond with the substrate layer, achieving integration of the conductive layer and the substrate.

[0028] S4: A blackened functional layer is prepared by coating a conductive metal mesh layer with in-situ oxidation and carbon nanotube loading. The substrate with the conductive metal mesh layer is placed in a constant-temperature oxidation furnace and heated at 150°C for 2 hours to allow a dense copper-silver composite oxide layer to grow in situ on the metal mesh surface. A multi-walled carbon nanotube dispersion is uniformly loaded onto the oxide layer surface using an dip-coating method. After drying, a silane coupling agent is used to chemically graft the carbon nanotubes onto the oxide layer, forming a 0.1-0.3 μm thick blackened functional layer on the metal mesh surface, completing the tight coating of the conductive layer. Simultaneously, oxygen plasma treatment is used to activate the blackened layer surface, preparing it for subsequent composite processes.

[0029] S5: Layer by layer, a buffer layer and an encapsulation layer are composited to construct an intermediate protective structure. The buffer layer is sprayed and cured, and then an ultraviolet-cured encapsulation layer is coated. A flexible buffer layer adhesive is sprayed onto the surface of the blackened functional layer of S4 and cured at low temperature to form a flexible buffer layer with a closed-cell microbubble structure. The adhesive is tightly embedded with the surface of the activated blackened layer. Subsequently, an ultraviolet-cured encapsulation adhesive is applied to the surface of the buffer layer with a scraper and cured rapidly under ultraviolet light to form a dense and corrosion-resistant encapsulation layer. During the curing process, the encapsulation layer and the buffer layer achieve intermolecular bonding. At the same time, the edges of the substrate are sealed to form a composite protective structure of a flexible buffer layer and a corrosion-resistant encapsulation layer, which isolates moisture and air.

[0030] S6: Prepare a hydrophobic and wear-resistant surface layer, form an outer protective layer, spray wear-resistant coating, and plasma modify to form a hydrophobic surface layer; spray fluorine-modified polyurethane wear-resistant coating on the surface of the corrosion-resistant encapsulation layer of S5, and form a basic wear-resistant layer after drying; use plasma hydrophobic modification process to construct lotus leaf-shaped micro-nano protrusion structure on the surface of the wear-resistant layer to form a hydrophobic and wear-resistant surface layer. During the modification process, the surface layer and the encapsulation layer are tightly bonded through chemical bonding to complete the overall forming of the seven-layer structure of the electronic skin and obtain a semi-finished product.

[0031] S7: Post-curing treatment, full performance testing to obtain the finished product, low-temperature post-curing to relieve stress, multi-index testing to screen the finished product; the seven-layer semi-finished product is placed in a constant temperature and humidity chamber and post-cured at 40-60℃ for 1-2 hours to slowly eliminate the internal stress generated during the preparation of each layer and further strengthen the interlayer bonding force; after cooling to room temperature, the finished product is tested for multiple indicators such as conductivity, anti-light interference performance, flexibility and durability, interlayer bonding force, and environmental resistance. Products that do not meet the standards are eliminated to obtain qualified electronic skin finished products with blackened metal mesh conductors.

[0032] This invention discloses an electronic skin with a blackened metal mesh conductor and its fabrication method. The electronic skin, from the substrate side to the outer side, consists of a flexible adhesion layer, a flexible base layer, a metal mesh conductive layer, a blackened functional layer, a flexible buffer layer, a corrosion-resistant encapsulation layer, and a hydrophobic and wear-resistant surface layer, with a total thickness not exceeding 60 μm. Each layer has complementary functions and mechanical compatibility. The fabrication method uses the flexible base layer as the core carrier, and employs processes such as hot pressing, photolithography electroplating, in-situ oxidation, spray curing, and plasma modification to sequentially composite and form the electronic skin. Finally, post-curing and performance testing yield the finished product. This fabrication method is simple and achieves tight bonding between the layers of the electronic skin. The resulting electronic skin possesses high conductivity, high flexibility, resistance to light interference, and strong protection, solving the problems of reflective interference and poor structural stability in traditional electronic skins.

[0033] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electronic skin with a blackened metal mesh conductor, characterized in that, include: A flexible adhesive layer is used to tightly and reversibly attach electronic skin to the substrate; The flexible substrate layer, as a flexible support framework for electronic skin, provides high tensile strength, high resilience, and fatigue resistance, supports subsequent functional layers, and avoids interlayer delamination and overall cracking during deformation. The metal mesh conductive layer is used to convert and transmit physical signals into electrical signals, while providing a uniform and firm adhesion substrate for the blackened functional layer, taking into account both high conductivity and flexible fatigue resistance. The blackened functional layer is used to achieve high resistance to light interference, low reflectivity, and visual stealth in electronic skin, while also improving the oxidation resistance of the metal mesh conductive layer. The flexible buffer layer alleviates interlayer stress during the deformation of the electronic skin, prevents cracking and peeling of the blackened functional layer and the corrosion-resistant encapsulation layer due to mechanical mismatch, and further improves the flexibility and fatigue resistance of the overall structure. The corrosion-resistant encapsulation layer seals and protects the internal metal mesh conductive layer and blackened functional layer, isolating them from air, moisture, and acid and alkali media, preventing the metal mesh from oxidizing and the blackened layer from failing. At the same time, it is flexible and does not affect the overall deformation performance, thus improving the environmental tolerance and durability of the electronic skin. The hydrophobic and wear-resistant surface layer is the outermost protective layer of the electronic skin, achieving the functions of hydrophobicity, anti-fouling, and wear resistance. It prevents external dust, liquids, and scratches from damaging the internal structure, further improving the service life and practical application adaptability of the electronic skin, while retaining flexibility. The overall thickness of the electronic skin is no more than 60 μm.

