Semiconductor processing apparatus and substrate posture adjustment device and method thereof

Abstract

The application provides a semiconductor processing equipment and a substrate posture adjusting device and method thereof; the substrate posture adjusting device is provided with a mover plate, a bearing plate and a center column connected between the two, and is also provided with a plurality of linear actuators and a plurality of hook hinges each having three rotation degrees of freedom; each linear actuator is used for driving a moving part of the linear actuator to move linearly along an actuating direction of the linear actuator; the moving part of each linear actuator is connected with the mover plate through a corresponding hook hinge; the strokes of the moving parts when moving linearly can be independently adjusted; by matching the stroke positions of the moving parts, the mover plate can be in an inclined state, and the bearing plate and a substrate supported by the bearing plate can be inclined through the center column, so that the adjustment of the inclination of the substrate is realized, and the uniformity during the processing of the surface of the substrate is optimized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and in particular to a semiconductor processing apparatus and a substrate orientation adjustment device and method thereof. Background Technology

[0002] In semiconductor processing equipment, a reaction chamber contains opposing support plates and spray heads. The spray heads are located at the top of the reaction chamber, while the support plates are positioned at the bottom of the chamber via support components, supporting the substrate to be processed. In processes such as deposition, etching, or heat treatment, the position of the support plates relative to the spray heads directly affects the uniformity of the process. Therefore, during the process, the support components are used to adjust the position of the support plates relative to the spray heads to ensure optimal process results.

[0003] In existing technologies, support components typically use a combination of spherical hinges and pivot hinges to adjust the position of the load-bearing plate. However, both spherical hinges and pivot hinges rely on rolling friction to adjust the position of the load-bearing plate. Under heavy loads and long-term operation, the spherical hinges and pivot hinges inevitably wear down, resulting in a significant reduction in the adjustment accuracy of the load-bearing plate. Therefore, it is necessary to adjust the structure of the support component. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor processing apparatus and a substrate orientation adjustment device and method thereof to adjust the tilt of the substrate and optimize the uniformity of the substrate surface during processing.

[0005] To achieve the above objectives, one technical solution of the present invention provides a substrate posture adjustment device, comprising:

[0006] Moving plate;

[0007] A support plate is used to support a substrate that requires further processing.

[0008] The central column supports the bearing plate at its first end and is connected to the moving plate at its second end.

[0009] Multiple linear actuators; each linear actuator is used to drive the moving part of the linear actuator to move linearly along the actuation direction of the linear actuator;

[0010] Multiple Hooke hinges, each with three rotational degrees of freedom; the moving part of each of the linear actuators is connected to the moving plate via a corresponding Hooke hinge;

[0011] The stroke of each of the moving parts of the multiple linear actuators can be adjusted independently when they make linear movements, so that the moving plate is in an inclined state, and the bearing plate is tilted through the central column, thereby tilting the base plate.

[0012] Optionally, the moving plate can switch between an inclined state and a horizontal state;

[0013] The moving plate is tilted when at least one of the moving parts of all linear actuators is in a different travel position than the other moving parts.

[0014] When the moving parts of all linear actuators are at the same stroke position, the moving plate is in a horizontal state, and the central column drives the bearing plate and the base plate to be in a horizontal state.

[0015] Optionally, the plane in which the moving plate is in a horizontal state is called the reference plane;

[0016] Each of the Hooke hinges further comprises:

[0017] A pair of first bearings are mounted on a first rotating shaft arranged along a first direction; the portions of the first rotating shaft extending beyond the pair of first bearings are respectively rotatably connected to the moving plate; the first direction corresponds to the tangential direction of the moving plate on a reference plane.

[0018] A pair of second bearings are mounted on a second rotating shaft arranged along a second direction; the second direction corresponds to the radial direction of the moving plate on the reference plane.

[0019] A pair of third bearings are mounted on a third rotating shaft arranged along a third direction; the third direction corresponds to the normal of the moving plate on the reference plane.

[0020] Optionally, the first bearing, the second bearing, and the third bearing are all tapered roller bearings.

[0021] Optionally, the contact angles of the first bearing and the second bearing are both smaller than the contact angle of the third bearing.

[0022] Optionally, the pair of first bearings are mounted back-to-back on the first rotating shaft and subjected to axial constant pressure preload; the pair of second bearings are mounted back-to-back on the second rotating shaft and subjected to axial constant pressure preload; and the pair of third bearings are mounted back-to-back on the third rotating shaft and subjected to positioning preload.

[0023] Optionally, the Hooke hinge further includes the following components configured for the pair of first bearings:

[0024] The first bearing housing is provided with a first bearing mounting hole for fixing the pair of first bearings;

[0025] Two first end caps are respectively disposed on the outer sides of the axial ends of the first bearing mounting hole; each of the two first end caps is provided with a central hole, for the two ends of the first rotating shaft to extend out to connect to the stator plate;

[0026] A plurality of first screws pass through screw holes on at least one first end cap to apply preload;

[0027] A first gasket is disposed between the at least one first end cap and the first bearing adjacent thereto.

[0028] Optionally, the first rotating shaft and the second rotating shaft intersect perpendicularly, and the pair of first bearings and the components configured thereon form an assembly with the pair of second bearings;

[0029] The Hooke hinge further includes:

[0030] A mounting bracket is provided for connecting the assembly; the mounting bracket is provided with two opposing second bearing mounting holes for fixing the pair of second bearings;

[0031] The second end cap is located on the outer side of one of the second bearing mounting holes in the axial direction;

[0032] Several second screws pass through screw holes on the second end cap to apply preload;

[0033] The second gasket is disposed between the second end cap and the second bearing adjacent to it.

[0034] Optionally, the mounting bracket is provided with an upwardly extending shaft as the third pivot.

[0035] The Hooke hinge further includes:

[0036] A third bearing housing is used to fix the pair of third bearings;

[0037] A nut is fitted onto the threaded section of the upper part of the third shaft and is located outside a third bearing away from the mounting bracket to apply preload; another third bearing close to the mounting bracket abuts against a boss provided on the mounting bracket.

[0038] Optionally, the moving plate is provided with a plurality of first mounting slots evenly distributed along the circumference of the moving plate;

[0039] Two opposing first rotating shaft mounting holes are provided along the first direction at the moving plate next to each first mounting slot, for corresponding insertion of the two ends of the first rotating shaft;

[0040] Each first mounting slot is equipped with two first pressure plates, which are fixed to the moving plate next to the first mounting slot with third screws. The openings of the first rotating shaft mounting holes exposed to the end face of the moving plate are closed by the corresponding first pressure plates.

[0041] Optionally, the substrate attitude adjustment device further includes:

[0042] The stator plate is connected to the bottom plate of the reaction chamber of the semiconductor processing equipment; the moving plate is arranged at intervals below the stator plate;

[0043] The plurality of linear actuators are each disposed between the stator plate and the mover plate; the actuation direction of each linear actuator is the same as the interior angle formed by the plane on which the stator plate is located; the interior angle formed is a right angle, an acute angle, or an obtuse angle.

[0044] Optionally, each of the linear actuators is rotatably connected to the stator plate via a pivot, at which a fourth rotating shaft passes;

[0045] The stator plate is provided with a plurality of second mounting slots evenly distributed along the circumference of the stator plate;

[0046] A pair of second rotating shaft mounting holes are provided on the stator plate next to each second mounting slot along the tangent of the stator plate, for corresponding insertion of the two ends passing through the fourth rotating shaft;

[0047] Each second mounting slot is equipped with two second pressure plates, which are fixed to the stator plate next to the second mounting slot with fourth screws. The openings of the second shaft mounting holes exposed to the radial outer side of the stator plate are closed by the corresponding second pressure plates.

[0048] Optionally, the moving part of each of the linear actuators includes: a guide rail;

[0049] Each of the linear actuators further includes: a motor, a transmission gear set, a lead screw, a slider, and a position sensor;

[0050] The drive shaft of the motor is connected to one end of the lead screw through a transmission gear set, which drives the lead screw to rotate, so that the lead screw nut on the lead screw moves linearly along the axis of the lead screw, and drives the guide rail connected to the lead screw nut to move linearly along the corresponding actuation direction; the actuation direction corresponds to the length direction of the guide rail, and the length direction of the guide rail is parallel to the axis of the lead screw.

[0051] The slider and the guide rail form a sliding pair that can move relative to each other along the actuation direction; the slider is fixedly mounted at the linear actuator; the guide rail is connected to the corresponding Hooke hinge, so as to drive the corresponding Hooke hinge to move as a whole when the guide rail moves linearly along the actuation direction, and then drive the moving plate to adjust its attitude through the corresponding Hooke hinge.

[0052] The position sensor is used to detect the travel position of the guide rail.

[0053] Optionally, the support plate is located inside the reaction chamber;

[0054] The first end of the central column passes through the first through hole of the stator plate and the second through hole of the cavity bottom plate, and extends into the reaction cavity to support the bearing plate;

[0055] The substrate posture adjustment device is further provided with an adapter; the second end of the central column is connected to the adapter; the adapter is connected to the moving sub-plate, so that the adapter and the moving sub-plate maintain the same tilt state or horizontal state, and the central column is arranged tilted or vertically.

[0056] Optionally, the central column is fitted with a flexible sealing tube to connect the space inside the flexible sealing tube with the space inside the reaction chamber and to isolate it from the external atmospheric environment.

[0057] The flexible sealing pipe is provided with an upper flange at one end. The upper flange is fixed at the first through hole of the stator plate and connected to the bottom plate of the cavity. The third through hole of the upper flange communicates with the second through hole of the bottom plate of the cavity, allowing the first end of the central column to pass through.

[0058] The other end of the flexible sealing pipe is provided with a lower flange; the lower flange is connected to the adapter.

[0059] Another technical solution of the present invention is to provide a semiconductor processing apparatus, including a reaction chamber, wherein a substrate is processed by introducing process gas into the reaction chamber; and further including any of the above-mentioned substrate posture adjustment devices;

[0060] A support plate for the substrate is located inside the reaction chamber; the first end of the central column extends into the reaction chamber to support the support plate;

[0061] Apart from the support plate and part of the central column, the other components of the substrate attitude adjustment device are located outside the reaction chamber, wherein the moving plates are arranged at intervals below the cavity bottom plate of the reaction chamber.

[0062] Another technical solution of the present invention is to provide a substrate posture adjustment method, which is implemented using any of the above-mentioned substrate posture adjustment devices;

[0063] The substrate attitude adjustment method includes a first control mode that controls the stroke position of each moving part of a plurality of linear actuators in the actuation direction, so that at least one moving part of all linear actuators is at a different stroke position than the other moving parts, so that the moving plate is in an inclined state, and then the central column drives the support plate and the substrate to tilt, thereby adjusting the inclination of the substrate.

[0064] Optionally, the substrate posture adjustment method further includes a second control mode that controls the stroke position of each of the moving parts of the multiple linear actuators in the actuation direction, so that the stroke position of the moving parts of all linear actuators is the same, so that the moving plate is in a horizontal state, and then the support plate and the substrate are driven to a horizontal state through the central column; the substrate posture adjustment method can switch between the first control mode and the second control mode.

[0065] Optionally, under the first control mode, the moving plate can rotate around any axis passing through the center of the moving plate in its plane by a set angle, so that the central column, the bearing plate and the base plate are tilted by the corresponding angle.

[0066] Optionally, the substrate attitude adjustment method further includes a third control mode and a fourth control mode for controlling the stroke of the moving parts of the multiple linear actuators when they move in their respective actuation directions, for adjusting the height of the support plate in the reaction chamber.

[0067] In the third control mode, all the moving parts of the linear actuators are controlled to move the same distance in their respective actuation directions toward the side closer to the reaction chamber, so that the moving plate as a whole rises, and then drives the bearing plate to rise through the central column.

[0068] In the fourth control mode, all the moving parts of the linear actuators are controlled to move the same distance away from the reaction chamber in their respective actuation directions, so that the moving plate as a whole descends, and then the bearing plate is driven to descend through the central column.

[0069] Optionally, the moving plate may be in a horizontal or tilted state when the whole is rising or falling.

[0070] Optionally, the third and fourth control modes are alternately performed to enable the moving plate to perform reciprocating motion of rising and falling, thereby driving the bearing plate to reciprocate between the first and second positions in the reaction chamber via the central column;

[0071] The first position and the second position are at different heights;

[0072] The reaction chamber has a transfer port on its side wall; when the carrier plate is in the first position, the robotic arm enters the reaction chamber through the transfer port and places the substrate it carries onto the carrier plate, or removes the substrate from the carrier plate.

[0073] When the support plate is in the second position, the substrate supported by the support plate is processed by introducing process gas from the reaction chamber.

[0074] Optionally, the second end of the central column is connected to the moving plate via an adapter;

[0075] When the moving plate is in a horizontal state, the adapter is in a horizontal state, making the central column vertically arranged; when the moving plate is in an inclined state, the adapter is in an inclined state, making the central column inclined.

[0076] Compared with the prior art, the technical solution provided by the present invention has at least the following beneficial effects:

[0077] In the semiconductor processing equipment and substrate posture adjustment device and method provided by the present invention, the travel positions of the moving parts of multiple linear actuators in their respective actuation directions can be coordinated and controlled as needed. The moving plate is connected and driven to switch to a horizontal or tilted state through a Hooke hinge, and the central column connected to the moving plate drives the carrier plate and substrate in the reaction chamber to be in a horizontal or tilted state, thereby adjusting the tilt of the substrate.

[0078] This invention allows the moving plate to rotate around an axis passing through the center of the moving plate on its plane, achieving the required tilt direction and / or tilt angle. This adjustment of the substrate's tilt can compensate for factors in the semiconductor processing equipment that previously caused uneven substrate surface treatment, ultimately resulting in a more uniform treatment effect on the substrate surface and significantly improving the quality and stability of the entire process.

[0079] Existing technologies using ordinary spherical hinges face challenges in balancing dynamic friction and contact gap during design. While spherical hinges offer three degrees of freedom, achieving both high precision and heavy load requirements is difficult, and manufacturing costs are high. In contrast, this invention utilizes a high-rigidity, high-precision three-degree-of-freedom Hooke hinge as the guide, enabling dynamic and precise rotational guidance of the moving plate. This results in greater load capacity, smaller gaps, higher accuracy, and lower costs.

[0080] Compared to Hooke hinges based on ball roller bearings, this invention considers the slower rotation speed of the central column driving the bearing plate, and prioritizes the use of tapered roller bearings suitable for low-speed operation. It also provides bearing configurations and preload methods applicable to different directions. The support area changes from point contact of ball roller bearings to line contact of tapered rollers. By applying axial preload, it achieves backlash-free smooth transmission, realizing the design of a high-precision, high-rigidity, and high-load-bearing three-degree-of-freedom Hooke hinge. Attached Figure Description

[0081] Figure 1 This is a schematic diagram of the substrate posture adjustment device of the present invention.