2. The electronic skin with a blackened metal mesh conductor according to claim 1, characterized in that: The surface of the flexible adhesive layer has a micro-nano porous structure, which increases the contact area with the substrate.

3. An electronic skin with a blackened metal mesh conductor according to claim 1, characterized in that: The flexible substrate has a non-porous, dense thin film structure with an internal interpenetrating network phase structure.

4. An electronic skin with a blackened metal mesh conductor according to claim 1, characterized in that: The conductive metal mesh layer is a silver-copper alloy mesh, which is a biomimetic regular hexagonal honeycomb array with rounded transitions at the nodes to avoid stress concentration during deformation that could lead to mesh breakage.

5. An electronic skin with a blackened metal mesh conductor according to claim 4, characterized in that: The grid has a line width of 8-15μm, a grid spacing of 80-150μm, and an overall duty cycle of 15%-20%, maximizing flexibility while ensuring conductivity. The grid surface has a micro-nano rough structure with a roughness Ra=0.2-0.5μm, increasing the contact area with the blackened functional layer, improving interlayer bonding, and preventing the blackened layer from peeling off. The grid thickness is 1-3μm, and an electroplating thickening process is used to ensure the mechanical stability of the conductive layer.

6. An electronic skin with a blackened metal mesh conductor according to claim 1, characterized in that: The blackening functional layer uses CuO-Ag2O composite oxide grown in situ on the surface of the metal mesh as a substrate, loaded with 5-8wt% multi-walled carbon nanotubes with a diameter of 20-30nm and a length of 1-2μm, to form a blackening layer with high light absorption and low reflectivity. It has no conductive loss and does not affect the electrical signal transmission of the metal mesh.

7. An electronic skin with a blackened metal mesh conductor according to claim 1, characterized in that: The flexible buffer layer has a closed-cell microbubble structure with a bubble diameter of 1-5 μm and a uniform and disordered distribution. The microbubble structure can be compressed and rebounded during deformation, effectively absorbing and dispersing interlayer stress. The flexible buffer layer has a thickness of 5-8 μm, and its low modulus characteristics ensure overall flexibility. The microbubble structure does not break when the elongation is ≤200%, and the interlayer stress buffering rate is ≥60%.

8. An electronic skin with a blackened metal mesh conductor according to claim 1, characterized in that: The corrosion-resistant encapsulation layer is a non-porous, dense thin film structure with a thickness of 8-12 μm and a smooth surface. It is embedded with the microbubble structure surface of the flexible buffer layer, providing a seal without dead corners and effectively blocking water vapor and oxygen.

9. An electronic skin with a blackened metal mesh conductor according to claim 1, characterized in that: The hydrophobic and wear-resistant surface layer has a micro-nano lotus leaf-shaped protrusion structure, achieving a superhydrophobic effect with a water contact angle ≥135° and a roll-off angle ≤10°. The hydrophobic and wear-resistant surface layer has a thickness of 2-4μm, is thin and flexible, and does not crack when the elongation is ≤150%.

10. A method for preparing electronic skin according to any one of claims 1-9, characterized in that, It includes the following steps: S1: Prepare a flexible substrate layer, activate the surface, cast and cure to form a flexible substrate layer, double-sided activation to improve interlayer bonding; S2: Composite flexible adhesive layer, forming an inner double-layer structure, hot-pressed composite flexible adhesive layer and base layer to form inner support; S3: Prepare a metal mesh conductive layer, integrally molded on the substrate layer, and form the metal mesh by photolithography and electroplating, which is then integrated with the substrate layer. S4: Prepare a blackening functional layer, coat it with a metal mesh conductive layer, and perform in-situ oxidation combined with carbon nanotube loading to form a blackening functional layer; S5: Layer by layer composite buffer layer and encapsulation layer to build intermediate protective structure, spray-cured buffer layer, and coated with UV-cured encapsulation layer; S6: Prepare a hydrophobic and wear-resistant surface layer, form an outer protective layer, spray wear-resistant coating, and plasma modify to form a hydrophobic surface layer; S7: Post-curing treatment, full performance testing to obtain the finished product, low-temperature post-curing to relieve stress, and multi-index testing to screen the finished product.

Images