[0082] Figure 2 This is a schematic diagram of the semiconductor processing equipment and the substrate posture adjustment device of the present invention, showing the carrier plate in the wafer transfer position.

[0083] Figure 3 This is a schematic diagram of the semiconductor processing equipment and the substrate posture adjustment device of the present invention, showing the carrier plate in the process processing position.

[0084] Figure 4 This is a schematic diagram of the semiconductor processing equipment and the substrate posture adjustment device of the present invention when the support plate tilts.

[0085] Figure 5 This is a schematic diagram of the Hooke hinge of the present invention.

[0086] Figure 6 This is a cross-sectional view of the second direction of the Hooke hinge of the present invention when it corresponds to the direction of the paper.

[0087] Figure 7 This is a cross-sectional view of the first direction of the Hooke hinge of the present invention when it corresponds to the direction of the paper.

[0088] Figure 8 This is a schematic diagram of the bearing pairs in the Hooke hinge of the present invention installed back to back.

[0089] Figure 9 This is a schematic diagram of bearings mounted face-to-face.

[0090] Figure 10 This is a simplified structural diagram of the substrate posture adjustment device of the present invention.

[0091] Figure 11 This is a flowchart of an example of the substrate posture adjustment method in this invention. Detailed Implementation

[0092] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The accompanying drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clearly illustrate the objectives of the embodiments of the present invention. The structures, proportions, sizes, etc., shown are only used to complement the content disclosed in the specification, for those skilled in the art to understand and read, and are not intended to limit the implementation conditions of the present invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0093] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0094] like Figures 1-4 As shown, the present invention provides a substrate attitude adjustment device, comprising a plurality of linear actuators 30, each of which has a movable component (in this example, a guide rail 32) connected to the same moving plate 20 via corresponding Hooke hinges 40 having three rotational degrees of freedom; the moving plate 20 is connected to the lower end of a central column 51, the upper end of which supports a support plate 52 located within the reaction chamber 10 of a semiconductor processing device to support the substrate w requiring processing; wherein, the movable component of each linear actuator 30 can move along the corresponding actuation path The linear actuators 30 reciprocate in a straight line, and the stroke of the moving parts in their respective actuation directions can be adjusted independently. The change in the stroke of a single moving part is transmitted through the corresponding Hooke hinge 40, which can at least produce a downward pushing or upward pulling motion tendency on the part of the moving plate 20 connected to the Hooke hinge 40. Therefore, by coordinating and controlling the progress position of the moving parts of these linear actuators 30, the overall posture of the moving plate 20 can be adjusted, thereby causing the central column 51, the support plate 52 and the base plate w to make corresponding posture adjustments.

[0095] In some examples, by controlling the travel position of one or more moving parts, the entire moving subplate 20 can be tilted, causing the central column 51 and the support plate 52 to tilt, thereby tilting the substrate w supported by the support plate 52, thus achieving adjustment of the tilt angle of the substrate w (see [reference]). Figure 4To tilt the moving plate 20, at least one of the moving parts needs to be in a different travel position than the remaining moving parts. Assuming all moving parts are initially in the same travel position, depending on the requirements for the tilt direction and / or tilt angle of the moving plate 20, one moving part can be controlled to move, resulting in a different travel position than the other stationary moving parts; alternatively, multiple moving parts can be controlled to move independently. If their orientation and travel are the same, their travel positions after movement need to be different from the stationary moving parts; if their orientation or travel is different, the condition of at least one moving part having a different travel position is already met; or, all moving parts can be controlled to move independently, but their travel positions after movement need to be different. The orientation refers to whether the moving part moves towards or away from the reaction chamber 10 in the corresponding actuation direction.

[0096] In other examples, when all moving parts are at the same travel position, the moving subplate 20 can be kept in a horizontal state (e.g., Figure 2 or Figure 3 If all moving parts are controlled to move the same distance in the same direction, the moving plate 20 can be moved upward or downward as a whole (i.e., closer to or away from the reaction chamber 10) in its current posture (horizontal or tilted), driving the central column 51 and the support plate 52 to move upward or downward, thus adjusting the height of the support plate 52 within the reaction chamber 10. During different stages of the process, the support plate 52, whose height has been adjusted, may or may not have a substrate w placed on it. Optionally, when the moving plate 20 is in a horizontal state and the support plate 52 supported by the central column 51 is also in a horizontal state, all moving parts can be adjusted simultaneously in the same direction and with the same distance. This makes the force on each moving part more even, and the movement of the moving plate 20, the central column 51, and the support plate 52 more stable. If the support plate 52 already has a substrate w on it, adjusting the height when the support plate 52 is in a horizontal state can also prevent the substrate w from slipping during movement.

[0097] exist Figures 2-4 In the example, Figure 2 The vertical distance between the bottom plate 11 of the cavity and the bottom surface of the moving plate 20 is H1. The moving plate 20 maintains its current horizontal state and rises to... Figure 3 At the position shown, the vertical distance between the bottom plate 11 of the cavity and the bottom surface of the moving plate 20 is shortened to H2. During this period, the central column 51 remains vertical and drives the supporting plate 52 and the base plate w to rise vertically within the reaction cavity 10 by a distance Δh. This distance Δh is equal to the distance (H2-H1) that the moving plate 20 rises. Further comparison... Figure 3 , Figure 4 It can be seen that the originally horizontal moving plate 20 is driven in Figure 4 After the central column 51 tilts to one side by an angle α, the originally vertical central column 51 also tilts to the same side by an angle α, causing the originally horizontally arranged support plate 52 and substrate w to also tilt to the same side by an angle α. In the original semiconductor processing equipment, for example, but not limited to, uneven distribution of process gas when delivered to the surface of substrate w, or unevenness of some substrate w surfaces to be processed, it is impossible to obtain a uniform processing effect on all parts of the substrate w surface, affecting product quality; while the substrate posture adjustment device of the present invention can tilt the sub-board 20, and drive the support plate 52 and substrate w to tilt at a suitable angle through the central column 51, to compensate for the factors of uneven processing in a simple and effective way, to achieve a more uniform processing effect on the surface of substrate w, and to significantly improve the quality and stability of the entire process.

[0098] like Figures 1-4 As shown, when the aforementioned substrate orientation adjustment device is configured for a semiconductor processing equipment, all components of the substrate orientation adjustment device, except for the support plate 52 and the upper part of the central pillar 51 supporting it, are located outside the reaction chamber 10 of the semiconductor processing equipment, specifically below the chamber bottom plate 11 of the reaction chamber 10. Process gases, etc., are injected into the reaction chamber 10 through the gas delivery device 13 to perform semiconductor processing (e.g., deposition, etching, etc.) on the substrate w supported by the support plate 52. A vacuum device (not shown) connected to the reaction chamber 10 can discharge the remaining gases and reaction byproducts after processing from the reaction chamber 10 to maintain a vacuum environment inside the chamber.

[0099] Optionally, the support plate 52 can be an electrostatic chuck to adsorb and fix the substrate w placed on top of it; or, the substrate w can be placed in a groove on the top of the support plate 52; the support plate 52 can support one or more substrates w simultaneously; the substrate w can be a wafer; the gas delivery device 13 can be located at the top of the reaction chamber 10 to deliver process gas from top to bottom to the surface of the substrate w, for example, a spray head; or, the gas delivery device 13 can make the process gas flow laterally across the surface of the substrate w while being delivered radially outward from the center of the reaction chamber 10; or, the gas delivery device 13 can make the process gas be injected from one side of the reaction chamber 10, flow laterally across the surface of the substrate w, and then be output from the other side of the reaction chamber 10; for example, in addition to delivering process gas, the gas delivery device 13 can also deliver auxiliary gas, which is introduced into the reaction chamber simultaneously or staggered (for example, after the process is completed, an inert gas for equipment cleaning can be injected). It should be noted that the above is only an example and is not a limitation on semiconductor processing equipment and its related components, and can be adjusted according to application needs.

[0100] The substrate attitude adjustment device of the present invention also includes a stator plate 60, which is fixedly connected to the lower surface of the cavity bottom plate 11 of the reaction chamber 10, and a mover plate 20 is arranged at intervals below the stator plate 60. A flexible sealing tube 70 is sleeved outside the central column 51, and the upper flange 71 of the flexible sealing tube 70 (see...) Figure 1 The upper flange 71 is embedded in the first through hole 61 at the center of the stator plate 60, and is fixedly connected to the lower surface of the cavity bottom plate 11; the upper flange 71 has a third through hole 711 at its center, which is connected to the second through hole 111 at the center of the cavity bottom plate 11 (see...). Figure 2 Aligned and interconnected, the upper end of the central column 51 passes through the third through hole 711 of the upper flange 71 (and also through the first through hole 61 of the stator plate 60) and the second through hole 111 of the cavity bottom plate 11, extending into the reaction chamber 10 to support the bearing plate 52; the lower flange 72 of the flexible sealing pipe 70 (see...) Figure 1 It is connected to an adapter 53 mounted on the moving plate 20. The space inside the flexible sealing tube 70 is connected to the space inside the reaction chamber 10, and this connected space is isolated from the external atmospheric environment through the flexible sealing tube 70. When the moving plate 20 causes the central column 51 to tilt or rise and fall, the flexible material of the flexible sealing tube 70 allows it to deform appropriately, for example... Figure 4 The flexible sealing tube 70 shown can be appropriately compressed on one side and appropriately stretched on the opposite side in accordance with the tilt direction of the central column 51; for example, the flexible sealing tube 70 can be appropriately stretched or compressed according to the distance by which the moving plate 20 drives the central column 51 to rise or fall, so that the length of the flexible sealing tube 70 after deformation can be adapted to the gap distance between the moving plate 20 and the stator plate 60 after the moving plate 20 rises or falls (for example, the moving plate 20 from...). Figure 2 Position rise to Figure 3 When positioned, the flexible sealing fitting 70 is in Figure 3 When compressed, the height of the flexible sealing tube 70 is less than that of the flexible sealing tube 70 in Figure 2 (Height at the time). The example flexible sealing fitting 70 is a bellows.

[0101] Optionally, the lower end of the center column 51 is connected to the moving plate 20 via an adapter 53. The lower flange 72 of the flexible sealing pipe 70 is also connected to the moving plate 20 via an adapter 53; the adapter 53 will maintain the same tilt or horizontal state as the moving plate 20, and the center column 51 will be arranged accordingly at an angle or vertically.

[0102] This embodiment includes three linear actuators 30, each disposed between the stator plate 60 and the mover plate 20; three first mounting slots 210 are evenly distributed along the circumference of the mover plate 20 for mounting Hooke hinges 40 corresponding to the lower ends of each linear actuator 30; three second mounting slots 610 are evenly distributed along the circumference of the stator plate 60 for connecting the upper ends of each linear actuator 30 to the pivots 33.

[0103] exist Figure 10 In the motion model obtained by simplifying the structure, there are three pivot models 84 (corresponding to Figure 1 The lines connecting the three second mounting slots 610 on the plane of the stator plate model 82 can form the first equilateral triangle, and its coordinate system is OXYZ; the three Hooke hinge models 83 (corresponding to Figure 1 The lines connecting the three first mounting slots 210 on the plane containing the moving plate model 81 can form a second equilateral triangle, whose coordinate system is Pxyz. In this example, the area of ​​the second equilateral triangle is smaller than the area of ​​the first equilateral triangle; that is... Figure 1 The radial distance between each of the second mounting slots 610 and the central column 51 is greater than the radial distance between each of the first mounting slots 210 and the central column 51. Therefore, when the moving plate 20 is in a horizontal state, each of the linear actuators 30 in this embodiment is arranged with its upper end facing outward (toward the side away from the central column 51) and its lower end facing inward (toward the side closer to the central column 51). In other embodiments not shown, each of the linear actuators 30 may also be arranged vertically between the moving plate 20 and the stator plate 60, or tilted in the opposite direction (i.e., each of the linear actuators 30 is tilted with its upper end facing inward and its lower end facing outward).

[0104] See also Figures 1-4 , Figure 10 As shown, the tilting method in this embodiment is optional. Because the stator plate 60 is fixed to the cavity bottom plate 11, the moving plate 20 is suspended below the stator plate 60 through the connection of the linear actuator 30 and the Hooke hinge 40. The stator plate 60 then provides support for the central column 51, the bearing plate 52, etc. Therefore, most of the load will be ultimately transferred to the stator plate 60 through each linear actuator 30. Compared with the method of vertical or reverse tilting of the linear actuator 30, the linear actuator 30 in this example is tilted with the upper end outward and the lower end inward. This can make the distance between each support point on the stator plate 60 (corresponding to each second mounting slot 610) more dispersed, and the support area on the stator plate 60 is larger (corresponding to the second equilateral triangle). The load can be evenly distributed and the force on each support point is smaller, making the stability of the entire structure better.

[0105] The actuation direction of each linear actuator 30 is in Figure 10The axis can be represented by the line connecting the upper pivot model 84 to the lower Hooke's hinge model 83. Since the stator plate 60, fixed to the cavity base plate 11, does not change its posture, while the mover plate 20 will tilt, the positional relationship between the actuation direction and the stator plate 60 is used for explanation. The actuation direction of each linear actuator 30 has the same angle β as the interior angle β formed by the plane containing the stator plate 60. In this example, the linear actuator 30 is tilted outwards at the top and inwards at the bottom, resulting in acute interior angles β. In other embodiments not shown, if the linear actuator 30 is positioned perpendicular to the stator plate 60 and the mover plate 20, the resulting interior angles β are right angles; if the linear actuator 30 is tilted in the opposite direction (inwards at the top and outwards at the bottom), the resulting interior angles β are obtuse angles.

[0106] like Figure 1 As shown, each linear actuator 30 is connected to the stator plate 60 at its upper end via a pivot 33. The pivot 33 is provided with a bearing (not shown) and its shaft 331, providing a rotational degree of freedom. Each second mounting slot 610 on the stator plate 60 is recessed inward from the side edge of the stator plate 60 in a generally radial direction. The middle portion connecting the pivot 33 is recessed more deeply, while the slightly shallower recesses on both sides form two stepped surfaces 611. A pair of shaft mounting holes are formed on these two stepped surfaces 611 for accommodating the shaft 331 at the pivot 33. This pair of shaft mounting holes includes opposing openings tangentially to the stator plate 60, and each shaft mounting hole has an opening exposed radially outward from the stator plate 60, facilitating the insertion of both ends of the shaft 331 into these shaft mounting holes to form a rotatable connection with the stator plate 60. The pivot 33 is positioned in the middle of the second mounting slot 610, with both ends of the shaft 331 located behind the shaft mounting holes. Screws are used to fix the two pressure plates 332 of each second mounting slot 610 onto the two stepped surfaces 611, closing the openings of the shaft mounting holes exposed radially outward from the stator plate 60. During the tilting process of the lower moving plate 20, one or more linear actuators 30 will adapt to the axial rotation about their respective pivots 33 to maintain the stability of the entire structure; while when the moving plate 20 is in a horizontal state, or when it is rising or falling in a horizontal state, the individual linear actuators 30 will not rotate axially about the pivots 33.

[0107] Each linear actuator 30 includes a motor 31, a transmission gear set, a lead screw, a guide rail 32 forming a sliding pair, and a slider. Optionally, a ball screw can be used, with balls arranged in the helical raceway of the lead screw and lead screw nut to reduce friction between the lead screw nut and the lead screw. The drive shaft of the motor 31 is connected to the driving gear, and the driven gear is connected to the upper end of the lead screw. When the drive shaft of the motor 31 rotates, it drives the lead screw to rotate through the transmission gear set, causing the lead screw nut to move linearly along the axial direction of the lead screw, and driving the guide rail 32 connected to the lead screw nut to move linearly along the actuation direction. In this example, the actuation direction of each linear actuator 30 corresponds to the length direction of its guide rail 32, and the length direction of the guide rail 32 is parallel to the axial direction of the lead screw.

[0108] In this embodiment, the guide rail 32 serves as the moving component of the linear actuator 30, connecting it to the corresponding Hooke hinge 40. When the lead screw nut drives the guide rail 32 to move linearly along the actuation direction, it moves the corresponding Hooke hinge 40, adjusting the attitude of the moving plate 20. The slider is fixedly positioned within the linear actuator 30, forming a sliding pair with the guide rail 32 that can move relative to it along the actuation direction. This provides guidance and support for the movement of the guide rail 32, making its movement smoother. A position sensor can be installed in each linear actuator 30 to detect the travel position of the guide rail 32. The controller issues corresponding commands based on the detection results to control the operating state of each motor 31, thereby maintaining or adjusting the travel position of the guide rail 32 to meet the attitude adjustment requirements of the substrate w.

[0109] like Figure 1 , Figures 5-7 As shown, each Hooke hinge 40 is provided with a pair of first bearings 41, a pair of second bearings 42, and a pair of third bearings 43. The two first bearings 41 are mounted on a first rotating shaft 411 arranged along a first direction L1. The portions of the first rotating shaft 411 extending beyond the two first bearings 41 are rotatably connected to the moving plate 20. The two second bearings 42 are mounted on a second rotating shaft 421 arranged along a second direction L2. The two third bearings 43 are mounted on a third rotating shaft 431 arranged along a third direction L3. Taking the plane where the moving plate 20 is in a horizontal state as the reference plane, the first direction L1, the second direction L2, and the third direction L3 correspond to the tangential, radial, and normal directions of the moving plate 20 on the reference plane, respectively, providing three degrees of rotational freedom in these three directions. If the moving plate 20 can be raised and lowered to different heights, it can be assumed that each height has a reference plane corresponding to the horizontal moving plate 20.

[0110] Each first mounting slot 210 on the moving plate 20 is recessed radially from the side edge of the moving plate 20 to the inward side, and the middle part of the Hooke hinge 40 can be arranged from the top surface of the moving plate 20 to the bottom surface. On both sides there are two stepped surfaces 211 that are recessed downward from the top surface of the moving plate 20. A pair of pivot mounting holes are formed on these two stepped surfaces 211 for placing the first pivot 411. This pair of rotating shaft mounting holes includes opposing openings tangentially along the moving subplate 20, and each rotating shaft mounting hole has an opening exposed toward the top surface of the moving subplate 20. The two ends of the first rotating shaft 411 can be respectively inserted into this pair of rotating shaft mounting holes to form a rotatable connection with the moving subplate 20. Several components related to the first bearing 41 and the second bearing 42 can form an assembly, which is placed in the middle of the first mounting slot 210, and the two ends of the first rotating shaft 411 are located behind this pair of rotating shaft mounting holes. The two pressure plates 416 configured in each first mounting slot 210 are respectively fixed to the two stepped surfaces 211 with screws to close the openings of the rotating shaft mounting holes exposed toward the top surface of the moving subplate 20.

[0111] Two first bearings 41 of the Hooke hinge 40 are fixed at intervals to the axial ends of the first bearing mounting holes of the first bearing housing 412. Two first end caps 413 are respectively disposed on the outer sides of the axial ends of the first bearing mounting holes. The two ends of the first rotating shaft 411 pass through the inner rings of the two first bearings 41, the axial ends of the first bearing mounting holes, and the center holes of the two first end caps 413, and are then disposed in the two rotating shaft mounting holes on the moving plate 20. In this example, the first side of the first rotating shaft 411 in the axial direction (e.g. Figure 6 A first washer 414 is provided between the first end cap 413 (on the left side) and the first bearing 41, and several screw holes are opened on the first end cap 413 on the first side for correspondingly setting several first screws 415. Tightening the first screws 415 can apply a preload to the first end cap 413, which helps to eliminate the internal clearance of the first bearing 41 and improve the motion accuracy of the mover plate 20. In this example, the following components are not provided, but it is not limited to other examples. A first washer is provided between the first end cap 413 and the first bearing 41 on the second side of the first rotating shaft 411 axis, and the corresponding first screws are passed through the first end cap 413 on the second side to apply a preload.

[0112] The first rotating shaft 411 and the second rotating shaft 421 are perpendicularly intersecting, for example, the first rotating shaft 411 passes through a shaft hole opened inside the second rotating shaft 421. Therefore, the first bearing 41, the first bearing seat 412, the first end cap 413, and other components mounted on the first rotating shaft 411 form a combination with the pair of second bearings 42 located on the second rotating shaft 421; the Hooke hinge 40 is provided with a mounting bracket 44 to connect this combination. The lower part of the mounting bracket 44 forms a fork, and the two side arms of the fork are provided with opposing second bearing mounting holes to correspondingly fix the two second bearings 42; the second bearing mounting hole on the first side of the second rotating shaft 421 (e.g., Figure 7 The left side of the first side has a stepped hole 422. The outer ring of the second bearing 42 on the first side is fixed in the part of the stepped hole 422 with a larger diameter and closer to the axial inner side. The first end of the second shaft 421 first passes through the inner ring of the first bearing 41 on this side, and then passes through the opening of the stepped hole 422 with a smaller diameter and closer to the axial outer side, extending out of the mounting bracket 44. The stepped surface in the part with a larger diameter can limit the second bearing 42 on the first side, preventing the second bearing 42 from moving outward along the axial direction under the push of the second shaft 421 and other components.

[0113] The second bearing mounting hole on the second side of the second shaft 421 can be a through hole with a constant diameter (e.g., Figure 7 On the right side), the outer ring of the second bearing 42 on the second side is fixed in the through hole, for example, in a part closer to the axial inner side of the through hole. The end of the second shaft 421 on the second side first passes through the inner ring of the second bearing 42 on this side, and then exits through the through hole. A second end cap 423 is provided on the outer side of the fork side wall on the second side, which covers the outer side of the axial opening of the second bearing mounting hole on the second side. The second end cap 423 can cover the end of the second shaft 421 on this side, or the second end cap 423 can have a central hole to expose the end of the second shaft 421 on this side. A second gasket 424 is provided between the second end cap 423 and the second bearing 42 on the second side. The second end cap 423 also has several screw holes for setting several second screws 425. Tightening the second screws 425 can apply a preload to the second end cap 423, which helps to eliminate the internal clearance of the second bearing 42 and improve the movement accuracy of the mover plate 20.

[0114] The mounting bracket 44 is provided with an upwardly extending shaft as a third pivot 431; this shaft and the fork can be integrally formed or fixedly connected, and a boss 441 is formed at the transition part from the upper part of the fork to the shaft (see...). Figure 6Two third bearings 43 are arranged vertically at intervals, with their inner rings respectively fitted onto the third shaft 431; a third bearing housing 432 surrounds the outer rings of the two third bearings 43. A nut 433 is fitted onto the threaded part of the upper part of the third shaft 431 and is located outside the upper first third bearing 43 to apply preload; the outer side of the lower second third bearing 43 abuts against the boss 441, which can limit the lower third bearing 43 and the third bearing housing 432 to prevent them from moving downward.

[0115] Optionally, tapered roller bearings are used for the first bearing 41, the second bearing 42, and the third bearing 43, and the three pairs of bearings are each installed back-to-back. In this example, the distance a1 between the pressure centers of the back-to-back mounted bearing pairs (back-to-back combination) is... Figure 8 The distance a2 between the pressure centers of a face-to-face bearing pair (face-to-face combination) will be greater than that between the pressure centers of the face-to-face bearing pair. Figure 9 That is, back-to-back combinations can withstand radial and axial loads in both directions, and have high stiffness when subjected to torque loads, making them more suitable for high-precision bearing housings and situations with small installation errors; in contrast, face-to-face combinations have a weaker ability to withstand torque loads, but can suppress the increase in internal loads caused by installation tilt, making them more suitable for situations with low bearing housing precision, low shaft stiffness, and large shaft bending caused by loads.

[0116] Optionally, in this example, the two first bearings 41 and the two second bearings 42 are axially preloaded on their axial sides by corresponding screws to eliminate clearance. These two sets of bearings mainly bear radial external loads and the resulting additional axial loads, so bearings with small contact angles are selected to reduce the additional axial loads and prevent axial deformation (the larger the contact angle, the greater the axial load and the smaller the radial load on the bearing; the smaller the contact angle, the smaller the axial load and the greater the radial load on the bearing); moreover, axial constant pressure preload is used for these two sets of bearings to improve installation accuracy.

[0117] Compared to the previous two sets of bearings, the two third bearings 43 in this example utilize the threaded section of the nut 433 to engage with the axial side of the bearing 43. Tightening the nut 433 applies an axial preload to eliminate clearance. Since this set of third bearings 43 primarily bears axial force, bearings with a large contact angle are selected to improve axial contact stiffness. If a constant axial pressure preload were used, the bearing would experience significant axial deformation under external axial loads. Therefore, this set of third bearings 43 employs a positioning preload to ensure the axial stiffness of the hinge.

[0118] In this embodiment, the third bearing housing 432 is generally a cuboid structure with four sidewalls along its length, and the edges between adjacent sidewalls are rounded. Each linear actuator 30 is provided with two opposing guide rails 32, which are fixed on the two opposing sidewalls of the third bearing housing 432, so that the length direction of the guide rails 32 corresponds to the length direction of the third bearing housing 432. This allows the actuation direction corresponding to the length of the guide rails 32 to further correspond to the axial direction of the third rotating shaft 431 in the Hooke hinge 40. Thus, when the guide rails 32 move along the actuation direction, the attitude adjustment of the moving plate 20 can be precisely controlled by the Hooke hinge 40.

[0119] For example, one guide rail 32 can be mounted on the side wall of the third bearing housing 432 closer to the central column 51, and the other guide rail 32 can be mounted on the side wall of the third bearing housing 432 farther from the central column 51. Optionally, some shorter auxiliary strips 34 can be pre-installed on the corresponding side wall of the third bearing housing 432. Figure 1 This provides a reference surface for installing the guide rail 32, allowing the guide rail 32 to be installed more accurately at the set position on the third bearing housing 432, ensuring that the length direction of the guide rail 32 matches that of the third bearing housing 432; in some examples, the auxiliary strip 34 is removed after the guide rail 32 is installed.

[0120] The guide rails 32 of one or more linear actuators 30 are moved along the corresponding actuation direction. The stroke positions of the guide rails 32, which have moved and those that remain stationary, are controlled in coordination. Through the transmission and constraint of force by the Hooke hinges 40, the moving plate 20 can be rotated by a set angle around any axis passing through the center of the moving plate in its current plane, causing the moving plate 20 to tilt as a whole. The central column 51 drives the bearing plate 52 and the base plate w to achieve the corresponding tilt angle. When the moving plate 20 tilts, depending on the rotation axis and / or angle, one or more Hooke hinges 40 will each rotate through bearings in one or more directions to adapt to the tilt change of the moving plate 20, so that the entire structure can remain stable after the guide rails 32 move and the moving plate 20 tilts.

[0121] The present invention also provides a substrate posture adjustment method, implemented using the aforementioned substrate posture adjustment device configured for a semiconductor processing device. This method includes a first control mode, which controls the stroke position of each moving component of a plurality of linear actuators 30 in the actuation direction, such that at least one moving component of all linear actuators 30 is at a different stroke position than the others, causing the moving subplate 20 to be tilted. This tilts the support plate 52 and substrate w via the central column 51, adjusting the tilt angle of substrate w. Under the first control mode, the moving subplate 20 can rotate by a set angle around any axis passing through its center in its current plane, causing the central column 51, support plate 52, and substrate w to tilt by a corresponding angle.

[0122] The substrate attitude adjustment method also includes a second control mode, which can make the moving parts of all linear actuators 30 have the same stroke position, so that the moving subplate 20 is in a horizontal state, and then drives the support plate 52 and the substrate w to a horizontal state through the central column 51. The first control mode and the second control mode can be switched as needed to adjust the attitude of the relevant components.

[0123] The substrate posture adjustment method not only coordinates the stroke position of the moving parts when they remain stationary or after they move, but also controls the stroke of the moving parts of the multiple linear actuators 30 when they move in their respective actuation directions by implementing the third control mode and the fourth control mode, thereby adjusting the height of the support plate 52 in the reaction chamber 10.

[0124] In the third control mode, all moving parts of the linear actuators 30 are controlled to move the same distance in their respective actuation directions toward the side closer to the reaction chamber 10, causing the moving plate 20 to rise as a whole, which in turn drives the support plate 52 to rise via the central column 51. In the fourth control mode, all moving parts of the linear actuators 30 are controlled to move the same distance in their respective actuation directions toward the side farther from the reaction chamber 10, causing the moving plate 20 to fall as a whole, which in turn drives the support plate 52 to fall via the central column 51.

[0125] When the moving plate 20 is raised or lowered as a whole, it can be in a horizontal state or in an inclined state. Optionally, after the second control mode has been implemented to make the moving plate 20 and the bearing plate 52 both in a horizontal state, a third or fourth control mode is further executed to control the raising or lowering of the moving plate 20, the central column 51 and the bearing plate 52.

[0126] Optionally, by alternating between the third and fourth control modes, the moving subplate 20 can achieve reciprocating motion of rising and falling, thereby driving the support plate 52 to reciprocate between the first position A and the second position B within the reaction chamber 10 via the central column 51. The first position A and the second position B are at different heights, with the first position A corresponding to the height of the transfer port 12 on the side wall of the reaction chamber 10, and the second position B being the working position within the reaction chamber 10 where processing can be performed. Therefore, when the support plate 52 moves to the first position A, an external robotic arm can carry the substrate w into the reaction chamber 10 through the transfer port 12 and place the substrate w onto the support plate 52; or, after completing the processing, the robotic arm can also enter the reaction chamber 10 through the transfer port 12, remove the substrate w from the support plate 52, and send the substrate w out of the reaction chamber 10 through the transfer port 12. When the support plate 52 moves to the second position B, the substrate w supported by the support plate 52 can be processed by introducing process gas from within the reaction chamber 10. Optionally, after the substrate w has been placed on the carrier plate 52 and driven to the working position, the tilt of the substrate w is adjusted through the first control mode to obtain a more uniform surface treatment effect of the substrate w.

[0127] like Figure 11 As shown, an example of a substrate orientation adjustment method includes the following steps:

[0128] S1. The carrier plate 52 is located at the first position A, and the substrate w is placed on the carrier plate 52.

[0129] Optionally, before step S1, the moving plate 20 is raised or lowered by executing a third or fourth control mode, and the support plate 52 is raised or lowered within the reaction chamber 10 by the central column 51, so that the support plate 52 reaches the first position A. Optionally, before the moving plate 20 or the like performs the lifting operation, or after the support plate 52 reaches the first position A, the moving plate 20 and the support plate 52 are brought to a horizontal state by executing a second control mode. In this example, the first position A corresponds to the height of the transfer port 12 for picking up and placing the substrate w, and the first position A is lower than the second position B. In step S1, the robotic arm carries the substrate w through the transfer port 12 into the reaction chamber 10 and places it on the support plate 52 located at the first position A.

[0130] S2. All moving parts rise by the same stroke, causing the moving subplate 20 to rise. The central column 51 drives the support plate 52 and the substrate w to rise to the second position B, where the substrate w is processed.

[0131] In step S2, by executing the third control mode, all moving parts move the same distance in their respective actuation directions toward the side closer to the reaction chamber 10, causing the moving plate 20 to rise from the first position A to the second position B.

[0132] S3. Adjust the stroke position of several moving parts so that the moving subplate 20 is in an inclined state, and the central column 51 drives the bearing plate 52 and the base plate w to be in an inclined state.

[0133] Step S3 is optional. By executing the first control mode, the moving sub-plate 20 is rotated by a set angle around any axis of its plane. The central column 51 drives the support plate 52 and the substrate w to tilt, adjusting the tilt of the substrate w and compensating for factors that previously caused uneven processing of the substrate w, thereby achieving a more uniform surface treatment effect on the substrate w. Optionally, step S3 can be executed before the substrate w reaches the working position but before the process begins, or it can be executed during the process as needed. It can also be executed multiple times during the process to adjust the substrate w to different tilt directions and / or angles.

[0134] S4. End the process and adjust the stroke position of several moving parts to make the moving subplate 20 horizontal. The central column 51 drives the bearing plate 52 and the base plate w to also be horizontal.

[0135] In step S4, by executing the second control mode, all moving parts are positioned at the same travel distance, so that the moving subplate 20 and the support plate 52 are in a horizontal state. If the tilting operation in step S3 was not performed beforehand, the leveling operation of the moving subplate 20, the support plate 52, and the base plate w in step S5 can be omitted.

[0136] S5. All moving parts descend by the same stroke, causing the moving plate 20 to descend. The central column 51 drives the support plate 52 and the substrate w to descend to the first position A, and the substrate w is removed from the support plate 52.

[0137] In step S5, by executing the fourth control mode, all moving parts move the same distance away from the reaction chamber 10 in their respective actuation directions, causing the moving plate 20 to return from the second position B to the first position A. The robotic arm enters the reaction chamber 10 through the transfer port 12, removes the processed substrate w from the support plate 52, and carries it out of the reaction chamber 10 through the transfer port 12.

[0138] Although the present invention has been described in detail through the above optional embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A substrate posture adjustment device, characterized in that, Include: Moving plate; A support plate is used to support a substrate that requires further processing. The central column supports the bearing plate at its first end and is connected to the moving plate at its second end. Multiple linear actuators; each linear actuator is used to drive the moving part of the linear actuator to move linearly along the actuation direction of the linear actuator; Multiple Hooke hinges, each with three rotational degrees of freedom; the moving part of each of the linear actuators is connected to the moving plate via a corresponding Hooke hinge; The stroke of each of the moving parts of the multiple linear actuators can be adjusted independently when they make linear movements, so that the moving plate is in an inclined state, and the bearing plate is tilted through the central column, thereby tilting the base plate.

2. The substrate posture adjustment device as described in claim 1, characterized in that, The moving plate can switch between an inclined state and a horizontal state; The moving plate is tilted when at least one of the moving parts of all linear actuators is in a different travel position than the other moving parts. When the moving parts of all linear actuators are at the same stroke position, the moving plate is in a horizontal state, and the central column drives the bearing plate and the base plate to be in a horizontal state.

3. The substrate posture adjustment device as described in claim 2, characterized in that, The plane in which the moving plate is in a horizontal state is called the reference plane; Each of the Hooke hinges further comprises: A pair of first bearings are mounted on a first rotating shaft arranged along a first direction; the portions of the first rotating shaft extending beyond the pair of first bearings are respectively rotatably connected to the moving plate; the first direction corresponds to the tangential direction of the moving plate on a reference plane. A pair of second bearings are mounted on a second rotating shaft arranged along a second direction; the second direction corresponds to the radial direction of the moving plate on the reference plane. A pair of third bearings are mounted on a third rotating shaft arranged along a third direction; the third direction corresponds to the normal of the moving plate on the reference plane.

4. The substrate posture adjustment device as described in claim 3, characterized in that, The first bearing, the second bearing, and the third bearing are all tapered roller bearings; The contact angles of the first bearing and the second bearing are both smaller than the contact angle of the third bearing; The pair of first bearings are mounted back-to-back on the first rotating shaft and subjected to axial constant pressure preload. The pair of second bearings are mounted back-to-back on the second rotating shaft and subjected to axial constant pressure preload; the pair of third bearings are mounted back-to-back on the third rotating shaft and subjected to positioning preload.

5. The substrate posture adjustment device as described in claim 3, characterized in that, The Hooke hinge further includes the following components configured for the pair of first bearings: The first bearing housing is provided with a first bearing mounting hole for fixing the pair of first bearings; Two first end caps are respectively disposed on the outer sides of the axial ends of the first bearing mounting hole; each of the two first end caps is provided with a central hole, for the two ends of the first rotating shaft to extend out to connect to the stator plate; A plurality of first screws, passing through screw holes on at least one first end cap, are used to apply preload; a first washer is disposed between the at least one first end cap and a first bearing adjacent thereto.

6. The substrate posture adjustment device as described in claim 5, characterized in that, The first rotating shaft and the second rotating shaft intersect perpendicularly, and the pair of first bearings and the components configured thereon form an assembly with the pair of second bearings; The Hooke hinge further includes: A mounting bracket is provided for connecting the assembly; the mounting bracket is provided with two opposing second bearing mounting holes for fixing the pair of second bearings; The second end cap is located on the outer side of one of the second bearing mounting holes in the axial direction; Several second screws pass through screw holes on the second end cap to apply preload; The second gasket is disposed between the second end cap and the second bearing adjacent to it.

7. The substrate posture adjustment device as described in claim 6, characterized in that, The mounting bracket is provided with an upwardly extending shaft, which serves as the third rotating shaft; The Hooke hinge further includes: A third bearing housing is used to fix the pair of third bearings; A nut is fitted onto the threaded section of the upper part of the third shaft and is located outside a third bearing away from the mounting bracket to apply preload; another third bearing close to the mounting bracket abuts against a boss provided on the mounting bracket.

8. The substrate posture adjustment device as described in claim 3, characterized in that, The moving plate is provided with a plurality of first mounting slots evenly distributed along the circumference of the moving plate; Two opposing first rotating shaft mounting holes are provided along the first direction at the moving plate next to each first mounting slot, for corresponding insertion of the two ends of the first rotating shaft; Each first mounting slot is equipped with two first pressure plates, which are fixed to the moving plate next to the first mounting slot with third screws. The openings of the first rotating shaft mounting holes exposed to the end face of the moving plate are closed by the corresponding first pressure plates.

9. The substrate posture adjustment device according to any one of claims 1 to 8, characterized in that, The substrate attitude adjustment device further includes: The stator plate is connected to the bottom plate of the reaction chamber of the semiconductor processing equipment; the moving plate is arranged at intervals below the stator plate; The plurality of linear actuators are each disposed between the stator plate and the mover plate; the actuation direction of each linear actuator is the same as the interior angle formed by the plane on which the stator plate is located; the interior angle formed is a right angle, an acute angle, or an obtuse angle.

10. The substrate posture adjustment device as described in claim 9, characterized in that, Each of the linear actuators is rotatably connected to the stator plate via a pivot, at which a fourth rotating shaft passes; The stator plate is provided with a plurality of second mounting slots evenly distributed along the circumference of the stator plate; A pair of second rotating shaft mounting holes are provided on the stator plate next to each second mounting slot along the tangent of the stator plate, for corresponding insertion of the two ends passing through the fourth rotating shaft; Each second mounting slot is equipped with two second pressure plates, which are fixed to the stator plate next to the second mounting slot with fourth screws. The openings of the second shaft mounting holes exposed to the radial outer side of the stator plate are closed by the corresponding second pressure plates.

11. The substrate posture adjustment device as described in claim 3, characterized in that, The moving component of each of the linear actuators includes: a guide rail; Each of the linear actuators further includes: a motor, a transmission gear set, a lead screw, a slider, and a position sensor; The drive shaft of the motor is connected to one end of the lead screw through a transmission gear set, which drives the lead screw to rotate, so that the lead screw nut on the lead screw moves linearly along the axis of the lead screw, and drives the guide rail connected to the lead screw nut to move linearly along the corresponding actuation direction; the actuation direction corresponds to the length direction of the guide rail, and the length direction of the guide rail is parallel to the axis of the lead screw. The slider and the guide rail form a sliding pair that can move relative to each other along the actuation direction; the slider is fixedly mounted at the linear actuator; the guide rail is connected to the corresponding Hooke hinge, so as to drive the corresponding Hooke hinge to move as a whole when the guide rail moves linearly along the actuation direction, and then drive the moving plate to adjust its attitude through the corresponding Hooke hinge. The position sensor is used to detect the travel position of the guide rail.

12. The substrate posture adjustment device as described in claim 9, characterized in that, The support plate is located inside the reaction chamber; The first end of the central column passes through the first through hole of the stator plate and the second through hole of the cavity bottom plate, and extends into the reaction cavity to support the bearing plate; The substrate posture adjustment device is further provided with an adapter; the second end of the central column is connected to the adapter; the adapter is connected to the moving sub-plate, so that the adapter and the moving sub-plate maintain the same tilt state or horizontal state, and the central column is arranged tilted or vertically.

13. The substrate posture adjustment device as described in claim 12, characterized in that, The central column is fitted with a flexible sealing tube, which connects the space inside the flexible sealing tube with the space inside the reaction chamber and isolates it from the external atmospheric environment. The flexible sealing pipe is provided with an upper flange at one end. The upper flange is fixed at the first through hole of the stator plate and connected to the bottom plate of the cavity. The third through hole of the upper flange communicates with the second through hole of the bottom plate of the cavity, allowing the first end of the central column to pass through. The other end of the flexible sealing pipe is provided with a lower flange; the lower flange is connected to the adapter.

14. A semiconductor processing apparatus, comprising a reaction chamber, wherein a substrate is processed by introducing a process gas from the reaction chamber; characterized in that, It also includes the substrate posture adjustment device according to any one of claims 1 to 13; A support plate for the substrate is located inside the reaction chamber; the first end of the central column extends into the reaction chamber to support the support plate; Apart from the support plate and part of the central column, the other components of the substrate attitude adjustment device are located outside the reaction chamber, wherein the moving plates are arranged at intervals below the cavity bottom plate of the reaction chamber.

15. A method for adjusting the posture of a substrate, characterized in that, Use the substrate posture adjustment device according to any one of claims 1 to 13; The substrate attitude adjustment method includes a first control mode that controls the stroke position of each moving part of a plurality of linear actuators in the actuation direction, so that at least one moving part of all linear actuators is at a different stroke position than the other moving parts, so that the moving plate is in an inclined state, and then the central column drives the support plate and the substrate to tilt, thereby adjusting the inclination of the substrate.

16. The substrate attitude adjustment method as described in claim 15, characterized in that, The substrate posture adjustment method further includes a second control mode that controls the stroke position of each of the moving parts of multiple linear actuators in the actuation direction, so that the stroke position of the moving parts of all linear actuators is the same, so that the moving subplate is in a horizontal state, and then the central column drives the support plate and the substrate to be in a horizontal state. The substrate posture adjustment method can switch between a first control mode and a second control mode. Under the action of the first control mode, the moving sub-plate can rotate around any axis passing through the center of the moving sub-plate in its plane by a set angle, so that the central column, the bearing plate and the substrate are tilted by the corresponding angle.

17. The substrate attitude adjustment method as described in claim 16, characterized in that, The substrate posture adjustment method further includes a third control mode and a fourth control mode for controlling the stroke of the moving parts of multiple linear actuators when they move in their respective actuation directions, which are used to adjust the height of the support plate in the reaction chamber. In the third control mode, all the moving parts of the linear actuators are controlled to move the same distance in their respective actuation directions toward the side closer to the reaction chamber, so that the moving plate as a whole rises, and then drives the bearing plate to rise through the central column. In the fourth control mode, all the moving parts of the linear actuators are controlled to move the same distance away from the reaction chamber in their respective actuation directions, so that the moving plate as a whole is lowered, and then the bearing plate is lowered through the central column; The moving plate is in a horizontal state or in an inclined state when it is rising or falling as a whole.

18. The substrate attitude adjustment method as described in claim 17, characterized in that, Alternating between the third and fourth control modes, the moving plate achieves reciprocating motion of rising and falling, which in turn drives the bearing plate to reciprocate between the first and second positions within the reaction chamber via the central column; The first position and the second position are at different heights; The reaction chamber has a transfer port on its side wall; when the carrier plate is in the first position, the robotic arm enters the reaction chamber through the transfer port and places the substrate it carries onto the carrier plate, or removes the substrate from the carrier plate. When the support plate is in the second position, the substrate supported by the support plate is processed by introducing process gas from the reaction chamber.

19. The substrate attitude adjustment method as described in claim 16, characterized in that, The second end of the central column is connected to the moving plate via an adapter; When the moving plate is in a horizontal state, the adapter is in a horizontal state, making the central column vertically arranged; when the moving plate is in an inclined state, the adapter is in an inclined state, making the central column inclined.

Images